JP2002037684A - Regenerating method of silicon carbide-coated graphite element and silicon carbide-coated graphite element by the method - Google Patents

Regenerating method of silicon carbide-coated graphite element and silicon carbide-coated graphite element by the method

Info

Publication number
JP2002037684A
JP2002037684A JP2000225674A JP2000225674A JP2002037684A JP 2002037684 A JP2002037684 A JP 2002037684A JP 2000225674 A JP2000225674 A JP 2000225674A JP 2000225674 A JP2000225674 A JP 2000225674A JP 2002037684 A JP2002037684 A JP 2002037684A
Authority
JP
Japan
Prior art keywords
sic
coated
silicon carbide
graphite element
coated graphite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000225674A
Other languages
Japanese (ja)
Other versions
JP4447131B2 (en
Inventor
Teruhisa Kondo
照久 近藤
Hiroyuki Hirano
博之 平野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Tanso Co Ltd
Original Assignee
Toyo Tanso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tanso Co Ltd filed Critical Toyo Tanso Co Ltd
Priority to JP2000225674A priority Critical patent/JP4447131B2/en
Publication of JP2002037684A publication Critical patent/JP2002037684A/en
Application granted granted Critical
Publication of JP4447131B2 publication Critical patent/JP4447131B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a regenerating method of a SiC coated-graphite element, and a SiC coated-graphite element which is regenerated by the method. The SiC-coated graphite element which has become its life end consisting of a SiC- coated graphite element, and used as an element for pulling up monocrystal, and as a suscepter for the epitaxial growth of a silicon wafer in a semiconductor manufacturing process which can homogeneously remove surface-coated SiC, can use a small type exhaust gas treating device and can reduce the semiconductor manufacturing cost. SOLUTION: The SiC-coated graphite element is reused after coating SiC with CVD method on the base material which is evaporated the surface coated SiC at a temperature not less than 1700 deg.C, under pressure not higher than 1.33 kPa, in an innert gas atmosphere or under pressure not higher than 1.33 kPa in an innert gas atmosphere.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ライフエンドにな
った炭化ケイ素被覆黒鉛部材の再生方法及びその方法に
よって再生された炭化ケイ素被覆黒鉛部材に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for regenerating a silicon carbide-coated graphite member that has reached the end of its life and to a silicon carbide-coated graphite member regenerated by the method.

【0002】[0002]

【従来の技術】従来から、炭化ケイ素被覆黒鉛部材は、
半導体製造装置用部材や、ガラス製品製造装置用部材等
の耐熱性、耐食性、耐熱衝撃性が要求される部位等に広
く使用されている。例えば、半導体製造工程における単
結晶引き上げ用部材や、Siウェハーのエピタキシャル
成長用サセプター等に、高純度等方性黒鉛材の表面に化
学気相蒸着法(以下、CVD法という。)によって炭化
ケイ素(以下、SiCという。)を被覆したSiC被覆
黒鉛部材が使用されている。これら、SiC被覆黒鉛部
材は表面に被覆されているSiCに、半導体製造工程中
に何らかの原因で混入した不純物等に起因すると思われ
る剥離や、ピンホール等の欠陥が発生した時点でその使
用を中止し、ライフエンドとして廃棄処分されていた。
2. Description of the Related Art Conventionally, graphite members coated with silicon carbide have been
It is widely used in parts for which heat resistance, corrosion resistance and thermal shock resistance are required, such as members for semiconductor manufacturing equipment and members for glass product manufacturing equipment. For example, silicon carbide (hereinafter, referred to as CVD method) on a surface of a high-purity isotropic graphite material for a member for pulling a single crystal in a semiconductor manufacturing process, a susceptor for epitaxial growth of a Si wafer, or the like. , SiC) is used. The use of these SiC-coated graphite members is discontinued when the surface of the SiC is peeled off or imperfections such as pinholes, which are thought to be caused by impurities mixed in for some reason during the semiconductor manufacturing process. And was disposed of as a life end.

【0003】[0003]

【発明が解決しようとする課題】近年の半導体関連製品
の需要の急増により、半導体価格が下落し、半導体製造
メーカーにとっては、半導体製造コストの削減が必須と
なり、半導体製造工程において、ライフエンドとなった
SiC被覆黒鉛材からなる部材の再生が要望されてい
る。
With the rapid increase in demand for semiconductor-related products in recent years, semiconductor prices have fallen, and it has become essential for semiconductor manufacturers to reduce semiconductor manufacturing costs. There is a demand for recycling of members made of graphite materials coated with SiC.

【0004】そこで、例えば、特開平9−241086
号公報には、炭化ケイ素被覆黒鉛部材をハロゲンを含む
ガスに接触させて加熱することによって、炭化ケイ素の
被膜を炭素層に変換し、この炭素層を除去した後の黒鉛
基材上に炭化ケイ素の被膜を形成して炭化ケイ素被覆黒
鉛部材を得る炭化ケイ素被覆黒鉛部材の再生方法が開示
されている。
For example, Japanese Patent Application Laid-Open No. 9-241086 discloses
Japanese Patent Application Laid-Open No. H11-163873 discloses that a silicon carbide-coated graphite member is contacted with a gas containing halogen and heated to convert the silicon carbide coating into a carbon layer. A method of regenerating a silicon carbide-coated graphite member by forming a film of the above-described method to obtain a silicon carbide-coated graphite member is disclosed.

【0005】しかしながら、この方法は、表面に被覆さ
れている炭化ケイ素の被膜を高価なハロゲンを含むガス
に接触させて加熱させるため、この時に使用されるハロ
ゲンを含むガスの処理及びこのハロゲンを含むガスによ
って、分解、昇華するSiガスの処理のために、大型の
排ガス処理装置が必要となり、半導体製造コストの大幅
な削減にはいたらなかった。また、ハロゲンを含むガス
による処理のため、選択的な反応で、不均一にSiCが
除去される可能性があった。
However, in this method, since the silicon carbide film coated on the surface is heated by being brought into contact with an expensive halogen-containing gas, treatment of the halogen-containing gas used at that time and the halogen-containing gas are included. A large exhaust gas treatment device is required for treating Si gas that decomposes and sublimates depending on the gas, and the semiconductor manufacturing cost has not been significantly reduced. Further, since the treatment is performed using a gas containing halogen, there is a possibility that SiC may be unevenly removed by a selective reaction.

【0006】そこで、本発明は、表面に被覆されている
SiCを均一に除去でき、小型の排ガス処理装置が使用
でき、半導体製造コストの削減を可能とする半導体製造
工程における単結晶引き上げ用部材や、Siウェハーの
エピタキシャル成長用サセプター等に用いられ、ライフ
エンドとなったSiC被覆黒鉛材からなるSiC被覆黒
鉛部材の再生方法及びその方法によって再生されたSi
C被覆黒鉛部材を提供することを目的とする。
Accordingly, the present invention provides a member for pulling a single crystal in a semiconductor manufacturing process capable of uniformly removing SiC coated on the surface, using a small exhaust gas treatment device, and reducing semiconductor manufacturing costs. , A method of regenerating a SiC-coated graphite member made of a SiC-coated graphite material and used as a susceptor for epitaxial growth of a Si wafer and having a life end, and Si regenerated by the method.
An object is to provide a C-coated graphite member.

【0007】[0007]

【課題を解決するための手段】前記課題を解決するため
の本発明の黒鉛基材に炭化ケイ素を被覆した炭化ケイ素
被覆黒鉛部材の再生方法は、表面に被覆されたSiCを
1700℃以上で、1.33kPa以下の圧力下、又
は、不活性ガス雰囲気下、又は、1.33kPa以下の
圧力下の不活性ガス雰囲気下で熱処理して昇華させて除
去した前記黒鉛基材に、CVD法によりSiCを被覆す
ることを特徴とする。また、前記熱処理後に、黒鉛材を
高純度化処理する際に使用する一般的な高純度化処理炉
を使用してハロゲンを含むガス雰囲気下において200
0℃以上で熱処理し、表面のSiCを完全に除去すると
共に、表面層付近の不純物を除去する高純度化処理を適
宜付加することができる。これにより、CVD法により
SiCを再度被覆した時に不純物等に起因すると思われ
るSiCの剥離等を防ぐことができるからである。な
お、ここでいうSiC被覆黒鉛部材とは、具体的には、
単結晶引き上げ用炉に用いられる部材、例えばルツボ
や、上部、下部リング、或いは上部、下部コーン等や、
エピタキシャル成長用サセプターとして用いられるパン
ケーキサセプター、バレルサセプターや、その他ヒータ
ー、レーザーミラー、金属融解用耐火物、耐酸化性部材
等のSiC被覆された黒鉛材の全てを含むものである。
In order to solve the above-mentioned problems, a method for regenerating a silicon carbide-coated graphite member in which a graphite base material is coated with silicon carbide according to the present invention comprises the steps of: The graphite substrate removed by heat treatment under a pressure of 1.33 kPa or less or under an inert gas atmosphere or under an inert gas atmosphere under a pressure of 1.33 kPa or less is subjected to SiC by CVD. Is coated. Further, after the heat treatment, a general purifying furnace used for purifying the graphite material may be used in a gas atmosphere containing halogen for 200 hours.
A heat treatment at 0 ° C. or higher can completely remove SiC on the surface, and can appropriately add a high-purity treatment for removing impurities near the surface layer. This is because it is possible to prevent the SiC from being separated due to impurities and the like when the SiC is coated again by the CVD method. In addition, the SiC-coated graphite member mentioned here is, specifically,
The members used for the single crystal pulling furnace, such as crucibles, upper and lower rings, or upper and lower cones,
It includes pancake susceptors and barrel susceptors used as susceptors for epitaxial growth, and all other graphite materials coated with SiC such as heaters, laser mirrors, refractories for melting metals, and oxidation-resistant members.

【0008】このように、本発明は、基材である黒鉛材
の表面に被覆されたSiCを1700℃以上、好ましく
は2000℃以上、さらに好ましくは2500℃以上
で、10時間以上、好ましくは20時間以上熱処理する
ことで、SiCを昇華させて、黒鉛材表面から除去する
ものである。
[0008] As described above, the present invention provides a method for removing SiC coated on the surface of a graphite material as a substrate at 1700 ° C or more, preferably 2000 ° C or more, more preferably 2500 ° C or more, for 10 hours or more, preferably 20 By performing heat treatment for more than an hour, SiC is sublimated and removed from the graphite material surface.

【0009】一般に、半導体製造工程に使用されたエピ
タキシャル成長用サセプターの、SiCの表面には、金
属シリコンが付着しているが、前述のように、1700
℃以上、好ましくは2000℃以上、さらに好ましくは
2500℃以上で、10時間以上、好ましくは20時間
以上熱処理すると、SiCとともに除去することが可能
となる。この金属シリコンは前処理として、フッ硝酸溶
液で溶解させるか、あるいは、研削砥石で機械的に除去
してもよい。
Generally, metallic silicon is attached to the surface of SiC of the susceptor for epitaxial growth used in the semiconductor manufacturing process.
When heat-treated at a temperature of at least 2000C, preferably at least 2500C, more preferably at least 2500C, for at least 10 hours, preferably at least 20 hours, it becomes possible to remove together with SiC. This metal silicon may be dissolved in a hydrofluoric / nitric acid solution or mechanically removed with a grinding wheel as a pretreatment.

【0010】さらに、この熱処理は、1.33kPa以
下の圧力下、好ましくは0.67kPa以下の圧力下又
は/及び不活性ガス雰囲気、例えば、アルゴンガス、窒
素ガス、特に、アルゴンガス雰囲気下で行う。このよう
に低い圧力下で熱処理することにより、表面に被覆され
ているSiCの昇華を促進することができ、SiCを均
一に除去できる。また、熱処理時の雰囲気の酸素分圧を
低くすることで、熱処理後に黒鉛材表面に二酸化ケイ素
等が残存すること無く、SiCを除去することができ
る。なお、この際、表面にSiCが若干残っていてもよ
い。このように、SiCを除去する際に、ハロゲンを含
むガスを使用しないため、安全性に優れ、且つ大型の排
ガス処理設備を特に必要としない。
Further, the heat treatment is performed under a pressure of 1.33 kPa or less, preferably under a pressure of 0.67 kPa or less and / or in an inert gas atmosphere, for example, an argon gas, a nitrogen gas, especially an argon gas atmosphere. . By performing the heat treatment under such a low pressure, sublimation of the SiC coated on the surface can be promoted, and the SiC can be uniformly removed. Further, by lowering the oxygen partial pressure of the atmosphere during the heat treatment, SiC can be removed without silicon dioxide or the like remaining on the surface of the graphite material after the heat treatment. At this time, some SiC may remain on the surface. As described above, when removing SiC, a gas containing halogen is not used, so that safety is excellent and a large-sized exhaust gas treatment facility is not particularly required.

【0011】前述の熱処理後に、その表面にSiCを被
覆することで、SiC被覆黒鉛部材として使用すること
が可能となるが、熱処理後、さらに、ハロゲンガス雰囲
気下において、2000℃以上、10時間以上で処理す
ることが好ましい。これにより、SiCを完全に除去す
るとともに、表面部の不純物を除去することができ、S
iC被覆直後のSiCの剥離やピンホールの発生を抑制
することができる。また、ハロゲンガス雰囲気下での処
理前にセラミックス粉末等でブラスト処理を行ってもよ
い。
[0011] By coating the surface with SiC after the above-mentioned heat treatment, it becomes possible to use it as a SiC-coated graphite member. It is preferred to treat with. As a result, SiC can be completely removed, and impurities on the surface can be removed.
Exfoliation of SiC and generation of pinholes immediately after iC coating can be suppressed. In addition, blasting may be performed with ceramic powder or the like before the treatment in a halogen gas atmosphere.

【0012】表面のSiCを除去後、CVD法によって
その黒鉛材の表面に再度SiCを被覆する。CVD法に
使用される原料ガスとしては、SiCl4 とC3 8
混合ガスや、SiH4 とC3 8 の混合ガス等が例示で
きる。この原料ガスにキャリアーガスとして水素ガスを
使用して、1000〜1600℃、0.001〜0.1
MPaという条件で、CVD処理を行い、黒鉛材の表面
をSiCで被覆することで、SiC被覆黒鉛部材として
再利用することができる。ここで、SiCの厚みは、3
0〜200μm、好ましくは60〜150μmとなるよ
うにする。
After removing the surface SiC, the surface of the graphite material is coated again with the SiC by the CVD method. As a raw material gas used in the CVD method, a mixed gas of SiCl 4 and C 3 H 8, a mixed gas of SiH 4 and C 3 H 8 and the like can be exemplified. Using hydrogen gas as a carrier gas for this source gas, 1000 to 1600 ° C., 0.001 to 0.1
By performing the CVD process under the condition of MPa and coating the surface of the graphite material with SiC, it can be reused as a SiC-coated graphite member. Here, the thickness of SiC is 3
The thickness is set to 0 to 200 μm, preferably 60 to 150 μm.

【0013】以上のようにして、ライフエンドとなった
SiC被覆黒鉛部材の表面を被覆したSiCを除去する
ことができ、その表面に再度高純度なSiCをCVD法
により被覆することで、SiC被覆黒鉛部材として再利
用することが可能となる。
As described above, the SiC coated on the surface of the SiC-coated graphite member which has reached the end of its life can be removed, and the surface is coated with high-purity SiC again by the CVD method. It can be reused as a graphite member.

【0014】[0014]

【実施例】エピタキシャル成長用サセプターとして使用
し、その表面に何らかの原因で発生したピンホールのた
めにライフエンドとなったサセプターを2500℃、1
3.3Paで72時間の熱処理を行った。次に、その表
面にSiCl4 とC3 8の混合ガスを原料ガスとし
て、キャリアーガスとして水素ガスを使用して、130
0℃、0.1MPaで、CVD処理を行い、SiCを1
20μmの厚みで形成した。このようにして、再度Si
Cを被覆したのち、エピタキシャル成長用サセプターと
して使用したが、シリコンウェハー上に形成される結晶
にも、異常が見られず、エピタキシャル成長用サセプタ
ーとして再利用することが可能となった。
EXAMPLE A susceptor which was used as a susceptor for epitaxial growth and had a life end due to a pinhole generated for some reason on its surface was heated at 2500 ° C.
Heat treatment was performed at 3.3 Pa for 72 hours. Next, a mixed gas of SiCl 4 and C 3 H 8 was used as a source gas on the surface thereof, and hydrogen gas was used as a carrier gas.
CVD treatment is performed at 0 ° C. and 0.1 MPa to reduce SiC to 1
It was formed with a thickness of 20 μm. In this way, Si
After being coated with C, it was used as a susceptor for epitaxial growth. However, no abnormality was found in the crystals formed on the silicon wafer, and it was possible to reuse it as a susceptor for epitaxial growth.

【0015】[0015]

【発明の効果】本発明は以上のように構成されており、
ライフエンドとなったSiC被覆黒鉛部材の表面に被覆
されたSiCを除去することができ、その表面に再度高
純度なSiCをCVD法により被覆することで、SiC
被覆黒鉛部材として再利用することが可能となり、半導
体製造コストの低減と共に、産業廃棄物の削減を行うこ
とができる効果を奏する。また、SiCの除去時に高価
なハロゲンを含むガスを使用しないため、安全性に優れ
るとともに、製造コストの低減が可能となる。また、ハ
ロゲンを含むガスを使用した場合と異なり、SiCが選
択的に除去されず、均一に除去されていくため、SiC
を再被覆させた時に、均一な膜のSiCを形成すること
が可能となる。
The present invention is configured as described above.
It is possible to remove the SiC coated on the surface of the SiC-coated graphite member which has reached the end of its life, and to coat the surface again with high-purity SiC by the CVD method.
It can be reused as a coated graphite member, which has the effect of reducing semiconductor manufacturing costs and industrial waste. In addition, since expensive gas containing halogen is not used at the time of removing SiC, safety is excellent and manufacturing cost can be reduced. Further, unlike the case where a gas containing halogen is used, SiC is not selectively removed but is uniformly removed.
When Si is recoated, a uniform film of SiC can be formed.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 黒鉛基材に炭化ケイ素を被覆した炭化ケ
イ素被覆黒鉛部材の再生方法であって、表面に被覆され
た炭化ケイ素を1700℃以上で、1.33kPa以下
の圧力下、又は、不活性ガス雰囲気下、又は、1.33
kPa以下の圧力下の不活性ガス雰囲気下で熱処理して
昇華させて除去した前記黒鉛基材に、CVD法により炭
化ケイ素を被覆することを特徴とする炭化ケイ素被覆黒
鉛部材の再生方法。
1. A method for regenerating a silicon carbide-coated graphite member in which a graphite base material is coated with silicon carbide, wherein the silicon carbide coated on the surface is heated to 1700 ° C. or more under a pressure of 1.33 kPa or less. Under an active gas atmosphere, or 1.33
A method for regenerating a silicon carbide-coated graphite member, wherein the graphite substrate removed by sublimation by heat treatment under an inert gas atmosphere under a pressure of kPa or less is coated with silicon carbide by a CVD method.
【請求項2】 請求項1に記載の再生方法で、再生され
た炭化ケイ素被覆黒鉛部材。
2. A graphite member coated with silicon carbide which has been regenerated by the method of claim 1.
JP2000225674A 2000-07-26 2000-07-26 Regeneration method of silicon carbide-coated graphite member and silicon carbide-coated graphite member thereby Expired - Fee Related JP4447131B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000225674A JP4447131B2 (en) 2000-07-26 2000-07-26 Regeneration method of silicon carbide-coated graphite member and silicon carbide-coated graphite member thereby

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000225674A JP4447131B2 (en) 2000-07-26 2000-07-26 Regeneration method of silicon carbide-coated graphite member and silicon carbide-coated graphite member thereby

Publications (2)

Publication Number Publication Date
JP2002037684A true JP2002037684A (en) 2002-02-06
JP4447131B2 JP4447131B2 (en) 2010-04-07

Family

ID=18719411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000225674A Expired - Fee Related JP4447131B2 (en) 2000-07-26 2000-07-26 Regeneration method of silicon carbide-coated graphite member and silicon carbide-coated graphite member thereby

Country Status (1)

Country Link
JP (1) JP4447131B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011043428A1 (en) 2009-10-09 2011-04-14 信越化学工業株式会社 Method for producing carbon material coated with silicon carbide
TWI415170B (en) * 2006-06-22 2013-11-11 Nuflare Technology Inc Method for maintaining semiconductor manufacturing apparatus, semiconductor manufacturing apparatus, and method for manufacturing semiconductor
WO2017002457A1 (en) * 2015-07-02 2017-01-05 株式会社Sumco Method for regenerating member within silicon single crystal pulling apparatus
JP2017524065A (en) * 2014-08-01 2017-08-24 株式会社ブリヂストン Rubber mixture comprising pyrolytic carbon black, method for preparing the mixture, and use of said mixture
KR101814201B1 (en) * 2009-06-12 2018-01-02 도쿄엘렉트론가부시키가이샤 Method of reusing a consumable part for use in a plasma processing apparatus
CN116590708A (en) * 2023-07-18 2023-08-15 湖南泰坦未来科技有限公司 Graphite material with silicon carbide coating and preparation method and application thereof

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415170B (en) * 2006-06-22 2013-11-11 Nuflare Technology Inc Method for maintaining semiconductor manufacturing apparatus, semiconductor manufacturing apparatus, and method for manufacturing semiconductor
KR101814201B1 (en) * 2009-06-12 2018-01-02 도쿄엘렉트론가부시키가이샤 Method of reusing a consumable part for use in a plasma processing apparatus
WO2011043428A1 (en) 2009-10-09 2011-04-14 信越化学工業株式会社 Method for producing carbon material coated with silicon carbide
JP2017524065A (en) * 2014-08-01 2017-08-24 株式会社ブリヂストン Rubber mixture comprising pyrolytic carbon black, method for preparing the mixture, and use of said mixture
KR20170129246A (en) 2015-07-02 2017-11-24 가부시키가이샤 사무코 Method for regenerating member within silicon single crystal pulling apparatus
TWI602957B (en) * 2015-07-02 2017-10-21 Sumco股份有限公司 Recycling method for members in a monocrystalline silicon pulling-up device
JP2017014072A (en) * 2015-07-02 2017-01-19 株式会社Sumco Component regeneration process in silicon single crystal pulling device
WO2017002457A1 (en) * 2015-07-02 2017-01-05 株式会社Sumco Method for regenerating member within silicon single crystal pulling apparatus
CN107923068A (en) * 2015-07-02 2018-04-17 胜高股份有限公司 The renovation process of component in pulling silicon single crystal device
US20180148857A1 (en) * 2015-07-02 2018-05-31 Sumco Corporation Method for regenerating member within silicon single crystal pulling apparatus
KR101983751B1 (en) * 2015-07-02 2019-05-29 가부시키가이샤 사무코 Method for regenerating member within silicon single crystal pulling apparatus
CN107923068B (en) * 2015-07-02 2021-08-17 胜高股份有限公司 Method for regenerating component in silicon single crystal pulling apparatus
CN116590708A (en) * 2023-07-18 2023-08-15 湖南泰坦未来科技有限公司 Graphite material with silicon carbide coating and preparation method and application thereof
CN116590708B (en) * 2023-07-18 2023-10-31 湖南泰坦未来科技有限公司 Graphite material with silicon carbide coating and preparation method and application thereof

Also Published As

Publication number Publication date
JP4447131B2 (en) 2010-04-07

Similar Documents

Publication Publication Date Title
EP2284122B1 (en) Low nitrogen concentration carbonaceous material
JP2015182948A (en) Production method of silicon carbide single crystal
KR100427118B1 (en) Heat treatment jig and its manufacturing method
JPH1012692A (en) Dummy wafer
KR102017138B1 (en) Method for Recycling of SiC Product and Recycled SiC Product
JP4447131B2 (en) Regeneration method of silicon carbide-coated graphite member and silicon carbide-coated graphite member thereby
JPH08188408A (en) Silicon carbide molded product by chemical vapor deposition and its production
JPH1045474A (en) Production of graphite material coated with pyrolyzed carbon
JP2000302576A (en) Graphite material coated with silicon carbide
JPH11157989A (en) Susceptor for gas phase growth and its production
JP2907095B2 (en) Method for manufacturing semiconductor device
KR101983751B1 (en) Method for regenerating member within silicon single crystal pulling apparatus
JP2002274983A (en) Member for semiconductor manufacturing apparatus coated with sic film and method of manufacturing the same
WO2001059826A1 (en) Silicon boat with protective film, method of manufacture thereof, and silicon wafer heat-treated using silicon boat
JPH0583517B2 (en)
JPH11130565A (en) Silicon carbide-coated carbon material
JPH03146470A (en) Silicon carbide-based material
JP3925884B2 (en) Method for coating SiC film
JP4556090B2 (en) Member for silicon carbide semiconductor manufacturing apparatus and method for manufacturing the same
JP3739507B2 (en) Manufacturing method of heat treatment jig
JPH0471880B2 (en)
JP2708612B2 (en) Method for producing pyrolytic boron nitride compact
JP2549030B2 (en) Semiconductor processing member and method of manufacturing the same
JP3803148B2 (en) Method for recycling and using laminated member and laminated member used therefor
JPS61291484A (en) Graphite crucible

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061211

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20091211

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100119

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100120

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130129

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130129

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140129

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees