JP2001345999A - Sensor chip, image reading sensor and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor chip that can prevent the defective image reading operations and also to provide an image reading sensor and an electronic equipment. SOLUTION: This sensor chip 3 includes an image reading sensor 2 consisting of plural sensor chips 3 mounted on a sensor substrate 4 and notched parts 3d formed at the lower corner parts of an end part 3t that meets another chip 3. The sensor 2 consists of plural chips 3 which are mounted on the substrate 4 and has the parts 3d formed at the lower corner parts of the part 3t that meets another chip 3. An electronic equipment 1 contains the sensor 2 consisting of plural chips 3 mounted on the substrate 4 and also has the parts 3d formed at the lower corner parts of the part 3t that meets another chip 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic apparatus equipped with an image reading sensor comprising a sensor chip for sensing light and converting it into an electric signal.
Further, the present invention relates to the image reading sensor and the sensor chip.

[0002]

2. Description of the Related Art Conventionally, a copying machine or an OCR (optical charac
An image reading sensor used in a reading device such as a ter reader (optical character reading device) has a configuration shown in FIG.

That is, the image reading sensor 102
Is constituted by arranging a plurality of charge-coupled device (CCD) sensor chips 103 in a straight line on a sensor substrate 104. The individual CCD sensor chips 103 are extremely close to each other. In this manner, it is adhered on the sensor substrate 104.

[0004] The CCD sensor chip 103 shown in FIG.
As shown in FIG. 5, a rectangular parallelepiped shape is formed, and a sensor surface 103h is formed on the surface thereof. On the sensor surface 103h, a large number of reading pixels (CCD elements) that sense light and convert it into electric signals are provided. 103C is formed.

Each of the CCD sensor chips 103 has a back surface 103r as a mounting surface adhered to a sensor substrate 104 by using a die bonding paste 104p in such a manner that the ends 103t face each other.

Here, the adjacent CCD sensor chips 10
The interval between the three end portions 103t is set to 10 to 20 μm.

Further, the sensor substrate 104 and each CCD
The sensor chip 103 is electrically connected to an electrode terminal (not shown) of the sensor surface 103 h of the CCD sensor chip 103 and an electrode terminal (not shown) of the sensor substrate 104 by wire bonding using a gold wire 106. Connected.

[0008]

By the way, in the image reading sensor 102 constructed as described above, in the manufacturing process, when the bonding pressure is applied from above during the bonding operation, as shown in FIG. The phenomenon that the die bonding paste 104p leaks from between the ends 103t of the adjacent CCD sensor chips 103 and partially covers the sensor surface 103h of the CCD sensor chips 103 may occur.

Then, the leaked die bonding paste 104p is applied to the sensor surface 10 as shown in FIG.
If the reading pixel 103C formed in 3h is covered, the reading pixel 103C cannot sense the incident light, and a reading defect will occur.

Thus, the individual CCD sensor chips 1
When an image reading defect occurs in the image sensor 03, an image reading defect occurs in the image reading sensor 102 configured using the CCD sensor chip 103, and the image reading function of an electronic device equipped with the image reading sensor 102 is impaired.

On the other hand, according to "CCD chip and method for forming the CCD chip" (Japanese Patent Application No. 8-129470), in a CCD chip to which a component is attached with reference to the surface, the component side is located outside the effective pixel area. There is disclosed a configuration in which a step surface is formed lower than an effective pixel region in which an abutting surface is abutted and positioned.

However, the above structure eliminates the stress applied to the effective pixel area by providing a step surface on the side of the effective pixel area opposite to the substrate mounting surface of the CCD chip. This does not solve the above-mentioned problem.

In view of the above situation, the present invention provides a sensor chip, an image reading sensor, and a sensor chip capable of preventing an image reading defect caused by leakage of a die bonding paste.
And electronic equipment.

[0014]

According to a first aspect of the present invention, there is provided a sensor chip having a rectangular shape in plan view, pixels for reading on a surface thereof, and forming a straight line by associating the ends on a sensor substrate. A sensor chip constituting an image reading sensor by being mounted in a plurality of aspects,
A notch is provided at the lower corner of the end that meets the other sensor chip.

An image reading sensor according to claim 6 is
An image reading sensor comprising a plurality of sensor chips each having a rectangular planar shape and having pixels for reading on a surface thereof, which are mounted on a sensor substrate in such a manner that ends thereof are associated with each other to form a straight line. The chip comprises a notch in the lower corner of the end meeting the other sensor chip.

According to an eleventh aspect of the present invention, there is provided the electronic device, wherein a plurality of sensor chips having a rectangular planar shape and having pixels for reading on the surface are formed on the sensor substrate in such a manner that ends thereof are associated with each other to form a straight line. An electronic device having an image reading sensor mounted thereon, the electronic device comprising a cutout portion at a lower corner of an end portion of a sensor chip constituting the image reading sensor which meets another sensor chip.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows a copying machine 1 (electronic device) to which the present invention is applied.
Accommodates the image reading unit U inside the housing K.

The image reading unit U according to the first embodiment has a base frame U1 extending in a direction perpendicular to the plane of FIG. 1, and a document surface glass U2 is mounted on the upper surface of the base frame U1. Inside, a light source U3 and an imaging lens U4 extending in the longitudinal direction of the base frame U1 are installed.

In the copying machine 1 having the above-described configuration, the original conveying rollers R move on the original surface glass U2 of the image reading unit U.
The original G conveyed by the original is irradiated by the light source U3, and the reflected light from the original G is imaged on the CCD sensor chip 3 (sensor chip) of the image reading sensor 2 using the imaging lens U4. An operation of reading the drawn book image information is performed.

The image reading sensor 2 in the image reading unit U is constituted by arranging a plurality of CCD sensor chips 3 on a sensor substrate 4 in a straight line as shown in FIG. CCD sensor chip 3
Are bonded on the sensor substrate 4 in a manner very close to each other.

The CCD sensor chip 3 is a raw material wafer.
(Described later) is cut and separated, and is formed into a substantially rectangular parallelepiped shape, as shown in FIG. 3, and a sensor surface 3h is formed on the surface thereof. A large number of reading pixels (CCD elements) 3C are formed to sense the image data and convert it into an electric signal.

Each CCD sensor chip 3 has an end 3
The back surface 3r as a mounting surface is adhered to the sensor substrate 4 using a die bonding paste 4p in a mode in which t is opposed to each other.

Here, the interval between the ends 3t of the adjacent CCD sensor chips 3 is set to 10 to 20 μm.

Further, the sensor substrate 4 and each CCD sensor chip 3 are connected to an electrode terminal (not shown) on the sensor surface 3 h of the CCD sensor chip 3 and an electrode terminal (not shown) on the sensor substrate 4. They are electrically connected by wire bonding using gold wires 6.

Here, in the CCD sensor chip 3, although each side surface portion 3s has a flat shape, both ends (left and right sides in FIGS. 3A and 3B) are shown. Step-shaped notch 3 having two planes at the lower corner of portion 3t
d is formed.

The notch 3d is formed as described below.
During the bonding operation in the manufacturing process, the die bonding paste 4p is applied to the CCD sensor chip 3 by the bonding pressure.
When it leaks from between the back surface 3r (mounting surface) and the sensor substrate 4, the space for accommodating the die bonding paste 4p is defined.

According to the image reading sensor 2 having the above configuration, as shown in FIG.
Even if the D sensor chip 3 receives an adhesive pressure from above and the die bonding paste 4p leaks from between the back surface 3r (mounting surface) of the CCD sensor chip 3 and the sensor substrate 4,
The die bonding paste 4p does not leak onto the sensor surface 3h of the CCD sensor chip 3 because it penetrates and remains in the notch 3d formed in the CCD sensor chip 3.

Therefore, the die bonding paste 4p
Does not adhere to the reading pixels 3C formed on the sensor surface 3h of the CCD sensor chip 3, and thus the CC
No image reading defect occurs in the D sensor chip 3.

As described above, since the image reading defect does not occur in each CCD sensor chip 3, the occurrence of the image reading defect is also prevented in the image reading sensor 2 including the CCD sensor chip 3 as a component.

Further, since no image reading defect occurs in each CCD sensor chip 3, the image reading sensor 2 including the CCD sensor chip 3 as a constituent element
The occurrence of defective image reading is prevented, and the copying machine 1 equipped with the image reading sensor 2 is prevented from having defective image reading, and the copying function functions normally.

The notch 3d in the CCD sensor chip 3 is formed only in the lower corner of the end 3t, and does not significantly reduce the area of the back surface 3r, which is the mounting surface. 4 is sufficiently secured, so that the bonding strength of the CCD sensor chip 3 to the sensor substrate 4 does not decrease.

As described above, since each CCD sensor chip 3 is bonded to the sensor substrate 4 with a sufficient bonding strength,
The image reading sensor 2 configured by bonding a plurality of CCD sensor chips 3 to the sensor substrate 4 has sufficient structural strength.

Further, as described above, the copier 1 equipped with the image reading sensor 2 having sufficient structural strength.
The operation reliability of the electronic device is improved.

Hereinafter, a method of manufacturing the above-described CCD sensor chip 3 will be described.

First, as shown in FIG. 5A, a wafer 10 as a raw material of the CCD sensor chip 3 is prepared.
As shown in (1), a pattern to be the sensor surface 3h of each CCD sensor chip 3 described above is formed on the front surface 10h of the wafer 10.

Next, as shown in FIG. 6, the back surface 10r of the wafer 10 (the surface constituting the mounting surface of the CCD sensor chip 3) is polished using a grindstone 10t.

Thereafter, as shown in FIG.
0 from the back surface 10r to the back surface blade 1 having a wide width.
Using 1, the wafer 10 is half-cut diced widely to a position corresponding to the end 3t of each CCD sensor chip 3 up to the middle of the thickness of the wafer 10.

That is, as shown in FIG. 7 (b), the back surface 10r of the wafer 10 divides the wafer 10 into the respective CCD sensor chips 3 by dividing lines Lt (virtual lines) corresponding to the ends 3t of the CCD sensor chips 3. Line) and the dividing line Ls (virtual line) corresponding to the side surface portion 3s, half-cut dicing is performed along the dividing line Lt, and as shown in FIG.
A half-cut groove 11hc that defines a notch 3d (see FIG. 3) of the CD sensor chip 3 is formed.

Next, as shown in FIG.
The full-cut dicing is performed from the front surface 10h using the front blade 12 having a width smaller than that of the back blade 11 described above, and the wafer 10 is divided into individual CCD sensor chips 3.

That is, as shown in FIG. 8B, the dividing line Ls for dividing the wafer 10 into each CCD sensor chip 3
A full cut dicing is performed from the surface 10h along the division line Lt, and the wafer 10 is divided into individual CCD sensor chips 3 as shown in FIG.

According to the above-described manufacturing method, the notch 3d formed in the CCD sensor chip 3 is obtained by half-cut dicing of the wafer 10 from the back surface 10r using the wide back surface blade 11 during manufacturing. Therefore, the work related to the formation is extremely easy.

In the above-described embodiment, a step-shaped notch is described as an example of a notch at the end of the CCD sensor chip. However, the shape of the notch can be appropriately selected. It is.

FIG. 9 shows a CCD sensor chip 32 according to a second embodiment and an image reading sensor 22 in which the CCD sensor chip 32 is mounted on a sensor substrate 4 '.

That is, a plurality of CCs constituting the image reading sensor 22 are mounted on the sensor substrate 4 'in such a manner that a plurality of the end portions 3t' are brought close to each other so as to form a straight line.
In the D sensor chip 32, the lower corners of both end portions 3t 'associated with the other adjacent CCD sensor chip 32 have 1
A chamfered notch 3d2 having two slopes is formed.

This embodiment is different from the first embodiment in that
Except that the notch 3d formed at the end 3t of the CCD sensor chip 3 has been changed to a chamfered notch 3d2, the configuration of the other parts is exactly the same. The detailed description is omitted by showing the parts.

As shown in FIG. 9B, during the bonding operation in the manufacturing process, the CCD sensor chip 32 receives an adhesive pressure from above, and the die bonding paste 4p 'is attached to the back surface 3r' (mounting surface) of the CCD sensor chip 32. ) And the sensor substrate 4 ', the liquid crystal enters the cutout 3d2 formed in the CCD sensor chip 32 and stays there. Therefore, die bonding is performed on the sensor surface 3h' of the CCD sensor chip 32. The paste 4p 'does not leak.

Therefore, the die bonding paste 4p '
Does not adhere to the reading pixels formed on the sensor surface 3h 'of the CCD sensor chip 32,
No image reading failure occurs in the D sensor chip 32.

The notch 3d2 in the CCD sensor chip 32 is formed only at the lower corner of the end 3t 'and does not significantly reduce the area of the back surface 3r' which is the mounting surface. A sufficient bonding area with the sensor substrate 4 'is ensured, so that the bonding strength of the CCD sensor chip 32 to the sensor substrate 4' does not decrease.

Accordingly, the CCD sensor chip 32, the image reading sensor 22, and the copying machine (electronic device) equipped with the image reading sensor 22 can obtain exactly the same effects as those described in the first embodiment.

FIG. 10 shows a CCD sensor chip 33 according to the third embodiment and an image reading sensor 23 in which the CCD sensor chip 33 is mounted on a sensor substrate 4 '.
Is shown.

The CCD sensor chip 33 of the third embodiment is
As shown in FIG. 10, when mounted on the sensor substrate 4 ', the lower surface (mounting surface) 3r' is attached to the lower surface of the end 3t 'where it meets the adjacent CCD sensor chip 33 from the sensor surface. A chamfered notch 3d3 having one slope extending over 3h 'is formed.

In this embodiment, since the configuration other than the above-mentioned cutout 3d3 is exactly the same as that of the second embodiment, the other components are denoted by the same reference numerals and detailed description thereof will be omitted.

The CCD sensor chip 33 is manufactured by the following method.

First, as shown in FIG. 11 (a), a wafer 10 'which is a raw material of the CCD sensor chip 33 is prepared, and the sensor surface of each CCD sensor chip 33 is placed on the surface 10h' of the wafer 10 '. A pattern of 3h 'is formed.

Next, as shown in FIG.
The back surface 10r 'of 0' (the surface constituting the mounting surface in the CCD sensor chip 33) is polished using a grindstone, and
A film t is attached to the sensor surface 3h 'of the wafer 10'.

Then, a chamfered notch 3d3 having one slope extending from the back surface 3r 'side to the sensor surface 3h' is formed at the lower corner of the end 3t 'of the CCD sensor chip 33 by cutting. A blade 11a having a blade 11a1 having a wedge-shaped cross section as shown in FIG.

Next, as shown in a cross-sectional view perpendicular to the cutting direction of the wafer 10 'and the blade 11a in the cutting step of the wafer 10' in FIG. 11C, a film t was attached using the blade 11a. Back surface 10 of wafer 10 '
Each CCD sensor chip 3 is continuously cut along a predetermined cutting line from r 'to the inner region of the film t.
Divide into three.

Here, the film t is moved by the blade 11a.
The reason why is not completely cut and not separated is to prevent the plurality of cut and divided CCD sensor chips 33 from being individually dispersed.

At the time of cutting the wafer 10 ', the blade 11a having a pointed wedge-shaped cross section at the tip of the blade is used.
Instead of (see FIG. 12 (a)), a blade 11a′1 having a wedge-shaped cross section with a flat surface 11a′2 as shown in FIG.
May be used.

According to this structure, as shown in FIG. 10B, during the bonding operation in the manufacturing process, the CCD sensor chip 33 receives the bonding pressure from above, and the die bonding paste 4p 'is applied to the back surface of the CCD sensor chip 33. Even if it leaks from between the 3r '(mounting surface) and the sensor substrate 4', it penetrates into the cutout 3d3 formed in the CCD sensor chip 33 and stays there. The die bonding paste 4p 'does not leak above.

Therefore, the die bonding paste 4p '
Does not adhere to the reading pixels formed on the sensor surface 3 h ′ of the CCD sensor chip 33,
No image reading defect occurs in the D sensor chip 33.

The notch 3d3 in the CCD sensor chip 33 is formed at the lower corner of the end 3t 'and does not significantly reduce the area of the back surface 3r' which is the mounting surface. A sufficient bonding area with the substrate 4 'is ensured, so that the bonding strength of the CCD sensor chip 33 to the sensor substrate 4' does not decrease.

Therefore, the CCD sensor chip 33, the image reading sensor 23, and the copying machine (electronic device) equipped with the image reading sensor 23 can obtain exactly the same effects as those described in the first embodiment.

In addition, according to the above-described method for manufacturing the CCD sensor chip 33, in the step of cutting the wafer 10 ',
By using the blade 11a or the blade 11a ', the wafer is divided into the respective CCD sensor chips 33 by cutting only from the back surface 10r' of the wafer, so that the cutting operation in the manufacturing process is simplified and the manufacturing cost is reduced.

Further, in the step of cutting the wafer 10 ', the blade 1 having a flat surface 11a'2 and a wedge-shaped section
If the blade 11a 'of 1a'1 is used, the strength of the blade is stronger and the service life is longer, so that the number of times of replacing the blade is reduced and the manufacturing cost is reduced.

FIG. 13 shows a CCD sensor chip 34 of the fourth embodiment and an image reading sensor 24 in which the CCD sensor chip 34 is mounted on a sensor substrate 4 '.
Is shown.

The CCD sensor chip 34 of the fourth embodiment is
As shown in FIG. 13, when mounted on the sensor substrate 4 ′, the lower surface (mounting surface) 3 r ′ is connected to the lower surface of the end 3 t ′ that meets the adjacent CCD sensor chip 34. A curved notch 3d4 having a continuous curved surface over 3h 'is formed.

In this embodiment, since the configuration other than the above-mentioned cutout portion 3d4 is exactly the same as that of the third embodiment, the other components are denoted by the same reference numerals and detailed description thereof will be omitted.

The CCD sensor chip 34 is manufactured by the following method.

First, as in the third embodiment, a wafer 10 'as a raw material of the CCD sensor chip 34 is prepared, and FIG.
As shown in (a), each C is applied to the surface 10h 'of the wafer 10'.
A pattern to be the sensor surface 3h 'of the CD sensor chip 34 is formed.

Next, the back surface 10r 'of the wafer 10' (CC
The surface constituting the mounting surface of the D sensor chip 34)
Polishing is performed using a grindstone, and a film t is attached to the sensor surface 3h 'of the wafer 10' as shown in FIG.

Then, as shown in the cross-sectional view perpendicular to the blade 11b and the cutting direction of the wafer 10 'in the cutting process of the wafer 10' in FIG.
In order to form a curved notch 3d4 having a continuous curved surface extending from the back surface 3r 'to the sensor surface 3h' at the lower corner of the end 3t 'of the blade 4, a blade 11b having a curved cross section is formed.
Prepare a blade 11b having
By using b, the wafer is cut continuously along a predetermined cutting line from the back surface 10r 'of the wafer 10' on which the film t is stuck to the inner region of the film t, thereby dividing the wafer into each CCD sensor chip 34.

Here, the film t is moved by the blade 11b.
The reason why is not completely cut and separated is to prevent the plurality of cut and divided CCD sensor chips 34 from being individually dispersed.

According to this configuration, as shown in FIG. 13B, during the bonding operation in the manufacturing process, the CCD sensor chip 34
Receives the bonding pressure from above, the die bonding paste 4p 'leaks from between the back surface 3r' (mounting surface) of the CCD sensor chip 34 and the sensor substrate 4 '. The die bonding paste 4p 'does not leak onto the sensor surface 3h' of the CCD sensor chip 34 because it penetrates into the notch 3d4 and stays.

Therefore, the die bonding paste 4p '
Does not adhere to the reading pixels formed on the sensor surface 3h 'of the CCD sensor chip 34,
An image reading defect in the D sensor chip 34 does not occur.

The notch 3d4 in the CCD sensor chip 34 is formed at the lower corner of the end 3t 'and does not significantly reduce the area of the back surface 3r' which is the mounting surface. A sufficient bonding area with the substrate 4 'is ensured, so that the bonding strength of the CCD sensor chip 34 to the sensor substrate 4' does not decrease.

Therefore, the CCD sensor chip 34, the image reading sensor 24, and the copying machine (electronic device) equipped with the image reading sensor 24 can obtain exactly the same effects as those described in the first embodiment.

In addition, according to the above-described method of manufacturing the CCD sensor chip 34, in the step of cutting the wafer 10 ',
Since the wafer 10 'is divided into the respective CCD sensor chips 34 by cutting only from the wafer back surface 10r' side using the blade 11b, the cutting operation in the manufacturing process is simplified and the manufacturing cost is reduced.

Further, in the cutting step, since the blade 11b used has the blade 11b1 having a curved cross section, the stress applied to the blade 11b1 at the time of cutting is dispersed relatively uniformly, the strength of the blade 11b1 is high, and the life is extended. Long, the number of replacements of the blade 11b is reduced, and the manufacturing cost is reduced.

FIG. 15 shows a CCD sensor chip 35 of the fifth embodiment and an image reading sensor 25 in which the CCD sensor chip 35 is mounted on a sensor substrate 4 '.
Is shown.

In the fifth embodiment, the CCD sensor chip 3 and the image reading sensor 2 of the first embodiment shown in FIGS.
This is a modified example.

The CCD sensor chip 35 is provided at the lower corner of the end 3t 'associated with the other CCD sensor chip 35 by 2.
A step having two planes and a curved surface connecting the two planes are provided, and a notch 3d5 is formed.

That is, a curved surface having an R-shaped cross section is formed at the concave corner where the two planes in the notch 3d5 intersect.

This embodiment is different from the first embodiment in that
The configuration other than the above-mentioned cutout 3d5 is exactly the same, so the other configuration is denoted by adding a prime to the number of the first embodiment, and detailed description thereof will be omitted.

Similarly, the method of manufacturing the CCD sensor chip 35 is the same as the method of manufacturing the CCD sensor chip 3 of the first embodiment except that the back surface blade having a curved corner having an R-shaped cross section is used. Since it is manufactured by cut dicing and the other manufacturing method is the same as the manufacturing method of the CCD sensor chip 3 of the first embodiment, the description of the manufacturing method is omitted.

According to this configuration, the CCD sensor chip 35
Is applied when mounted on the sensor substrate 4 ', or when stress is applied to the CCD sensor chip 35 due to environmental changes during use after shipment as a product,
The notch 3d5 formed in the D sensor chip 35 is
Since the concave corner portion where the two planes intersect is formed as a curved surface having an R-shaped cross section, occurrence of stress concentration can be prevented.

The CCD sensor chip 35, the image reading sensor 25, and the copying machine (electronic device) equipped with the image reading sensor 25 can obtain exactly the same effects as those described in the first embodiment.

FIG. 16 shows a CCD sensor chip 36 of the sixth embodiment and an image reading sensor 26 in which the CCD sensor chip 36 is mounted on a sensor substrate 4 '.
Is shown.

The sixth embodiment is similar to the fifth embodiment, except that the first
It is a modification of the CCD sensor chip 3 and the image reading sensor 2 of the embodiment.

In the CCD sensor chip 36, a stepped notch 3d6 having two flat surfaces is formed at a lower corner of one end 3t 'of both ends 3t' associated with the other CCD sensor chip 36. Have been.

This embodiment is different from the first embodiment in that
The structure is exactly the same as that of the first embodiment except that the notch 3d6 is formed only at the lower corner of one end 3t '. Detailed description is omitted.

Similarly, the manufacturing method of the CCD sensor chip 36 is the same as the manufacturing method of the CCD sensor chip 3 of the first embodiment except that the notch 3d6 is formed only at the lower corner of one end 3t '. Are the same as those in the manufacturing method of the first embodiment, and a description thereof will be omitted.

According to this configuration, the CCD sensor chip 36
Is formed only at the lower corner of one side end 3t ', and the reduction in the area of the back surface 3r', which is the mounting surface of the CCD sensor chip 36, is extremely small. The adhesion area of is secured enough,
Thus, the bonding strength of the CCD sensor chip 36 to the sensor substrate 4 'does not decrease.

Also, as shown in FIG. 16B, during the bonding operation in the manufacturing process, the CCD sensor chip 36 receives an adhesive pressure from above, and the die bonding paste 4p 'is brought into contact with the back surface 3r' ( Even if it leaks from between the (mounting surface) and the sensor substrate 4 ', it will penetrate into the notch 3d6 formed in the CCD sensor chip 36 and stay there, so that it will remain on the sensor surface 3h' of the CCD sensor chip 36. The die bonding paste 4p 'does not leak.

Therefore, the die bonding paste 4p '
Does not adhere to the reading pixels formed on the sensor surface 3h 'of the CCD sensor chip 36, and thus the CC
No image reading failure occurs in the D sensor chip 36.

Therefore, the same effects as those described in the first embodiment can be obtained for the CCD sensor chip 36, the image reading sensor 26, and the copying machine (electronic device) equipped with the image reading sensor 26.

Here, as described in the sixth embodiment,
In the above-described second to fifth embodiments as well, the notch is formed at the lower corner of one end of both ends of the CCD sensor chip which is associated with another CCD sensor chip. The same effect as that of the embodiment can be obtained.

That is, a notch is formed at one of the lower corners of two CCD sensor chip ends where a certain CCD sensor chip and another CCD sensor chip meet each other, whereby The same effects as in the sixth embodiment can be obtained.

In the above-described embodiment, the CCD sensor chip has been described as an example of the sensor chip. However, the sensor chip according to the present invention can be applied to various other sensor chips. Needless to say, the image reading sensor according to the present invention can be applied to an image reading sensor including various other sensor chips.

It goes without saying that the electronic apparatus according to the present invention can be effectively applied to an electronic apparatus equipped with an image reading sensor composed of various sensor chips other than the above-mentioned CCD sensor chip.

In addition, OCs other than copiers as electronic devices
Naturally, the electronic device according to the present invention can be effectively applied to various other electronic devices such as R and facsimile.

[0103]

As described in detail above, the sensor chip according to the first aspect of the present invention has a rectangular planar shape, has pixels for reading on the surface, and associates the ends with each other on the sensor substrate. A plurality of sensor chips which are mounted in a straight line so as to form an image reading sensor, and have a notch at a lower corner of an end portion where the sensor chip is associated with another sensor chip.

According to the above-described sensor chip, during the bonding operation in the manufacturing process, the sensor chip receives the bonding pressure from above, and the die bonding paste leaks from between the back surface (mounting surface) of the sensor chip and the sensor substrate. However, since it penetrates into the notch formed in the sensor chip and stays, the die bonding paste does not leak onto the sensor surface of the sensor chip and does not adhere to the reading pixels, so that the image of the sensor chip is read. Defects are prevented.

According to a sixth aspect of the present invention, there is provided an image reading sensor in which a sensor chip having a rectangular planar shape and having pixels for reading on the surface is formed into a straight line by bringing both ends of the sensor chip into association with each other on a sensor substrate. And a plurality of image reading sensors, each of which has a cutout at a lower corner of an end of the sensor chip where the sensor chip meets another sensor chip.

According to the above-described image reading sensor, during the bonding operation in the manufacturing process, the sensor chip constituting the image reading sensor receives the bonding pressure from above, and the die bonding paste is attached to the back surface (mounting surface) of the sensor chip and the sensor chip. Even if it leaks from between the substrate, it penetrates into the notch formed in the sensor chip and stays there, so that the die bonding paste does not leak onto the sensor surface of the sensor chip and adheres to the reading pixels. Therefore, no image reading failure of each sensor chip occurs.

Therefore, an image reading defect of the image reading sensor constituted by using the sensor chip is prevented.

The electronic device according to the eleventh aspect of the present invention is such that a sensor chip having a rectangular planar shape and having pixels for reading on the surface is formed in a straight line by bringing both ends of the sensor chip into association with each other on a sensor substrate. An electronic device equipped with a plurality of mounted image reading sensors, comprising a notch at a lower corner of an end of a sensor chip constituting the image reading sensor which is associated with another sensor chip.

According to the electronic device described above, during the bonding operation in the manufacturing process, the sensor chip constituting the image reading sensor receives the bonding pressure from above, and the die bonding paste is attached to the back surface (mounting surface) of the sensor chip and the sensor substrate. Even if it leaks from the gap between the sensor chip and the sensor chip, the die bonding paste does not leak onto the sensor surface because it penetrates into the notch formed in the sensor chip and stays there. In addition, the image reading failure of each sensor chip does not occur.

Therefore, reading failure of the image reading sensor constituted by using the above-mentioned sensor chip is prevented, so that the image reading function of the electronic device equipped with the image reading sensor functions normally and the electronic device with high reliability is used. Equipment is obtained.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram showing an embodiment of an electronic apparatus according to the present invention.

2A and 2B are a front view and a perspective view showing a first embodiment of an image reading sensor in the electronic device of FIG.

3 (a), (b), (c), (d), (e) are plan views showing a first embodiment of a sensor chip of the image reading sensor shown in FIG. 2 according to the present invention; Front view, BB line sectional view, side view, perspective view.

4 (a) and 4 (b) are a partially enlarged front view and a cross-sectional view taken along the line CC showing the image reading sensor of FIG. 2;

5 (a) and 5 (b) are perspective views of a wafer before processing and a perspective view of a wafer after pattern formation, showing a manufacturing process of the sensor chip shown in FIG. 3;

FIG. 6 is a perspective view of a polishing process of the back surface of the wafer showing a manufacturing process of the sensor chip shown in FIG. 3;

FIGS. 7A, 7B, and 7C are perspective views of a cutting state from the back surface of the wafer showing a manufacturing process of the sensor chip shown in FIG. 3;
FIG. 2 is a partially enlarged view of the back surface of the wafer before cutting, and a partially enlarged view of the back surface of the wafer after cutting.

8 (a), 8 (b) and 8 (c) are perspective views of a cutting state from a wafer surface showing a manufacturing process of the sensor chip shown in FIG. 3;
FIG. 2 is a partially enlarged view of a wafer surface before cutting, and a partially enlarged conceptual view of a wafer surface after cutting.

9A and 9B are a perspective view showing a second embodiment of a sensor chip according to the present invention and a partially enlarged front view showing a second embodiment of an image reading sensor using the sensor chip.

10A and 10B are a perspective view showing a third embodiment of a sensor chip according to the present invention and a partially enlarged front view showing a third embodiment of an image reading sensor using the sensor chip.

FIGS. 11A and 11B are front views showing a manufacturing process of a third embodiment of the sensor chip according to the present invention, and FIG. 11C shows a cutting process of the third embodiment of the sensor chip according to the present invention. FIG. 4 is a cross-sectional view in a direction perpendicular to a cutting direction of the illustrated wafer and blade.

12 (a) and (b) are cross-sectional views of a blade used in the cutting step shown in FIG. 11 (c).

FIGS. 13A and 13B are a perspective view showing a fourth embodiment of a sensor chip according to the present invention and a partially enlarged front view showing a fourth embodiment of an image reading sensor using the sensor chip.

FIG. 14 is a cross-sectional view in a direction perpendicular to the cutting direction of a wafer and a blade showing a cutting process of a fourth embodiment of the sensor chip according to the present invention.

15A and 15B are a perspective view showing a fifth embodiment of a sensor chip according to the present invention and a partially enlarged front view showing a fifth embodiment of an image reading sensor using the sensor chip.

16A and 16B are a perspective view showing a sixth embodiment of a sensor chip according to the present invention and a partially enlarged front view showing a sixth embodiment of an image reading sensor using the sensor chip.

FIG. 17 is a perspective view showing a conventional image reading sensor.

18 (a), (b) and (c) are a plan view, a front view and a side view showing a conventional CCD sensor chip.

19 (a) and (b) are a partially enlarged front view and a partially enlarged plan view showing a conventional image reading sensor.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic device 2, 22, 23, 24, 25, 26 ... Image reading sensor, 3, 32, 33, 34, 35, 36 ... Sensor chip, 3c ... Reading pixel, 3d, 3d2, 3d3, 3d4, 3d5, 3d6: Notch, 3h, 3h ': Sensor surface (surface), 3t, 3t': End, 4, 4 ': Sensor board.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H04N 1/19 H01L 27/14 B 5/335 H04N 1/04 102

Claims (15)

[Claims] 1. An image reading sensor having a rectangular planar shape, pixels for reading on its surface, and a plurality of mounted on a sensor substrate in a form of a straight line with end portions associated with each other. A sensor chip comprising: a notch at a lower corner of said end portion which is associated with another sensor chip. 2. The sensor chip according to claim 1, wherein the notch has two flat surfaces provided at a lower corner of the end. 3. The sensor chip according to claim 2, wherein the cutout portion is formed to have a curved surface provided continuously with the two planes. 4. The sensor chip according to claim 1, wherein the notch is formed with one slope provided at a lower corner of the end. 5. The sensor chip according to claim 1, wherein the notch has a continuous curved surface provided at a lower corner of the end. 6. An image reading sensor in which a plurality of sensor chips each having a rectangular planar shape and having pixels for reading on its surface are mounted on a sensor substrate in such a manner that ends thereof are associated with each other to form a straight line. An image reading sensor, comprising: a notch at a lower corner of an end of the sensor chip that meets another sensor chip. 7. The image reading sensor according to claim 6, wherein the notch in the sensor chip is formed with two flat surfaces provided at a lower corner of the end. 8. The image reading sensor according to claim 7, wherein the cutout portion in the sensor chip is formed to have a curved surface provided continuously with the two planes. 9. The image reading sensor according to claim 6, wherein the notch in the sensor chip is formed with one slope provided at a lower corner of the end. 10. The image reading sensor according to claim 6, wherein the notch in the sensor chip is formed to have a continuous curved surface provided at a lower corner of the end. 11. An image reading sensor in which a plurality of sensor chips each having a rectangular planar shape and having a pixel for reading on its surface are mounted on a sensor substrate in such a manner that ends thereof are associated with each other to form a straight line. An electronic device comprising: a notch at a lower corner of an end of the sensor chip constituting the image reading sensor where the sensor chip is associated with another sensor chip. 12. The electronic device according to claim 11, wherein the notch in the sensor chip constituting the image reading sensor has two flat surfaces provided at a lower corner of the end. machine. 13. The electronic device according to claim 12, wherein a cutout portion in the sensor chip constituting the image reading sensor is formed to have a curved surface provided continuously with the two planes. 14. The electronic device according to claim 11, wherein a notch in the sensor chip constituting the image reading sensor is formed with one slope provided at a lower corner of the end. machine. 15. The electronic device according to claim 11, wherein the cutout portion of the sensor chip constituting the image reading sensor has a continuous curved surface provided at a lower corner of the end. machine.