JP2002066896A - Polishing device for medium slide surface of magnetic head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To control the size of a depth with high precision by polishing the medium slide surfaces of a plurality of MR heads at one time. SOLUTION: Polishing is applied on medium slide surfaces 102a of a plurality of magnetic head assembly 100 one time by a polishing device 1 having a plurality of sub-holders 10 to hold a magnetic head assembly 100. In this case, the resistance value of the magnetic head assembly 100 during polishing is always measured. Only the sub-holder 10 holding the magnetic head assembly 100 adjusted to a given resistance value is moved in a direction separating away from a polishing tape 11 and polishing of the magnetic head assembly 100 is completed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for polishing a medium sliding surface of a magnetic head which collectively polishes the medium sliding surface of a plurality of magnetic heads.

[0002]

2. Description of the Related Art Conventionally, magnetoresistive thin films (hereinafter referred to as M
An R thin film is used. 2. Description of the Related Art A magneto-resistive magnetic head (hereinafter, referred to as an MR head) for reproducing a signal recorded on a magnetic recording medium by utilizing the magneto-resistive effect of (1) is widely used.

In this MR head, the track width is determined by the width of the MR thin film, so that it is easy to narrow the track, and the reproducing sensitivity is reduced because the MR thin film is exposed from the surface facing the magnetic recording medium. It is high and attracts attention as an essential device for realizing high-density magnetic recording in the future.

Use of such an MR head for reproduction by the so-called helical scan method has been studied. In the helical scan method, a magnetic recording medium (magnetic tape) is wound around a drum that rotates at a high speed, and the magnetic head slides against the magnetic tape at a high speed. Reproduce the magnetic recording.

When used for the helical scan method,
The MR head has a structure in which a magnetoresistance effect element (hereinafter, referred to as an MR element) is sandwiched between a pair of bulk materials. Then, as shown in FIG.
Medium sliding surface 20 on which the magnetic tape slides
At 0a, an arc-shaped curved surface having a radius of curvature of Rx is formed in the sliding direction of the magnetic tape as shown by an arrow F in order to improve the contact with the magnetic tape. An arc-shaped curved surface having a radius of curvature Ry is formed in a direction perpendicular to the sliding direction of the magnetic tape as shown (hereinafter, referred to as a sliding width direction). Note that Rx> Ry.

The arc-shaped curved surface formed in the sliding direction and the sliding width direction of the medium sliding surface 200a is generally formed using a polishing tape and a polishing sheet. That is, a polishing tape, a polishing sheet and the like and the MR head 200
The medium sliding surface 200a is polished by the relative motion of the medium and the bending due to the rigidity of the polishing tape, the polishing sheet, or the like, and an arc-shaped curved surface is formed in the sliding direction and the sliding width direction. Then, at the same time as polishing the medium sliding surface, depth output is performed.

Here, the depth refers to the distance from the end on the medium sliding surface side of the MR thin film to the end on the side separated from the medium sliding surface.

When forming an arcuate curved surface in the sliding direction and the sliding width direction as described above, for example, the polishing tape 201 is caused to run in the sliding direction indicated by an arrow H as shown in FIG. While reciprocating the MR head 200 in the sliding width direction indicated by the arrow I, the MR head 200 is oscillated in the sliding direction as indicated by the arrow J. Thus, the medium sliding surface 200a has an arc-shaped curved surface having a radius Rx in the sliding direction and an arc-shaped curved surface having a radius Ry in the sliding width direction. .

[0009]

In this MR head, the variation in depth has a large effect on the electromagnetic conversion characteristics.
In addition, since MR heads are employed because demands for high capacity and high recording density are increasing, more accurate depth control is required.

In order to control the depth with high precision, the MR
In the head, the medium sliding surface is polished while measuring the resistance value of each MR head. There is a correlation between the resistance value of the MR head and the depth, and the resistance value of the MR head increases as the depth decreases. For this reason, the depth control can be accurately performed by measuring the resistance value of the MR head at a predetermined depth in advance and polishing the medium sliding surface until the resistance value reaches the resistance value.

Generally, when polishing an MR head as described above, first, one MR head is mounted on a polishing apparatus, and then polishing is performed for a certain period of time. Next, the MR head is once removed from the polishing apparatus, and the resistance value of the MR head is measured. Then, the above operation is repeated until the resistance value of the MR head reaches a predetermined value. That is, the polishing of the medium sliding surface and the measurement of the resistance value of the MR head are alternately repeated.

However, when the medium sliding surface is polished by the above-described method, it is necessary to perform polishing for each MR head, and it is necessary to remove the MR head from the polishing apparatus every time the polishing and the measurement of the resistance value are repeated. In order to increase the processing accuracy of the depth, it is necessary to repeat the polishing and the measurement of the resistance value as much as possible as described above, thereby causing an increase in the number of steps, which makes mass production difficult. . Further, since the resistance value of the MR head during polishing of the medium sliding surface cannot be determined, the medium sliding surface may be excessively polished even when the resistance value is measured as much as possible. At the same time, it is difficult to finish polishing at a specific resistance value, so that the finished MR head varies in depth.

On the other hand, when manufacturing a bulk-type inductive magnetic head, the medium sliding surfaces of a plurality of magnetic heads are polished at once. For this reason, the number of steps is reduced and mass production is easy.

Here, a method of simultaneously polishing the medium sliding surface of the bulk inductive magnetic head will be specifically described. First, the magnetic heads are mounted one by one on a plurality of sub-holders provided in a polishing apparatus capable of simultaneously polishing the medium sliding surfaces of the plurality of magnetic heads. Next, the medium sliding surface of each magnetic head is brought into contact with polishing means such as a polishing tape provided in the polishing apparatus, and the medium sliding surface is polished by relatively moving the polishing means and the sub holder. I do. Then, after the polishing for a certain period of time, the medium sliding surfaces of the plurality of magnetic heads are separated from the polishing means at a time to finish the polishing.

As described above, when the sliding surface of a bulk-type inductive magnetic head is polished by the polishing apparatus, the polishing amount is indirectly controlled by keeping the polishing time constant. I have. In the bulk-type inductive magnetic head, the dimensional tolerance of the depth is relatively large, for example, about ± 2 μm. Therefore, the polishing amount of the medium sliding surface is indirectly controlled by keeping the polishing time constant. Also, the depth is a value within the range of the dimensional tolerance described above. Therefore, there is no problem even if the polishing amount of the medium sliding surface is indirectly controlled by keeping the polishing time constant.

However, the MR head is required to control the depth more precisely, and the dimensional tolerance of the depth is set to ± 0.1 μm. For this reason, if the medium sliding surfaces of a large number of MR heads are polished at once for the purpose of reducing the number of steps, the required depth dimensional tolerance cannot be satisfied. Also, a difference occurs in the amount of polishing for each MR head, the depth of the finished MR head varies greatly, and an error exceeding an allowable amount occurs in some MR heads. Therefore, as described above, the medium sliding surface is polished while measuring the resistance value of each MR head. And the number of processes increases, and mass production becomes difficult.

The present invention has been proposed in view of such a conventional situation, and has been proposed in which the medium sliding surfaces of a plurality of MR heads are polished at a time to provide an MR with high depth machining accuracy.
An object of the present invention is to provide a polishing apparatus for a medium sliding surface of a magnetic head, which can manufacture a large amount of heads.

[0018]

An apparatus for polishing a medium sliding surface of a magnetic head according to the present invention comprises a plurality of holding means, a polishing means, a resistance value measuring means, and a control means. The plurality of holding units hold a plurality of magnetic heads. The polishing means collectively polishes the medium sliding surfaces of the plurality of magnetic heads held by the plurality of holding means. The resistance value measuring means is:
The resistance values of a plurality of magnetic heads whose medium sliding surfaces are polished by the polishing means are measured. The control unit compares the resistance values of the plurality of magnetic heads measured by the resistance value measurement unit with a preset reference resistance value, and the resistance value measured by the resistance value measurement unit is set to the reference resistance value. When the reached magnetic head is detected, control is performed to move the holding means for holding the magnetic head to a position separated from the polishing means.

In the apparatus for polishing a magnetic head according to the present invention, while measuring the resistance values of the plurality of magnetic heads held by the plurality of holding means, the medium sliding surfaces of the respective magnetic heads are collectively controlled by the polishing means. And polish. Then, the control means compares the resistance value of each magnetic head with the reference resistance value, and moves the holding means for holding the magnetic head whose resistance value has reached the reference resistance value to a position separated from the polishing means. I do.

Therefore, the apparatus for polishing a medium sliding surface of a magnetic head according to the present invention is capable of polishing the medium sliding surfaces of a plurality of magnetic heads at a time, and has good depth machining accuracy. It is possible to mass-produce a certain MR head.

[0021]

Embodiments of the present invention will be described below in detail with reference to the drawings. The present invention is not limited to the following examples, and it goes without saying that the present invention can be arbitrarily changed without departing from the gist of the present invention.

First, a description will be given of a magnetic head assembly 100 which is polished by a polishing apparatus for a medium sliding surface of a magnetic head to which the present invention is applied. The magnetic head assembly 100 includes:
As shown in FIG. 1, a head base 101 is provided with a magnetoresistive magnetic head (hereinafter referred to as an MR head) 102. When the MR head 102 is used in a so-called helical scan type recording / reproducing apparatus, the MR head 102 is usually used in the form of a magnetic head assembly 100 provided on a head base 101 and mounted on a rotating drum. .

The head base 101 has a terminal plate 1 on its main surface.
A pattern 104 made of a conductive material such as copper or gold is provided on the terminal plate 103. The pattern 104 is M
It is electrically connected to a terminal section 106 formed on the R head 102. The pattern 104 is connected to a measurement mechanism described later. That is, the measurement mechanism measures the resistance value of the MR head 102 via the pattern 104.

As shown in FIG. 2, the MR head 102
It has a structure in which a magnetoresistive element (hereinafter, referred to as an MR element) is sandwiched between a pair of bulk materials 107a and 107b. The MR element is exposed on the medium sliding surface 102a that slides on the magnetic tape.

As shown in FIG. 3, the MR element 110
An R thin film 111, a pair of bias layers 112a and 112b formed at both ends of the MR thin film 111, and a bias layer 11;
2a, 112b, a pair of electrode layers 113a,
113b is sandwiched between a pair of shield members 114a and 114b via a gap layer. The electrode layers 113a and 113b are, as shown in FIG.
The electrode layer 113 that is drawn out to the side separated from the medium sliding surface 102a and is separated from the medium sliding surface 102a.
The ends of a and 113b are connected to the terminal 106.

The MR head 102 is used for reproducing a so-called helical scan system. MR head 102
As shown in FIG. 5, an arc-shaped curved surface having a radius Rx in the sliding direction of the magnetic tape indicated by arrow A is formed on the medium sliding surface 102a of FIG. Further, in a direction perpendicular to the sliding direction indicated by arrow B (hereinafter, referred to as a sliding width direction), an arc-shaped curved surface having a radius Ry is formed. Note that Rx
> Ry.

When the medium sliding surface 102a is polished to form an arc-shaped curved surface having a radius Rx in the sliding direction and an arc-shaped curved surface having a radius Ry in the sliding width direction, a large number of MRs are required. It is desirable that the medium sliding surface 102a of the head 102 be polished collectively. By polishing the medium sliding surfaces 102a of a large number of MR heads 102 at once, the number of steps for manufacturing the MR heads 102 is reduced, and the MR heads 102 can be mass-produced.

When polishing the medium sliding surface 102a, the final depth is determined. In the MR head 102, the variation in depth has a large effect on the electromagnetic conversion characteristics. Since the MR head 102 has been adopted because of the increasing demand for high capacity and high recording density, more accurate depth control is required.

Note that the depth corresponds to the width of the MR thin film from the end on the medium sliding surface side to the end on the side separated from the medium sliding surface.

The apparatus for polishing a medium sliding surface of a magnetic head to which the present invention is applied performs a medium sliding surface 1 of a plurality of MR heads 102 while controlling the depth of the MR head 102 with high precision.
02a can be polished at once.

Hereinafter, a polishing apparatus for a medium sliding surface of a magnetic head to which the present invention is applied will be described in detail.

As shown in FIG. 6, the polishing apparatus 1 includes a polishing mechanism 2, a resistance value measuring mechanism 3, and a control mechanism 4.

As shown in FIG. 7, the polishing mechanism 2 includes a plurality of sub-holders 10 for individually holding a plurality of magnetic head assemblies 100, a polishing tape 11 for polishing a medium sliding surface 102a, and a plurality of polishing tapes. The magnetic head assembly 100 includes a main holder 12 that holds a plurality of sub-holders 10 so as to be arranged in a direction perpendicular to the running direction of the polishing tape 11.

The sub-holder 10 includes a magnetic head assembly 10
0 is a holding means. The sub holder 10 is the medium sliding surface 1
By holding the magnetic head assembly 100 and reciprocating while holding the magnetic head assembly 02a against the polishing tape 11,
The medium sliding surface 102a is polished. Also, the sub holder 10
Is provided with a probe 13 and a cable 14, which will be described later.
A resistance value of 0 is detected, and the detected resistance value is the value of cable 1
4 to the resistance value measuring mechanism 3. Further, the sub holder 10 is provided with an air cylinder (not shown). When the air cylinder operates, the sub holder 10 moves in a direction away from the polishing tape 11.

Even during polishing of the medium sliding surface 102a,
The resistance value of the magnetic head assembly 100 is detected by the probe 13. Then, when the resistance value of the magnetic head assembly 100 held by the sub-holder 10 reaches the reference resistance value, the air cylinder operates under the control of the control mechanism 4 and is individually polished with the other sub-holders 10. Tape 1
It moves individually in the direction away from 1. Then, the magnetic head assembly 100 is retracted from the polishing tape 11.

The above-described reference resistance value is a resistance value when the magnetic head assembly 100 reaches a predetermined depth. There is a correlation between the resistance value of the magnetic head assembly 100 and the depth of the magnetic head assembly 100, and the resistance value of the magnetic head assembly 100 increases as the depth of the magnetic head assembly 100 decreases. Magnetic head assembly 100
Is a predetermined depth, the resistance value is measured in advance, and this resistance value becomes the reference resistance value.

As described above, when the magnetic head assembly 100 held by the magnetic head assembly 100 reaches the reference resistance value, the magnetic head assemblies 100 are individually retracted from the polishing tape 11, so that the polishing apparatus 1 Each of the magnetic head assemblies 100 can have a predetermined depth without excessively polishing the medium sliding surface 102a.

Although the sub holder 10 is moved by the air cylinder here, the sub holder 10 may be moved by power other than the air cylinder.

The polishing tape 11 is a polishing means for polishing the medium sliding surface 102a. Then, the medium sliding surface 102a
Has an arc-shaped curved surface having a radius Rx in the sliding direction, and an arc-shaped curved surface having a radius Ry in the sliding width direction. Specifically, as shown in FIG.
Moves reciprocally by repeating the movement of the polishing tape 11 to the winding side and the movement of the polishing tape 11 to the supply side as shown by the arrow C, and the magnetic head assembly 1
00 performs the reciprocating motion in the sliding width direction as shown by arrow D and the swinging motion in the sliding direction as shown by arrow E, whereby the medium sliding surface 102a is polished. Note that a polishing sheet may be used instead of the polishing tape 11.

The main holder 12 includes a plurality of sub holders 1
0 is placed. Then, all the magnetic head assemblies 1
When the polishing of the magnetic head assembly 100 is started or when the polishing is completed in all the magnetic head assemblies 100, the plurality of sub-holders 10 are moved at one time.

Specifically, as shown in FIG.
Before the main holder 12 starts polishing of the medium sliding surface 102a, the magnetic head assembly 100 provided at the tip of the sub holder 10 is located at a position farthest from the polishing tape 11. When the polishing of the medium sliding surface 102a is started, as shown in FIG. 10, the sub holder 10 moves to a position close to the polishing tape 11 by rotating the main holder 12 about the rotation shaft 15. At this time, the magnetic head assembly 100 is
1, and the medium sliding surface 102a and the polishing tape 11 are in contact with each other. Then, the medium sliding surface 102a is polished. When the polishing of all the medium sliding surfaces 102a is completed, all the magnetic head assemblies 100 are retracted from the polishing tape 11, as shown in FIG. The main holder 12 rotates around the rotation shaft 15 again in this state, and the sub holder 10 moves to a position separated from the polishing tape 11 as shown in FIG. At this time, the magnetic head assembly 100 is located at the position farthest from the polishing tape 11.

The resistance value measuring mechanism 3 measures the resistance value of each magnetic head assembly 100. The resistance value measured by the resistance value measuring mechanism 3 is supplied to a control mechanism 4 described later.

The control mechanism 4 compares the resistance value of each magnetic head assembly 100 supplied from the resistance value measuring mechanism 3 with the reference resistance value, and determines whether the magnetic head assembly 10 has reached the reference resistance value.
Medium sliding surface 102 with respect to sub-holder 10
The information for terminating the polishing for a is supplied. The control mechanism 4 first compares the resistance value of each magnetic head assembly 100 supplied from the resistance value measurement mechanism 3 with a reference resistance value. Then, with respect to the sub-holder 10 holding the magnetic head assembly 100 having reached the reference resistance value, the information for moving the magnetic head assembly 100 away from the polishing tape 11 by moving the sub-holder 10 away from the polishing tape 11 is provided. Supply.

When a plurality of magnetic head assemblies 100 are being polished by the polishing mechanism 2, the resistance value of each magnetic head assembly 100 as shown in FIG. It is shown. here,
A straight line D indicates a reference resistance value. As each of the magnetic head assemblies 100 is polished, the resistance value increases, and eventually reaches a straight line D by extending the bar of the bar graph. When the bar reaches the straight line D, the depth of the magnetic head assembly 100 indicates that the bar has a predetermined size. Further, the magnetic head assembly 100 in which the bar does not reach the straight line D indicates that the depth is not set to the predetermined size. By displaying the resistance value of each magnetic head assembly 100 on the monitor, it is possible for an operator to confirm the polishing state of the magnetic head assembly 100.

Hereinafter, a specific operation of the above-described polishing apparatus 1 will be described in detail. In the polishing apparatus 1, when a switch for operating the polishing apparatus 1 is turned on, a control program is executed, and the operation of each section for polishing the medium sliding surface 102a is fully automatically controlled.

First, a plurality of magnetic head assemblies 100 are set on the sub holder 10. The polishing apparatus 1 is provided with a stand for a preliminary set (not shown). First, the magnetic head assembly 100 is attached to the stand for the preliminary set.
Insert Then, when a switch for operating the polishing apparatus 1 is turned on, the mechanical chuck is moved to the magnetic head assembly 10.
0, the magnetic head assembly 100 is set in each sub-holder 10 and clamped. The probe 13
Is brought into contact with the pattern 104 so as to be electrically conducted.

Next, the initial resistance value of each magnetic head assembly 100 is measured. The initial resistance value measured here is
The data is captured by the control mechanism 4 and displayed on a monitor provided in the control mechanism 4.

When the main holder 12 rotates about the rotation shaft 15, the sub holder 10 moves to a position close to the polishing tape 11, and each medium sliding surface 102 a is in contact with the polishing tape 11. It is said.

Next, the medium sliding surface 102a is polished. At this time, the polishing tape 11 reciprocates by repeating the movement to the winding side and the movement to the supply side as shown by the arrow C in FIG. Further, the magnetic head assembly 10
0 performs reciprocating motion in the sliding width direction as shown by arrow D and swinging motion in the sliding direction as shown by arrow E.

While the medium sliding surface 102a is being polished as described above, the resistance value of each magnetic head assembly 100 is measured by the resistance value measuring mechanism 3. The resistance value of each magnetic head assembly 100 is detected by a probe 13 provided on the sub holder 10. The resistance value detected by the probe 13 is supplied to the resistance value measuring mechanism 3 through the cable 14.

The resistance value of each magnetic head assembly 100 measured by the resistance value measurement mechanism 3 is supplied to the control mechanism 4 and compared with a reference resistance value. And the control mechanism 4
A polishing tape 11 is attached to the sub-holder 10 holding the magnetic head assembly 100 reaching the reference resistance value.
The information indicating that the magnetic head assembly 100 is retracted from the polishing tape 11 by moving in the direction away from the polishing tape 11 is supplied.

The sub holder 10 to which the information is supplied from the control mechanism 4 moves the medium sliding surface 102a in accordance with the supplied information.
Polishing is continued or terminated. When the information for terminating the polishing is supplied, the sub-holder 10
The magnetic head assembly 100 is moved away from the polishing tape 11 so as to be retracted from the polishing tape 11, and the polishing of the medium sliding surface 102a is completed. The movement of the sub holder 10 in the direction away from the polishing tape 11 is performed by the operation of an air cylinder provided in the sub holder 10. When the information for terminating the polishing is not supplied, the sub holder 10 is not moved, and the polishing of the medium sliding surface 102a is continued.

The resistance value of the magnetic head assembly 100 increases as the polishing of the medium sliding surface 102a proceeds and the depth decreases. Then, when the depth is set to a predetermined value, the resistance value of the magnetic head assembly 100 becomes the reference resistance value. When the resistance value of the magnetic head assembly 100 becomes higher than the reference resistance value, the depth becomes smaller than a predetermined value, which indicates that the medium sliding surface 102a is excessively polished. Magnetic head assembly 100
When the resistance value of the magnetic head assembly 100 reaches the reference resistance value, the polishing is terminated, so that the depth of the magnetic head assembly 100 is set to a predetermined size.

As described above, in the polishing apparatus 1,
The resistance value is measured while polishing the medium sliding surface 102a, and the magnetic head assembly 10 whose resistance value reaches the reference resistance value is measured.
Since the depth is managed by individually retracting the sub-holder 10 holding 0 from the polishing tape 11,
Depth variation can be improved. When the medium sliding surface 102a was polished by the polishing apparatus without measuring the resistance value, the depth variation of the finished magnetic head assembly was 1 μm, whereas in the present embodiment, the finished magnetic head assembly was finished. Depth variation in the magnetic head assembly has been improved to 0.2 μm.

When the polishing of the medium sliding surface 102a in all the magnetic head assemblies 100 is completed, all the sub holders 10 are retracted from the polishing tape 11. After all the sub holders 10 have been retracted from the polishing tape 11, the main holder 12 rotates about the rotation shaft 15, and the sub holder 10 moves to a position separated from the polishing tape 11. At this time, the magnetic head assembly 100 is at the position farthest from the polishing tape 11.

Then, the final resistance value of each magnetic head assembly 100 is measured, and the polishing of the medium sliding surface 102a is completed.

As is clear from the above description, the polishing apparatus 1 measures the resistance value while polishing the medium sliding surfaces 102a of the plurality of magnetic head assemblies 100 at once, and sets the reference resistance value. By moving only the sub-holder 10 holding the reached magnetic head assembly 100 in a direction away from the polishing tape 11, the magnetic head assembly 100 having a predetermined depth is retracted from the polishing tape 11. The polishing apparatus 1 measures the resistance value of each magnetic head assembly 100 while polishing the magnetic head assembly 100. For this reason, the polishing apparatus 1
This is due to the difference between the initial state of each magnetic head assembly 100 and the contact state between the medium sliding surface 102a and the polishing tape 11 even when a plurality of magnetic head assemblies 100 are polished simultaneously. The depth of each magnetic head assembly 100 can be controlled to a predetermined size with high precision without being affected by variations in the polishing state.

Further, since the polishing apparatus 1 can polish a plurality of magnetic head assemblies 100 at once, the processing time of the magnetic head assemblies 100 can be greatly reduced, and Mass production of the assembly 100 is facilitated.

The polishing apparatus 1 has a medium sliding surface 102a.
There is no need for an operator to be resident because the polishing is performed automatically. For this reason, the number of steps can be significantly reduced.

[0060]

The polishing apparatus for a medium sliding surface of a magnetic head according to the present invention measures the resistance value while polishing the medium sliding surface of a plurality of magnetic heads at a time, and adjusts the resistance value to a predetermined resistance value. By moving only the holding means for holding the reached magnetic head in a direction away from the polishing means, the magnetic head having a predetermined depth is retracted from the polishing means. Further, the polishing apparatus for a medium sliding surface of a magnetic head according to the present invention measures the resistance value of the magnetic head while polishing the magnetic head. For this reason, according to the apparatus for polishing a medium sliding surface of a magnetic head according to the present invention, even when a plurality of magnetic heads are simultaneously polished, the initial state of each magnetic head and the polishing of the medium sliding surface can be improved. The depth of each magnetic head can be controlled to a predetermined size with high precision without being affected by variations in the polishing state due to the difference in the state of contact with the means.

The magnetic head polishing apparatus according to the present invention can simultaneously polish a plurality of magnetic heads at a time, so that the processing time of the magnetic head can be greatly reduced. Mass production becomes easier.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a magnetic head assembly.

FIG. 2 is a perspective view showing a magnetic head.

FIG. 3 is an enlarged view of a main part of a medium sliding surface of a magnetic head.

FIG. 4 is a sectional view showing an electrode layer formed on the magnetic head.

FIG. 5 is a perspective view showing the shape of a medium sliding surface of a magnetic head.

FIG. 6 is a block diagram of an apparatus for polishing a medium sliding surface of a magnetic head to which the present invention is applied.

FIG. 7 is an enlarged view of a main part of the polishing apparatus.

FIG. 8 is a schematic diagram showing a state in which the medium sliding surfaces of a plurality of magnetic head assemblies are polished by the polishing apparatus.

FIG. 9 is a view for explaining the movement of the main holder in the polishing apparatus, and is a schematic view showing a state before the polishing of the medium sliding surface is started.

FIG. 10 is a view for explaining the movement of the main holder in the polishing apparatus, and is a schematic view showing a state in which the medium sliding surface is being polished.

FIG. 11 is a view for explaining the movement of the main holder in the polishing apparatus, and is a schematic view showing a state immediately after the polishing of the medium sliding surface is completed.

FIG. 12 is a view showing a graph shown on a monitor of the polishing apparatus.

FIG. 13 is a perspective view showing a shape of a medium sliding surface of the magnetic head.

FIG. 14 is a schematic view showing a state in which a magnetic head assembly is polished by a conventional polishing method.

[Explanation of symbols]

1 polishing apparatus, 10 sub holders, 11 polishing tape,
12 main holder, 13 probe, 14 cable, 100 magnetic head assembly, 102a medium sliding surface

Claims (1)

[Claims] A plurality of holding means for individually holding a plurality of magnetic heads; a polishing means for collectively polishing medium sliding surfaces of the plurality of magnetic heads held by the plurality of holding means; Resistance measuring means for measuring the resistance of each of the plurality of magnetic heads whose medium sliding surfaces are polished by the means; and a reference resistance set in advance to the resistance of the plurality of magnetic heads measured by the resistance measuring means. When a magnetic head whose resistance value measured by the resistance value measuring means has reached the reference resistance value is detected, the holding means for holding the magnetic head is separated from the polishing means. And control means for controlling the movement of the magnetic head to the medium.