JP2002006921A - Parts ditribution system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To store various kinds of electronic parts efficiently, and to distribute them properly, regardless of variable factors in production. SOLUTION: From information of an identification gag G of a semiconductor device instructed to be stored, stored data ND is extracted from an assembly server 3, then a name of the semiconductor device is read to be checked with the name in the stored data ND. Based on a control file for storing parts, which is stored in a section 5c for storing warehousing/delivery data, a palette capable of storing is selected from a section for storing parts, to store sequentially from a corner, regardless of the name. When the selected palette has an unoccupied plate, there is housed in the place for a start. When delivering delivery data SD is extracted from information of a ceramic substrate instructed to be delivered, then the delivery data SD and the control file for storing parts are referred, then the instructed semiconductor device is taken out from the palette. After checking the read name with the name in the control file, there is distributed on a delivery palette, based on the delivery data SD.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technology for mounting electronic components used in an electronic computer and the like, and more particularly to a technology effective for storing electronic components and distributing electronic components to be mounted on a corresponding ceramic substrate. It is about.

[0002]

2. Description of the Related Art In a high-density mounting module used for an electronic device such as an electronic computer, electronic components such as a semiconductor device to be mounted are diversified. In the process of assembling these mounting modules, in consideration of such characteristics, electronic components matched to each ceramic substrate are arranged in advance on a pallet or the like corresponding to each ceramic substrate on which electronic components are to be mounted. Supplying assembly techniques have been proposed.

In this case, in a serving system for serving electronic components, electronic components are placed on a pallet corresponding to a ceramic substrate to be mounted, and each pallet is temporarily stored until mounting.

A BGA (Ball G) provided with a bare chip or a solder bump as an external connection terminal is provided.
When storing a semiconductor device such as a lid array, a low-oxygen, low-humidity atmosphere that can ensure the conditions of storage specifications is provided in order to prevent insulation deterioration and surface oxidation of solder balls due to moisture absorption of the insulating film layer. The electronic components are stored in a warehouse, mounted on a ceramic substrate, and taken out of a permanent warehouse in accordance with the reflow schedule, and are placed in a device that can be served.

[0005] Examples of this type of support system are described in detail on November 20, 1993, published by Ohm Co., Ltd., Information Processing Society of Japan (ed.)
There are “Information Processing Handbook” P1290 to P1291, and this document describes an outline of the comprehensive production system CIM and the like.

[0006]

However, it has been found by the present inventors that the following problems have been encountered in the above-mentioned technology for supplying and distributing electronic components.

[0007] That is, if electronic components, ceramic substrates, and the like are not supplied for a predetermined delivery date for some reason, electronic components required for mounting cannot be secured due to a shortage of some components, and pallets for serving on the way increase. There is a problem of doing it.

[0008] In addition, electronic parts with a high yield may be unnecessarily received in advance in some cases, and there is a problem that an excess pallet is required to store the unnecessarily received electronic parts.

Furthermore, today, there are many types of electronic parts, and electronic devices such as a plurality of types of large-scale computers are assembled on the same line. If the storage is not large, it may not be possible to store it.

In addition, since the temporary storage provided in the serving system for temporarily storing electronic components does not have a function of maintaining a low oxygen and low humidity atmosphere, the production schedule fluctuates due to long holidays and production adjustment. In some cases, semiconductor devices are manually transferred to a low-oxygen, low-humidity permanent storage that can be stored for a long period of time, and there is a possibility that a mistake in this transfer may cause confusion in the assembly process.

[0011] It is an object of the present invention to provide a parts distributing system which can efficiently store electronic components of various types and the like and can appropriately distribute them regardless of production fluctuation factors.

[0012]

According to the present invention, there is provided a parts serving system including a pallet for storing electronic parts, storage data of electronic parts to be stored, and delivery of electronic parts instructed to be discharged. A data storage unit for storing data and a parts warehouse management file for managing the storage status of pallets; a print reading unit for reading a product name printed on the electronic component when the electronic component is loaded / unloaded; and a data storage unit From the storage unit, the storage data of the electronic components to be stored is extracted, and the product name of the electronic components read by the print reading unit is compared with the product name of the storage data, and can be stored from the parts warehouse management file stored in the data storage unit. The pallet is selected and the warehousing processing unit that sequentially stores the pallets from the corners of the pallet, and the warehousing data of the electronic components for which the warehousing instruction has been issued are extracted from the data storage unit. The electronic component that has been instructed to be ejected is taken out of the pallet based on the outgoing data and the parts warehouse management file, the product name of the outgoing data is compared with the product name of the electronic component read by the print reading unit, and based on the outgoing data, And an outgoing processing section for distributing food to the outgoing pallet.

In the component serving system according to the present invention, when the selected pallet has an unstored portion that has already been unloaded from the selected pallet, the storage portion preferentially stores electronic components from the unstored portion. Is what you do.

Further, the parts serving system of the present invention is provided with a dehumidifying and drying unit for dehumidifying the atmosphere in the parts warehouse to a certain humidity or less.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is an explanatory diagram of a component serving system according to one embodiment of the present invention, and FIG. 2 is an explanatory diagram of a product name reading serving device provided in the component serving system according to one embodiment of the present invention. FIGS. 3A and 3B are explanatory diagrams showing the configuration of a parts warehouse management file used when the parts serving system according to one embodiment of the present invention moves in and out of a semiconductor device.

In the present embodiment, a component serving system 1 stores an electronic component used for an electronic device such as an electronic computer, and a ceramic substrate such as a ceramic substrate on which the electronic component is mounted, and specifies a designated electronic component. To serve.

As shown in FIG. 1, the component serving system 1 includes a host computer 2, an assembly server (data storage unit) 3, a bump inspection device 4, an item name reading / serving device 5,
And a mounting device 6.

The host computer 1 is connected to the assembling server 3 via a network NT such as a dedicated line. The host computer 1 and the assembling server 3 exchange a database for arranging parts and assembling arrangement with other sections. I do.

The assembly server 3 is connected to a product name reading and serving device 5 via a network NT, and transfers and exchanges a database of another section based on a request from the product name reading and serving device 5.

The product name reading and serving device 5 reads the product name of the semiconductor device that has arrived, stores it in the product name reading and serving device 5, and delivers the product in accordance with the assembly schedule.

Also, by connecting the product name reading and serving device 5 to the assembly server 3 via the network NT, the incoming data, outgoing data, progress data of the ceramic substrate, individual schedule data, etc. of the semiconductor device are collected in real time, and Functions to feed back to the process.

Here, the electronic components managed by the product name reading and serving device 5 include a semiconductor device H1 provided with solder bumps as external connection terminals such as BGA, a bare chip semiconductor device H2, and a CSP (Chip S).
The semiconductor devices (electronic components) H1 to H3 are used in three different large-sized computers. Each computer is assumed to be composed of ten or more ceramic substrates such as ceramic substrates and about several hundreds of semiconductor devices per one computer.

The product name reading / serving device 5 is provided with a storage processing unit 5a, a storage processing unit 5b, and a storage and retrieval data storage unit 5c. The storage processing part 5a controls the storage processing in the semiconductor devices H1 to H3, and the discharge processing part 5b controls the storage processing in the semiconductor devices H1 to H3. A parts warehouse management file BF is stored in the entry / exit data storage unit 5c.
Data ND and warehouse data SD extracted from
Etc. are temporarily stored.

When the semiconductor devices H1 to H3 are stored, the assembling server stores the type of the semiconductor devices to be stored, the number of arrangements, the number of storages, the storage date, the storage instruction date, and the storage data ND such as the actual tag bar code. 3

The incoming data ND is used to extract data of an arbitrary semiconductor device by reading bar code information provided on the tag G or the like using a handy bar code scanner or the like.

When the semiconductor devices H1 to H3 are delivered from the product name reading and serving device 5, a delivery process is performed based on the delivery data SD extracted from the assembly server 3. Arbitrary semiconductor devices are arranged and delivered to the delivery pallet SP.

The delivery data SD includes the product name of the semiconductor device to be delivered, the delivery instruction date, the delivery date, the scheduled delivery number (arranged number-the delivery number), the product name of the ceramic substrate on which the semiconductor device is mounted,
And X coordinate and Y coordinate position data for mounting on a ceramic substrate.

In this case, the bar code information written on the control card CC provided on the ceramic substrate on which the semiconductor device is mounted is read using a handy bar code scanner or the like, and the delivery data SD of the semiconductor device is assembled. Extract from 3.

The bump inspection apparatus 4 includes semiconductor devices H1 to H
It is inspected whether the solder bump No. 3 is formed normally. The mounting device 6 mounts the semiconductor device provided and supplied by the product name reading and serving device 5 on a ceramic substrate.

Further, the configuration of the product name reading and serving apparatus 5 will be described.

An operation section 7 is provided at the forefront of the item name reading and serving apparatus 5, as shown in FIG. Operation unit 7
Has a keyboard, a mouse, a handy barcode scanner, a liquid crystal monitor, a touch panel, and the like.

A transport conveyor section 8 is provided on the left side of the rear of the operation section 7. The transport conveyor unit 8 is connected to the equipment in the previous process, and a worker sets a receiving tray for transporting the semiconductor device 1.

A magazine 9 is provided on the right side of the conveyor 8. The magazine unit 9 includes the semiconductor device H
1, a magazine for storing a pallet NP loaded with H3 is provided, and the magazine has a vertical movement mechanism.

A storage pallet 10 is provided behind the magazine 9. The storage pallet unit 10 takes in and out the storage pallet NP from the magazine and positions the storage pallet NP discharged from the magazine.

On the right side of the magazine 9, a side mark inspection unit (print reading unit) 11 is provided. A lower surface mark inspection unit (print reading unit) 12 is provided behind the side surface mark inspection unit 11, and a position detection unit 13 is provided behind the lower surface mark inspection unit 12.

The side surface mark inspection unit 11 detects the printing on the side surface of the semiconductor device or the like by using the recognition camera and the illumination. The lower surface mark inspection unit 12 detects the printing in the direction opposite to the bump surface such as a bare chip by the recognition camera and the half mirror unit.

The position detecting section 13 is provided with a recognition camera, a half mirror unit, and a tray mounting table for discharging defective chips. The position is measured and corrected by a transmission sensor unit for measuring chip height.

The cube supply unit 14 is located on the right side of the side mark inspection unit 11. The cube supply section 14 is provided with a pallet mounting table for discharging defective chips, and the semiconductor device H2 such as a bare chip contained in the cube is provided.
Are supplied in a stack.

A retrieval pallet unit 15 is provided on the right side of the cube supply unit 14. The retrieval pallet unit 15 reads a barcode of the retrieval pallet SP, and transports, positions, and discharges it to a fixed position. A transfer robot unit 16 is provided behind the unloading pallet unit 15 from the right side to the left side.

The transfer robot unit 16 is provided with a transfer hand and an empty cube tray transfer arm, and transfers the semiconductor devices H1 to H3 to be loaded and unloaded to a predetermined position.
Behind the transfer robot unit 16, the tray drawer unit 1
7 and 18 are provided, and component storage units 19 and 20 are provided behind the tray drawers 17 and 18, respectively.

The tray drawers 17 and 18 pull out one pallet from the parts warehouses 19 and 20, respectively.
Position. The parts storage units 19 and 20 have an elevation function for taking in and out, and the semiconductor devices H1 to H3
Is stored in each pallet. The dryer unit (dehumidifying and drying unit) 21 has a drying function, and dries the atmosphere in the parts storage units 19 and 20 until the humidity becomes equal to or lower than a preset humidity.

The drier section 21 makes it unnecessary to transfer the semiconductor device to a storage for preventing moisture absorption of the semiconductor device when the semiconductor device has to be stored for a long period of time due to fluctuations in the production schedule or the like. .

Next, the operation of the whole component serving system 1 in the present embodiment will be described.

Here, a case where the semiconductor device H1 is received will be described.

First, when the semiconductor device H1 is received, the semiconductor device H1 is put into an assembling process in accordance with an instruction from the host computer 1, and the name, quantity, and the like are checked.

Thereafter, a solder ball is supplied to the semiconductor device H 1 to form a bump, and the bump is inspected by the bump inspecting device 4. After that, the semiconductor device H1
In a state where the articles are arranged on the receiving pallet NP, the articles are loaded into the article name reading and serving apparatus 5.

The bar code information of the tag G of the semiconductor device H1 to be stored is read by the handy bar code scanner of the operation unit 7 or the like, and the storage processing unit 5a is
And retrieves the incoming data from the database and stores it in the incoming / outgoing data storage unit 5c.

The name of the semiconductor device H1 is read, a pallet that can be stored in the warehouse of the reading device 5 is selected, and the semiconductor devices H1 are stored in order from the corner of the pallet regardless of the product name, and stored. The storage data such as the product name of H1, the storage date, the storage position, and the number of product names are updated and written to the assembly server 3.

When the bar code of the control card CC provided on the ceramic substrate is read by the handy bar code scanner of the operation unit 7, the retrieval processing unit 5a
Distributes the semiconductor device H1 corresponding to the ceramic substrate product name to the delivery pallet SP, and supplies the components to the mounting device 6. Thereby, the serving of the ceramic substrate and the semiconductor device H1 can be synchronized.

The operation of the item name reading and serving apparatus 5 will be described.

The bar code information written on the tag G of the semiconductor device instructed to enter the warehouse is read by a handy bar code scanner or the like of the operation unit 7, and based on the information, the entrance data ND is extracted from the assembly server 3, and the entrance / exit is performed. The data is stored in the data storage unit 5c.

The semiconductor devices H1,
The receiving pallet NP in which H3 is set is stored, and the receiving pallet NP in which the semiconductor devices H1 and H3 are set is
It is stored in the magazine of the magazine section 9. These storage pallets NP are transported to the storage pallet unit 10, and a cube on which the semiconductor device H <b> 2 is set is input from the cube supply unit 14.

Then, the semiconductor devices H1 to H3 conveyed to a predetermined position on the storage pallet unit 10 are conveyed to the position detecting unit 13 by the transfer robot unit 16, and the positions are detected. Thereafter, the semiconductor devices H1 to H3 are moved to the side mark inspection unit 11 or the bottom surface mark inspection unit 12 depending on the printing position.
, And the product name is read.

At this time, the storage processing unit 5a compares the read product name with the product name of the storage data ND, and if they match, the parts warehouse management file BF stored in the assembly server 3
And selects a pallet that can be stored from the parts warehouse units 19 and 20 based on the parts warehouse management file BF,
Store in order from the corner regardless of the product name.

If the selected pallet has an unaccommodated portion that has already been delivered, it is preferentially stored from the unaccommodated portion, and the semiconductor devices are stored in the parts warehouses 18 and 19 until the host computer 2 issues a delivery instruction. Keep in.

[0057] the parts warehouse section 19, for example, provided with the pallet P1 ₁ to P1 ₄₀ 40 stages, even parts warehouse section 20, the pallet P2 ₁ to P2 ₄₀ of 40 stages are provided.

Pallets P1 _{1 to} P1 ₄₀ , P2 _{1 to} P2 ₄₀
Is provided with four sub-pallets SB1 to SB4, respectively, and these sub-pallets SB1 to SB4 are provided with 9 × 6 component pallets B1 to B54.

Here, the parts warehouse management file BF will be described.

The parts warehouse management file BF is shown in FIG.
As shown in (a) and (b), the entire file ZF and the
And a sub-palette file SPF. Storage
When searching for a position, the
P1₁~ P1₄₀, P2₁~ P2 ₄₀, And subpa
Lets SB1 to SB4 are sequentially searched.

For example, if there is a position where the pallet P1 ₂ and the sub pallet SB2 can be stored, the part number pallets B1 to B1 shown in the sub pallet file SPF of FIG.
B54 is searched in order to detect a storable position.

When the component pallet to be stored is retrieved, the storage coordinates X, storage coordinates Y, lot number, component name, and storage date and time of the semiconductor device to be stored at the position of the corresponding component pallet in the subpalette file SPF are entered. Write and update the incoming data ND stored in the incoming / outgoing data storage unit 5c. As a result, it is possible to store the selected pallets from the unstored portions in order from the corners of the pallets regardless of the product name.

When the storage of all the parts in the storage pallet unit 10 or the cube supply unit 14 is completed, the empty storage pallet NP is discharged, the storage data ND is output to the assembly server 3, and the storage data ND is updated. I do.

Further, when the bar code of the control card CC provided on the ceramic substrate instructed to be discharged is read by the handy barcode scanner of the operation unit 7, the retrieval processing unit 5a retrieves the retrieval corresponding to the product name of the ceramic substrate. The data SD is extracted and stored in the entry / exit data storage unit 5c.

The delivery pallet SP set in the delivery pallet unit 15 is transported to a predetermined part delivery position based on the delivery data SD, and refers to the delivery data SD and the parts warehouse management file BF to specify the specified product name. Are taken out of the pallets of the parts warehouses 19 and 20.

Then, an arbitrary semiconductor device is transported by the transport robot unit 16 to the position detecting unit 13 and the print position of the semiconductor device is detected. The semiconductor device may have a side mark inspection unit 11 or a bottom surface mark inspection unit 1 depending on a printing position.
2, and the product name is read.

The read product name is checked against the product name in the parts warehouse management file BF.
Are arranged on the outgoing pallet of the outgoing pallet section 15 in accordance with the above.

At the same time, the entry data ND of the released semiconductor device stored in the entry / exit data storage section 5c is deleted. When the serving of the semiconductor device is completed, the delivery pallet SP is discharged from the delivery pallet unit 15, and at the same time, the delivery data SD and the parts warehouse management file BF are output to the host, and the serving is completed.

Thus, in the present embodiment, the semiconductor devices to be stored and retrieved are managed by the parts warehouse management file BF, so that a plurality of semiconductor devices can be stored in a small space irrespective of the names of the received semiconductor devices. It is possible to efficiently store and accurately supply a designated semiconductor device. In addition, even if the production schedule fluctuates, the electronic components can be supplied in real time.

Further, by providing the dryer section 21, semiconductor devices can be stored in the parts storage sections 19, 20 for a long period of time, so that transfer to a storage box becomes unnecessary, and mistakes due to transfer work are prevented, and Work man-hours and costs can be reduced.

The present invention is not limited to the above-described embodiment, and it goes without saying that various changes can be made without departing from the scope of the invention.

[0072]

(1) According to the present invention, a wide variety of electronic components can be efficiently stored in a small space, a specified semiconductor device can be accurately served, and fluctuations in production schedules and the like can be prevented. Even if it occurs, electronic components can be supplied in real time.

(2) Further, according to the present invention, the provision of the dehumidifying / drying section enables the electronic parts to be stored in the parts storage section for a long period of time. Work man-hours and costs can be reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a component serving system according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a product name reading and serving device provided in the component serving system according to the embodiment of the present invention;

FIG. 3A is an explanatory diagram of an entire file in a parts warehouse management file used when the parts serving system according to one embodiment of the present invention moves in and out of a semiconductor device;
(B) is an explanatory view showing a configuration of a sub-palette file in the parts warehouse management file.

[Explanation of symbols]

1 ... parts serving system, 2 ... host computer, 3 ...
Assembly server (data storage unit), 4 ... Bump inspection device, 5
... An item name reading and serving device, 5a... A warehouse processing unit, 5b... A warehouse processing unit, 5c.
... Operation unit, 8 ... Conveyor unit, 9 ... Magazine unit, 10
... incoming pallet section, 11 ... side mark inspection section (print reading section) 11, 12 ... bottom mark inspection section (print reading section) 12, 13 ... position detection section, 14 ... cube supply section,
15: Outgoing pallet section 15, 16 ... Transfer robot section 1
6, 17, 18: tray drawer section, 19, 20: parts warehouse section, 21: dryer section (dehumidifying / drying section) 21, semiconductor devices (electronic parts) H1 to H3, ND: warehousing data, SD
... outgoing data, BF ... parts warehouse management file.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Naofumi Kai 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the IP Systems Division of Hitachi, Ltd. Hitachi Information Technology (72) Inventor Toshihiro Mine 1 Horiyamashita, Hadano-shi, Kanagawa F-term (reference) 3F022 AA08 BB06 EE01 EE02 JJ19 KK20 LL31 MM01 MM08 MM19 MM22 MM26 MM35 MM35 PP01 PP04 QQ17 5H215 AA06 BB01 BB18 BB20 CC07 CC09 CX01 CX05 GG09 HH03 JJ10 KK04

Claims (3)

[Claims] 1. A parts storage unit provided with a pallet for storing electronic parts, storage data of electronic parts to be stored, storage data of electronic parts instructed to be discharged, and parts for managing the storage status of the pallets. A data storage unit in which a warehouse management file is stored, a print reading unit that reads a product name printed on the electronic component when the electronic component is moved in and out, and a data reading unit that stores the electronic component. The storage data is extracted, the product name of the electronic component read by the print reading unit is compared with the product name of the storage data, and the pallet that can be stored is selected from the component warehouse management file stored in the data storage unit. A storage processing unit that sequentially stores the pallets from the corners of the pallet; and a retrieval data of the electronic component instructed to be retrieved from the data storage unit. The electronic component having the delivery instruction is taken out from the pallet based on the warehouse data and the parts warehouse management file, and the product name of the warehouse data is compared with the product name of the electronic component read by the print reading unit. A delivery processing unit for serving on a delivery pallet based on the delivery data. 2. The parts distribution system according to claim 1, wherein, when the selected pallet has an unstored portion that has already been delivered to the selected pallet, the storage processing section preferentially starts with the unstored portion. A component serving system for storing electronic components. 3. The component serving system according to claim 1, further comprising a dehumidifying / drying unit configured to dehumidify an atmosphere in the component warehouse to a certain humidity or less.