JP2002011695A - Punching method, and punching device used for the method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a punching method and a punching device used therefor in which cards such as plug-in IC cards having island-like parts within a frame are efficiently manufactured, the structure of a punching die used in the manufacture is simplified, and the product shape can be easily made to cope with change. SOLUTION: The same sheet 6 is fed twice to a predetermined punching position. In the first feed, a first punching die 12 is located at the predetermined punching position to form an IC carrier part 3. In the second feed, a second punching die 13 is located at the predetermined punching position to punch the frame 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a punching method used for punching a plug-in IC card or the like having an island portion in a frame portion from a sheet material, and a punching apparatus used in this method.

[0002]

FIGS. 7 and 8 show a plug-in IC card 1. FIG. This plug-in IC card 1 has an IC carrier section 3 as an island-shaped section provided in a frame section 2.
A C module (not shown) is mounted. In the plug-in IC card 1, the frame 2 with the IC carrier 3 is distributed and used for carrying. When used, the IC carrier 3 is removed from the frame 2 and
The carrier section 3 is inserted into an IC card mounting section of the electronic device. In order to remove the IC carrier 3 from the frame 2, there is a cut groove 4 around the IC carrier 3 attached to the frame 2 to divide the IC carrier 3 from the frame 2.
The notch 4 does not extend all around, but
There are thin bridges 5 at several places of the cut groove 4 for integrally connecting the IC carrier 3 and the IC carrier 3. The bridge portion 5 is thinner than the other portions of the frame portion 2 and the IC carrier portion 3. When the IC carrier 3 is used, the bridge 5 is pushed out to remove the IC carrier 3 from the frame 2.

The integrated frame 2 and IC carrier 3
Is made of PVC (polyvinyl chloride), PET (polyethylene terephthalate), laminated PET, or the like, and the frame portion 2 has a larger sheet material 6 as shown in FIG.
And manufactured by punching using a mold. This sheet material 6 includes a product part 1a to be a plug-in IC card 1.
Are arranged in a plurality of rows and columns. Then, the sheet material 6 is intermittently conveyed in a certain direction, and the frame portions 2 are punched line by line during the intermittent conveyance. On the other hand, the IC carrier portion 3 is formed by cutting a cutting groove 4 around the IC carrier portion 3 separately from the punching of the frame portion 2.
However, if the IC carrier portion 3 is formed by cutting separately from the punching of the frame portion 2 as described above, there is a problem that manufacturing efficiency is poor.

Therefore, it is conceivable that both the formation of the cut groove 4 and the punching of the frame 2 are performed using the same mold.
FIG. 10 is a plan view showing an example of the lower die 101 of the die for that purpose. The die 101 has a kerf forming hole 102 for punching the kerf 4 and a frame portion forming hole 103 for forming the frame portion 2. In the drawings, only a pair of kerf forming holes 102 and frame forming holes 103 are shown for simplification. Further, pilot holes 104 and 105 are formed at four corners around the kerf forming hole 102 and the frame part forming hole 103, respectively. These pilot holes 104, 105
In the figure, a positioning pilot pin provided on the upper die side, that is, the punch side (not shown) is inserted through the sheet material 6. Reference numeral 7 denotes a through hole formed in the sheet material 6 through the passage of the pilot pin. Then, the sheet material 6 is intermittently conveyed on the die 101 in the direction in which the kerf forming holes 102 and the frame portion forming holes 103 are arranged (the direction indicated by the arrow A). The notch 4 is punched out by fitting into the frame 102, and the frame 2 is punched out by fitting the frame forming punch into the frame forming hole 103. The punching of the kerf 4 and the frame 2 is performed simultaneously, but the kerf 4 and the frame 2 forming the same plug-in IC card 1 are punched first, and then the sheet material 6 is After being sent one pitch,
The frame 2 is punched. However, performing both the cutting groove 4 and the punching of the frame portion 2 with one mold as described above has a problem that the structure of the mold becomes complicated first. The complicated structure of the mold not only increases the cost, but also is disadvantageous in terms of improving the accuracy of punching. The frame 2 has the same shape, and the IC carrier 3
In the case of punching a card having different island-shaped portions, there is a problem that the entire mold must be replaced.

An object of the present invention is to solve such a problem and to provide a plug-in IC having an island portion in a frame portion.
It is an object of the present invention to efficiently produce cards such as cards and to simplify the structure of a punching die, that is, a die used in the production, and to easily cope with a change in product shape.

[0006]

According to a first aspect of the present invention, there is provided a punching method for punching a frame having an island-shaped portion inside from a sheet material. In the first feeding, the first punching die is located at the punching position, and the first punching die forms an island-like portion. In the second feeding, the punching position is Then, a second punching die different from the first punching die is positioned, and the frame portion is punched by the second punching die.

As described above, the efficiency of manufacturing is improved by forming the island-shaped portion and punching out the frame portion by a punching die in a series of steps. Further, since the punching die for forming the island portion and the punching die for punching the frame are separated, the structure of each punching die is simplified. Further, for example, when punching cards having the same shape of the frame portion and different island-shaped portions, it can be dealt with only by replacing the first punching die, and the second punching die can be shared.

According to a second aspect of the present invention, there is provided a punching apparatus used in the punching method according to the first aspect, wherein a sheet conveying mechanism for feeding the same sheet material twice to a predetermined punching position, and an island-shaped portion. A first punching die to be formed, a second punching die for punching a frame portion separately from the first punching die, and a first punching die and a second punching die for the punching position. And a mold exchanging mechanism for exchanging.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the punching method of the present invention and a punching apparatus used in the method will be described below with reference to FIGS. The target of the punching in this embodiment is the plug-in IC card 1 described above and shown in FIGS. 7 and 8, which is punched from a sheet material 6 as shown in FIG. FIG. 1 shows an outline of the entire punching apparatus. In the figure, 11
Is a press mechanism, and the press mechanism 11 is composed of two sets of dies, namely, a punching die, that is, a first punching die 12 and a first die.
And a second punching die 13 separate from the punching die 12 of FIG. The first punching die 12 punches out the kerf 4 from the sheet material 6 to form the IC carrier portion 3. The second punching die 13 punches out the frame 2 from the sheet material 6 after the IC carrier 3 is formed.
The punching of the kerf 4 and the punching of the frame 2 are performed at the same punching position B. for that reason,
The first punching die 12 and the second punching die 13 are exchanged with respect to a predetermined punching position B by a die exchange mechanism 14. The mold changing mechanism 14 may have various configurations. For example, the mold changing mechanism 14 may reciprocate the entire press mechanism 11 in horizontal directions C1 and C2 by a driving mechanism 15 such as a hydraulic driving mechanism. In this case, a mechanism is provided for adjusting the vertical position of the punches 16 and 17 (shown in FIGS. 3 and 5 and the like). , 19 may not be touched.

The sheet material 6 is intermittently transported in the horizontal directions A1 and A2 by a sheet transport mechanism 20 provided before and after the press mechanism 11 with respect to the punching position B. . The sheet transport mechanism 20 feeds the same sheet material 6 twice to the punching position B. Its configuration and operation will be described later in detail. Then, when the sheet material 6 is intermittently fed in the front direction, that is, in the A1 direction, punching of the kerf 4 and the frame portion 2 is sequentially performed. On the other hand, the punching of the product parts 1a in one row is performed simultaneously.

Next, the configuration of the punching dies 12, 13 will be described in more detail with reference to FIGS. Each of the punching dies 12 includes lower dies 21 and 22 and upper dies 23 and 24 that move up and down to open and close the lower dies 21 and 22. The dies 18, 19 are fixed to the lower dies 21, 22 on the lower holders 25, 26, and the upper dies 23, 24 are moved vertically by a ram (not shown).
A plurality of punches 16 and 17 are fixed side by side below 27 and 28. The punch 16 of the first punching die 12 is a kerf forming punch 16, and the punch 17 of the second punching die 13 is a frame forming punch 17. On the other hand, the dies 18 and 19 are provided with a plurality of kerf forming holes 29 and framing portion forming holes 30 into which the kerf forming punches 16 and the frame forming punches 17 are respectively removably fitted from above.
Are formed side by side. The kerf forming hole 29 of the first punching die 12 has the shape of the kerf 4 of the plug-in IC card 1. 4 is punched out. On the other hand, the frame forming hole 30 of the second punching die 13 has the outer shape of the frame 2 of the plug-in IC card 1,
The frame 2 is punched from the sheet material 6 by fitting the frame forming punch 17.

The upper dies 23, 24 of both punching dies 12, 13 are located around the punches 16, 17 and have stripper plates 31,
32 is supported movably up and down. These stripper plates 31, 32 are urged downward by springs 33, 34,
Die the sheet material 6 around the punches 16 and 17 at the time of punching.
It is the one that holds down on 8,19.

The second punching die 13 is of a pushback type. That is, the shedder 35 is incorporated in each frame portion forming hole 30 of the die 19 so as to be vertically movable within a predetermined range. These shedders 35 are for returning the plug-in IC card 1 punched from the sheet material 6 to the sheet material 6 once, and are urged upward by a spring 36. Are located on the same horizontal plane as the upper surface of the.

Further, the die 1 of the both punching dies 12, 13 is used.
Pilot holes 37 and 38 are formed on the upper surfaces of the grooves 8 and 19 at the four corners surrounding all the kerf forming holes 29 or the frame forming holes 30 respectively. On the other hand, the upper holder 2
When the punches 16 and 17 descend, the pilot holes 3 and 7
Pilot pins 39, 4 inserted into 7, 38 respectively
0 is respectively fixed downwardly hanging. The pilot holes 37 and 38 and the pilot pins 39 and 40 are used for positioning the sheet material 6,
13 pilot holes 37, 38 and pilot pins 39, 40
Are located at the same position with respect to the plug-in IC card 1, that is, with reference to the kerf forming hole 29 or the frame forming hole 30 and the punches 16 and 17.

Reference numerals 41 and 42 are guide rods which stand on the dies 18 and 19 and guide the upper dies 23 and 24 in the vertical direction.

Next, the configuration of the sheet transport mechanism 20 will be described. Drive rollers 51 and 52 driven by motors (not shown) are respectively provided on the front and rear sides of a punching position B where the first punching die 12 and the second punching die 13 are selectively located. It is rotatably supported by 53 and 54. These drive rollers 51 and 52 have the left-right direction as the rotation axis direction, but their upper edges are located on the same horizontal plane as the dies 18 and 19. In addition, driven rollers 59, 60 are rotatably supported on the support tables 53, 54 by lift tables 57, 58 driven up and down by air cylinders 55, 56, respectively. These driven rollers 59 and 60 are located above the driving rollers 51 and 52, respectively, and
And the sheet material 6 is sandwiched between them. That is,
In a state where the sheet material 6 is sandwiched between the driving rollers 51 and 52 and the corresponding driven rollers 51 and 52, the driving rollers 51 and 52 are
The rotation of 52 causes the sheet material 6 to be conveyed to the punching dies 12 and 13 in the A1 direction or the A2 direction. Then, after the sheet material 6 is conveyed in the A1 direction, the sheet material 6 is returned in the A2 direction once, and then the sheet material 6 is conveyed again in the A1 direction. It is to be sent around.

The configuration for feeding the same sheet material 6 twice to the punching position B is not limited to this, and the sheet material 6 is gripped separately from the sheet transport mechanism 20 as described above. A transport mechanism including a chuck device and a traveling device that travels the chuck device is provided. With the transport mechanism, the sheet material 6 carried out from the first punching die 12 in the A1 direction is returned by bypassing the press mechanism 11, and The second punching die 13 which has been replaced with the first punching die 12 may be fed again.

Next, a punching method using the punching device will be described. In the punching, first, the IC carrier portion 3 is formed by punching the kerf 4 (first punching process), and then the frame portion 2 is punched (second punching process). In the first punching step, the first punching die 12 is positioned at the punching position B as shown in FIGS. Then, the sheet material 6 before punching is fed between the driving roller 51 and the driven roller 59 in the preceding stage by a sheet carrying mechanism (not shown). Then, the driven roller 59 descends and the drive roller 51
When the driven roller 59 sandwiches the sheet material 6 and the drive roller 51 rotates in the forward direction, the sheet material 6 is intermittently conveyed on the die 18 in the A1 direction. The conveying pitch is equal to the pitch of the product portion 1a in the sheet material 6 in the front-rear direction. In addition, the sheet material 6 is a driving roller in a subsequent stage.
When it reaches the upper position 52, the subsequent driven roller 60 descends to sandwich the sheet material 6 between itself and the driving roller 52, and the preceding driven roller 59 rises and separates from the sheet material 6; The sheet material 6 is intermittently conveyed in the A1 direction by the roller 52 and the following driven roller 60.

As described above, while the sheet material 6 is being conveyed on the die 18 (first feeding), the kerfs 4 are punched line by line, and the IC carrier portion 3 is formed.
During this punching, the upper die 23 descends in the first punching die 12, the stripper plate 31 presses the sheet material 6 onto the die 18 around the kerf forming punch 16, and the kerf forming punch 16 It penetrates through the sheet material 6 and fits into the kerf forming hole 29 of the die 18. Thereby, the kerf 4 is punched out of the sheet material 6 to form the IC carrier portion 3. At the same time, the pilot pin 39 of the upper die 23 penetrates the sheet material 6 and is inserted into the pilot hole 37 of the die 18.
This prevents the sheet material 6 from being displaced at the time of punching, and the sheet material 6 has through holes 7 at four corners surrounding the product portion 1a in a horizontal row.
These through holes 7 are located at predetermined positions based on the IC carrier portion 3 formed by the die 18 and the kerf forming punch 16.

When the first punching of one sheet material 6 is completed, the driving roller 52 in the subsequent stage is rotated in the reverse direction, and the sheet material 6 is sandwiched between the driving roller 51 and the driven roller 59 in the preceding stage. By rotating the driving roller 51 in the reverse direction, the sheet material 6 is returned to the A2 direction.
Further, the first punching die 12 and the second
The second punching die 13 is located at the punching position B by replacing the punching die 13 of FIG.
Is performed. In this second punching step,
In exactly the same manner as in the first punching step, the sheet material 6 is intermittently conveyed in the direction A1 on the die 19 by the sheet conveying mechanism 20, and the frame portions 2 are punched out one by one during the second feeding. Go. At the time of this punching, the upper die 24 descends in the second punching die 13 and its stripper plate
32 presses the sheet material 6 onto the die 19 around the frame forming punch 17 and, as shown in FIG.
17 penetrates the sheet material 6 and fits into the frame forming hole 30 of the die 19. Thereby, the frame portion 2 is punched from the sheet material 6.

At this time, the frame forming punch 17 is
Prior to penetrating through the through hole, the pilot pin 40 of the upper die 24 passes through the through hole 7 of the sheet material 6 and the pilot hole 38 of the die 18.
Is inserted into. By inserting the pilot pin 40 into the through hole 7 formed in the first punching step as described above, it is possible to prevent the sheet material 6 from being pressed down during punching and to be displaced. The sheet material 6 is positioned with respect to the second punching die 13 with reference to FIG. Therefore, the frame portion 2 is punched at an accurate position based on the previously formed IC carrier portion 3. Since subsequent embedding of the IC module in the IC carrier unit 3 is performed with reference to the frame unit 2,
The positional accuracy of the IC carrier 3 with respect to the outer shape of the frame 2 is important.

When the frame forming punch 17 is fitted into the frame forming hole 30 of the die 19, the shedder 35 is once pushed down by the frame forming punch 17, but thereafter, the frame forming punch 17 is disengaged from the die 19. When the user pulls out, the shedder 35 is pushed up by the force of the spring 36, and as shown by a chain line in FIG. Therefore, in the subsequent transport of the sheet material 6, the plug-in I
The C card 1 is transported together with the sheet material 6. And
After the sheet material 6 is carried out from the press mechanism 11, the plug-in IC card 1 is separated from the sheet material 6 by a separation mechanism (not shown).

As described above, according to the structure of the above embodiment, the formation of the IC carrier portion 3 as an island portion and the punching of the frame portion 2 are performed by the punching dies 12 and 13 in a series of steps, so that the manufacturing efficiency is improved. improves. Further, since the punching die 12 for forming the IC carrier portion 3 and the punching die 13 for punching the frame portion 2 are separated, the structure of each punching die 12, 13 is simplified. Furthermore, for example, the shape of the frame portion 2 is the same, and the IC carrier portion 3 is different from the plug-in I.
When performing the punching of the C card 1, the first punching die 12
And the second punching die 11 can be shared. Therefore, it is possible to easily cope with a change in the product shape.

It should be noted that the present invention is not limited to the above embodiment, and various modifications can be made. For example,
In the above embodiment, the plug-in IC card is described as an example. However, the present invention is not limited to the plug-in IC card.
The present invention can be generally applied to cards having an island portion in a frame portion.

[0025]

According to the first aspect of the present invention, in a punching method for punching a frame portion having an island-shaped portion inside from a sheet material, the same sheet material is removed from a predetermined punching position.
In the first feeding, the first punch is located at the punching position to form an island portion, and in the second feeding, another second punching die is located at the punching position. Since the frame portion is punched, cards having an island-shaped portion in the frame portion can be efficiently manufactured, and the structure of the punching die used in this manufacturing can be simplified.
It can easily respond to changes in product shape.

According to the punching device of the second aspect of the present invention,
A sheet conveying mechanism for feeding the same sheet material twice to a predetermined punching position, a first punching die for forming an island portion, a second punching die for punching a frame portion, and a second punching die for punching a frame portion. The provision of the die exchanging mechanism for exchanging the first die and the second die makes it possible to carry out the punching method according to the first aspect of the present invention.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing one embodiment of a punching device of the present invention.

FIG. 2 is a plan view of a first punching die of the same.

FIG. 3 is a side view of the first punching die.

FIG. 4 is a plan view of a second punching die of the above.

FIG. 5 is a side view of the second punching die of the above.

FIG. 6 is a sectional view of a second punching die of the above.

FIG. 7 is a plan view of a plug-in IC card manufactured by punching.

FIG. 8 is a sectional view taken along line VIII-VIII of FIG. 7;

FIG. 9 is a plan view of a sheet material from which a plug-in IC card is punched.

FIG. 10 is a plan view showing an example of a plug-in IC card punching device.

[Explanation of symbols]

 2 Frame part 3 IC carrier part (island part) 6 Sheet material 12 First punching die 13 Second punching die 14 Die exchange mechanism 20 Sheet transport mechanism B Punching position

Claims (2)

[Claims] 1. A punching method for punching a frame portion having an island-shaped portion inside from a sheet material, wherein the same sheet material is fed twice to a predetermined punching position, and in the first feeding, the first punching position is at the punching position. The first punching die is located and an island is formed by the first punching die.
In the second feeding, a punching method is characterized in that a second punching die different from the first punching die is located at the punching position and a frame portion is punched by the second punching die. 2. A punching apparatus used in the punching method according to claim 1, wherein a sheet transport mechanism for feeding the same sheet material twice to a predetermined punching position and a first island-shaped portion are formed. A punching die, a second punching die for punching a frame part separately from the first punching die, and a die exchange for exchanging the first punching die and the second punching die for the punching position. A punching device comprising a mechanism.