JP2002071715A - Socket for inspecting electric part and circuit structure thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for inspecting electric parts which achieves easier adaptation thereof to various configures of wiring and a circuit structure thereof. SOLUTION: An insulation film 11 is formed on a wiring board 6 partially covering a plurality of signal supply terminals 9 formed on the same board 6 comprising a hard base material and a plurality of contact terminals 10 formed in an array isolated from the signal supply terminals 9, while an opening part 12 is formed on the insulation film 11. Optional signal supply terminals 9 are connected to optional contact terminals 10 with a plurality of respective connection wires 13 through the opening part 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a liquid crystal display panel,
Socket for inspecting electric components used for inspection of display quality of display panels such as electroluminescence panels and plasma display panels, or inspection of electric components such as operation confirmation of semiconductor integrated circuits (ICs), and for inspecting such electric components The present invention relates to a circuit structure suitable for a socket.

[0002]

2. Description of the Related Art Generally, various display panels such as an electric component, for example, a liquid crystal display panel, an electroluminescence panel, and a plasma display panel have a large number of electrodes on a substrate. Therefore, in the manufacturing process of the display panel, the display panel before connection of the peripheral circuit such as the driving IC tab is inspected for a display defect portion, a display quality, and the like. When inspecting the display or performance of this type of display panel, an electrical component inspection socket having a contact terminal called a display panel inspection socket for supplying various driving signals to the display panel is used. I have.

[0003] In such an electrical component inspection socket, the drive signal supply form to the electrode terminals of the electrical product to be inspected differs depending on the type of electrical component and the inspection purpose. It is necessary to route the wiring to the terminals.

For example, when three color pixels of red (R), green (G) and blue (B) are individually lit in a single color in a color display panel, drive signals are sent from the contact terminals to the electrode terminals of the color display panel for each color. Therefore, the contact terminals that are in contact with the respective electrode terminals must be connected to the signal supply terminals on the substrate for each color. On the other hand, when the display panel is turned on every predetermined number of rows irrespective of the color, it is necessary to send a drive signal from the contact terminals to the electrode terminals every predetermined number of rows. It must be connected to a signal supply terminal on the substrate every predetermined number of columns.

[0005]

However, since the types of electrical components and the purpose of inspecting the display panel are various, the contact terminals and the signal supply according to the type of electrical component or the purpose of inspecting the display panel are varied. It was necessary to change the connection point with the terminal. Therefore, in order to prepare an electrical component inspection socket having a circuit structure with a different wiring form, it is necessary to individually design connection positions, which requires a great deal of labor and labor. Therefore, there is a need for a circuit structure of an electrical component inspection socket that can efficiently manufacture an electrical component inspection socket that can support various wiring configurations.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electrical component inspection socket and a circuit structure thereof that can be easily applied to various wiring forms.

[0007]

According to a first aspect of the present invention, there is provided a socket for electrical component inspection, wherein a contact terminal on a wiring board is brought into contact with an electrode terminal of the electrical component. In an electrical component inspection socket for inspecting electrical components, a part of a plurality of signal supply terminals formed on the same substrate made of a hard base material and a plurality of contact terminals arranged separately from the signal supply terminals An insulating film is formed on the wiring substrate so as to cover the wiring board, an opening is formed on the insulating film, and an arbitrary signal supply terminal and an arbitrary contact terminal are respectively connected to the plurality of connection lines through the opening. Have been connected.

According to the electrical component inspection socket of the present invention, an arbitrary intersection between the connection line, the contact terminal, and the signal supply terminal is selected and an opening is formed in the insulating film, so that an arbitrary contact terminal can be formed. It is possible to connect an arbitrary contact terminal to an arbitrary signal supply terminal via an arbitrary connection line, and use a substrate made of a hard base material. The supply circuit itself can be manufactured accurately and at low cost. .

A feature of the socket for electrical component inspection according to the present invention is to provide a socket for electrical component inspection for inspecting an electrical component by bringing a contact terminal on a wiring board into contact with an electrode terminal of the electrical component. A wiring board having a plurality of signal supply terminals and a plurality of contact terminals arranged separately from the signal supply terminals, a lead pattern connected to each of the signal supply terminals, and an array separated from the lead pattern; A conductive pattern connected to each of the contact terminals, an insulating film formed to cover the lead pattern and a part of the conductive lead pattern, and an opening formed in the insulating film. A connection board made of a hard base material having a plurality of connection lines for connecting an arbitrary conductive pattern and an arbitrary lead pattern. In that so as to electrically connect the wiring board through an anisotropic conductive material.

According to the electrical component inspection socket of the present invention, an arbitrary intersection of the connection line, the contact terminal, and the signal supply terminal is selected and an opening is formed in the insulating film, whereby any arbitrary contact terminal can be formed. It is possible to connect an arbitrary contact terminal to an arbitrary signal supply terminal via an arbitrary connection line and use a substrate made of a hard base material. Thus, the signal supply circuit itself can be manufactured accurately and at low cost. In addition, since the two substrates are electrically connected with an anisotropic conductive material, a difference in thickness of a terminal, a wiring pattern, and the like protruding from the substrate surface can be absorbed by the anisotropic conductive material.

Further, the circuit structure according to the third aspect is characterized in that a wiring board having a plurality of signal supply terminals and a plurality of contact terminals arranged and arranged separately from the signal supply terminals;
A lead pattern connected to the signal supply terminal, a conductive pattern connected to each of the connection terminals and formed separately from the lead pattern, and a part of the lead pattern and the conductive pattern; And a connection board made of a hard board having a connection line for connecting an arbitrary conductive pattern and an arbitrary lead pattern through an opening formed in the insulation film. The wiring board and the connection board are formed by electrically connecting them via an anisotropic conductive material.

According to the circuit structure of the present invention, by selecting an arbitrary intersection between the connection line and the contact terminal and the signal supply terminal and forming an opening in the insulating film, the arbitrary contact terminal can be connected to the arbitrary connection line. It is possible to connect an arbitrary contact terminal to an arbitrary signal supply terminal via an arbitrary connection wire, and to supply a signal by using a substrate made of a hard base material. The circuit itself can be manufactured accurately and at low cost. In addition, since the two substrates are electrically connected with an anisotropic conductive material, a difference in thickness of a terminal, a wiring pattern, and the like protruding from the substrate surface can be absorbed by the anisotropic conductive material.

[0013]

FIG. 1 is a block diagram showing an embodiment of the present invention.
This will be described with reference to FIGS.

FIG. 1 shows a positional relationship between a liquid crystal display panel 1 as an electric component and an electric component inspection socket 5. The liquid crystal display panel 1 has a pair of substrates 2 and 3, A large number of electrode terminals 4 are arranged on the substrate 2 along the side of the liquid crystal display panel 1.

FIGS. 2 to 4 illustrate the electrical component inspection socket and the circuit structure thereof according to the first embodiment of the present invention, together with the manufacturing process.

Further, the wiring board 6 constituting the socket 5 for inspecting electrical components in the present embodiment is constituted by a PCB base 7 using a hard board which is a printed board. As shown in FIGS. 2 to 4, on one surface of the wiring board 6, a plurality of signal supply terminals 9 having signal supply lands 8 (here, three signal supply terminals 9 corresponding to three colors of RGB) are provided. The signal supply terminals 9A, 9B, 9C) and the plurality of contact terminals 10 arranged at the same pitch in the same direction as the electrode terminals 4 on the substrate 2 of the liquid crystal display panel 1 are separated from the signal supply terminals 9. It is formed on a PCB base 7.
In the present embodiment, the three signal supply terminals 9 extend in parallel with the contact terminals 10 on both outer sides of the arrangement region in the arrangement direction of the contact terminals 10. Note that the number of the contact terminals 10 shown in FIGS. 2 to 4 is schematically shown for ease of illustration and description, and is not limited to the illustrated example.

The signal supply terminal 9 and the contact terminal 1
No. 0 is formed by forming an aluminum (Al) layer on the PCB base 7 by vapor deposition or the like, and then etching the aluminum layer into a pattern shown in FIGS. Preferably, the surfaces thereof are plated with metal having excellent corrosion resistance, for example, two-layer plating consisting of a nickel base plating layer and a gold plating layer on the surface. The signal supply terminals 9 and the contact terminals 10 may be formed of a conductive material such as ITO or copper foil instead of aluminum.

Thereafter, in the hatched region in FIG. 3, an insulating film 11 made of, for example, a resist is formed on the PCB base 7 so as to cover a part of the contact terminals 10 and the signal supply terminals 9. The insulating film 11 has a plurality of openings 12 described later.

FIG. 2 shows that the contact terminals 10 correspond to RGB signals, and every third contact terminal 10A is a first group of contact terminals 10A,
The contact terminals are divided into a second group of contact terminals 10B and a third group of contact terminals 10C.
B and 10C are connected to any one of the desired signal supply terminals 9A, 9B and 9C via one connection line 13, respectively.

Therefore, the insulating film 11 has an intersection between the first group of contact terminals 10A and the connection line 13A, an intersection between the second group of contact terminals 10B and the connection line 13B, and a third group of contact terminals. 10C and the intersection of the connection line 13C and any desired signal supply terminals 9A, 9B, 9
Openings 12 are formed at the intersections of C and the connection lines 13A, 13B, 13C.

That is, as shown in FIG. 3, a first group of contact terminals 10A, a second group of contact terminals 10B and a third group of contact terminals 10C, and three signal supply terminals 9A, 9B, 9C are respectively connected. For connection, three connection lines 13A, 13B, and 13C made of a conductive paste such as silver are formed on the insulating film 11. Connection line 13
A, 13B and 13C are spaced apart from each other by contact terminals 10
A, 10B, and 10C extend linearly substantially orthogonally to
Further, they extend linearly substantially orthogonal to the signal supply terminals 9A, 9B, 9C.

An opening 12A is formed in the insulating film 11 at a location where the connection line 13A intersects with the first group of contact terminals 10A to expose a part of the contact terminal 10A. 13A and signal supply terminal 9A
An opening 12A that exposes a part of the signal supply terminal 9A is formed at the intersection of the two. Therefore, the connection line 11A is connected to the contact terminal 10A and the signal supply terminal 9A at these openings 12A.

Similarly, openings 12B are formed in the insulating film 11 at portions where the connection lines 13B and the contact terminals 10B of the second group intersect to expose portions of the contact terminals 10B, respectively. Line 13B and signal supply terminal 9B
An opening 12B for exposing a part of the signal supply terminal 9B is formed at the intersection of the contact line 10B and the connection line 13B is connected to the contact terminal 10B and the signal supply terminal 9B at these openings 12B. Further, in the insulating film 11, an opening 12C for exposing a part of the contact terminal 10C is formed at a position where the connection line 13C intersects with the contact terminal 10C of the third group. The signal supply terminal 9C is located at the intersection with the supply terminal 9C.
An opening 12C for exposing a part of the connection line 1 is formed.
3C is a contact terminal 1 at each of these openings 12C.
0C and the signal supply terminal 9C.

With the above arrangement, the first group of contact terminals 10A is connected to the signal supply terminal 9A via the connection line 13A, and the second group of contact terminals 10B is connected to the connection line 13B.
And the contact terminals 10C of the third group are connected to the signal supply terminals 9C via the connection lines 13C, so that the contact terminals 10 are connected to the electrode terminals 4 of the liquid crystal display panel 14. If the signal is supplied to the signal supply terminal 9A after the contact, the lighting signal can be sent only to the electrode terminal 4A to which the first signal is to be supplied via the first group of contact terminals 10A. If a signal is supplied to the supply terminal 9B, a lighting signal can be sent only to the electrode terminal 4B to which the second signal is to be supplied via the contact terminal 10B of the second group, and further, a signal is supplied to the signal supply terminal 9C. Is supplied, the lighting signal can be sent only to the electrode terminal 4C to which the third signal is to be supplied via the third group of contact terminals 10C.

As described above, since each contact terminal 10 of the present embodiment intersects with a plurality of connection lines 13, an arbitrary intersection is selected to form the opening 12 in the insulating film 9. It is possible to connect an arbitrary contact terminal 10 to an arbitrary connection line 13, and thereby connect an arbitrary contact terminal 10 to an arbitrary signal supply terminal 9 via an arbitrary connection line 13. Becomes Therefore,
By simply changing the position of the opening 12 formed in the insulating film 11, the contact terminal 10 connected to the signal supply terminal 9 via the connection line 13 can be freely changed to form a desired signal supply circuit. It is possible to efficiently and economically manufacture electrical component inspection sockets of various signal supply forms.

According to the above configuration, the opening 12A for connecting the connection line 13A and the contact terminal 10A and the opening 12B for connecting the connection line 13B and the contact terminal 10B are provided.
And the openings 12C for connecting the connection lines 13C and the contact terminals 10C are arranged linearly, so that the step of forming the openings in the insulating film 11 can be simplified.

FIGS. 5 to 13 are views for explaining the electrical component inspection socket and the circuit structure thereof according to the second embodiment of the present invention together with the manufacturing process. The same members and portions as those in the first embodiment are denoted by the same reference numerals and described.

As shown in FIGS. 5, 9 and 10, the electrical component inspection socket 5 is an FPC base 1 using a flexible film made of a resin such as polyimide or polyester.
The wiring board 6 and the connection board 15 are stacked with an anisotropic conductive sheet 16 sandwiched between a wiring board 6 made of a printed circuit board 4 and a connection board 15 made of a PCB base 7 using a hard board as a printed board. It has been combined.

An electrode terminal 4 formed on the liquid crystal display panel 1 is provided on one end of one side of the FPC base 14 of the wiring board 6 constituting the electrical component inspection socket 5 of this embodiment.
A large number of contact terminals 10 are arranged and formed at the same pitch corresponding to the above arrangement, and a signal supply terminal 9 is formed on the other end side of one surface of the wiring board 6. In the present embodiment, three signal supply terminals 9D, 9E, and 9F having signal input lands 8 are formed corresponding to the three RGB signals supplied to the liquid crystal display panel 1. In the present embodiment, the three signal supply terminals 9D, 9E, and 9F respectively extend in front of both outsides of the arrangement area in the arrangement direction of the contact terminals 10 in parallel with the contact terminals 10.

The signal supply terminal 9 and the contact terminal 1
No. 0 is formed by etching a copper foil formed in a plane on the FPC base 14 into a pattern shape shown in FIGS. Preferably, the surfaces thereof are plated with metal having excellent corrosion resistance, for example, two-layer plating consisting of a nickel base plating layer and a gold plating layer on the surface. The signal supply terminal 9
The contact terminals 10 may be formed of a conductive material such as ITO and Al in addition to the copper foil. In the present embodiment, the thickness of the FPC base 14 is 25 μm to 50 μm.
The signal supply terminal 9 and the contact terminal 10 are formed to have a thickness of at least about 5 μm to 20 μm.

On the other hand, as shown in FIGS. 6 to 8, on one surface of the connection board 15, wiring 17 for connecting to each contact terminal 10 and each signal supply terminal 9 of the wiring board 6 is formed. .

The wiring 17 will be described in further detail. As shown in FIGS. 6 to 8, a conductive pattern 18 corresponding to the arrangement of the contact terminals 10 is formed on one surface of the connection substrate 15. Three lead patterns 19 extending in parallel with the conductive pattern 18 are formed on both outer sides of the arrangement region in the arrangement direction of the 18.
The base of each of the conductive patterns 18 is a connection contact terminal 18a that overlaps with the contact terminal 10 when the wiring board 6 and the connection board 15 are overlapped. The base of the lead pattern 19 is a connection signal supply terminal 19a that overlaps with the signal supply terminal 9 when the wiring board 6 and the connection board 15 are overlapped.

Note that the numbers of the contact terminals 10, the conductive patterns 18, the lead patterns 19, etc. shown in FIGS. 5 to 9 are schematically shown for ease of illustration and description. It is not limited.

The conductive pattern 18 and the lead pattern 19 are made of a copper foil formed in a planar shape on the PCB base 7 in the same manner as the signal supply terminal 9 and the contact terminal 10 as shown in FIGS. It is formed by etching. Preferably, the surfaces thereof are plated with metal having excellent corrosion resistance, for example, two-layer plating consisting of a nickel base plating layer and a gold plating layer on the surface. This conductive pattern 1
8 and the lead pattern 19 are made of ITO,
It may be formed of a conductive material such as Al. In this embodiment, the thickness of the PCB base is at least 0.5
The conductive pattern 18 and the lead pattern 19 were formed to have a thickness of at least about 35 μm.

Thereafter, in a hatched area indicated by reference numeral 11 in FIG. 7, an insulating film 11 partially covering the conductive pattern 18 and the lead pattern 19 is formed. This insulating film 11 is preferably made of a resist film. In this embodiment, the resist film is
An opening 12 for exposing a part of the conductive pattern 18 and the lead pattern 19 is formed in the insulating film 11 so as to have a thickness of about 10 μm.

Further, as shown in FIG. 8, a plurality of connection lines 13 for selectively connecting the conductive pattern 18 and the lead pattern 19 are formed on the insulating film 11. The connection line 13 is made of, for example, a conductive paste such as silver. In the present embodiment, three connection lines 13D, 13E, and 13F corresponding to three signals supplied to the liquid crystal display panel 1 are provided.
Is formed on the insulating film 11. Each connection line 13D, 1
3E and 13F protrude in a direction crossing the conductive pattern 18 and the lead pattern 19, and are connected to the conductive pattern 18 and the lead pattern 19 at the opening 12 of the insulating film 11. In the present embodiment, the conductive patterns 18 are for the color-specific electrodes corresponding to the three colors of RGB of the liquid crystal display panel 1, and the three connection lines 1 for the three colors are used.
They are connected to the lead pattern 19 via 3D, 13E, and 13F, respectively.

That is, FIGS. 7 and 8 show the conductive pattern 18.
Are divided into a first group of conductive patterns 18D, a second group of conductive patterns 18E, and a third group of conductive patterns 18F every three in accordance with RGB signals,
The conductive patterns 18D, 18E, 18F of each group are connected to any one of the desired lead patterns 19D, 19E, 19F via one connection line 13, respectively.

Therefore, the insulating film 11 has an intersection between the first group conductive pattern 18D and the connection line 13, an intersection between the second group conductive pattern 18E and the connection line 13, and a third group conductive pattern. Intersection between 18F and connection line 13 and lead patterns 19D, 19E, 19F
Openings 12D and 12D at the intersections of
E and 12F are formed. The openings 12D, 12
E, 12F and Lead Patterns 19D, 19
The configuration and method of connection between the connection lines E, 19F and the conductive patterns 18D, 18E, 18F via the connection lines 13D, 13E, 13F are via the connection line 13 between the signal supply terminal 9 and the contact terminal 10 described in detail in the above embodiment. The configuration and method of the connection are the same, and the description is omitted.

The connection line 13 is connected to the wiring board 6.
It is formed so as to be located in a space region between the signal supply terminal 9 formed on the wiring board 6 and the connection terminal 10 when the connection substrate 15 and the connection substrate 15 are overlapped. In the present embodiment, the connection line 13 is formed to a thickness of about 0.1 mm.

As shown in FIGS. 9 to 13, the wiring board 6 and the connection board 15 are connected to each other via an anisotropic conductive sheet 16 disposed on a portion of the connection board 15 other than the area where the insulating film 11 is formed. Then, the anisotropic conductive sheet 16 is thermocompression-bonded so as to have an appropriate thickness to absorb the thickness of the terminal members provided on the substrates 6 and 15. At this time, it is desirable that the anisotropic conductive sheet 16 be temporarily bonded to the connection board 15 by heating at a lower temperature, as shown in FIG. Thus, the contact terminal 10 and the conductive pattern 1
8 are electrically connected to each other via the anisotropic conductive sheet 16, and the connection signal supply terminals 19 a and the signal supply terminals 9 of the lead pattern 19 are electrically connected to the anisotropic conductive sheet 16, respectively. Electrically connected via the

As shown in FIG. 13, the electrical circuit structure of such an electrical component inspection socket electrically connects a plurality of signal supply terminals 9 and a plurality of contact terminals 10 formed separately on a wiring board. In this case, each of the signal supply terminals 9 and the corresponding connection signal supply terminal 19a of the lead pattern 19 formed on the connection board 15 are connected to the conductive particles 16a of the anisotropic conductive sheet 16 interposed therebetween. In addition, the contact terminals 10 and the corresponding connection contact terminals 18a of the conductive patterns 18 formed on the connection substrate 15 are electrically connected to each other by the conductive material of the anisotropic conductive sheet 16 interposed therebetween. Conduction is enabled via the particles 16a. Further, the conductive pattern 18 having each connection contact terminal 18a and the lead pattern 19 having each connection signal supply terminal 19a
Has a relationship of intersecting with a plurality of connection lines 13 respectively. Therefore, an arbitrary intersection is selected, an opening 12 of an insulating film is formed in this intersection, and a portion exposed from the opening 12 is connected to the connection line. By selectively connecting the terminals 13, various wiring forms can be configured.

Therefore, the opening 12 formed in the insulating film 11
Can be changed freely with respect to the signal supply terminal 9 and the lead pattern 19, the conductive pattern 18 and the contact terminal 10 electrically connected via the connection line 13. The electrical component socket 5 in the form of wiring can be efficiently and economically manufactured.

In the electrical component inspection socket of this embodiment, the signal supply terminals 9 correspond to the connection signal supply terminals 1 of the lead pattern 19 formed on the connection board 15.
9a, the connection portion between the contact terminal 10 and the corresponding connection contact terminal 18a of the conductive pattern 18 formed on the connection substrate 15 and the formation portion of the connection line 13 are formed between the wiring substrate 6 and the connection substrate 15. Further, the wiring board 6 and the connection board 15 are pressure-bonded with the anisotropic conductive sheet 16 as shown in FIGS. Absorbs the difference in thickness of the terminals and wiring patterns projecting from the surfaces of the substrates 6 and 15, and covers and protects the terminals and wiring patterns. It becomes something.

In this embodiment, for example, a flexible film substrate such as FPC or TAB is used as the substrate of the wiring substrate in the above embodiment, but a so-called hard substrate such as a glass substrate or a plastic substrate is used. It is also possible. Further, the anisotropic conductive sheet connecting the wiring substrate and the connection substrate can be replaced with another anisotropic conductive material, for example, an anisotropic conductive paste.

[0045]

As described above, according to the electrical component inspection socket of the first aspect of the present invention, the signal supply terminal can be connected via the connection line only by changing the position of the opening formed in the insulating film. By freely changing the contact terminals to be connected to each other to configure a desired signal supply circuit, it is possible to efficiently and economically manufacture electrical component inspection sockets of various signal supply forms and use a hard board. As a result, the signal supply circuit itself can be manufactured accurately and at low cost.

According to the electrical component inspection socket of the present invention, the contact terminal connected to the signal supply terminal via the connection wire can be freely changed only by changing the position of the opening formed in the insulating film. By changing the signal supply circuit, a signal supply circuit itself can be manufactured with high precision by efficiently and economically manufacturing electrical component inspection sockets of various signal supply forms and using a hard board. And it can be manufactured at low cost. In addition, since the two substrates are electrically connected with an anisotropic conductive material, it is possible to absorb a difference in thickness of a terminal or a wiring pattern protruding from the surface of the substrate by the anisotropic conductive material itself. Can withstand the impact of

According to the circuit structure of the third aspect, the contact terminal connected to the signal supply terminal via the connection line can be freely changed only by changing the position of the opening formed in the insulating film. Thus, a desired circuit structure can be efficiently and economically constructed.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a use state in which a contact terminal of an electrical component inspection socket is brought into contact with an electrode terminal of a liquid crystal display panel as an electrical component.

FIG. 2 is an explanatory plan view showing the shapes of signal supply terminals and connection terminals formed on a wiring board of the electrical component inspection socket according to the first embodiment of the present invention.

FIG. 3 is an explanatory plan view showing a position where an insulating film and an opening are formed on the wiring board of FIG. 2;

FIG. 4 is an explanatory plan view showing a completed state of a wiring board of an electrical component inspection socket.

FIG. 5 is an explanatory plan view showing the shapes of signal supply terminals and connection terminals formed on a wiring board of an electrical component inspection socket according to a second embodiment of the present invention.

FIG. 6 is an explanatory plan view showing the shapes of signal connection supply terminals and connection connection terminals formed on a connection board of an electrical component inspection socket according to a second embodiment of the present invention.

7 is an explanatory plan view showing a position where an insulating film and an opening are formed on the connection substrate shown in FIG. 6;

FIG. 8 is an explanatory plan view showing a state in which connection lines are formed on the connection substrate in FIG. 6;

FIG. 9 is an explanatory plan view showing a state where the wiring board of FIG. 5 and the connection board of FIG. 8 are crimped;

FIG. 10 is an explanatory diagram showing a state before starting pressure bonding of a wiring board and a connection board using an anisotropic conductive sheet.

FIG. 11 is an explanatory view showing a state in which an anisotropic conductive sheet is temporarily bonded to a connection substrate.

FIG. 12 is an explanatory view showing a state in which the wiring board and the connection board are pressed by using an anisotropic conductive sheet;
-12 sectional view

13 is a sectional view taken along the line 13-13 in FIG. 9;

[Description of Signs] 1 liquid crystal display panel 2 (one of liquid crystal display panel) substrate 3 (other liquid crystal display panel) substrate 4 electrode terminal 5 electrical component inspection socket 6 wiring board 7 PCB base 8 land 9 signal supply terminal DESCRIPTION OF SYMBOLS 10 Contact terminal 11 Insulating film 12 Opening 13 Connection line 14 FPC base 15 Connection board 16 Anisotropic conductive sheet 17 Wiring 18 Conductive pattern 19 Lead pattern

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H01R 33/76 H01R 33/76 A // G09F 9/00 352 G09F 9/00 352 F term (Reference) 2G011 AA10 AB08 AE22 AF07 2H088 EA02 FA12 FA13 FA30 HA02 HA06 MA16 2H092 GA41 GA49 GA50 JB77 MA57 NA30 PA06 5E024 CA30 CB10 5G435 AA17 AA19 BB12 EE47 KK05 KK09 KK10

Claims (3)

[Claims] An electrical component inspection socket for inspecting an electrical component by bringing a contact terminal on a wiring board into contact with an electrode terminal of the electrical component, wherein a plurality of sockets formed on the same substrate made of a hard base material are provided. An insulating film is formed on the wiring board so as to cover a part of the signal supply terminal and the plurality of contact terminals arranged separately from the signal supply terminal, and an opening is formed on the insulating film. An electrical component inspection socket, wherein an arbitrary signal supply terminal and an arbitrary contact terminal are connected by a plurality of connection lines via the opening. 2. An electrical component inspection socket for inspecting an electrical component by bringing a contact terminal on a wiring board into contact with an electrode terminal of the electrical component, the socket being separated from a plurality of signal supply terminals and the signal supply terminal. A wiring board having a plurality of contact terminals formed in an array, a lead pattern connected to each of the signal supply terminals, and a conductive pattern connected to each of the contact terminals; A pattern, an insulating film formed so as to cover a part of the lead pattern and the conductive lead pattern, and a plurality of connecting parts for connecting an arbitrary conductive pattern and an arbitrary lead pattern through an opening formed in the insulating film. And a connection board made of a hard base material having connection lines, wherein the connection board and the wiring board are electrically connected via an anisotropic conductive material. A socket for inspecting electrical components, characterized in that the socket is adapted to be inspected. 3. A wiring board having a plurality of signal supply terminals and a plurality of contact terminals arranged separately from the signal supply terminals, a lead pattern connected to the signal supply terminals, and the lead pattern. A conductive pattern connected to each of the connection terminals, an insulating film formed so as to cover a part of the lead pattern and the conductive pattern, and an insulating film formed on the insulating film. A connection board made of a hard board having a connection line for connecting an arbitrary conductive pattern and an arbitrary lead pattern through the opening, and connecting the wiring board and the connection board with an anisotropic conductive material. A circuit structure characterized by being formed by electrical connection.