JP2002032902A - Magnetic head and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a magnetic head which can deal with miniaturization of a magnetic head element and a finer pitch of a terminal size and secure bonding strength and to provide its manufacturing method. SOLUTION: A terminal 4 formed on a substrate 2 of a magnetic head 1 and a lead terminal LT formed on a lead L surface connected with the magnetic head 1 are fixed by a bump B consisting of gold (Au) and the like and electrically connected with each other. The bump B is formed by integrally bonding the tip part of the terminal 4 and a tip part of the lead terminal LT to each other by using a wire bonding device such as a ball bonder. Thus, the magnetic head 1 can deal with the finer pitch of the terminal 4 and prevent a connection defect, since the terminal 4 and the lead terminal LT can be directly joined to each other by the bump B without using a bonding wire.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head for recording / reproducing information on / from a magnetic recording medium and a method of manufacturing the same, and more particularly to an electrical connection technique between a magnetic head and a wiring lead.

[0002]

2. Description of the Related Art In a magnetic tape device, a terminal provided on a magnetic head and a lead terminal provided on a surface end of a wiring lead are electrically connected by bonding using a wire bonding device or the like. A recording current is supplied to a magnetic head, and information is recorded on a recording medium, or reproduction is performed by detecting a reproduction signal from the recorded medium with the magnetic head.

[0003]

Due to the miniaturization of the magnetic head and the fine pitch of the terminal size accompanying the recent increase in the capacity of the recording medium, the connection technique by wire bonding requires contact of adjacent wires and small ball bond. There is a problem that the wire is broken due to the reduction in the wire diameter to cope with the increase in the diameter, and the bonding strength is insufficient due to the reduction in the second bonding bonding area, and the electrical bonding is poor.

[0004] Further, there is also a problem that the reinforcement of the resin at the wire bonding portion causes wire breakage at the second terminal bonding portion due to the stress of the resin. Accordingly, an object of the present invention is to provide a magnetic head capable of solving the above-described problems, responding to the miniaturization of the magnetic head element and the fine pitch of the terminal size, and ensuring the bonding strength, and a method of manufacturing the same. I do.

[0005]

According to the present invention, there is provided a magnetic head for recording / reproducing information on / from a magnetic recording medium, wherein a plurality of lead terminals are formed on a front end surface. A wiring lead, and a magnetic head element for detecting a recording signal and a reproduction signal are formed, and a plurality of terminals connected to the lead terminals have a substrate provided along a tip of the wiring lead; This is achieved by a configuration in which the lead terminals and the terminals of the substrate are connected by bumps.

Further, the present invention provides a method for manufacturing a magnetic head for recording / reproducing information on / from a magnetic recording medium, comprising: a wiring having a plurality of lead terminals formed on a front end surface; A lead and a magnetic head element for detecting a recording signal and a reproduction signal are formed, and a plurality of terminals connected to the lead terminal are prepared with a substrate provided along the tip of the wiring lead. And the terminals of the substrate are connected by a bump formed by melting a bonding wire.

According to the above configuration, the terminal and the lead terminal can be directly joined and electrically connected by the bump.
Wire bonding can be eliminated. For this reason, it is possible to reduce the pitch of the terminals and to reduce the size of the magnetic head element, and it is possible to prevent poor connection.

[0008]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention, and therefore, various technically preferable limitations are added. It is not limited to these forms unless otherwise stated.

FIG. 1 is a side view showing an embodiment of a magnetic head according to the present invention, FIG. 2A is a perspective view showing an embodiment of the magnetic head, and FIG. 2B is formed on a substrate of the magnetic head. FIG. 4 is an explanatory diagram showing a connection state between a terminal and a lead terminal formed on a lead. This magnetic head 1 is shown in FIGS.
As shown in FIGS. 1A and 1B, a magnetic head element 3 is formed on a substrate 2 made of a rectangular semiconductor wafer. The magnetic head element 3 is formed near one long side of the substrate 2.

Further, a plurality of terminals 4 are provided near the center of the substrate 2. These terminals 4 are rectangular electrodes made of a conductive material, and about 46 terminals 4 are formed on the substrate 2 at equal intervals with a width of about 7 mm. A support groove 5 is provided on the surface of the substrate 2. The support groove 5 is formed from the peripheral portion on the other long side to immediately before the terminal 4 by etching or the like. The depth of the support groove 5 depends on the lead (wiring lead) L connected to the magnetic head 1.
, And the width of the support groove 5 is also approximately the same as the width of the lead L.

The leads L are made of a flexible wiring board obtained by patterning a copper-clad board having excellent flexibility using a resin such as polyimide or polyester as a base film. Further, a plurality of lead terminals LT also formed of a conductive material are provided on the surface of the tip of the lead L. Similarly, these lead terminals LT are about 7 mm
It is configured such that about 46 rectangular electrodes are formed in a width of about 46 pieces. The lead terminals LT are also formed at the same pitch as the terminals 4.

Further, the tips of the leads L are fitted into the support grooves 5 provided in the substrate 2, and the terminals 4 of the substrate 2 and the lead terminals LT of the leads L are electrically connected to each other. I have. As described above, since the depth of the support groove 5 is almost the same as the thickness of the lead L, when the tip of the lead L is fitted into the support groove 5, the surface of the substrate 2 and the surface of the lead L The height is the same, that is, a so-called lychee state. Similarly, the surface of the terminal 4 and the surface of the lead terminal LT are also in the state of slash.

Then, both terminals of the terminal 4 and the lead terminal LT are fixed by a bump B made of, for example, gold (Au) and are electrically connected so as to bridge. The material of the bump B may be other than gold, for example, a gold alloy, aluminum (Al), an aluminum alloy, or copper (Cu).

Next, a technique for connecting the terminals 4 of the substrate 2 of the magnetic head 1 and the lead terminals LT of the leads L will be described. First, a magnetic head 1 having a magnetic head element 3, terminals 4, and a support groove 5 formed on a substrate 2, and a lead L are prepared. Then, the tip of the lead L on which the lead terminal LT is formed is fitted into the support groove.

Thereafter, using a wire bonding device such as a ball bonder provided with a metal torch, a bump B is formed so as to bridge the tip of the terminal 4 and the tip of the lead terminal LT. The lead terminals LT are respectively joined and electrically connected. Electric torch
A wire such as a gold wire protruding from the tip of the capillary is melted by the discharge energy from the electrode to form a ball.

In this ball bonder, at the time of the first bonding, a ball formed at the tip of the wire by an electric torch is pressed by a capillary and bonded, and then the second bonding is performed.
The bump B is formed by tearing the wire from the ball without bonding.

Thus, the terminal 4 and the lead terminal LT are directly joined by the bumps B and electrically connected to each other, so that wire bonding can be eliminated, and the fine pitch of the terminals 4 can be coped with and the connection failure can be prevented. Therefore, the reliability of the magnetic head can be improved. In the above-described embodiment, one bump B
However, the terminal and the lead terminal may be connected and fixed by using two or more bumps.

FIGS. 3 and 4 are perspective views showing a connection state between a terminal 4 connected by two bumps B1 and B2 and a lead terminal LT, and FIG. 5 is a terminal connected by three bumps B3 to B5. FIG. 6 is a perspective view showing a connection state between the lead 4 and the lead terminal LT. FIG. 6 is a perspective view showing a connection state between the terminal 4 and the lead terminal LT connected by the four bumps B6 to B9.

When two bumps B1 and B2 are used, as shown in FIG. 3, both bumps B1 and B2 are connected so that two bumps B1 and B2 bridge terminal 4 and lead terminal LT. The bumps B1 and B2 are arranged in the width direction (first direction) of the terminal 4 and are in contact with each other. Alternatively, as shown in FIG.
1 and B2 are provided in the longitudinal direction (second direction) of the terminal 4 at a position where the terminal 4 and the lead terminal LT are bridged, and the bumps B1 and B2 are formed so as to be in contact with each other. Thereby, joining can be reinforced.

When the three bumps B3 to B5 are used, as shown in FIG. 5, the two bumps B3 and B4 are connected to the terminal 4 so as to bridge the terminal 4 and the lead terminal LT.
Are formed in contact with both the bumps B3 and B4 on either the terminal 4 or the lead terminal RT so as to reinforce the bumps B3 and B4. This allows
The joining strength can be further increased.

Further, when four bumps B6 to B9 are used, as shown in FIG. 6, the terminal 4 and the lead terminal LT are used.
And the two bumps B6 and B7 are arranged in the width direction of the terminal 4 so as to bridge the bumps B3 and B3 on both the terminal 4 and the lead terminal RT so as to reinforce these bumps.
B4 is formed in contact with both bumps B3 and B4 so as to reinforce B4. As a result, the joining strength can be further greatly enhanced.

[0022]

As described above, according to the present invention, the reliability of the magnetic head can be improved while the size of the magnetic head element is reduced.

[Brief description of the drawings]

FIG. 1 is a side view showing an embodiment of a magnetic head according to the present invention.

FIG. 2A is a perspective view illustrating an embodiment of a magnetic head, and FIG. 2B is an explanatory diagram illustrating a connection state between terminals formed on a substrate of the magnetic head and lead terminals formed on leads.

FIG. 3 is a perspective view showing an example of a connection state in which a terminal of a magnetic head and a lead terminal are connected by two bumps according to another embodiment of the present invention.

FIG. 4 is a perspective view showing another example of a connection state in which a terminal and a lead terminal of a magnetic head are connected by two bumps according to another embodiment of the present invention.

FIG. 5 is a perspective view showing an example of a connection state in which a terminal of a magnetic head and a lead terminal are connected by three bumps according to another embodiment of the present invention.

FIG. 6 is a perspective view showing an example of a connection state in which a terminal and a lead terminal of a magnetic head are connected by four bumps according to another embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Magnetic head, 2 ... Substrate, 3 ... Magnetic head element, 4 ... Terminal, 5 ... Support groove, L ... Lead (wiring lead), LT ... Lead terminal , B: bump, B1 to B9: bump

Claims (9)

[Claims] 1. A magnetic head for recording / reproducing information on / from a magnetic recording medium, comprising: a wiring lead having a plurality of lead terminals formed on the tip surface; and a magnetic head element for detecting a recording signal and a reproduction signal. Are formed, a plurality of terminals connected to the lead terminals have a substrate provided along the tip of the wiring leads, and the lead terminals of the wiring leads and the terminals of the substrate are bumped, Magnetic heads characterized by being connected to each other. 2. A magnetic head for recording / reproducing information on / from a magnetic recording medium, comprising: a wiring lead having a plurality of lead terminals formed on a tip end surface; and a magnetic head element for detecting a recording signal and a reproduction signal. , And a support groove for indicating the tip of the wiring lead is formed,
A plurality of terminals connected to the lead terminals have a substrate facing the support groove and provided along the tip of the wiring lead, and by fitting the wiring lead into the support groove, the same surface is provided. A lead terminal of the wiring lead and a terminal of the substrate are connected by bumps. 3. The depth of a support groove formed in the substrate is:
3. The magnetic head according to claim 2, wherein the thickness is substantially the same as the thickness of the wiring lead. 4. A method for manufacturing a magnetic head for recording / reproducing information on / from a magnetic recording medium, comprising: a wiring lead having a plurality of lead terminals formed on a front end surface thereof; A head element is formed, and a plurality of terminals connected to the lead terminals are prepared as a substrate provided along the tip of the wiring lead. A bonding wire is formed between the lead wiring of the wiring lead and the terminal of the substrate. A method for manufacturing a magnetic head, characterized in that the connection is made by a bump formed by melting the magnetic head. 5. A method of manufacturing a magnetic head for recording / reproducing information on / from a magnetic recording medium, comprising: a wiring lead having a plurality of lead terminals formed on a front end surface thereof; and a magnetic head for detecting a recording signal and a reproduction signal. A head element, and a support groove for indicating a tip end of the wiring lead are formed, and a plurality of terminals connected to the lead terminal are prepared with a substrate provided along the tip end of the wiring lead; A method of manufacturing a magnetic head, comprising: fitting the wiring lead into a groove; and connecting a lead terminal of the wiring lead and a terminal of the substrate on the same surface by a bump formed by melting a bonding wire. 6. The connection according to claim 4, wherein the connection by the bump is performed by forming one bump between the adjacent terminal and the lead terminal. A method for manufacturing a magnetic head. 7. The terminal and the lead terminal are connected by two bumps, and the two bumps are provided between the terminal and the lead terminal in a first direction at the terminal or a first direction thereof. 5. The semiconductor device according to claim 4, wherein the two bumps are arranged in any one of a second direction perpendicular to the direction, and the two bumps are formed and connected so as to be in contact with each other.
Or the method of manufacturing a magnetic head according to any one of the above items 5. 8. The terminal and the lead terminal are connected by three bumps, and two bumps of the three bumps are provided between the terminal and the lead terminal in a first direction in the terminal. , Or in a second direction orthogonal to the first direction, and the two bumps are formed so as to be in contact with each other, and the remaining one bump is connected to the terminal side or the lead terminal side. The method of manufacturing a magnetic head according to claim 4, wherein the magnetic head is formed while being in contact with both of the two bumps and connected. 9. The terminal and the lead terminal are connected by four bumps, and two of the four bumps are in a first direction between the terminal and the lead terminal in the terminal. , Or in a second direction orthogonal to the first direction thereof, and the two bumps are formed so as to be in contact with each other, and the other two bumps are connected to the terminal side and the lead terminal. The method of manufacturing a magnetic head according to claim 4, further comprising forming and connecting both of the two bumps while making contact with both of the two bumps.