JP2001351756A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket enabling easy installation of a chip capacitor in a base housing. SOLUTION: This IC socket has the base housing 11 of an insulating material and a large number of contacts 13, held along the outer periphery of the base housing 11 and being electrically connectable to a lead wire and a substrate of an IC. A cover 12 of a conductive material is fitted in the outer periphery of this base housing, and flexible elastic pieces 26 facing forward the contacts 13 are arranged in a part opposed to the contacts 13 of the cover 12, and are formed as a structure, capable of holding the chip capacitor 14 between the contacts 13 and the elastic pieces 26 in an inserting state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC such as a ROM.
More particularly, the present invention relates to an IC socket in which a chip capacitor can be directly attached to each contact connected to each lead pin of an IC so as to be groundable.

[0002]

2. Description of the Related Art In an IC socket for mounting an IC such as a ROM on a substrate, a chip capacitor is connected to a contact connected to each lead pin of the IC as a measure against noise in the device, and the chip capacitor is connected to be groundable. Is done.

[0003] Although such a chip capacitor is provided on the substrate itself, a lead wire extending to the chip capacitor on the substrate becomes longer, and the frequency characteristics deteriorate due to the influence of the inductance of the lead wire.

Therefore, it is desired to directly attach a chip capacitor to each contact of an IC socket. As an IC socket integrated with such a chip capacitor,
One proposed in Japanese Utility Model Laid-Open No. 5-8945 is known. In this IC socket, individual external terminals communicating with the respective contacts are arranged in a row above the outer periphery of the base housing, and a band-like common external terminal connectable to a substrate is provided below the outer periphery of the base housing. A chip capacitor is fixed between an external terminal and the common external terminal by soldering.

[0005]

However, in the conventional example in which the chip capacitor is mounted on the outer periphery of the base housing, the work of soldering the chip capacitor for each contact is required, so that it is troublesome to mount the chip capacitor. Is a problem.

Accordingly, an object of the present invention is to provide an IC socket in which a chip capacitor can be easily attached to a base housing.

[0007]

According to a first aspect of the present invention, there is provided an IC socket mounted on a substrate, comprising: a base housing made of an insulating material; and an IC socket held along an outer periphery of the base housing; A plurality of contacts that can be electrically connected to the IC lead wires and the substrate, a cover made of a conductive material is fitted around the outer periphery of the base housing, and the cover has a portion facing the contacts. A flexible elastic piece facing the contact is provided so that the chip capacitor can be held between the contact and the elastic piece in an inserted state.

According to the first aspect, when a chip capacitor is inserted between the elastic piece and the contact, the chip capacitor is grounded via the cover of the chip capacitor and the conductive material. Since the chip capacitor can be attached simply by inserting it between the elastic piece and the contact, it is possible to freely insert the chip capacitor into a contact requiring the chip capacitor.

According to a second aspect of the present invention, in the IC socket according to the first aspect, the elastic piece includes a first elastic piece serving as a stopper and a second elastic piece pressed for electrical connection of the chip capacitor. They are arranged in order from the direction.

According to the present invention, when the inserted chip capacitor passes through the first elastic piece, the chip capacitor is prevented from coming off, and the second elastic piece allows the chip capacitor to be electrically connected to both the contact and the cover made of a conductive material. Connection state.

According to a third aspect of the present invention, there is provided the IC socket according to the first or second aspect, wherein the cover is provided with a ground terminal for the substrate.

According to the third aspect, since the ground terminal is provided on the cover on the outer periphery of the base housing, the cover is grounded at the same time when the base housing is mounted on the substrate, and each chip capacitor has almost no inductance. Grounded through a cover of conductive material.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the electrical connector of the present invention will be described below with reference to the drawings. FIG.
2 is a perspective view including a cross section of the assembled IC socket, and FIG. 3 is an enlarged view of a cross section of a contact portion. FIG.

In FIG. 1, an IC socket 1 includes a base housing 11, a cover 12, a contact 13,
And a chip capacitor 14 inserted as needed.

The base housing 11 is formed by molding an insulating material such as a resin, and is entirely a hollow rectangular parallelepiped. Insertion holes 21 for the contacts 13 are arranged on both sides in the longitudinal direction of the base housing 11. Further, holding spaces 22 communicating with the respective insertion holes 21 are opened on both side surfaces in the longitudinal direction of the base housing 11. The holding space 22 is a space for holding the inserted chip capacitor 14.

The cover 12 is formed by press-molding a metal of a conductive material such as stainless steel, and has a square frame fitted on the outer periphery of the base housing 11 as a whole. A flexible first elastic piece 25 and a flexible second elastic piece 25, generally called lances, which are cut inward, are formed on portions of the long sides of the square frame corresponding to the holding spaces 22.
An elastic piece 26 is provided integrally with the cover 12.
At the lower part of the square frame, a projection 27 which is used for both attachment to the substrate and grounding is also provided integrally. A bent portion 28 is formed on the upper portion of the square frame to be positioned against the base housing 11.

The contact 13 is formed by press-forming a conductive metal, and has an inwardly bent portion 31.
And a wide portion 32 and a lead portion 33. The chip capacitor 14 has a rectangular parallelepiped shape in which brazing portions 37 are integrally provided on both sides of a main body 36.

FIGS. 2 and 3 show a structure for holding the contacts 13 in the base housing 11 and a structure for fitting the cover 12 in the base housing 11.

The bent portion 31 of the contact 13 is
And a structure in which a lead wire of an IC (not shown) can be received between the inner wall of the insertion hole 21 and the bent portion 31. The wide portion 32 of the contact 13 is located below the insertion hole 21 and faces the holding space 22. The lead portion 33 of the contact 13 projects from the lower surface of the base housing 11.

First lance or first elastic piece 2 of cover 12
5 is located below the holding space 22 and the second
The lance or the second elastic piece 26 is located above the holding space 22. The degree of bending of the first elastic piece 25 toward the contact 13 is greater than the degree of bending of the second elastic piece 26 toward the contact 13. The direction of the first elastic piece 25 is
The direction in which the chip capacitor 14 can be inserted from below is the direction in which the second elastic piece 26 is opposite to the above direction. As clearly shown in FIG. 3, the chip capacitor 14 inserted from the direction of arrow A is prevented from coming off by the first elastic piece 25, and the wide portion 32 of the contact 13 is
Is pressed.

FIGS. 4 and 5 show the details of the insertion hole 21 and the holding space 22 of the base housing 11. In FIG. 4, when the insertion hole 21 is viewed from above, the insertion hole 21 has a substantially T-shape in which a wide slit portion 42 communicates with the central portion 41.
There is a chamfer around the entrance. The wide part 32 of the contact 13 in FIG. 1 passes through the slit part 42, and the tip of the bent part 31 of the contact 13 in FIG. 1 hits a step 43 provided on both sides of the central part 41.

In FIG. 5, when the insertion hole 21 is viewed from below, it has a shape in which a wide slit portion 42 communicates with the central portion 41 and further a holding space 22 communicates. The periphery of the insertion hole 21 and the holding space 22 is chamfered. The wide part 32 of the contact 13 in FIG. 1 passes through the slit part 42 and faces the holding space 22.

The procedure for assembling the IC socket 1 having the above structure will be described with reference to FIG. The contacts 13 are inserted from above the respective insertion holes 21 of the base housing 11 so that a large number of contacts 13 are held by the base housing 11. Next, when the cover 12 is fitted from above the base housing 11, the IC socket 1 is assembled.

The chip capacitor 14 is an IC socket 1
Can be inserted at the time of assembling, or can be inserted immediately before the IC socket 1 is attached to the substrate. As shown in FIG. 3, when the chip capacitor 14 is pushed in from below the holding space 22, the first flexible elastic piece 25 is deformed, and when the chip capacitor 14 advances to the position shown in FIG. The contact is prevented by the flexible first elastic piece 25 and the contact 1 is secured by the flexible second elastic piece 26.
It is pressed to the third side to be in a holding state in which the electrical conduction to the contact 13 is maintained.

An example of assembling the IC socket 1 on a substrate will be described with reference to FIG. The IC socket 1 is attached to the substrate 2 by inserting the lead portion 33 of the contact 13 into a hole (not shown) of the substrate 2. At this time, the projection 27 of the cover 12 is grounded to the substrate 2. Next, an IC such as a ROM is placed on the IC socket 1.
C3 is attached by inserting the lead wire 3a while pressing and bending the bent portion of the contact (not shown) in the insertion hole 21.

The lead wire 3a of the IC 3 such as a ROM is electrically connected to the lead portion 33 of the contact 13 and at the same time is grounded to the substrate 2 via a chip capacitor 14 (not shown). This makes it possible to implement noise countermeasures for devices that are easily affected by noise.

The effects of the IC socket 1 having the above-described embodiment will be described below. When the base housing 11, the cover 12, and the contact 13 are assembled,
The chip capacitor 14 can be selectively inserted at any time or at any place. Therefore, the base housing 1
1. When assembling the cover 12 and the contact 13, a chip capacitor 14 having a predetermined specification can be inserted. Also, the base housing 11, the cover 12
Then, after assembling the contacts 13, an appropriate chip capacitor 14 can be inserted into the appropriate contact 13. Also, each contact 13 corresponding to the IC
It is also possible to select and insert a chip capacitor 14 having a capacity suitable for the above. Furthermore, for the contact 13 that does not require the chip capacitor 14, the chip capacitor 14
It is also possible to choose not to insert.

Also, the first elastic piece 25 for retaining and the second elastic piece 26 for pressing formed on the cover 12
The electrical conduction between the contact 13 and the cover 12 is also ensured without the chip capacitor 14 falling out.

Further, since the entire cover 12 is formed of a conductive metal and is grounded to the substrate by the projections 27 of the cover 12, grounding can be performed with the inductance from each chip capacitor 14 to ground being negligible.

The present invention is not limited to the above embodiment, and various design changes can be made. (1) The cover 12 is not limited to a rectangular frame, and may be a three-sided frame body, or may be one in which two separate long sides are attached. When not forming a square frame, a concave-shaped and a convex-shaped engaging portion can be provided at the end so as to be inserted into the base housing 11.

(2) The elastic pieces of the cover 12 are not limited to the first elastic piece 25 for retaining and the second elastic piece 26 for pressing, but one elastic piece for both retaining and pressing. be able to. In this case, it is possible to adopt a shape in which a step is provided on one elastic piece, and when the step is over the step, the step is prevented from coming off and the step is pressed by the step after the step.

(3) The chip capacitor 14 has been described as a standard product having a brazed portion at both ends, but a chip capacitor 14 having no brazed portion can be used.

[0033]

As described above, according to the first aspect, the chip capacitor can be attached to the necessary contact simply by inserting the chip capacitor between the contact and the cover.
There is an effect that the chip capacitor can be easily and quickly mounted. In addition, since there is no special fixing means such as soldering, there is an effect that a chip capacitor can be selectively attached to an arbitrary contact during assembling or the like.

According to the second aspect, there is an effect that both the mechanical holding and the electrical conduction of the inserted chip capacitor are ensured.

According to the third aspect, the grounding of each chip capacitor can be performed at the same time as the operation of mounting the base housing on which the cover made of a conductive material is mounted to the substrate, so that the direct grounding of each chip capacitor to each contact is simple and easy. This has the effect that it can be done reliably.

[Brief description of the drawings]

FIG. 1 is a perspective view of each component before assembling an IC socket according to the present invention.

FIG. 2 is a perspective view including a cross section of the assembled IC socket.

FIG. 3 is an enlarged view of a cross section of a contact portion.

FIG. 4 is a top view of the base housing.

FIG. 5 is a bottom view of the base housing.

FIG. 6 is a perspective view of the IC socket in an assembled state.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC socket 2 Substrate 3 IC 3a Lead wire 11 Base housing 12 Cover 13 Contact 14 Chip capacitor 21 Insertion hole 22 Holding space 25 First elastic piece 26 Second elastic piece 27 Projection

Claims (3)

[Claims] 1. An IC socket mounted on a substrate, comprising: a base housing made of an insulating material; and a plurality of IC sockets held along an outer periphery of the base housing and electrically connectable to an IC lead wire and the substrate. A contact made of a book, a cover made of a conductive material is fitted around the outer periphery of the base housing, and a flexible elastic piece facing the contact is provided at a portion of the cover facing the contact,
An IC socket having a structure capable of holding a chip capacitor between the contact and the elastic piece in an inserted state. 2. The elastic piece is formed by arranging a first elastic piece serving as a stopper and a second elastic piece pressed for electrical connection in order from the insertion direction of the chip capacitor. 2. The IC socket according to 1. 3. The IC socket according to claim 1, wherein a ground terminal for the substrate is provided on the cover.