JP2002025825A - Electronic component and radio terminal equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component which can realize either improved mountability or prevention of deterioration in characteristic and, particularly is reduced in size and radio terminal equipment. SOLUTION: The electronic component is provided with a base 11, a conductive film 12 formed on the base 11, grooves 13 formed through the film 12, a pair of terminal sections 14 and 15 which are respectively installed to the end sections of the base 11, and a protective material 14 which is formed to cover the grooves 13, and with recessed sections 14a being on the surface of the protective material 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component and a radio terminal device which are used for electronic equipment such as mobile communication, and particularly preferably used for high frequency circuits and the like. In particular, the present invention relates to an electronic component and a wireless terminal device in which a conductive film is provided on an insulating substrate.

[0002]

2. Description of the Related Art FIG. 8 is a side view showing a conventional inductance element. In FIG. 8, reference numeral 1 denotes a square-pillar or columnar base, 2 denotes a conductive film formed on the base 1, 3 denotes a groove provided in the conductive film 2, and 4 denotes a stacked layer on the conductive film 3 Protected material.

A prior example is disclosed in Japanese Patent Application Laid-Open No. 8-557.
No. 28 publication.

[0004]

However, when electronic components such as inductance elements are miniaturized, when they are surface-mounted with cream solder or the like, the electronic components are moved by flux or the like coming out of the solder by heat treatment. However, if the electronic component is not mounted on the board properly, or if the electronic component tries to suck the electronic component with the nozzle of the mounting machine due to its small size, the nozzle slips on the electronic component and it is not mounted well. A mounting defect has occurred. In particular, among the electronic components, the characteristics of the inductance element have been deteriorated with the downsizing.

An object of the present invention is to solve the above-mentioned conventional problems, and to provide a particularly miniaturized electronic component and a radio terminal device which can realize at least one of good mountability and prevention of deterioration of characteristics. Aim.

[0006]

SUMMARY OF THE INVENTION The present invention provides a base, a conductive film provided on the base, a groove provided in the conductive film, and a pair of terminals provided on an end of the base. And an electronic component including a protective member provided so as to cover the groove, wherein a concave portion is provided on a surface portion of the protective member.

[0007]

DETAILED DESCRIPTION OF THE INVENTION The invention according to claim 1 comprises a base,
A conductive film provided on the base, a groove provided in the conductive film, a pair of terminal portions provided on an end of the base, and a protective material provided to cover the groove The electronic component is characterized in that a concave portion is provided on the surface of the protective material, whereby slip with the suction nozzle can be reduced, and the position of the element due to the flux can be reduced. Displacement can be prevented.

According to a second aspect of the present invention, there is provided the electronic component according to the first aspect, wherein the concave portion provided in the protective member is provided on all side surfaces of the base. The mountability can be improved.

According to a third aspect of the present invention, the recess provided in the protective material is provided corresponding to the groove.
The use of the electronic component described above eliminates the need for a step of separately providing a concave portion, thereby improving productivity.

According to a fourth aspect of the present invention, since the bottom of the concave portion is formed in an arc shape, the electronic component according to the first aspect does not accumulate debris or the like in the concave portion.

According to a fifth aspect of the present invention, in the electronic component according to the first aspect, the bottom of the concave portion is inserted into the groove. As a result, the high frequency characteristics can be improved.

According to a sixth aspect of the present invention, the depth of the concave portion is 0 μm.
2. The electronic component according to claim 1, wherein the electronic component is larger than m and smaller than 30 μm.

According to a seventh aspect of the present invention, in the first to sixth aspects, an inductance element excellent in mountability and the like can be provided by forming an inductance component by the conductive film and the groove.

According to an eighth aspect of the present invention, a chip resistor excellent in mountability can be provided by using a resistive film instead of the conductive film in the first to sixth aspects.

According to a ninth aspect of the present invention, a chip capacitor excellent in mountability and the like can be provided by providing a groove for dividing the conductive film into at least two parts and having a capacitance component.

According to a tenth aspect of the present invention, there is provided a display unit, a conversion unit for converting at least one of a data signal and a voice signal into a transmission signal or a reception signal into at least one of a data signal and a voice signal, and the transmission unit. An antenna for transmitting and receiving a signal and the reception signal, and a wireless terminal device including control means for controlling each unit, comprising: a transmission circuit;
By using the electronic component according to any one of claims 1 to 9 for at least one of a filter circuit, an antenna unit, a peripheral portion of a matching circuit for each stage, and the like, the electronic component on the board is securely mounted, No problems occur with long-term use.

Hereinafter, embodiments of an electronic component and a wireless terminal device according to the present invention will be specifically described by taking an inductance element as an example.

FIGS. 1 and 2 are a perspective view and a side sectional view, respectively, showing an inductance element according to an embodiment of the present invention.

In FIG. 1, reference numeral 11 denotes a base which is formed by subjecting an insulating material or the like to press working, extrusion, or the like.
Reference numeral 2 denotes a conductive film provided on the base 11.
2 is formed on the base 11 by an evaporation method such as a plating method or a sputtering method.

Reference numeral 13 denotes a groove provided on the base 11 and the conductive film 12. The groove 13 is formed by irradiating the conductive film 12 with a laser beam or the like, or is mechanically formed by applying a grindstone or the like to the conductive film 12. Or by selective etching using a resist or the like. By forming the groove 13 in a spiral shape, for example, a coil-shaped conductive film is formed on the conductive film 12.

Reference numeral 14 denotes a protective material applied to a portion of the base 11 and the conductive film 12 where the groove 13 is provided. The protective material 14 has a concave portion 14 a corresponding to the groove 13. 1
Reference numerals 5 and 16 denote terminal portions respectively attached to the ends of the base 11.

The inductance element of the present embodiment preferably has the following length L1, width L2, and height L3.

L1 = 0.2 to 2.0 mm (preferably 0.3 to 0.8 mm) L2 = 0.1 to 1.0 mm (preferably 0.1 to 0.4 mm)
mm) L3 = 0.1 to 1.0 mm (preferably 0.1 to 0.4 mm)
(Note that the dimensional error of each of L1, L2, and L3 is 0.3 mm.)
It is preferably equal to or less than 02 mm. If L1 is 0.2 mm or less, the required inductance cannot be obtained. Further, when L1 exceeds 2.0 mm, the element itself becomes large, and a substrate on which an electronic circuit or the like is formed (hereinafter abbreviated as a circuit substrate or the like).
Cannot be miniaturized, and as a result, it is not possible to reduce the size of electronic equipment or the like on which the circuit board or the like is mounted. Also, L
If each of L2 and L3 is 0.1 mm or less, the mechanical strength of the element itself becomes too weak, and the element may be broken when mounted on a circuit board or the like by a mounting apparatus or the like. Further, when L2 and L3 are 1.0 mm or more, the elements become too large, and the circuit board and the like can be reduced in size.
As a result, the size of the device cannot be reduced.

With respect to the inductance element configured as described above, each part will be described in detail below.

First, the shape of the base 11 will be described.

The base 11 is preferably formed in a prismatic or cylindrical shape. By forming the base 11 in a prismatic shape as shown in FIGS. And the like. In addition, among the rectangular bases, the base 11 is particularly preferably formed in a square pillar shape, which greatly facilitates the mounting and the positioning of the element on the circuit board. In addition, it is more preferable that the bottom surface is a rectangular parallelepiped having a square shape, so that the mountability and the like can be further improved. Further, since the base 11 has a prismatic structure, the structure becomes very simple, so that the productivity is good and the cost is very advantageous. Although not shown, a configuration in which a circular step is provided in the center of the base 11 and the groove 13, the protective material 14, and the like are formed in the circular step may be used. According to such a configuration, the protection member 14 and the like do not protrude significantly from the side surface of the electronic component, and the mountability and the like can be improved.

Further, by forming the base 11 in a cylindrical shape, a conductive film 12 is formed on the base 11 as described later, and when a groove is formed in the conductive film 12 by laser processing or the like, the The depth of the groove and the like can be formed with high accuracy, and variations in characteristics can be suppressed.

Next, chamfering of the base 11 will be described with reference to FIG.

FIG. 3 is a perspective view showing a base used for an inductance element according to an embodiment of the present invention.

The corners 11b and 11c of the base 11 are chamfered, and the radius of curvature R1 of each of the chamfered corners 11b and 11c and the radius of curvature R2 of the corner 11a.
Is preferably formed as follows.

0.03 <R1 <0.15 (mm) 0.07 <R2 (mm) If R1 is 0.03 mm or less, the corners 11b and 11c
Because of the sharp point, the corners 11b and 11c may be chipped by a slight impact or the like, and the chipping may cause deterioration of characteristics or the like. When R1 is 0.15 mm or more, the corner 11
Since b and 11c are too round, the Manhattan phenomenon is liable to occur, causing a problem. Furthermore, R2 is 0.01 m
If it is less than m, burrs and the like are likely to be generated at the corners 11a, and the thickness of the conductive film 12, which greatly affects the characteristics of the device, may be significantly different between the corners 11f and the flat portion, resulting in large variations in device characteristics. Become.

Next, the constituent materials of the base 11 will be described. It is preferable to satisfy the following characteristics as a constituent material of the base 11.

Volume resistivity: 10 ¹³ Ωm or more (preferably 10 ¹⁴ Ωm or more) Thermal expansion coefficient: 5 × 10 ⁻⁴ / ° C. or less (preferably 2 × 10 Ω / m)
⁻⁵ / ° C. or less) [Coefficient of thermal expansion at 20 ° C. to 500 ° C.] Relative permittivity: 12 or less at 1 MHz (preferably 10
Bending strength: 1300 kg / cm ² or more (preferably 20
Density: ^{2 to 5} g / cm ³ (preferably ³ to 4 g / cm ³ ) When the constituent material of the base 11 has a volume resistivity of 10 ¹³ Ωm or less, the conductive material 12 and the base 11 Also, a current starts to flow in a predetermined manner, so that a parallel circuit is formed, and the self-resonant frequency f0 and the Q value decrease, which is not suitable for a high-frequency element.

If the coefficient of thermal expansion is 5 × 10 ⁻⁴ / ° C. or more, cracks may occur in the base 11 due to heat shock or the like. That is, when the thermal expansion coefficient is 5 × 10 ⁻⁴ / ° C. or more, the base 11 is locally heated to a high temperature because a laser beam or a grindstone is used when forming the groove 13 as described above. Although cracks and the like may occur in 11, the occurrence of cracks and the like can be greatly suppressed by having the above-described coefficient of thermal expansion.

If the dielectric constant is 12 or more at 1 MHz, the self-resonant frequency f0 and the Q value become low, which is not suitable for a high-frequency device.

If the bending strength is 1300 kg / cm ² or less, the element may be broken when mounted on a circuit board or the like by a mounting apparatus.

When the density is 2 g / cm ³ or less, the base 1
1, the water absorption rate is increased, the characteristics of the base 11 are significantly deteriorated, and the characteristics as an element are deteriorated. The density is 5 g / c
If it exceeds m ³ , the weight of the base will be heavy, and there will be a problem in mountability and the like. In particular, when the density is set within the above range, the water absorption rate is small, water hardly enters the base 11, the weight is reduced, and no problem occurs when mounting on a substrate by a chip mounter or the like.

By defining the volume resistivity, the coefficient of thermal expansion, the dielectric constant, the bending strength, and the density of the base 11 in this manner, the self-resonant frequency f0 and Q do not decrease, so that the base 11 can be used as a high-frequency element. It is possible to suppress the occurrence of cracks or the like in the base 11 due to heat shock or the like, so that the defective rate can be reduced, and furthermore, the mechanical strength can be improved. Since it can be mounted on a circuit board or the like, excellent effects such as improvement in productivity can be obtained.

As a material for obtaining the above-mentioned various properties, there is a ceramic material containing alumina as a main component. However, simply using a ceramic material mainly composed of alumina cannot obtain the above-mentioned characteristics. That is,
Since the above-mentioned various characteristics vary depending on the pressing pressure, the sintering temperature, and the additives at the time of producing the base 11, the production conditions and the like must be appropriately adjusted. Specific manufacturing conditions include a pressing pressure of 2 to 5 tons when processing the base 11, a firing temperature of 1500 to 1600 ° C., and a firing time of 1 to 3 hours. Specific examples of the alumina material include Al ₂ O ₃ of 90% by weight or more, SiO ₂ of 6% by weight or less, MgO of 1.5% by weight or less, and Fe ₂ O ₃ of 0.3% by weight or less.
% Or less, and 0.2% by weight or less of Na ₂ O.

The base 11 may be made of a magnetic material such as ferrite. When the base 11 is made of a magnetic material such as ferrite, an element having a high inductance (about 0.5 μH to 1 μH) can be formed.

Next, the surface roughness of the base 11 will be described. The surface roughness described below means the average roughness of the center line, and the roughness described in the description of the conductive film 12 is also the average roughness of the center line.

The surface roughness of the base 11 is 0.15 to 0.5 μm
m, preferably about 0.2 to 0.3 μm. Judging from the results of the adhesion strength between the conductive film 12 and the base 11, the Q value of the conductive film 12, and the self-resonance frequency f0, the surface roughness of the base 11 is preferably 0.15 μm to 0.5 μm. More preferably, the thickness is 0.2 to 0.3 μm.

In the present embodiment, the bonding strength between the conductive film 12 and the base 11 is improved by adjusting the surface roughness of the base 11.
By providing an intermediate layer composed of at least one of C alone or a material containing C as a main component between the two, the adhesion strength between the conductive film 12 and the base 11 can be improved without adjusting the surface roughness. Can be. Of course, when the surface roughness of the base 11 is adjusted and the intermediate layer and the conductive film 12 are laminated on the base 11, it is possible to obtain a stronger adhesion strength between the conductive film 12 and the base 11. it can.

Next, the conductive film 12 will be described.

The constituent materials of the conductive film 12 are copper, silver,
Conductive materials such as gold and nickel can be used. This copper,
Predetermined elements may be added to materials such as silver, gold, and nickel in order to improve weather resistance and the like. Alternatively, an alloy such as a conductive material and a nonmetallic material may be used. Copper and its alloys are often used as constituent materials in terms of cost, corrosion resistance, and ease of fabrication. When copper or the like is used as the material of the conductive film 12, first, a base film is formed on the base 11 by electroless plating, and a predetermined copper film is formed on the base film by electrolytic plating. The conductive film 12 is formed. Further, when the conductive film 12 is formed of an alloy or the like, it is preferable to form the conductive film 12 by a sputtering method or a vapor deposition method.

Further, as in the present embodiment, when the conductive film 12 is made of, for example, copper and the film thickness is increased to suppress self-heating, the width K1 of the groove 13 formed in the conductive film 12 is reduced. The width K2 of the conductive film 12 between the grooves 13 preferably has the following relationship.

50 μm>K1> 8 μm 300 μm>K2> 10 μm In particular, as described above, the length L1, width L2, and height L3 are L1 = 0.2 to 2.0 mm (preferably 0.3 to 0.8
mm) L2 = 0.1 to 1.0 mm (preferably 0.1 to 0.4 mm)
mm) L3 = 0.1 to 1.0 mm (preferably 0.1 to 0.4 mm)
(Note that the dimensional error of each of L1, L2, and L3 is 0.3 mm.)
It is preferably equal to or less than 02 mm. ), The above K1, K
2 is in the above range, the electric resistance can be reduced, and the groove 13 formed in the conductive film 12 can be reduced.
Can be formed with high precision, and the groove 13 can be reliably formed when the film thickness of the conductive film 12 is increased.

The conductive film 12 may be composed of a single layer, but may have a multilayer structure. That is, a plurality of conductive films 12 having different constituent materials may be stacked. For example, base 1
First, a copper film is formed on 1 and a metal film having good weather resistance (such as nickel) is laminated thereon, so that corrosion of copper having a problem in weather resistance can be prevented.

Examples of the method for forming the conductive film 12 include a plating method (such as an electrolytic plating method and an electroless plating method), a sputtering method, and a vapor deposition method. Among these forming methods,
A plating method with good mass productivity and small variations in film thickness is often used.

The surface roughness of the conductive film 12 is preferably 1 μm or less, more preferably 0.2 μm or less. When the surface roughness of the conductive film 12 exceeds 1 μm, the Q value at high frequencies decreases due to the skin effect.

Next, the protective member 14 will be described.

As the protective material 14, an organic material having excellent weather resistance, for example, an insulating material such as an epoxy resin or an electrodeposition film is used. Further, as the protective material 14, the groove 13
It is preferable to have transparency so that the situation can be observed. Further, it is preferable that the protective material 14 has a predetermined color while having transparency. By coloring the protective material 14 with a color such as red, blue, or green, which is different from the conductive film 12 and the terminal portions 15 and 16, it is possible to distinguish each element portion, and to easily inspect each element portion. . Also, the size of the element,
By changing the color of the protective material 14 depending on the difference in characteristics, product numbers, etc., it is possible to reduce errors such as mounting of elements having different characteristics, product numbers, etc. on erroneous parts.

In particular, when the protective member 14 is formed of an electrodeposition film, the protective member 14 is very thin, can secure insulation, and can have improved heat resistance. That is, when the method of applying an epoxy resin, a resist, or the like is applied, a portion of the protective material 14 rises greatly, and when mounted on a circuit board or the like, a gap is generated between the terminal portions 15 and 16 of the element and the wiring of the circuit board. In some cases, sufficient electrical bonding cannot be performed. However, by forming the protective material 14 with an electrodeposition film, a thin and uniform protective material 14 can be formed. When mounted, terminal 1
The gap between the wiring 5 and 16 and the wiring is very small, and the electrical connection between the wiring and the terminal of the board can be sufficiently performed.

In the method of applying a resist or the like, since each element must be applied using a tape or the like, the number of steps is increased, the productivity is not improved, and the manufacturing cost is reduced. Although it is not possible, as in the present embodiment, by forming the protective material 14 with an electrodeposition film, the protective material 14 can be provided to many elements at once, so that productivity is improved and cost is reduced. Can be done.

As a specific constituent material of the protective member 14, an electrodeposition resin film made of at least one resin material such as an acrylic resin, an epoxy resin, a fluorine resin, a urethane resin, and a polyimide resin is used. It is configured. In the case where the protective material 14 is formed of an electrodeposited film, and when either the cation type or the anion type is selected, the constituent material of the conductive film 12, the constituent material of the electrodeposited film, and the usage of the inductance element are used. It is preferable to determine in consideration of the above. The protective material 14 may be formed by laminating electrodeposited films made of different materials, or may be formed by laminating the same material. Further, a plurality of electrodeposited films may be stacked on the groove 13 in parallel. It may be provided.

When the protective member 14 is formed of an electrodeposited film, the protective member 14 preferably has a thickness of several tens of microns and a withstand voltage of 20 V or more, and has a melting point of 183 ° C., which is the melting point of solder.
It is preferable to use a material having characteristics of not burning or evaporating. In the case where the protective material 14 is softened at 183 ° C., no problem occurs.

In some cases, it is important for an inductance element used for a special purpose to have an adhesion strength between the conductive film 12 and the protective material 14. In this case, it is preferable to roughen the surface of the conductive film 12 by chemical etching, and to provide a protective material 14 made of an electrodeposition film on the roughened surface. As described above, if the surface of the conductive film 12 is roughened, there is a risk of lowering the Q value. However, in a special use or the like, the adhesion strength between the protective material 14 and the conductive film 12 is improved more than the Q value. In this case, it is necessary to appropriately determine the roughness of the conductive film 12 in consideration of the application and the like.

When the conductive film 12 is made of a material containing copper, the protective material 14 which is an electrodeposition film may be formed with an uneven film thickness. A metal film such as Ni is formed thereon, and a protective material 1 is formed on the metal film.
4 may be formed.

As described above, the protective material 1 composed of the electrodeposition film
After manufacturing the inductance element having No. 4, it is preferable to apply heat treatment to the element. By this heat treatment,
The surface of the protective material 14 becomes gentle, the surface roughness becomes small, and the protective film 14 is surely covered.

The features of the present invention will be described below.

As shown in FIG. 1A and FIG.
By providing the concave portion 14a on the surface of 4, the mountability and the characteristics as an inductance element can be improved.

That is, first, when the electronic component is mounted on the circuit board and joined by cream solder or the like by providing the concave portion 14 a in the protective member 14, even if flux or the like flows out of the solder or the like, the concave portion 14 a is formed. Since a small gap can be formed at 14a, the movement of the electronic component due to the flux or the like can be suppressed as compared with the related art. As in the conventional case, in the case of the flat protective material 14, the movement of the electronic component is suppressed by its own weight in the case of a large electronic component, but in the case of a very small electronic component as in the present embodiment, The flow of the flux causes a displacement of the electronic component.

Further, by providing the concave portion 14a in the protective material 14, when the electronic component is sucked by the nozzle of the mounting machine, the nozzle does not slip on the electronic component, so that a suction error does not occur. In the case of a large electronic component as in the past, a protection member that is as flat as possible is necessary because the suction portion by the nozzle is large, but according to the small electronic component assumed in this embodiment, Since the suction portion of the component by the nozzle is very small, the suction is easy, but the slip of the nozzle on the electronic component becomes a serious problem. Again, in the present embodiment, the concave portions 14
By providing a, the sliding of the nozzle can be prevented to some extent, and the mountability of small electronic components can be improved.

In the present embodiment, the depth of the concave portion 14a can be adjusted by changing the depth of the groove 13 by providing the concave portion 14a corresponding to the groove 13, and the concave portion 14a is bothersome. Since a process for forming the layer is not required, productivity is improved.

In this embodiment, the concave portion 14a is provided so as to correspond to the groove 13. However, the concave portion 14a may be formed by processing the protective material 14 into a corrugated shape.
The concave portion 14a may be formed by providing a plurality of convex portions on the surface.

Further, in the present embodiment, the concave portion 14a is provided continuously over all side surfaces of the base 11,
May be provided on at least one side face, or the recess 14a may be provided discontinuously.

As shown in FIG. 7, the depth E of the recess 14a is 0 μm <E <30 μm (preferably 3 μm
<E <20 μm, more preferably 3 μm <E <10 μm
m) is preferable. When E is 0 μm, the concave portion 14a is not formed, so that improvement in mountability cannot be expected. When E exceeds 30 μm, the probability of occurrence of suction error by the nozzle becomes extremely high.

In particular, in the case of an inductance element, the bottom portion 14b of the concave portion 14a enters the inside of the groove 13 as shown in FIG. 7, so that the protection existing between the coil portions formed by providing the groove 13 is provided. The amount of the material 14 can be reduced, and the high frequency characteristics are improved.

In this embodiment, the recesses 14a are periodically formed to suppress variations in mountability and characteristics. However, the recesses 14a are irregularly formed in accordance with the specifications and the use environment. 14a may be provided. For example, the distance between the concave portions 14a at the center of the electronic component is reduced, and the distance between the concave portions 14a at both ends is increased, or vice versa. A configuration in which the interval of 14a is gradually widened or narrowed may be used.

Further, in the present embodiment, by forming the bottom 14b with an arc-shaped cross section, it is possible to prevent dust and the like from accumulating in the recess 14a.

Next, the terminals 15 and 16 will be described.

As shown in FIG. 2, the terminal portions 15 and 16 are provided on the end of the base 11, and are provided on the side of the base 11 via the conductive film 12. Therefore, the electrical connection between the conductive film 12 and the terminal portions 15 and 16 can be favorably performed. The conductive film 12 is exposed on the end face of the electronic component when viewed from the end face of the electronic component, but is not formed on the end face of the base 11, so that the terminal portions 15, 16 are formed by plating. , Terminal part 15,
16 is hardly formed on the end face of the base 11,
Alternatively, only a small portion is formed on the end face of the base 11. As described above, since the terminal portions 15 and 16 exist only at the outer edge of the end surface of the base 11, the mounting area and the mounting area when mounting on a circuit board or the like can be reduced. In addition, a soldering inspection by image recognition can be reliably performed.

Further, in order to make a good connection between the land pattern provided on the circuit board and the like and the electronic component, it is preferable to make the terminal portions 15 and 16 project from the end face of the base 11.

With the above configuration, electronic components can be mounted at a high density when mounted on a circuit board or the like.
Since one end face is exposed, an improvement in Q value and the like can be realized.

In the present embodiment, the end surface of the base 11 is configured to be exposed to the outside. However, the end surface of the base 11 is exposed, so that the base 11 may be damaged or deteriorated. If there is a concern, a resin having weather resistance, a metal material having weather resistance, or the like may be provided on the end surface of the base 11.

Hereinafter, the terminal portions 15 and 16 will be specifically described.

The terminals 15 and 16 are basically made of a material having a bonding property, that is, a solder or a lead-free bonding material (Sn).
Lead-free solder or the like containing at least one of Ag, Cu, Zn, Bi, and In in Sn or Sn) is used.
The preferred film thickness is 5 to 10 μm. As above,
The terminal parts 15 and 16 are formed directly on the conductive film 12 by using, for example, a plating method.

In order to improve the corrosion resistance, Ti, N
A corrosion resistant film such as a metal film that is hardly corroded, such as i, W, and Cr, and an alloy film (such as Ni—Cr) of those metal materials is formed to a thickness of 0.5 to
It is preferable to first form a 3 μm-thick film on the conductive film 12 and then to form the solder or lead-free bonding material under the above-mentioned conditions. In particular, the use of Ni alone or a Ni alloy as the corrosion resistant film is excellent in characteristics, cost, and the like.

The terminal portions 15 in the longitudinal direction of the base 11,
It is preferable that the lengths P1 and P2 of the respective 16 satisfy the following relationship. Note that L1 represents the entire length of the element as described above.

0.07 <P1 ÷ L1 <0.3 (preferably 0.2) 0.07 <P2 ÷ L1 <0.3 (preferably 0.2) P1 ÷ L1 and P2 ÷ L1 are 0.07 In the following cases,
When the element is mounted on a circuit board, the bonding area with the electrodes provided on the circuit board becomes smaller, the bonding strength may deteriorate, and the Manhattan phenomenon may occur. In this case, the terminal portions 15 and 16 are close to each other, and when mounted on a circuit board or the like, the terminal portions 1
There is a possibility that a short circuit occurs between 5 and 16 on a circuit board or the like.

The widths P3, P3 of the terminals 15, 16 formed on the terminals 15, 16 when viewed from the end surface of the base 11.
4 is 10 μm to 30 μm (preferably 20 to 30 μm)
If P3 and P4 are smaller than 10 μm, sufficient bonding strength with a land pattern or the like cannot be obtained, and image recognition during soldering inspection is difficult. If it is larger than 30 μm, an element standing phenomenon or the like is likely to occur.

Further, as shown in FIG. 2, the terminal portions 15 and 16 are slightly provided on the end surface of the base 11 so as to cover the boundary between the base 11 and the conductive film 12 so that the base 11 and the conductive film 1 can be formed.
It can be prevented that water or the like enters between the two and causes deterioration of characteristics over time. The widths of the terminal portions 15 and 16 formed directly on the end surface of the base 11 are P3 and P4.
Is preferably about 5% to 20% (preferably 7 to 12%) from the viewpoint of mounting and protection.

The base 1 from the surface of the end face of the base 11
1, the protrusion amounts P5 and P of the terminal portions 15 and 16 on the end face.
6 is 3 μm to 30 μm (preferably 5 μm to 15 μm)
If P5 and P6 are smaller than 3 μm, sufficient bonding strength with a land pattern or the like cannot be obtained, and image recognition at the time of soldering inspection becomes difficult. If it is larger than 30 μm, an element standing phenomenon or the like is likely to occur.

The specific resistance of the terminals 15 and 16 is 1 ×
10 ⁻⁴ Ωcm or more (preferably 5 × 10 ⁻⁴ Ωcm or more)
It is effective to improve the electrical characteristics.

As shown in FIG. 2, the heights Z1 and Z2 of the terminal portions 15 and 16 preferably satisfy the following conditions.

| Z1-Z2 | ≦ 80 μm (preferably 50 μm) The difference in height between Z1 and Z2 is 80 μm (preferably 50 μm).
m or less), when the element is mounted on a circuit board and attached to a circuit board or the like with solder or the like, the element is pulled to one end by surface tension of the solder or the like, and the element stands up. The probability of occurrence is very high. FIG. 4 shows this Manhattan phenomenon. As shown in FIG. 4, an inductance element is arranged on a substrate 200,
Solder 20 between each of terminal portions 15 and 16 and substrate 200
Although the solders 201 and 202 are provided, when the solders 201 and 202 are melted by reflow or the like, the molten solders 201 and 202 are melted due to a difference in the application amount of each of the solders 201 and 202 and a difference in melting point due to a difference in material. 4 differs between the terminal portion 15 and the terminal portion 16, and as a result, as shown in FIG. 4, the surface element rotates about one terminal portion, and the inductance element rises. If the difference between the heights of Z1 and Z2 exceeds 80 μm (preferably 50 μm or less), the elements are arranged on the substrate 200 in an inclined state, and the standing of the elements is promoted. In addition, the Manhattan phenomenon is particularly remarkable in small and lightweight chip-type electronic components (including chip-type inductance elements). One of the causes of the Manhattan phenomenon is the terminal portion 1.
The element is tilted due to the difference in height between 5 and 16 and the substrate 200
We paid attention to being placed in. As a result, by forming the base 11 by molding or the like so that the difference between the heights of Z1 and Z2 is 80 μm or less (preferably 50 μm or less), the occurrence of the Manhattan phenomenon could be significantly suppressed. . By setting the difference between the heights of Z1 and Z2 to 50 μm or less, the occurrence of the Manhattan phenomenon can be substantially suppressed.

The method of manufacturing the inductance element having the above configuration will be described below.

First, a base for several to several tens of elements is manufactured by pressing or extruding an insulating material such as alumina, and then a conductive film 12 is formed on the entire base 11 by plating or sputtering. It is formed excluding the end face.
At this time, first, after the conductive film 12 is formed on the entire surface of the base 11, the conductive film 12 on the end surface is removed, or the conductive film 12 is formed on the long rod-shaped base 11, and the base 11 is removed. It is formed by cutting, or a mask is previously applied to the end face of the base 11 so that the conductive film 12 is not formed on the end face.

Next, a plurality of spiral grooves 13 are provided at predetermined intervals on the base 11 on which the conductive film 12 is formed. The groove 13 is formed by laser processing or cutting. Since the laser processing has very high productivity, the laser processing will be described below. First, the base 11 is attached to a rotating device, the base 11 is rotated, and the base 11 is irradiated with a laser to remove both the conductive film 12 and the base 11, thereby forming a spiral groove. The laser at this time is a YAG laser,
An excimer laser, a carbon dioxide laser, or the like can be used, and the base 11 is irradiated with the laser light by narrowing the laser light with a lens or the like. Further, the depth and the like of the groove 13 can be adjusted by adjusting the power of the laser, and the width and the like of the groove 13 can be adjusted by exchanging a lens when narrowing down the laser beam. Since the laser absorptivity varies depending on the constituent material of the conductive film 12 and the like, it is preferable to appropriately select the type of laser (laser wavelength) depending on the constituent material of the conductive film 12. The groove 13 may be formed using a grindstone or the like.

After forming the groove 13, a protective material 14 is formed on the entire surface of the conductive film 12 by using an electrodeposition method, a coating method, or the like.
Further, a concave portion 14a is formed in the protective member 14.

Next, after cutting the base 11 so as to sandwich the groove 13, the protective member 14 on the side end of the base 11 is removed. Alternatively, before cutting the base 11, the protective material 14 is removed so as to sandwich the groove 13, and then, with the portion from which the protective material 14 has been removed as a guide, the portion is cut into individual elements. At this time, the conductive film 12 is formed on the end face of the base 11.
Does not exist, and the conductive film 1 is provided on the outer edge of the end face of the base 11.
2 are located.

After that, the terminal portions 15 and 15 are formed on the exposed portions of the conductive film 12 at the ends of the base 11 by plating.
The electronic component is completed by laminating one or a plurality of the layers 16.

Although the present embodiment has been described with reference to an inductance element, the same effect can be obtained with an electronic component in which a conductive film is formed on a base made of an insulating material.

Further, by using the conductive film 12 as a resistance film, a small chip resistor can be manufactured. Instead of providing the spiral groove 13 in the conductive film 12, an annular groove or the like is provided. By dividing the conductive film 12 into at least two parts, the conductive film 12 can also be used as a chip capacitor.

FIGS. 5 and 6 are a perspective view and a block diagram, respectively, showing a wireless terminal device according to an embodiment of the present invention. 5 and 6, reference numeral 29 denotes a microphone for converting an audio signal to an audio signal, 30 denotes a speaker for converting an audio signal to an audio signal, 31 denotes an operation unit including dial buttons and the like, and 32 denotes a display unit for displaying an incoming call and the like. , 33 are antennas,
Reference numeral 34 denotes a transmission unit for demodulating an audio signal from the microphone 29 and converting the demodulated signal into a transmission signal. The transmission signal produced by the transmission unit 34 is emitted to the outside through an antenna. A receiving unit 35 converts a received signal received by the antenna into an audio signal.
The audio signal created by the receiving unit 35 is converted into audio by the speaker 30. A control unit 36 controls the transmission unit 34, the reception unit 35, the operation unit 31, and the display unit 32.

An example of the operation will be described below.

First, when there is an incoming call, the receiving unit 35
Sends an incoming signal to the control unit 36, the control unit 36 displays a predetermined character or the like on the display unit 32 based on the incoming signal, and further presses a button or the like for receiving an incoming call from the operation unit 31. And a signal is sent to the control unit 36,
The control unit 36 sets each unit to the incoming call mode. That is, the signal received by the antenna 33 is converted into an audio signal by the receiving unit 35, the audio signal is output as audio from the speaker 30, and the audio input from the microphone 29 is converted into an audio signal, Through the antenna 33 to the outside.

Next, a case of transmitting a call will be described.

First, when transmitting a signal, a signal to transmit is transmitted from the operation unit 31 to the control unit 36. Subsequently, when a signal corresponding to the telephone number is transmitted from the operation unit 31 to the control unit 36, the control unit 36 transmits a signal corresponding to the telephone number from the antenna 33 via the transmission unit 34. When the transmission signal establishes communication with the other party,
When a signal to that effect is sent to the control unit 36 via the reception unit 35 via the antenna 33, the control unit 36 sets each unit to the transmission mode. That is, the signal received by the antenna 33 is converted into an audio signal by the receiving unit 35, the audio signal is output as audio from the speaker 30, and the audio input from the microphone 29 is converted into an audio signal, Through the antenna 33 to the outside.

In the present embodiment, an example in which voice is transmitted and received has been described. However, the present invention is not limited to voice, and a similar effect can be obtained for a device that transmits or receives data other than voice such as character data. Can be obtained.

The electronic components described above (shown in FIGS. 1 to 3 and the like) are used for at least one of a transmitting circuit, a filter circuit, an antenna section, a peripheral section of a matching circuit for each stage, and the like. Are several to 40 in one wireless terminal device.
About one piece is used. By using the electronic components as described above, the size of the substrate and the like inside the device can be reduced, and the phenomenon of standing up of the elements can be suppressed. Therefore, the defective rate of the circuit board and the like becomes extremely small, and the productivity becomes very good.
In addition, the electronic components are securely mounted on the substrate, and no trouble is caused by long-term use.

[0102]

According to the present invention, there are provided a base, a conductive film provided on the base, a groove provided in the conductive film, a pair of terminal portions provided on an end of the base, and a groove. An electronic component comprising a protective material provided so as to cover the surface of the electronic component, wherein a concave portion is provided on a surface portion of the protective material, whereby slip with the suction nozzle can be reduced, and the position of the element due to the flux can be reduced. Displacement can be prevented.

Also, by mounting the above-mentioned electronic components in the wireless terminal device, it is possible to prevent the deterioration of the mountability and characteristics of the electronic components, thereby greatly improving the productivity and suppressing the deterioration of the characteristics of the terminal. .

[Brief description of the drawings]

FIG. 1 is a diagram showing an inductance element according to an embodiment of the present invention.

FIG. 2 is a side sectional view showing an inductance element according to an embodiment of the present invention.

FIG. 3 is a perspective view showing a base used for the inductance element according to the embodiment of the present invention;

FIG. 4 is a diagram showing the Manhattan phenomenon

FIG. 5 is a perspective view showing a wireless terminal device according to one embodiment of the present invention;

FIG. 6 is a block diagram showing a wireless terminal device according to an embodiment of the present invention.

FIG. 7 is a partially enlarged view showing an inductance element according to one embodiment of the present invention.

FIG. 8 is a side view showing a conventional inductance element.

[Explanation of symbols]

 Reference Signs List 11 base 12 conductive film 13 groove 14 protective material 14a concave portion 14b bottom 15, 16 terminal unit 30 speaker 31 operation unit 32 display unit 33 antenna 34 transmitting unit 35 receiving unit 36 control unit

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Iso ▲ saki ▼ Kenzo 1006 Kadoma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. In-house F term (reference) 5E070 AA01 AB01 AB10 BA07 CB01 CC01 CC03 5K023 AA07 BB04 LL01 PP01

Claims (10)

[Claims] 1. A base, a conductive film provided on the base, a groove provided in the conductive film, a pair of terminals provided on an end of the base, and the groove An electronic component comprising: a protection member provided so as to cover the protection member, wherein a recess is provided in a surface portion of the protection member. 2. The electronic component according to claim 1, wherein the recess provided in the protective material is provided on all side surfaces of the base. 3. The electronic component according to claim 1, wherein the recess provided in the protective material is provided corresponding to the groove. 4. The electronic component according to claim 1, wherein the bottom of the recess has an arc shape. 5. The electronic component according to claim 1, wherein the bottom of the recess is inserted into the groove. 6. The electronic component according to claim 1, wherein the depth of the recess is larger than 0 μm and smaller than 30 μm. 7. The electronic component according to claim 1, wherein an inductance component is formed by the conductive film and the groove. 8. The electronic component according to claim 1, wherein a resistive film is used in place of the conductive film. 9. The method according to claim 1, wherein a groove for dividing the conductive film into at least two parts is provided, and has a capacitance component.
Electronic components as described. 10. A display means, conversion means for converting at least one of a data signal and an audio signal into a transmission signal or converting a reception signal into at least one of a data signal and an audio signal, and converting the transmission signal and the reception signal. 10. A wireless terminal device comprising an antenna for transmitting and receiving and control means for controlling each unit, wherein at least one of a transmitting circuit, a filter circuit, an antenna unit, and a peripheral circuit of a matching circuit for each stage is provided. A wireless terminal device using the electronic component according to claim 1.