JP2002043702A - Multiple pieces of board and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multiple pieces board capable of maintaining flatness between cut and pasted piece parts and other parts, and also ensuring strength of junction for a frame part of the cut and pasted piece parts, and a method for manufacturing the board. SOLUTION: In a mixed boards including groove and bad piece parts, a frame part 2 is provided with cut lines which are joined together and the multiple pieces board 1 being assembled with good piece parts is formed. Seams 9 don't exit on bridges 8, but on the frame part 2 so that the original strength of bridges 8 is maintained. Seams 9 have wide junction areas so that seams 9 have sufficient strength of junction. The multiple pieces board and the method for manufacturing are provided and prevent cut and pasted piece parts 3 from falling carelessly by handling in post-processing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-piece substrate in which a single substrate includes a plurality of pieces. More specifically, when a piece of a defective piece and a piece of a good piece are included in one board, the piece of the bad piece is removed and a piece of a good piece cut out from another board is replaced with a piece of the bad piece. The present invention relates to a fitted multi-piece substrate (so-called jigsaw substrate) and a method for manufacturing the same.

[0002]

2. Description of the Related Art As a wiring board, there is a multi-piece board in which a plurality of pieces are included in one board. Regarding a multi-piece substrate, there is a case where, for example, all pieces are required to be non-defective due to a request in a post-process. However, in an actual process, it is difficult to completely eliminate the formation of a multi-piece substrate including defective piece portions. However,
If even one defective piece portion is included, scraping up another good piece portion on the substrate is a problem in terms of effective use of resources.

For this reason, when there is a substrate (hereinafter, referred to as a "mixing plate") including both a defective piece and a good piece, the defective piece is removed and another mixed loading is performed in the empty space. A so-called jigsaw substrate is provided by attaching a non-defective piece part removed from a plate.
This makes it possible to provide a multi-piece substrate in which all pieces are non-defective to a subsequent process while effectively using resources.

[0004]

However, in the conventional jigsaw substrate, the removal and attachment of the piece portion are performed by cutting and joining a bridge connecting the piece portion and the frame portion. Therefore, there are the following problems. That is, a step may occur between the frame portion and the piece portion originally attached to the frame portion and the piece portion attached by cutting and pasting. For this reason,
In a subsequent step of printing, for example, a solder paste for mounting electronic components, there has been a case where good printing cannot be performed due to steps on the surface of the substrate. In this case, there was a high possibility that a defect would occur due to insufficient solder. Also, the bridge is originally a weak part in terms of strength. Since the strength of the portion was further reduced by cutting and pasting, there was a case where unexpected falling off occurred in a later process.

The present invention has been made to solve the above-mentioned problems of the conventional multi-piece substrate. That is, it is an object of the present invention to provide a multi-piece substrate which ensures flatness between a cut and pasted piece portion and another portion, and secures a bonding strength of the cut and pasted piece portion to a frame portion, and a method of manufacturing the same. It is in.

[0006]

SUMMARY OF THE INVENTION A multi-piece substrate according to the present invention, which has been made to solve this problem, has a frame portion and a plurality of piece portions connected to the frame portion by bridges. Wherein the frame portion has a seam surrounding the root of the bridge around the at least one piece portion.

In this multi-piece substrate, the seam between the cut and pasted piece portion and the frame portion is provided not on the bridge but on the frame portion. Therefore, the strength of the bridge itself is not affected by the cutting and pasting. Further, by providing the joint in the frame portion, the joint area can be increased as compared with the case where the joint is provided in the bridge. Therefore, the strength of the seam itself is relatively excellent. In addition, it is easy to secure flatness between both sides of the seam, that is, between the cut and pasted piece portion and another portion.

[0008] In the multi-piece substrate of the present invention,
It is desirable that the shape of the joint be a retaining shape that prevents in-plane pull-out. Further, it is desirable that a positioning claw is provided on at least one of the frame side and the piece side in the joint.

The method of manufacturing a multi-piece board according to the present invention is a method of manufacturing a multi-piece board having a frame portion and a plurality of piece portions connected to the frame portion by bridges. In the case of a multi-piece board including a non-defective piece part and a non-defective piece part, that is, if there are a plurality of mixed boards, a cut is made at a position surrounding the base of the bridge around the defective piece in the frame part of one mixed board. Then, remove the relevant piece, cut out the non-defective piece in the same manner from the other mixed board, and insert the non-defective piece from the mixed board into the vacant land where the defective piece has been removed. In this method, the cuts of the frame portions are joined together.

In this manufacturing method, a piece of a defective product is cut out from one mixed mounting plate. The cut at that time is put not in the bridge but in the frame part. Therefore, strictly speaking, not only the defective piece itself but also the bridge around it and the portion of the frame near the base of the bridge are removed. Similarly, non-defective pieces are cut out from the other mixed plates. The cut piece of the non-defective product has not only the piece itself but also a bridge around it and a portion of the frame near the base of the bridge. By joining these, a multi-piece substrate having a joint in the frame portion instead of the bridge is manufactured as described above.

In this manufacturing method, when cutting out a defective piece from one mixed mounting plate and cutting out a non-defective piece from another mixed mounting plate, the shape of the cut is changed after joining. Needless to say, it is preferable to have a retaining shape for preventing the pull-out in the inward direction.
Alternatively, when cutting out a defective piece from one mixed plate, or when cutting a good piece from another mixed plate, the shape of the cut should include the part that will become a positioning claw after joining. Of course, it is also preferable.

Further, in this manufacturing method, when cutting out a defective piece from one mixed mounting plate and cutting out a good piece from another mixed mounting plate, the shape of the cut is joined. It is also preferable that a gap is formed between the two at times, and an adhesive is inserted into the gap at the time of splicing for joining. In this case, the gap acts as a space for storing the adhesive, and the bonding strength of the joint is ensured by the adhesive.

In this manufacturing method, it is also preferable that the cuts are joined by laminating an insulating layer containing an adhesive component. That is, in this case, the adhesive component contained in the insulating layer permeates the seam at the time of lamination and adheres. In this case, it does not appear to have any seams.

Further, in this manufacturing method, the cuts may be joined after forming the inner layer pattern or after forming the outermost layer pattern. If performed after forming the inner layer pattern, the seam is hidden by the upper layer, and a beautiful appearance is obtained. If the layer to be laminated contains an adhesive component, the joint is joined by the adhesive component. If it is performed after the outermost layer pattern is formed, a 100% non-defective product can be obtained. Here, the "outermost layer pattern" is a layer with a pattern located on the outermost side as a product.
This is not necessarily a wiring, and may be a pattern such as a solder resist. On the other hand, the “inner layer pattern” here is a layer with a pattern located inside the “outermost layer pattern”. This is not necessarily a wiring pattern, but may be an interlayer insulating layer in which holes are formed.

[0015]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

First, an embodiment of a multi-piece substrate to which the present invention is applied will be described. As shown in FIG. 1, the multi-piece substrate 1 according to the present embodiment has a frame portion 2 and four piece portions 3 to 6. A slit 7 is formed between each of the pieces 3 to 6 and the frame 2. Bridges 8 for fixing the pieces 3 to 6 to the frame 2 are provided everywhere. In FIG. 1, the piece part 3 and the piece part 5, the piece part 4 and the piece part 6, have the same pattern. Piece part 3 and piece part 5
The patterns of the piece part 4 and the piece part 6 are different. However, they are arranged face-down with each other and are the same as a product. The dimensions of the multi-piece substrate 1 of FIG. 1 are approximately 14 cm × 24 cm.

FIG. 2 shows the vicinity of the base of the bridge 8 around the piece 3 which is one of the pieces 3 to 6 to the frame 2. As shown in FIG. In FIG. 2, a joint 9 is present near the base of the bridge 8 in the frame portion 2. The seam 9 surrounds the base of the bridge 8. Small holes 10, 10 are provided at two places of the joint 9. The small holes 10, 10 are filled with an adhesive. When an adhesive having a high fluidity is used, the adhesive penetrates into the seam 9 other than the small holes 10 and 10 by capillary action, and the both sides sandwiching the seam 9 are more firmly adhered. Is done. When an adhesive having a high fluidity is used, a heat-resistant tape (polyimide tape or the like) is preferably attached to the back side of the substrate. This is to prevent unwanted contamination due to leaching of the adhesive. The roots of all the bridges 8 around the piece portion 3 to the frame portion 2 are as shown in FIG. On the other hand, the bridges 8 around the other piece parts 4 to 6 are not as shown in FIG.

The multi-piece substrate 1 shown in FIG. 1 is originally a mixed board in which the pieces 4 to 6 are good and the piece 3 is provided with a defective piece. Then, the piece part of the defective product was removed, and a piece part 3 of a good product cut out from another mixed board was attached to the vacant space instead, and a board in which all the pieces were good was obtained as shown in FIG. is there. Thus, in the multi-piece substrate 1, the original part (the frame part 2 and the piece parts 4 to 6)
The seam 9 between the cut and pasted part (piece part 3)
It is provided not on the bridge 8 but on the frame section 2.

For this reason, in the multi-piece substrate 1, even for the piece portion 3 attached by cutting and pasting, each bridge 8 around the same secures the same strength as each bridge 8 around the piece portions 4 to 6 originally attached. Have been. Also,
The seam 9 has a significantly larger bonding area than the case where the bridge 8 is cut and bonded to form a seam, and thus has a higher bonding strength. Further, both sides of the joint 9 are flattened by a press (at the time of joining or after) included in the manufacturing process.

The multi-piece substrate 1 is manufactured through the following cutting and pasting process. In other words, if two or more mixed boards are found in the quality inspection of each piece part of a multi-piece board, a good mixed board (preferably one with as many good pieces as possible) is left with the good piece pieces. The non-defective pieces are removed to obtain the state shown in FIG. When removing the defective piece of the mixed plate, the frame 2 is cut with a router or the like so as to surround each bridge 8 around the piece to be removed. As a result, the piece portion to be removed, the bridges 8 around the piece portion, and the base portion of the frame portion 2 are cut off from the mixed plate.

On the other hand, a non-defective piece 3 is cut out from another mixed board. At this time, a cut is similarly made in the frame portion 2. As shown in FIG. 4, the cut piece 3
Each of the surrounding bridges 8 and the base portion of the frame portion 2 are provided. In addition, the shape of both cuts is
At the time of assembly, they almost coincide with each other, and
(See FIG. 2). And FIG.
The piece part 3 of FIG. 4 is arranged at the vacant lot 11 in the middle,
An adhesive is inserted into the small holes 10 and joined. Thereby, the state of FIG. 1 is obtained. As the adhesive, a liquid material may be injected into the small holes 10 or a solid granular material may be sandwiched between the small holes 10 and subjected to a treatment such as heating. Alternatively, it may be supplied from an upper layer material as described later. When arranging the piece 3, in order to improve the relative positional accuracy with respect to the frame 2 or another piece, it is preferable to use a jig having a positioning pin and cure the adhesive as it is.

The specific shape of the seam 9 shown in FIG.
Various modifications are possible. Hereinafter, modified examples will be listed. FIG. 5 shows that the shape of the frame portion 2 cut out together with the piece portion 3 is a retaining shape. That is, in this shape, the width of the part cut out together with the piece part 3 of the frame part 2 becomes wider toward the back. For this reason, even if the piece part 3 is pulled downward in FIG. 5, it does not fall off from the whole part of the frame part 2. Therefore, it is not necessary to pay much attention in handling from assembly to fixing.

FIG. 6 shows a claw 1 for positioning between the piece 3 and the entire frame 2.
2, 12 and 13 are provided on the piece part 3 side.
That is, in this shape, the claws 12, 12 are responsible for positioning in the horizontal direction in FIG. 6, and the claws 13 are responsible for positioning in the vertical direction in FIG. As a result, in the jigsaw multi-piece substrate shown in FIG.
The accuracy of the positional relationship with the attached piece portion 3 can be assured as in the case of a multi-piece substrate in which all the pieces are originally good. This is particularly useful when building up further layers. In this shape, a gap 14 is formed between the piece portion 3 side and the entire frame portion 2 side, so that a space for adhering the adhesive is secured without intentionally providing a shape like the small holes 10 and 10. Is done. The claws 12, 12, 13 may be provided on the entire side of the frame portion 2 instead of being provided on the piece portion 3 side. Further, a shape having both a retaining shape as shown in FIG. 5 and a positioning shape as shown in FIG. 6 may be employed.

Next, a description will be given of how the above-described cutting and pasting of the piece portion are performed in a specific manufacturing process of the multilayer wiring board. Here, as an example, it is assumed that a six-layer penetrating subtractive method for creating the cross-sectional structure shown in FIG. First, FIG.
The manufacturing process for reaching the cross-sectional structure of FIG. First, a pattern processing is performed on each surface of two double-sided copper-clad plates as a base material (FIG. 8). Thus, the inner layer pattern 14 is formed. Inner layer pattern 14
Corresponds to Layers 2 to 5 in FIG. Then, when these are combined and pressed, the state shown in FIG. 9 is obtained. That is, copper foils 17, 17 are arranged above and below both base materials 15, 15 via prepregs 16, 16, and further, both base materials 15, 1
The prepregs 16 are also sandwiched between the 5 and integrated by pressing.

Then, a through hole 18 is formed in this, a chemical copper plating 19 is applied to the entire surface, and a pattern resist 20 is formed on the front and back surfaces to obtain a state shown in FIG. Then, an electrolytic copper plating 21 is formed in a region where there is no pattern resist 20, the pattern resist 20 is peeled off, and unnecessary copper is removed by quick etching to obtain a state shown in FIG. Thereby, the outer layers Lay 1 and 6 are formed. When the solder resist 22 is formed, the state shown in FIG. 7 is obtained. After that, it proceeds to external processing and further continuity inspection.

In the above-described manufacturing process, the above-described cutting and pasting of the piece portion can be performed when a certain pattern is formed and the quality is checked.
Specifically, this is the state shown in FIG. 8 or the state shown in FIG. Alternatively, cutting and pasting can be performed even at the time when the continuity inspection after the formation of the solder resist 22 is completed. Of course two of these
The cut and paste may be performed more than once (all three times may be performed). By performing the cutting and pasting at these three timings, there are advantages.

First, advantages of cutting and pasting in the state of FIG. 8 will be described. The greatest advantage of this case is that the pattern forming process still remains after cutting and pasting.
That is, the formation of the outer layers Lay 1 and 6 (FIG. 1)
1). For this reason, if it is necessary to provide wiring connecting the pieces or wiring connecting the pieces and the frame, such as a lead wire to a pad used for a function test after component mounting, the Layers 1 and 6 are required. It can be used to route such wires seamlessly. At the time of lamination (FIG. 9), the epoxy component enters the joint from the prepreg 16 and acts as an adhesive. For this reason, it is not necessary to supply an adhesive especially for joining the seams. In addition, flatness can be obtained by pressing at that time. Further, the seam is covered with the upper layer and becomes invisible, so that a beautiful appearance can be obtained. In addition, by performing the cutting and pasting at such an early stage, waste such as stacking the upper layer on the defective piece portion is eliminated. Also, at this point, since the two base materials are separately present, the cutting and pasting are also performed separately. Therefore, a non-defective piece can be utilized as much as possible while removing a defective piece.

Next, an advantage of performing the cutting and pasting in the state of FIG. 11 will be described. The advantage of this case is that the step of forming the solder resist 22 still remains after cutting and pasting. Therefore, if a material containing an adhesive component is used as the material of the solder resist 22, there is no need to supply an adhesive particularly for joining the seam. Further, since the material of the solder resist 22 is generally liquid, its surface becomes flat. This also gives a beautiful appearance. Also,
By cutting and pasting at this stage, waste such as forming the solder resist 22 on the defective piece portion is eliminated.

Finally, the advantage of cutting and pasting at the time when the continuity test after the formation of the solder resist 22 is completed is as follows.
Needless to say, a 100% good product including the quality of the pattern of the solder resist 22 can be obtained.

As described in detail above, in the present embodiment, when a multi-piece board includes two or more mixed plates including a non-defective piece part and a defective piece part, the frame part is used. A so-called jigsaw substrate is obtained by making a cut in 2 and joining the cuts together to collect only good pieces. Therefore, the seam 9 of the jigsaw board exists not in the bridge 8 but in the frame portion 2. Therefore, the original strength of the bridge 8 is maintained, and the seam 9 also has a sufficient joint strength due to a large joint area. This provides a multi-piece substrate in which the cut and pasted piece portion 3 is not accidentally dropped during handling in a later step, and a method for manufacturing the same.

Further, by providing the seam 9 in the frame portion 2, flatness between the cut and pasted piece portion 3 and other portions can be easily obtained. In addition, as shown in FIGS. 2, 5, and 6, by variously modifying the shape of the cut,
It is possible to provide a positioning function and secure a space for inserting an adhesive.

The cut and paste can be executed at various points during the manufacturing process as described above. By cutting and pasting at an early stage, it is possible to eliminate waste such as laminating an upper layer or the like on a piece in which a defect has already occurred.
Also, a beautiful surface can be obtained. In this case, if the adhesive component is contained in the upper layer, the adhesive for bonding is unnecessary. Conversely, if cutting and pasting are performed at a later stage, a 100% good product can be obtained.

The present embodiment is merely an example and does not limit the present invention. Therefore, naturally, the present invention can be variously modified and modified without departing from the gist thereof.

For example, the number and size of layers of a target substrate,
The outer shape, the material of each layer, and the like may be different from those described in the present embodiment. Further, the shape of the frame portion 2 cut out together with the piece portion 3 is not limited to the shapes shown in FIGS. For example, the retaining shape in FIG. 5 is not limited to the trapezoidal shape as shown, and may be another shape such as a circle.
In addition, in FIGS. 2 and 5, by forming the seam 9 in a zigzag shape, a larger joint area can be obtained.
As shown in FIG. 12, depending on the substrate, there are a plurality of frames in the entire size of the work, and a plurality of pieces in each frame. The present invention can be applied to such a case. In this case, the piece may be cut and pasted, or the frame may be cut and pasted.

[0035]

As is apparent from the above description, according to the present invention, the flatness between the cut and pasted piece portion and other portions is ensured, and the joining strength of the cut and pasted piece portion to the frame portion is ensured. Multi-piece substrate and a method for manufacturing the same are provided.

[Brief description of the drawings]

FIG. 1 is a plan view of a multi-piece substrate according to an embodiment.

FIG. 2 is an enlarged view near a bridge in a multi-piece substrate.

FIG. 3 is a plan view showing a state where a defective piece portion is removed from an original multi-piece substrate.

FIG. 4 is a plan view showing a non-defective piece cut out from another multi-piece substrate.

FIG. 5 is a view showing a modification (No. 1) of the shape of the seam.

FIG. 6 is a diagram showing a modification (No. 2) of the shape of the seam.

FIG. 7 is a cross-sectional view illustrating an example of the overall configuration of a multi-piece substrate.

FIG. 8 is a cross-sectional view showing one process of forming a multi-piece substrate (inner layer pattern formation).

FIG. 9 is a cross-sectional view showing one process (combination press) of manufacturing a multi-piece substrate.

FIG. 10 is a cross-sectional view showing one process (pattern resist formation) of manufacturing a multi-piece substrate.

FIG. 11 is a cross-sectional view showing one process (formation of an outer layer pattern) of manufacturing a multi-piece substrate.

FIG. 12 is a diagram showing an example of the arrangement of a multi-piece substrate on a work.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Multi-piece board 2 Frame part 3-6 piece part 8 Bridge 9 Seam 10 Small hole 11 Open space 12,13 Positioning nail 14 Gap

 ────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Katsumi Sakasaka 300 Aoyagi-cho, Ogaki-shi, Gifu F-term in IBIDEN Co., Ltd. (reference) 5E338 AA00 BB47 CC01 EE26 EE32

Claims (10)

[Claims] 1. A multi-piece substrate having a frame portion and a plurality of piece portions connected to the frame portion by bridges, wherein at least one
A multi-piece substrate having a seam surrounding a base of a bridge around two piece portions. 2. The multi-piece substrate according to claim 1, wherein the shape of the joint is a retaining shape for preventing pull-out in an in-plane direction. 3. The multi-piece substrate according to claim 1, wherein a positioning claw is provided on at least one of the frame side and the piece side of the joint. 4. A method for manufacturing a multi-piece substrate having a frame portion and a plurality of piece portions connected to the frame portion by bridges, wherein the multi-piece substrate includes a defective piece portion and a non-defective piece portion. When there are multiple substrates,
A cut is made at a position surrounding the base of the bridge around the defective piece in the frame part of one multi-piece board, the piece is removed, and a non-defective piece is cut out from the other multi-piece board in the same manner. A method of manufacturing a multi-piece board, comprising inserting a non-defective piece cut from another multi-piece board into a vacant land from which a defective piece has been removed, and joining the cuts of the frame. 5. The method of manufacturing a multi-piece board according to claim 4, wherein a piece of a defective piece is cut out from the one multi-piece board and a piece of a non-defective piece is cut from the other multi-piece board. When cutting, the shape of the cut is
A method for manufacturing a multi-piece substrate, wherein the shape is a retaining shape for preventing pulling out in an in-plane direction after joining. 6. The method for manufacturing a multi-piece substrate according to claim 4, wherein a piece portion of a defective product is cut out from the one multi-piece substrate or a non-defective piece portion from the other multi-piece substrate is cut out. When cutting, the shape of the cut is
A method for manufacturing a multi-piece substrate, comprising a shape including a portion serving as a positioning claw after joining. 7. The method for manufacturing a multi-piece substrate according to claim 4, wherein a defective piece portion is cut out from said one multi-piece substrate, and a non-defective piece portion from said another multi-piece substrate is cut out. When cutting, the shape of the cut is
A method for manufacturing a multi-piece substrate, characterized in that a gap is formed between the two at the time of joining, and an adhesive is inserted into the gap at the time of joining and joined. 8. The method for manufacturing a multi-piece substrate according to claim 4, wherein the cuts are joined by laminating an insulating layer containing an adhesive component. . 9. The method for manufacturing a multi-piece substrate according to claim 4, wherein the cuts are joined after forming the inner layer pattern. 10. The method for manufacturing a multi-piece substrate according to claim 4, wherein the cuts are joined after forming the outermost layer pattern.