JP2002052444A - Surface grinding device and work grinding method - Google Patents

Surface grinding device and work grinding method

Info

Publication number
JP2002052444A
JP2002052444A JP2000239248A JP2000239248A JP2002052444A JP 2002052444 A JP2002052444 A JP 2002052444A JP 2000239248 A JP2000239248 A JP 2000239248A JP 2000239248 A JP2000239248 A JP 2000239248A JP 2002052444 A JP2002052444 A JP 2002052444A
Authority
JP
Japan
Prior art keywords
grinding
contact
reference block
height
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000239248A
Other languages
Japanese (ja)
Inventor
Keiichi Kosugi
桂一 小杉
Akinori Yui
明紀 由井
Yuichi Kiyama
裕一 木山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okamoto Machine Tool Works Ltd
Original Assignee
Okamoto Machine Tool Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okamoto Machine Tool Works Ltd filed Critical Okamoto Machine Tool Works Ltd
Priority to JP2000239248A priority Critical patent/JP2002052444A/en
Publication of JP2002052444A publication Critical patent/JP2002052444A/en
Pending legal-status Critical Current

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  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a surface grinding device for giving excellent dimensional precision to a work. SOLUTION: The surface grinding device comprises a sensor unit 90 mounted on the side face of a wheel spindle head in opposition to a working table 11, a nozzle for blowing a gas, a reference block 100, contact detecting means for detecting the contact of a touch probe with the upper face of the reference block when a column is moved a predetermined distance in the longitudinal direction, a storage part for storing a height H from the working table to the upper face of the reference block during contact, contact detecting means for detecting the contact of the touch probe with the upper face of the work when the working table is moved a predetermined distance in the cross direction, a storage part for storing a height (h) from the working table to the upper face of the work during contact, a storage part for storing a height (H+h) after grinding, and computing means for computing a machining allowance αto be ground in accordance with a difference between the (h) and the H stored in the storage parts.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ワ−クテ−ブルの
温度分布の影響がワ−クの加工寸法に与える影響を小さ
くしたサドルタイプ、コラムタイプ、または門型タイプ
の平面研削装置に関するものである。また、本発明は、
ワ−クの平面研削加工方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a saddle-type, column-type, or portal-type surface grinding apparatus in which the influence of the temperature distribution of a work table on the working dimensions of a work is reduced. It is. Also, the present invention
The present invention relates to a surface grinding method for a work.

【0002】[0002]

【従来の技術】砥石によりテ−ブル上に設けられたワ−
クを研削するサドルタイプまたはコラムタイプの研削装
置は知られている(特開昭55−83567号、同59
−59349号、同61−173851号、特開平4−
13552号、特開2000−135675号、特許第
2694189号、特許第3023018号)。図5に
コラム型NC平面研削装置1の一例を示す。図中、10
は作業台部、11は水平方向(X軸方向)に往復移動可
能なテ−ブル、12は電磁チャック、13は前後方向
(Z軸方向)に往復移動可能なサドル、20は砥石装
置、21は砥石を垂直方向(Y軸方向)に移動する昇降
機構を備えたコラム、22は砥石頭、24は砥石軸に備
えられた砥石、70は操作盤、80はベッドである。
2. Description of the Related Art A wafer provided on a table by a grindstone
Saddle-type or column-type grinding devices for grinding a grinding wheel are known (Japanese Patent Application Laid-Open Nos. 55-83567 and 59-58).
-59349 and 61-173851;
13552, JP-A-2000-135675, Japanese Patent No. 2694189, and Japanese Patent No. 3023018). FIG. 5 shows an example of the column type NC surface grinding apparatus 1. In the figure, 10
Is a worktable, 11 is a table capable of reciprocating in the horizontal direction (X-axis direction), 12 is an electromagnetic chuck, 13 is a saddle capable of reciprocating in the front-rear direction (Z-axis direction), 20 is a grindstone device, 21 Is a column provided with an elevating mechanism for moving the grindstone in the vertical direction (Y-axis direction), 22 is a grindstone head, 24 is a grindstone provided on the grindstone shaft, 70 is an operation panel, and 80 is a bed.

【0003】ワ−クの研削に当たって、予め総研削量と
テ−ブル反転毎の切り込み量が設定されており、研削時
にテ−ブル送りを行いながらその反転時毎に切り込み量
分づつ砥石を下降することによりさせ研削する。このN
C平面研削装置1では、テ−ブル11上の電磁チャック
12にワ−クを固定し、サドル13を移動させてZ軸方
向の位置を決め、テ−ブル11をX軸方向に往復移動さ
せる過程で砥石軸頭に備えられた回転している砥石24
をワ−クに接触させ、砥石軸頭をY軸方向に送りをかけ
てワ−クに切り込みを懸けて研削する。この際、ワ−ク
表面には図示されていない研削液供給ノズルより研削液
が供給される。
[0003] In grinding a work, a total grinding amount and a cutting amount for each table reversal are set in advance, and the grindstone is lowered by the cutting amount every time the table is reversed while feeding the table during grinding. By doing so grinding. This N
In the C-plane grinding machine 1, the work is fixed to the electromagnetic chuck 12 on the table 11, the saddle 13 is moved to determine the position in the Z-axis direction, and the table 11 is reciprocated in the X-axis direction. The rotating grindstone 24 provided on the grindstone head during the process
Is brought into contact with the work, and the grinding wheel spindle head is fed in the Y-axis direction to cut the work and grind it. At this time, a grinding fluid is supplied to the work surface from a grinding fluid supply nozzle (not shown).

【0004】総研削量は、図6にサイクル図示すように
粗研削代量と精研削代量に振り分けられ、粗研削ではテ
−ブル反転1回毎の切り込み代は大きく取られる。精研
削ではテ−ブル反転1回毎の切り込み代は粗研削時の取
り代量より小さい。砥石は加工原点の研削開始点位置ま
でワ−ク面から後退され、操作盤のボタンを押して、ま
たはハンドルを回して砥石底面をワ−ク表面に2〜3μ
m離れた位置まです速く近づけ、ついで手パハンドルを
手動で動かして砥石底面をワ−クに接触させ、粗研削が
開始される。
The total amount of grinding is divided into a rough grinding allowance and a fine grinding allowance as shown in a cycle diagram in FIG. 6, and in the rough grinding, a large cutting allowance is taken for each table reversal. In fine grinding, the cutting allowance for each table reversal is smaller than the removal allowance in rough grinding. The grindstone is retracted from the work surface to the grinding starting point position of the machining origin, and the bottom of the grindstone is brought into contact with the work surface by pressing the button on the operation panel or turning the handle.
Then, the grindstone bottom is brought into contact with the work by manually moving the handwheel, and rough grinding is started.

【0005】粗研削代量が研削され、粗研削が終了する
と、砥石は若干後退され、精研削の準備を取る。操作盤
のボタンを押して、またはハンドルを廻して砥石底面を
ワ−ク表面に2〜3μm離れた位置まです速く近づけ、
ついで手パハンドルを手動で動かして砥石底面をワ−ク
に接触させ、精研削が開始される。精研削代量が研削さ
れ、精研削が終了すると、砥石は若干後退され、ついで
砥石がワ−ク表面に0μmの切り込みを行うスパ−クア
ウトが0〜10回行われ、砥石は後退(リトラクト)
し、研削が終了する。
[0005] When the rough grinding amount is ground and the rough grinding is completed, the grinding wheel is slightly retracted to prepare for fine grinding. Press the button on the operation panel or turn the handle to bring the grindstone bottom surface close to the work surface 2-3 μm away quickly,
Then, the handwheel is manually moved to bring the bottom surface of the grindstone into contact with the work, and fine grinding is started. When the fine grinding amount is ground and the fine grinding is completed, the grinding wheel is slightly retracted, and then the sparking is performed 0 to 10 times in which the grinding wheel makes a 0 μm cut into the work surface, and the grinding wheel is retracted (retract).
Then, the grinding is completed.

【0006】ワ−クの研削加工中には砥石が磨耗し、表
面粗さ、研削性、切残し量が変化するので、砥石の外周
を適時ドレッシングする必要がある(特開2000−1
35675号など前記特許公報参照)。ドレッサにはテ
−ブル上に備えられて使用される卓上ドレッサまたは、
砥石頭に設けられる頭上ドレッサが利用される。
During grinding of the work, the grindstone is worn and the surface roughness, grindability and uncut amount change, so it is necessary to dress the outer periphery of the grindstone in a timely manner (Japanese Patent Laid-Open No. 2000-1).
See the above-mentioned patent publications such as 35675). The dresser is a table dresser that is used by being provided on a table or
An overhead dresser provided on the grindstone head is used.

【0007】平面研削装置において、テ−ブルと砥石軸
芯のY軸上の位置関係は設計上明確であり、従来、ワ−
クの研削取り代のワ−ク高さの測定は、テ−ブル表面を
基準点(0mm位置)として行っている。しかしながら
ワ−クの研削時間が長かったり、連続してワ−クの研削
がなされる場合、実運転中に熱変形等によるベッドの伸
縮があるので、テ−ブルと砥石軸芯のY軸上の位置関係
は精密には設定値と異なるものとなり、製品によっては
1〜3μm程度寸法精度がずれることがある。
[0007] In the surface grinding apparatus, the positional relationship between the table and the axis of the grinding wheel on the Y axis is clear from the design point of view.
The measurement of the work height for the grinding allowance of the work is performed using the table surface as a reference point (0 mm position). However, when the work grinding time is long or the work is continuously ground, the bed expands and contracts due to thermal deformation and the like during the actual operation. Is precisely different from the set value, and the dimensional accuracy may be shifted by about 1 to 3 μm depending on the product.

【0008】[0008]

【発明が解決しようとする課題】本発明等は、タッチプ
ロ−ブを備えたセンサユニットと基準ブロックを用い、
ワ−クの研削取り代の値を基準ブロックとワ−クテ−ブ
ル表面間の高さと、ワ−クの研削面とワ−クテ−ブル表
面間の高さから算出する方法を着想し、本発明に到っ
た。
The present invention uses a sensor unit having a touch probe and a reference block.
The present invention is based on the idea of calculating the grinding allowance value of the work from the height between the reference block and the work table surface and the height between the work grinding surface and the work table surface. The invention has been reached.

【0009】本発明の請求項1は、左右方向に往復移動
可能なワ−クテ−ブルと、前記ワ−クテ−ブルに対し前
後方向に移動可能なコラムに保持されたワ−クを加工す
るための砥石軸頭の砥石軸に軸承された砥石と、該砥石
軸を上下方向に昇降可能な送り機構と、砥石を回転させ
る駆動機構と、砥石軸の前後軸および上下軸の移動量を
数値制御する制御機構と、ポジショニング機能を有する
ワ−クテ−ブルの左右軸とを備える平面研削装置であっ
て、該平面研削装置は、ワ−クテ−ブルに対向して砥石
軸頭に取り付けられた先端にスタイラスを有するタッチ
プロ−ブを備えたセンサユニットと、ワ−クテ−ブル上
に備えられた基準ブロックとワ−クテ−ブルを前後方向
に所定量移動させ、タッチプロ−ブのスタイラスを基準
ブロック上面に接触させた際に、接触したことを検知す
る接触検知手段と、その接触した際のワ−クテ−ブルか
ら基準ブロック上面までの高さHiを記憶する記憶部
と、ワ−クテ−ブルを左右方向に所定量移動させ、タッ
チプロ−ブのスタイラスをワ−ク上面に接触させた際
に、接触したことを検知する接触検知手段と、その接触
した際のワ−クテ−ブルからワ−ク上面までの高さhi
を記憶する記憶部と、制御装置に入力された、研削終了
後の所望の加工ワ−クの高さ(H+β)を記憶する記憶
部と、および、前記記憶部に記憶されたhiとHiの差に
基づき、研削する取り代量αを算出する演算手段と、を
有することを特徴とする平面研削装置を提供するもので
ある。
According to a first aspect of the present invention, a worktable reciprocally movable in the left-right direction and a work held on a column movable in the front-rear direction with respect to the worktable are processed. A grinding wheel supported on the grinding wheel shaft of the grinding wheel shaft head, a feed mechanism capable of moving the grinding wheel shaft up and down, a driving mechanism for rotating the grinding wheel, and moving amounts of the front-rear axis and the vertical axis of the grinding wheel axis A surface grinding apparatus having a control mechanism for controlling and a left and right axis of a worktable having a positioning function, wherein the surface grinding apparatus is mounted on a grindstone shaft head so as to face the worktable. A sensor unit provided with a touch probe having a stylus at the tip, a reference block provided on the worktable and the worktable are moved by a predetermined amount in the front-rear direction, and the stylus of the touch probe is moved. Contact the top of the reference block When obtained by the contact detection means for detecting that contact, the sum of upon its contact - Kute - a storage unit for storing the height H i of the table to the reference block top surface, Wa - Kute - lateral Bull When the stylus of the touch probe is brought into contact with the upper surface of the work by a predetermined amount in the direction, the contact detection means for detecting the contact, and the work table at the time of the contact makes a work. Height h i to the top
, A storage unit for storing the desired height (H + β) of the machining work after the end of grinding, which is input to the control unit, and hi and H stored in the storage unit. and a calculating means for calculating a grinding allowance α based on the difference i .

【0010】熱膨張率の小さい基準ブロックを介してタ
ッチプロ−ブで測定された値である実際に研削された取
り代量が算出され、残取り代量も算出されるのでベッド
の熱膨張率の影響を受けることはない。
[0010] The actual grinding allowance, which is the value measured by the touch probe via the reference block having a small coefficient of thermal expansion, is calculated, and the remaining allowance is also calculated. Is not affected.

【0011】本発明の請求項2は、上記平面研削装置に
おいて、スタイラスを有するタッチプロ−ブを備えたセ
ンサユニットは、砥石軸頭の側面に配置され、基準ブロ
ックは、ワ−クテ−ブル上に載置されたワ−クの前側側
端から0〜100mm以内に設置されることを特徴とす
る。
According to a second aspect of the present invention, in the above-mentioned surface grinding apparatus, the sensor unit having a touch probe having a stylus is disposed on a side surface of a grinding wheel shaft head, and the reference block is provided on a work table. The work is placed within 0 to 100 mm from the front end of the work placed on the work.

【0012】センサユニットが砥石軸に軸承された砥石
を保護する砥石ガ−ドに配備されるので、砥石軸とセン
サユニット間の距離が確定し、砥石径の算出や、タッチ
プロ−ブ/ワ−ク表面間距離、タッチプロ−ブ/基準ブ
ロック表面間距離が砥石軸を起点として算出できる。ま
た、基準ブロックは、ワ−クテ−ブル上に載置されたワ
−クの前側側端から0〜100mm以内に設置されるの
で、基準ブロックがワ−クテ−ブルの左右端に設けられ
たときよりもワ−クに近く、ワ−クとほぼ同じ温度のテ
−ブル上で距離が測定されることとなり、テ−ブルの温
度分布の影響を受けない。
Since the sensor unit is provided on a grindstone guard for protecting the grindstone supported on the grindstone shaft, the distance between the grindstone shaft and the sensor unit is determined, and the calculation of the grindstone diameter and the touch probe / wire are performed. The distance between the surface of the workpiece and the distance between the surface of the touch probe and the surface of the reference block can be calculated starting from the grinding wheel axis. Since the reference block is set within 0 to 100 mm from the front end of the work placed on the work table, the reference block is provided at the left and right ends of the work table. The distance is measured on a table that is closer to the work than at the time and has substantially the same temperature as the work, and is not affected by the temperature distribution of the table.

【0013】本発明の請求項3は、平面研削装置のワ−
クテ−ブルの左右方向の反転位置と、コラムの前後方向
の反転位置と、研削加工された後の所望のワ−ク厚み
(H+β)を制御装置に入力し、コラムを前後方向に所
定量移動させ、タッチプロ−ブのスタイラスを基準ブロ
ック上面に接触させてワ−クテ−ブルから基準ブロック
上面までの高さHを測定し、ついで、ワ−クテ−ブルを
左右方向に所定量移動させ、タッチプロ−ブのスタイラ
スをワ−ク上面に接触させてワ−クテ−ブルからワ−ク
上面までの高さhを測定し、総研削代量αをα=(h−
H−β)と算出し、この総研削代量αを粗研削取り代量
α1と精研削取り代量α2に制御装置で振り分け、粗研削
する取り代量α1を算出するとともに、基準ブロック上
面の高さHを基準にして粗研削加工開始位置Y1を決定
し、砥石軸を粗研削加工開始位置Y1に位置決めし、粗
研削を行った後、コラムを前後方向に所定量移動させ、
タッチプロ−ブのスタイラスを基準ブロック上面に接触
させてワ−クテ−ブルから基準ブロック上面までの高さ
1を測定し、ついで、ワ−クテ−ブルを左右方向に所
定量移動させ、タッチプロ−ブのスタイラスをワ−ク上
面に接触させてワ−クテ−ブルからワ−ク上面までの高
さh1を測定し、精研削する取り代量α2を(h1−H1
β)式より算出するとともに、基準ブロック上面の高さ
iを基準にして精研削加工開始位置Y2を決定し、砥石
軸を精研削加工開始位置Y2に位置決めし、精研削を行
った後、コラムを前後方向に所定量移動させ、タッチプ
ロ−ブのスタイラスを基準ブロック上面に接触させてワ
−クテ−ブルから基準ブロック上面までの高さHiを測
定し、ついで、ワ−クテ−ブルを左右方向に所定量移動
させ、タッチプロ−ブのスタイラスをワ−ク上面に接触
させてワ−クテ−ブルからワ−ク上面までの高さhi
測定し、ワ−クの仕上がり寸法(hi−Hi)の値を演算
し、(hi−Hi)=βのときは、研削終了とし、(hi
−Hi)<βのときは、(hi−Hi−β)の量更に補正
の精研削を行うことを制御装置に入力し、補正研削を行
うことを特徴とする、ワ−クの研削方法を提供するもの
である。
A third aspect of the present invention is a wire grinding machine for a surface grinding apparatus.
The table is input to the control device with the left-right reversal position of the table, the reversal position of the column in the front-rear direction, and the desired work thickness (H + β) after grinding, and the column is moved in the front-rear direction by a predetermined amount. Then, the stylus of the touch probe is brought into contact with the upper surface of the reference block to measure the height H from the work table to the upper surface of the reference block. Then, the work table is moved in the left and right direction by a predetermined amount. The stylus of the touch probe is brought into contact with the upper surface of the work, the height h from the work table to the upper surface of the work is measured, and the total grinding allowance α is α = (h−
With calculated H-beta) and, distributed by the control unit the total grinding allowance amount alpha in the rough grinding allowance amount alpha 1 and fine grinding allowance amount alpha 2, to calculate the allowance amount alpha 1 to the rough grinding, the reference based on the height H of the block top surface to determine the rough grinding start position Y 1, to position the wheel spindle to the rough grinding start position Y 1, after rough grinding, a predetermined amount of movement in the longitudinal direction of the column Let
Touch Pro - contacting the blanking of the stylus on the reference block top surface Wa - Kute - measuring the height H 1 from bull to the reference block top surface, then word - Kute - by a predetermined amount of movement of the table in the lateral direction, touch pro - Bed stylus a word - word into contact with the click top - Kute - table Kurrawa - measuring the height h 1 to click a top surface, a machining allowance amount alpha 2 to fine grinding (h 1 -H 1 -
to calculate than beta) type, and the reference block upper surface height H i to the reference to determine the fine grinding start position Y 2, to position the wheel spindle in seminal grinding start position Y 2, was fine grinding after, is moved by a predetermined amount in the longitudinal direction of the column, touch pro - the blanking of the stylus is brought into contact with the reference block top surface Wa - Kute - measuring the height H i of the table to the reference block top surface, then word - Kute - Bull in the lateral direction is moved by a predetermined amount, the touch pro - the blanking stylus word - is brought into contact with the click top word - Kute - table Kurrawa - measuring the height h i of up click top, word - the click calculates the value of the finished dimension (h i -H i), when the (h i -H i) = β , and grinding ends, (h i
-H i ) <β, the amount of (h i -H i -β) is further input to the control device to perform the precise grinding, and the correction grinding is performed. A grinding method is provided.

【0014】コラム型平面研削装置を用い、ワ−クを研
削する際、精研削終了後、加工されたワ−クの高さを基
準ブロックの高さ位置を基準に求め、さらに補正の精研
削が必要とされたときは製品取り代量を補正して研削を
行うので寸法精度の良好な加工ワ−クが得られる。
When grinding a work using a column-type surface grinding apparatus, after finishing the fine grinding, the height of the processed work is determined with reference to the height position of the reference block, and the precision grinding for correction is further performed. Is required, the grinding is performed with the product removal amount corrected, so that a machining work with good dimensional accuracy can be obtained.

【0015】本発明の請求項4は、ベッドに対し、左右
方向および前後方向に往復移動可能なワ−クテ−ブル
と、前記ワ−クテ−ブルに対し上方に設けられた砥石軸
頭の砥石軸に軸承された砥石と、該砥石軸を上下方向に
昇降可能な送り機構と、砥石を回転させる駆動機構と、
ワ−クテ−ブルの左右軸および前後軸並びに砥石軸の上
下軸の移動量を数値制御する制御機構とを有する平面研
削装置であって、該平面研削装置は、ワ−クテ−ブルに
対向して砥石軸頭に取り付けられた先端にのスタイラス
を有するタッチプロ−ブを備えたセンサユニットと、ワ
−クテ−ブル上に備えられた基準ブロックとワ−クテ−
ブルを前後方向に所定量移動させ、タッチプロ−ブのス
タイラスを基準ブロック上面に接触させた際に、接触し
たことを検知する接触検知手段と、その接触した際のワ
−クテ−ブルから基準ブロック上面までの高さHiを記
憶する記憶部と、ワ−クテ−ブルを左右方向に所定量移
動させ、タッチプロ−ブのスタイラスをワ−ク上面に接
触させた際に、接触したことを検知する接触検知手段
と、その接触した際のワ−クテ−ブルからワ−ク上面ま
での高さhiを記憶する記憶部と、制御装置に入力され
た、研削終了後の所望の加工ワ−クの高さ(H+β)を
記憶する記憶部と、および、前記記憶部に記憶されたh
iとHiの差に基づき、研削する取り代量αを算出する演
算手段と、を有することを特徴とする平面研削装置を提
供するものである。
According to a fourth aspect of the present invention, there is provided a worktable reciprocally movable in the left-right direction and the front-rear direction with respect to the bed, and a grindstone of a grindstone shaft head provided above the worktable. A grindstone supported on a shaft, a feed mechanism capable of moving the grindstone shaft up and down, and a drive mechanism for rotating the grindstone,
A surface grinding device having a control mechanism for numerically controlling the amount of movement of the left and right axes and the front and rear axes of a worktable and the vertical axis of a grinding wheel axis, wherein the surface grinding apparatus is opposed to the worktable. Unit equipped with a touch probe having a stylus at the tip attached to the head of the grinding wheel, a reference block provided on the worktable, and a worktable
When the stylus of the touch probe is brought into contact with the upper surface of the reference block by contacting the stylus of the touch probe with the upper surface of the reference block, contact detection means for detecting the contact and a worktable at the time of the contact are used as a reference. a storage unit for storing the height H i to the block top surface, Wa - Kute - Bull in the lateral direction is moved by a predetermined amount, the touch pro - the stylus of the probe word - when in contact with the click top, the contact a contact detection means for detecting the sum of upon its contact - Kute - Bull Kurrawa - a storage unit for storing the height h i of up click top, which is input to the control device, the desired processing after grinding completion A storage unit for storing the work height (H + β), and h stored in the storage unit
Based on the difference between i and H i, there is provided a surface grinding apparatus, characterized in that it comprises calculating means for calculating an allowance amount α grinding, the.

【0016】サドル型の平面研削装置において、熱膨張
率の小さい基準ブロックを介してタッチプロ−ブで測定
された値である実際に研削された取り代量が算出され、
残取り代量も算出されるのでベッドの熱膨張率の影響を
受けることはない。
In the saddle-type surface grinding device, an actually ground removal amount, which is a value measured by a touch probe via a reference block having a small coefficient of thermal expansion, is calculated.
Since the remaining amount is also calculated, it is not affected by the thermal expansion coefficient of the bed.

【0017】本発明の請求項5は、平面研削装置のワ−
クテ−ブルの左右方向の反転位置および前後方向の反転
位置と、研削加工された後の所望のワ−ク厚み(H+
β)を制御装置に入力し、ワ−クテ−ブルを前後方向に
所定量移動させ、タッチプロ−ブのスタイラスを基準ブ
ロック上面に接触させてワ−クテ−ブルから基準ブロッ
ク上面までの高さHを測定し、コラムを前後方向に所定
量移動させ、タッチプロ−ブのスタイラスを基準ブロッ
ク上面に接触させてワ−クテ−ブルから基準ブロック上
面までの高さHを測定し、ついで、ワ−クテ−ブルを左
右方向に所定量移動させ、タッチプロ−ブのスタイラス
をワ−ク上面に接触させてワ−クテ−ブルからワ−ク上
面までの高さhを測定し、総研削代量αをα=(h−H
−β)と算出し、この総研削代量αを粗研削取り代量α
1と精研削取り代量α2に制御装置で振り分け、粗研削す
る取り代量α1を算出するとともに、基準ブロック上面
の高さHを基準にして粗研削加工開始位置Y1を決定
し、砥石軸を粗研削加工開始位置Y1に位置決めし、粗
研削を行った後、ワ−クテ−ブルを前後方向に所定量移
動させ、タッチプロ−ブのスタイラスを基準ブロック上
面に接触させてワ−クテ−ブルから基準ブロック上面ま
での高さH1を測定し、ついで、ワ−クテ−ブルを左右
方向に所定量移動させ、タッチプロ−ブのスタイラスを
ワ−ク上面に接触させてワ−クテ−ブルからワ−ク上面
までの高さh1を測定し、精研削する取り代量α2をを
(h1−H1−β)式より算出するとともに、基準ブロッ
ク上面の高さHiを基準にして精研削加工開始位置Y2
決定し、砥石軸を精研削加工開始位置Y2に位置決め
し、精研削を行った後、ワ−クテ−ブルを前後方向に所
定量移動させ、タッチプロ−ブのスタイラスを基準ブロ
ック上面に接触させてワ−クテ−ブルから基準ブロック
上面までの高さHiを測定し、ついで、ワ−クテ−ブル
を左右方向に所定量移動させ、タッチプロ−ブのスタイ
ラスをワ−ク上面に接触させてワ−クテ−ブルからワ−
ク上面までの高さhiを測定し、ワ−クの仕上がり寸法
(hi−Hi)の値を演算し、(hi−Hi)=βのとき
は、研削終了とし、(hi−Hi)<βのときは、(hi
−Hi−β)の量更に補正の精研削を行うことを制御装
置に入力し、補正研削を行うことを特徴とする、ワ−ク
の研削方法を提供するものである。
A fifth aspect of the present invention is a wire grinding machine for a surface grinding apparatus.
And the desired work thickness (H +) after the grinding process.
β) is input to the control device, the worktable is moved in the front-rear direction by a predetermined amount, and the stylus of the touch probe is brought into contact with the upper surface of the reference block, and the height from the worktable to the upper surface of the reference block is increased. The height H from the worktable to the upper surface of the reference block is measured by measuring the H, moving the column in the front-rear direction by a predetermined amount, bringing the stylus of the touch probe into contact with the upper surface of the reference block, and then measuring the height H. -Move the table in the left and right direction by a predetermined amount, bring the stylus of the touch probe into contact with the upper surface of the work, measure the height h from the work table to the upper surface of the work, and determine the total grinding allowance. When the quantity α is α = (h−H
−β) and calculate the total grinding allowance α by the coarse grinding allowance α.
Distributing the control device 1 and the fine grinding allowance amount alpha 2, to calculate the allowance amount alpha 1 to rough grinding, the reference block upper surface height H with respect to determining the rough grinding start position Y 1, positioning the wheel spindle to the rough grinding start position Y 1, after rough grinding, Wa - Kute - Bull in the longitudinal direction is moved by a predetermined amount, the touch pro - with the blanking of the stylus into contact with the reference block top surface Wa - Kute - the height H 1 to the reference block top surface measured from Bull, then word - Kute - Bull in the lateral direction is moved by a predetermined amount, the touch pro - the blanking stylus word - it is brought into contact with the click upper surface Wa - Kute - table Kurrawa - measuring the height h 1 to click a top surface, a the allowance amount alpha 2 to fine grinding to calculate than (h 1 -H 1-beta) type, the reference block upper surface height based on the H i to determine the fine grinding start position Y 2, fine grinding wheel spindle Positioned in Engineering start position Y 2, after fine grinding, Wa - Kute - Bull in the longitudinal direction is moved by a predetermined amount, the touch pro - from table - with the blanking of the stylus into contact with the reference block top surface Wa - Kute up reference block upper surface height H i is measured, then, word - Kute - Bull in the lateral direction is moved by a predetermined amount, the touch pro - from table - is brought into contact with the click top word - - the blanking of the stylus word Kute Wow
Measuring the height h i of up click top, Wa - calculating the value of the click of the finished dimension (h i -H i), when the (h i -H i) = β , and grinding ends, (h i− H i ) <β, then (h i
The present invention provides a grinding method for a work, characterized in that a control device is instructed to perform the precise grinding for the amount of -H i -β) and further to perform the correction grinding.

【0018】サドル型平面研削装置を用い、ワ−クを研
削する際、精研削終了後、加工されたワ−クの高さを基
準ブロックの高さ位置を基準に求め、さらに補正の精研
削が必要とされたときは製品取り代量を補正して研削を
行うので寸法精度の良好な加工ワ−クが得られる。
When grinding a work using a saddle-type surface grinding device, after finishing the fine grinding, the height of the processed work is determined based on the height position of the reference block, and the precision fine grinding is further corrected. Is required, the grinding is performed with the product removal amount corrected, so that a machining work with good dimensional accuracy can be obtained.

【0019】[0019]

【発明の実施の形態】以下、図を用いて本発明をさらに
詳細に説明する。図1は、平面研削装置の一部を切り欠
いた正面図、図2はタッチプロ−ブを備えるセンサユニ
ットの正面図、図3は本発明のワ−クの平面研削方法の
フロ−図である。図4は研削前のワ−クの寸法と、研削
取り代量と基礎ブロックの高さの相関を示す図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail with reference to the drawings. FIG. 1 is a partially cutaway front view of a surface grinding apparatus, FIG. 2 is a front view of a sensor unit having a touch probe, and FIG. 3 is a flowchart of a surface grinding method of a work according to the present invention. is there. FIG. 4 is a diagram showing the correlation between the dimensions of the work before grinding, the amount of grinding allowance and the height of the basic block.

【0020】図1に示す平面研削装置において、11は
水平方向(X軸方向)に往復移動可能なテ−ブル、wは
該テ−ブル上に置かれたワ−ク、22は砥石軸頭、24
は砥石軸に備えられた砥石、25は砥石カバ−、90は
タッチプロ−ブを備えたセンサユニット、91はスタイ
ラス、100は基準ブロックである。
In the surface grinding apparatus shown in FIG. 1, reference numeral 11 denotes a table capable of reciprocating in the horizontal direction (X-axis direction), w denotes a work placed on the table, and 22 denotes a grindstone shaft head. , 24
Is a grindstone provided on the grindstone shaft, 25 is a grindstone cover, 90 is a sensor unit having a touch probe, 91 is a stylus, and 100 is a reference block.

【0021】図2に示すセンサユニット90において、
91はスタイラス、92はプロ−ブ、93はモジュ−
ル、94はジャンク、95はスピンドル、96は配線、
97はインタ−ファ−ス、98は平面研削装置の制御機
構、99は吹き付けるノズルで、スタイラス先端がワ−
クに触れている部分に0.4〜0.6Mpaの乾燥空気
を吹き付ける。接触検知手段であるセンサユニット90
は、砥石軸の軸芯からスタイラス先端が接触した被検査
物(ワ−クまたは基準ブロック)表面間の距離を測定す
るように設ける。制御機構98は、記憶部、演算部を備
える。
In the sensor unit 90 shown in FIG.
91 is a stylus, 92 is a probe, 93 is a module.
, 94 is junk, 95 is spindle, 96 is wiring,
Reference numeral 97 denotes an interface, 98 denotes a control mechanism of a surface grinding apparatus, 99 denotes a spray nozzle, and the tip of the stylus has a warp.
The dry air of 0.4 to 0.6 Mpa is blown to the portion touching the crack. Sensor unit 90 as contact detection means
Is provided to measure the distance between the surface of the inspection object (work or reference block) where the tip of the stylus comes in contact with the axis of the grinding wheel shaft. The control mechanism 98 includes a storage unit and a calculation unit.

【0022】[0022]

【実施例】実施例1 図3のワ−クの平面研削方法のフロ−図を用いて、ワ−
クを粗研削、ついで精研削する例を以下に述べる。ま
ず、平面研削装置の電源および操作盤の電源をonと
し、テ−ブルの左右方向の反転位置と前後方向の反転位
置をティ−チングする(開始)200。テ−ブル11を
左方向に移動、ついでテ−ブルを後方向に後退させた
後、図示されていないサ−ボモ−タによりボ−ルネジを
回転させることにより砥石頭22を下降させ、センサユ
ニット90のタッチプロ−ブのスタイラス91を基準ブ
ロック表面に接触させ、基準測定201を行い、テ−ブ
ル表面から基準ブロック表面間の距離Hを制御装置98
に伝達し、記憶部に記録する。
Embodiment 1 Referring to the flow chart of the method for grinding a work surface shown in FIG.
An example of rough grinding followed by fine grinding is described below. First, the power of the surface grinding apparatus and the power of the operation panel are turned on, and the table is taught 200 between the left and right reversing positions and the front and rear reversing positions (start). After moving the table 11 to the left, and then moving the table backward, the grinding wheel head 22 is lowered by rotating a ball screw with a servo motor (not shown), and the sensor unit is turned off. A stylus 91 of a touch probe 90 is brought into contact with the surface of the reference block, a reference measurement 201 is performed, and a distance H between the surface of the table and the surface of the reference block is controlled 98.
And record it in the storage unit.

【0023】砥石軸頭22を上昇させ、テ−ブル11を
前方向に前進させた後、砥石頭22を下降させ、センサ
ユニット90のスタイラス91をワ−クw表面に接触さ
せ、ワ−ク測定202を行い、テ−ブル表面からワ−ク
表面間の距離hを制御装置98に伝達し、記憶部に記録
する。
After raising the grindstone shaft head 22 and moving the table 11 forward, the grindstone head 22 is lowered and the stylus 91 of the sensor unit 90 is brought into contact with the surface of the work w, and the work is performed. The measurement 202 is performed, and the distance h between the table surface and the work surface is transmitted to the control device 98 and recorded in the storage unit.

【0024】砥石径を制御装置98に入力し、ワ−ク表
面と砥石底面の間の距離Lを制御装置の演算部で計算
し、記憶部に記録する203。または、砥石軸頭22を
上昇させ、テ−ブル11を左方向に移動させた後、砥石
軸頭22を下降させて基準ブロックに砥石底面を接触さ
せ、その際の砥石軸のY軸方向の高さをサ−ボモ−タよ
り算出させ、前記基準測定201時の砥石軸のY軸方向
の高さとの差(L)を制御装置の演算部で計算し、記憶
部に記録する203。なお、この工程は、必須ではな
い。
The diameter of the grindstone is input to the control device 98, and the distance L between the work surface and the bottom surface of the grindstone is calculated by the arithmetic unit of the control device and recorded in the storage unit 203. Alternatively, after raising the grinding wheel shaft head 22 and moving the table 11 to the left, the grinding wheel shaft head 22 is lowered to bring the bottom surface of the grinding wheel into contact with the reference block. The height is calculated by the servomotor, and the difference (L) from the height of the grinding wheel axis in the Y-axis direction at the time of the reference measurement 201 is calculated by the arithmetic unit of the control device and recorded in the storage unit 203. This step is not essential.

【0025】研削終了後のワ−クの高さ(H+β)を制
御装置に入力し、総研削取り代量αを式α=(h−H−
β)より演算して求め、これを粗研削する研削代量α1
と精研削する研削代量α2とに振り分けて粗研削する研
削代量α1を算出し、制御装置に伝達するとともに、基
準ブロック上面の高さHを基準にして粗研削加工開始位
置Y1を決定する。図5に示すように、総研削取り代量
αは粗研削代量α1と精研削代量α2とに振り分けられ、
研削終了後のワ−クの高さ(H+β)は(h−α)に等
しいこととなる。
The height (H + β) of the work after grinding is input to the controller, and the total grinding allowance α is calculated by the equation α = (h−H−
β), which is obtained by calculation from this, and the grinding allowance α 1 for rough grinding
And the grinding allowance α 1 for coarse grinding by dividing the amount into a grinding allowance α 2 for fine grinding and transmitting the same to the control device, and the rough grinding start position Y 1 based on the height H of the upper surface of the reference block. To determine. As shown in FIG. 5, the total grinding allowance amount alpha is distributed in the rough grinding allowance amount alpha 1 and fine grinding allowance amount alpha 2,
The work height (H + β) after the end of grinding is equal to (h−α).

【0026】砥石軸頭22を上昇させ、粗研削加工開始
位置Y1に砥石を移動する205(図1の左側砥石参
照)。粗研削を開始し、算出された粗研削代量α1に相
当する研削取り代の研削を行う206。テ−ブル11を
左方向に移動、ついでテ−ブルを後方向に後退させた
後、図示されていないサ−ボモ−タによりボ−ルネジを
回転させることにより砥石軸頭22を下降させ、表面が
洗浄され、乾燥空気の吹付けにより乾燥された基準ブロ
ックの表面にセンサユニットのスタイラス91を接触さ
せ、粗研削の基準測定207を行い、テ−ブル表面から
基準ブロック表面間の距離H1を制御装置98に伝達
し、記憶部に記録する。
[0026] raise the wheel spindle head 22, to move the grinding wheel to the rough grinding start position Y 1 205 (see the left grinding wheel of FIG. 1). The rough grinding is started, performs the grinding of the grinding allowance corresponding to the calculated rough grinding allowance amount alpha 1 206. After the table 11 is moved to the left and the table is retracted backward, the ball screw 22 is rotated by a servo motor (not shown) to lower the grindstone shaft head 22 so as to lower the surface. There is washed, the stylus 91 of the sensor unit on the surface of the dried reference block by blowing dry air is contacted performs reference measurement 207 of the rough grinding, Te - the distance H 1 between the reference block from the surface table surface The information is transmitted to the control device 98 and recorded in the storage unit.

【0027】砥石軸頭22を上昇させ、テ−ブル11を
前方向に前進させた後、砥石軸頭22を下降させ、表面
が洗浄され、乾燥空気の吹付けにより乾燥されたワ−ク
w表面にセンサユニット90のスタイラス91を接触さ
せ、ワ−ク測定208を行い、テ−ブル表面からワ−ク
表面間の距離h1を制御装置98に伝達し、記憶部に記
録する。
After raising the grindstone shaft head 22 and advancing the table 11 forward, the grindstone shaft head 22 is lowered to clean the surface and dry the workpiece by blowing dry air. surface contacting the stylus 91 of the sensor unit 90, word - perform click measurement 208, Te - table surface Kurrawa - it transmits the distance h 1 between click surface to the controller 98, and records in the storage unit.

【0028】精研削する取り代量α2を(h1−H1
β)式より算出するとともに、基準ブロック上面の高さ
1を基準にして精研削加工開始位置Y2を決定する20
9。
The machining allowance α 2 for fine grinding is defined as (h 1 −H 1
β), and the precise grinding start position Y 2 is determined based on the height H 1 of the upper surface of the reference block 20.
9.

【0029】砥石軸を精研削加工開始位置Y2に位置決
めする210。
[0029] The grinding wheel axis position to fine grinding machining start position Y 2 210.

【0030】精研削を開始し、算出されたα2量の切り
込み研削を行う211.テ−ブル11を左方向に移動、
ついでテ−ブルを後方向に後退させた後、図示されてい
ないサ−ボモ−タによりボ−ルネジを回転させることに
より砥石軸頭22を下降させ、表面が洗浄され、乾燥空
気の吹付けにより乾燥された基準ブロック表面にセンサ
ユニト90のスタイラス91を接触させ、精研削の基準
測定212を行い、テ−ブル表面から基準ブロック表面
間の距離Hiを制御装置98に伝達し、記憶部に記録す
る。
The fine grinding is started, and the cut grinding of the calculated α 2 amount is performed 211. Move table 11 to the left,
Then, after retracting the table in the backward direction, the wheel head 22 is lowered by rotating a ball screw with a servo motor (not shown), the surface is cleaned, and the dry air is blown. the dried reference block surface contacting the stylus 91 of Sensayunito 90 performs reference measurement 212 of fine grinding, Te - transmitted from Bull surface distance H i between the reference block surface to the controller 98, recorded in the storage unit I do.

【0031】砥石軸頭22を上昇させ、テ−ブル11を
前方向に前進させた後、砥石軸頭22を下降させ、表面
が洗浄された、乾燥空気の吹付けにより乾燥されたワ−
クw表面にセンサユニット90のスタイラス91を接触
させ、ワ−ク測定213を行い、テ−ブル表面からワ−
ク表面間の距離hiを制御装置98に伝達し、記憶部に
記録する。
The wheel head 22 is raised, and the table 11 is moved forward. Then, the wheel head 22 is lowered, and the surface is cleaned and dried by blowing dry air.
The stylus 91 of the sensor unit 90 is brought into contact with the surface of the work w, a work measurement 213 is performed, and the work
Transmitting the distance h i between the click surface to the controller 98, and records in the storage unit.

【0032】ワ−クの仕上がり寸法の値(Hi+β)を
求めるに、(hi−Hi)=βの関係を利用し、(hi
i)の値を制御装置の演算部で比較する214。(hi
−Hi)=βのときは、研削終了215とし、その時点
で精研削はテ−ブルが反転位置に戻るまで行われ、反転
位置に戻ったところで精研削が終了される。(hi
i)<βのときは、(hi−Hi−β)の量(この補正
研削量は(α-h+hi)に相当する。)更に補正の精研
削を行うことが制御装置より指示され216、補正の精
研削を行う217。
In order to obtain the value (H i + β) of the finished dimension of the work, the relationship (h i −H i ) = β is used, and (h i
The value of Hi ) is compared 214 in the arithmetic unit of the control device. (H i
When −H i ) = β, the grinding end 215 is performed, at which point fine grinding is performed until the table returns to the reversing position, and the fine grinding ends when the table returns to the reversing position. (H i
H i) <When the β, (h i -H i -β ) of the amount (the correction amount of grinding is (α-h + h i) corresponding to.) Instructed by the control device may further perform the precise grinding of correction 216, and perform precise grinding for correction 217.

【0033】補正研削217が行われ、製品寸法が算出
され、(hi−Hi=β)のときはその時点で精研削はテ
−ブルが反転位置に戻るまで行われ、反転位置に戻った
ところで補正研削が終了される215。
The correction grinding 217 is performed, the product size is calculated, the fine grinding at that time when the (h i -H i = β) Te - performed until Bull returns to reverse position, returns to the reversing position Then, the correction grinding is ended 215.

【0034】本発明の別態様として、制御装置の演算部
に補正研削の研削取り代量を算出させる工程216を制
御装置で行わず、作業者が補正研削の研削取り代量を制
御装置に入力させるときは、その入力した値が(hi
i)>βとなることを制御装置の演算部が算出したと
きにアラ−ム信号を発信する工程218を加えた変更に
する。
As another aspect of the present invention, the control unit does not perform the step 216 of causing the arithmetic unit of the control unit to calculate the grinding allowance for correction grinding, and the operator inputs the grinding allowance for correction grinding to the control unit. When the input value is (h i
When the arithmetic unit of the control device calculates that H i )> β, a step 218 of transmitting an alarm signal is added.

【0035】[0035]

【発明の効果】本発明のワ−クの平面研削方法は、テ−
ブルの温度分布の影響を受けず、寸法精度の良好な研削
ワ−クを与える。
The method for grinding a surface of a work according to the present invention is characterized in that
A grinding work with good dimensional accuracy is provided without being affected by the temperature distribution of the cable.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 平面研削装置の一部を切り欠いた正面図であ
る。
FIG. 1 is a partially cutaway front view of a surface grinding apparatus.

【図2】 センサユニットの正面図である。FIG. 2 is a front view of the sensor unit.

【図3】 本発明のワ−クの平面研削方法のフロ−図で
ある。
FIG. 3 is a flowchart of a method of surface grinding a work according to the present invention.

【図4】 研削前のワ−クの寸法と、研削取り代量と基
礎ブロックの高さの相関を示す図である。
FIG. 4 is a diagram showing the relationship between the dimensions of a work before grinding, the amount of grinding allowance, and the height of a basic block.

【図5】 平面研削装置の斜視図である。FIG. 5 is a perspective view of a surface grinding device.

【図6】 ワ−クの平面研削のフロ−線図である。FIG. 6 is a flow diagram of surface grinding of a work.

【符号の説明】[Explanation of symbols]

1 平面研削装置 W ワ−ク 11 テ−ブル 22 砥石軸頭 24 砥石 90 センサユニット 91 スタイラス 98 制御装置 100 基準ブロック DESCRIPTION OF SYMBOLS 1 Surface grinding device W work 11 Table 22 Grinding wheel shaft head 24 Grinding wheel 90 Sensor unit 91 Stylus 98 Control device 100 Reference block

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 3C029 BB06 3C034 AA07 CA04 CA12 CA13 CB01 DD12 3C043 BA01 BA12 CC03  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3C029 BB06 3C034 AA07 CA04 CA12 CA13 CB01 DD12 3C043 BA01 BA12 CC03

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 左右方向に往復移動可能なワ−クテ−ブ
ルと、前記ワ−クテ−ブルに対し前後方向に移動可能な
コラムに保持されたワ−クを加工するための砥石軸頭の
砥石軸に軸承された砥石と、該砥石軸を上下方向に昇降
可能な送り機構と、砥石を回転させる駆動機構と、砥石
軸の前後軸および上下軸の移動量を数値制御する制御機
構と、ポジショニング機能を有するワ−クテ−ブルの左
右軸とを備える平面研削装置であって、該平面研削装置
は、 ワ−クテ−ブルに対向して砥石軸頭に取り付けられた先
端にスタイラスを有するタッチプロ−ブを備えたセンサ
ユニットと、 ワ−クテ−ブル上に備えられた基準ブロックとワ−クテ
−ブルを前後方向に所定量移動させ、タッチプロ−ブの
スタイラスを基準ブロック上面に接触させた際に、接触
したことを検知する接触検知手段と、その接触した際の
ワ−クテ−ブルから基準ブロック上面までの高さHi
記憶する記憶部と、 ワ−クテ−ブルを左右方向に所定量移動させ、タッチプ
ロ−ブのスタイラスをワ−ク上面に接触させた際に、接
触したことを検知する接触検知手段と、その接触した際
のワ−クテ−ブルからワ−ク上面までの高さhiを記憶
する記憶部と、 制御装置に入力された、研削終了後の所望の加工ワ−ク
の高さ(H+β)を記憶する記憶部と、および、 前記記憶部に記憶されたhiとHiの差に基づき、研削す
る取り代量αを算出する演算手段と、を有することを特
徴とする平面研削装置。
1. A worktable reciprocally movable in the left-right direction, and a grindstone shaft head for processing a work held on a column movable in the front-rear direction with respect to the worktable. A grindstone supported on a grindstone shaft, a feed mechanism capable of moving the grindstone shaft up and down, a drive mechanism for rotating the grindstone, and a control mechanism for numerically controlling the amount of movement of the front and rear axes of the grindstone shaft and the vertical axis, A surface grinding device having a left and right axis of a worktable having a positioning function, said surface grinding device having a stylus at a tip attached to a whetstone shaft head opposite to the worktable. The sensor unit having the probe, the reference block provided on the worktable and the worktable are moved in the front-rear direction by a predetermined amount, and the stylus of the touch probe is brought into contact with the upper surface of the reference block. Contact A contact detection means for detecting that the sum of upon its contact - Kute - a storage unit for storing the height H i of the table to the reference block top surface, Wa - Kute - by a predetermined amount of movement of the table in the lateral direction Contact detecting means for detecting the contact when the stylus of the touch probe is brought into contact with the upper surface of the work, and the height h from the work table to the upper surface of the work when the contact is made; a storage unit for storing i , a storage unit for storing a desired height (H + β) of the machining work after the completion of the grinding, and a h i stored in the storage unit. based on a difference H i, surface grinding apparatus characterized by comprising calculating means for calculating an allowance amount α grinding, the.
【請求項2】 センサユニットは、砥石軸頭の側面に配
置され、基準ブロックは、ワ−クテ−ブル上に載置され
たワ−クの前側側端から0〜100mm以内に設置され
ることを特徴とする、請求項1に記載の平面研削装置。
2. A sensor unit is disposed on a side surface of a grinding wheel shaft head, and a reference block is installed within 0 to 100 mm from a front end of a work placed on a work table. The surface grinding apparatus according to claim 1, wherein:
【請求項3】 平面研削装置のワ−クテ−ブルの左右方
向の反転位置と、コラムの前後方向の反転位置と、研削
加工された後の所望のワ−ク厚み(H+β)を制御装置
に入力し、 コラムを前後方向に所定量移動させ、タッチプロ−ブの
スタイラスを基準ブロック上面に接触させてワ−クテ−
ブルから基準ブロック上面までの高さHを測定し、 ついで、ワ−クテ−ブルを左右方向に所定量移動させ、
タッチプロ−ブのスタイラスをワ−ク上面に接触させて
ワ−クテ−ブルからワ−ク上面までの高さhを測定し、
総研削代量αをα=(h−H−β)と算出し、この総研
削代量αを粗研削取り代量α1と精研削取り代量α2に制
御装置で振り分け、粗研削する取り代量α1を算出する
とともに、基準ブロック上面の高さHを基準にして粗研
削加工開始位置Y1を決定し、 砥石軸を粗研削加工開始位置Y1に位置決めし、粗研削
を行った後、 コラムを前後方向に所定量移動させ、タッチプロ−ブの
スタイラスを基準ブロック上面に接触させてワ−クテ−
ブルから基準ブロック上面までの高さH1を測定し、 ついで、ワ−クテ−ブルを左右方向に所定量移動させ、
タッチプロ−ブのスタイラスをワ−ク上面に接触させて
ワ−クテ−ブルからワ−ク上面までの高さh1を測定
し、 精研削する取り代量α2を(h1−H1−β)式より算出
するとともに、基準ブロック上面の高さHiを基準にし
て精研削加工開始位置Y2を決定し、 砥石軸を精研削加工開始位置Y2に位置決めし、精研削
を行った後、 コラムを前後方向に所定量移動させ、タッチプロ−ブの
スタイラスを基準ブロック上面に接触させてワ−クテ−
ブルから基準ブロック上面までの高さHiを測定し、 ついで、ワ−クテ−ブルを左右方向に所定量移動させ、
タッチプロ−ブのスタイラスをワ−ク上面に接触させて
ワ−クテ−ブルからワ−ク上面までの高さhiを測定
し、 ワ−クの仕上がり寸法(hi−Hi)の値を演算し、 (hi−Hi)=βのときは、研削終了とし、 (hi−Hi)<βのときは、(hi−Hi−β)の量更に
補正の精研削を行うことを制御装置に入力し、補正研削
を行うことを特徴とするワ−クの研削方法。
3. A control device is provided with a left and right reversal position of a work table of a surface grinding device, a reversal position of a column in a front and rear direction, and a desired work thickness (H + β) after grinding. Input, move the column in the forward and backward direction by a predetermined amount, and touch the stylus of the touch probe to the upper surface of the reference block to make the work
The height H from the table to the upper surface of the reference block is measured. Then, the work table is moved in the left and right direction by a predetermined amount.
The stylus of the touch probe is brought into contact with the upper surface of the work, and the height h from the work table to the upper surface of the work is measured.
The total grinding allowance amount alpha alpha = calculated to (h-H-β), distributed by the control unit the total grinding allowance amount alpha in the rough grinding allowance amount alpha 1 and fine grinding allowance amount alpha 2, to rough grinding to calculate the allowance amount alpha 1, the reference block upper surface height H with respect to determining the rough grinding start position Y 1, to position the wheel spindle to the rough grinding start position Y 1, a rough grinding performed After that, the column is moved in the front-rear direction by a predetermined amount, and the stylus of the touch probe is brought into contact with the upper surface of the reference block to make the work table.
The height H 1 to the reference block top surface measured from Bull, then word - Kute - by a predetermined amount of movement of the table in the lateral direction,
Touch Pro - Bed stylus a word - word into contact with the click top - Kute - table Kurrawa - measuring the height h 1 to click a top surface, a machining allowance amount alpha 2 to fine grinding (h 1 -H 1 to calculate than-beta) type, and the reference block upper surface height H i to the reference to determine the fine grinding start position Y 2, to position the wheel spindle in seminal grinding start position Y 2, subjected to fine grinding After that, the column is moved in the front-rear direction by a predetermined amount, and the stylus of the touch probe is brought into contact with the upper surface of the reference block to make the work table.
The height H i from the cable to the upper surface of the reference block is measured. Then, the work table is moved in the left and right direction by a predetermined amount.
Touch Pro - Bed stylus a word - word into contact with the click top - Kute - table Kurrawa - measuring the height h i of up click top, word - the value of the click of the finished dimension (h i -H i) calculating a, when the (h i -H i) = β , and grinding ends, (h i -H i) <when beta is the amount further correction of fine grinding (h i -H i -β) Performing a correction grinding on a workpiece.
【請求項4】 ベッドに対し、左右方向および前後方向
に往復移動可能なワ−クテ−ブルと、前記ワ−クテ−ブ
ルに対し上方に設けられた砥石軸頭の砥石軸に軸承され
た砥石と、該砥石軸を上下方向に昇降可能な送り機構
と、砥石を回転させる駆動機構と、ワ−クテ−ブルの左
右軸および前後軸並びに砥石軸の上下軸の移動量を数値
制御する制御機構とを有する平面研削装置であって、該
平面研削装置は、 ワ−クテ−ブルに対向して砥石軸頭に取り付けられた先
端にスタイラスを有するタッチプロ−ブを備えたセンサ
ユニットと、 ワ−クテ−ブル上に備えられた基準ブロックとワ−クテ
−ブルを前後方向に所定量移動させ、タッチプロ−ブの
スタイラスを基準ブロック上面に接触させた際に、接触
したことを検知する接触検知手段と、その接触した際の
ワ−クテ−ブルから基準ブロック上面までの高さHi
記憶する記憶部と、 ワ−クテ−ブルを左右方向に所定量移動させ、タッチプ
ロ−ブのスタイラスをワ−ク上面に接触させた際に、接
触したことを検知する接触検知手段と、その接触した際
のワ−クテ−ブルからワ−ク上面までの高さhiを記憶
する記憶部と、 制御装置に入力された、研削終了後の所望の加工ワ−ク
の高さ(H+β)を記憶する記憶部と、および、 前記記憶部に記憶されたhiとHiの差に基づき、研削す
る取り代量αを算出する演算手段と、を有することを特
徴とする平面研削装置。
4. A worktable reciprocally movable in a left-right direction and a front-rear direction with respect to a bed, and a grindstone supported on a grindstone shaft of a grindstone shaft head provided above the worktable. A feed mechanism capable of moving the grindstone shaft up and down, a drive mechanism for rotating the grindstone, and a control mechanism for numerically controlling the amount of movement of the left and right axes and the front and rear axes of the worktable and the vertical axis of the grindstone axis. A surface grinding device comprising: a sensor unit having a touch probe having a stylus at a tip attached to a grinding wheel shaft head facing a work table; and When the reference block and the work table provided on the table are moved by a predetermined amount in the front-rear direction and the stylus of the touch probe is brought into contact with the upper surface of the reference block, contact detection is performed to detect the contact. Means and their connections The time of Wa - Kute - a storage unit for storing the height H i to the reference block upper surface from Bull, word - Kute - Bull in the lateral direction is moved by a predetermined amount, the touch pro - word the blanking stylus - click top when in contact with the a contact detecting means for detecting that contact, the sum of upon its contact - Kute - Bull Kurrawa - a storage unit for storing the height h i of up click top, input to the control device is, desired processing word after grinding completion - a storage unit which stores the click height (H + beta), and, based on the difference h i and H i stored in the storage unit, allowance amount taken to grind a surface grinding device comprising: a calculating means for calculating α.
【請求項5】 平面研削装置のワ−クテ−ブルの左右方
向の反転位置および前後方向の反転位置と、研削加工さ
れた後の所望のワ−ク厚み(H+β)を制御装置に入力
し、 ワ−クテ−ブルを前後方向に所定量移動させ、タッチプ
ロ−ブのスタイラスを基準ブロック上面に接触させてワ
−クテ−ブルから基準ブロック上面までの高さHを測定
し、 コラムを前後方向に所定量移動させ、タッチプロ−ブの
スタイラスを基準ブロック上面に接触させてワ−クテ−
ブルから基準ブロック上面までの高さHを測定し、 ついで、ワ−クテ−ブルを左右方向に所定量移動させ、
タッチプロ−ブのスタイラスをワ−ク上面に接触させて
ワ−クテ−ブルからワ−ク上面までの高さhを測定し、
総研削代量αをα=(h−H−β)と算出し、この総研
削代量αを粗研削取り代量α1と精研削取り代量α2に制
御装置で振り分け、粗研削する取り代量α1を算出する
とともに、基準ブロック上面の高さHを基準にして粗研
削加工開始位置Y1を決定し、 砥石軸を粗研削加工開始位置Y1に位置決めし、粗研削
を行った後、 ワ−クテ−ブルを前後方向に所定量移動させ、タッチプ
ロ−ブのスタイラスを基準ブロック上面に接触させてワ
−クテ−ブルから基準ブロック上面までの高さH1を測
定し、 ついで、ワ−クテ−ブルを左右方向に所定量移動させ、
タッチプロ−ブのスタイラスをワ−ク上面に接触させて
ワ−クテ−ブルからワ−ク上面までの高さh1を測定
し、 精研削する取り代量α2を(h1−H1−β)式より算出
するとともに、基準ブロック上面の高さHiを基準にし
て精研削加工開始位置Y2を決定し、 砥石軸を精研削加工開始位置Y2に位置決めし、精研削
を行った後、 ワ−クテ−ブルを前後方向に所定量移動させ、タッチプ
ロ−ブのスタイラスを基準ブロック上面に接触させてワ
−クテ−ブルから基準ブロック上面までの高さHiを測
定し、 ついで、ワ−クテ−ブルを左右方向に所定量移動させ、
タッチプロ−ブのスタイラスをワ−ク上面に接触させて
ワ−クテ−ブルからワ−ク上面までの高さhiを測定
し、 ワ−クの仕上がり寸法(hi−Hi)の値を演算し、 (hi−Hi)=βのときは、研削終了とし、 (hi−Hi)<βのときは、(hi−Hi−β)の量更に
補正の精研削を行うことを制御装置に入力し、補正研削
を行うことを特徴とするワ−クの研削方法。
5. A control device is supplied with a left-right reversal position and a front-rear reversal position of a work table of a surface grinding device, and a desired work thickness (H + β) after the grinding process. Move the worktable in the front-rear direction by a predetermined amount, bring the stylus of the touch probe into contact with the upper surface of the reference block, measure the height H from the worktable to the upper surface of the reference block, and move the column in the front-rear direction. And move the stylus of the touch probe into contact with the top surface of the reference block.
Measure the height H from the table to the top surface of the reference block. Then, move the work table in the left and right direction by a predetermined amount.
The stylus of the touch probe is brought into contact with the upper surface of the work, and the height h from the work table to the upper surface of the work is measured.
The total grinding allowance amount alpha alpha = calculated to (h-H-β), distributed by the control unit the total grinding allowance amount alpha in the rough grinding allowance amount alpha 1 and fine grinding allowance amount alpha 2, to rough grinding to calculate the allowance amount alpha 1, the reference block upper surface height H with respect to determining the rough grinding start position Y 1, to position the wheel spindle to the rough grinding start position Y 1, a rough grinding performed after, Wa - Kute - Bull in the longitudinal direction is moved by a predetermined amount, the touch pro - the blanking of the stylus is brought into contact with the reference block top surface Wa - Kute - measuring the height H 1 from bull to the reference block upper surface, Then, the work table is moved in the left and right direction by a predetermined amount,
Touch Pro - Bed stylus a word - word into contact with the click top - Kute - table Kurrawa - measuring the height h 1 to click a top surface, a machining allowance amount alpha 2 to fine grinding (h 1 -H 1 to calculate than-beta) type, and the reference block upper surface height H i to the reference to determine the fine grinding start position Y 2, to position the wheel spindle in seminal grinding start position Y 2, subjected to fine grinding after, Wa - Kute - Bull in the longitudinal direction is moved by a predetermined amount, the touch pro - the blanking of the stylus is brought into contact with the reference block top surface Wa - Kute - measuring the height H i of the table to the reference block upper surface, Then, the work table is moved in the left and right direction by a predetermined amount,
Touch Pro - Bed stylus a word - word into contact with the click top - Kute - table Kurrawa - measuring the height h i of up click top, word - the value of the click of the finished dimension (h i -H i) calculating a, when the (h i -H i) = β , and grinding ends, (h i -H i) <when beta is the amount further correction of fine grinding (h i -H i -β) Performing a correction grinding on the workpiece.
JP2000239248A 2000-08-08 2000-08-08 Surface grinding device and work grinding method Pending JP2002052444A (en)

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