JP2001332530A5 - - Google Patents
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- JP2001332530A5 JP2001332530A5 JP2000196861A JP2000196861A JP2001332530A5 JP 2001332530 A5 JP2001332530 A5 JP 2001332530A5 JP 2000196861 A JP2000196861 A JP 2000196861A JP 2000196861 A JP2000196861 A JP 2000196861A JP 2001332530 A5 JP2001332530 A5 JP 2001332530A5
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000196861A JP4305707B2 (ja) | 2000-03-14 | 2000-06-29 | 基板の製造方法および半導体装置の製造方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000070521 | 2000-03-14 | ||
JP2000-70521 | 2000-03-14 | ||
JP2000196861A JP4305707B2 (ja) | 2000-03-14 | 2000-06-29 | 基板の製造方法および半導体装置の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006308576A Division JP2007088503A (ja) | 2000-03-14 | 2006-11-15 | 半導体発光素子 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001332530A JP2001332530A (ja) | 2001-11-30 |
JP2001332530A5 true JP2001332530A5 (nl) | 2006-12-28 |
JP4305707B2 JP4305707B2 (ja) | 2009-07-29 |
Family
ID=26587451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000196861A Expired - Fee Related JP4305707B2 (ja) | 2000-03-14 | 2000-06-29 | 基板の製造方法および半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4305707B2 (nl) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8138002B2 (en) | 2008-08-21 | 2012-03-20 | Sony Corporation | Semiconductor light-emitting element, fabrication method thereof, convex part formed on backing, and convex part formation method for backing |
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2000
- 2000-06-29 JP JP2000196861A patent/JP4305707B2/ja not_active Expired - Fee Related