JP2001513452A5 - - Google Patents
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- Publication number
- JP2001513452A5 JP2001513452A5 JP2000507089A JP2000507089A JP2001513452A5 JP 2001513452 A5 JP2001513452 A5 JP 2001513452A5 JP 2000507089 A JP2000507089 A JP 2000507089A JP 2000507089 A JP2000507089 A JP 2000507089A JP 2001513452 A5 JP2001513452 A5 JP 2001513452A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5490797P | 1997-08-06 | 1997-08-06 | |
| US60/054,907 | 1997-08-06 | ||
| PCT/US1998/016266 WO1999007518A1 (en) | 1997-08-06 | 1998-08-05 | Continuously variable planarization and polishing pad system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001513452A JP2001513452A (ja) | 2001-09-04 |
| JP2001513452A5 true JP2001513452A5 (cs) | 2006-01-05 |
Family
ID=21994296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000507089A Pending JP2001513452A (ja) | 1997-08-06 | 1998-08-05 | 連続的に変化し得る平坦化及び研磨パッドシステム |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2001513452A (cs) |
| WO (1) | WO1999007518A1 (cs) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6093085A (en) * | 1998-09-08 | 2000-07-25 | Advanced Micro Devices, Inc. | Apparatuses and methods for polishing semiconductor wafers |
| US6390890B1 (en) | 1999-02-06 | 2002-05-21 | Charles J Molnar | Finishing semiconductor wafers with a fixed abrasive finishing element |
| US6641463B1 (en) | 1999-02-06 | 2003-11-04 | Beaver Creek Concepts Inc | Finishing components and elements |
| US6746311B1 (en) * | 2000-01-24 | 2004-06-08 | 3M Innovative Properties Company | Polishing pad with release layer |
| DE60110226T2 (de) * | 2000-06-30 | 2006-03-09 | Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington | Unterlage für polierscheibe |
| WO2002005337A1 (fr) * | 2000-07-10 | 2002-01-17 | Shin-Etsu Handotai Co., Ltd. | Tranche a chanfreinage en miroir, tissu a polir pour chanfreinage en miroir, machine a polir pour chanfreinage en miroir et procede associe |
| US20220048156A1 (en) * | 2020-08-14 | 2022-02-17 | Steven Anneker | Polishing pad assembly |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4220491A (en) * | 1978-10-19 | 1980-09-02 | Ppg Industries, Inc. | Method for forming an accurately assembled laminate utilizing a vacuum holding press |
| US5081421A (en) * | 1990-05-01 | 1992-01-14 | At&T Bell Laboratories | In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection |
| JPH04201181A (ja) * | 1990-11-30 | 1992-07-22 | Ichikawa Woolen Textile Co Ltd | 研磨用フェルト |
| US5196353A (en) * | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
| US5310455A (en) * | 1992-07-10 | 1994-05-10 | Lsi Logic Corporation | Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers |
| US5551986A (en) * | 1995-02-15 | 1996-09-03 | Taxas Instruments Incorporated | Mechanical scrubbing for particle removal |
| US5665656A (en) * | 1995-05-17 | 1997-09-09 | National Semiconductor Corporation | Method and apparatus for polishing a semiconductor substrate wafer |
| JPH0963995A (ja) * | 1995-08-28 | 1997-03-07 | Hitachi Ltd | 研磨装置およびそれを用いた研磨方法 |
| JPH09115862A (ja) * | 1995-10-20 | 1997-05-02 | Hitachi Ltd | 研磨工具と、それを用いた研磨方法および研磨装置 |
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1998
- 1998-08-05 JP JP2000507089A patent/JP2001513452A/ja active Pending
- 1998-08-05 WO PCT/US1998/016266 patent/WO1999007518A1/en active Application Filing