JP2001339027A - Boiling cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a boiling/cooling device (heat diffusing block 1) which is hardly restricted by arrangement and excellent in mountability. SOLUTION: In the heat diffusing block 1, a hermetically sealed tank chamber 12 is formed by closing a hollow section formed in the block body 2 of the block 1 with two side plates. The tank chamber 12 is composed of a refrigerant chamber 12A which is largely extended in the transversal and longitudinal directions of the block body 2, and projecting heat radiating spaces 12B which are protruded to the upper part of the chamber 12A. A liquid refrigerant is poured in the chamber 12A to about the full height of the chamber 12A. In addition, a water passage section 15 is formed by closing the hollow section formed between the recessed and projecting sections and upper lid 4 of the block body 2 with two external plates 5 and cooling water flows through the section 15. The vapor of the refrigerant produced when the refrigerant boils and vaporizes upon receiving the heat of heating elements 13 is cooled by the cooling water flowing through the section 15 and condensed into droplets on the internal wall surface of the tank chamber 12 and the droplets return to the liquid refrigerant when the droplets drop into the refrigerant chamber 12A.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a boiling cooling device for cooling a heating element by transferring boiling heat of a refrigerant.

[0002]

2. Description of the Related Art As a prior art, for example, Japanese Patent Application Laid-Open
There is a boiling cooling device disclosed in Japanese Patent No. 4075. This boiling cooling device cools a heating element by the boiling heat transfer of a refrigerant, and can obtain a large heat transfer coefficient as compared with a cooling method such as air cooling or water cooling, so that a semiconductor element having a large heat flux can be cooled. Often used as a device. This boiling cooling device comprises a refrigerant tank for storing a liquid refrigerant, a radiator for cooling the refrigerant vapor boiling by receiving heat from a heating element in the refrigerant tank, and a cooling fan for supplying cooling air to the radiator. It is configured.

[0003]

However, the conventional boiling cooling apparatus has a configuration in which condensation heat transfer with a high heat transfer rate is performed inside the radiator while air cooling with a smaller heat transfer rate is performed outside the radiator. Therefore, the size of the radiator becomes necessary and large due to air cooling. As a result, the arrangement of the boiling cooling device is often restricted, and particularly when the cooling device is mounted on an automobile or the like, it is necessary to dispose it in a limited small space. The present invention has been made based on the above circumstances, and an object of the present invention is to provide a boiling cooling device which is less subject to restrictions on arrangement and has excellent mountability.

[0004]

(Means for Solving the Problems) A boiling cooling apparatus according to the present invention is characterized in that a refrigerant vapor which has been heated and vaporized by the heat of a heating element is exchanged with a liquid. According to the present invention, the refrigerant vapor can be cooled by liquid cooling (for example, water cooling) capable of obtaining a larger heat transfer coefficient than air cooling, so that a large-sized radiator corresponding to air cooling unlike the related art is not required. As a result, the size of the boiling cooling device can be reduced, and the mountability in an automobile or the like can be improved.

According to a second aspect of the present invention, there is provided the boiling cooling apparatus according to the first aspect, wherein a vapor passage through which the refrigerant vapor which has been vaporized by the heat of the heating element flows, and which is provided adjacent to the vapor passage, is provided with a liquid. And a coolant passage through which the fluid flows.
According to this configuration, heat exchange is performed between the liquid (for example, water, oil or the like) flowing through the coolant passage and the refrigerant vapor flowing through the vapor passage, and the heat of the refrigerant vapor is transmitted to the liquid and released to the outside. You.

(3) The boiling cooling device according to (2), further comprising a tank chamber for storing a liquid refrigerant, and an internal space forming a vapor passage above the liquid level in the tank chamber. ing. In this case, the tank chamber and the coolant passage can be provided adjacent to each other, and the two can be integrally formed to reduce the number of components, thereby achieving a reduction in the size of the apparatus.

(Means of Claim 4) In the boiling cooling device according to Claim 2 or 3, the boundary between the tank chamber and the coolant passage is formed in an uneven shape. In this case, most of the heat of the refrigerant vapor is transferred to the liquid through the interface between the tank chamber and the coolant passage. That is, since the boundary surface between the tank chamber and the coolant passage becomes a heat transfer surface, a larger heat transfer area (radiation area) can be secured by forming the boundary surface in an uneven shape. Heat dissipation performance can be improved. Also, compared to the case where the boundary surface between the tank chamber and the coolant passage is flat, when the boiling cooling device is mounted on a moving body such as an automobile, the liquid level fluctuation when the boiling cooling device is tilted can be reduced, The heat radiation performance can be prevented from lowering.

According to a fifth aspect of the present invention, in the boiling cooling apparatus according to the fourth aspect, the height of the convex portion protruding toward the coolant passage is substantially the center of the tank chamber in the left-right direction or the front-rear direction. Section, the highest, and gradually lower on both sides. With this configuration, there is an effect that the liquid level fluctuation when the boiling cooling device is tilted can be further reduced.

According to a sixth aspect of the present invention, in the boiling cooling device according to the fourth or fifth aspect, a fin for increasing a heat radiation area is arranged on an outer surface of the convex portion protruding from the tank chamber side to the coolant passage side. I have. In this case, since the heat radiation area can be increased by the fins, the amount of heat exchange between the refrigerant vapor and the liquid increases, and the heat radiation performance can be improved.

(Claim 7) In the boiling cooling apparatus according to any one of claims 2 to 6, the coolant passage is connected to a coolant circuit having a radiator for heat radiation, and is provided in the coolant circuit. The liquid flows through the coolant passage by the operation of the pump. According to this configuration, the radiator and the boiling cooling device can be separately arranged, so that the degree of freedom in mounting the boiling cooling device is improved.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a cooling apparatus according to the present invention will be described with reference to the drawings. (First Embodiment) FIG. 1 is a sectional view (a) and a plan view (b) of an AA heat diffusion block, and FIG. 4 is an overall configuration diagram of the present system. The boiling cooling device of the present embodiment has a heat diffusion block 1 which is provided in a box shape as a whole and in which a refrigerant is sealed.

As shown in FIG. 1, the heat diffusion block 1 includes a block main body 2, two side plates 3 (see FIG. 3) for closing open surfaces opened on both side surfaces of the block main body 2, and a block main body. The upper cover 4 is fixed to the upper end surface of the block 2, and two outer plates 5 are fixed to both side surfaces of the block body 2. The block main body 2 is provided in a hollow shape penetrating the inside in the up-down direction of FIG. 2 (a), and is provided with an uneven shape on the upper side from the center in the up-down direction shown in FIG. 2 (b). In addition, as shown in FIG. 2B, sealing surfaces 6 are formed on the upper and lower sides of the block main body 2 shown in FIG. The sealing surface 6 is formed lower than the side surface of the block body 2 by the thickness of the side plate 3.

As shown in FIG. 3, the side plate 3 is formed in accordance with the shape of the opening opening on the side surface of the block body 2, and can be closed against the sealing surface 6 described above. The upper lid 4 is provided with the same planar size as the block main body 2, and is fixed to the left and right end faces of the block main body 2 with bolts 8 via seal members 7 as shown in FIG. You. As shown in FIG. 1 (b), the outer plate 5 is fixed to the block body 2 with bolts 10 via sealing members 9 from outside the side plate 3 to both side surfaces of the block body 2 after fixing the upper lid 4 to the block body 2. . Each of the two outer plates 5 has a water passage hole 11 penetrating therethrough in the plate thickness direction, and the water passage hole 11 is provided with a pipe connection port 11a.

The above-mentioned heat diffusion block 1 forms a hermetically sealed tank chamber 12 in which a hollow portion formed inside the block main body 2 is closed by two side plates 3.
After degassing, a predetermined amount of refrigerant is injected into and sealed in 2.
As shown in FIG. 1 (a), the tank chamber 12 has a small vertical width, and a refrigerant chamber 12A that greatly expands in the left-right direction and the front-rear direction of the block body 2, and a convex shape projecting above the refrigerant chamber 12A. Heat radiation space 12B (steam passage of the present invention)
, And the liquid refrigerant is injected to almost the entire height of the refrigerant chamber 12A.

The bottom surface of the heat diffusion block 1 (block body 2
A heating element 13 (see FIG. 1A) is fixed to the bottom surface of the block body 2 with bolts 14, and heat of the heating element 13 is transmitted to the liquid refrigerant in the tank chamber 12 via the bottom surface of the block body 2. Also,
The heat diffusion block 1 includes an uneven portion of the block body 2 and an upper lid 4.
Is closed by the two outer plates 5 to form a water passage portion 15 along the uneven portion. As shown in FIG. 4, the water passage portion 15 is connected to a cooling water circuit 17 via a water pipe 16 connected to a pipe connection port 11a provided on the outer plate 5. The cooling water circuit 17 includes a pump 18 for circulating the cooling water and a radiator 19 for cooling the cooling water by air.

Next, the operation of this embodiment will be described. The liquid refrigerant in the refrigerant chamber 12A receives heat from the heating element 13 transmitted from the bottom surface of the refrigerant chamber 12A, evaporates, and flows into the heat radiation space 12B of the tank chamber 12. On the other hand, cooling water flows through the water passage 15 of the heat diffusion block 1 by the operation of the pump 18. As a result, the refrigerant vapor flowing into the heat radiation space 12B is cooled by the cooling water flowing through the water passage portion 15, condensed on the inner wall surface of the tank chamber 12 forming the heat radiation space 12B, and becomes droplets, and drops into the refrigerant chamber 12A. To return to the liquid refrigerant. The cooling water, which receives heat from the refrigerant vapor and rises in temperature, radiates heat to the atmosphere by the radiator 19 to lower the temperature, and flows through the water passage portion 15 again.

(Effects of the First Embodiment) The heat diffusion block 1 of the present embodiment is configured to condense the refrigerant vapor, which has been heated and boiled by the heat of the heating element 13 and cooled by water cooling, so that the semiconductor having a large heat flux. It is suitable for cooling the heating element 13 having elements and the like. In addition, since a large radiator corresponding to air cooling is not required unlike the related art, the heat diffusion block 1 can be downsized. As a result, there are few restrictions on arranging the heat diffusion block 1, and for example, the mountability to a vehicle or the like where the arrangement space is limited is greatly improved.

The heat diffusion block 1 includes a radiator 19
It is not necessary to integrate the heat diffusion block 1 with the radiator 19 as shown in FIG. 4, so that the restriction on the arrangement does not increase.

Further, in the heat diffusion block 1 of the present embodiment,
Heat exchange is performed between the refrigerant vapor and the cooling water via the boundary surface between the tank chamber 12 and the water passage portion 15. That is, since the boundary surface between the tank chamber 12 and the water passage portion 15 becomes a heat transfer surface,
By making the boundary surface uneven, a larger heat transfer area (heat dissipation area) can be secured. Further, as compared with the case where the boundary surface between the tank chamber 12 and the water passage portion 15 is flat, the liquid level fluctuation in the tank chamber 12 when the heat diffusion block 1 is inclined can be reduced, so that the heat radiation performance due to the liquid level fluctuation can be reduced. Can be prevented from decreasing.

(Second Embodiment) FIG. 5 is a sectional view of the heat diffusion block 1. As shown in FIG. 5, the heat diffusion block 1 according to the present embodiment has a bottom surface of the block main body 2 to which the bottom surface of the refrigerant chamber 12A and the heating element 13 are fixed, except for a portion 20 where a screw hole of the bolt 14 is formed. Is thinned. In this case, as compared with the configuration of the first embodiment, the heating element 1
Since the heat of No. 3 is efficiently transmitted to the liquid refrigerant in the refrigerant chamber 12A, and the boiling heat is properly transmitted by the refrigerant, the heat radiation performance can be improved.

(Third Embodiment) FIG. 6 is a sectional view of the heat diffusion block 1. The heat diffusion block 1 according to the present embodiment has a radiating fin 21 in the water passage portion 15 in addition to the configuration of the second embodiment.
Has been arranged. The heat radiation fins 21 are made of, for example, aluminum, and as shown in FIG.
It is inserted into a concave portion formed between the convex portion 2a and is joined to the outer wall surface of the convex portion 2a by brazing or the like. In this case, since the heat transfer area (heat dissipation area) is increased by the heat dissipation fins 21, the heat dissipation performance can be improved accordingly.

(Fourth Embodiment) FIG. 7 is a sectional view of the heat diffusion block 1. As shown in FIG. 7, in the heat diffusion block 1 of the present embodiment, in addition to the configuration of the third embodiment, the height of the convex portion 2 a of the block body 2 is set in the left-right direction (or the front-back direction) of the tank chamber 12. , The highest in the approximate center, and gradually lower toward both sides. In this configuration, for example, when the heat diffusion block 1 is mounted on a vehicle and the heat diffusion block 1 is tilted during running or the like, the convex portions 2 are formed on both left and right sides of the tank chamber 12.
Since the height of “a” is low, the amount of the refrigerant filled in the inside of the projection 2a (the heat radiation space 12B) is smaller than in the first to third embodiments. As a result, the fluctuation of the liquid level when the heat diffusion block 1 is tilted can be further reduced, and the refrigerant chamber 1 serving as the refrigerant boiling surface
It is easy to prevent the bottom surface of 2A from being covered with the liquid surface, and the heat radiation performance required for cooling the heating element 13 can be maintained.

(Fifth Embodiment) FIG. 8 is a sectional view of the heat diffusion block 1. In the heat diffusion block 1 of the present embodiment, as shown in FIG. 8, an inner plate 22 is disposed in the refrigerant chamber 12A. The inner plate 22 is formed of, for example, a metal plate having good heat conductivity, such as aluminum, and is inserted into and supported by a groove 12a formed on the wall surface of the refrigerant chamber 12A, as shown in FIG. In addition, the inner plate 22
As shown in FIG. 9A, a notch 22a may be provided on one side. Alternatively, as shown in FIG. 9B, a notch 22a may be provided on the other side. In this configuration,
By disposing the inner plate 22 in the refrigerant chamber 12A,
Since the boiling area of the refrigerant chamber 12A can be increased, the heat radiation performance can be improved accordingly.

(Sixth Embodiment) FIGS. 10 to 12 show the appearance of a boiling cooling device, FIG. 10 is a front view of the boiling cooling device, and FIG. 11 is a bottom view of the boiling cooling device (from the side of the mounting surface of the heating element). FIG. 12 is a side view of the boiling cooling device (a plan view as viewed from the side of the heat radiating portion). The boiling cooling device 30 of the present embodiment is used, for example, mounted on an electric vehicle, and is an IGBT constituting an inverter circuit of a traveling motor.
The module (the heating element 31 of the present invention) is cooled. As shown in FIGS. 10 to 12, the boiling cooling device 30 includes a refrigerant container 32 for storing a liquid refrigerant therein, and a radiator for cooling the refrigerant vapor boiling by receiving heat of the heating element 31 in the refrigerant container 32. And a metal material having a high thermal conductivity (for example, aluminum).

The refrigerant container 32 has a vertical thickness (height).
Is a thin hollow body that is small in size and large in the plane direction (width direction and length direction), both ends of which are open in the length direction (left and right direction in FIG. 10), and the inside is partitioned into a plurality of passage portions. ing. Further, at least a passage portion (hereinafter referred to as a steam outflow passage 32) included in a range (a boiling portion) where the heating element 31 is attached.
a) is inserted with the inner fin 34 (see FIG. 13). This inner fin 34 is, for example, shown in FIG.
As shown in FIG. 4 (a) or (b), a plurality of recesses 34a can be provided to increase the heat transfer area (boiling area). The heating element 31 is fixed to the lower surface of the refrigerant container 32 with a bolt 35 in close contact therewith.

The radiator 33 is composed of a pair of tanks (a lower tank 36 and an upper tank 37) and a heat exchange part (described below). As shown in FIG. Is provided. The lower tank 36 is provided in communication with the passage of the refrigerant container 32, and stores the liquid refrigerant together with the refrigerant container 32. Accordingly, the right radiator 33 and the left radiator 33 are arranged such that the lower tanks 36 are in the refrigerant container 32.
The refrigerant vapor boiled in the refrigerant container 32 flows through the vapor outflow passage 32a in both the left and right directions and can flow into the lower tank 36. In addition,
The liquid refrigerant is stored up to a position higher than the upper surface of the refrigerant container 32 (see FIG. 13). That is, the inside of the refrigerant container 32 is filled with the liquid refrigerant.

Inside the lower tank 36, a refrigerant flow control plate 38 is provided as shown in FIGS.
The refrigerant flow control plate 38 is connected to the vapor outflow passage 3 of the refrigerant container 32.
An extension passage portion 3 extending the vapor outflow passage 32 a into the lower tank 36 so that the refrigerant vapor flowing out of the lower tank 36 does not interfere with the condensate flowing back from the radiator 33.
8a (see FIG. 20). Upper tank 37
Is located at the upper part of the heat exchange part, and is provided vertically opposite to the lower tank 36 via the heat exchange part.

As shown in FIG. 13, the heat exchange section includes a plurality of radiating passages 3 communicating the lower tank 36 and the upper tank 37.
9 and a water jacket 40 provided around the heat radiation passage 39, and exchanges heat between the refrigerant vapor flowing through the heat radiation passage 39 and the cooling water flowing through the water jacket 40. As shown in FIG. 15, the heat radiation passage 39 is opened in an elongated rectangular cross section, and the width direction of both tanks 36 and 37 (FIG. 1).
5 left and right directions) at substantially constant intervals.

As shown in FIG. 16, an inner fin 41 is inserted into the heat radiation passage 39. The inner fin 41 is formed by alternately bending a thin metal plate made of, for example, aluminum at a predetermined pitch to form a wavy shape. The inner fin 41 is inserted in one direction (the right direction in FIG. 16) inside the heat radiation passage 39. As a result, the inside of the heat radiation passage 39 has a first passage portion (hereinafter, referred to as a steam passage portion 39 a) generated on the other end side of the inner fin 41 and a second passage portion formed between the pitches of the inner fins 41. Hereinafter, it is referred to as a liquid passage portion 39b).

The water jacket 40 is a passage for flowing cooling water, and is provided so as to surround the periphery of each heat radiation passage 39 and the entire periphery of the heat exchange section as shown in FIGS. It is connected to a circulating cooling water circuit. The cooling water circuit
As shown in FIG. 19, it is used for a water cooling system for cooling a running motor 42 of an electric vehicle with water, and has a pump 43 for circulating cooling water, a radiator 44 for cooling the cooling water by air, and the like. .

Next, the operation of this embodiment will be described. The liquid refrigerant stored in the refrigerant container 32 receives the heat of the heating element 31 and boils, and as shown in FIG. 20, extends from the vapor outflow passage 32a to the extension passage portion 38a formed by the refrigerant flow control plate 38.
Through the lower tank 36. Thereafter, the gas flows from the lower tank 36 into the steam passage portion 39a in the heat radiation passage 39, rises up the steam passage portion 39a, flows into the upper tank 37, and further flows from the upper tank 37 into the inner fin 41.
Into the respective liquid passage portions 39b formed between the pitches.
Here, the refrigerant vapor flowing into the liquid passage portion 39b is cooled by the cooling water flowing through the water jacket 40, and condenses on the surface of the inner fin 41 and the inner wall surface of the heat radiation passage 39 to be liquefied.

The condensed liquid liquefied in the liquid passage 39b is held under the inner fin 41 by surface tension,
As shown in FIG. 6, a liquid pool is formed. Since the liquid reservoir is formed below the inner fin 41, the refrigerant vapor rising from the lower tank 36 is prevented from flowing through the liquid passage 3.
9b can be prevented, and a good refrigerant circulation flow can be formed in the heat radiation passage 39. The condensed liquid accumulated in the liquid pool is sequentially dropped into the lower tank 36 from the liquid pool by the pressure of the refrigerant vapor rising in the vapor passage section 39a.

The boiling cooling device 30 is disposed, for example, with the longitudinal direction of the refrigerant container 32 (the left-right direction in FIG. 10) facing the front-rear direction of the vehicle, and is mounted with the refrigerant container 32 horizontal. In this case, when the vehicle travels on a slope or the like, the refrigerant container 32 is inclined with respect to a horizontal plane. Therefore,
For example, as shown in FIG. 21, when the right side of the refrigerant container 32 is higher than the left side, the refrigerant vapor boiling in the refrigerant container 32 becomes
Above the boiling portion along the slope of the refrigerant container 32 (rightward)
And flows into the lower tank 36 of the radiator 33 on the right side.

Thereafter, as described above, the condensate cooled by the radiator 33 drops into the lower tank 36. At this time,
The condensed liquid dropped into the lower tank 36 from the liquid reservoir is
It mainly flows into the passage portion (called the liquid return passage 32b) in the refrigerant container 32 from both outer sides of the refrigerant flow control plate 38 (see FIG. 22). The condensed liquid that has flowed into the liquid return passage 32b flows into the lower tank 36 of the radiator 33 on the left side as it is along the inclination of the refrigerant container 32, and is returned from the lower tank 36 to the boiling portion in the refrigerant container 32 again. be able to.

(Effects of the present embodiment) The boiling cooling device 30 of the present embodiment is different from the heat diffusion block 1 of the first to fifth embodiments in construction, but receives heat from the heating element 31 and evaporates. Condensing the refrigerant vapor by water cooling is the same. Therefore, it is suitable for cooling the heating element 31 having a semiconductor element having a large heat flux. Also, the refrigerant container 32
The radiators 33 are provided on both sides of the
Even when used in a state where there is a height difference between the three, the heat radiation can be performed by exchanging the refrigerant vapor with the cooling water in at least one of the radiators 33, so that the heat radiation performance does not decrease, and a stable heat radiation performance is obtained. It is possible to secure.

In particular, when the boiling cooling device 30 is mounted on an automobile and used, the attitude of the automobile is not constant. For example, the refrigerant container 32 is inclined when traveling uphill and traveling downhill. Since the directions in which the cooling is performed are opposite, the boiling cooling device 30 of the present embodiment, which can secure stable heat radiation performance regardless of which side is inclined, is extremely effective. The boiling cooling device 30 of the present invention is not limited to the case where it is used by being mounted on an automobile, but may be used by being mounted on a transportation means such as a ship (especially a small ship with a large swing) or a helicopter. good. Alternatively, it may be used on a slope.

[Brief description of the drawings]

FIG. 1A is a sectional view (A) and FIG. 1B is a plan view of a heat diffusion block (first embodiment).

FIG. 2 is a plan view (a) and a side view (b) of a main body block (first embodiment).

FIG. 3 is a plan view (a) and a side view (b) of a state in which a lid is attached to a side surface of a main body block (first embodiment).

FIG. 4 is an overall configuration diagram of the present system.

FIG. 5 is a sectional view of a heat diffusion block (second embodiment).

FIG. 6 is a sectional view of a heat diffusion block (third embodiment).

FIG. 7 is a sectional view of a heat diffusion block (fourth embodiment).

FIG. 8 is a sectional view of a heat diffusion block (fifth embodiment).

FIG. 9 is a sectional view of a tank chamber to which an inner plate is attached (fifth embodiment).

FIG. 10 is a front view of a boiling cooling device (sixth embodiment).

FIG. 11 is a bottom view of a boiling cooling device (sixth embodiment).

FIG. 12 is a side view of a boiling cooling device (sixth embodiment).

FIG. 13 is a sectional view taken along line AA of FIG. 10 (sixth embodiment).

FIG. 14 is a cross-sectional view of a refrigerant container showing an attached state of an inner fin (sixth embodiment).

FIG. 15 is a sectional view taken along line BB of FIG. 12 (sixth embodiment).

FIG. 16 is a sectional view taken along line CC of FIG. 12 (sixth embodiment).

FIG. 17 is a sectional view taken along line DD of FIG. 12 (sixth embodiment);

FIG. 18 is a sectional view taken along line EE of FIG. 12 (sixth embodiment).

FIG. 19 is a cooling water circuit diagram of a water cooling system (sixth embodiment).

FIG. 20 is a sectional view taken along line FF of FIG. 18 (sixth embodiment).

FIG. 21 is a front view of a boiling cooling device showing a state where a refrigerant container is inclined (sixth embodiment).

FIG. 22 is a sectional view taken along line GG of FIG. 18 (sixth embodiment).

[Explanation of symbols]

 (1st to 5th embodiments) 1 heat diffusion block (boiling cooling device) 2a convex portion 12 tank room 12B heat radiation space (steam passage) 13 heating element 15 water passage portion (coolant passage) 17 cooling water circuit (coolant circuit) ) 18 pump 19 radiator 21 radiator fin (sixth embodiment) 30 boiling cooling device 31 heating element 39 radiator passage (steam passage) 40 water jacket (coolant passage) 43 pump 44 radiator

Claims (7)

[Claims] 1. A boiling cooling device for cooling a heating element by transferring boiling heat of a refrigerant, wherein the cooling means vaporizes refrigerant vapor which has been heated and vaporized by receiving heat from the heating element and exchanges heat with a liquid. . 2. The boiling cooling device according to claim 1, wherein a vapor passage through which the refrigerant vapor boiling and vaporized by receiving heat from the heating element is provided, and a cooling passage provided adjacent to the vapor passage and through which the liquid flows. A boiling cooling device comprising a liquid passage. 3. The boiling cooling device according to claim 2, further comprising a tank chamber for storing a liquid refrigerant therein, and an internal space forming the vapor passage above a liquid level in the tank chamber. A boiling cooling device, characterized in that: 4. The boiling cooling device according to claim 2, wherein the boundary between the tank chamber and the cooling liquid passage is formed in an uneven shape. 5. The boiling cooling device according to claim 4, wherein the height of the protrusion protruding toward the coolant passage in the tank chamber is substantially the center of the tank chamber in the left-right direction or the front-rear direction. A boiling cooling device characterized by being provided at the highest and gradually lowering toward both sides. 6. The boiling cooling device according to claim 4, wherein a fin for increasing a heat radiation area is arranged on an outer surface of the projection protruding from the tank chamber side to the coolant passage side. Characterized boiling cooling device. 7. The boiling cooling device according to claim 2, wherein the cooling fluid passage is connected to a cooling fluid circuit having a radiator for heat radiation, and is operated by a pump provided in the cooling fluid circuit. A boiling cooling device, wherein a liquid flows through the cooling liquid passage.