JP2002046060A - Polishing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of preventing leakage of a polishing liquid or its mist. SOLUTION: A shutoff portion (e.g. cover member 7) for preventing the polishing liquid scattered within a polishing chamber 6 and a mist of the polishing liquid floating in the polishing chamber from leaking out of the upper portion (opening 61) of the polishing chamber 6 without impeding reciprocation of the rotating shaft 41 of a polishing brush 4 or the like in B direction in the figure and its movement in A direction in the figure is provided at the upper portion of the polishing chamber 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus and the like, and more particularly to a polishing apparatus and the like which can be suitably used for polishing an outer peripheral end portion of a glass substrate for a magnetic recording medium.

[0002]

2. Description of the Related Art Aluminum substrates have been widely used as substrates for magnetic recording media such as magnetic disks. However, as magnetic disks have become smaller and thinner and higher density recording has been required, the surface of the substrate has become larger than that of aluminum substrates. It is gradually being replaced by a glass substrate having excellent flatness and substrate strength. As the glass substrate for a magnetic recording medium, a glass substrate which is chemically strengthened or a crystallized glass substrate whose substrate strength is increased by crystallization is generally used to increase the substrate strength.

[0003] In addition, the magnetic head has been changing from a thin film head to a magnetoresistive head (MR head) and a giant magnetoresistive head (GMR head) with the increase in recording density. Therefore, reproducing a magnetic recording medium using a glass substrate with a magnetoresistive head is becoming a big trend in the future.

[0004] As described above, various improvements have been made to the magnetic disk in order to increase the recording density, and with the progress of such a magnetic disk, new problems have arisen in glass substrates for magnetic recording media one after another. ing. One of them is high purification of the glass substrate surface. This is because if foreign matter adheres to the glass substrate surface, it causes a film defect of the thin film formed on the glass substrate surface, or it becomes a convex portion of the thin film surface, so that an appropriate glide height cannot be obtained. Cause such problems. In addition, when reproducing a magnetic recording medium using a glass substrate with a magnetoresistive head, if the flying height (flying height) of the head is lowered in order to improve the recording density, the reproducing operation malfunctions or the reproduction becomes impossible. Phenomena may be encountered, which is a problem. The cause is that the protrusions formed by particles on the glass substrate on the surface of the magnetic disk cause thermal asperity (Th
As a result, heat is generated in the magnetoresistive head, which changes the resistance value of the head and adversely affects electromagnetic conversion.

On the other hand, the cause of the foreign matter on the surface of the glass substrate for a magnetic recording medium as described above is that the outer peripheral end portion of the glass substrate is not smooth, so that the outer peripheral end portion rubs against the wall surface of the resin case. A major factor is that particles of resin or glass generated by the rubbing and other particles captured on the outer peripheral end surface of the glass substrate adhere to the surface.

Conventionally, the outer peripheral end portion of a glass substrate for a magnetic recording medium has been mirror-polished not for the purpose of avoiding the above-mentioned problem but mainly for the purpose of improving processing accuracy and preventing damage to the substrate. For example, as shown in FIG. 5, a laminated glass substrate 10 in a state in which a plurality of disk-shaped glass substrates 1 each having a circular hole in the center portion are rotated, and a polishing brush is applied to an outer peripheral end surface portion of the laminated glass substrate 10. A polishing apparatus has been proposed in which a polishing liquid is supplied between the outer peripheral end surface portion of the laminated glass substrate 10 and the brush bristles 43 of the polishing brush 4 to perform polishing by bringing the polishing liquid 4 into rotary contact (Japanese Patent Laid-Open No. 11-28649). Gazette).

[0007]

However, in the above outer peripheral end surface polishing apparatus, since the rotating polishing brush and the glass substrate are rubbed and polished, the polishing brush, the laminated glass substrate and the surrounding atmosphere are very different. It becomes hot. The polishing liquid supplied in such an environment is scattered around and around the surroundings as a high-temperature mist, and is lifted upward by an air current generated as the polishing brush rotates. Then, the motor enters the motor from the cooling fan of the drive motor of the rotating shaft of the polishing brush provided above the apparatus and causes a failure of the motor or a failure of other mechanical or electrical systems in the apparatus. Was. In addition, mist (mis) flying around the device
t) resulted in deterioration of the working environment.

The present invention has been made under the above-mentioned background, and has as its object to provide a polishing apparatus which can solve the above-mentioned problems.

[0009]

In order to achieve the above object, the present invention has the following constitution.

(Structure 1) Holding means for holding a plurality of disc-shaped substrates having circular holes at the center thereof, means for rotating the holding means, and an outer peripheral end face portion of the plurality of stacked substrates A polishing brush or a polishing pad that comes into contact with the substrate, a means for rotating the polishing brush or the polishing pad, and a polishing liquid supply means for supplying a polishing liquid to an outer peripheral end portion of the plurality of stacked substrates. And
A polishing chamber is provided around a portion where polishing is performed so that the mist of the polishing liquid scattered around and the mist of the polishing liquid flying around during the polishing does not leak outside, and the polishing chamber has a structure capable of sealing. A polishing apparatus characterized in that:

(Structure 2) Holding means for holding a plurality of disc-shaped substrates having circular holes at the center thereof, means for rotating the holding means, and outer peripheral end portions of the plurality of stacked substrates A polishing brush or a polishing pad that comes into contact with, a means provided above the polishing brush or the polishing pad for rotating the polishing brush or the polishing pad, and a means for reciprocating the polishing brush or the polishing pad in a rotation axis direction; Means for moving the rotation axis of the polishing brush or the polishing pad to adjust the distance between the holding means and the polishing brush or the polishing pad, and supplying the polishing liquid to the outer peripheral end portion of the plurality of stacked substrates. A polishing apparatus comprising at least a polishing liquid supply means and a polishing chamber surrounding a polishing section in which polishing is performed, wherein an upper portion of the polishing chamber has a rotating shaft of a polishing brush or a polishing pad. A polishing liquid blocking portion that does not hinder the reciprocation and the movement, and that prevents the mist of the polishing liquid flying in the polishing chamber and the mist of the polishing liquid flying in the polishing chamber from leaking from the upper part of the polishing chamber to the outside. A polishing apparatus characterized by being provided.

(Structure 3) Between the ceiling wall of the polishing chamber and the bearing of the rotating shaft of the polishing brush or polishing pad, the polishing liquid scattered in the polishing chamber and the mist of the polishing liquid flying in the polishing chamber are shut off. 3. The polishing apparatus according to Configuration 2, further comprising a cover member.

(Structure 4) Between the ceiling wall of the polishing chamber and the rotating shaft of the polishing brush or polishing pad, there is an action of shutting off the polishing liquid scattered in the polishing chamber and the mist of the polishing liquid flying in the polishing chamber. 3. The polishing apparatus according to Configuration 2, wherein a member is interposed.

(Structure 5) The polishing apparatus according to any one of structures 1 to 4, further comprising a suction device for sucking a mist of the polishing liquid flowing in the polishing chamber.

[0015]

[Action]

According to the first aspect, a polishing chamber is provided around a portion where the polishing is performed so that the polishing liquid scattered around and the mist of the polishing liquid flying around during the polishing do not leak outside. Since the polishing chamber has a sealable structure, the polishing liquid and the mist of the polishing liquid do not leak to the outside. Therefore, it is possible to avoid a failure of the mechanical system or the electrical system in the device. In particular, it is possible to prevent the mist of the polishing liquid from entering the driving motor such as the polishing brush and causing the motor to fail.
Further, the deterioration of the working environment due to the mist of the polishing liquid flying around the apparatus can be greatly improved. In addition, measures such as installing a filter at the suction port of the cooling fan of the motor or installing the motor below the polishing chamber are also effective to some extent in terms of avoiding the failure of the motor. It has no effect on the environment.

According to the second aspect, the reciprocating motion of the rotating shaft of the polishing brush or the polishing pad and the movement of the rotating shaft in the direction perpendicular to the rotating shaft are not hindered in the upper portion of the polishing chamber where the polishing is performed, and Since a polishing liquid blocking portion is provided to prevent mist flying and flying in the polishing chamber from leaking from the upper part of the polishing chamber to the outside, the polishing liquid or mist of the polishing liquid may leak to the upper part of the apparatus. Absent. Therefore, a failure of a mechanical system, an electric system, or the like in an upper portion of the apparatus can be avoided. In particular, it is possible to avoid a situation in which the mist of the polishing liquid wound up by an air current or the like generated by the rotation of the polishing brush or the like enters a driving motor such as a polishing brush provided above the apparatus and breaks down the motor. . Further, the mist of the polishing liquid flowing around the apparatus can be reduced, and the deterioration of the working environment can be improved.

According to the configuration 3, in addition to the effect of the configuration 2, for example, as shown in FIG. 1, the space between the ceiling wall 62 of the polishing chamber 6 and the bearing 44 of the rotating shaft 41 of the polishing brush or the polishing pad. Since the cover member 7 is stretched so as not to form a gap through which the polishing liquid or the mist of the polishing liquid leaks, the polishing brush 4
The rotation of the rotary shaft 41 and the reciprocating movement of the rotating shaft 41 in the direction B and the movement in the direction A can be prevented at low cost without the polishing liquid mist or the like rising over the apparatus. The cover member may be attached to a non-rotating part such as a bearing part of the polishing brush or the like so as not to hinder rotation of the polishing brush or the like. In FIG. 1, since the polishing brush 4 is positioned at the highest position, the cover member 7 is in a state without slack. However, in the case of a cover member having no elasticity,
It is preferable that the cover member 7 is attached in a state where the polishing brush is slackened so as not to hinder the reciprocation of the polishing brush in the direction B and the movement in the direction A. In the case of an elastic cover member, it is not necessary to attach the cover member in a loosened state. The cover member may be any one that is suitable for blocking the polishing liquid or the mist of the polishing liquid. As a material of the cover member, a resin sheet, a rubber sheet, a waterproof cloth, or the like having water resistance, waterproofness, moistureproofness, and the like, and capable of completely blocking mist is preferable. The cover member can also be manufactured using an elastic bellows.

In the structure 4, a member having an action of blocking a polishing liquid or a mist of the polishing liquid is interposed instead of the cover member of the structure 3. As the polishing liquid or a member having a function of blocking the mist of the polishing liquid, for example, a known member having a filter function can be used, but a member having water resistance or the like is preferable. The member having the filter action is
A sheet-like filter material can be attached instead of the cover member 7 shown in FIG. As shown in FIG. 3, there is a mode in which an elastic filter material 66 such as sponge is interposed in the opening 61 of the ceiling wall 62 of the polishing chamber. In this case, the rotary shaft 41 of the polishing brush 4 and the like
It is preferable to interpose a sponge or the like in a compressed state so as not to hinder the movement in the direction. The reciprocating motion in the direction of the rotation axis is not hindered by the expansion and contraction of the sponge or the like and the rotation shaft 41 sliding on the sponge or the like. As shown in FIG. 4, the opening 6 in the ceiling wall 62 of the polishing chamber is provided.
1, by arranging the bristles 67 densely, the polishing liquid and the mist of the polishing liquid can be cut off to some extent.
It cannot be shut off enough. Also in this case, the movement of the rotating shaft 41 of the polishing brush in the direction A in the drawing is not hindered, and the reciprocating motion in the direction of the rotating shaft is not hindered. As the bristles 67, various brush bristles made of natural or synthetic resin can be used. Examples of the natural brush bristles include broom bristles (for example, red stems and branches of broom grass).

According to the fifth aspect, since the suction device for sucking the mist flying in the polishing chamber is provided, the mist of the polishing liquid does not flow out to the surroundings when the substrate is taken out after polishing. The working environment can be improved, and failures of the device can be further reduced. The suction timing is preferably before the substrate is taken out. Suction can also be performed during or before polishing, or during removal of the substrate. One or a plurality of suction ports (suction ducts) can be provided at arbitrary positions on the wall surface of the polishing chamber. The sucked mist is preferably removed by a filter.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the polishing apparatus of the present invention will be described in detail with reference to the drawings. FIG. 1 is a partial cross-sectional view of a main part of a polishing apparatus according to an embodiment of the present invention, as viewed from the front, and FIG. 2 is a plan view of a polishing chamber without a ceiling wall.

In FIG. 1, 1 is a glass substrate for a magnetic disk to be polished (hereinafter referred to as an MD substrate), 2 is a holding means for holding a large number of MD substrates 1 on top of each other, and 3 is a holding means 2 which is rotatable. A rotary holding table 4 for holding, a polishing brush for contacting an outer peripheral end surface portion of the MD substrate 1 on which a large number of MD substrates 1 are stacked;
5 is a polishing liquid supply means for supplying a polishing liquid, 6 is a polishing chamber, 7
Is a cover member.

The substrate holding means 2 includes an MD inserted into the shaft 21.
The substrate 1 is received by the receiving member 22, and the collar 2 is received from the upper part in the axial direction.
By tightening the stacked MD substrates with the tightening jig 24 via the 3, the MD substrates are not shifted by the rotation of the substrate holding means 2 or the rotation of the polishing brush 4 due to the friction coefficient between the main surfaces of the MD substrates 1. 1 is provided.
The upper end of the shaft 21 of the substrate holding means 2 is
2 is attached in a rotatable state.

The rotation holder 3 is connected to a rotation shaft 31,
A rotation driving device (not shown) for driving the rotation shaft 31 can rotate in both forward and reverse directions. In addition, this rotation driving device can change its rotation speed, and can select an appropriate rotation speed according to a polishing purpose. The rotating shaft 31 is rotatably and sealedly mounted on the bottom surface of the polishing chamber 6.

The polishing brush 4 is connected to a rotary shaft 41 of a rotary drive (not shown), and is configured to be rotatable in both forward and reverse directions. The polishing brush 4 is configured to be retractable in the direction A in the drawing when setting the substrate. In addition, the polishing brush 4 is configured to be able to adjust the pressing amount of the brush bristles 43 against the outer peripheral end surface portion of the MD substrate 1 in order to adjust the length of contact of the brush bristles 43 with the MD substrate 1. Polishing brush 4
Is configured to be able to reciprocate along the rotation axis direction (B direction in the drawing) of the brush by a cam mechanism (not shown). At this time, the reciprocating range of the polishing brush 4 is
The range from the lowermost portion to the uppermost portion of the set MD substrate 1 is set to be within the range in which the bristle of the polishing brush 4 is implanted.

Although the polishing brush 4 does not have a rotating shaft on the opposite side (lower side in the figure) of the rotating shaft 41 on the side of the rotary driving device, the rotating shaft and the rotating shaft are also provided on the opposite side of the rotating shaft 41. By providing a bearing for fixing the shaft, the rotation shaft of the polishing brush 4 can be polished without shifting even during polishing of the outer peripheral end face portion, and high-precision polishing without variation in surface roughness and size is performed. It is preferable because it can be used. Known bearings such as bearings, ball bearings, roller bearings, and slide bearings can be used as the bearings. Bearings can be provided at a plurality of positions on the rotating shaft of the polishing brush 4, and can also be provided on the rotating shaft 41 on the rotation drive device side. In this case, in order to move the rotating shaft 41 in the illustrated A direction, for example, once the rotating shaft 41 is lifted and removed from the bearing, and then moved in the A direction, or the bearing can be inserted into and removed from the rotating shaft 41. do it.

The polishing brush 4 is obtained by, for example, implanting brush bristles in a belt shape and a spiral shape on a cylindrical body. As another embodiment of the polishing brush 4, there is an embodiment such as partial planting in which brush bristles are scattered and planted in a cylindrical body.
In addition, as the brush bristles 43, for example, a meandering curled nylon fiber (diameter: 0.1 to 0.3 mm, length: 1)
0-30 mm). Other embodiments of the brush bristles 43 include vinyl chloride fiber, pig hair, piano wire, stainless steel fiber and the like instead of nylon fiber.

In the present invention, a polishing pad can be used in place of the polishing brush 4. Examples of the polishing pad include soft polishers made of suede and velor, and hard polishers such as hard velor, urethane foam, and pitch impregnated suede. As the polishing pad, for example, it is preferable that the polishing pad is provided by winding the polishing pad around the entire circumference of a cylindrical body.

The polishing liquid supply means 5 includes a polishing liquid supply nozzle 5
1, a polishing liquid supply pipe 53, etc.
Is supplied with a polishing liquid 50. The polishing liquid supply means 5 'includes a polishing liquid supply port 52, a polishing liquid supply pipe 53, and the like, and supplies the polishing liquid 50 to the laminated glass substrate 10' in a manner shown in FIG. Although not shown in FIG. 1, the polishing apparatus of the present invention collects the polishing liquid supplied from the polishing liquid supply means from a recovery port (not shown) provided on the bottom surface 64 of the polishing chamber 6. And a circulating mechanism for cleaning the collected polishing liquid and circulating it again to the polishing liquid supply means.

The polishing chamber 6 includes a ceiling wall 62, side walls 63, and a bottom surface 64. An opening 6 is formed in the ceiling wall 62 of the polishing chamber 6 so as not to hinder the rotation of the polishing brush 4 and the like and the reciprocation of the rotating shaft 41 in the direction B and the movement in the direction A.
1 is provided. The cover member 7 is stretched between the ceiling wall 62 of the polishing chamber 6 and the bearing portion 44 of the rotating shaft 41 of the polishing brush 4 so as not to form a gap through which the polishing liquid or the mist of the polishing liquid leaks. The mist of the polishing liquid or the like is prevented from leaking from above 61 to the upper part of the apparatus. Polishing room 6
An opening / closing door 65 is provided on the side wall 63 on the working side, and the inside of the polishing chamber 6 can be sealed by the opening / closing door 65.

Although the present invention has been described with reference to the preferred embodiments, the present invention is not limited to the above embodiments.

For example, instead of the cover member, as shown in FIGS. 3 and 4, a member having a function of blocking a mist or the like of the polishing liquid can be interposed in the opening 61 or the like. Further, in addition to the configuration shown in FIGS. 1 and 2, a suction device for sucking mist of the polishing liquid flowing in the polishing chamber may be provided via a suction port (suction duct). The suction port is provided below the polishing chamber. The configuration of the present invention can also be applied to inner peripheral end surface polishing. For example, holding means for stacking and holding a plurality of disc-shaped substrates having circular holes in the center, means for rotating the holding means, and polishing for contacting the inner peripheral end surface portion of the plurality of stacked substrates An inner peripheral end surface polishing apparatus comprising at least a brush or a polishing pad, a means for rotating the polishing brush or the polishing pad, and a polishing liquid supply means for supplying a polishing liquid to an inner peripheral end surface portion of the plurality of stacked substrates. In the structure, a polishing chamber is provided around a portion where polishing is performed so that a mist of the polishing liquid scattered around the polishing liquid and a mist of the polishing liquid flying therearound does not leak outside, and the polishing chamber can be sealed. The polishing apparatus can be made as follows. Similarly, in the inner peripheral end surface polishing apparatus, the polishing liquid blocking portion, the cover member, the suction device, and the like in the above-described outer peripheral end surface polishing apparatus can be similarly provided. For example, in the inner peripheral end surface polishing apparatus, in the upper portion of the polishing chamber surrounding the periphery of the polishing section where polishing is performed, without hindering the rotation of the rotation axis of the polishing brush or polishing pad and the reciprocating movement and various movements of the rotation axis, In addition, a polishing liquid blocking portion can be provided to prevent the polishing liquid scattered in the polishing chamber and the mist of the polishing liquid flying in the polishing chamber from leaking from the upper part of the polishing chamber to the outside. More specifically,
For example, in an inner peripheral end surface polishing apparatus, between a ceiling wall of a polishing chamber and a bearing of a rotating shaft of a polishing brush or a polishing pad, a polishing liquid scattered in the polishing chamber and a mist of the polishing liquid flying in the polishing chamber are removed. A cover member for blocking can be provided. Further, in the inner peripheral end surface polishing apparatus, an action of shutting off a polishing liquid scattered in the polishing chamber and a mist of the polishing liquid flying in the polishing chamber between the ceiling wall of the polishing chamber and the rotating shaft of the polishing brush or the polishing pad. Can be interposed. The polishing apparatus of the present invention includes, for example, glass substrates such as aluminosilicate glass, soda lime glass, soda aluminosilicate glass, aluminoborosilicate glass, borosilicate glass, quartz glass, and glass for magnetic disks such as crystallized glass substrates. It can be suitably used as a substrate polishing apparatus.

[0033]

As described above, according to the polishing apparatus of the present invention, it is possible to prevent the polishing liquid and the mist of the polishing liquid from leaking to the outside. Therefore, it is possible to avoid a failure of the mechanical system or the electrical system in the device. In particular, it is possible to prevent the mist of the polishing liquid from entering the drive motor of the polishing brush and causing the motor to break down. Further, the deterioration of the working environment due to the mist of the polishing liquid flying around the apparatus can be greatly improved.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view of a main part of a polishing apparatus according to an embodiment of the present invention as viewed from the front.

FIG. 2 is a plan view of a main part of the polishing apparatus according to one embodiment of the present invention.

FIG. 3 is a plan view of a main part of a polishing apparatus according to another embodiment of the present invention.

FIG. 4 is a plan view of a main part of a polishing apparatus according to another embodiment of the present invention.

FIG. 5 is a side view showing a supply mode of a polishing liquid in an example.

FIG. 6 is a plan view showing a state of polishing an outer peripheral end surface portion.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 glass substrate (MD substrate) 1 a side wall portion 1 b chamfered portion 2 substrate holding means 3 rotation holding table 4 polishing brush 5, 5 'polishing liquid supply means 6 polishing chamber 7 cover member 10, 10' laminated glass substrate 31 rotation axis 41 Rotating shaft 43 Brush hair 50 Polishing liquid 62 Ceiling wall

Claims (5)

[Claims] 1. A holding means for stacking and holding a plurality of disc-shaped substrates having a circular hole at a center portion, a means for rotating the holding means, and a contacting means for contacting an outer peripheral end surface portion of the plurality of stacked substrates. A polishing brush or a polishing pad, a means for rotating the polishing brush or the polishing pad, and a polishing liquid supply means for supplying a polishing liquid to an outer peripheral end surface portion of the plurality of stacked substrates. A polishing chamber is provided around a portion where polishing is performed so that a polishing liquid scattered around the polishing liquid and a mist of the polishing liquid flying around the liquid do not leak outside, and the polishing chamber can be hermetically sealed. A polishing apparatus characterized in that: 2. A holding means for stacking and holding a plurality of disc-shaped substrates having a circular hole at a central portion, a means for rotating the holding means, and a contacting means for contacting an outer peripheral end surface portion of the plurality of stacked substrates. A polishing brush or a polishing pad, means for rotating the polishing brush or the polishing pad provided above the polishing brush or the polishing pad, means for reciprocating the polishing brush or the polishing pad in a rotation axis direction, Means for moving the rotation axis of the polishing brush or the polishing pad to adjust the distance between the holding means and the polishing brush or the polishing pad; and a polishing liquid for supplying a polishing liquid to the outer peripheral end portion of the plurality of stacked substrates. A polishing apparatus comprising at least a supply unit and a polishing chamber surrounding a polishing section where polishing is performed, wherein an upper portion of the polishing chamber includes a polishing brush or a rotating shaft of a polishing pad. A polishing liquid blocking section is provided to prevent the polishing liquid scattered in the polishing chamber and the mist of the polishing liquid flying in the polishing chamber from leaking from the upper part of the polishing chamber to the outside without hindering the backward movement and the movement. Polishing apparatus, characterized in that: 3. A cover member that intercepts a polishing liquid scattered in the polishing chamber and a mist of the polishing liquid flying in the polishing chamber between a ceiling wall of the polishing chamber and a bearing portion of a rotating shaft of the polishing brush or the polishing pad. 3. The polishing apparatus according to claim 2, further comprising: 4. A member having a function of blocking a polishing liquid scattered in the polishing chamber and a mist of the polishing liquid flying in the polishing chamber is provided between a ceiling wall of the polishing chamber and a rotating shaft of the polishing brush or the polishing pad. The polishing apparatus according to claim 2, wherein the polishing apparatus is interposed. 5. The polishing apparatus according to claim 1, further comprising a suction device for suctioning a mist of the polishing liquid flowing in the polishing chamber.