JP4040811B2 - Magnetic head slider processing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for processing a magnetic head slider used in a hard disk device or the like.
[0002]
[Prior art]
In a magnetic recording device such as a hard disk device, a thin film magnetic head element for writing or reading magnetic information is mounted on a magnetic head slider provided facing a recording surface of a recording medium such as a hard disk. The magnetic head slider has a hexahedral shape, and a pair of parallel slider rails is formed on one surface thereof. The surface of the slider rail is a surface facing the recording surface of the recording medium, and is called an air bearing surface (or air bearing surface). When the recording medium rotates, the magnetic head slider slightly moves away from the recording medium (generally, it floats) due to the air flow generated between the recording surface and the air bearing surface.
[0003]
A thin film magnetic head element is formed on an end face sharing the ridge line with the air bearing surface in the magnetic head slider. The thin film magnetic head element includes an MR (Magneto-Resistive) film whose resistance is changed by an external magnetic field, and this MR film is formed so that its edge is located on the same plane as the air bearing surface.
[0004]
This magnetic head slider is manufactured by the following process, for example, as proposed in JP-A-9-180146.
[0005]
First, a large number of thin film magnetic head elements are formed on a predetermined substrate (wafer) made of, for example, a ceramic material by a thin film process using a photolithography method or the like. Subsequently, the wafer is cut using a dicing saw or the like to form a plurality of strip-shaped bars each including a plurality (a plurality of sets) of magnetic head sliders. After polishing the cut surfaces of the plurality of bars thus obtained, the bars are cut to obtain individual magnetic head sliders.
[0006]
In general, the cutting process of the cut surface of the bar includes (1) a first polishing process for processing the MR film into a predetermined dimension, and (2) further polishing the surface polished in the first polishing process. For example, it comprises two processes called a second polishing process for forming an air bearing surface of a predetermined shape called a crown or the like. The crown is a convex curved surface that is curved in the extending direction of the slider rail.
[0007]
The first polishing process is performed by a method called RLG (Resistance Lapping Guide) polishing method, for example. In the RLG polishing method, for example, as proposed in Japanese Patent Laid-Open No. 2-95572, a resistance film is formed at a position adjacent to the MR film, for example, and the resistance value of the resistance film accompanying polishing is controlled as feedback information. Is supposed to do.
[0008]
On the other hand, in the second polishing process, for example, polishing called a touch lap method is performed. The touch wrap method is different from a normal polishing process in that the bar is pressed against the polishing plate via an elastic body such as rubber. The reason for using the elastic body is to make the pressing force of the bar against the polishing plate uniform over the surface to be polished. In place of the touch wrap method, a so-called kiss wrap method in which a single magnetic head slider cut out from a bar is pressed against a polishing plate via an elastic body may be used.
[0009]
Conventionally, in the touch wrap method and the kiss wrap method, feedback control based on the resistance value of the resistive film formed on the bar (or a single magnetic head slider cut out from the bar) has not been performed, and from the start of polishing. The polishing is finished when a certain time has passed.
[0010]
[Problems to be solved by the invention]
However, in general, any polishing method inevitably causes a change in the polishing rate with time due to abrasion of abrasive grains on the polishing plate. Therefore, as described above, in the method of ending polishing when a certain time has elapsed from the start of polishing, there is a possibility that the actual polishing amount varies for each bar. Such variation in the polishing amount causes variation in the shape of the air bearing surface of the magnetic head slider. In addition, even if the MR element is accurately formed in the first polishing process, there is a problem that the final dimension of the MR element varies due to variations in the polishing amount in the second polishing process.
[0011]
Such problems can be solved by frequently embedding abrasive grains on the polishing plate (charging work), but this requires frequent shutdown of the equipment, which greatly reduces the operating rate of the equipment. There is a problem of end up.
[0012]
The present invention has been made in view of such problems, and an object of the present invention is to provide a method of processing a magnetic head slider with small processing variations.
[0013]
[Means for Solving the Problems]
  A magnetic head slider processing method according to the present invention includes:A long member including at least one magnetic head slider each having a thin film magnetic head element and a resistance film formed thereon.A first polishing step of polishing a predetermined surface of the bar by pressing the bar against the first polishing plate without using an elastic member;The lead member for detecting the resistance value of the resistance film and the resistance film are electrically connected to the bar after the completion of the first polishing process or the single magnetic head slider cut out from the bar by a rigid support. And a step of transferring the bar or the single magnetic head slider to which the lead member is connected from the support to a holding means including an elastic member,Bar orIs simpleThe magnetic head slider of the body is pressed against the second polishing plate using an elastic member and polished by the first polishing stepIsA second polishing step for further polishing the polished surface.SeeAt least in the second polishing step, it varies depending on the polishing amount of the bar or the single magnetic head slider.Resistance film resistanceOn the basis of thefeedbackPolishing control is performed.
[0014]
  According to the magnetic head slider processing method of the present invention, for example, a first polishing process is performed to form a thin film magnetic head element with a predetermined dimension, and then the shape of the air bearing surface is formed into a predetermined shape. Therefore, the second polishing process can be performed. At least in the second polishing stepResistance film resistancebased onfeedbackSince polishing is performed, for example, a constant amount of polishing is always performed regardless of the degree of wear of abrasive grains on the polishing plate.Prior to the second polishing step, the resistance film and the lead member are connected while the magnetic head is supported by a rigid support, and then the magnetic head is moved from the support to the holding means (including the elastic member). Since the transfer is performed, it is possible to easily perform a method (for example, a wire bonding method) that is difficult to implement when the bar is attached to the elastic member.
[0015]
  Also, aboveOfIt is desirable to finish polishing when the resistance value reaches a predetermined value.
[0017]
In the second polishing step, it is desirable to swing the bar or the single magnetic head slider about an axis substantially parallel to the polishing surface of the second polishing plate. This makes it easy to make the air bearing surface of the bar or the single magnetic head slider convex. Further, the bar or the single magnetic head slider may be swung around an axis orthogonal to the polishing surface of the second polishing plate. In this way, it is possible to prevent the bar from being damaged in a certain direction called smear by changing the angle between the rotating direction of the polishing plate and the extending direction of the bar.
[0018]
  Other magnetic head slider processing methods according to the present invention include thin film magnetic head elements, respectively.And resistive filmAt least one magnetic head slider formed withIt is a long member includingBar or a single magnetic head slider cut out from the barA process of electrically connecting a lead member and a resistive film for detecting resistance of the resistive film while supporting by a rigid support, and supporting a bar or a single magnetic head slider to which the lead member is connected A process of transferring from a body to a holding means including an elastic member, and a bar or a single magnetic head sliderPolishing process by pressing against the polishing plate using an elastic memberWhenIncludingSeeIn this polishing process, it varies depending on the polishing amount of the bar or the single magnetic head slider.Resistance film resistanceOn the basis of thefeedbackPolishing control was performedIs a thing.
[0019]
  According to the magnetic head slider processing method of the present invention, the magnetic head slider changes according to the polishing amount of the bar or the single magnetic head slider.Resistance film resistanceOn the basis of thefeedbackSince polishing control is performed, the same amount of polishing is always performed regardless of the degree of abrasion of the abrasive grains on the polishing plate.AndAn accurate magnetic head slider can be formed.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
[Configuration of magnetic head slider]
First, a structure of a magnetic head slider to which a magnetic head slider processing method according to an embodiment of the present invention is applied will be described with reference to FIGS.
[0021]
FIG. 1 shows a magnetic head slider 2 to which the magnetic head slider processing method according to the present embodiment is applied. The magnetic head slider 2 is attached to the tip of an actuator arm 3 provided in a hard disk (not shown). The actuator arm 3 is rotated by, for example, a driving force of a voice coil motor (not shown), so that the magnetic head slider 2 extends in a direction x across the track line along the recording surface of a recording medium such as a hard disk. It is supposed to move.
[0022]
The magnetic head slider 2 is a substantially hexahedral block, and one of the blocks (the upper surface in the figure) is disposed so as to face the recording surface of the recording medium. Two parallel slider rails 2a are formed on the surface of the recording medium facing the recording surface. The surface of the slider rail 2a is called an air bearing surface (ABS) 2e. When the recording medium rotates, the magnetic head slider 2 is caused by an air flow generated between the recording surface of the recording medium and the air bearing surface 2e. Is slightly moved away from the recording surface in the direction y facing the recording surface, so that a certain clearance is formed between the air bearing surface 2e and the recording medium.
[0023]
A thin film magnetic head element 1 is provided on one end surface (the left side end surface in FIG. 1) sharing a ridge line with the air bearing surface 2e of the magnetic head slider 2.
[0024]
FIG. 2 is an exploded view of the configuration of the thin film magnetic head element 1. FIG. 3 shows a cross-sectional structure of the thin film magnetic head element 1 in the arrow direction along the line III-III shown in FIG. The thin-film magnetic head element 1 is constructed by integrating a reproducing head portion 1a for reproducing magnetic information recorded on a recording medium and a recording head portion 1b for recording magnetic information on the recording medium.
[0025]
As shown in FIGS. 2 and 3, the reproducing head portion 1a includes, for example, an insulating layer 11, a lower shield layer 12, a lower shield gap layer 13, an upper shield gap layer 14 and an upper portion on the base 2d of the slider 2. The shield layer 15 has a structure laminated in this order. For example, the insulating layer 11 has a thickness of 2 μm to 10 μm, and Al₂O_Three(Alumina). The lower shield layer 12 has a thickness of 1 μm to 3 μm, for example, and is made of a magnetic material such as NiFe (nickel iron alloy: permalloy). The lower shield gap layer 13 and the upper shield gap layer 14 have, for example, a thickness of 10 nm to 100 nm, respectively, and Al₂O_ThreeOr each is comprised by AlN (aluminum nitride). The upper shield layer 15 has a thickness of 1 μm to 4 μm, for example, and is made of a magnetic material such as NiFe. The upper shield layer 15 also has a function as a lower magnetic pole of the recording head portion 1b.
[0026]
An MR (Magneto-Resistive) element 1 c is embedded between the lower shield gap layer 13 and the upper shield gap layer 14. The MR element 1c is for reading information written on a recording medium, and is arranged on the air bearing surface 2e side. The MR element 1c includes an MR film 20 made of an AMR (Anisotropic Magneto-Resistive) film or a GMR (Giant Magneto-Resistive) film. The AMR film has a single layer structure including a magnetic layer made of, for example, NiFe. The GMR film includes a soft magnetic layer, a ferromagnetic layer made of, for example, CoFe (iron cobalt alloy), an antiferromagnetic layer made of, for example, MnPt (manganese platinum alloy), and a nonmagnetic metal layer made of, for example, Cu (copper). It has a multilayer structure including.
[0027]
As shown in FIG. 2, magnetic domain control films 30a and 30b made of, for example, a hard magnetic material are formed on both sides of the MR film 20 in the track width direction (x direction in the figure). The magnetic domain control films 30 a and 30 b are for suppressing the generation of Barkhausen noise by applying a bias magnetic field in a certain direction to the MR film 20. The MR film 20 is electrically connected to a pair of lead layers 33a and 33b disposed so as to face each other with the MR film 20 interposed therebetween in the track width direction. These lead layers 33a and 33b are made of, for example, tantalum (Ta), and are formed between the lower shield gap layer 13 and the upper shield gap layer 14, respectively. The lead layers 33a and 33b are extended toward the side opposite to the air bearing surface 2e, and have a predetermined pattern on the upper shield gap layer 14 through an opening (not shown) formed in the upper shield gap layer 14. Are electrically connected to the output terminals 33c and 33d.
[0028]
As shown in FIG. 3, the recording head 1b is formed on, for example, the upper shield layer 15 with Al.₂O_ThreeAnd a recording gap layer 41 having a thickness of 0.1 μm to 0.5 μm made of an insulating film. The recording gap layer 41 has an opening 41a at a position corresponding to the center of thin film coils 43 and 45 described later. A thin film coil 43 having a thickness of 1 μm to 3 μm and a photoresist layer 44 covering the same are formed on the recording gap layer 41 via a photoresist layer 42 having a thickness of 1.0 μm to 5.0 μm, for example. ing. A thin film coil 45 having a thickness of 1 μm to 3 μm and a photoresist layer 46 covering the thin film coil 45 are formed on the photoresist layer 44.
[0029]
On the recording gap layer 41 and the photoresist layers 42, 44, 46, an upper magnetic pole 47 having a thickness of about 3 μm made of a magnetic material having a high saturation magnetic flux density such as NiFe or FeN (iron nitride) is formed. ing. The upper magnetic pole 47 is in contact with the upper shield layer 15 through the opening 41a of the recording gap layer 41 provided corresponding to the center of the thin film coils 43 and 45, and is magnetically coupled. . Although not shown in FIGS. 2 and 3 on the upper magnetic pole 47, for example, Al₂O_ThreeAn overcoat layer having a thickness of 20 μm to 30 μm is formed so as to cover the whole. As a result, the recording head 1b generates a magnetic flux between the upper shield layer 15 as the lower magnetic pole and the upper magnetic pole 47 by the current flowing through the thin film coils 43 and 45, and records by the magnetic flux generated in the vicinity of the recording gap layer 41. The medium is magnetized and information is recorded.
[0030]
The thin film magnetic head element 1 having such a structure operates as follows. That is, by writing a current through the thin film coils 43 and 45 of the recording head unit 1b, a magnetic flux for writing is generated and information is recorded on the recording medium. Also, a sense current is passed through the MR film 20 of the reproducing head unit 1a to detect a change in resistance due to a signal magnetic field from the recording medium, thereby reading information recorded on the recording medium.
[0031]
[Polishing equipment]
The magnetic head slider processing method according to the present embodiment includes two polishing steps. In the first polishing process, a so-called RLG polishing method is used, and the bar height 5 until the MR height (distance from the air bearing surface to the farthest end of the MR film 20) of the MR film 20 of the thin film magnetic head element 1 reaches the target value. The surface to be polished is polished. In the second polishing step, the surface polished in the first polishing step is further polished using a so-called touch wrap method to form, for example, a convex curved surface called a crown.
[0032]
First, an RLG polishing apparatus used in the first polishing process and a touch lap polishing apparatus used in the second polishing process will be described.
[0033]
<RLG polishing equipment>
FIG. 4 is a diagram showing the basic configuration of the RLG polishing apparatus 6, and FIG. 5 is an enlarged view showing the main part thereof. The RLG polishing apparatus 6 includes a long first holder 60 that holds the bar 5, a polishing plate 61 that is formed by burying diamond abrasive grains on the surface of a disk made of Sn (tin), and a polishing plate And a polishing plate driving mechanism 62 for rotating the motor 61. Three actuators 63a, 63b, and 63c that press the bar 5 against the polishing plate 61 are provided on the opposite side of the surface of the first holder 60 to which the bar 5 is attached. The polishing plate drive mechanism 62 and the actuators 63a, 63b, and 63c are controlled by a control unit 65 including, for example, a CPU (central processing unit).
[0034]
The first holder 60 is formed with two cutouts 60a and 60b at positions where the first holder 60 is equally divided in the longitudinal direction. The cutouts 60a and 60b cause the first holder 60 to bend in the bending direction. It can be bent. The actuators 63a, 63b, and 63c press the respective portions divided into three by the notches 60a and 60b of the first holder 60.
[0035]
As shown in FIG. 5, for example, five dummy resistance films 7 are formed on the bar 5 at regular intervals in the longitudinal direction of the bar 5. The dummy resistance film 7 is a resistance film having substantially the same configuration as the MR film 20 (FIG. 3) of the thin film magnetic head element 1, and is connected to the measurement circuit 64 through a flexible substrate (not shown). Similar to the thin-film magnetic head element 1, the dummy resistance film 7 is formed on an end face that shares a ridge line with a surface to be polished (that is, a surface to be an air bearing surface) of the magnetic head slider 2, and is used for polishing the surface to be polished. Along with this, the size of the dummy resistance film 7 becomes smaller and its resistance value changes. The controller 65 drives the three actuators 63a, 63b, and 63c based on the resistance value change of the dummy resistance film 7, thereby pressing the bar 5 against the polishing plate 61 with a uniform pressure in the longitudinal direction. It is like that. Since this RLG polishing apparatus is a known apparatus described in JP-A-10-7231, JP-A-11-863, etc., detailed description of a specific apparatus configuration example is omitted.
[0036]
<Touch wrap polishing equipment>
FIG. 6 is a diagram illustrating a basic configuration of the touch wrap polishing apparatus 8. The touch wrap polishing apparatus 8 includes a second holder 80 that is a long member that holds the bar 5, a polishing plate 81 that is formed by burying diamond abrasive grains on the surface of a disk made of Sn, and the polishing plate. A polishing plate drive mechanism 82 that rotationally drives 81 is provided. An elastic member 80a made of rubber, for example, is provided on the side of the second holder 80 that holds the bar 5, and the bar 5 is bonded and fixed to the elastic member 80a. This elastic member 80a is for bringing the bar 5 into contact with the polishing plate 81 evenly over the surface to be polished.
[0037]
Further, the touch wrap polishing apparatus 8 includes actuators 83a, 83b, 83c that press the bar 5 against the polishing plate 81, and a direction in which the bar 5 approaches and separates from the polishing plate 81 (indicated by an arrow C in the drawing) ), A slide mechanism 85 for moving the bar 5 along the radial direction of the polishing plate 81 (direction indicated by arrow D in the figure), and an axis A substantially parallel to the polishing surface. Is provided with a swing mechanism 86 that rotates around a predetermined angle (eg, ± 20 ° C.) and a rotation mechanism 87 that rotates the bar 5 around an axis B substantially parallel to the polishing surface. These actuators 83a, 83b, and 83c, the slide mechanism 85, the swing mechanism 86, and the rotation mechanism 87 are controlled by a control unit 88 that includes a CPU, for example.
[0038]
The actuators 83a, 83b, and 83c press the one end, the center, and the other end of the second holder 80 in the longitudinal direction against the polishing plate 81, respectively. As shown in FIG. 7, the slide mechanism 85 moves the second holder 80 from the outer periphery to the inner periphery of the polishing surface 81a of the polishing plate 81 so that the bar 5 is uniformly in contact with the entire polishing surface 81a. It has become. Further, as shown in FIG. 7, the swing mechanism 86 reciprocally swings the second holder 80 about a predetermined angle around an axis A that is substantially parallel to the polishing surface 81a and substantially parallel to the longitudinal direction of the bar 5. Thus, the polished surface of the bar 5 is a convex curved surface (for example, a crown). The rotation mechanism 87 reciprocates the second holder 80 around the axis B substantially perpendicular to the polishing surface 81a by a predetermined angle so that the angle in the extending direction of the bar 5 is relative to the rotation direction of the polishing surface 81a. Thus, it is possible to prevent a scratch (so-called smear) along the rotation direction of the polishing plate 81 from occurring on the surface to be polished of the bar 5.
[0039]
The slide mechanism 85 is configured to start the reciprocating movement of the second holder 80 when receiving an operation start signal from the control unit 88 and repeat the reciprocating movement until receiving a stop signal from the control unit 88. Similarly, when the swing mechanism 86 and the rotation mechanism 87 receive an operation start signal from the control unit 88, the swing mechanism 86 and the rotation mechanism 87 start reciprocal swing (or reciprocal rotation) within a predetermined angle range. The reciprocating rocking (or reciprocating rotation) is repeated until a stop signal is received.
[0040]
For example, the five dummy resistance films 7 formed on the bar 5 are connected to the measurement circuit 89 via the flexible substrate 95 (FIG. 11). The control unit 88 drives the actuators 83a, 83b, 83c based on the resistance value of the dummy resistance film 7 detected by the measurement circuit 89 so that the polishing amount of the bar 5 is made uniform in the longitudinal direction. .
[0041]
[Method of manufacturing magnetic head slider]
FIG. 8 is a flowchart showing a magnetic head slider manufacturing method including the magnetic head slider processing method according to the present embodiment. FIG. 9 is a perspective view for each step for explaining the method of manufacturing the magnetic head slider shown in FIG. First, as shown in FIG. 9A, for example, Al₂O_ThreeA large number of thin film magnetic head elements 1 and dummy resistance films 7 are formed on a wafer 4 of about 3 inches made of TiC by a thin film process (S10).
[0042]
Here, a thin film process for forming a thin film magnetic head or the like will be briefly described with reference to FIGS.
[0043]
First, for example, Al is formed on the wafer 4 by sputtering or the like.₂O_ThreeAn insulating film 11 made of an insulating material such as is formed. Next, the lower shield layer 12 made of a magnetic material such as NiFe is selectively formed on the insulating film 11 by, eg, sputtering. Subsequently, Al is formed on the lower shield layer 12 by sputtering, for example.₂O_ThreeA highly insulating lower shield gap layer 13 is formed by forming a film and heating the film.
[0044]
Next, after forming a laminated film for forming the MR film 20 on the lower shield gap layer 13 by sputtering, for example, a photoresist pattern is selectively formed thereon. After that, using this photoresist pattern as a mask, the laminated film is etched by, for example, ion milling to form an MR film 20 having a predetermined planar shape and size. Next, the magnetic domain control films 30a and 30b and the lead layers 33a and 33b are respectively formed on the lower shield gap layer 13 by sputtering, for example.
[0045]
Next, the upper shield gap layer 14 is formed on the lower shield gap layer 13, the MR film 20, and the lead layers 33a and 33b in the same manner as the lower shield gap layer 13. After that, the upper shield layer 15 is selectively formed on the upper shield gap layer 14 by sputtering, for example.
[0046]
After the upper shield layer 15 is formed, Al is formed thereon by, for example, sputtering.₂O_ThreeA recording gap 41 made of an insulating material such as is formed. After that, a photoresist 42 is selectively formed on the recording gap 41 by using a photolithography technique. Next, the thin film coil 43 is selectively formed on the photoresist 42 by, for example, plating or sputtering. Subsequently, a photoresist 44 is selectively formed on the photoresist 42 and the thin film coil 43 in the same manner as the photoresist 42, and the thin film coil 45 is selectively formed thereon as in the thin film coil 43. To form. Further, a photoresist 46 is selectively formed on the photoresist 44 and the thin film coil 45 in the same manner as the photoresist 42.
[0047]
After forming the photoresist 46, the recording gap 41 is partially etched to form an opening 41a in the vicinity of the center of the thin film coils 43 and 45. After that, an upper magnetic pole 47 made of a magnetic material such as NiFe or FeN is formed on the recording gap 41 and the photoresists 44 and 46 by, for example, sputtering. Subsequently, using the upper magnetic pole 47 as a mask, the recording gap 41 and a part of the upper shield layer 15 are etched by, for example, ion milling. After that, on the upper magnetic pole 47, for example, by sputtering, for example, Al.₂O_ThreeAn overcoat (not shown) is formed.
[0048]
In this way, as shown in FIG. 9A, a large number of thin film magnetic head elements 1 are formed on the wafer 4 (only one row is shown in FIG. 9A).
[0049]
Subsequently, the wafer 4 is cut into strips by, for example, a dicing saw to obtain a large number of bars 5 (S12). As shown in FIG. 9B, each bar 5 includes a plurality of magnetic head sliders 2 each having at least one thin film magnetic head element 1 formed thereon. In addition, the dummy resistance films 7 are arranged on the bar 5 at regular intervals.
[0050]
Next, as shown in FIG. 9 (C), the surface opposite to the surface (indicated by symbol S in the figure) which becomes the air bearing surface of the bar 5 is bonded and fixed to the first holder 60 using an adhesive. . In FIG. 9C, one bar 5 is fixed to the first holder 60, but two or more bars 5 may be fixed to be parallel to each other. Subsequently, the flexible substrate (not shown) connected to the measurement circuit 64 and the dummy resistance film 7 are connected by, for example, a wire bonding method so that the resistance value of the dummy resistance film 7 can be measured by the measurement circuit 64 (S13). Subsequently, the first polishing process using the RLG processing machine 6 is started (S14).
[0051]
FIG. 10 is a diagram illustrating a polishing process of the bar 5 by the RLG polishing apparatus 6. First, the bar 5 is pressed against the polishing plate 61 with a predetermined pressing force, and the polishing plate 61 is rotated to start polishing the bar 5 (S100). Next, every time a predetermined time (for example, 5 to 10 seconds) elapses, the control unit 65 reads the detected value of the resistance of the dummy resistance film 7 by the measurement circuit 64 (S102, S104). Further, the control unit 65 calculates the inclination of the bar 5 from each resistance detection value of the five dummy resistance films 7 (S106), and drives the actuators 63a, 63b, and 63c to correct the inclination (S108).
[0052]
The control unit 65 converts the resistance detection value into the MR height, compares it with a predetermined threshold Rth (target MR height) (S110), and if the value is equal to or greater than the threshold Rth (step S110; Y) ), The polishing by the RLG polishing apparatus 6 is terminated (S112). On the other hand, if the MR height converted value of the resistance detection value is less than the threshold value Rth (step S110; N), the process returns to step S102 again and the polishing process is continued. Incidentally, a method of performing polishing control by converting the resistance detection value into MR height is proposed in Japanese Patent Application No. 9-311076.
[0053]
After the first polishing step (step S14 in FIG. 8) by the RLG polishing method is completed, the wire W connecting the flexible substrate (not shown) and the dummy resistance film 7 of the bar 5 is removed. After removing the wire, the bar 5 is removed from the first holder 60 (S16).
[0054]
Subsequently, in order to proceed to the second polishing step, the connection work between the flexible substrate 95 connected to the measurement circuit 89 of the touch lap polishing apparatus 8 and the dummy resistance film 7 of the bar 5 is performed, and the bar 5 is connected to the second holder 80. (S18). Here, in a state where the bar 5 is fixed to the elastic member 80a of the second holder 80, connection work using the wire bonding method is difficult (because the ultrasonic wave is attenuated by the elastic member 80a). Therefore, here, the bar 5 is temporarily held by a suction jig 90 different from the second holder 80, the dummy resistance film 7 of the bar 5 and the flexible substrate 95 are connected using the wire bonding method, and then the bar 5 Is transferred to the second holder 80.
[0055]
FIG. 11 is a perspective view for each process for explaining the connection work of the dummy resistance film 7 of the bar 5. The suction jig 90 is a block formed of a rigid body that does not include an elastic member, and has a suction surface 91 that holds one bar 5. Suction holes 93 (FIG. 11C) are formed in a row on the suction surface 91, and each suction hole 93 is connected to a common pipe 92. The pipe 92 is provided with a valve 92a, and the adsorption and desorption of one bar 5 can be performed by opening and closing the valve 92a.
[0056]
First, as shown in FIG. 11A, the surface to be polished (the surface that becomes the air bearing surface) of the bar 5 is brought into contact with the suction surface of the suction jig 90 to open the valve 92a. Adsorption is held by an adsorption jig 90. Next, the dummy resistance film 7 of the bar 5 and a predetermined pattern portion 96 on the flexible substrate 95 attached to the second holding member 80 are connected by a wire bonding method. That is, for example, both end portions of the wire W made of Au (gold) are melted by ultrasonic waves and fixed to the dummy resistance film 7 and the pattern portion 96, respectively. Since the bar 5 is held by the suction jig 90 made of a rigid body, the ultrasonic wave is not attenuated. In FIG. 11, one wire W is connected to each dummy resistance film 7, but two wires W are connected to both ends (in the longitudinal direction of the bar) of each dummy resistance film 7. You may do it.
[0057]
Next, as shown in FIG. 11B, the second holding member 80 is pressed against the bar 5 held by the suction jig 90. Since the elastic member 80a of the second holding member 80 has adhesiveness, the bar 5 is adhesively held by the elastic member 80a. Subsequently, as shown in FIG. 11C, the valve 92a of the suction jig 90 is closed to release the suction, and the second holding member 80 is separated from the suction jig 90 to suck the bar 5. The jig 90 is transferred to the second holding member 80. In this way, the resistance of the dummy resistance film 7 can be detected by the measurement circuit 89.
[0058]
Subsequently, a second polishing step by a touch lap polishing method is performed (step S20 in FIG. 8). FIG. 12 is a flowchart showing the second polishing step. First, the bar 5 held by the second holder 80 is pressed against the polishing plate 81 with a predetermined pressing force, and the driving of the polishing plate rotating mechanism 82 is started, thereby starting the polishing operation of the bar 5 (S200). At the same time, the control unit 88 also starts driving the slide mechanism 85, the swing mechanism 86, and the rotation mechanism 87.
[0059]
Next, the control unit 88 reads the resistance value of the dummy resistance film 7 detected by the measurement circuit 89 every predetermined time (for example, 5 to 10 seconds) (S202, S204). Subsequently, for example, the inclination of the bar 5 is calculated from the resistance detection values of the five dummy resistance films 7 (S206), and the actuators 63a, 63b, and 63c are driven to correct the inclination (S208).
[0060]
Subsequently, the control unit 88 converts the resistance detection value into the MR height and compares it with a predetermined threshold value Rth (target MR height) (S210). S210; Y), polishing is finished (S212). On the other hand, if the MR height converted value of the resistance detection value is less than the threshold value Rth (step S210; N), the process returns to step S202 again and the polishing process is continued.
[0061]
After the second polishing step (step S20 in FIG. 8) is completed, the wire W connecting the dummy resistance film 7 and the flexible substrate 95 is removed. After removing the wire W, the bar 5 is removed from the second holder 80 (S22).
[0062]
Subsequently, as shown in FIG. 13A, the slider rail of the bar 5 is processed using, for example, a photolithography method (S24). That is, the groove 2g is formed in the central portion of the magnetic head slider 2 included in the bar 5. By the formation of the groove 2g, the above-described dummy resistance film 7 (FIG. 12) that is disposed at the substantially central portion of the magnetic head slider 2 is removed. In each magnetic head slider 2, portions on both sides sandwiching the groove 2g serve as a slider rail 2a, and the surface of the slider rail 2a serves as an air bearing surface 2e. After forming the slider rail, as shown in FIG. 13B, the bar 5 is cut using, for example, a dicing saw, and the magnetic head slider 2 is separated (S26). In this way, the magnetic head slider 2 is obtained.
[0063]
In the present embodiment, the air bearing surface 2e is moved by swinging the second holder 80 about an axis A (FIG. 7) that is substantially parallel to the polishing surface 81a and substantially parallel to the extending direction of the bar 5. Although a convex curved surface is used, the following method is also possible. That is, if a minute scratch is formed on a surface other than the air bearing surface 2e of the magnetic head slider 2, the magnetic head slider 2 is curved due to the residual stress generated in the magnetic head slider 2, so that the air bearing surface 2e is formed as a result. It can be a convex curved surface. Since this method is disclosed in Japanese Patent No. 2859468, detailed description thereof is omitted.
[0064]
Here, the polishing plate 61 of the RLG polishing apparatus 6 corresponds to a specific example of “first polishing plate” in the present invention. Further, the polishing plate 81 of the touch wrap device 8 corresponds to a specific example of “second polishing plate” in the present invention. Furthermore, the second holder 80 corresponds to a specific example of “holding means” in the present invention, and the elastic member 80a of the second holder 80 corresponds to a specific example of “elastic member” in the present invention. The measurement circuit 89 corresponds to a specific example of “detecting means” in the present invention, and the pattern portion 96 of the flexible substrate 95 corresponds to a specific example of “lead member” in the present invention. Further, the suction jig 90 corresponds to a specific example of “support” in the present invention, and the suction hole 93, the pipe 92, and the valve 92a correspond to a specific example of “suction means” in the present invention.
[0065]
[Example of touch wrap device]
Finally, a specific example of the configuration of the touch wrap device 8 will be described.
[0066]
FIG. 14 is a diagram illustrating the outer shape of the touch wrap device 8. The touch wrap device 8 includes a rectangular parallelepiped base 800 and a side frame 801 erected on the upper surface of the base 800, and the above-described polishing plate 81 is rotatably provided on the upper surface of the base 800. ing. A slide body 850 that can move along the polishing surface 81 a of the polishing plate 81 is supported on the side frame 801.
[0067]
The slide body 850 is slidably held by a pair of parallel rails 851 formed on the side frame 801. A feed screw 852 is provided between the rails 851, and this feed screw 852 is engaged with a female screw (not shown) formed on the slide body 850. The slide body 850 moves horizontally along the rail 851 by rotationally driving the feed screw 852 by a slide motor (not shown) attached to the side frame 802. These mechanisms for horizontally moving the slide body 850 correspond to the slide mechanism 85 in FIG.
[0068]
The slide body 850 includes a slide base 855 supported by a rail 851 and a lift body 840 held on the slide base 855 so as to be lifted and lowered. A guide groove 856 extending vertically is formed in the slide base 855, and a guided portion (not shown) formed in the elevating body 840 is slidably engaged with the guide groove 841. As shown in FIG. 14, the slide base 855 is provided with a feed screw 842 extending in parallel with the guide groove 841, and this feed screw 842 is engaged with a female screw (not shown) formed on the elevating body 840. Match. When the feed screw 842 is rotated by an elevating motor (not shown) mounted on the slide base 855, the elevating body 840 moves up and down along the guide groove 841. These mechanisms for moving the lifting body 840 up and down correspond to the lifting mechanism 84 in FIG.
[0069]
FIG. 15 is a perspective view showing the lifting body 840. The elevating body 840 includes an elevating base 841 and a rotating body 870 that is rotatably held by the elevating base 845 via a radial bearing 842 in a horizontal plane (that is, in a plane parallel to the polishing plate 81). . The rotating body 870 has a support ring 871 fixed to the inner ring 843 of the radial bearing 842. This support ring 871 is arranged in a horizontal plane by a rotation motor and a gear train (not shown) mounted on the elevating body 840. As shown by the arrow R1 in the figure (that is, around the axis B extending in the vertical direction), the rotation is driven by a predetermined angular range. These mechanisms for rotating the rotating body 870 correspond to the rotating mechanism 87 in FIG.
[0070]
On the upper surface of the support ring 871, a vertical frame 872 for vertically holding a swinging body 860 described later is erected vertically. The vertical frame 872 has a pair of parallel side walls 873 extending vertically upward from above the support ring 871 and a rear wall 874 connecting the pair of side walls 873, and is formed in a U shape in a top view. A pair of support pins 875 extending in the horizontal direction are provided at locations of the pair of side walls 873 facing each other, and a swinging body 860 is swingably supported by the support pins 875.
[0071]
The rocking body 860 is a rectangular plate-like member, and actuators 830a, 830b, and 830c described later are attached to one surface thereof. A pair of engagement pieces 861 that engage with the pair of support pins 875 are attached to one end extension of the rocking body 60. The oscillating body 860 oscillates around a support pin 875, that is, around an axis A extending in the horizontal direction within a predetermined angle range by an oscillating motor 862 attached to the vertical frame 872 and a feed screw mechanism (not shown). These mechanisms for rotating the rocking body 860 correspond to the rocking mechanism 86 in FIG.
[0072]
The actuators 830a, 830b, and 830c are configured to linearly drive the plungers 831a, 831b, and 831c using, for example, a piezoelectric element as a drive source. The actuators 830a, 830b, and 830c are juxtaposed in the horizontal direction, and are arranged so that the movement directions of the plungers 831a, 831b, and 831c are in the vertical direction. Moving blocks 832a, 832b, and 832c are attached to the lower ends of the plungers 831a, 831b, and 831c. The moving blocks 832a, 832b, and 832c are provided so as to be movable along the surface of the rocking body 860, for example, via a linear guide. Further, in the moving blocks 832a, 832b, and 832c, one end portion, a center portion, and a multi-end portion in the longitudinal direction of the above-mentioned second holder 80 of the above-mentioned second holder 80 are respectively connected via the link levers 833a, 833b, and 833c. Are connected.
[0073]
The actuators 830a, 830b, and 830c are independently driven by the controller 88 (FIG. 6). The actuators 830a, 830b, and 830c can incline the second holder 80 as indicated by a broken line E in the drawing, for example, by making the protrusion amounts of the plungers different from each other. These mechanisms for driving the second holder 80 in a tiltable manner correspond to the actuators 83a, 83b, and 83c in FIG.
[0074]
The operation of the touch wrap device described above will be described with reference to FIG. The attaching operation of the bar 5 to the second holder 80 is performed in a state where the slide body 850 is moved to a position away from the polishing plate 81 (for example, the left side of the base 800) and the elevating body 840 is lowered, for example. The work of bonding the bar 5 to the second holder 80 and connecting the flexible substrate 95 (FIG. 12) and the dummy resistance film 7 is performed by, for example, an operator using a dedicated tool. After attaching the bar 5 to the second holder 80, the elevating body 840 is raised, and then the slide body 850 is slid to move the second holder 80 to the upper part of the polishing plate 81. Next, the elevating body 840 is lowered until the bar 5 held by the second holder 80 contacts the polishing surface 81 a of the polishing plate 81.
[0075]
Subsequently, the actuators 830a, 830b, and 830c are driven to press the bar 5 against the polishing plate 81, and the rotation of the polishing plate 81 is started. The control unit of the touch wrap device detects the resistance of the dummy resistance film 7 of the bar 5 and drives and controls the actuators 830a, 830b, and 830c based on the resistance detection value, thereby causing the bar 5 to extend in the longitudinal direction. The polishing plate 81 is pressed with a uniform pressing force.
[0076]
On the other hand, almost simultaneously with the start of the rotation of the polishing plate 81, the slide body 850 is reciprocated within a predetermined range of movement, the rotary body 870 (FIG. 15) is reciprocated within a predetermined angle range, and the rocking body 860 is predetermined. Start reciprocating rocking within the angular range. The bar 5 reciprocates between the outer peripheral portion and the inner peripheral portion of the polishing surface 81 a of the polishing plate 81 by the reciprocating motion of the slide body 850. Further, the rotation of the rotating body 860 changes the angle formed by the rotation direction of the polishing plate 81 and the extending direction of the bar 5, thereby preventing the bar 5 from being damaged in a certain direction called smear. Further, the surface of the bar 5 serving as the air bearing can be formed into a convex curved surface by the swinging of the swinging body 860.
[0077]
[Effects of the embodiment]
As described above, in this embodiment, feedback control based on the resistance value change of the dummy resistance film 7 is performed not only in the RLG polishing but also in the touch wrap polishing process. Unlike the case where the polishing control based on is performed, it is possible to always perform a constant polishing regardless of the wear state of the abrasive grains of the polishing plate 81. Accordingly, it is possible to form a slider rail having an accurate shape. Further, it is possible to prevent the MR height of the MR film 20 of the thin film magnetic head element 1 accurately formed by RLG polishing from being largely changed by the touch wrap polishing.
[0078]
In the present embodiment, the bar 5 and the flexible substrate 95 are connected while the bar 5 is once held by the suction jig 90, and then the bar 5 is transferred from the suction jig 90 to the second holder 80. I have to. Therefore, it is possible to easily perform a method (for example, a wire bonding method) that is difficult to implement when the bar 5 is fixed to the elastic member 80a.
[0079]
In addition, in the present embodiment, the bar 5 held by the second holder 80 is swung by a predetermined angle around an axis A (FIG. 7) that is substantially parallel to the polishing surface 81a and parallel to the longitudinal direction of the bar. Therefore, it becomes easy to curve the air bearing surface of the magnetic head slider in a convex shape. Further, since the bar 5 held by the second holder 80 is swung around the axis B (FIG. 7) substantially orthogonal to the polishing surface 81a, the rotation direction of the polishing plate 81 and the extension of the bar 5 are increased. By changing the angle formed with the direction, it is possible to prevent the bar 5 from being damaged (so-called smear) extending in a certain direction.
[0080]
While the present invention has been described with reference to the embodiment, the present invention is not limited to this embodiment, and various modifications can be made. For example, in the above embodiment, in the second polishing step, touch lap polishing is performed in which the bar is polished while being held using an elastic member. Instead of touch wrap polishing, the magnetic head slider alone is elastic. You may perform the kiss wrap grinding | polishing which grind | polishes while hold | maintaining using a member.
[0081]
The thin-film magnetic head element 1 is not limited to those using an AMR film or a GMR film, and may use another MR film (for example, a TMR (Tunnel-type Magneto-Resistive) film). . The thin film magnetic head element may be a read-only head or a recording-only head.
[0082]
【The invention's effect】
  As described above, claims 1 to13According to the magnetic head slider processing method described in any one of the above, in the polishing step of pressing the bar against the polishing plate using an elastic member, the magnetic head slider changes according to the polishing amount of the bar or the single magnetic head slider.Resistance film resistanceOn the basis of thefeedbackSince the polishing control is performed, for example, an accurate amount of polishing is always performed regardless of the degree of abrasion of the abrasive grains of the polishing plate. Therefore, the shape of the air bearing surface of the magnetic head slider can be accurately formed, and variations in the dimensions of the thin film magnetic head elements formed on the end surface of the magnetic head slider can be reduced.The resistance film and the lead member are connected while the bar or the single magnetic head slider is supported by a rigid support, and the bar or the single magnetic head slider is transferred from the support to a holding means including an elastic member. Since it changed, the method (for example, wire bonding method) difficult to implement in the state where the bar was supported by the elastic member can be easily performed.
[0084]
  In addition, the claims3Or claims7A method of processing a magnetic head slider according to claim 1 or claim10Or claims13According to the magnetic head slider processing method described in any one of the above, since the supporting means is provided with the suction means, and the suction means supports the bar or the single magnetic head slider, the bar (or the single magnetic head slider) is provided. The head slider can be reliably supported, and the bar can be easily transferred to the holding means.
[0085]
  Claims5Or claims7A method of processing a magnetic head slider according to claim 1 or claim12Or claims13According to the method of processing a magnetic head slider described in (4), the bar or the single magnetic head slider is swung around an axis substantially parallel to the polishing surface. There is an effect that it becomes easy to make a curved surface (for example, a crown).
[0086]
  Claims6Or claims7A method of processing a magnetic head slider according to claim 1 or claim13According to the magnetic head slider processing method described in (4), the bar or the single magnetic head slider is swung around the axis orthogonal to the polishing surface. By changing the angle formed with the direction, it is possible to prevent the bar from being damaged (so-called smear) extending in a certain direction.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration of a magnetic head slider to which a magnetic head slider processing method according to an embodiment of the present invention is applied.
2 is an exploded perspective view showing a configuration of a thin film magnetic head element mounted on the magnetic head slider shown in FIG. 1. FIG.
3 is a cross-sectional view taken along the line III-III of the thin film magnetic head element mounted on the magnetic head slider shown in FIG.
FIG. 4 is a diagram showing a schematic configuration of an RLG polishing apparatus used in a magnetic head slider processing method according to an embodiment of the present invention.
5 is an enlarged view showing a main part of the RLG polishing apparatus shown in FIG. 4;
FIG. 6 is a diagram showing a schematic configuration of a touch wrap polishing apparatus used in the magnetic head slider processing method according to the embodiment of the present invention.
7 is a perspective view for explaining a moving direction of a second holder in the touch wrap polishing apparatus shown in FIG. 6. FIG.
FIG. 8 is a flowchart showing a magnetic head slider manufacturing method including a magnetic head slider processing method according to an embodiment of the present invention.
9 is a cross-sectional view for each step for explaining the method of manufacturing the magnetic head slider shown in FIG. 9. FIG.
10 is a flowchart showing a first polishing step in the method of manufacturing the magnetic head slider shown in FIG.
11 is a process diagram illustrating a method of attaching a bar to a second holder in the method of manufacturing the magnetic head slider shown in FIG.
12 is a flowchart showing a second polishing step in the method of manufacturing the magnetic head slider shown in FIG.
13 is a perspective view for each step for explaining a slider rail forming step and a cutting step in the method of manufacturing the magnetic head slider shown in FIG. 9; FIG.
14 is a perspective view illustrating a configuration example of the touch wrap polishing apparatus illustrated in FIG. 6. FIG.
15 is a perspective view showing a main part of the touch wrap polishing apparatus shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Thin film magnetic head element, 1a ... Read head part, 1b ... Recording head part, 2 ... Slider, 2a ... Slide rail, 2e ... Air bearing surface, 3 ... Actuator arm, 4 ... Wafer, 5 ... Bar, 6 ... RLG Polishing device, 60 ... first holder, 61 ... polishing plate, 62 ... polishing plate driving mechanism, 63a, 63b, 63c ... actuator, 64 ... measurement circuit, 65 ... control unit, 7 ... dummy resistance film, 8 ... touch wrap device 80 ... second holder, 81 ... polishing plate, 82 ... polishing plate driving mechanism, 83a, 83b, 83c ... actuator, 84 ... lifting mechanism, 85 ... sliding mechanism, 86 ... oscillating mechanism, 87 ... rotating mechanism, 88 ... Control unit 89 ... Measurement circuit 90 ... Suction jig 95 ... Flexible substrate.

Claims (13)

The bar is elongated member comprising at least one magnetic head slider head element and the resistive film is formed on each, and pressed against the first polishing plate without using the elastic member, the bars A first polishing step for polishing a predetermined surface;
A lead member for detecting a resistance value of the resistance film while supporting the bar after the first polishing step or a single magnetic head slider cut out from the bar by a support made of a rigid body, and the resistance film Electrically connecting
Transferring the bar or single magnetic head slider to which the lead member is connected from the support to a holding means including an elastic member;
The magnetic head slider of the bar or front Kitan body, the elastic member presses against the second polishing plate using a second polishing step of further polishing the polished surface by the first polishing step viewing including the door,
At least in the second polishing step, feedback polishing control is performed on the basis of the resistance value of the resistance film that changes in accordance with the polishing amount of the bar or the single magnetic head slider. The processing method of the slider. At least and in the second polishing step, the processing method of a magnetic head slider according to claim 1, characterized in that so as to terminate the polishing when the resistance value reaches the predetermined value. 3. The magnetic head slider machining method according to claim 1, wherein the resistance film and the lead member are connected by a wire bonding method. The suction means provided on the support, the magnetic head slider according to any one of claims 1 to 3, characterized in that so as to support the bar or the single magnetic head slider by the suction means Processing method. The second polishing step is characterized in that the bar or the single magnetic head slider is swung around an axis substantially parallel to the polishing surface of the second polishing plate. 1 to the processing method of a magnetic head slider according to any one of claims 4. The second polishing step is characterized in that the bar or the single magnetic head slider is swung around an axis substantially orthogonal to the polishing surface of the second polishing plate. 1 to the processing method of a magnetic head slider according to any one of claims 5. Wherein also in the first polishing step, any one of claims 1 to 6, characterized in that to perform the feedback polishing control based on the resistance value of the resistive film that varies according to the amount of polishing of the bar 2. A method of processing a magnetic head slider according to 1. The head element and the resistive film is Ba Ma other an elongated member comprising at least one magnetic head slider formed respectively supported by a support made of a single magnetic head slider cut out from the bars of a rigid body While electrically connecting a lead member for detecting the resistance of the resistive film and the resistive film;
Transferring the bar or single magnetic head slider to which the lead member is connected from the support to a holding means including an elastic member;
The magnetic head slider of the bar or front Kitan body, seen including a polishing step of pressing polished against the polishing plate with the elastic member,
In the polishing step, feedback polishing control is performed based on a resistance value of the resistance film that changes in accordance with the polishing amount of the bar or the single magnetic head slider. . 9. The magnetic head slider processing method according to claim 8 , wherein, in the polishing step, polishing is terminated when the resistance value reaches a predetermined value. 10. The method of processing a magnetic head slider according to claim 8, wherein the resistance film and the lead member are connected by a wire bonding method. The magnetic head slider according to any one of claims 8 to 10, wherein a suction means is provided on the support member, and the bar or the single magnetic head slider is supported by the suction means. Processing method. Wherein in the polishing process, of claims 8 to 11, characterized in that so as to swing about a substantially parallel axis said bar or the single magnetic head slider against the polishing surface of said polishing plate The magnetic head slider processing method according to any one of the above. Wherein in the polishing process, of claims 8 to 12, characterized in that so as to swing about an axis substantially perpendicular to the bar or the single magnetic head slider against the polishing surface of said polishing plate The magnetic head slider processing method according to any one of the above.

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