JP2001345324A5 - - Google Patents
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- Publication number
- JP2001345324A5 JP2001345324A5 JP2000163046A JP2000163046A JP2001345324A5 JP 2001345324 A5 JP2001345324 A5 JP 2001345324A5 JP 2000163046 A JP2000163046 A JP 2000163046A JP 2000163046 A JP2000163046 A JP 2000163046A JP 2001345324 A5 JP2001345324 A5 JP 2001345324A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000163046A JP2001345324A (en) | 2000-05-31 | 2000-05-31 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000163046A JP2001345324A (en) | 2000-05-31 | 2000-05-31 | Manufacturing method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001345324A JP2001345324A (en) | 2001-12-14 |
JP2001345324A5 true JP2001345324A5 (en) | 2005-06-16 |
Family
ID=18666863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000163046A Abandoned JP2001345324A (en) | 2000-05-31 | 2000-05-31 | Manufacturing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001345324A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4757372B2 (en) * | 2000-06-13 | 2011-08-24 | 富士通株式会社 | Method for forming buried wiring layer |
KR100720489B1 (en) * | 2005-12-28 | 2007-05-22 | 동부일렉트로닉스 주식회사 | Method for planarizing copper metallization layer |
JP4906417B2 (en) * | 2006-07-11 | 2012-03-28 | ラピスセミコンダクタ株式会社 | Manufacturing method of semiconductor device |
JP4967110B2 (en) * | 2008-04-24 | 2012-07-04 | スパンション エルエルシー | Manufacturing method of semiconductor device |
WO2012090292A1 (en) | 2010-12-28 | 2012-07-05 | 富士通セミコンダクター株式会社 | Semiconductor device production method |
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2000
- 2000-05-31 JP JP2000163046A patent/JP2001345324A/en not_active Abandoned