JP2002014367A - Method for manufacturing liquid crystal display element and wiring board using this method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid crystal display element permitting to improve a method for inspecting wiring, and perform management of each liquid crystal cell from the early stage of the process. SOLUTION: Wiring 3 and an identification pattern 3b connected with the wiring are formed on a 1st metallic thin film on a substrate 1, and these surfaces are processed by anode oxidization treatment to form an insulating film 7, and thereafter, the wiring 3 is inspected depending on whether or not the insulating film 7 is formed on the identification pattern 3b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal display device by forming another thin film on the surface of a conductive thin film by using an electrochemical surface treatment.

[0002]

2. Description of the Related Art A liquid crystal display device has a pair of substrates facing each other, and both substrates are bonded together with a sealing material.
Liquid crystal is sealed between the substrates. As one substrate of a liquid crystal display element, a substrate on which a thin film element such as a thin film transistor or a thin film diode is formed has been put to practical use and widely used. Hereinafter, the prior art will be described by taking an active matrix driving type liquid crystal display element using a thin film diode as a switching element as an example.

FIG. 10 shows a conventional liquid crystal display device 2.
FIG. The liquid crystal display element 20 has a pair of substrates 1 and 2 facing each other at a fixed distance, and the substrates 1 and 2 are bonded together by a sealing material 12 and a liquid crystal (not shown) is provided between the substrates 1 and 2. ) Is enclosed.

The one substrate 1 is formed by forming wirings 3, thin-film diodes 4, pixel electrodes 5, and terminals 6 on a transparent substrate made of glass. The thin-film diode 4 has a lower electrode 3a, an insulating film 7, and an upper electrode 8, and a metal-
It has an oxide-metal (MIM) structure. The thin-film diode 4 having the MIM structure of the liquid crystal display device, the lower electrode 3a is made of Ta film as the first metal thin film, an insulating film 7 consists of TaO _x film, an upper electrode 8 in the second metal thin film A film made of a certain Ti film or Cr film has been put to practical use. The pixel electrode 5 is made of ITO as a transparent conductor.
(Indium tin oxide) is used.

[0005] The other substrate 2 is formed by forming a stripe-shaped counter electrode 9 and a terminal 10 made of a transparent conductor such as ITO on a transparent substrate. An alignment film (not shown) is formed on the inner surfaces of both substrates 1 and 2 by performing a rubbing process using a cloth or the like so that the liquid crystal sealed between the substrates has a predetermined alignment state. You. In addition, the substrate 1,
2, an optical film 1 represented by a polarizing plate
1 is provided.

In the liquid crystal display element 20, a region where the pixel electrode 5 and the counter electrode 9 face each other is one pixel, and a predetermined signal is input from the terminals 6 and 10 to perform light modulation for each pixel, thereby performing predetermined light modulation. An image is displayed by controlling the light transmittance. For the purpose of controlling the production of the liquid crystal display element, for example, a symbol 14 such as an alphanumeric character is written on the substrate as disclosed in JP-A-11-174422.

A substrate of a liquid crystal display element is rarely manufactured as a single unit. A plurality of substrate patterns are simultaneously formed on a large glass substrate, a mother glass, and the mother glass is divided. FIG. 11 is a plan view showing the mother glass 1a of the substrate 1 of the conventional liquid crystal display element 20. On the mother glass 1a, a plurality of (four in the figure) patterns of the substrate 1 are formed at predetermined intervals. Symbol 1
Reference numeral 4 often indicates the position of each substrate 1 on the mother glass 1a. Further, the symbol 14 may be provided on the opposing substrate 2.

FIG. 12 is a plan view showing a mother glass 2a of the substrate 2 of the conventional liquid crystal display device 20. A plurality of (four in the figure) patterns of the substrates 2 are formed at predetermined intervals on the mother glass 2a. Both mother glasses 1a,
2a is a reference symbol “a” of the mother glass 1a and the mother glass 2
The reference symbol a ′ of a, the reference symbol b of the mother glass 1a, and the reference symbol b ′ of the mother glass 2a face each other, and are stuck so that their patterns face each other.

Next, a procedure for manufacturing a liquid crystal display element manufactured using the mother glasses 1a and 2a will be described. Figure 1
FIG. 3 is a plan view for explaining a manufacturing procedure of the conventional liquid crystal display element 20.

[0010] First, in FIG.
a, a first metal thin film to be the wiring 3, the lower electrode 3a of the thin film diode 4, and the terminal 6 is formed and patterned into a predetermined shape. At this time, the patterns of the plurality of substrates 1 are simultaneously formed on the mother glass 1a.

In FIG. 13B, a metal oxide serving as an insulating film 7 of the thin-film diode 4 is formed on the surface of the patterned first metal thin film by using an anodic oxidation method.

In the anodic oxidation method, the mother glass 1a
Is immersed in the same electrolytic solution together with a counter electrode plate such as a Pt plate, and the mother glass 1a is connected to the anode side, and the counter electrode plate is connected to the cathode side. Therefore, it is preferable to previously provide the connection portion 13 and the wiring 13a for connecting the first metal thin film to the anode, and connect the connection portion 13 to all of the wirings 3 via the wiring 13a. In this way, all the wirings 3 on the mother glass 1a are connected to the anode side only by attaching the electrode clip on the anode side to the connection portion 13 that appears on the surface of the electrolytic solution at the time of anodic oxidation, so that workability is excellent. preferable.

The connection 13 and the wiring 13a are preferably patterned using the same material at the same time as the wiring 3, the lower electrode 3a and the terminal 6. At the end of the anodic oxidation, an insulating film 7 is also formed on the terminal 6. However, the insulating film 7 on the terminal 6 prevents an electrical connection between the terminal 6 and a driving circuit member for driving the liquid crystal display element 20. It is necessary to remove the first metal thin film by etching to remove it.

In FIG. 13 (3), the second electrode serving as the upper electrode 8 is formed.
Is formed and patterned into a predetermined shape.

In FIG. 13D, a transparent conductor is formed as a thin film and patterned into a predetermined shape to simultaneously form the pixel electrode 5 and the symbol 14. The transparent conductor may be patterned on the terminal 6 from the viewpoint of reliability.

In FIG. 13 (5), a mother glass 2a in which a counter electrode 9 and a terminal 10 are patterned using a transparent conductor is separately manufactured, and an alignment film (not shown) is formed on each surface of the mother glass 1a, 2a. Is formed, the mother glasses 1a and 2a are placed in such a manner that the electrodes face each other as shown in FIG.
Are bonded via a sealing material 12 shown in FIG. At this time, a predetermined space is provided between the mother glasses 1a and 2a.
In many cases, a granular spacer (not shown) having a fixed size is sandwiched.

In FIG. 13 (6), the bonded mother glasses 1a and 2a are cut along the cutting line 15 to produce a plurality of empty cells in which no liquid crystal is sealed. Thereafter, liquid crystal is sealed through an injection port (not shown) provided in a part of the sealing material 12, an optical film 11 is attached to the outside of the substrates 1 and 2, and a driving circuit member (not shown) is attached to the liquid crystal display. The element 20 is completed.

[0018]

As described above, since the liquid crystal display element 20 has a plurality of wirings, and particularly the wirings 3 of the substrate 1 are thin, a failure due to disconnection may occur. The substrate 1 is
Since it is manufactured through many processes, it is important to detect disconnection of wiring at an early stage, distinguish between good cells and defective cells, and correct or discard if possible It is.

As a method for determining whether or not there is a disconnection in the wiring 3, a method utilizing the fact that the insulating film 7 on the wiring 3 exhibits a specific color, for example, that TaO _x having a thickness of about 60 nm exhibits blue. is there. FIG. 14 is a plan view showing a place where the disconnection of the wiring 3 has occurred.
The substrate 1 on which is marked is shown in an enlarged manner. Since the insulating film 7 is formed on the surface of the first metal thin film that is energized at the time of anodic oxidation, the insulating film 7 is formed on the non-defective non-defective wiring 3 and is blue (shown in black in the figure). ), And the wiring 3 that is disconnected and not anodized exhibits metallic luster (indicated by oblique lines in the figure). Therefore, disconnection can be inspected by visually observing the wiring 3 of the mother glass 1a.

However, it is possible to inspect by visual observation when the width of the wiring 3 of the substrate 1 is large to some extent, and the large number of wirings 3 which have become elongated with the enlargement and refinement of the liquid crystal display element. Is very difficult to inspect visually. In addition, recent mother glass 1
It becomes more and more difficult due to the enlargement of a.

Even if the wiring 3 is thick, the wiring 3
If the vicinity of the end is broken, the wiring 3 exhibiting metallic luster is extremely short, and it is difficult to find the broken by visual inspection. In addition, recently proposed wiring 3
In a reflection type liquid crystal display element in which a reflective pixel electrode is disposed with an interlayer insulating film interposed therebetween, the wiring 3 is inspected only during some steps because the wiring is hidden by the pixel electrode. Things can happen. In addition, depending on the lighting at the time of inspection, the positional relationship between the wiring board and the person in charge of inspection, and the inspection ability of the person in charge of inspection, the disconnection may not be found and may be overlooked.

Therefore, regardless of the line width and the position of the disconnection of the wiring 3, and furthermore, regardless of the pixel structure and the inspection environment, a manufacturing method capable of easily detecting the disconnection of the wiring 3, and a wiring board of a liquid crystal display element capable of providing this manufacturing method Is desired.

Therefore, another inspection method is disclosed in Japanese Patent Laid-Open No. 7-199.
No. 210 is disclosed. The above-mentioned publication proposes a method in which a small test pad is provided at the end of a wiring, and a test element is brought into contact with the small test pad to electrically test for disconnection or the like.
With this inspection method, a wiring failure can be found even with a fine wiring. However, in order to electrically inspect a large number of wirings using contacts, there is a problem that a dedicated device is required and the inspection takes time.

On the other hand, the thin-film diode and the thin-film transistor are composed of fine thin-film patterns on the order of several μm. Therefore, when patterning each thin film, an exposure apparatus having excellent resolution, for example, a stepper exposure apparatus is used. The stepper exposure apparatus is characterized in that a large-sized substrate such as a mother glass 1a is dividedly exposed. For example, a reticle (photomask) on which a pattern for one substrate is formed is moved and exposed on the mother glass. A plurality of exposures can be performed on the same substrate pattern.
For this reason, a pattern having the same shape can be exposed and transferred to each substrate region of the mother glass, but it is difficult to provide different symbols for each substrate region. When dare to expose and transfer different symbols for each substrate region of the mother glass, all the symbols are prepared in a reticle pattern and exposed while selecting different symbols for each substrate, or for example. Although there is a method of performing exposure using a plotter-like dedicated symbol input device, it takes time for the exposure process or requires a dedicated device, which is disadvantageous.

Therefore, in the case where a different symbol is exposed relatively easily for each substrate area, the above-described method disclosed in Japanese Patent Application Laid-Open No.
As disclosed in Japanese Patent Application Laid-Open No. 22-222, there is no alternative but to use a batch exposure such as a proximity exposure apparatus used for patterning pixel electrodes that do not require relatively high dimensional accuracy. However, as described with reference to FIG. 13, since the formation of the pixel electrode is in the latter half of the manufacturing process of the mother glass, it is difficult to provide and manage different symbols in each substrate region from an early stage of the manufacturing process.

An object of the present invention is to provide a method of manufacturing a liquid crystal display element, which can improve the method of inspecting wiring and can manage individual substrates from an early stage of the manufacturing process.

[0027]

According to the present invention, there is provided a liquid crystal display device manufactured by patterning a conductive thin film on a substrate and forming a second thin film on the surface of the conductive thin film by electrochemical surface treatment. Forming a wiring and an identification pattern connected to the wiring from a conductive thin film on a substrate, performing an electrochemical surface treatment on a surface of the conductive thin film to form a second thin film, A method for manufacturing a liquid crystal display element, wherein a wiring is inspected based on a color presented by an identification pattern.

According to the present invention, a wiring and an identification pattern connected to the wiring are formed from a conductive thin film on a substrate, and the surface of the conductive thin film is subjected to an electrochemical surface treatment to form a second thin film. Since the wiring is formed and thereafter the wiring is inspected based on the color presented by the identification pattern, it is possible to easily determine whether or not the wiring is broken based on the identification pattern.

Further, the identification pattern of the present invention is characterized in that the width thereof is larger than the width of the wiring and is set to a size that can be visually recognized.

According to the present invention, since the width of the identification pattern is larger than the width of the wiring and is set to a size that can be visually recognized, the presence or absence of a disconnection can be easily determined from the identification pattern even if the wiring is thin. can do.

Further, according to the present invention, the conductive thin film is a metal thin film, an anodizing treatment is performed as an electrochemical surface treatment, a metal oxide is formed on the surface of the metal thin film, and after the anodizing treatment, the metal on the identification pattern is formed. Inspection of wiring defects is performed by utilizing the fact that the color of the oxide is different from the color of the identification pattern that exhibits metallic luster without being anodized due to disconnection of the wiring.

According to the present invention, the conductive thin film is a metal thin film, anodizing is performed as an electrochemical surface treatment, a metal oxide is formed on the surface of the metal thin film, and after the anodizing, the metal on the identification pattern is formed. Wiring defects are inspected by using the difference between the color of the oxide and the color of the identification pattern that exhibits metallic luster without being anodized due to disconnection of the wiring. Even if there is a book, it is possible to determine the presence or absence of disconnection from the identification pattern group, and it is most suitable for a method of inspecting a thin film transistor substrate or a thin film diode substrate having such wiring.

The substrate of the present invention is obtained by dividing a large substrate constituting a plurality of substrates. A thin film is formed on the large substrate, and a photoresist is formed on the thin film. A first exposure to be performed at a plurality of locations on a large substrate using a photomask provided with a part of a light shielding portion together with a predetermined pattern to be exposed; The method is characterized in that a symbol for identifying each substrate is provided on a large-sized substrate by patterning the thin film by combining the second exposure performed using a photomask provided with.

According to the present invention, the substrate is obtained by dividing a large substrate constituting a plurality of substrates, and a symbol for identifying each substrate is provided on the large substrate. Inspection can be performed in correspondence with the symbol of the substrate, and wiring defects can be easily managed for each substrate.
In addition, a thin film is formed on a large substrate, a positive resist is formed thereon, and a plurality of portions of the large substrate are formed using a photomask provided with a predetermined light shielding portion along with a predetermined pattern constituting each substrate. 1 is exposed, and then a second exposure is performed using a photomask in which a symbol pattern is provided at a position corresponding to the light-shielding portion together with a pattern for exposing the peripheral portion of each substrate. Since a symbol is provided on each substrate, a different symbol can be provided for each substrate even for a thin film that requires stepper exposure.

Further, the symbol of the present invention is characterized in that the symbol is formed by a conductive thin film constituting a wiring and an identification pattern.

According to the present invention, since the symbol is formed by the conductive thin film forming the wiring and the identification pattern, the symbol can be provided from an early stage of the manufacturing process, and the substrate is managed in correspondence with the symbol. can do.

Further, the present invention is characterized in that the symbol is composed of a metal thin film, and the surface of the metal thin film is not covered with a metal oxide.

According to the present invention, the symbol is composed of a metal thin film, and the surface of the metal thin film is not covered with a metal oxide.

Further, the present invention is characterized in that the identification pattern is provided with a symbol for identifying each wiring in the substrate.

According to the present invention, since the identification pattern is provided with a symbol for identifying each wiring in the substrate, it is possible to know the presence or absence of the broken wiring and the position of the wiring in the substrate. This can help improve yield.

According to the present invention, when the third thin film is formed on the wiring, the identification pattern is not covered by the third thin film.

According to the present invention, since the identification pattern is not covered by the third thin film, for example, the third thin film such as a metal wiring, a transparent electrode, an inorganic insulating film or an organic insulating film, and a semiconductor layer is formed by the third thin film. By being formed thereon, light interference does not occur or light is blocked so that it does not hinder the determination of the color presented by the identification pattern. Even if it cannot be confirmed, the inspection can be easily performed based on the color of the identification pattern even after the formation of the third thin film, so that there is no mistake or oversight in the inspection.

Also, the present invention provides a method of manufacturing a semiconductor device comprising:
It is characterized in that a dummy pattern having a different dimension or shape from the identification pattern and having the same film configuration is provided.

According to the present invention, a dummy pattern which can be compared with the surface of the identification pattern is provided next to the identification pattern, so that another identification pattern whose surface can be compared is arranged next to the identification pattern. Even for an identification pattern which is likely to be omitted due to lack of inspection, inspection omission can be prevented. Further, since the size or shape of the dummy pattern is different from that of the identification pattern, the dummy pattern can be easily recognized as a dummy pattern, and erroneous determination can be prevented.

Further, according to the present invention, when the third thin film is a wiring extending longitudinally on the identification pattern, the third thin film has an opening or a cutout on the identification pattern. The second thin film on the surface is exposed.

According to the present invention, since the third thin film traverses the identification pattern as a wiring, the third thin film has a function as a wiring, and the opening or the opening of the third thin film on the identification pattern. Since the second thin film is exposed from the notch, it is possible to observe the color of the identification pattern on the identification pattern surface.

[0047]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below by taking an active matrix drive type liquid crystal display device using a thin film diode as a switching device as an example. The liquid crystal display element has a pair of substrates facing each other at a predetermined distance, and both substrates are pasted together with a sealing material, and liquid crystal is sealed between the substrates.

One substrate is formed by forming wirings, thin-film diodes, pixel electrodes and terminals on a transparent substrate made of glass or the like. The other substrate is a transparent substrate on which I
A stripe-shaped counter electrode and a terminal made of a transparent conductor such as TO (indium tin oxide) are formed and formed. On the inner surfaces of both substrates, an alignment film is formed by performing a rubbing process using a cloth or the like so that the liquid crystal sealed between the substrates has a predetermined alignment state. On the outer surface of the substrate, an optical film typified by a polarizing plate is provided. In the liquid crystal display device configured as described above, a region where the pixel electrode and the counter electrode face each other is one pixel, and a predetermined signal is input from each terminal to perform light modulation for each pixel.
An image is displayed by controlling the light transmittance to a predetermined value.

The substrate of the liquid crystal display element is rarely manufactured as a single unit. A plurality of substrate patterns are simultaneously formed on a large mother glass, and the mother glass is divided and manufactured. FIG. 1 is a plan view for explaining a method for manufacturing a liquid crystal display element according to one embodiment of the present invention, and FIG. 2 is a plan view showing a part of a mother glass 1a in an enlarged manner.
1 and 2 show a state immediately after the pixel electrode 5 is formed.

The mother glass 1a has a thin film diode 4
A plurality of patterns (one in FIG.
) Are formed at a predetermined interval. When the mother glass 1a is divided along a dividing line 15 indicated by a dotted line in a step described later, a plurality of substrates 1 are formed.

Mother glass 1a which is a large glass substrate
Are formed with wirings 3 and 13a, identification patterns 3b, connection portions 13 with the anode in the anodic oxidation method described later, thin-film diodes 4, pixel electrodes 5 and terminals 6. The identification pattern 3b is formed in such a size as to be visible at each end of the wiring 3. The thin-film diode 4 has a lower electrode 3a, an insulating film 7, and an upper electrode 8, and has a metal-oxide-metal (MIM) structure.

The wirings 3 and 13a, the connection portion 13, the identification pattern 3b and the lower electrode 3a are made of a first metal thin film T
It is formed from a film and is all electrically connected. The insulating film 7 is formed so as to cover the first metal thin film,
It is made of TaO _{x with} a thickness of about 60 nm and exhibits a blue color. The upper electrode 8 is formed on the insulating film 7 and is made of a second metal thin film, such as a Ti film or a Cr film. In addition, the pixel electrode 5
Is formed from ITO which is a transparent conductor.

In the prior art, the presence or absence of disconnection of the wiring 3 is electrically inspected by observing the wiring 3 itself or by using an inspector. On the other hand, in the present embodiment, the inspection is performed by looking at the color of the identification pattern 3b. In a place where the wiring 3 is not disconnected, the insulating film 7 is formed on the first metal thin film of the wiring 3 and the identification pattern 3b and exhibits a blue color (shown in black in FIG. 2). The insulating film 7 is not formed on the first metal thin film of the wiring 3 and the identification pattern 3b at the location where the wiring 3 and the identification pattern 3b have metallic luster (shown by oblique lines in FIG. 2).

The width W of the identification pattern 3b is preferably set to be wider than the width of the wiring 3 as shown in FIG. The length L is at least one pixel, preferably about 10 to 20 pixels, and more preferably as long as possible. Since one pixel is about 0.2 to 0.3 mm, the length corresponding to 10 to 20 pixels is 2 to 6 m
m, which is a size that can be visually observed.

In general, the resolution of the human eye is as follows: L1 is the distance between the object and the lens of the eye, L2 is the distance between the lens and the retina, and L3 is the distance between the cone cells on the retina. It is known that it is easily obtained as L2 × L3 (1). Also,
The average value of anatomical L2 and L3 is L2 = 16.7 m
m, L3 = 0.005 mm.

From the standpoint of inspection, it is desirable to view the wiring board as wide as possible, so that the distance L1 should be increased. Therefore, the relationship between L1 and the resolution of the eyes is known as in the equation (1), and by using this, the standard of the dimension required for the identification pattern 3b can be known.

For example, when the inspection is to be performed at L1 = 300 mm, the resolution is about 0.09 mm. This value is the minimum distance between two visible points, and the color can be identified by providing the identification pattern 3b over a wider area. Therefore, it is clear that the dimension L or W of the identification pattern 3b described above is a value sufficiently larger than the resolution, and that the color of the identification pattern 3b can be easily determined.

If the identification patterns 3b contact each other due to the remaining first metal thin film and short-circuit, the wiring 3
The insulating film 7 is also formed on the identification pattern 3b connected to the disconnected wiring 3 via the short-circuited portion, even if there is a broken portion in the area. To prevent this, the identification pattern 3b
Should be wide enough to prevent short circuiting.

Further, a symbol 14 for identifying each substrate 1 is provided in the area of each substrate 1 on the mother glass 1a. Symbol 14 is, for example, an alphanumeric character, and is formed from the first metal thin film forming wiring 3 and identification pattern 3b. For this reason, it is very easy to see as compared with the conventional symbol made of a transparent conductor such as ITO. In addition, mother glass 1
By providing the symbol 14 in “a”, it is possible to manage the presence or absence of the disconnection of the wiring 3 for each substrate 1 in association with the symbol 14.

Next, a procedure for manufacturing a liquid crystal display element manufactured using the mother glass 1a will be described. FIG. 3 is a plan view for explaining a manufacturing procedure of the liquid crystal display element 21. In FIG. 3A, a first metal thin film is formed on a mother glass 1a and patterned into a predetermined shape to form wirings 3 and 3.
13a, connection portion 13, lower electrode 3 of thin-film diode 4
a, terminals 6, identification patterns 3b, and symbols 14 are formed. At this time, a plurality of substrate patterns are simultaneously formed on the mother glass 1a.

Here, the procedure for patterning the first metal thin film will be described. First, a positive photoresist is applied on a first metal thin film formed on the mother glass 1a, and dried to form a resist film. Thereafter, the resist film is exposed to a predetermined pattern. Thin film diode 4
Is composed of a fine thin film pattern on the order of several μm. Therefore, when exposing the resist film of each thin film,
An exposure apparatus having excellent resolution, for example, a stepper exposure apparatus is used. The stepper exposure apparatus is characterized in that a large substrate such as a mother glass 1a is dividedly exposed, and, for example, a reticle (photomask) on which a pattern for one substrate is formed is moved on the mother glass 1a and exposed. The same substrate pattern can be exposed a plurality of times.

FIG. 4 is a perspective view for explaining the procedure for exposing the first metal thin film. In FIG. 4, the mask portion of the reticle 17 is shown in black, and the mask portion of the photomask 18 is shown in oblique lines. In FIG. 4A, the mother glass 1a on which the resist film 16 is applied is exposed using a reticle 17 of a stepper exposure apparatus on which a predetermined pattern is formed. On the reticle 17, a wiring pattern, a terminal 6, a lower electrode 3a, a mask pattern for one substrate serving as an identification pattern 3b and a light shielding portion 14a are formed, and a frame-shaped light shielding portion 26 is formed on the periphery. I have. The light shielding portion 14a
It has a square shape and is formed at a position corresponding to a corner of each substrate region. The stepper exposure apparatus performs exposure while moving the relative position between the mother glass 1a and the reticle 17 along the arrow, and repeatedly exposes and transfers the same pattern in a matrix.

In the present embodiment, the pattern for one substrate is arranged on one reticle 17, but the pattern for one substrate is divided into a plurality of regions, and each divided region is exposed. May be performed.

Thereafter, in (2) of FIG. 4, a second exposure is performed by using a very simple light source and a photomask 18 which does not require precision, and a predetermined pattern is collectively exposed. On the photomask 18, a mask pattern for the connection portion 13 and the wiring 13 a is formed for one mother glass, and a mask for shielding the pattern portion formed by the reticle 17 from light is formed. Further, the photomask 18 has a mask at a position corresponding to the peripheral edge of each substrate 1 removed so that the peripheral edge of each substrate 1 can be exposed.

If the thin film constituting the substrate 1 is laminated on the periphery of the substrate 1 without being removed, stress may be applied and the substrate 1 may be broken. If the mask at the position corresponding to the peripheral portion of the substrate 1 is removed as described above, the resist film on the peripheral portion of the substrate can be exposed, and unnecessary thin films on the peripheral portion of the substrate can be removed in a later etching process. And the substrate can be prevented from cracking. In particular, the first metal thin film has a larger stress applied to the substrate than the other thin films constituting the substrate 1, and the peripheral exposure to the peripheral portion of the substrate has been conventionally performed. The surrounding exposure is described in Japanese Patent No. 2928402.
No.

Further, the reticle 1 is
The mask at the position corresponding to the light-shielding portion 14a of No. 7 is removed, and the symbol pattern 14b is formed. For this reason, by the two exposures using the reticle 17 and the photomask 18, it is possible to expose and transfer a different symbol 14 to each substrate 1 even in the case of the first metal thin film to be subjected to the division exposure.

Thereafter, the exposed resist film 16 is developed, the first metal thin film is etched, and the resist film 16 is etched.
Is removed to complete the patterning. in this way,
The formation of the symbol 14 by the first metal thin film can be performed only by changing the pattern of the reticle 17 and the photomask 18 by using the conventional peripheral exposure, and there is no increase in process and cost. . Further, the patterning of the first metal thin film is an early stage of the manufacturing process. In the present embodiment, the symbol 14 can be printed at this stage.
4 can be managed. That is, the yield can be improved by checking the defect of the wiring 3 from each identification pattern 3b and checking the symbol 14 of the defective board. Although the exposure method using a positive resist has been described here, a negative resist may of course be used. When a negative resist is used, there is no need to change the pattern of the reticle, and the symbol pattern may be provided by partially removing the photomask. In addition, although the case where the exposure using the photomask 18 is performed after the exposure using the reticle 17 has been described, the invention is not limited to this. For example, after exposure using a photomask 18, the reticle 17 is exposed.
It is also possible to perform exposure using. Therefore, the first exposure using the reticle 17 and the second exposure using the photomask 18 may be combined, and the order of exposure may be determined at the discretion of the practitioner in consideration of productivity, management, and the like. Can be.

In FIG. 3B, a metal oxide serving as the insulating film 7 of the thin film diode 4 is formed on the surface of the first metal thin film by using an anodic oxidation method.

In the anodic oxidation method, the mother glass 1a
Is immersed in the same electrolytic solution together with a counter electrode plate such as a Pt plate, and the connection portion 13 formed of the first metal thin film is placed on the anode side.
The processing is performed by connecting the counter electrode plate to the cathode side.

At the end of the anodic oxidation, an insulating film 7 is also formed on the terminal 6, but since the insulating film 7 on the terminal 6 hinders the electrical connection between the drive circuit member and the terminal 6, it is etched. Then, the first metal thin film is exposed.

Further, as shown in FIG. 3A, the symbol 14 is connected to the connection portion 13 so as not to be in contact with any of the wires 3, 13a, the connection portion 13, the lower electrode 3a, the terminal 6, and the identification pattern 3b. It is preferable to form them in an electrically separated state. By doing so, even if anodization is performed, the symbol 14 remains metallic luster, so that even if there is a wiring colored by the insulating film 7 around the symbol 14, the symbol 14 is conspicuous and has an effect of being easy to find. Symbol 1
4 is electrically connected, and when this surface is anodized, the metal oxide on the symbol 14 may be removed by etching or the like.

In FIG. 3 (3), a second metal thin film to be the upper electrode 8 is formed and patterned into a predetermined shape.

In FIG. 3D, a transparent conductor to be the pixel electrode 5 is formed into a thin film and patterned into a predetermined shape. At this time, a transparent conductor may be patterned on the terminal 6 from the viewpoint of reliability.

In FIG. 3 (5), a mother glass 2 in which a counter electrode and a terminal are formed by patterning using a transparent conductor is shown.
a is separately formed, and an alignment film (not shown) is formed on each surface of the mother glasses 1a and 2a by performing a rubbing treatment. Then, a sealing material (not shown) is interposed therebetween so that the electrodes face each other. And stick them together. At this time, the substrates 1a and 2a
A granular spacer (not shown) having a fixed size is interposed so as to have a predetermined interval between the spacers.

In FIG. 3 (6), the cell is cut along the dividing line 15 shown by the dotted line in FIG. 3 (5) to manufacture an empty cell in which no liquid crystal is sealed. Thereafter, a liquid crystal is sealed in the empty cell from an injection port (not shown) provided in a part of the sealing material, an optical film 11 is attached to the outer surfaces of the substrates 1 and 2, and a driving circuit member (not shown) Is attached to complete the liquid crystal display element 21.

In the present embodiment, the symbol 14 is formed of the first metal thin film. However, if the surrounding exposure is added, the symbol can be formed even with another thin film on which the stepper exposure is performed. . However, if the surrounding exposure is performed on the first metal thin film as in the present embodiment, the numbering can be realized only by changing the reticle 17 and the photomask 18, which is very preferable. .

FIG. 5 is a plan view for explaining a method of manufacturing a liquid crystal display device according to another embodiment of the present invention.
FIG. 2 schematically shows a region where a broken portion of the wiring 3 of the substrate 1 exists.
5 (1) to 5 (4) show the pixel electrode 5 similarly to FIG.
FIG. 5 shows a state immediately after the formation, and description of portions of the substrate 1 shown in FIG. 5 that are configured similarly to the substrate 1 shown in FIG. 2 will be omitted.

In the identification pattern 3b, the wiring 3 is inspected according to the color of the surface thereof. Therefore, there is no limitation on the shape and position for applying the inspection element, unlike the inspection pad used in the conventional electric inspection. . Therefore, in addition to the contents of the embodiment described with reference to FIGS. FIGS. 5A to 5D show four kinds of identification patterns 3b each devised.

In the substrate 1 shown in FIG. 5A, the numbering of each wiring 3 is written on the identification pattern 3b. By doing so, the presence / absence of the wiring 3 in which the disconnection has occurred and the position of the wiring 3 in the substrate region can be checked, which can be used to improve the yield.

In the substrate 1 shown in FIG. 5B, since the identification patterns 3b are formed so as to be staggered, even when the wirings 3 are densely arranged as in a color liquid crystal display device,
The width of the identification pattern 3b can be formed larger than the width of the wiring 3. In particular, as shown in FIG. 5 (2), when the number of wirings 3 is small and large, the effect of this is great.

In the substrate 1 shown in FIG. 5C, the identification pattern 3b is provided outside the dividing line 15 of the substrate 1.
Since the identification pattern 3b is provided for facilitating the inspection of the disconnection, it is an unnecessary pattern in the end. For this reason, when it is desired to remove the identification pattern 3b because the appearance of the liquid crystal display element is impaired by the identification pattern 3b, this may be done.

In the substrate 1 shown in FIG. 5D, the identification patterns 3b are formed in a narrow area with a narrow interval. When the identification patterns 3b are collected in a narrow area, the range to be inspected is narrowed, and the time required for the inspection can be reduced.

FIG. 6 is a plan view for explaining a method of manufacturing a liquid crystal display element according to still another embodiment of the present invention, and schematically shows a region where the wiring 3 of the substrate 1 is disconnected. . In the substrate 1 shown in FIG. 6, the description of the same components as those of the substrate 1 shown in FIG. 2 will be omitted.

In the substrate of the liquid crystal display element, the wiring may be composed of a plurality of conductive thin films in order to reduce the electric resistance. In the substrate 1 shown in FIG.
An insulating film 7 is formed on the wiring 3 made of the conductive thin film of the above, and an auxiliary wiring 8a made of a second conductive thin film such as a Ti film is laminated. The wiring 3 and the auxiliary wiring 8a
It is electrically connected by a through hole 19 provided at an arbitrary position in the insulating film 7. Thereby, the wiring resistance can be reduced.

In the substrate of the liquid crystal display device according to the prior art,
In the case of such a wiring structure, even if the wiring 3 is thick and the inspection can be performed by looking at the wiring 3 itself, the auxiliary wiring 8a showing the metallic luster becomes a hindrance, and the color of the wiring 3 indicates the disconnection. It is difficult to determine the presence or absence. Therefore, in this case, the inspection based on the color of the wiring 3 can be performed as follows.
Substantially, there is only a point in time immediately after the anodic oxidation before the formation of the auxiliary wiring 8a.

On the other hand, in the substrate 1 shown in FIG. 6, an identification pattern 3b is provided at the end of each wiring 3 and is not covered with the auxiliary wiring 8a. By doing so, in this embodiment, at any time after anodization,
By looking at the identification pattern 3b, the presence or absence of a disconnection can be inspected. Therefore, even if there is an overlooked disconnection in the inspection immediately after the anodic oxidation, the inspection can be performed again, and the oversight of the disconnection can be further prevented.

As described above, in the present embodiment, the case where the auxiliary wiring 8a made of the second conductive thin film of Ti or the like is formed on the wiring 3 has been described. The present invention can be applied to any thin film that obstructs color observation.

For example, even a transparent electrode such as ITO used for a pixel electrode causes interference of light, which hinders the observation of the color of the wiring 3. Further, an inorganic insulating film such as SiNx, an organic insulating film such as a resin, and a semiconductor layer such as Si also hinder color observation. Therefore, when these thin films are formed, care should be taken so as not to cover the identification pattern 3b.

When the mother glass 1a is completed,
After the selection of non-defective cells and defective cells based on the presence or absence of defects such as scratches and dirt, the identification pattern 3b becomes unnecessary. Therefore, in the subsequent steps, the identification pattern 3b
There is no problem in forming another thin film (for example, an alignment film made of polyimide) thereon, and whether to form another thin film on the identification pattern 3b after the inspection can be determined at the discretion of the practitioner. That is, after completion of the inspection using the identification pattern 3b, there is no restriction on providing or blocking another thin film thereon.

FIG. 7 is a plan view for explaining a method of manufacturing a liquid crystal display element according to still another embodiment of the present invention, in which the position of the wiring 13a of the mother glass 1a shown in FIG. 1 is changed. Shows glass 1a. In the mother glass 1 a shown in FIG. 1, the electrical connection between the connection portion 13 with the anode, the wiring 3, the identification pattern 3 b, and the terminal 6 is as follows.
3-wiring 13a-terminal 6-wiring 3-identification pattern 3b. However, the connection order of the substrate 1 is not limited to this, and as shown in FIG.
3a-wiring 3-identification pattern 3b-terminal 6 in this order. That is, the connection may be at least in the order of the connection portion 13-the wiring 3-the identification pattern 3 b, and the terminal 6 may be formed at any end of the wiring 3.

In this embodiment, the identification pattern 3
b is provided using a part of the terminal 6. Terminal 6 is
Conventionally, the terminal 6 is provided with a relatively large size for connection with a drive circuit member, so that a part or an extended part of the terminal 6 can be used as the identification pattern 3b.

FIG. 8 is a plan view for explaining a method of manufacturing a liquid crystal display element which is a modification of the embodiment of the present invention, and shows a portion corresponding to one liquid crystal cell on mother glass 1a. Things.

In this modification, a so-called COG
In order to take a mounting form called (Chip on Glass), a terminal 6 for connecting to a drive IC chip directly mounted on a substrate and an external terminal 6a for sending a signal from the outside to the drive IC chip are provided. Are formed in a separated state. That is, the driving IC chip is mounted on the driving IC chip mounting area 6b between the terminal 6 and the external terminal 6a.

In a substrate having such a positional relationship between terminals, power cannot be supplied for anodic oxidation from the terminal 6 side. Therefore, a method of supplying power from the opposite side of the terminal 6 is adopted. Therefore, the whole image of the mother glass 1a has a form very similar to FIG.

In this modification, the wiring 8a is laminated so as to cover almost the wiring 3. The connection between the wiring 3 and the wiring 8a can be realized via a through hole as shown in FIG. 6, and the wiring resistance can be reduced. For the purpose of omitting the step of removing the metal oxide on the terminal 6 instead of reducing the wiring resistance, as disclosed in JP-A-6-324355,
It is also possible to use the wiring 8a as an electrode constituting a terminal structure utilizing capacitive coupling without providing a through hole.

In the above-described embodiment of FIG. 7, the identification pattern 3
b was formed using a part of the terminal 6. This is an example in a mounting mode of a so-called TCP (Tape Carrier Package) system. In this case, since the terminal 6 is relatively large and easily visible, a part of the terminal 6 is used as the identification pattern 3b. .

Generally, in COG, several mm × 10
Since a large number of wirings are connected to a driving IC chip having a size of about several mm, the terminals 6 are inevitably small, so that it is difficult to use the terminals 6 as identification patterns. In addition, when the wiring 8a is formed also on the terminal 6 as shown in FIG. 8, it is more inconvenient because the color cannot be observed.

Therefore, in this modification, as shown in FIG. 8, the connection pattern connecting the wiring 3 and the terminal 6 is provided with the identification pattern 3b. It is desirable that the identification pattern 3b be formed to have at least a dimension that is at least visible, but this region is a so-called routing portion, and there are many empty regions without other patterns.
Is sufficiently possible.

That is, the terminal 6 and the identification pattern 3b can be designed independently, and the identification pattern 3b can be provided relatively freely without being restricted by the restrictions on the terminal 6.

Here, since the wiring 8a is a wiring between the terminal 6 and the wiring 3, the wiring 8a runs longitudinally on the identification pattern 3b, but care must be taken so that the color of the identification pattern 3b can be seen. Therefore, the wiring 8a may be formed on the identification pattern 3b in, for example, a window frame shape (“□”). In this case, the function as a wiring and the identification pattern 3
It is most preferable that the color b can be made visible.

The shape of the wiring 8a on the identification pattern 3b is not limited to the "□" shape as long as the color of the identification pattern 3b can be observed without impairing the function as the wiring. For example, a cutout shape such as a shape having an opening such as a "field", a shape of a "", a shape of an "I", or a shape of a """may be sufficient. The wiring 8a can have any shape as long as it has an exposed portion of the identification pattern 3b and a function as a wiring can be secured.

By doing so, when a break exists in the wiring 3 (the second break from the right in FIG. 8), not only immediately after the anodic oxidation step but also in the subsequent predetermined steps. By observing the mother glass 1a, the presence or absence of disconnection can be easily confirmed based on the color of the identification pattern 3b. That is, if any of the identification patterns 3b that normally anodize and exhibit a color (shown in black in FIG. 8) exhibits metallic luster (shown by hatching in FIG. 8),
It can be determined that there is a break in the liquid crystal cell, and non-defective / defective products are managed using the symbol 14 provided in advance, so that the liquid crystal display element can be manufactured efficiently.

FIG. 9 is a plan view for explaining a method of manufacturing a liquid crystal display element according to still another embodiment of the present invention, and schematically shows the vicinity of the end of the wiring 3 of the substrate 1. FIG.
In the substrate 1 shown in FIG. 1, the description of the same components as those in the substrate 1 shown in FIG.

In the substrate 1 shown in FIG. 9A, the identification pattern 3b is simply formed at the end of the N pieces of the wirings 3 juxtaposed. As described above, the disconnection of the wiring 3 can be inspected by looking at the identification pattern 3b. However, this inspection method uses a large number of normal identification patterns, that is, identification patterns in which an insulating film is formed and presents a color. When there are a small number of abnormal identification patterns, that is, identification patterns exhibiting metallic luster, the fact that the latter is conspicuous is used. However, the first and N
Even if the first wiring 3 is disconnected, the other identification patterns 3b to be compared in color are only one of the left and right, so that even if the first or Nth identification pattern has a metallic luster due to the disconnection of the wiring 3. , Easy to be overlooked in inspection.

Therefore, in the substrate 1 shown in FIG.
Dummy patterns 3c to be anodized are arranged at positions adjacent to the wirings 3 at both ends of the juxtaposed identification patterns 3b, that is, at the 0th and (N + 1) th positions. By doing so, for example, even if there is an identification pattern 3b exhibiting metallic luster on the N-th line, the identification pattern 3b exhibiting metallic luster is arranged in a group of blue-colored patterns in which the insulating film 7 is formed. It becomes noticeable.

Since the dummy pattern 3c itself must be anodized, a plurality of dummy patterns 3c (two in FIG. 9) are used.
It is preferable to perform anodic oxidation via the wiring 3.

Furthermore, if a dummy pattern 3c having a different shape or size from the regular identification pattern 3b is formed,
As a result of disconnection of the wiring 3, even if the dummy pattern 3c has a metallic luster, it can be easily recognized as the dummy pattern 3c, and it is not necessary to mistakenly judge the substrate as a defective substrate.

The case where the present invention is applied to a liquid crystal display device using a thin film diode having an MIM structure has been described above. However, the present invention is not limited to this. If it replaces with the wiring 3, it can be easily applied.

Of course, the present invention can be applied not only to a simple straight wiring, but also to a bent wiring applied to a so-called delta arrangement image display. Furthermore, the present invention is not limited to a substrate whose wiring is processed by an anodizing method, and can be widely applied to a substrate whose wiring is processed by another electrochemical surface treatment such as an electrodeposition method. The electrodeposition method is used, for example, for forming a color filter of a liquid crystal display device.

Further, the inspection for judging the presence or absence of disconnection is performed not only by the naked eye but also by using a loupe or the like, measuring the optical characteristics such as the reflectance of the identification pattern, or based on the result of image processing. Is also good. In addition, an inspection of the film thickness of the wiring may be performed based on not only the disconnection but also the color.

[0111]

According to the present invention, a wiring and an identification pattern connected to the wiring are formed from a conductive thin film on a substrate, and the surface of the conductive thin film is subjected to an electrochemical surface treatment to form a second conductive thin film. Since a thin film is formed and thereafter the wiring is inspected based on the color of the identification pattern, it is possible to easily determine the presence or absence of a disconnection from the identification pattern.

Further, according to the present invention, since the width of the identification pattern is set larger than the width of the wiring and is set to a size that can be visually recognized, the presence or absence of a disconnection can be easily determined from the identification pattern even if the wiring is thin. be able to.

According to the present invention, the conductor thin film is a metal thin film, and is subjected to anodizing treatment as an electrochemical surface treatment to form a metal oxide on the surface of the metal thin film. Since the wiring is inspected based on the wiring, the method is most suitable for a method of inspecting a thin film transistor substrate or a thin film diode substrate having such wiring.

According to the present invention, the substrate is obtained by dividing a large substrate constituting a plurality of substrates, and a sign for identifying each substrate is provided on the large substrate. Inspection can be performed in correspondence with the symbol of each board, and wiring defects can be easily managed for each board. In addition, a thin film is formed on the large substrate, a positive resist is formed thereon, and a predetermined pattern constituting the substrate and a photomask partially provided with a light shielding portion are used to form a thin film at a plurality of locations on the large substrate. 1 is exposed, and then a second exposure is performed using a photomask provided with a symbol pattern at a position corresponding to the light-shielding portion together with a pattern for exposing the peripheral portion of each substrate, and the thin film is patterned on the substrate. Since a symbol is provided, a different symbol can be provided for each substrate even for a thin film requiring stepper exposure.

Further, according to the present invention, since the symbol is formed by the conductive thin film constituting the wiring and the identification pattern, the symbol can be provided from an early stage of the manufacturing process, and the defective substrate is made to correspond to the symbol. Can be managed.

Further, according to the present invention, since the symbol is composed of a metal thin film, and the surface of the metal thin film is not covered with the metal oxide, the symbol portion has a metallic luster and is conspicuous, and it is easy to find the symbol.

Further, according to the present invention, since the identification pattern is provided with a symbol for identifying each wiring in the substrate, it is possible to know the presence or absence of the broken wiring and the position of the wiring in the substrate. , Can be used to improve the yield.

Further, according to the present invention, when the third thin film is formed on the wiring, the identification pattern is not covered by the third thin film. Even if it cannot be confirmed, the inspection can be easily performed based on the color of the identification pattern even after the formation of the third thin film, so that there is no mistake or oversight in the inspection.

Further, according to the present invention, since a dummy pattern is provided next to the identification pattern so that the surface of the identification pattern can be compared, the inspection of the identification pattern can be prevented from being omitted. Further, since the size or shape of the dummy pattern is different from that of the identification pattern, the dummy pattern can be easily recognized as a dummy pattern, and erroneous determination can be prevented.

Further, according to the present invention, when the third thin film is a wiring extending longitudinally on the identification pattern, the third thin film has an opening or a notch on the identification pattern, and the third thin film has Since the second thin film is exposed, it is possible to easily perform a disconnection inspection using the identification pattern while forming the third thin film as a wiring.

[Brief description of the drawings]

FIG. 1 is a plan view for explaining a method for manufacturing a liquid crystal display element according to an embodiment of the present invention.

FIG. 2 is an enlarged plan view showing a part of a mother glass 1a.

FIG. 3 is a plan view for explaining a manufacturing procedure of the liquid crystal display element 21.

FIG. 4 is a perspective view for explaining a procedure of exposing a first metal thin film.

FIG. 5 is a plan view for explaining a method for manufacturing a liquid crystal display element according to another embodiment of the present invention.

FIG. 6 is a plan view for explaining a method for manufacturing a liquid crystal display element according to still another embodiment of the present invention.

FIG. 7 is a plan view for explaining a method for manufacturing a liquid crystal display element which is still another embodiment of the present invention.

FIG. 8 is a plan view for explaining a method for manufacturing a liquid crystal display element which is a modification of the embodiment of the present invention.

FIG. 9 is a plan view for explaining a method for manufacturing a liquid crystal display element according to still another embodiment of the present invention.

FIG. 10 is a plan view showing a liquid crystal display device 20 according to the related art.

FIG. 11 is a plan view showing a mother glass 1a of a substrate 1 of a conventional liquid crystal display element 20.

FIG. 12 is a plan view showing a mother glass 2a of a substrate 2 of a conventional liquid crystal display element 20.

FIG. 13 is a plan view for explaining a manufacturing procedure of the conventional liquid crystal display element 20.

FIG. 14 is a plan view showing a place where a break in a wiring 3 of the conventional substrate 1 occurs.

[Explanation of symbols]

 1, 2 Substrate 1a, 2a Mother glass 3, 13a Wiring 3a Lower electrode 3b Identification pattern 3c Dummy pattern 4 Thin film diode element 5 Pixel electrode 6, 10 terminal 6a External terminal 6b Driving IC chip mounting area 7 Insulating film 8 Upper electrode 8a Auxiliary Wiring 9 Counter electrode 11 Optical film 12 Sealing material 13 Connection part 14 Symbol 14a Light shielding part 14b Symbol pattern 15 Dividing line 16 Resist film 17 Reticle 18 Photomask 19 Through hole 20, 21 Liquid crystal display element

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G09F 9/30 330 G09F 9/30 330Z F term (Reference) 2H088 FA11 HA02 HA08 MA20 2H092 GA60 JA03 JA24 MA15 MA24 NA12 NA15 NA29 NA30 5C094 AA42 AA43 AA46 AA48 BA03 BA43 CA19 DA13 DA15 DB01 DB02 DB04 EA03 EA04 EA05 EA10 EB02 FA01 FB12 FB15 GB10 5G435 AA17 BB12 CC09 KK05

Claims (10)

[Claims] 1. A conductive thin film is formed on a substrate by patterning.
In a method of manufacturing a liquid crystal display element, wherein a second thin film is formed on the surface of the conductive thin film by electrochemical surface treatment, a wiring and an identification pattern connected to the wiring are formed on the substrate from the conductive thin film Forming a second thin film by performing an electrochemical surface treatment on the surface of the conductive thin film, and then inspecting the wiring based on the color of the identification pattern. . 2. The method for manufacturing a liquid crystal display element according to claim 1, wherein the width of the identification pattern is larger than the width of the wiring and is set to a size that can be visually recognized. 3. The method according to claim 1, wherein the conductive thin film is a metal thin film, anodizing is performed as an electrochemical surface treatment, a metal oxide is formed on the surface of the metal thin film, and the metal oxide on the identification pattern is formed after the anodizing treatment. 3. The wiring defect inspection according to claim 1 or 2, wherein the wiring pattern is inspected by utilizing the difference between the color presented and the color of the identification pattern presenting metallic luster without being anodized due to disconnection of the wiring. A method for manufacturing a liquid crystal display element. 4. The substrate is obtained by dividing a large substrate constituting a plurality of substrates, forming a thin film on the large substrate, depositing a photoresist on the thin film, and forming a thin film on each substrate. A first exposure is performed at a plurality of locations on a large substrate using a photomask in which a light-shielding portion is partially provided along with a pattern, and a symbol pattern is provided at a position corresponding to the light-shielding portion along with a pattern for exposing a peripheral portion of each substrate. 4. A symbol for identifying each substrate on a large-sized substrate by patterning the thin film by combining the second exposure performed using a photomask to be used. Method for manufacturing a liquid crystal display element. 5. The method for manufacturing a liquid crystal display device according to claim 4, wherein said symbol is formed by a conductive thin film constituting a wiring and an identification pattern. 6. The method according to claim 4, wherein the symbol is formed of a metal thin film, and the surface of the metal thin film is not covered with a metal oxide. 7. The method for manufacturing a liquid crystal display device according to claim 1, wherein a symbol for identifying each wiring in the substrate is provided in the identification pattern. 8. The liquid crystal display device according to claim 1, wherein when forming a third thin film on the wiring, the identification pattern is not covered by the third thin film. Manufacturing method. 9. The liquid crystal display element according to claim 1, wherein a dummy pattern having a different dimension or shape from the identification pattern and having the same film configuration is provided next to the identification pattern. Method. 10. When the third thin film is a wiring extending longitudinally on the identification pattern, the third thin film has an opening or a notch on the identification pattern, and the third thin film has an opening or a cutout on the surface of the identification pattern. 9. The method according to claim 8, wherein the second thin film is exposed.