JP2001334461A5 - - Google Patents

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Publication number
JP2001334461A5
JP2001334461A5 JP2000157006A JP2000157006A JP2001334461A5 JP 2001334461 A5 JP2001334461 A5 JP 2001334461A5 JP 2000157006 A JP2000157006 A JP 2000157006A JP 2000157006 A JP2000157006 A JP 2000157006A JP 2001334461 A5 JP2001334461 A5 JP 2001334461A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000157006A
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Japanese (ja)
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JP2001334461A (ja
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Publication date
Application filed filed Critical
Priority to JP2000157006A priority Critical patent/JP2001334461A/ja
Priority claimed from JP2000157006A external-priority patent/JP2001334461A/ja
Publication of JP2001334461A publication Critical patent/JP2001334461A/ja
Publication of JP2001334461A5 publication Critical patent/JP2001334461A5/ja
Pending legal-status Critical Current

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JP2000157006A 2000-05-26 2000-05-26 研磨装置 Pending JP2001334461A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000157006A JP2001334461A (ja) 2000-05-26 2000-05-26 研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000157006A JP2001334461A (ja) 2000-05-26 2000-05-26 研磨装置

Publications (2)

Publication Number Publication Date
JP2001334461A JP2001334461A (ja) 2001-12-04
JP2001334461A5 true JP2001334461A5 (enrdf_load_stackoverflow) 2005-07-07

Family

ID=18661707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000157006A Pending JP2001334461A (ja) 2000-05-26 2000-05-26 研磨装置

Country Status (1)

Country Link
JP (1) JP2001334461A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4259048B2 (ja) * 2002-06-28 2009-04-30 株式会社ニコン コンディショナの寿命判定方法及びこれを用いたコンディショナの判定方法、研磨装置、並びに半導体デバイス製造方法
JP4597634B2 (ja) * 2004-11-01 2010-12-15 株式会社荏原製作所 トップリング、基板の研磨装置及び研磨方法
TWI368555B (en) 2004-11-01 2012-07-21 Ebara Corp Polishing apparatus
JP5306065B2 (ja) * 2009-06-04 2013-10-02 株式会社荏原製作所 ドレッシング装置およびドレッシング方法
JP5896625B2 (ja) * 2011-06-02 2016-03-30 株式会社荏原製作所 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置
CN107695860B (zh) * 2017-11-07 2023-10-20 佛山市高明富东机械制造有限公司 一种大理石板材抛光磨盘装置
US20240139900A1 (en) * 2022-10-27 2024-05-02 Applied Materials, Inc. Acoustic carrier head monitoring

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09285959A (ja) * 1996-04-18 1997-11-04 Hitachi Cable Ltd ウエハの研磨方法
JPH1086056A (ja) * 1996-09-11 1998-04-07 Speedfam Co Ltd 研磨パッドの管理方法及び装置
JPH10315118A (ja) * 1997-05-19 1998-12-02 Toshiba Corp 研磨布ドレッシング装置
JPH10315131A (ja) * 1997-05-23 1998-12-02 Hitachi Ltd 半導体ウエハの研磨方法およびその装置
JP2973404B2 (ja) * 1997-07-11 1999-11-08 株式会社東京精密 ウェーハ研磨装置

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