JP2001334382A - Laser machining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machining device in which the simplification of the structure is realized and the processing performance is improved. SOLUTION: A laser beam B, emitted from an assembly 21 of laser elements where plural laser diode bars 24 are so arranged that their beam emission parts align in series, is condensed in a linear form by a cylindrical lens 22, a pipe member 10 is rotated in the peripheral direction by a driving mechanism 23, and the laser beam B is scanned by sequentially moving the position of the incident beam emitted upon the pipe member 10 via the cylindrical lens 22 in the direction along the irradiated face of the pipe member 10 with the beam and in the direction crossing the longitudinal direction of the beam.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser beam machine.

[0002]

2. Description of the Related Art FIG. 7 shows an example of a conventional laser beam machine. This laser beam machine uses a laser device 1 using a solid medium or a gas medium and a laser beam B emitted from the laser device 1. A beam shaper 4 composed of a beam expander 2 for reducing the divergence angle and a cylindrical lens 3 for condensing the laser beam B;
Having a polygonal mirror 6 rotatable about
A scanning device 7 that can horizontally move a laser beam B incident on a polygon mirror 6 through a mirror, and a tube member that is composed of a toroidal lens 8 and an Fθ lens 9 and that is a target of laser processing of the laser beam B emitted from the polygon mirror 6 The apparatus includes a beam shaper 11 for condensing light on the outer surface of the tube 10 and a moving mechanism 13 having a roller 12 for supporting the tube 10 rotatably in a circumferential direction.

[0003] In a laser beam machine shown in FIG.
The laser beam B is irradiated onto the tube 10 in a planar manner by a combination of the scanning of the laser beam B in the horizontal direction by the moving mechanism 13 and the rotation of the tube 10 in the circumferential direction by the moving mechanism 13, and the surface modification of the tube 10 Various processes such as quality and film removal are performed.

[0004]

However, in the laser beam machine shown in FIG. 7, the irradiation area of the laser beam B emitted from the laser device 1 using a solid medium or a gas medium is small, so that the laser beam machine can be used in various processes. In order to obtain such an irradiation angle, it is necessary to provide the scanning device 7 and the beam shapers 4 and 11 having complicated structures.

The present invention has been made in view of the above circumstances, and has as its object to provide a laser beam machine capable of simplifying the structure of the apparatus and improving the processing ability.

[0006]

According to a first aspect of the present invention, there is provided a laser processing machine comprising: a plurality of semiconductor laser elements having a plurality of semiconductor laser elements arranged such that light emitting portions thereof are arranged in series; Body, an optical element for linearly condensing a laser beam emitted from the laser element assembly, and a laser beam incident position on the object to be processed which is irradiated onto the object through the optical element. And a movement mechanism for displacing the object to be processed so as to be able to sequentially move along the beam and in a direction intersecting the longitudinal direction of the beam.

According to a second aspect of the present invention, there is provided a laser beam machine including a plurality of semiconductor laser elements arranged such that light emitting portions thereof are arranged in series, and a laser beam emitted from the laser element group. An optical element for condensing a beam linearly, and a laser beam incident position irradiated on a processing object via the optical element sequentially moves along a beam irradiation surface of the processing object and in a direction intersecting the beam longitudinal direction. And a moving mechanism for displacing the laser element assembly so as to perform the operation.

In the laser beam machine according to the first aspect of the present invention, a laser beam emitted from a laser element assembly in which a plurality of semiconductor laser elements are arranged in series is condensed linearly by an optical element. The laser beam is displaced by the moving mechanism so that the incident position of the laser beam applied to the processing object sequentially moves in a direction crossing the beam longitudinal direction along the beam irradiation surface of the processing object, and the laser is displaced. Scan the beam.

In the laser beam machine according to a second aspect of the present invention, a laser beam emitted from a laser element assembly having a plurality of semiconductor laser elements arranged in series is condensed linearly by an optical element. By displacing the laser element assembly by the moving mechanism, the incident position of the laser beam applied to the processing object is sequentially moved in a direction crossing the beam longitudinal direction along the beam irradiation surface of the processing object, The laser beam is scanned.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 show a first embodiment of a laser beam machine according to the present invention. In the drawing, portions denoted by the same reference numerals as those in FIG. 7 represent the same components.

This laser processing machine has a laser element assembly 2
1, a cylindrical lens 22, and a moving mechanism 23 for displacing the tube 10 as a processing object.

The laser element assembly 21 is formed by stacking a stack 25 (see FIG. 2) formed by stacking a plurality of laser diode bars 24 such that the light emitting portions 24a of the laser diode bars 24 of each layer are arranged in series. 2
6.

The cylindrical lens 22 has a length corresponding to the laser element assembly 21 and is formed so that the laser beam B emitted from the laser element assembly 21 can be linearly condensed. 21 is attached to the same base 26.

The moving mechanism 23 includes the roller 12 that supports the pipe member 10 so as to be rotatable in the circumferential direction, and a driving mechanism (not shown) that drives the roller 12.

[0016] The laser processing machine shown in FIG.
When performing various processes such as surface modification and film removal of the laser beam, the laser beam B is emitted from the laser element assembly 21 and the laser beam B is linearly condensed by the cylindrical lens 22 and simultaneously moved. By rotating the roller 12 with a driving device (not shown) of the mechanism 23, the incident position of the laser beam B applied to the tube 10 is shifted along the beam irradiation surface of the tube 10 in a direction intersecting the beam longitudinal direction. The laser beam B is scanned while being sequentially moved.

As described above, in the laser beam machine shown in FIG. 1, the laser beam B emitted from the laser element assembly 21 in which a plurality of laser diode bars 24 are arranged in series.
Is focused linearly by the cylindrical lens 22,
The tube mechanism 10 is displaced by the moving mechanism 23 so that the incident position of the laser beam B applied to the tube member 10 sequentially moves in the direction intersecting the beam longitudinal direction along the beam irradiation surface of the tube member 10. Since B is scanned, the structure of the device can be simplified and the processing capability can be improved.

Further, by appropriately increasing or decreasing the number of the laser diode bars 24 constituting the laser element assembly 21, the laser beam B in the irradiation range corresponding to the length of the tube material 10 can be obtained.
Can be obtained.

FIG. 3 shows a second example of the embodiment of the laser beam machine according to the present invention. In the figure, portions denoted by the same reference numerals as those in FIGS. 1 and 2 represent the same items.

This laser processing machine has a laser element assembly 2
1, a cylindrical lens 22, and a moving mechanism 28 capable of displacing the laser element assembly 21 with respect to a flat plate 27 which is an object to be processed.

The laser element assembly 21 and the cylindrical lens 22 are mounted on a base 30.

The moving mechanism 28 includes a guide member 29 for guiding the board 30 in the vertical direction, and an elevating mechanism (not shown) for moving the board 30 up and down.

With the laser beam machine shown in FIG.
When performing various processes such as surface modification and film removal of 7, the laser beam B is emitted from the laser element assembly 21, and the laser beam B is condensed linearly by the cylindrical lens 22. The platform 30 is vertically displaced along the guide member 29 by an elevating mechanism (not shown) of the moving mechanism 28 so that the incident position of the laser beam B applied to the flat plate 27 is adjusted to the beam of the flat plate 27. The laser beam B is scanned by sequentially moving in the direction intersecting the beam longitudinal direction along the irradiation surface.

As described above, in the laser beam machine shown in FIG. 3, the laser beam B emitted from the laser element assembly 21 in which the plurality of laser diode bars 24 are arranged in series.
Is focused linearly by the cylindrical lens 22,
The incident position of the laser beam B applied to the flat plate material 27 is
Since the laser element assembly 21 is displaced by the moving mechanism 28 to scan the laser beam B so as to sequentially move in the direction intersecting the beam longitudinal direction along the beam irradiation surface of the flat plate member 27, the apparatus structure is simplified. And improvement of processing capacity can be achieved.

Further, by appropriately increasing or decreasing the number of the laser diode bars 24 constituting the laser element assembly 21, the laser beam B in the irradiation range corresponding to the width of the flat plate member 27 can be obtained.
Can be obtained.

Further, instead of the laser element assembly 21 shown in FIGS. 1 and 3, laser element assemblies 31, 41 and 51 as shown in FIGS. 4 to 6 may be used.

The laser element assembly 31 is arranged so that the plurality of laser diode bars 24 correspond to the shape of a cylindrical convex lens 32 which is a condensing means of the laser beam B when viewed from the side in the emission direction of the laser beam B. Are stacked on a convex curved surface to form a stack 33.
To the light emitting portion 24a of the laser diode bar 24 of each layer.
(See FIG. 2) so that the base plates 26 and 3 are arranged in series.
0 (see FIGS. 1 and 3), and the incidence of a laser beam B that is linearly applied to the flat plate material 27 or the tube material 10 (see FIG. 1) as an object to be processed through the cylindrical convex lens 32 The position is scanned by movement of the base 30 or displacement of the tube 10 in the circumferential direction by the movement mechanism 23 (see FIG. 1).

The laser element assembly 41 includes a plurality of laser diode bars 24 corresponding to the shape of a cylindrical convex lens 42 as a laser beam B condensing means, as viewed from the side in the emission direction of the laser beam B. A stack 43 is formed by radially stacking laser beams B emitted from the light emitting portions 24a (see FIG. 2) of the laser diode bar 24, and the stack 43 is combined with the light emitting portions 24a of the laser diode bar 24 of each layer. Are arranged on the base plates 26 and 30 (see FIGS. 1 and 3) so as to be arranged in series, respectively, and are passed through the cylindrical convex lens 42 to the flat plate material 27 or the tube material 10 (see FIG. The incident position of the laser beam B irradiated linearly is
Scanning is performed by movement of the base plate 30 or displacement of the tube material 10 in the circumferential direction by the movement mechanism 23 (see FIG. 1).

The laser element assembly 51 is configured so that the plurality of laser diode bars 24 correspond to the shape of a cylindrical concave lens 52 which is a condensing means of the laser beam B when viewed from the side in the emission direction of the laser beam B. Are stacked on a concave curved surface to form a stack 53.
To the light emitting portion 24a of the laser diode bar 24 of each layer.
(See FIG. 2) so that the base plates 26 and 3 are arranged in series.
0 (see FIGS. 1 and 3), and the incidence of a laser beam B that is linearly irradiated on the flat plate material 27 or the tube material 10 (see FIG. 1) as a processing object through the cylindrical concave lens 52 The position is scanned by movement of the base 30 or displacement of the tube 10 in the circumferential direction by the movement mechanism 23 (see FIG. 1).

These laser element assemblies 31, 41, 5
In 1, the stacks 33, 43, and 53 stacked on the plurality of laser diode bars 24 are used so as to correspond to the shapes of the lenses 32, 42, and 52. Becomes possible.

Further, the laser element assembly 5 shown in FIG.
As a modification of the first embodiment, a plurality of laser diode bars 24 are provided.
Is viewed from the side in the emission direction of the laser beam B, the cylindrical concave lens 52 which is a condensing means of the laser beam B
So that the laser beam B emitted from the light emitting portion 24a of each laser diode bar 24 expands in accordance with the shape of
A configuration in which a stack is formed by radially stacking is also possible.

The laser beam machine according to the present invention is not limited to the above-described embodiment. For example, the laser beam machine shown in FIGS. Alternatively, the arrangement of the entire apparatus may be changed so that the laser beam is emitted downward, and other changes may be made without departing from the scope of the present invention.

[0033]

As described above, according to the laser beam machine of the present invention, the following various excellent effects can be obtained.

(1) In the laser beam machine according to the first aspect of the present invention, a laser beam emitted from a laser element assembly in which a plurality of semiconductor laser elements are arranged in such a manner that their light emitting portions are arranged in series is optically converted. The beam is condensed linearly by the element, and the incident position of the laser beam irradiated to the processing object through the optical element is sequentially moved along the beam irradiation surface of the processing object and in a direction intersecting the beam longitudinal direction by the moving mechanism. Since the object to be processed is displaced so as to be movable, the structure of the apparatus can be simplified and the processing capability can be improved.

(2) In the laser beam machine according to the second aspect of the present invention, a laser beam emitted from a laser element assembly in which a plurality of semiconductor laser elements are arranged in such a manner that their light emitting portions are arranged in series is used. The beam is condensed linearly by the element, and the incident position of the laser beam irradiated to the processing object through the optical element is sequentially moved along the beam irradiation surface of the processing object and in a direction intersecting the beam longitudinal direction by the moving mechanism. Since the laser element assembly is displaced so as to be movable, the structure of the device can be simplified and the processing capability can be improved.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram showing a first example of an embodiment of a laser beam machine according to the present invention.

FIG. 2 is a perspective view showing a stack related to FIG. 1;

FIG. 3 is a conceptual diagram showing a second example of the embodiment of the laser beam machine according to the present invention.

FIG. 4 is a conceptual diagram showing another example of a laser element assembly used for the laser beam machine of the present invention.

FIG. 5 is a conceptual diagram showing another example of the laser element assembly used in the laser beam machine according to the present invention.

FIG. 6 is a conceptual diagram showing another example of a laser element assembly used in the laser beam machine of the present invention.

FIG. 7 is a conceptual diagram showing an example of a conventional laser beam machine.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Tube material (workpiece) 21, 31, 41, 51 Laser element assembly 22 Cylindrical lens (optical element) 23 Moving mechanism 24 Laser diode bar (semiconductor laser element) 27 Plate material (workpiece) 28 Moving mechanism

Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court II (Reference) H01S 5/40 H01S 5/40 (72) Inventor Seiji Fukutomi 3-1-1-15 Toyosu, Koto-ku, Tokyo Ishikawajima-Harima Heavy Industries Co., Ltd. Tokyo Engineering Center (72) Inventor Yoshihisa Yamauchi 3-1-1, Toyosu, Koto-ku, Tokyo Ishikawajima-Harima Heavy Industries, Ltd. Tokyo Engineering Center F-term (reference) 4E068 CD05 CE02 CE04 5F073 AB02 AB27 BA09

Claims (2)

[Claims] A laser element assembly in which a plurality of semiconductor laser elements are arranged such that light emitting portions thereof are arranged in series; an optical element for condensing a laser beam emitted from the laser element assembly in a linear manner; A moving mechanism for displacing a processing object so that a laser beam incident position irradiated on the processing object via the optical element can be sequentially moved along a beam irradiation surface of the processing object and in a direction intersecting a beam longitudinal direction. And a laser beam machine. 2. A laser element assembly in which a plurality of semiconductor laser elements are arranged such that light emitting portions thereof are arranged in series, an optical element for condensing a laser beam emitted from the laser element assembly in a linear manner, Movement for displacing the laser element assembly such that the incident position of the laser beam irradiated onto the object through the optical element can be sequentially moved along the beam irradiation surface of the object and in a direction intersecting the longitudinal direction of the beam. A laser processing machine comprising a mechanism.