JP2001351202A - Method for manufacturing multichannel magnetic head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently eliminate adhesive stuck to the surface of a connection terminal. SOLUTION: The surface of a connection terminal 2b is polished by a grinding wheel having diamond particles. Thus, an adhesive stuck to the surface of the connection terminal 2b is eliminated while a multichannel magnetic head 1 is being fixed to a cutting jib. In addition, the elimination of the adhesive stuck to the surface of the connection terminal 2b facilitates wire bonding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-channel magnetic head having a plurality of magnetic head elements.

[0002]

2. Description of the Related Art A magnetic head is mounted on a magnetic recording / reproducing device such as a video tape recorder (VTR) and records and reproduces information signals on a magnetic recording medium.

As such a magnetic head, an inductive magnetic head of a magnetic induction type such as a so-called metal-in-gap type and a laminated type is used. Further, in order to cope with future multimedia applications, a magnetoresistive effect type magnetic head (hereinafter referred to as an MR head) capable of obtaining a sufficient reproduction output with a narrower track has been proposed. This MR head is used as a read-only head in a hard disk device or the like.

On the other hand, in order to cope with an increase in the capacity and transfer rate of recorded information in the magnetic recording / reproducing apparatus described above, a plurality of tracks are simultaneously recorded / reproduced by joining and integrating a plurality of magnetic heads. Multi-channel magnetic heads are used.

[0005] This multi-channel magnetic head is formed at both ends of a magnetic head block on which a plurality of magnetic head elements are formed in order to assist the running of the tape on the sliding surface and to protect the magnetic head elements. One having a wafer cover and a pair of end bars has been put to practical use.

The multi-channel magnetic head is manufactured by bonding and fixing the above-described magnetic head block, wafer cover, and a pair of end bars with an adhesive made of an epoxy resin material. The connection terminals of the plurality of magnetic head elements of the manufactured multi-channel magnetic head are connected to the lands of a flexible printed circuit (FPC) by wires made of Au or the like. It is electrically connected to the recording / reproducing IC circuit via the FPC.

[0007] The connection by the above-mentioned wires is performed by a method called wire bonding. This wire bonding is a method of automatically connecting terminals using a machine.Specifically, the tip of the wire is melted by generating heat by applying ultrasonic waves, and the wire is connected to the melted wire. This is a method of connecting a terminal and an FPC.

As described above, when a magnetic head block, a wafer cover, and a pair of end bars are fixed with an adhesive to form a multi-channel magnetic head, the adhesive flows into and adheres to a part of the connection terminals. Resulting in.

[0009] When even a small amount of adhesive is attached to the connection terminal, it is extremely difficult to perform connection by wire bonding. For this reason, at the time of bonding, great care has been taken to prevent the adhesive from flowing into the connection terminals and causing the adhesive to adhere, but the adhesion of the adhesive has not yet been completely suppressed. Then, in order to remove the adhered adhesive, after applying O ₂ asher for 30 minutes, CF ₄
The asher has been applied for 10 minutes.

[0010]

The above-mentioned O ₂ and CF ₄
The asher is performed after a multi-channel magnetic head formed in plural units is divided into a single multi-channel magnetic head. Hereinafter, the reason will be described.

When forming a multi-channel magnetic head, first, as shown in FIGS. 12 and 13, a plurality of end bars are connected to both ends of a composite head block 100 in which a plurality of head blocks are connected. The composite end bar 101 in a state is bonded, and a composite wafer cover 102a in a state where a plurality of wafer covers 102 are connected is bonded to the composite end bar 101. The composite wafer cover 102a has a shape in which a plurality of wafer covers 102 are formed on a plate-shaped connecting portion 102b.

At this time, as shown in FIG. 13, a plurality of multi-channel magnetic heads are connected and are covered by a connecting portion 102b of the composite wafer cover 102a. Then, after fixing this to the cutting jig with wax, the connecting portion 102b of the composite wafer cover 102a is polished. As a result, as shown in FIG. 13, a composite multi-channel magnetic head 103 in which a plurality of multi-channel magnetic heads are connected is formed.

After the composite multi-channel magnetic head 103 is cut and divided while being fixed to the cutting jig, the single multi-channel magnetic head is separated from the cutting jig.

The connection terminal 104 is connected to the composite guard block 10
When covered by the connecting portion 102b of 2a is, O ₂ and CF ₄ can not be subjected to ashing. Even after the connecting portion 102b of the composite guard block 102a is polished, when the composite multi-channel magnetic head 103 is fixed with a cutting jig and subjected to O ₂ and CF ₄ asher, the composite multi-channel magnetic head 103
In this state, it is impossible to apply O ₂ and CF ₄ asher, because the wax used when fixing the wire to the cutting jig is vaporized and adheres to the connection terminal 104. is there.

For this reason, the O ₂ and CF ₄ ashers are applied to the single multi-channel magnetic head after the composite multi-channel magnetic head 103 is divided into a single multi-channel magnetic head and detached from the cutting jig. It is done for.

However, in this case, man-hours are required for setting a single multi-channel magnetic head to the asher device by handling. For this reason, the manufacturing time of the multi-channel magnetic head is lengthened, and the manufacturing cost is increased.

The present invention has been proposed in view of such conventional circumstances, and is intended to provide a multi-channel magnetic head capable of removing an adhesive adhered to a connection terminal with a small number of steps and in a short time. A manufacturing method is provided.

[0018]

A method of manufacturing a multi-channel magnetic head according to the present invention is directed to a multi-channel magnetic head comprising a head block on which a plurality of magnetic head elements are formed and a guard block for protecting the head block. A method of manufacturing a magnetic head, comprising a step of polishing a connection terminal of a magnetic head element formed on the head block with a grindstone and exposing the polished surface as a terminal surface to the outside. And

Therefore, according to the method of manufacturing a multi-channel magnetic head according to the present invention, it is possible to remove the adhesive adhered to the connection terminals without performing O ₂ and CF ₄ ashers. The adhesive attached to
It can be removed with a small number of steps and in a short time. Further, by removing the adhesive adhered to the connection terminals in this manner, it is possible to improve the yield of wire bonding.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings. Hereinafter, a multi-channel magnetic head 1 as shown in FIG. 1 will be described. In addition, in the drawings used in the following description, in order to easily illustrate the characteristics of each part, the characteristic parts may be enlarged and shown, and the dimensional ratio of each member is not the same as the actual one. Not exclusively.

First, the multi-channel magnetic head 1 will be described.

The multi-channel magnetic head 1 has a magnetic head block 3 on which a plurality of magnetic head elements 2 are formed, as shown in FIGS. A pair of end bars 4 serving as guard blocks for protecting the magnetic head block 3 are adhered to both ends in the longitudinal direction of the magnetic head block 3 with an adhesive made of an epoxy resin material or the like. Further, a wafer cover 5 as a guard block is adhered on one end of the magnetic head block 3 and one end of the pair of end bars 4 along the longitudinal direction thereof with the same adhesive as described above. That is, in the multi-channel magnetic head 1, the magnetic head block 3, the pair of end bars 4, and the wafer cover 5 are bonded with an adhesive, and these are integrated.

In the multi-channel magnetic head 1, an end face on one end side where the magnetic head block 3 and the wafer cover 5 are bonded is polished in an arc shape having a predetermined curvature, and the polished surface in the arc shape is The medium sliding surface 1a is in contact with the magnetic recording medium. The magnetic sensing portion 2a of each magnetic head element 2 is exposed to the outside from the surface constituting the medium sliding surface 1a of the magnetic head block 3.

In the multi-channel magnetic head 1, the other end of the magnetic head block 3 to which the wafer cover 5 is not bonded is provided with a magnetically sensitive portion 2 of each magnetic head element 2.
The connection terminal 2b electrically connected to the terminal a is provided so as to expose the terminal surface to the outside.

As shown in FIG. 3, the connection terminal 2b is connected to a terminal portion 7a of a flexible wiring board 7 connected to a recording / reproducing IC circuit provided in the recording / reproducing apparatus by wire bonding using a wire 8 made of Au or the like. Electrically connected by Thus, each magnetic head element 2 of the multi-channel magnetic head 1 is electrically connected to the recording / reproducing IC circuit included in the recording / reproducing apparatus via the flexible wiring board 7. The connection terminal 2b is polished by a grindstone and its polished surface is used as a terminal surface, which will be described later in detail.

The magnetic head element 2 is, as shown in FIG.
On a substrate 9, a magnetoresistive effect type magnetic head (hereinafter referred to as MR head) 10 and an inductive type magnetic head 11 are laminated. The MR head 10 operates as a reproducing head, and the inductive magnetic head 11 operates as a recording head. That is, the magnetic head element 2 is formed by laminating and integrating a reproducing head and a recording head.

The MR head 10 as a reproducing head is
For example, the thin film 21 (hereinafter, referred to as MR) which is configured as a so-called shield type MR head and exhibits a magnetoresistive effect on the substrate 9
It is called a thin film. ) Is a pair of upper and lower magnetic shield layers 22 and 2
3 has a structure in which the insulating layer 24 is interposed therebetween. The MR thin film 21 of the MR head 10 serves as a magnetic sensing part of the multi-channel magnetic head 1 described above, and one end thereof is connected to the medium sliding surface 1 a of the multi-channel magnetic head 1.
It is arranged so that it is exposed to the outside from the surface where it becomes. Further, a pair of bias layers 25 are provided at both ends of the MR thin film 21.
Is connected. Then, the pair of bias layers 25
And an electrode layer 26 provided over the vicinity of the medium sliding surface 1a and a position separated from the medium sliding surface 1a.

A conductive material such as Cu is laminated on one end of the electrode layer 26 that is not connected to the bias layer, that is, on an end that is separated from the medium sliding surface 1a. The upper end surface of the conductive material is connected to the connection terminal 2 described above.
The terminal surface b is exposed outside the magnetic head block 3.

The MR thin film 21 may be constituted as an AMR film exhibiting an anisotropic magnetoresistance effect,
It may be configured as a GMR film exhibiting a giant magnetoresistance effect or a TMR film exhibiting a tunnel magnetoresistance effect.

The MR head 10 is not limited to the shield type MR head described above, but may be a yoke type MR head in which the MR thin film is not exposed to the outside from the medium sliding surface.

The inductive magnetic head 11 as a recording head is laminated on the MR head 10 as described above, and includes a lower core 23 having a function as a second magnetic shield of the MR head 10; The magnetic core 28 includes an upper core 27 formed on the lower core 23.

The upper core 27 is opposed to one end of the lower core 23 via a magnetic gap g at one end of the multi-channel magnetic head 1 located on the side of the medium sliding surface 1a, and from the medium sliding surface 1a. The other end of the lower core 23 is formed so as to be connected to the other end of the lower core 23 at the other end. As a result, a closed magnetic path is formed by the lower core 23 and the upper core 27, and the magnetic core 28 is formed.

The magnetic gap g is the same as that of the MR head 1 described above.
The magnetic thin film of the multi-channel magnetic head 1 is exposed to the outside from the surface serving as the medium sliding surface 1a of the multi-channel magnetic head 1 together with the zero MR thin film.

A magnetic core 28 composed of the lower core 23 and the upper core 27 is wound with a thin-film coil 29 made of a conductive material formed in a spiral shape. The inner peripheral end and the outer peripheral end of the thin-film coil 29 are connected to electrode layers (not shown), respectively, and are drawn out of the medium sliding surface 1a. Then, a conductive material such as Cu is laminated on the end of the electrode layer at a position separated from the medium sliding surface 1a, and the upper end surface of the conductive material serves as a terminal surface of the connection terminal 2b described above. 3 is exposed to the outside.

In this case, the magnetic head element 2 is
Although the R head 10 and the inductive magnetic head 11 are assumed to be laminated and integrated, an MR head in which the inductive magnetic head is not integrated and laminated may be used.

A plurality of magnetic head elements 2 are formed on a substrate 9. Then, the substrate 9 finally has the magnetic head element 2
Are cut so as to be arranged in the horizontal direction, and the magnetic head block 3 is obtained.

The end bars 4 are formed at both ends of the magnetic head block 3. The wafer cover 5 is bonded onto the bonded magnetic head block 3 and end bar 4. In addition, the wafer cover 5 is not adhered on the connection terminal 6. End bar 4 and wafer cover 5
Is formed of ceramic, assists the running of the magnetic recording medium and protects the magnetic head element 2.

In the multi-channel magnetic head 1 configured as described above, the terminal surfaces of the external terminals 2b are polished by a grindstone. Therefore, when the multi-channel magnetic head 1 is manufactured, the adhesive attached to the terminal surface of the external terminal 2b is removed. This allows
The yield when the connection terminal 2b and the relay board 7 are wire-bonded is improved.

Hereinafter, a method for manufacturing the multi-channel magnetic head 1 will be described in detail with reference to FIGS.

First, as shown in FIG. 5, a large number of the above-described magnetic head elements 2 are formed on a substrate 9 by a thin film process.

Next, the substrate 9 on which a number of magnetic head elements 2 are formed is cut such that a plurality of rows of magnetic head elements 2 are arranged in the horizontal direction. Thus, a composite magnetic head block 3a in which the plurality of magnetic head blocks 3 are connected is formed.

Next, as shown in FIG. 6, a composite end bar 4a having a plurality of end bars 4 connected to both ends of the composite magnetic head block 3a is bonded by an adhesive made of an epoxy resin material. I do. The number of end bars 4 connected in the composite end bar 4a is the same as the number of magnetic head blocks 3 connected in the composite magnetic head block 3a.

Next, as shown in FIG. 7, the composite wafer cover 5 in which a plurality of wafer covers 5 are connected is shown.
a on the composite magnetic head block 3a and the composite end bar 4a bonded as described above. At this time, the composite wafer cover 5a is bonded to the composite magnetic head block 3 on the side where the connection terminals 2b are exposed. Further, the composite wafer cover 5a does not adhere to the connection terminals 2b.

The composite wafer cover 5a is formed by forming a plurality of grooves in a plate made of ceramic or the like to form a projecting portion between the grooves, and the projecting portion is used as the wafer cover 5. In other words, it has a shape in which a plurality of wafer covers 5 are formed on the plate-like connecting portion 5b. By having such a shape, the wafer cover 5 is connected.
The number of wafer covers 5 connected in the composite wafer cover 5a is the same as the number of magnetic head blocks 3 connected in the composite magnetic head block 3a.

Next, as described above, the composite magnetic head block 3a, the composite end bar 4a, and the composite wafer cover 5a bonded together are attached to the cutting jig 30.
Then, by grinding and removing the connecting portion 5b of the composite wafer cover 5a, as shown in FIG. 8, a composite multi-channel magnetic head 1b in which a plurality of multi-channel magnetic heads 1 are connected is formed.

Next, as shown in FIG. 9, the composite multi-channel magnetic head 1b is cut for each multi-channel magnetic head 1.

Next, with the plurality of multi-channel magnetic heads 1 attached to the cutting jig 30, the connection terminals 2b are polished with a grindstone to remove the adhesive adhered to the connection terminals 2b. Polishing with a grindstone is performed on a portion B that is slightly wider than the portion where the plurality of connection terminals 2b are formed, as shown in FIG.

As described above, the connection terminal 2b is polished with a grindstone to remove the adhesive attached to the connection terminal 2b, so that the multi-channel magnetic head 1 can be removed from the cutting jig 30 without removing it. It is possible to remove the adhesive attached to the connection terminal 2b in the in-line process.

The step of removing the adhesive adhering to the connection terminal 2b by the above-described method and the step of removing the adhesive adhering to the connection terminal 2b by applying O ₂ and CF ₄ asher as in the related art are described. In comparison, the number of steps for polishing the multi-channel magnetic head 1 increases. However, the multi-channel magnetic head 1 is detached from the cutting jig 30 by handling, and O ₂ and CF _{4 are} removed.
The process of installing it on the device for applying asher and O ₂
And the step of applying the CF ₄ asher and the step of removing the multi-channel magnetic head 1 from the above-described apparatus by handling are eliminated. For this reason, the time required to manufacture the multi-channel magnetic head 1 is reduced by about 10 minutes, and the number of steps is reduced. Then, it is possible to reduce the manufacturing cost for manufacturing the multi-channel magnetic head 1. The man-hour means the amount of work performed by one worker per unit time.

Further, since the adhesive adhering to the surface of the connection terminal 2b can be removed without applying O ₂ and CF ₄ asher, wire bonding can be easily performed. Therefore, even when the O ₂ and CF ₄ ashers are not applied, the production amount of the multi-channel magnetic head 1 is improved.

When polishing, it is desirable to use a grindstone having diamond particles. The diameter of the diamond particles is desirably 10 μm or more and 40 μm or less. Diamond particle size is 10
If it is less than μm, processing becomes impossible because clogging of the grindstone occurs. If the diameter of the diamond particles is larger than 40 μm, the roughness of the polished surface increases, so that it is difficult to connect the connection terminal 2 b and the wire 8.

As shown in FIG. 11, it is desirable that the polished connection terminal 2 b be protruded from the surface of the magnetic head block 3. Further, it is desirable that the thickness T of the protruding portion in the polished connection terminal 2b is finally set to 3 μm or more. If the final thickness of the connection terminal 2b is less than 3 μm, it becomes difficult to connect the connection terminal 6 and the wire 8.

Finally, as shown in FIG.
And the relay board 7 are wire-bonded. As a result, the magnetic head element 2 and the recording / reproducing IC circuit (not shown) are connected. At this time, since the polished surface of the connection terminal 2b is used as the terminal surface, the yield of wire bonding is improved.

As is clear from the above description, in the multi-channel magnetic head 1, the connection terminal 2b is polished with a grindstone and the polished surface is used as the terminal surface, thereby applying an asher such as O ₂ and CF _4. Without connecting terminal 2
It becomes possible to remove the adhesive and the like adhering to b. As a result, even when no asher such as O ₂ and CF ₄ is applied, the yield at the time of wire bonding between the connection terminal 2 b and the relay substrate 7 is improved.

Further, in order to remove the adhesive or the like adhering to the connection terminal 2b, the multi-channel magnetic head 1 is detached from the cutting jig 30 and placed on a device for applying O ₂ and CF ₄ asher by handling. And O
_The step of applying the ₂ and CF ₄ asher and the step of taking out the multi-channel magnetic head 1 from the above-described apparatus by handling are not required. As a result, the number of steps for manufacturing the multi-channel magnetic head 1 is reduced.
Therefore, the manufacturing time of the multi-channel magnetic head 1 can be shortened, and the manufacturing cost can be reduced.

[0056]

As is apparent from the above description, the multi-channel magnetic head according to the present invention is characterized in that the connection terminals are polished with a grindstone and the polished surface is used as the terminal surface.
It is possible to remove an adhesive or the like attached to the connection terminal without applying an asher such as O ₂ and CF ₄ . As a result, even when the asher such as O ₂ and CF ₄ is not applied, the yield in automatically connecting the connection terminal to the relay board is improved.

Further, it is possible to reduce the number of steps for removing the adhesive or the like attached to the connection terminals.
Therefore, the manufacturing time of the multi-channel magnetic head can be shortened, and the manufacturing cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a multi-channel magnetic head to which the present invention is applied.

FIG. 2 is a side view of the multi-channel magnetic head viewed from a direction indicated by an arrow A in FIG.

FIG. 3 is a schematic diagram showing a state in which wire bonding is being performed.

FIG. 4 is a partially cutaway sectional view of a magnetic head element mounted on a multi-channel magnetic head to which the present invention is applied.

FIG. 5 is a diagram illustrating a manufacturing process of a multi-channel magnetic head to which the present invention is applied, and is a plan view illustrating a substrate on which a number of magnetic head elements are formed.

FIG. 6 is a view showing a manufacturing process of the multi-channel magnetic head, and is a plan view showing a state where a composite end bar is adhered to both ends of a composite magnetic head block.

FIG. 7 is a view showing a manufacturing process of the multi-channel magnetic head, and is a perspective view showing a state where a composite wafer cover is further bonded to the bonded composite magnetic head block and composite end bar.

FIG. 8 is a view showing a manufacturing process of the multi-channel magnetic head, and is a perspective view showing a state where the composite wafer cover is ground and a connection portion is removed.

FIG. 9 is a view showing a manufacturing process of the multi-channel magnetic head, and is a cross-sectional view showing a state in which the composite multi-channel magnetic head is cut into a single multi-channel magnetic head.

FIG. 10 is a view showing a manufacturing process of the multi-channel magnetic head, and is a perspective view showing a region to be polished.

FIG. 11 is a view showing a manufacturing process of the multi-channel magnetic head, and is a cross-sectional view showing a portion to be polished.

FIG. 12 is a view showing a manufacturing process of a conventional multi-channel magnetic head, and is a perspective view showing a state in which a composite wafer cover is further bonded to the bonded composite magnetic head block and composite end bar.

FIG. 13 is a view showing a manufacturing process of a conventional multi-channel magnetic head, and is a perspective view showing a state where a composite wafer cover is ground and a connection portion is removed.

[Explanation of symbols]

1 multi-channel magnetic head, 3 magnetic head block, 5 wafer cover, 6 connection terminals

Claims (6)

[Claims] 1. A method for manufacturing a multi-channel magnetic head comprising a head block on which a plurality of magnetic head elements are formed and a guard block for protecting the head block, wherein the head block is formed on the head block. A method of manufacturing a multi-channel magnetic head, comprising a step of polishing a connection terminal of a magnetic head element with a grindstone and exposing the polished surface as a terminal surface to the outside. 2. As a pre-process of the polishing process, a composite in which a plurality of multi-channel magnetic heads are integrated by bonding the guard block to the head block with an adhesive in units of a plurality of multi-channel magnetic heads. A multi-channel magnetic head forming step of forming a multi-channel magnetic head; and a cutting step of cutting the multi-channel magnetic head for each multi-channel magnetic head after fixing the composite multi-channel magnetic head to a cutting jig. A method for manufacturing a multi-channel magnetic head according to claim 1. 3. The multi-channel magnetic head manufacturing according to claim 2, wherein in the connection terminal polishing step, the connection terminals are polished while the multi-channel magnetic head is fixed to a cutting jig. Method. 4. The method for manufacturing a multi-channel magnetic head according to claim 1, wherein in the connection terminal polishing step, a whetstone having diamond particles is used as a whetstone for polishing the connection terminal. 5. The method according to claim 1, wherein the diameter of the diamond particles is 10 μm.
5. The method for manufacturing a multi-channel magnetic head according to claim 4, wherein the diameter is not less than m and not more than 40 μm. 6. The multi-channel magnetic head according to claim 1, wherein, in the connection terminal polishing step, the connection terminal is polished by the grindstone so that the connection terminal has a thickness of 3 μm or more. Production method.