JP2002066432A - Coating apparatus - Google Patents
Coating apparatusInfo
- Publication number
- JP2002066432A JP2002066432A JP2000266615A JP2000266615A JP2002066432A JP 2002066432 A JP2002066432 A JP 2002066432A JP 2000266615 A JP2000266615 A JP 2000266615A JP 2000266615 A JP2000266615 A JP 2000266615A JP 2002066432 A JP2002066432 A JP 2002066432A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- coating apparatus
- filter
- coating
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はガラス基板や半導体
ウェーハ等の被処理基板の表面に塗膜を形成する塗布装
置に関する。The present invention relates to a coating apparatus for forming a coating film on a surface of a substrate to be processed such as a glass substrate or a semiconductor wafer.
【０００２】[0002]
【従来の技術】液晶（ＬＣＤ）、ＰＤＰ（プラズマディ
スプレイ）、半導体素子等の製造プロセスにおける塗布
装置として米国特許第4,938,994号公報に開示されるも
のが知られている。この塗布装置は、スリット状吐出口
を有するノズルに対し、矩形状ガラス基板を水平移動せ
しめることで、矩形状ガラス基板の所定範囲にパッチ状
の均一な厚みの塗膜を形成するというものである。2. Description of the Related Art A coating apparatus disclosed in U.S. Pat. No. 4,938,994 is known as a coating apparatus in a manufacturing process of a liquid crystal (LCD), a PDP (plasma display), a semiconductor element and the like. This coating apparatus forms a patch-shaped coating film having a uniform thickness in a predetermined range of a rectangular glass substrate by horizontally moving a rectangular glass substrate with respect to a nozzle having a slit-shaped discharge port. .
【０００３】また、上記の塗布装置に限らず、回転塗布
装置を含め、ノズルへの塗布液の供給は、ポンプで加圧
し配管を介してノズルまで圧送している。そして、配管
としては振動による影響を少なくしたり、取り廻しの容
易さから可撓性チューブを用いている。更に、可撓性チ
ューブのできるだけノズルに近い位置にフィルターを設
け、万一塗布液中に異物が混入していてもノズル内に入
らないようにしている。[0003] In addition to the above-described coating apparatus, the supply of the coating liquid to the nozzles, including the rotary coating apparatus, is performed by pressurizing with a pump and sending it to the nozzles through a pipe. As the piping, a flexible tube is used to reduce the influence of vibrations and to facilitate handling. Further, a filter is provided at a position as close as possible to the nozzle of the flexible tube so that even if a foreign substance is mixed in the coating liquid, it does not enter the nozzle.
【０００４】[0004]
【発明が解決しようとする課題】塗布装置を使用してゆ
くと、経時的にフィルタが汚れ、このためフィルタ部分
において抵抗が大きくなる。そして、その分、配管内の
圧力が高まり、図５に誇張して示すように、配管が膨張
し、この膨張した分だけノズルからの供給量が減少す
る。As the application apparatus is used, the filter becomes soiled with time, and the resistance at the filter portion increases. Then, the pressure in the pipe increases accordingly, and the pipe expands as shown in an exaggerated manner in FIG. 5, and the supply amount from the nozzle decreases by the amount of the expansion.
【０００５】特に上記の不具合は、スリットノズルを用
いた塗布の開始時に顕著に現れる。即ち、スリットノズ
ルを用いた最近の塗布方法にあっては、先ず、ノズル下
端を被処理基板の表面に数１０μｍまで接近せしめ、こ
の状態でノズルから塗布液を吐出し、ノズルと被処理基
板の表面との間を塗布液で連続せしめ、この状態でノズ
ルまたは被処理基板を水平移動させているが、塗布の開
始時にフィルタの部分の抵抗が大きくなって、所定の量
の塗布液がノズルから流下しないと、ノズルと被処理基
板の表面との間が塗布液で連続していないまま、ノズル
または被処理基板が水平移動を開始してしまい、その結
果塗膜は筋状に塗布されてしまう。[0005] In particular, the above-mentioned disadvantages appear remarkably at the start of coating using a slit nozzle. That is, in a recent coating method using a slit nozzle, first, the lower end of the nozzle is brought close to the surface of the substrate to be processed to several tens μm, and the coating liquid is discharged from the nozzle in this state, and the nozzle and the substrate to be processed are The coating liquid is continuously applied to the surface and the nozzle or the substrate to be processed is moved horizontally in this state.At the start of coating, the resistance of the filter part increases and a predetermined amount of coating liquid flows from the nozzle. If it does not flow down, the nozzle or the substrate to be processed starts to move horizontally while the coating liquid is not continuous between the nozzle and the surface of the substrate to be processed, and as a result, the coating film is applied in a streak shape .
【０００６】また、配管が膨張することによって配管内
に余分に蓄えられた塗布液は、相対移動の振動をきっか
けとして一気にノズルから吐出されやすく、その結果、
塗布開始位置から若干進んだ位置において、急激に膜厚
が厚くなる不利が生じやすい。[0006] In addition, the coating liquid that is excessively stored in the pipe due to the expansion of the pipe is easily discharged from the nozzle at a stroke triggered by the vibration of the relative movement.
At a position slightly advanced from the application start position, a disadvantage that the film thickness is rapidly increased tends to occur.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するた
め、本発明に係る塗布装置は、ポンプとノズルとの間を
配管を介して接続し、この配管の途中に設けたフィルタ
を通してポンプから塗布液をノズルまで圧送するように
した塗布装置において、前記配管の少なくともポンプと
フィルタとの間の部分を、内部圧力による変形が無視で
きる材料にて構成した。斯かる構成とすることで、フィ
ルタの汚れに起因して配管が膨張することがなく、所定
の量の塗布液がノズルに供給される。In order to solve the above-mentioned problems, a coating apparatus according to the present invention connects a pump and a nozzle via a pipe, and performs coating from the pump through a filter provided in the middle of the pipe. In a coating apparatus configured to pump the liquid to the nozzle, at least a portion of the pipe between the pump and the filter is made of a material that can be distorted by internal pressure. By adopting such a configuration, a predetermined amount of the coating liquid is supplied to the nozzle without expanding the pipe due to contamination of the filter.
【０００８】前記変形が無視できる材料としては、ステ
ンレスなどの金属若しくはポリフェニレンサルファイド
（ＰＰＳ）などの樹脂が適当である。As a material whose deformation can be ignored, a metal such as stainless steel or a resin such as polyphenylene sulfide (PPS) is suitable.
【０００９】また、本発明はスリット状の吐出口を有す
るスリットノズルを備えた塗布装置に特に有効であり、
このスリットノズルを用いた場合の無視できる配管の内
部容積変化量Ｖ（cm3）としては、ノズルと被処理基板
との間隔をＧ（cm）、スリット状吐出口の幅をＷ（c
m）、スリット状吐出口の長さをＬ（cm）とした場合、
Ｖ≦Ｇ・Ｗ・Ｌである。The present invention is particularly effective for a coating apparatus provided with a slit nozzle having a slit-shaped discharge port.
The negligible internal volume change amount V (cm 3 ) of the pipe when this slit nozzle is used is as follows: the distance between the nozzle and the substrate to be processed is G (cm), and the width of the slit-shaped discharge port is W (c).
m), when the length of the slit-shaped discharge port is L (cm),
V ≦ G · W · L.
【００１０】なお、本発明にあってはフィルタよりも上
流側または下流側の配管にバルブを設けてもよい。[0010] In the present invention, a valve may be provided in a pipe upstream or downstream of the filter.
【００１１】[0011]
【発明の実施の形態】以下に本発明の実施の形態を説明
する。図１は本発明に係る塗布装置の正面図、図２は本
発明に係る塗布装置の側面図、図３は同塗布装置の要部
を示す図である。Embodiments of the present invention will be described below. FIG. 1 is a front view of a coating apparatus according to the present invention, FIG. 2 is a side view of the coating apparatus according to the present invention, and FIG. 3 is a view showing a main part of the coating apparatus.
【００１２】塗布装置はベース１の上面に高さ調整機構
を備えた脚２を介してテーブル３を設けている。このテ
ーブル３上面に載置したガラス基板などの被処理基板Ｓ
の水平度を正確に出すために、脚２に設けたナットを廻
してテーブル３の各部の高さの微調整を行う。The coating apparatus has a table 3 provided on a top surface of a base 1 via a leg 2 provided with a height adjusting mechanism. Substrate S such as a glass substrate placed on the upper surface of table 3
The height of each part of the table 3 is finely adjusted by turning a nut provided on the leg 2 in order to accurately obtain the horizontality of the table 3.
【００１３】またベース１の上面には上下方向のシリン
ダユニット４を設け、このシリンダユニット４のロッド
に水平プレート５を取り付け、この水平プレート５に被
処理基板Ｗをテーブル３から持ち上げるためのピン６を
取り付けている。尚、テーブル３にはピン６が貫通する
穴７を形成している。A vertical cylinder unit 4 is provided on the upper surface of the base 1, and a horizontal plate 5 is attached to a rod of the cylinder unit 4. Pins 6 for lifting the substrate W to be processed from the table 3 are mounted on the horizontal plate 5. Is installed. The table 3 has a hole 7 through which the pin 6 passes.
【００１４】一方、ベース１の上面には左右方向に延び
るレール８，８を平行に２本設け、このレール８に沿っ
て移動部材９を移動可能に配置している。即ち移動部材
９の下面にはレール８を跨ぐ浮上手段としてのエアベア
リング１０を固着し、各レール８の外側には移動手段と
してのリニアモータ１１を配置している。On the other hand, two rails 8, 8 extending in the left-right direction are provided in parallel on the upper surface of the base 1, and a moving member 9 is movably arranged along the rails 8. That is, an air bearing 10 as a floating means that straddles the rail 8 is fixed to the lower surface of the moving member 9, and a linear motor 11 as a moving means is disposed outside each rail 8.
【００１５】一方、各移動部材９には左右の支柱１２、
１２を立設し、この支柱１２、１２間に門型をなす昇降
フレーム１３を係合し、支柱１２の内側に取り付けたサ
ーボモータ１４を駆動することで昇降フレーム１３が昇
降する構造になっている。On the other hand, each moving member 9 has left and right columns 12,
The vertical frame 12 is erected, and a gate-shaped vertical frame 13 is engaged between the columns 12, 12, and the servomotor 14 mounted inside the column 12 is driven to raise and lower the vertical frame 13. I have.
【００１６】昇降フレーム１３の下面には塗布ノズル２
０が取り付けられている。この塗布ノズル２０にはテー
ブル３上に載置された被処理基板Ｓの表面に向かって開
口するスリット状の吐出口２１が幅方向に形成されてい
る。A coating nozzle 2 is provided on the lower surface of the lifting frame 13.
0 is attached. The application nozzle 20 is formed with a slit-shaped discharge port 21 that opens toward the surface of the processing target substrate S placed on the table 3 in the width direction.
【００１７】また、昇降フレーム１３の一端側上面には
送液ポンプ２２が取り付けられている。送液ポンプ２２
には配管２３を介して塗布液タンクから塗布液が供給さ
れ、また、配管２４を介して塗布ノズル２０に塗布液が
供給される。A liquid pump 22 is mounted on the upper surface of one end of the lifting frame 13. Liquid pump 22
The application liquid is supplied from a coating liquid tank via a pipe 23, and the application liquid is supplied to the application nozzle 20 via a pipe 24.
【００１８】前記配管２４は継ぎ手２５によってポンプ
２２に接続され、また途中にはフィルタ２６が設けられ
ている。そして配管２４はフィルタ２６が汚れて配管の
内部圧が高くなっても変形が無視できる材料、例えば、
ステンレスなどの金属若しくはポリフェニレンサルファ
イド（ＰＰＳ）などの樹脂にて構成されている。The pipe 24 is connected to the pump 22 by a joint 25, and a filter 26 is provided on the way. The pipe 24 is made of a material whose deformation can be ignored even when the filter 26 becomes dirty and the internal pressure of the pipe increases, for example,
It is made of metal such as stainless steel or resin such as polyphenylene sulfide (PPS).
【００１９】なお、図示例では配管２４全体を変形が無
視できる材料にて構成したが、フィルタ２６よりも上流
部分のみをステンレスやＰＰＳで構成してもよい。In the illustrated example, the entire pipe 24 is made of a material whose deformation is negligible, but only the upstream portion of the filter 26 may be made of stainless steel or PPS.
【００２０】ここで、配管２４の許容できる内部容積変
化量Ｖ（cm3）としては、図３に示すように、ノズルと
被処理基板との間隔をＧ（cm）、スリット状吐出口の幅
をＷ（cm）、スリット状吐出口の長さをＬ（cm）とした
場合、Ｖ≦Ｇ・Ｗ・Ｌである。即ち、Ｖ＞Ｇ・Ｗ・Ｌで
あると塗布開始時にノズルと被処理基板Ｓとの間に連続
した塗布液の幕を形成することができなくなるので、上
記範囲とするのが好ましい。As shown in FIG. 3, the allowable internal volume change V (cm 3 ) of the pipe 24 is, as shown in FIG. 3, the distance between the nozzle and the substrate to be processed, G (cm), the width of the slit-shaped discharge port. Is W (cm), and the length of the slit-shaped discharge port is L (cm), V ≦ G · W · L. In other words, if V> GWWL, it is not possible to form a continuous curtain of the coating liquid between the nozzle and the substrate S at the start of coating, so that the above range is preferable.
【００２１】また、図４は別実施例を示す図３と同様の
図であり、この図に示すように、フィルタ２６よりも上
流位置の配管２４の途中にバルブ２７を設けるようにし
てもよい。また、バルブ２７はフィルタ２６よりも下流
位置に設けてもよい。FIG. 4 is a view similar to FIG. 3 showing another embodiment. As shown in FIG. 4, a valve 27 may be provided in the pipe 24 at a position upstream of the filter 26. . Further, the valve 27 may be provided at a position downstream of the filter 26.
【００２２】[0022]
【発明の効果】以上に説明したように本発明によれば、
スリットノズルなどのノズルとポンプとの間をつなぐ配
管の材料を、ステンレスやＰＰＳなどの膨張しにくいも
のにしたので、経時的にフィルタが汚れも、それを原因
として配管が膨張（変形）することがなく、一定量の塗
布液がノズルに供給される。その結果、塗布開始時にノ
ズルから被処理基板表面に供給される塗布液が設定値よ
り少なくなったり、逆に大幅に多くなることがないの
で、従来問題となっていた塗布開始時の塗膜の厚さの不
均一を改善することができる。According to the present invention as described above,
Since the material of the pipe connecting the nozzle such as the slit nozzle and the pump is made of stainless steel or PPS, etc., it is difficult for the filter to expand, so the filter may become dirty over time, causing the pipe to expand (deform) And a constant amount of the coating liquid is supplied to the nozzle. As a result, the coating liquid supplied from the nozzle to the surface of the substrate to be processed at the start of coating does not become smaller than the set value, or conversely, does not increase significantly. The thickness unevenness can be improved.
【図１】本発明に係る塗布装置の正面図FIG. 1 is a front view of a coating apparatus according to the present invention.
【図２】同塗布装置の側面図FIG. 2 is a side view of the coating apparatus.
【図３】同塗布装置の要部を示す図FIG. 3 is a diagram showing a main part of the coating apparatus.
【図４】別実施例を示す図FIG. 4 is a diagram showing another embodiment.
【図５】従来の問題点を説明した図FIG. 5 is a diagram illustrating a conventional problem.
1…ベース、２…脚、３…テーブル、４…シリンダユニ
ット、５…水平プレート、６…ピン、７…穴、８…レー
ル、９…移動部材、１０…エアベアリング、１１…リニ
アモータ、１２…支柱、１３…昇降フレーム、１４…サ
ーボモータ、２０…塗布ノズル、２１…スリット状吐出
口、２２…送液ポンプ、２３、２４…配管、２５…継ぎ
手、２６…フィルタ、２７…バルブ、Ｓ…被処理基板。DESCRIPTION OF SYMBOLS 1 ... Base, 2 ... Leg, 3 ... Table, 4 ... Cylinder unit, 5 ... Horizontal plate, 6 ... Pin, 7 ... Hole, 8 ... Rail, 9 ... Moving member, 10 ... Air bearing, 11 ... Linear motor, 12 ... Posts, 13 ... Elevating frame, 14 ... Servo motor, 20 ... Application nozzle, 21 ... Slit-shaped discharge port, 22 ... Liquid feed pump, 23, 24 ... Piping, 25 ... Joint, 26 ... Filter, 27 ... Valve, S ... substrate to be processed.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2H025 AB13 AB16 EA04 4F041 AA02 AA06 AB02 BA02 BA34 CA02 CA16 4F042 AA02 AA07 AA10 CB02 CB19 CB25 5F046 JA02 JA03 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H025 AB13 AB16 EA04 4F041 AA02 AA06 AB02 BA02 BA34 CA02 CA16 4F042 AA02 AA07 AA10 CB02 CB19 CB25 5F046 JA02 JA03
Claims (5)
続し、この配管の途中に設けたフィルタを通してポンプ
から塗布液をノズルまで圧送するようにした塗布装置に
おいて、前記配管の少なくともポンプとフィルタとの間
の部分は、内部圧力による変形が無視できる材料にて構
成されていることを特徴とする塗布装置。1. A coating apparatus in which a pump and a nozzle are connected via a pipe and a coating liquid is pumped from the pump to the nozzle through a filter provided in the middle of the pipe. The coating device, wherein a portion between the filter and the filter is made of a material that can be distorted by internal pressure.
記変形が無視できる材料とは、ステンレスなどの金属若
しくはポリフェニレンサルファイド（ＰＰＳ）などの樹
脂であることを特徴とする塗布装置。2. The coating apparatus according to claim 1, wherein the material whose deformation is negligible is a metal such as stainless steel or a resin such as polyphenylene sulfide (PPS).
装置において、前記ノズルはスリット状の吐出口を有す
るスリットノズルであることを特徴とする塗布装置。3. The coating apparatus according to claim 1, wherein the nozzle is a slit nozzle having a slit-shaped discharge port.
記無視できる配管の内部容積変化量Ｖ（cm3）は、ノズ
ルと被処理基板との間隔をＧ（cm）、スリット状吐出口
の幅をＷ（cm）、スリット状吐出口の長さをＬ（cm）と
した場合、Ｖ≦Ｇ・Ｗ・Ｌであることを特徴とする塗布
装置。4. The coating apparatus according to claim 3, wherein the negligible internal volume change amount V (cm 3 ) of the pipe is defined as G (cm), the distance between the nozzle and the substrate to be processed. A coating apparatus characterized in that V ≦ GWL when the width is W (cm) and the length of the slit-shaped discharge port is L (cm).
において、前記配管のフィルタよりも上流側または下流
側にバルブが設けられていることを特徴とする塗布装
置。5. The coating apparatus according to claim 1, wherein a valve is provided upstream or downstream of the filter of the pipe.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000266615A JP4004216B2 (en) | 2000-09-04 | 2000-09-04 | Coating device |
| TW090121666A TW577774B (en) | 2000-09-04 | 2001-08-31 | Coating device |
| KR1020010054067A KR100786227B1 (en) | 2000-09-04 | 2001-09-04 | A coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000266615A JP4004216B2 (en) | 2000-09-04 | 2000-09-04 | Coating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002066432A true JP2002066432A (en) | 2002-03-05 |
| JP4004216B2 JP4004216B2 (en) | 2007-11-07 |
Family
ID=18753668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000266615A Expired - Fee Related JP4004216B2 (en) | 2000-09-04 | 2000-09-04 | Coating device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4004216B2 (en) |
| KR (1) | KR100786227B1 (en) |
| TW (1) | TW577774B (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004139814A (en) * | 2002-10-17 | 2004-05-13 | Toppan Printing Co Ltd | Coating device and manufacturing method of organic el element using the same |
| WO2006057345A1 (en) * | 2004-11-25 | 2006-06-01 | Az Electronic Materials (Japan) K.K. | Photoresist coating liquid supplying apparatus, and photoresist coating liquid supplying method and photoresist coating apparatus using such photoresist coating liquid supplying apparatus |
| JP2007054696A (en) * | 2005-08-23 | 2007-03-08 | Tokyo Ohka Kogyo Co Ltd | Coater |
| JP2007083237A (en) * | 2006-12-01 | 2007-04-05 | Tokyo Ohka Kogyo Co Ltd | Coating apparatus |
| US7416758B2 (en) | 2004-12-31 | 2008-08-26 | Lg Display Co., Ltd. | Slit coater |
| US7449069B2 (en) | 2004-12-28 | 2008-11-11 | Lg Display Co., Ltd. | Slit coater having apparatus for supplying a coating solution |
| JP2009195907A (en) * | 2009-04-23 | 2009-09-03 | Dainippon Printing Co Ltd | Applicator |
| US7647884B2 (en) | 2004-12-31 | 2010-01-19 | Lg. Display Co., Ltd. | Slit coater with a standby unit for a nozzle and a coating method using the same |
| US7914843B2 (en) | 2004-12-31 | 2011-03-29 | Lg Display Co., Ltd. | Slit coater having pre-applying unit and coating method using the same |
| CN104841607A (en) * | 2014-02-14 | 2015-08-19 | 斯克林集团公司 | Coating apparatus |
| CN107835555A (en) * | 2017-11-21 | 2018-03-23 | 深圳市诚峰智造有限公司 | A kind of plasma surface processing device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6942497B2 (en) * | 2016-09-08 | 2021-09-29 | 東京エレクトロン株式会社 | Processing liquid supply device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5156336A (en) * | 1989-12-27 | 1992-10-20 | Xerox Corporation | Multiple fluid injection nozzle array for rotary atomizer |
| JPH08173875A (en) * | 1994-12-22 | 1996-07-09 | Dainippon Screen Mfg Co Ltd | Coater and coating method |
| KR0165480B1 (en) * | 1995-11-21 | 1999-02-01 | 김광호 | Coating apparatus of photo resist |
| US5941456A (en) * | 1997-06-17 | 1999-08-24 | Nordson Corporation | Nozzle cleaning system including coating spray gun cover for can coating system |
| JPH11300262A (en) * | 1998-04-24 | 1999-11-02 | Toppan Printing Co Ltd | Discharging apparatus for photosensitive colored resin composition and preparation of color filter for display apparatus using the same |
-
2000
- 2000-09-04 JP JP2000266615A patent/JP4004216B2/en not_active Expired - Fee Related
-
2001
- 2001-08-31 TW TW090121666A patent/TW577774B/en not_active IP Right Cessation
- 2001-09-04 KR KR1020010054067A patent/KR100786227B1/en active IP Right Grant
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004139814A (en) * | 2002-10-17 | 2004-05-13 | Toppan Printing Co Ltd | Coating device and manufacturing method of organic el element using the same |
| WO2006057345A1 (en) * | 2004-11-25 | 2006-06-01 | Az Electronic Materials (Japan) K.K. | Photoresist coating liquid supplying apparatus, and photoresist coating liquid supplying method and photoresist coating apparatus using such photoresist coating liquid supplying apparatus |
| US7867559B2 (en) | 2004-11-25 | 2011-01-11 | Az Electronic Materials Usa Corp. | Photoresist coating liquid supplying apparatus, and photoresist coating liquid supplying method and photoresist coating apparatus using such photoresist coating liquid supplying apparatus |
| US7449069B2 (en) | 2004-12-28 | 2008-11-11 | Lg Display Co., Ltd. | Slit coater having apparatus for supplying a coating solution |
| US7416758B2 (en) | 2004-12-31 | 2008-08-26 | Lg Display Co., Ltd. | Slit coater |
| US7914843B2 (en) | 2004-12-31 | 2011-03-29 | Lg Display Co., Ltd. | Slit coater having pre-applying unit and coating method using the same |
| US7647884B2 (en) | 2004-12-31 | 2010-01-19 | Lg. Display Co., Ltd. | Slit coater with a standby unit for a nozzle and a coating method using the same |
| JP4657855B2 (en) * | 2005-08-23 | 2011-03-23 | 東京応化工業株式会社 | Coating device |
| JP2007054696A (en) * | 2005-08-23 | 2007-03-08 | Tokyo Ohka Kogyo Co Ltd | Coater |
| JP2007083237A (en) * | 2006-12-01 | 2007-04-05 | Tokyo Ohka Kogyo Co Ltd | Coating apparatus |
| JP2009195907A (en) * | 2009-04-23 | 2009-09-03 | Dainippon Printing Co Ltd | Applicator |
| CN104841607A (en) * | 2014-02-14 | 2015-08-19 | 斯克林集团公司 | Coating apparatus |
| CN104841607B (en) * | 2014-02-14 | 2017-09-22 | 斯克林集团公司 | Apparatus for coating |
| CN107835555A (en) * | 2017-11-21 | 2018-03-23 | 深圳市诚峰智造有限公司 | A kind of plasma surface processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW577774B (en) | 2004-03-01 |
| KR100786227B1 (en) | 2007-12-17 |
| KR20020018974A (en) | 2002-03-09 |
| JP4004216B2 (en) | 2007-11-07 |
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