JP2002056745A - Microswitch - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce man hour of wiring and connection and aim at space saving in a micro switch to which a diode is connected. SOLUTION: Into concave parts 14, 15 formed in a common terminal 12 and terminal fittings 8, a lead terminal 13a of the diode 13 is press-fitted, and by putting a notch or crushing in the vicinity of concave parts 14, 15 and by calking, the diode 13 is made to be built in a micro switch 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micro switch for switching contacts in a snap action manner.

[0002]

2. Description of the Related Art Conventionally, a diode is sometimes connected to a microswitch in order to prevent noise due to chattering. However, such a diode is soldered to a circuit board, and the microswitch and the diode are mounted. And the circuit board is connected by a lead wire.

[0003]

In such a conventional example, it is necessary to solder a diode to a circuit board, and a long lead wire must be provided between the microswitch and the circuit board. Therefore, there are disadvantages that the number of man-hours for wiring and connection increases and a wiring space increases.

The present invention has been made in view of such a point, and has an object to reduce the number of wiring and connection steps and to save space in a microswitch to which a diode is connected. .

[0005]

In order to achieve the above object, the present invention has the following configuration.

That is, the microswitch of the present invention comprises:
A diode is built in, and the terminal of the diode is press-fitted and connected to a recess formed in a circuit terminal of the microswitch.

Here, the circuit terminal is not limited to a common terminal, a normally open terminal, or a normally closed terminal of the microswitch, but also includes a terminal end portion of the circuit such as a terminal fitting inside the microswitch. The recess may be recessed so that the terminal of the diode can be press-fitted, and may be recessed in a groove or other shape.

According to the present invention, since the diode is built in the microswitch, it is not necessary to solder the diode to the circuit board as in the conventional example.
Since the lead wires are not required, and the terminals of the diode are press-fitted and connected to the concave portions formed in the circuit terminals of the microswitch, the connection between the diode and the microswitch can be easily performed.

In a preferred embodiment of the present invention, a cut is formed in the circuit terminal near the concave portion, and the concave portion is deformed and adhered along the terminal of the diode.

According to the present invention, the concave portion is deformed and adhered so as to follow the shape of the terminal press-fitted into the concave portion.
Since caulking is performed, reliable connection reliability can be obtained.

In another preferred embodiment of the present invention, the circuit terminal near the concave portion is crushed to form the concave portion.
It is deformed and adhered along the terminal of the diode.

Further, when the circuit terminal is crushed, a caulking jig is pressed against a position at a distance of 0.2 mm to 0.3 mm from the concave after the terminal of the diode is inserted into the concave. The terminals of the diode are fixed by being pressed and deforming the circuit terminals to cover the recesses.

According to the present invention, the caulking jig is pressed and pressed at a position apart from the concave portion by 0.2 mm to 0.3 mm, so that the caulking jig is pressed at a position too far from the concave portion. The entire circuit terminal is deformed significantly due to pressing, and conversely, it is pressed against the position too close to the recess and pressed, and the thickness of the recess is sufficient and the diode terminal cannot be fixed properly. There is no.

[0014]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIGS. 1A and 1B show the appearance of a microswitch according to an embodiment of the present invention. FIG. 1A is a plan view, FIG. 1B is a front view, and FIG. Is a side view, FIG. 2 is a longitudinal sectional front view thereof and a side view of a terminal portion thereof, and FIG. 3 is a view showing details of section A of FIG.

The micro switch 1 has a common terminal 2
The normally closed terminal 3 is a normally closed two terminal switch protruding from the side of the case, and each of the terminals 2 and 3 is a connector type micro switch having a connector shape.

The microswitch 1 includes a main body case 5 in which a snap action type switching mechanism 4 is incorporated, and a resin cover case 6 fitted and connected to the main body case 5. When the operation button 7 provided on the upper surface is pressed and operated, the contact of the switching mechanism 4 is switched and operated. The microswitch 1 is located below the operation button 7.
Is provided in a required location.

As shown in FIG. 2, the switching mechanism 4 includes the terminals 2 and 3 provided in the main body case 5, a terminal fitting 8 for common, a movable piece 9 for switching contacts, and The movable piece 9 includes a curved spring piece 10 for snapping up and down. The base end of the movable piece 9 is engaged with an engagement piece 8 a formed on the terminal fitting 8 via a V-shaped engagement groove 11. The base end of the curved spring piece 10 is supported by the other engagement piece 8b formed on the third fixed terminal 8 via a V-shaped engagement groove 12 and supported by the other engagement piece 8b. A free end of the movable piece 9 is engaged and supported by a free end side portion of the movable piece 9.

The operation button 7 is vertically slidably mounted on the upper surface of the case 5 so as to abut on the intermediate portion of the movable piece 9 from above.

In the conventional microswitch, the common terminal 2 and the terminal fitting 8 are integrally formed.
The microswitch of the present embodiment has a built-in diode 13 for preventing noise due to chattering. The diode 13 can be interposed between the common terminal 2 and the terminal fitting 8 as a circuit terminal. It is configured as follows.

That is, the common terminal 2 and the terminal fitting 8
Are bent downward so as to face each other substantially in the vicinity of the center of the longitudinal direction of the main body case 5. Both bent terminals 2 a and 8 c are connected to both lead terminals 1 of the diode 13.
The recesses 14 and 15 for press-fitting and holding the respective 3a and making electrical connection are formed in the recesses 14 and 15 respectively. The recesses 14 and 15 have tapered shapes for guiding the lead terminals 13a of the diode 13. Guide surface 14
a are formed, and the concave portions 14 and 15 have a substantially Y-shaped groove shape.

Since the tapered guide surface 14a is formed in the recesses 14 and 15 as described above, the diode 1
The third lead terminal 13a is smoothly press-fitted along the guide surface 14a, and automatic press-fitting can be performed.

Further, as shown in FIG. 3B, which is a sectional view taken along the line XX 'of FIG. 3A, when the diode 13 is press-fitted into the main body case 5, The lead terminal 1 is provided so that the glass tube portion in which the element of the diode 13 is sealed is not damaged by hitting the main body case 5.
A stopper 16 for regulating the press-fitting position of 3a is formed.

In this embodiment, the common terminal 2
In order to improve the contact reliability of the diode 13 press-fitted into the concave portions 14 and 15 of the terminal fitting 8, the diode 13
After press-fitting the lead terminals 13a of the common terminal 2 and the recesses 14 and 15 of the terminal fitting 8 as shown in FIG.
In the vicinity, cut 1 using a special jig 17 with a sharp tip.
8, the concave portions 14 and 15 are deformed and adhered so as to conform to the shape of the lead terminal 13a of the diode 13 so as to increase the caulking strength. As a result, reliable electrical connection can be ensured even when vibration or impact is applied.

As shown in FIG. 2, the micro switch 1 having the above-described structure applies the free end of the movable piece 9 upward by the elastic restoring force of the curved spring piece 10 when no external force is applied to the operation button 7 as shown in FIG. And the normally closed contact 3a of the normally closed terminal 3
In this state, the movable contact 9a provided on the upper surface of the free end of the movable piece 9 is kept in contact, and a state is established in which the common terminal 2 and the normally closed terminal 3 conduct. When the intermediate portion of the movable piece 9 is bent downward by a predetermined amount or more by pressing the operation button 7, the elastic restoring force of the curved spring piece 10 instantaneously biases the movable piece 9 downward. The contact is turned off. Also, when the pressing of the operation button 7 is released, the intermediate portion of the movable piece 9 returns and rises,
The elastic restoring force of the curved spring piece 10 is reversed so as to urge the movable piece 9 upward to be displaced, and returns to the original state.

The microswitch 1 having the above configuration is manufactured by the following procedure.

First, the movable piece 9 and the curved spring piece 10 are attached to the terminal fitting 8 and assembled into the main body case 5. Further, after the common terminal 2 is assembled into the main body case 5, the diode 13 is connected to the common terminal 2 and the terminal. After being press-fitted and held between the metal fittings 8 and caulked using the special jig 17 as described above, the normally closed terminal 3 is assembled to the main body case 5 and then the operation button 7
Is inserted, and the cover case 6 is fitted and connected to the main body case 5 to finish the process.

As another embodiment of the present invention, as shown in FIG. 5, a crush 20 is formed near the recesses 14 and 15 of the common terminal 2 and the terminal fitting 8 by a dedicated jig 19 having a blunt tip. Insert recesses 14 and 15 into diode 1
The third lead terminal 13a may be deformed and adhered so as to conform to the shape of the lead terminal 13a to increase the crimping strength.

More specifically, as shown in FIG. 6A, L = 0.2 mm to 0.3 mm from the concave portions 14 and 15 in which the lead terminals 13a of the diode 13 are inserted.
The caulking jig 19 is applied to a position just apart from
The caulking jig 19 is pressed in the same direction as the groove directions of the grooves 4 and 15. Then, as shown in FIG. 6B, the common terminal 2 and the terminal fitting 8 are deformed so as to cover the recesses 14 and 15 so that the lead terminal 13a of the diode 13 is fixed.

Here, if the position where the caulking jig 19 is applied is far from the recesses 14 and 15 by much more than 0.3 mm, the entire common terminal 2 and the terminal fitting 8 are caulked.
9 is greatly deformed by the pressing. Further, the position where the caulking jig 19 is applied is set at 0.2 from the concave portions 14 and 15.
If the distance is smaller than mm, the common terminal 2 and the terminal fitting 8 are deformed due to the pressure, and the thickness of the common terminal 2 and the terminal fitting 8 when the concave portions 14 and 15 are closed is not sufficient, and the lead terminal 13a of the diode 13 is not fixed well.

In order to prevent both of these problems, the position at which the caulking jig 19 is applied is important, and a position separated from the concave portions 14 and 15 by 0.2 mm to 0.3 mm is preferable.

In the above embodiment, the present invention is applied to a microswitch having only a normally-closed fixed terminal. However, the present invention is applied to a three-terminal microswitch having a normally-closed fixed terminal and a normally-open fixed terminal. It can also be applied.

Further, in the above-described embodiment, the present invention is applied to a microswitch having connector-shaped terminals, but the present invention may be applied to a microswitch having lead terminals to be soldered.

[0034]

According to the present invention described above, the diode is built into the microswitch by press-fitting the terminal of the diode into the recess formed in the circuit terminal of the microswitch. There is no need to solder the circuit board or route the lead wires to connect the microswitch to the circuit board, so that the number of wiring and connection steps can be reduced, and the space can be saved.

Moreover, by forming a notch or crushing in the vicinity of the fixed terminal to increase the caulking strength, the connection reliability can be ensured even when vibration or impact is applied.

[Brief description of the drawings]

FIG. 1 is a view showing the appearance of a microswitch according to the present invention.

FIG. 2 is a vertical sectional front view of the microswitch of FIG. 1 and a diagram showing a terminal portion.

FIG. 3 is a diagram showing details of a section A of FIG. 1;

FIG. 4 is a view showing swaging after press-fitting of a diode.

FIG. 5 is a view showing a caulking process according to another embodiment of the present invention.

6 is a diagram illustrating the caulking process of FIG. 5 in detail.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Micro switch 2 Common terminal 3 Normally closed terminal 4 Switching mechanism 5 Main body case 6 Cover case 7 Operation button 8 Terminal fitting 13 Diode 14, 15 Recess

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5G006 AA10 AB03 AB08 AC03 BA09 BB02 5G025 AA05 BA06 DA10

Claims (4)

[Claims] 1. A microswitch having a built-in diode and having a terminal of the diode press-fitted and connected to a recess formed in a circuit terminal of the microswitch. 2. The microswitch according to claim 1, wherein a notch is formed in the circuit terminal near the concave portion, and the concave portion is deformed and adhered along the terminal of the diode. 3. The microswitch according to claim 1, wherein the circuit terminal near the concave portion is crushed to deform and adhere the concave portion along the terminal of the diode. 4. When the circuit terminal is crushed, a caulking jig is pressed to a position away from the recess by 0.2 mm to 0.3 mm after the terminal of the diode is inserted into the recess. 4. The micro switch according to claim 3, wherein the terminal of the diode is fixed by being pressed to deform the circuit terminal and close the recess.