JP2002046071A - Segmented structure of diamond blade - Google Patents

Segmented structure of diamond blade

Info

Publication number
JP2002046071A
JP2002046071A JP2000232160A JP2000232160A JP2002046071A JP 2002046071 A JP2002046071 A JP 2002046071A JP 2000232160 A JP2000232160 A JP 2000232160A JP 2000232160 A JP2000232160 A JP 2000232160A JP 2002046071 A JP2002046071 A JP 2002046071A
Authority
JP
Japan
Prior art keywords
diamond
segment
particles
chip
embedded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000232160A
Other languages
Japanese (ja)
Other versions
JP3539679B2 (en
Inventor
Seiya Ogata
誠也 緒方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Co Ltd
Noritake Diamond Industries Co Ltd
Original Assignee
Noritake Co Ltd
Noritake Diamond Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritake Co Ltd, Noritake Diamond Industries Co Ltd filed Critical Noritake Co Ltd
Priority to JP2000232160A priority Critical patent/JP3539679B2/en
Publication of JP2002046071A publication Critical patent/JP2002046071A/en
Application granted granted Critical
Publication of JP3539679B2 publication Critical patent/JP3539679B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Polishing Bodies And Polishing Tools (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a segmented structure of a stable and sharp diamond blade without shortening its service life, in solving the problems of the initial sharpness and the grain replacement of a diamond blade product. SOLUTION: Grains approximately equal in diameter to diamond abrasives and having a Knoop hardness of 2500 Kg/mm2 or less at room temperature, made from a material with a melting point higher than a temperature for baking segment chips 2 mounted to the outer periphery of a disc-shaped stock 1, are buried in a cutting surface on the outer periphery of each diamond chip 2 up to a depth that is 1 to 3 times the grain diameter, as measured from the surface of the cutting surface. The ratio of the number of diamond abrasives to that of grains buried is from 2:1 to 1:4. The grains buried are geometrically arranged in this ratio on the outer peripheral surface of each segment chip.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、コンクリート、ア
スファルト、石材などの切断に用いるダイヤモンドブレ
ードのセグメント構造に関する。
The present invention relates to a diamond blade segment structure used for cutting concrete, asphalt, stone and the like.

【0002】[0002]

【従来の技術】これらの用途に用いるダイヤモンドブレ
ードはスール製円盤の外周にセグメントチップを装着し
た構造を有するもので、鉄筋入りのコンクリートや硬質
石材などを切断した際、台やモンド砥材が衝撃や発熱に
より劣化をきたし切刃が鈍化して切味が低下する。
2. Description of the Related Art Diamond blades used in these applications have a structure in which segment chips are attached to the outer periphery of a sour disk. When cutting concrete or hard stone with reinforced steel, the table or mond abrasive is subject to impact. Deterioration is caused by heat and heat, and the cutting edge is dulled to lower the sharpness.

【0003】切味を維持するためには、ダイヤモンド砥
材を保持している結合剤が摩耗することで、劣化したダ
イヤモンド砥材が脱落し、新たにセグメントチップ中の
ダイヤモンドが出現する、いわゆる目替りが繰替えされ
ることが必要である。
In order to maintain the sharpness, when the binder holding the diamond abrasive material is worn, the deteriorated diamond abrasive material falls off, and the diamond in the segment chip newly appears. It is necessary that the change be repeated.

【0004】一般に、正常な目替りでは切れ刃として働
く劣化していない完全な砥材、破砕したり摩耗した砥
材、および脱落した砥材の割合は、1:1:1である。
[0004] Generally, the ratio of undeteriorated perfect abrasive, crushed or worn abrasive, and dropped abrasive that acts as a cutting edge in a normal change is 1: 1: 1.

【0005】新品時は結合剤をグラインダーなどで強制
的に除去し、ダイヤモンドを露出させるため、完全砥粒
の割合が目替り後よりも多い。このため、新品時は砥粒
に加わる力が分散され、切断を続けるとダイヤモンド砥
材の破砕や摩耗は進行するものの、脱落には至らず、劣
化した砥材が表面に数多く残る所謂目つぶれ状態になり
切味が持続しないことがある。
[0005] When new, the binder is forcibly removed with a grinder or the like to expose the diamond, so that the percentage of completely abrasive grains is greater than after replacement. For this reason, when new, the force applied to the abrasive grains is dispersed, and if cutting continues, the diamond abrasive material will be crushed or worn, but it will not fall off, and a lot of deteriorated abrasive material will remain on the surface, a so-called blind state And the sharpness may not last.

【0006】従来においては、次のことが提案されてい
る。特開昭64-45574号公報には、アルミナ、炭
化珪素等ダイヤモンドとほぼ同じ粒径の粒子を5〜40
容量%添加することが開示されている。特開平9-10
3916号公報には、100μm程度までの黒鉛粒子を
添加することが開示されている。特許第2994466
号明細書には、超砥粒を含む研磨セグメントと超砥粒を
含まないセグメントとを区画して取り付けること、ま
た、超砥粒以外の第2の研磨剤を含むことが開示されて
いる。いずれの発明も砥材層外周面に着目したものでは
なく、本発明の外周部分の砥材数の調整とは別の目的で
あり、新品初期の砥材数の調整には効果がない。
Conventionally, the following has been proposed. JP-A-64-45574 discloses that particles having a particle size substantially the same as diamond, such as alumina and silicon carbide, are 5 to 40 particles.
It is disclosed to add% by volume. JP 9-10
Japanese Patent No. 3916 discloses that graphite particles of up to about 100 μm are added. Patent No. 2994466
The specification discloses that a polishing segment containing superabrasive grains and a segment not containing superabrasive grains are partitioned and attached, and that a second abrasive other than the superabrasive grains is included. Neither invention pays attention to the outer peripheral surface of the abrasive layer, but is an object different from the adjustment of the number of abrasives in the outer peripheral portion of the present invention, and has no effect on the adjustment of the number of abrasives in a new initial stage.

【0007】切味を重視して、砥粒数を減らすためにセ
グメントチップ全体の集中度(セグメントチップに含ま
れるダイヤモンドの割合: ダイヤモンドの体積がセグ
メントチップの体積の25%のときを集中度100とす
る)を低くすれば、すなわち砥粒数を減らせばブレード
の寿命が損なわれる。
In order to reduce the number of abrasive grains with emphasis on sharpness, the concentration of the entire segment chip (the ratio of diamond contained in the segment chip: the concentration of 100 when the volume of diamond is 25% of the volume of the segment chip) Lowering the number of abrasive grains, the life of the blade is impaired.

【0008】寿命を重視したブレードでは、砥粒数を増
やす必要があるが、新品時は結合剤をグラインダーなど
で強制的に除去し、ダイヤモンドを露出させるため、完
全砥粒の割合が目替り後よりも多い。このため、砥粒に
加わる力が分散され、切断を続けるとダイヤモンド砥材
の破砕や摩耗は進行するものの、脱落には至らず、劣化
した砥材が表面に数多く残る所謂目つぶれ状態、切味不
良が問題となる。
In the case of a blade that emphasizes the life, it is necessary to increase the number of abrasive grains. However, when a new article is used, the binder is forcibly removed with a grinder or the like to expose the diamond. More than. For this reason, the force applied to the abrasive grains is dispersed, and if the cutting is continued, the crushing and wear of the diamond abrasive material progresses, but the diamond abrasive material does not fall off, and a lot of deteriorated abrasive material remains on the surface, so-called blind state, sharpness Failure is a problem.

【0009】[0009]

【発明が解決しようとする課題】本発明が解決しようと
する課題は、ダイヤモンドブレードの新品時の切味およ
び目替りの問題を解決するにあたって、寿命を落とすこ
となく安定した切味のダイヤモンドブレードのセグメン
ト構造を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to solve the problem of sharpness and replacement when a diamond blade is new, and to provide a diamond blade having a stable sharpness without shortening its life. It is to provide a segment structure.

【0010】[0010]

【課題を解決するための手段】前記課題を解決するた
め、本発明のセグメント構造は、セグメントチップ外周
の切断作用面に、ダイヤモンド砥材と略同径であり、セ
グメントチップを焼成する温度より融点が高い材料から
なるヌープ硬さが常温で2500Kg/mm以下の粒
子を、切断作用面表面から粒径の1〜3倍の深さに埋め
込んだことを特徴とする。
In order to solve the above-mentioned problems, a segment structure according to the present invention is characterized in that a cutting action surface on an outer periphery of a segment chip has a diameter substantially the same as that of a diamond abrasive and has a melting point higher than a temperature at which the segment chip is fired. Is characterized by embedding particles having a Knoop hardness of 2500 kg / mm 2 or less at room temperature and having a Knoop hardness of 1 to 3 times the particle diameter from the surface of the cutting action surface.

【0011】セグメントチップ外周面におけるダイヤモ
ンド砥材と埋め込む粒子との数の割合を2:1〜1:4
とする。
The ratio of the number of the diamond abrasive and the number of the particles to be embedded on the outer peripheral surface of the segment chip is 2: 1 to 1: 4.
And

【0012】埋め込む粒子をセグメントチップの外周面
に前述の割合で幾何学的に配列することで、ダイヤモン
ド砥材を効果的に分散することができる。粒子を埋め込
む深さは、使用条件にもよるがダイヤモンド砥粒の1〜
3倍以内で目替りができる。
By arranging the particles to be embedded geometrically on the outer peripheral surface of the segment chip at the ratio described above, the diamond abrasive can be effectively dispersed. The depth at which the particles are embedded depends on the conditions of use, but it depends on the diamond abrasive grain.
You can change within three times.

【0013】これによって、新品時は完全砥粒数が過度
に多くならず、良好な切れ味が得られる。また、セグメ
ントチップ中の粒子が先に磨耗し、ダイヤモンド砥材に
働く力が増大することで切れ味が良く、劣化したダイヤ
モンドもスムーズに目替りする。
As a result, the number of perfect abrasive grains does not become excessively high when new, and good sharpness can be obtained. In addition, the particles in the segment chips are worn first, and the force acting on the diamond abrasive increases, so that the sharpness is improved and the deteriorated diamond is changed smoothly.

【0014】[0014]

【発明の実施の形態】以下、本発明の実施の形態を、図
面に示す実施例を参照しながら説明する。図1は本発明
のダイヤモンドブレードのセグメントチップ構造におけ
る実施例の外周面を示す拡大図であり、1は円盤状スチ
ール台金、2はセグメントチップ、3は埋め込んだ粒子
を示す。図2は、半径が355mmの円盤状スチール台
金1の外周に装着したそれぞれ長さ47mm、幅3.3
mm、高さが10mmのセグメントチップ2に粒子3を
埋め込んだ状態の(a),(b),(c)の3形態の実
施例を示す。
Embodiments of the present invention will be described below with reference to embodiments shown in the drawings. FIG. 1 is an enlarged view showing an outer peripheral surface of an embodiment of a segment tip structure of a diamond blade according to the present invention, wherein 1 is a disk-shaped steel base, 2 is a segment tip, and 3 is an embedded particle. FIG. 2 shows a length of 47 mm and a width of 3.3 mm attached to the outer periphery of a disc-shaped steel base 1 having a radius of 355 mm.
Examples of three modes (a), (b) and (c) in which particles 3 are embedded in a segment chip 2 having a height of 10 mm and a height of 10 mm are shown.

【0015】セグメントチップ2は、本例では集中度が
30のメタルボンドからなり、そこに球状のカーボンを
外周より1粒分の深さに粒子3として固着した。(a)
の場合は、ブレードの回転方向に対し直角になるように
粒子3を配列した。(b)の場合は、各粒子3が等間隔
になるように配列した。(c)の場合は、厚み方向中心
から側面に向かい斜線を形成するように配列した。
In this embodiment, the segment chip 2 is made of a metal bond having a degree of concentration of 30, and spherical carbon is fixed thereon as particles 3 at a depth of one particle from the outer periphery. (A)
In the case of, the particles 3 were arranged so as to be perpendicular to the rotation direction of the blade. In the case of (b), the particles 3 were arranged at regular intervals. In the case of (c), they were arranged so as to form oblique lines from the center in the thickness direction to the side surfaces.

【0016】[0016]

【実施例】本実施例と比較例を次の切断条件でコンクリ
ートを切断した結果、本発明の実施例の場合、前記の3
形態(a),(b),(c)ともに消費電力は目替り後
と大きな差がなく初期より切れ味が良好であったが、比
較例は初期の消費電力が増大しており、切れ味が悪かっ
たことを示している。
EXAMPLE As a result of cutting concrete of the present example and the comparative example under the following cutting conditions, in the case of the example of the present invention, the above-mentioned 3 was obtained.
In all of the modes (a), (b), and (c), the power consumption was not significantly different from that after the change, and the sharpness was better than the initial time. However, the comparative example had an increased initial power consumption, and the sharpness was poor. It shows that.

【0017】また、硬質石材(白御影石)を切断した結
果、前記の3形態(a),(b),(c)ともに消費電
力は目替り後と大きな差がなく初期より切れ味が良好で
あった。比較例は初期の消費電力が大きく、切れ味が低
下して行き、目つぶれにより切断不能となった。
In addition, as a result of cutting the hard stone (white granite), the power consumption of the three forms (a), (b) and (c) is not significantly different from that after the replacement, and the sharpness is better than the initial one. Was. In the comparative example, the initial power consumption was large, the sharpness was reduced, and it became impossible to cut due to blindness.

【0018】試験条件 切断ブレード 寸法:375D×47L×3.3T×10X×21N×
27H ダイヤモンド:SD40 集中度:30
Test conditions Cutting blade Dimensions: 375D x 47L x 3.3T x 10X x 21N x
27H Diamond: SD40 Concentration: 30

【0019】[0019]

【表1】 [Table 1]

【0020】[0020]

【表2】 注 “初期”はコンクリートでは0〜10m、白御影石では
0〜20m切断したときの平均消費電力を示す。“1m
m磨耗後”はセグメントチップ高さが1mm磨耗したと
きの消費電力を示す。
[Table 2] Note “Initial” indicates the average power consumption when cutting 0-10 m for concrete and 0-20 m for white granite. “1m
“After m wear” indicates the power consumption when the segment chip height is worn by 1 mm.

【0021】[0021]

【発明の効果】上述したように、本発明によれば下記の
効果を奏する。 (1)埋め込む粒子の融点がセグメントチップの焼成温
度よりも高いことから、焼成後もセグメントチップ中に
拡散することなくダイヤモンドと略同径の大きさを維持
できる。 (2)埋め込む粒子はダイヤモンドよりヌープ硬さで5
0%以下のため、硬質材を切断する際は、セグメントチ
ップ中の粒子が先に磨耗し、ダイヤモンド砥材に働く力
が増大することで劣化したダイヤモンドが脱落し、スム
ーズに目替りする。 (3)ダイヤモンドと略同径にすることで、埋め込んだ
粒子が磨耗し消滅した際、ダイヤモンド1粒分が脱落し
たことと同じになり目替りを促進することになる。 (4)上記により、寿命を落とすことなく初期より安定
した切れ味のダイヤモンドブレードが得られる。 (5)初期の切れ味を考慮せずに寿命を重視したブレー
ドの設計ができる。
As described above, according to the present invention, the following effects can be obtained. (1) Since the melting point of the particles to be embedded is higher than the sintering temperature of the segment chip, it is possible to maintain substantially the same diameter as diamond without being diffused into the segment chip even after sintering. (2) The particle to be embedded is 5 in Knoop hardness more than diamond.
When the hard material is cut, the particles in the segment chip are worn first, and the force acting on the diamond abrasive increases, so that the degraded diamond falls off and changes smoothly. (3) By making the diameter substantially the same as that of diamond, when the embedded particles are worn out and disappear, it is the same as that of one diamond falling off, which promotes switching. (4) As described above, it is possible to obtain a diamond blade having sharpness that is stable from the beginning without shortening the life. (5) A blade can be designed with an emphasis on life without considering the initial sharpness.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明のダイヤモンドブレードのセグメント
チップ構造における実施例の外周面を示す拡大図であ
る。
FIG. 1 is an enlarged view showing an outer peripheral surface of an embodiment in a segment tip structure of a diamond blade of the present invention.

【図2】 セグメントチップに粒子を埋め込んだ状態の
(a),(b),(c)の3形態の実施例を示す説明図
である。
FIGS. 2A and 2B are explanatory diagrams showing examples of three modes (a), (b), and (c) in which particles are embedded in a segment chip.

【符号の説明】 1 円盤状スチール台金 2 セグメントチップ 3 埋め込んだ粒子[Explanation of symbols] 1 Disc-shaped steel base metal 2 Segment chip 3 Embedded particles

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 3C063 AA02 AB03 BA03 BA24 BB01 BB02 BB07 BB23 BC02 BG05 EE31 FF20 FF23  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3C063 AA02 AB03 BA03 BA24 BB01 BB02 BB07 BB23 BC02 BG05 EE31 FF20 FF23

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 円盤状の台金の外周に装着したセグメン
トチップ外周の切断作用面に、ダイヤモンド砥材と略同
径であり、セグメントチップを焼成する温度より高い融
点の材料からなるヌープ硬さが常温で2500Kg/m
以下の粒子を、切断作用面表面から粒径の1〜3倍
の深さに埋め込んだことを特徴とするダイヤモンドブレ
ードのセグメント構造。
1. A Knoop hardness made of a material having substantially the same diameter as a diamond abrasive and having a melting point higher than a temperature at which a segment chip is fired, on a cutting action surface of an outer periphery of a segment chip mounted on an outer periphery of a disk-shaped base metal. Is 2500Kg / m at room temperature
The m 2 or less of the particles, the diamond blade segment structure, characterized in that embedded the cutting action face surface 1-3 times the depth of the particle size.
【請求項2】 セグメントチップ外周面におけるダイヤ
モンド砥材と埋め込む粒子との数の割合を2:1〜1:
4としたことを特徴とする請求項1記載のダイヤモンド
ブレードのセグメント構造。
2. The ratio of the number of diamond abrasives and particles to be embedded on the outer peripheral surface of a segment chip is 2: 1 to 1:
4. The diamond blade segment structure according to claim 1, wherein the segment structure is 4.
【請求項3】 埋め込む粒子をセグメントチップの外周
面に請求項2記載の割合で幾何学的に配列したことを特
徴とするダイヤモンドブレードのセグメント構造。
3. A segment structure of a diamond blade, wherein particles to be embedded are geometrically arranged on the outer peripheral surface of the segment tip at the ratio according to claim 2.
JP2000232160A 2000-07-31 2000-07-31 Segment structure of diamond blade Expired - Fee Related JP3539679B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000232160A JP3539679B2 (en) 2000-07-31 2000-07-31 Segment structure of diamond blade

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000232160A JP3539679B2 (en) 2000-07-31 2000-07-31 Segment structure of diamond blade

Publications (2)

Publication Number Publication Date
JP2002046071A true JP2002046071A (en) 2002-02-12
JP3539679B2 JP3539679B2 (en) 2004-07-07

Family

ID=18724884

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3539679B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008526526A (en) * 2004-12-30 2008-07-24 エーワ ダイアモンド インダストリアル カンパニイリミテッド Cutting tip for cutting tool and cutting tool

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61195969U (en) * 1985-05-27 1986-12-06
JPH10506580A (en) * 1994-12-28 1998-06-30 ノートン カンパニー Improved segmented cutting tool
JPH11285977A (en) * 1998-04-01 1999-10-19 Noritake Diamond Ind Co Ltd Rotary cutting grinding wheel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61195969U (en) * 1985-05-27 1986-12-06
JPH10506580A (en) * 1994-12-28 1998-06-30 ノートン カンパニー Improved segmented cutting tool
JPH11285977A (en) * 1998-04-01 1999-10-19 Noritake Diamond Ind Co Ltd Rotary cutting grinding wheel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008526526A (en) * 2004-12-30 2008-07-24 エーワ ダイアモンド インダストリアル カンパニイリミテッド Cutting tip for cutting tool and cutting tool

Also Published As

Publication number Publication date
JP3539679B2 (en) 2004-07-07

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