JP2002038030A - Flame-retarded resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flame-retarded resin composition excellent in impact resistance and moldability. SOLUTION: This composition contains (A) a thermoplastic resin and (B) aromatic phosphoric esters comprising (b-1) an aromatic phosphoric ester represented by formula (I) and (b-2) an aromatic phosphoric ester represented by formula (II). In formulas (I) and (II), R1 to R8 are each an aryl group provided at least one of R5 to R8 has a substituent; X is a divalent arylene group; and n is an integer of 0 or higher).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a thermoplastic resin and a polyphenylene ether-based resin as main resin components.
The present invention relates to a flame-retardant resin composition having excellent impact resistance and moldability.

[0002]

2. Description of the Related Art Among thermoplastic resins, styrene resins are excellent in moldability and dimensional stability, and are also excellent in impact resistance, rigidity, and electrical insulation. Is used in a variety of fields, including In these fields, since flame retardancy is required, various flame retardants are added. Further, in order to improve mechanical properties, chemical resistance, heat resistance, and the like, a combination of a styrene resin and a polyphenylene ether resin has also been used.

[0003] For example, JP-A-55-118957 discloses a flame-resistant composition in which a halogen-containing aromatic phosphorus compound is blended in a mixture of a polyphenylene ether-based resin and a styrene-based resin. However, this composition is not practical because of insufficient impact resistance. Also, because it contains a large amount of polyphenylene ether-based resin,
The moldability is not sufficient, and it is not suitable for applications such as OA parts having a complicated shape.

Japanese Patent Application Laid-Open No. 9-328572 discloses a flame-retardant resin composition in which an organic phosphorus compound is blended in a mixture of a polyphenylene ether resin having a specific molecular weight and a thermoplastic resin. However, even in this composition, the dispersibility of the polyphenylene ether resin is not sufficient, and the impact resistance cannot be sufficiently improved.

As described above, it is difficult for a resin system composed of a styrene-based resin and a polyphenylene ether-based resin to simultaneously satisfy high flame retardancy in addition to excellent mold release and moldability. It is.

[0006]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a flame-retardant resin composition exhibiting excellent flame retardancy, excellent impact resistance and moldability, and a molding formed from the composition. Is to provide the body.

Another object of the present invention is to provide a flame-retardant resin composition having high fluidity and moldability and a molded article formed from the composition.

[0008]

Means for Solving the Problems The present inventors have conducted intensive studies to achieve the above object, and as a result, when a thermoplastic resin and two specific types of aromatic phosphates are blended, excellent flame retardancy is obtained. The present inventors have found that a flame-retardant resin composition having excellent impact resistance and moldability can be obtained, and have completed the present invention.

That is, the flame-retardant resin composition of the present invention comprises:
A resin composition comprising (A) a thermoplastic resin and (B) an aromatic phosphate, wherein the aromatic phosphate is an aromatic phosphate (b-1) represented by the following formula (I): )
And an aromatic phosphate ester represented by the following formula (II) (b
-2).

[0010]

Embedded image

Wherein R ^{1 to} R ⁸ are an aryl group, and X is 2
And n represents an integer of 0 or more. However,
(At least one of R ^{5 to} R ⁸ has a substituent.) (B) In the aromatic phosphate ester, R ^{1 to} R ⁴ are phenyl groups, and R ^{5 to} R ⁸ are diC _1-4. An alkyl-phenyl group (particularly a 2,6-dimethylphenyl group), and X is preferably a 1,3-phenylene group. As the thermoplastic resin (A), a styrene resin (particularly, a styrene resin containing at least a rubber-modified styrene resin) is preferable. The flame-retardant resin composition may further contain (C) a polyphenylene ether-based resin. The ratio (weight ratio) of the component (b-1) to the component (b-2) is (b-1) / (b-2) = 95/5.
It is about 5/95, preferably about 90/10 to 10/90. The proportion of the component (B) is 0.1 to 50 parts by weight, preferably about 1 to 30 parts by weight, based on 100 parts by weight of the resin component. Ratio (weight ratio) of component (A) and component (C)
Is (A) / (C) = 95/5 to 50/50, preferably about 95/5 to 70/30.

The present invention also includes a molded article formed from the flame-retardant resin composition.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, the impact resistance and moldability can be improved by constituting a resin composition with a thermoplastic resin and a specific aromatic phosphate. Furthermore, you may mix | blend a polyphenylene ether type resin.

[(A) Thermoplastic resin] The thermoplastic resin is not particularly limited, and various thermoplastic resins can be used. As the thermoplastic resin, for example, styrene resin,
Acrylic resins [eg, poly (meth) acrylic acid alkyl esters such as polymethyl methacrylate, polyacrylonitrile, etc.], olefin resins (polyethylene,
Polypropylene resin), vinyl resin (vinyl chloride resin, vinyl acetate resin, ethylene-vinyl acetate copolymer, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, etc.), polyamide resin (nylon 6, nylon 66, nylon) 610, nylon 11, nylon 1
2, nylon 612, nylon 6/66, nylon 6 /
11), polyester resins (poly C _2-4 alkylene terephthalate, poly C _2-4 alkylene naphthalate,
Examples thereof include copolyesters and liquid crystalline polyesters), polycarbonate resins (such as bisphenol A type polycarbonate), and polyphenylene sulfide resins. These thermoplastic resins can be used alone or in combination, alone or in combination of two or more. Among these thermoplastic resins, a resin containing a styrene resin as a main component (for example, 50 to 100% by weight, preferably 70 to 100% by weight) is preferable.

The styrene resin includes a polystyrene resin and a rubber-modified styrene resin. The styrenic resins can be used alone or in combination of two or more kinds, and it is preferable to constitute at least a rubber-modified styrenic resin.

Examples of the aromatic vinyl monomer for forming the polystyrene resin include styrene, alkyl-substituted styrene (for example, vinyltoluene such as o-methylstyrene, m-methylstyrene, p-methylstyrene, and vinylxylene). , P-ethylstyrene, p-isopropylstyrene, butylstyrene, pt-butylstyrene,
2,4-dimethylstyrene, etc.), halogen-substituted styrene (for example, o-chlorostyrene, p-chlorostyrene,
and α-alkyl-substituted styrene in which an alkyl group is substituted at the α-position (eg, α-methylstyrene, α-ethylstyrene, etc.). These aromatic vinyl monomers can be used alone or in combination of two or more. Of these monomers, styrene, vinyltoluene, α-methylstyrene and the like, particularly styrene, are usually used.

The polystyrene resin may be a copolymer of the aromatic vinyl monomer and a copolymerizable monomer. Examples of the copolymerizable monomer include, for example, a vinyl cyanide monomer (eg, acrylonitrile, methacrylonitrile, etc.), an unsaturated polycarboxylic acid or an acid anhydride thereof (eg, maleic acid, itaconic acid, Citraconic acid, maleic anhydride, itaconic anhydride, citraconic anhydride, etc.), imide-based monomers [eg, N-alkylmaleimide (eg, N-methylmaleimide, N-ethylmaleimide, etc.), N-cycloalkylmaleimide ( For example, N
-Cyclohexylmaleimide), N-arylmaleimide (for example, N-phenylmaleimide, N- (2-
Methylphenyl) maleimide, etc.)] and acrylic monomers [eg, (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate , Such as amyl (meth) acrylate, hexyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, dodecyl (meth) acrylate, and octadecyl (meth) acrylate ) C _1-20 alkyl acrylate, cyclohexyl (meth) acrylate,
Phenyl (meth) acrylate, benzyl (meth) acrylate, glycidyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, (meth) 2-hydroxypropyl and the like]. These copolymerizable monomers can be used alone or in combination of two or more.
The amount of the copolymerizable monomer in all the monomers is from 1 to 50.
%, Preferably 5 to 40% by weight, more preferably 8 to 30% by weight.

Among these polystyrene resins, polystyrene (GPPS); poly (α-methylstyrene);
A styrene-acrylonitrile copolymer (AS resin); a styrene-maleic anhydride copolymer (SMA resin), etc., particularly GPPS are preferred.

The rubber-modified polystyrene-based resin is a polymer in which a rubber-like polymer is dispersed in a matrix in the matrix composed of the above-mentioned polystyrene-based resin, such as a blend, a copolymer (graft polymerization, block polymerization, etc.). Thereby, a rubbery polymer can be contained in the polystyrene resin. Preferred rubber-modified polystyrene resins are generally prepared by subjecting a monomer mixture containing at least an aromatic vinyl monomer to a conventional method (bulk polymerization, bulk suspension polymerization, solution polymerization, emulsion polymerization) in the presence of a rubbery polymer. Etc.) to obtain a graft copolymer.

Examples of the rubbery polymer include diene rubber [polybutadiene (low cis or high cis polybutadiene), polyisoprene, styrene-butadiene copolymer, styrene-isoprene copolymer, butadiene-acrylonitrile copolymer. Coal, isobutylene-isoprene copolymer, styrene-isobutylene-butadiene copolymer rubber, butadiene- (meth) acrylate copolymer, etc.], ethylene-vinyl acetate copolymer, acrylic rubber (polybutyl acrylate, etc.), Ethylene-α-olefin copolymer [ethylene-propylene rubber (EP
R) etc.], ethylene-α-olefin-polyene copolymer [ethylene-propylene-diene rubber (EPDM)
Etc.], urethane rubber, silicone rubber, butyl rubber,
Examples include hydrogenated diene-based rubbers (hydrogenated styrene-butadiene copolymer, hydrogenated butadiene-based polymer, and the like), ethylene ionomers, and the like. The above copolymer may be a random or block copolymer, and the block copolymer includes an AB type, an ABA type, a taper type, a copolymer having a radial teleblock type structure, and the like. . The hydrogenated butadiene-based polymer includes, in addition to the hydrogenated product of the block copolymer, a hydrogenated product of a styrene block and a block of a styrene-butadiene random copolymer, and a 1,2-vinyl bond in polybutadiene. Quantity 20
Weight% or less of the block and 1,2-vinyl bond amount of 20
Includes hydrides of polymers consisting of polybutadiene blocks in excess of% by weight. These rubbery polymers can be used alone or in combination of two or more.

Preferred rubbery polymers are polymers of conjugated 1,3-dienes or derivatives thereof, especially diene rubbers [polybutadiene (butadiene rubber), isoprene rubber, styrene-butadiene copolymer, etc.].

In the rubber-modified polystyrene resin, the content of the rubbery polymer is, for example, 3 to 80% by weight, preferably 4 to 70% by weight, particularly preferably 5 to 55% by weight.
(For example, 6 to 60% by weight).

The form of the rubbery polymer dispersed in the matrix composed of the polystyrene resin is not particularly limited, and may include a core / shell structure, an onion structure, a salami structure and the like. The particle diameter of the rubbery polymer constituting the dispersed phase is, for example, 0.05 to 30 μm, preferably 0.1 to 10 μm, according to the use of the resin composition.
m, more preferably 0.2 to 7 μm (particularly 0.5 to 5 μm).
μm). The graft ratio of the rubber-modified styrene resin is 5 to 150%, preferably about 10 to 150%.

Of these rubber-modified styrenic resins,
High impact polystyrene (HIPS), styrene-butadiene copolymer, styrene-acrylonitrile-butadiene copolymer (ABS resin), α-methylstyrene-modified A
HIPS is particularly preferable, such as BS resin and imide-modified ABS resin.

The weight average molecular weight of the styrene resin (styrene resin constituting the matrix in the case of the graft copolymer) is from 10,000 to 1,000,000, preferably from 50,000 to 500,000, and more preferably from 50,000 to 500,000. It is about 100,000 to 500,000.

[(B) Aromatic phosphate ester] The aromatic phosphate ester is an aromatic phosphate ester (b-1) represented by the above formula (I) and an aromatic phosphate ester represented by the above formula (II). It is composed of an aromatic phosphate (b-2). That is, the aryl group-unsubstituted aromatic phosphate (b-1)
By combining the compound with the aromatic phosphate (b-2) having an aryl group having a substituent, it is possible to achieve a high level of impact resistance while suppressing a decrease in heat resistance.

In the above formula, examples of the aryl group represented by R ^{1 to} R ⁸ include a phenyl group and a naphthyl group, and a phenyl group is preferred. Examples of the substituent of the aryl group in R ^{5 to} R ⁸ include methyl, ethyl,
Alkyl groups such as propyl, isopropyl, butyl and isobutyl; hydroxyl groups; alkoxy groups such as methoxy, ethoxy and butoxy; alkylthio groups such as methylthio and ethylthio; and C _1-4 alkyl groups (particularly methyl groups). preferable. Among the R ⁵ to R ^8, at least one has a substituent, R ⁵ all to R ⁸ are preferably has a substituent. The number of substituents in each aryl group is plural (preferably 2 to 3, especially 2).
Are preferably substituted.

The divalent arylene group of X means a divalent polyphenol residue. For example, optionally substituted phenylene group, polynuclear phenols (for example,
Bisphenols), and the relative position of the bond of the arylene group is arbitrary (for example, o-,
m-, p-position). As a compound corresponding to X,
Dihydroxybenzenes (eg, hydroquinone, resorcinol, etc.), bis (hydroxyphenyl) alkanes [bis (4-hydroxyphenyl) methane, 2,2-
Bis (4-hydroxyphenyl) propane (so-called bisphenol A) etc.], dihydroxydiaryls (dihydroxydiphenyl, dihydroxynaphthalene etc.),
p, p'-dihydroxydiphenyl sulfone, bis (4
-Hydroxyphenyl) sulfide, bis (4-hydroxyphenyl) sulfone, bis (4-hydroxyphenyl) ketone, bis (4-hydroxyphenyl) ether and the like. X is preferably a phenylene group, particularly a 1,3-phenylene group.

In the above formula, n represents the degree of condensation of the aromatic phosphate. Oligomer-type aromatic phosphates are generally a mixture of aromatic phosphates having different degrees of condensation, and are therefore often expressed as an average value of the degree of condensation,
The average value of n is generally 5 or less, preferably about 0.5 to 3, and more preferably about 0.7 to 2.

Examples of the aromatic phosphate (b-1) include monophosphates such as triphenyl phosphate and trinaphthyl phosphate; resorcinol bis (diphenyl phosphate), hydroquinone bis (diphenyl phosphate) and bisphenol A bis (diphenyl phosphate). ) And polyphosphate oligomers. Among these, resorcinol-type bisphosphates, particularly resorcinol bis (diphenyl phosphate), are preferred.

As the aromatic phosphate (b-2), for example, tricresyl phosphate, trixylenyl phosphate, tris (isopropylphenyl) phosphate, tris (o-phenylphenyl) phosphate, tris (p-phenylphenyl) ) Monophosphates such as phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, di (isopropylphenyl) phenyl phosphate, o-phenylphenyl dicresyl phosphate, dipyrocatechol hypophosphate, resorcinol bis (dicresyl phosphate), resorcinol Bis (dixylenyl phosphate), resorcinol bis (di-2,6-dimethylphenyl phosphate), hydroquinone bis (dicresyl phosphate) Hydroquinone bis (magnetic Sile nil phosphate), hydroquinone bis (di-2,6
Bisphosphates such as dimethylphenyl phosphate), bisphenol A bis (dicresyl phosphate), bisphenol A bis (dicylenyl phosphate), bisphenol A bis (di-2,6-dimethylphenyl phosphate), and polyphosphate oligomers. . Among these, resorcinol-type bisphosphates, particularly resorcinol bis (di-2,6-dimethylphenyl phosphate), are particularly preferred.

The ratio (weight ratio) of the component (b-1) to the component (b-2) is (b-1) / (b-2) = 95 / 5-5.
/ 95, preferably 90/10 to 10/90, more preferably 80/20 to 20/80 (particularly 30/70 to 7
0/30).

The proportion of the component (B) is 0.1 to 50 parts by weight, preferably 1 to 30 parts by weight, per 100 parts by weight of the resin component.
Parts by weight, more preferably about 5 to 20 parts by weight.

[(C) Polyphenylene ether resin]
The polyphenylene ether-based resin includes a homopolymer or a copolymer having a repeating unit represented by the following general formulas (V) and / or (VI). These polyphenylene ether resins can be used alone or in combination of two or more.

[0035]

Embedded image

[Wherein R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ ,
R ¹⁴ is each independently an alkyl group having 1 to 4 carbon atoms (such as a methyl, ethyl, propyl, butyl, or t-butyl group);
Indicates an aryl group (such as a phenyl group) or a hydrogen atom. However, R ¹³ and R ¹⁴ are not hydrogen atoms at the same time.] As the polyphenylene ether-based resin, a homopolymer,
For example, poly (2,6-dimethyl-1,4-phenylene) ether, poly (2-methyl-6-ethyl-1,4)
-Phenylene) ether, poly (2,6-diethyl-)
1,4-phenylene) ether, poly (2-methyl-6)
-N-propyl-1,4-phenylene) ether, poly (2-ethyl-6-n-propyl-1,4-phenylene) ether, poly (2,6-di-n-propyl-1,
4-phenylene) ether, poly (2-methyl-6-n
-Butyl-1,4-phenylene) ether, poly (2-
Ethyl-6-isopropyl-1,4-phenylene) ether, poly (2-methyl-6-hydroxyethyl-1,
And poly (2,6-dialkyl-1,4-phenylene) ethers such as 4-phenylene) ether. Among these resins, poly (2,6-dimethyl-1,4-phenylene) ether is particularly preferred.

As the polyphenylene ether-based copolymer, a copolymer having a phenylene ether structure as a main monomer unit can be used, and a monomer (particularly, 2,6-dimethylphenol, etc.) forming the homopolymer can be used. And other phenols, such as 2,6-dialkylphenol (especially 2,6-dimethylphenol) and phenols [especially, trialkylphenols (2,3
And at least one selected from monoalkylphenols (such as o-cresol)].

The weight average molecular weight of the polyphenylene ether resin is 25,000 to 60,000, preferably 3
000-55,000, more preferably 40,0
It is about 00 to 50,000.

The ratio (weight ratio) of component (A) to component (C) is (A) / (C) = 95/5 to 50/50, preferably 95/5 to 70/30, and more preferably. 90 /
It is about 10-80 / 20.

[Other Additives] The flame-retardant resin composition of the present invention may contain, if necessary, a flame retardant (other phosphorus-based flame retardant, halogen-based flame retardant, inorganic flame retardant, etc.), Agents, anti-dripping agents (eg, particulate fluororesin), fillers (eg, particulate or fibrous fillers such as glass fibers, carbon fibers, and inorganic fillers), fluidity improvers, stabilizers (eg, antioxidants) , Ultraviolet absorbers, light stabilizers, heat stabilizers, etc.), reinforcing agents, antistatic agents, lubricants, release agents, impact modifiers, reinforcing agents, hue improvers, colorants, plasticizers, compatibilizers, Dispersant,
It may contain a foaming agent, an antibacterial agent and the like. These additives can be used alone or in combination of two or more.

Among these additives, it is preferable to use a polyolefin wax as a release agent. Examples of the polyolefin-based wax include a polyethylene wax, a polypropylene wax, an olefin copolymer wax (for example, an ethylene copolymer wax), and a partial oxide thereof or a mixture thereof. Examples of the olefin copolymer include olefins (ethylene, propylene, butene-1, hexene-1, decene-1, 4-methylbutene-1, 4-methylpentene-).
Copolymers of α-olefins such as 1), monomers copolymerizable with these olefins, for example, unsaturated carboxylic acids or anhydrides thereof [maleic anhydride, (meth) acrylic acid, etc.], (meth) Acrylic esters [(meth) such as methyl (meth) acrylate, ethyl (meth) acrylate]
And other polymerizable monomers such as C _1-6 alkyl acrylate]. In addition, these copolymers include a random copolymer, a block copolymer, and a graft copolymer. The olefin copolymer wax is generally a copolymer of ethylene and at least one monomer selected from other olefins and polymerizable monomers. Of these polyolefin waxes, polyethylene wax is preferred. The polyolefin wax may have a linear or branched structure.

The density of the polyolefin wax is 0.1.
It is about 86 to 0.98 g / ml, and the melting point is 100 to
It is about 160 ° C. In particular, the density of the polyethylene wax is 0.86 to 0.96 g / ml, preferably 0.96 g / ml.
0 to 0.95 g / ml, more preferably 0.92 to
The melt viscosity at 140 ° C. is about 0.96 g / ml and 200 to 600 cps, preferably 300 to 550.
cps, more preferably about 400 to 500 cps, and the melting point is 100 to 130 ° C., preferably 105 to 150 cps.
The temperature is about 125 ° C., more preferably about 110 to 120 ° C., and the weight average molecular weight is about 1,000 to 12,000.

The polyolefin wax can be produced by a conventional method. For example, it can be obtained by polymerizing ethylene or ethylene and a copolymerizable monomer in the presence of an initiator.

The ratio of the polyolefin wax is about 0.1 to 2 parts by weight based on 100 parts by weight of the resin component.

In the present invention, the releasability of the resin composition is remarkably improved by blending a polyolefin-based wax (particularly, a polyethylene wax having a melt viscosity at 140 ° C. of 200 to 600 cps). It is suitable as a molding material.

[Production Method] The flame-retardant resin composition of the present invention is prepared by mixing a predetermined amount of each component with, for example, a Henschel mixer.
It may be prepared by mixing in a dry or wet manner using a conventional mixer such as a tumbler mixer or a kneader. In many cases, the resin composition is usually prepared by preliminarily mixing with the mixer and then kneading with an extruder or melt-kneading with a kneader such as a heating roll or a Banbury mixer. Melt kneading can be performed under appropriate conditions according to each component, for example, at a temperature of about 150 to 250 ° C.

The flame-retardant resin composition thus obtained can be formed into various molded articles by injection molding, extrusion molding, vacuum molding, irregular molding, foam molding, injection press, press molding, blow molding, gas injection molding and the like. Can be molded. Further, the flame-retardant resin composition of the present invention is excellent in mold releasability from a mold and has a wide moldable range.
The molding cycle can be shortened, and molding can be performed stably and efficiently.

The flame-retardant resin composition of the present invention can be used in a wide range of applications, for example, OA / home electric appliance field, electric / electronic field, communication equipment field, sanitary field, automobile field, housing related field such as furniture / building material, etc. Although it can be used for various parts, housings, chassis, etc. in the miscellaneous goods field, among these uses, it is useful as a molding material for OA equipment parts, particularly toner cartridge containers.

[0049]

The flame-retardant resin composition of the present invention combines a thermoplastic resin, two specific types of aromatic phosphate esters, and, if necessary, a polyphenylene ether-based resin, thereby providing excellent flame retardancy. It has excellent impact resistance, moldability and fluidity.

[0050]

The present invention will be described more specifically with reference to the following examples. However, the present invention is not limited at all by these examples. In the following example,
Parts and percentages are by weight.

Examples 1-3 and Comparative Examples 1-2 Melts were kneaded at 230 ° C using a twin-screw extruder in the composition shown in Table 1 and pelletized. After sufficiently drying the pellet thus obtained, a test piece was prepared by injection molding and evaluated by the following method. The results are shown in Tables 1 and 2.

[Thermal Deflection Temperature] A load of 1.82 × 10 ⁶ Pa (18.6 kg / c) in accordance with ASTM D648.
m ² ).

[Izod Impact Strength (IS)] ASTM
Izod impact strength (mold, cutting) was measured according to D256.

[MI] In accordance with ASTM D 1238, it was determined from the extruded amount per 10 minutes (g / 10 minutes) under the conditions of a load of 49 N (5 kg) and a melting temperature of 200 ° C.

[Flame retardancy] According to the UL-94 test method,
Evaluation was performed using a test piece having a thickness of 1.3 mm.

[Components used in Examples and Comparative Examples] (A) Thermoplastic resin HIPS: H53C manufactured by Toyo Styrene Co., Ltd. (B) Aromatic phosphate ester Phosphorus-based flame retardant 1 [1,3- Phenylene bis (diphenyl phosphate)]: CR-7, manufactured by Daihachi Chemical Industry Co., Ltd.
33S Phosphorus-based flame retardant 2 [1,3-phenylenebis (di-2,
6-dimethylphenyl phosphate)]: Daihachi Chemical Industry Co., Ltd., PX-200 (C) Polyphenylene ether-based resin • Poly (2,6-dimethyl-1,4-phenylene) ether (PPE): Mitsubishi Engineering Plastics YPX100F, Mw48,000, other additives manufactured by K.K .. Royal Black, Koshigaya Chemical Co., Ltd.

[0057]

[Table 1]

From the results shown in Table 1, when only one kind of aromatic phosphate was used (Comparative Example), both impact resistance and fluidity were poor. On the other hand, the flame-retardant resin compositions of Examples were excellent in both impact resistance and fluidity.
Has an excellent balance of various physical properties.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08L 71/12 C08L 71/12 85/02 85/02 F-term (Reference) 4F071 AA12 AA22 AA51 AA68 AC15 AE05 AF47 AF57 BA01 BB05 BB06 BC00 BC07 4J002 AC033 AC063 AC073 AC083 BB03W BB06W BB063 BB10W BB12W BB153 BB183 BB233 BC02W BC053 BD03W BE02W BE03W BF02W BF03W BF033 BG04W BG043 BG05W BG06W BG10W CF06W CF07W CG00W CH07X CK023 CL01W CL03W CN01W CP013 CP033 CQ014 EW046 FD134 FD136

Claims (11)

[Claims] 1. A resin composition comprising (A) a thermoplastic resin and (B) an aromatic phosphate, wherein the aromatic phosphate is an aromatic phosphate represented by the following formula (I): A flame-retardant resin composition comprising an ester (b-1) and an aromatic phosphate (b-2) represented by the following formula (II). Embedded image (Wherein, R ^{1 to} R ⁸ represent an aryl group, X represents a divalent arylene group, and n represents an integer of 0 or more, provided that at least one of R ^{5 to} R ⁸ has a substituent. are doing) 2. In the aromatic phosphate ester (B),
R ^{1 to} R ⁴ are phenyl groups, and R ^{5 to} R ^{8 are} diC _1-4 alkyl-
A phenyl group and X is a 1,3-phenylene group.
The flame-retardant resin composition according to claim 1. 3. The flame-retardant resin composition according to claim 2, wherein R ^{5 to} R ⁸ are 2,6-dimethylphenyl groups. 4. The flame-retardant resin composition according to claim 1, wherein (A) the thermoplastic resin is a styrene resin. 5. The flame-retardant resin composition according to claim 4, wherein the styrene resin contains at least a rubber-modified styrene resin. 6. The flame-retardant resin composition according to claim 1, further comprising (C) a polyphenylene ether-based resin. 7. The method according to claim 1, wherein the ratio of the component (b-1) to the component (b-2) is (b-1) / (b-2) = 95/5 to 5/95. Flammable resin composition. 8. The flame-retardant resin composition according to claim 1, wherein the proportion of the component (B) is 0.1 to 50 parts by weight based on 100 parts by weight of the resin component. 9. The flame-retardant resin composition according to claim 6, wherein the ratio (weight ratio) of the component (A) to the component (C) is (A) / (C) = 95/5 to 50/50. object. 10. A rubber-modified styrenic resin,
(B) an aromatic phosphate (b-1) represented by the following formula (III) and an aromatic phosphate (b-2) represented by the following formula (IV), and (C) a polyphenylene ether-based A resin composition containing a resin, comprising: a component (A);
The ratio (weight ratio) to the components is (A) / (C) = 95/5
And the proportion of the component (B) is 1 to 30 parts by weight based on 100 parts by weight of the total of the component (A) and the component (C), and the component (b-1) and the component (b) The ratio (weight ratio) to the component (b-2) is (b-1) / (b-2) = 90/1.
0 to 10/90, a flame-retardant resin composition. Embedded image Embedded image (Where n represents an integer of 0 or more) 11. A molded article formed from the flame-retardant resin composition according to claim 1.