JP2002050474A - Preparation method of el panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a preparation method of an EL panel wherein a plate making is unnecessary. SOLUTION: This is the preparation method wherein the first and the second comb-shaped electrodes 20A, 20B are installed in parallel on a surface of printed- circuit board 13 and wherein a dielectric layer 15 is formed on the printed-circuit board 13 and covers these first and second comb-shaped electrodes 20A, 20B and wherein a luminous layer 16 is formed on this dielectric layer 15, and the dielectric layer 15 and the luminous layer 16 are formed by heat transcription.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an EL panel having an electrode formed on a surface of a substrate, a dielectric layer formed on the electrode, and a light emitting layer formed on the dielectric layer. About the method.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG.
There is known an EL panel 7 in which a transparent electrode 2 is formed, a light emitting layer 3 and a dielectric layer 4 are formed on the transparent electrode 2, and a back electrode 5 of an aluminum sheet is provided on the dielectric layer 4. In addition, 6 is a protective film.

In the EL panel 7, as shown in FIG. 15, when only the pictures P1, P2 and the characters M1 to M3 drawn on the support 1 are displayed by light emission, the pictures P1, P2 and the letters M1 to M3 are displayed.
The dielectric layer 4 and the light-emitting layer 5 conforming to the shape of the above are formed on the back electrode 5 of the aluminum sheet by plate making for silk printing.

[0004]

In such an EL panel 7, it is necessary to make a plate for silk printing, especially when the luminescent color is changed for each of the patterns P1, P2 and the characters M1 to M3. The number of plates corresponding to each of the patterns P1, P2 and the characters M1 to M3 must be created. For this reason, many steps are required, and there has been a problem that the cost is increased.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for producing an EL panel which does not require plate making.

[0006]

Means for Solving the Problems To achieve the above object, the invention of claim 1 provides a substrate having electrodes formed on a surface thereof.
A method for producing an EL panel in which a dielectric layer is formed on the electrode and a light emitting layer is formed on the dielectric layer, wherein the dielectric layer and the light emitting layer are formed by transfer.

According to a second aspect of the present invention, the dielectric layer and the light emitting layer are formed by thermal transfer of a thermal transfer ribbon having a heat transferable light emitting layer formed on a surface of a ribbon substrate and a heat transferable dielectric layer formed on the heat transferable light emitting layer. It is characterized by having been formed.

According to a third aspect of the present invention, the dielectric layer is formed by thermal transfer of a first thermal transfer ribbon having a thermal transferable dielectric layer formed on the surface of a ribbon base material, and a heat transferable luminescent layer is formed on the surface of the ribbon base material. The light emitting layer is formed by thermal transfer of a second thermal transfer ribbon.

According to a fourth aspect of the present invention, there is provided a method of manufacturing an EL panel, comprising: forming a dielectric layer on an electrode on a substrate having an electrode formed on a surface thereof; and forming a light emitting layer on the dielectric layer. A light emitting layer and a dielectric layer are formed on a sheet by a printer, and the light emitting layer and the dielectric layer formed on the sheet are formed on the surface of the substrate by thermal transfer.

A fifth aspect of the present invention is a method of manufacturing an EL panel, comprising: forming a dielectric layer on the two electrodes on a substrate having electrodes formed on a surface thereof; and forming a light emitting layer on the dielectric layer.
The dielectric layer and the light emitting layer are formed by an inkjet printer.

According to a sixth aspect of the present invention, there is provided a method of manufacturing an EL panel, comprising: forming a dielectric layer on the two electrodes on a substrate having electrodes formed on a surface thereof; and forming a light emitting layer on the dielectric layer.
The dielectric layer and the light emitting layer are formed by pressing a cutting sheet having the dielectric layer and the light emitting layer.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for manufacturing an EL panel according to the present invention will be described below with reference to the drawings. [First Embodiment] In FIG. 1, reference numeral 10 denotes an EL panel produced by the production method of the present invention. On the display surface 11 of the EL panel 10, pictures A1 to A5 are printed.

As shown in FIG. 2, the EL panel 10 includes a printed wiring board (substrate) 13 and a plurality of comb electrodes 20 formed on the printed wiring board 13 (surface).
A dielectric layer 15 covering the comb electrode 20 and the printed wiring board 13; a light emitting layer 16 formed on the dielectric layer 15; And a sheet 17 attached so as to cover the entire surface. The pictures A1 to A5 are printed on the sheet 17.

As shown in FIG. 3, the surface of the printed wiring board 13 is divided into 24 segments B1 to B24 arranged in a matrix. As shown in FIG. 4, a first comb electrode (first electrode) 2
A comb electrode 20 composed of 0A and a second comb electrode (second electrode) 20B is formed. This comb electrode 20
Are formed by etching.

The first comb electrode 20A is vertically moved (FIG. 4).
) And the electrode portion 20Aa
And a plurality of comb electrode portions 20Ab extending parallel to the right from Aa.

The second comb electrode 20B is vertically moved (FIG. 4).
) And the electrode portion 20Ba
It has a plurality of comb electrode portions 20Bb extending in parallel from Ba to the right, and the comb electrode portions 20Ab and the comb electrode portions 20Bb are alternately arranged in parallel. That is, the comb electrode portion 20Ab and the comb electrode portion 20Bb are arranged side by side.

The distance between the comb electrode portions 20Ab and 20b is about 100 microns, and the width of the comb electrodes 20Ab and 20Bb is about 100 microns.

Similarly, in each of the segments B2 to B24, a squib electrode 20 including a first squib electrode (first electrode) 20A and a second squib electrode (second electrode) 20B is formed.

Each segment B1 is located between the first comb electrode 20A and the second comb electrode 20B of each segment B1 to B24.
.. B24 can be applied independently of each other.

On the surface of the printed wiring board 13,
As shown in FIG. 3, the first and second patterns are adjusted according to the patterns A1 to A5.
Dielectric layers 15a to 15e covering comb electrodes 20A and 20B
Are formed. That is, the EL panel electrode substrate 5
The dielectric layers 15a to 15e are formed on 0 in accordance with the patterns A1 to A5. The light emitting layer 1 is formed on the dielectric layers 15a to 15e.
6a to 16e are formed. For example, segment B9
As shown in FIG. 5, the first and second kushiba electrodes 20A, 2A
The light emitting layer 16b is formed on the dielectric layer 15b which covers OB and the dielectric layer 15b.

The dielectric layer 15 and the light emitting layer 16 are formed by thermally transferring the heat transferable dielectric (heat transferable dielectric layer) 31 and the heat transferable light emitting body (heat transferable light emitting layer) 41 of the heat transfer ribbons 30 and 40 shown in FIGS. It is formed by thermal transfer using a printer (not shown).

The heat transfer ribbons 30 and 40 are
The heat transferable dielectric material 31 and the heat transferable light emitting material 4
2 was obtained by coating.

The heat transferable dielectric 31 is, for example, a mixture of a dielectric of barium titanium oxide and a binder soluble in an organic solvent such as polyester resin. The heat transferable light emitting body 42 is a mixture of, for example, zinc oxide + manganese oxide and an organic solvent-soluble binder such as an epoxy resin.

The order of producing the EL panel 10 is as follows. First, the comb electrode 20 is formed on the surface of the printed wiring board 13, and then the dielectric layer 15 and the light emitting layer 16 are formed on the surface by a thermal transfer printer. Finally, the sheet 17 is attached.

As described above, since the dielectric layer 15 and the light emitting layer 16 are formed by the thermal transfer printer, the dielectric layer 15 and the light emitting layer 16 of a picture or a character having a free shape can be formed by printing. It can be easily formed in a short time. That is, plate making is not required, and an inexpensive EL panel 10 can be manufactured in a small number of steps.

The EL panel 10 produced as described above
When an AC voltage is applied between the first comb electrode 20A and the second comb electrode 20B, an AC current flows in a direction indicated by a broken line as shown in FIG. 2, and the AC current causes the light emitting layer 16 to be indicated by a solid arrow. To emit light.

Each segment B6 to B10, B12, B13, B15 to
By controlling the AC voltage applied to the comb electrode 20 for each of B17, B21 and B22, the light emitting layer 16a of each of the patterns A1 to A5 is controlled.
To 16e can emit light independently of each other. That is, light can be emitted independently for each of the pictures A1 to A5, and the pictures A1 to A5 can be made to emit light in a free light emission pattern.

In the above-described embodiment, the segment is divided into 24 segments, but it is a matter of course that the segment may be a 16 × 16 segment. [Second Embodiment] FIG. 9 and FIG.
Is a diagram illustrating a second embodiment of the method for creating a sword.

In the first step, the thermal transfer dielectric 31 of the thermal transfer ribbon 30 shown in FIG. 9A is thermally transferred to a transfer sheet 60 by a thermal transfer printer (not shown) as shown in FIG. 9B. In the second step, the transfer sheet 60 is placed on the printed wiring board 13 on which the first and second squib electrodes 20A and 20B are formed, and as shown in FIG. The heat roller 61 is rolled to transfer the heat transferable dielectric 31 of the transfer sheet 60 to the printed circuit board 1.
3 and a dielectric layer 15 is formed on the printed wiring board 13 as shown in FIG.

In the third step, the thermal transfer light emitting element 41 of the thermal transfer ribbon 40 shown in FIG. 10A is transferred by a thermal transfer printer (not shown) as shown in FIG.
5 is thermally transferred. In the fourth step, the transfer sheet 65
Is placed on the printed wiring board 13 on which the dielectric layer 15 is formed, and the heat roller 61 is rolled over the transfer sheet 65 to thermally transfer the heat transferable luminous body 41 of the transfer sheet 65.
As shown in FIG. 10D, the light emitting layer 16 is formed on the dielectric layer 15.
Is formed.

According to the method of the second embodiment, the same effect as that of the first embodiment can be obtained, and also, the thermal head of the thermal transfer printer is damaged by the unevenness of the first and second comb electrode 20A, 20B. Nothing. Third Embodiment In the third embodiment, the dielectric layer 15 and the light emitting layer 16 are formed by an ink jet printer. In this case, the ink for forming the dielectric layer 15 is
As in the case of forming by silk printing, for example, a material obtained by dissolving a barium titanate as a main material and a polyester resin as a binder with an ethylene-based organic solvent,
As the ink for forming the light emitting layer 16, for example, a material obtained by dissolving zinc oxide and manganese as a main material and a polyester resin as a binder in an ethylene-based organic solvent is used.

According to the third embodiment, since the dielectric layer 15 and the light emitting layer 16 are formed by the ink jet printer, the same effects as in the first embodiment can be obtained. Fourth Embodiment FIGS. 11 and 12 show a fourth embodiment. In the fourth embodiment, the dielectric layer 15 and the light emitting layer 16 are formed by using the cutting sheets 70 and 80.
Is formed. Below, cutting sheet 7
A method for forming the dielectric layer 15 and the light emitting layer 16 using 0,80 will be described.

First, as shown in FIG.
The cutting sheet 70 having the dielectric layer 15 is placed on the printed wiring board 13 on which the second comb electrode 20A, 20B is formed, and the cutting sheet 70 is pressed against the printed wiring board 13. By this pressure bonding, the dielectric layer 15 of the cutting sheet 70 is changed to the first and second squib electrodes 20A, 20A of the printed wiring board 13 as shown in FIG.
Transfer onto OB.

Next, as shown in FIG. 12A, the light emitting layer 1 is placed on the printed wiring board 13 on which the dielectric layer 15 has been transferred.
The cutting sheet 80 having the number 6 is placed, and the cutting sheet 80 is pressed against the printed wiring board 13. The light emitting layer 1 of the cutting sheet 80 is formed by this pressing.
6 is transferred onto the dielectric layer 15 as shown in FIG.

In the fourth embodiment, the cutting sheet 70 having the dielectric layer 15 and the cutting sheet 80 having the light emitting layer 16 form the dielectric layer 15 and the light emitting layer 1.
6, the dielectric layer 15 and the light emitting layer 16 may be formed by one cutting sheet having the dielectric layer and the light emitting layer. [Fifth Embodiment] FIG. 13 shows a fifth embodiment of the method of manufacturing the EL panel 100.

This EL panel 100 is, as in the prior art,
A back electrode 102 is formed on a support material sheet 101,
On this back electrode 102, a dielectric layer 103 is formed. Further, a light emitting layer 104 is formed on the dielectric layer 103, a transparent electrode 105 is formed on the light emitting layer 104, and a transparent sheet 106 on which a pattern or the like is printed is attached on the transparent electrode 105. .

The dielectric layer 103 and the light emitting layer 104 are formed by thermal transfer as in the first or second embodiment.

In the fifth embodiment, as in the first and second embodiments, the dielectric layer 103 and the light-emitting layer 104 of a free-form picture or character can be formed by printing, which is very simple. Can be formed in a short time,
An inexpensive EL panel 100 can be manufactured with a small number of steps.

In the fifth embodiment, the dielectric layer 103 and the light emitting layer 104 are formed by thermal transfer, but may be formed by an ink jet printer.

Further, the dielectric layer 103 and the light emitting layer 104 may be formed by a cutting sheet as in the fourth embodiment.

[0041]

According to the present invention, plate making becomes unnecessary.
An inexpensive EL panel can be manufactured with a small number of steps.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an EL panel produced by a production method of the present invention.

FIG. 2 is a partially enlarged sectional view showing a configuration of the EL panel of FIG.

FIG. 3 is an explanatory diagram showing a printed circuit board used for the EL panel of FIG. 1;

FIG. 4 is an explanatory view showing a comb electrode formed on the printed circuit board of FIG. 3;

FIG. 5 is an explanatory diagram showing a dielectric layer and a light emitting layer formed on a comb electrode.

FIG. 6 is an explanatory diagram showing a configuration of an ink ribbon for a dielectric layer.

FIG. 7 is an explanatory diagram showing a configuration of an ink ribbon for a light emitting layer.

FIG. 8 is an explanatory diagram showing a configuration of an ink ribbon forming a dielectric layer and a light emitting layer.

FIG. 9A is an explanatory diagram of an ink ribbon having a heat transferable dielectric. (B) It is explanatory drawing which showed the state in which the dielectric material was thermally transferred to the transfer sheet. (C) is an explanatory view showing a method of thermally transferring a dielectric of a transfer sheet onto a printed wiring board; (D) is an explanatory view showing a state where a dielectric layer is formed on a printed wiring board;

FIG. 10A is an explanatory diagram of an ink ribbon having a heat transferable luminous body. (B) is an explanatory view showing a state in which the heat transferable luminous body is thermally transferred to the transfer sheet. (C) It is explanatory drawing which showed the method of thermally transferring the heat transferable luminous body of a transfer sheet on a printed wiring board. (D) is an explanatory view showing a state in which a light emitting layer is formed on a dielectric layer of a printed wiring board;

FIG. 11A is an explanatory view showing a state in which a cutting sheet having a light emitting layer is placed on a printed wiring board. (B) It is explanatory drawing which showed the state in which the light emitting layer was formed on the printed wiring board by crimping of the cutting sheet.

FIG. 12A is an explanatory view showing a state in which a cutting sheet having a dielectric layer is placed on a printed wiring board on which a light emitting layer is formed. FIG. 4B is an explanatory view showing a state in which a dielectric is formed on the light emitting layer of the printed wiring board by pressing the cutting sheet.

FIG. 13 is an explanatory diagram showing a fifth embodiment.

FIG. 14 is an explanatory diagram showing a configuration of a conventional EL panel.

FIG. 15 is an explanatory diagram showing a conventional EL panel.

[Explanation of symbols]

 13 Printed wiring board (substrate) 20A First squib electrode (first electrode) 20B Second squib electrode (second electrode) B1 to B24 segment

Claims (6)

[Claims] 1. A method for manufacturing an EL panel, comprising: forming a dielectric layer on an electrode on a substrate having an electrode formed on a surface thereof, and forming a light emitting layer on the dielectric layer; Forming an EL panel by transfer. 2. The thermal transfer light emitting device according to claim 1, wherein the heat transferable light emitting layer is formed on the surface of the ribbon base material, and the heat transferable dielectric layer is formed on the heat transferable light emitting layer. The method for producing an EL panel according to claim 1, wherein 3. A second thermal transfer ribbon having a heat transferable dielectric layer formed on the surface of a ribbon base material, the dielectric layer formed by thermal transfer of the first heat transfer ribbon, and a heat transferable light emitting layer formed on the surface of the ribbon base material. 2. The method according to claim 1, wherein the light emitting layer is formed by thermal transfer. 4. A method for manufacturing an EL panel, comprising: forming a dielectric layer on an electrode on a substrate having an electrode formed on a surface thereof; and forming a light emitting layer on the dielectric layer, wherein the EL panel is formed on a sheet by a thermal transfer printer. A method for producing an EL panel, comprising: forming a light emitting layer and a dielectric layer; and forming the light emitting layer and the dielectric layer formed on the sheet on the surface of the substrate by thermal transfer. 5. A method for manufacturing an EL panel, comprising: forming a dielectric layer on two electrodes on a substrate having electrodes formed on a surface thereof; and forming a light emitting layer on the dielectric layer. A method for producing an EL panel, wherein the layer is formed by an inkjet printer. 6. A method for producing an EL panel, comprising: forming a dielectric layer on two electrodes on a substrate having electrodes formed on a surface thereof; and forming a light emitting layer on the dielectric layer. Forming the dielectric layer and the light emitting layer by pressure bonding of a cutting sheet having the following.