JP2002026511A - Automatic mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an automatic mounting method by which the quality control of soldering can be made easier and connection reliability can be improved. SOLUTION: This automatic mounting method comprises steps of fitting a heat shielding cap 8 on a secondary battery 1, automatically mounting the battery 1 on a substrate 3 by automatic soldering while the cap 8 is fitted on the battery 1, and removing the cap 8 from the battery 1. Since the battery 1 is shielded from the heat of the automatic soldering by the cap 8 fitted to the battery 1, the peripheral temperature of the battery 1 is suppressed to an allowable temperature or lower. Consequently, the battery 1 can be mounted automatically on the substrate 3 by automatic soldering and, accordingly, the quality control of the soldering becomes easier and the connection reliability can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to automatic soldering (hereinafter referred to as "reflow soldering" or "flow soldering") of electronic components such as a secondary battery for memory backup (hereinafter simply referred to as "electronic components") to a substrate. (Hereinafter simply referred to as automatic soldering).

[0002]

2. Description of the Related Art The allowable temperature of electronic components is generally about 60 ° C.
゜ C〜80 ゜ C. On the other hand, when an electronic component is automatically mounted on a substrate by automatic soldering, the ambient temperature of the electronic component is generally about 150 ° C.
It becomes 50 ° C. For this reason, it has not been possible to automatically mount an electronic component directly on a substrate by automatic soldering.
Therefore, there are the following two methods for mounting electronic components on a substrate.

The first method is a manual mounting method as shown in FIGS. 3A and 3B. Hereinafter, the first method will be described with reference to FIGS. In the figure, 1 is a memory backup 2 as an electronic component.
Next battery. This secondary battery 1 is provided with soldering leads 2. In the figure, 3 is a substrate. The board 3 is provided with a soldering pattern 4. In the figure, reference numeral 5 denotes solder. Next, the manual mounting method will be described. First, visually
The soldering lead 2 of the secondary battery 1 is positioned and set on the soldering pattern 4 on the substrate 3. Then, the soldering lead 2 of the secondary battery 1 and the soldering pattern 4 of the substrate 3 are connected via solder 5 by manual soldering, and the secondary battery 1 is mounted on the substrate 3.

Another method is, as shown in FIG. 4, a mounting method via an electronic component holder. Hereinafter, another method will be described with reference to FIG. In the figure, reference numeral 6 denotes a secondary battery for memory backup as an electronic component.
This secondary battery 6 is for a holder and has no soldering lead. In the figure, reference numeral 7 denotes a secondary battery holder. Next, a mounting method via the secondary battery holder 7 will be described. First, the secondary battery holder 7 is soldered to the substrate 3 by a chip mounter (not shown) and a reflow furnace (not shown). Then, the secondary battery 6 is manually set in the secondary battery holder 7 and the secondary battery 6
Is mounted on the substrate 3 via the secondary battery holder 7.

[0005]

However, in the first method, since the secondary battery 1 is mounted on the substrate 3 by manual soldering, the connection reliability of the solder 5 is large depending on the skill of the work. Change and quality control is difficult. Further, if the positioning between the soldering pattern 4 on the substrate 3 and the soldering lead 2 of the secondary battery 1 is insufficient, a defect such as a solder bridge may occur.

Another method is to attach the secondary battery holder 7 to the substrate 3
The soldering is performed by a chip mounter and a reflow furnace, so that the quality control of the soldering becomes easy. On the other hand, the rechargeable battery holder 7 and the rechargeable battery 6 are connected by contact, so that dust and dirt are removed. There is a problem that the connection reliability is affected by foreign substances such as.

An object of the present invention is to provide an automatic mounting method in which quality control of soldering is facilitated and connection reliability is improved.

[0008]

According to the present invention, in order to attain the above object, a heat shield cap is mounted on an electronic component, and the electronic component is automatically mounted on a substrate by automatic soldering as it is. Thereafter, the method comprises a step of removing the heat shield cap from the electronic component.

As a result, in the automatic mounting method according to the present invention, the heat of the automatic soldering is shielded by the heat shield cap, so that the ambient temperature of the electronic component mounted on the heat shield cap is kept below the allowable temperature. Will be done. For this reason, since the electronic component can be automatically mounted on the substrate by automatic soldering, the quality control of the soldering becomes easy, and the connection reliability is improved.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the automatic mounting method according to the present invention will be described below with reference to FIGS. In the drawing, the same reference numerals as those in FIGS. 3 and 4 denote the same components.

In FIG. 1, reference numeral 8 denotes a heat shield cap. This heat shield cap 8 has a cap shape with one end opened so that the secondary battery 1 can be detachably stored and mounted. The heat shield cap 8 is made of, for example, a heat insulating material such as heat-resistant silicone rubber, and shields the heat of the outer reflow furnace to keep the ambient temperature of the inner secondary battery 1 below the allowable temperature. Things.

FIG. 1 shows an automatic mounting method according to the present invention.
Description will be made with reference to (A) to (C). First, the secondary battery 1 is removably housed and mounted in the heat shield cap 8,
Further, the soldering lead 2 is made to protrude outward from the opening of the heat shield cap 8 (see FIG. 1A).

Next, the lead 2 for soldering the secondary battery 1
And the position of the cream solder 50 applied on the substrate 3 is automatically performed by a chip mounter. Then, soldering is automatically performed by a reflow furnace (see FIG. 1B). At this time, the secondary battery 1 is
Since it is housed and mounted inside, the heat of the outer reflow furnace is shielded by the heat shield cap 8, and the ambient temperature of the inner secondary battery 1 is suppressed to an allowable temperature or lower. After the secondary battery 1 is mounted on the substrate 3, it can be commercialized with the heat shield cap 8 attached.

Then, the heat shield cap 8 is removed from the secondary battery 1 and the substrate 3 (see FIG. 1C). As a result, the dimensions, weight, and the like of the mounted products of the secondary battery 1 and the substrate 3 are not different from those of the manually mounted soldered products.

As described above, according to the automatic mounting method of the present invention in this embodiment, the soldering connection can be shifted from the manual operation to the automatic operation using the chip mounter and the reflow furnace. Can be done without depending on the degree. Since the automatic mounting method of the present invention in this embodiment is based on soldering connection, the secondary battery holder 7 is automatically mounted, and the secondary battery 6 is manually connected to the secondary battery holder 7 by contact. Compared with the method, there is no possibility of poor contact due to dirt such as dust and dirt.

[0016]

As described above, in the automatic mounting method of the present invention, the heat of the automatic soldering is shielded by the heat shield cap, so that the ambient temperature of the electronic component mounted on the heat shield cap is: As a result, the temperature is kept below the allowable temperature. For this reason, since the electronic component can be automatically mounted on the substrate by automatic soldering, the quality control of the soldering becomes easy, and the connection reliability is improved.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view showing an embodiment of an automatic mounting method according to the present invention, wherein (A) is an explanatory view showing a state in which a secondary battery is mounted on a heat shield cap, and (B) is a thermal view. FIG. 7C is an explanatory view of a state in which the secondary battery is mounted on the substrate by automatic soldering with the shield cap attached, and FIG. 10C is an explanatory view of a state in which the heat shield cap is removed from the secondary battery.

FIG. 2 is a sectional view taken along line II-II in FIG.

3A and 3B are schematic explanatory views showing a conventional manual mounting method, wherein FIG. 3A is an explanatory view showing a state where a secondary battery is positioned on a substrate, and FIG. FIG. 5 is an explanatory view of a state where the is mounted on a substrate by manual soldering.

FIG. 4 is a schematic explanatory view showing a mounting method for automatically mounting a conventional secondary battery holder and manually connecting a secondary battery to the secondary battery holder by contacting the battery;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Secondary battery (electronic part), 2 ... Lead for soldering, 3
... board, 4 ... soldering pattern, 5 ... solder, 50 ... cream solder, 6 ... secondary battery (electronic parts), 7 ... secondary battery holder (electronic parts holder), 8 ... heat shield cap.

Claims (1)

[Claims] 1. A method of automatically mounting an electronic component on a substrate by automatic soldering, comprising: attaching a heat shield cap to the electronic component; and attaching the electronic component to the electronic component while the heat shield cap remains attached. Automatically mounting the electronic component on the board by automatic soldering; and automatically removing the heat shield cap from the electronic component after the electronic component is automatically mounted on the board by automatic soldering. Method.