JP2001345411A5 - - Google Patents
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- JP2001345411A5 JP2001345411A5 JP2000162340A JP2000162340A JP2001345411A5 JP 2001345411 A5 JP2001345411 A5 JP 2001345411A5 JP 2000162340 A JP2000162340 A JP 2000162340A JP 2000162340 A JP2000162340 A JP 2000162340A JP 2001345411 A5 JP2001345411 A5 JP 2001345411A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000162340A JP2001345411A (en) | 2000-05-31 | 2000-05-31 | Lead frame and semiconductor device using the same and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000162340A JP2001345411A (en) | 2000-05-31 | 2000-05-31 | Lead frame and semiconductor device using the same and its manufacturing method |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008024408A Division JP4901776B2 (en) | 2008-02-04 | 2008-02-04 | Lead frame, semiconductor device using the same, and production method thereof |
| JP2010291888A Division JP2011066455A (en) | 2010-12-28 | 2010-12-28 | Semiconductor apparatus utilizing lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001345411A JP2001345411A (en) | 2001-12-14 |
| JP2001345411A5 true JP2001345411A5 (en) | 2007-01-11 |
Family
ID=18666250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000162340A Pending JP2001345411A (en) | 2000-05-31 | 2000-05-31 | Lead frame and semiconductor device using the same and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001345411A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6720207B2 (en) | 2001-02-14 | 2004-04-13 | Matsushita Electric Industrial Co., Ltd. | Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device |
| JP3879452B2 (en) | 2001-07-23 | 2007-02-14 | 松下電器産業株式会社 | Resin-sealed semiconductor device and manufacturing method thereof |
| JP2003204027A (en) | 2002-01-09 | 2003-07-18 | Matsushita Electric Ind Co Ltd | Lead frame and its manufacturing method, resin sealed semiconductor device and its manufacturing method |
| JP2004134573A (en) * | 2002-10-10 | 2004-04-30 | Renesas Technology Corp | Semiconductor device and its manufacturing process |
| JP4652281B2 (en) * | 2006-05-29 | 2011-03-16 | パナソニック株式会社 | Resin-sealed semiconductor device |
| WO2007138679A1 (en) | 2006-05-30 | 2007-12-06 | Shimadzu Corporation | Mass spectrometer |
| JP5685012B2 (en) * | 2010-06-29 | 2015-03-18 | 新光電気工業株式会社 | Manufacturing method of semiconductor package |
| JP6617955B2 (en) * | 2014-09-16 | 2019-12-11 | 大日本印刷株式会社 | Lead frame and manufacturing method thereof, and semiconductor device and manufacturing method thereof |
| JP6870249B2 (en) * | 2016-09-14 | 2021-05-12 | 富士電機株式会社 | Semiconductor devices and methods for manufacturing semiconductor devices |
| KR102271093B1 (en) * | 2021-01-25 | 2021-07-02 | 에스앤피티(주) | Substrate for semiconductor packaging |
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2000
- 2000-05-31 JP JP2000162340A patent/JP2001345411A/en active Pending