JP2001329392A - Method for manufacturing electroforming die and method for manufacturing ink-jet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electroforming die by which the organic die part of a nozzle forming member is forward-tapered with good controllability. SOLUTION: According to the method of this invention for manufacturing an ink-jet head, a photosensitive film is first deposited on a substrate, and a light-shielding film is deposited on the photosensitive film. Meanwhile, a diffused light is projected from above the light-shielding film, and a forward- tapered electroforming die is formed with the optional part exposed by the development by the diffused light left. Subsequently, an electroformed film is accumulated by electroforming, an ink-repellent surface film is deposited on the electroformed film, the substrate and electroforming die are removed, and a nozzle hole having a reverse-tapered section is formed with a discharge face directed upward.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electroforming mold and a method for manufacturing an ink jet head. More specifically, the present invention relates to a method for manufacturing an ink jet head. The present invention relates to a method for manufacturing the provided inkjet head.

[0002]

2. Description of the Related Art A drop-on-demand (DOD) type ink jet recording apparatus used in a printer, a facsimile, a copying machine, or the like, includes, for example, a plurality of nozzles for discharging ink droplets, a liquid chamber in which the nozzles communicate, and an ink in the liquid chamber. Using an ink-jet head equipped with an energy generating means consisting of a thermo-mechanical conversion element such as a piezoelectric element or a thermo-resistor (heater) such as a piezoelectric element for applying pressure,
Only when a recording signal is input, ink droplets are ejected from nozzles to fly, and high-speed, high-resolution recording is performed.

In such an ink-jet head, recording is performed by driving an energy generating means such as a heater or a piezoelectric element so that ink droplets are ejected and ejected from a nozzle to perform recording. Affects the ink droplet ejection performance, and the characteristics of the surface of the nozzle member affect the ink droplet ejection performance. For example, if ink adheres to the periphery of the nozzle and an uneven ink pool is generated, the ejection direction of the ink droplet is bent, the size of the ink droplet varies, or the flying speed of the ink droplet becomes unstable. It is known that inconveniences such as becoming occur.

Therefore, it is conventionally known to improve the uniformity by forming a surface layer having water repellency (ink repellency) on the surface of the nozzle forming member (the ejection surface of the nozzle hole). As a method for forming the water-repellent film, a method of applying a water-repellent such as a fluorine-based water-repellent (JP-A-55-65564), a method of forming a water-repellent layer by fluorinated polymer eutectoid plating, and the like. (JP-A-63-3963 (hereinafter referred to as Conventional Example 1) and JP-A-4-294145 (hereinafter referred to as Conventional Example 2).

Here, a method for forming a nozzle forming member and a water-repellent surface layer when the electroforming method disclosed in the above-mentioned conventional example 1 is used will be described. FIG. 12 is a schematic view of the vicinity of a nozzle hole in a manufacturing process of a nozzle forming member in Conventional Example 1. The nozzle forming member is formed by electroforming a metal film, and the water-repellent layer film is formed of metal and polytetrafluoroethylene (hereinafter PTFE).
). FIG.
(A), the substrate 201 on which the release layer 202 is formed
A dry film resist 203 is patterned at a position corresponding to the upper nozzle hole. In FIG. 12B, a metal film 204 is formed by an electrodeposition method, and thereafter, a metal plating layer 205 containing a tetrafluoride resin is continuously formed. In FIG. 12C, the release layer 202 and the substrate 201 are removed, and the nozzle forming member is completed. At this time, the opening that has been in contact with the substrate 201 side becomes the ink inlet 207, and the opening corresponding thereto becomes the ink discharge port 206. In the first conventional example, it is necessary to control the diameter of the ink discharge port 206 and to suppress the variation at the time of forming the water-repellent layer film 205 in the vicinity thereof in order to suppress the variation in the ejection performance of the ink droplet.

Next, a nozzle forming member disclosed in the above-mentioned conventional example 2 will be described. FIG. 13 is a sectional view of a nozzle forming member of Conventional Example 2. In the drawing, the nozzle forming member of Conventional Example 2 includes a nozzle forming member 301, an ink flow path 302, an ink-repellent surface treatment layer 303 on an ink discharge surface, and an ink discharge port 304. . The nozzle forming member 301 is formed by a pressing method or an electroforming method, and
As can be seen from FIG. 3, it has an inverse tapered shape with respect to the ejection surface.

Next, as a conventional example 3, a general method of forming a nozzle forming member and an ink-repellent surface layer when an electroforming method is used will be described. FIG. 14 is a schematic view of the vicinity of a nozzle hole in a manufacturing process of a nozzle forming member of Conventional Example 3. Conventional example 3
Is formed by electroforming a metal film, and the ink-repellent layer film is formed by eutectoid plating of metal and PTFE. In FIG. 14A, an organic resist 302 is patterned on a conductive substrate 301 at a position corresponding to a nozzle hole. Further, the metal film 303 of the nozzle forming member is isotropically formed by electroforming. In FIG. 14B, the substrate 301 and the organic resist 302 are removed, and a nozzle forming member 303 is prepared. At this time, the opening that has been in contact with the substrate 301 side generally serves as the ink ejection port 307, and the opening opposite thereto serves as the ink inlet 308. (C) of FIG.
In FIG. 14, after the surface of the metal film 303 is sealed with the seal member 304, the organic film 305 and the like are packed from the ink inflow port 308 side, and the seal member is removed. An eutectoid plating film 306 of metal and PTFE is formed by an electrolytic eutectoid plating method or the like. In FIG. 14E, the organic film 305 is removed, and a nozzle forming member having an ink-repellent surface layer is completed.

[0008]

However, according to the above-mentioned prior art example 1, the nozzle holes are arranged with respect to the ink ejection direction.
It has a straight shape. Therefore, in Conventional Example 1, the ink meniscus position is not stable, and the ejection direction varies. Further, since the diameter of the ink inlet and the diameter of the ink discharge port are the same, when the diameter of the discharge port is reduced to 25 μm or less in order to perform high-definition printing, the resistance in the nozzle hole increases and is given by the energy generating means. This leads to loss of discharge energy. Further, in Conventional Example 2, there is no description of a method of processing a nozzle hole into an inverted tapered shape by electroforming. According to Conventional Example 3, in the step of forming the ink-repellent surface layer, the seal member 304 and the organic film 305 shown in FIG.
Must be formed, resulting in a long process and an increase in cost. Also, the opening diameter Z of the ink inlet 308 is Z =
2X + Y, which is much larger than the ejection diameter, making it difficult to achieve high integration of the inkjet head, that is, high definition and high speed. For example, the discharge port diameter Y is 25 μm and the film thickness X is 50
If it is set to μm, the ink inlet diameter Z becomes 125 μm, and it becomes impossible to manufacture an inkjet head having an arrangement of 200 dpi or more.

The present invention has been made to solve these problems, and a first object of the present invention is to form an organic tapered portion of a nozzle forming member into a forward taper with good controllability by an exposure technique using diffused light. It is to process into a shape. The second purpose is
Since the organic mold portion was processed into a forward tapered shape with good controllability, the reverse tapered nozzle hole matched to the organic mold portion was formed with good controllability by electroforming, stabilizing the position of the ink meniscus, The purpose of the present invention is to suppress variations in the injection direction. A third object is to form a nozzle hole having a small discharge port diameter and a moderately large inlet port diameter, and to suppress the loss of discharge energy given by the energy generating means. A fourth object is to form a nozzle forming member and an ink-repellent surface layer by a continuous electroforming method (plating method), to reduce the number of steps, improve product yield, and supply an inexpensive inkjet head. It is in. A fifth object is to form a nozzle hole mold by an exposure technique, so that the resolution limit of the photosensitive film is minute, so that a fine ejection opening of 25 μm or less can be easily formed, and the inkjet head can be formed. It is to perform high speed and high density (high definition). In addition, as a supplementary explanation, the forward tapered shape of the mold portion is that the diameter of the upper portion of the organic mold portion corresponding to the discharge port side is smaller than the diameter of the lower portion of the mold portion corresponding to the inflow side, It also means that the slope is relatively straight. In addition, the inverted tapered shape of the nozzle hole means that the diameter of the discharge port is smaller than the diameter of the inflow port, and that the slope is relatively straight.

[0010]

According to the present invention, there is provided an electroforming mold manufacturing method for manufacturing an electroforming mold in which a photosensitive film is formed on a substrate. A light-shielding film is formed on the non-conductive film. Then, a diffused light is irradiated from above the light-shielding film, and a forward tapered electroforming mold in which an arbitrary portion exposed by the developing process using the diffused light remains is formed. Therefore, the electroforming mold of the nozzle forming member can be processed into a forward tapered shape with good controllability.

According to another aspect of the present invention, there is provided a nozzle forming member having a nozzle hole for discharging ink, a liquid chamber communicating with the nozzle hole, and energy generating means for pressurizing the ink in the liquid chamber. According to the ink jet head manufacturing method of manufacturing an ink jet head for recording on a recording medium by ejecting ink droplets from a nozzle hole and pressurizing ink in a liquid chamber by an energy generating means based on an input, a photosensitive material is exposed on a substrate. A light-shielding film is formed on the photosensitive film. Then, a diffused light is irradiated from above the light-shielding film to form a forward tapered electroforming mold in which an arbitrary portion exposed by the developing process using the diffused light remains. Then, an electroformed film is deposited by an electroforming method, an ink-repellent surface film is formed on the electroformed film, the substrate and the electroforming mold are removed, and the cross-sectional shape is an inverted tapered shape with the ejection surface facing upward. Is formed. Therefore, the electroforming mold of the nozzle forming member is processed into a forward tapered shape with good controllability, and the reverse tapered nozzle hole matched to the electroforming mold can be formed with good controllability by the electroforming method. In addition to stabilizing the position and suppressing variations in the ejection direction, a nozzle hole having a small discharge port diameter and a moderately large inlet diameter can be formed, and loss of discharge energy given by the energy generation means can be suppressed.

Further, since the photosensitive film is a negative type, first, deformation during electroforming can be suppressed as compared with a general positive type mold material. Secondly, in the case of making the nozzle hole into a forward tapered shape, it is desirable that the region where the light is incident remains according to the principle of diffused light, and the cross-linking reaction is promoted and the remaining negative type forms a forward tapered type. Can be easily done. Third, the shape retention of the mold at the time of development is superior to that of the positive mold.
This is remarkable when the thickness is more than μm.

The diffused light is obtained by making parallel light incident on a diffuser plate, and the diffused angle of the diffused light is set according to the taper angle of the electroforming mold.
An inkjet head having a desired reverse taper angle can be provided.

[0014]

According to the method of manufacturing an ink jet head of the present invention, a photosensitive film is formed on a substrate, and a light-shielding film is formed on the photosensitive film. Then, a diffused light is irradiated from above the light-shielding film to form a forward tapered electroforming mold in which an arbitrary portion exposed by the developing process using the diffused light remains. Then, an electroformed film is deposited by an electroforming method, an ink-repellent surface film is formed on the electroformed film, the substrate and the electroforming mold are removed, and the cross-sectional shape is an inverted tapered shape with the ejection surface facing upward. Is formed.

[0015]

FIG. 1 is a sectional view showing a manufacturing process of a nozzle forming member in an ink jet head according to a first embodiment of the present invention. In FIG. 1A, a photosensitive film 1002 which is a photoresist is disposed on a substrate 1001 having an arbitrary conductive or conductive film. Photosensitive film 1
002 may be a liquid coating type resist or a dry film type resist. In FIG. 1B, a light-shielding film 1003 having a hole corresponding to a nozzle hole
And a photosensitive film 1002 are arranged in close contact with each other, and a diffusion plate 1005 is arranged on a photomask 1004. Parallel light 100 required for exposure from above diffusion plate 1005
6 is incident. In FIG. 1 (b), since a photocurable negative type is used as the photosensitive film, an arbitrary portion of the photosensitive film on which light is incident undergoes a crosslinking reaction and is cured. In FIG. 1B, the photosensitive film 100
2 and the light-shielding film 1003 on the photomask 1004 do not necessarily have to be in close contact with each other, and a light-transmitting film or the like may be present therebetween, or a space may be provided. However, it is desirable that the interval be controlled. In (c) of FIG. 1, an arbitrary portion exposed to light by the development processing remains,
It becomes an organic mold part 1007 for electroforming. At this time, since the light incident in FIG. 1B passes through the diffusion plate 1005, it becomes diffused light, and the organic mold part 10 for electroforming is used.
07 has a forward tapered shape from about 1 degree to about 40 degrees with respect to the vertical direction of the substrate surface. Next, FIG.
In, an electroformed film 1008 constituting the nozzle forming member is deposited by an electroforming method. At this time, a nickel film, a nickel-cobalt film, a copper film, or the like is used as the electroformed film 1008. Thereafter, in FIG. 1E, a surface film 1009 having ink repellency is formed. Surface coating 1
As 009, it is desirable that an eutectoid film of nickel and PTFE is deposited by an eutectoid plating (electroforming) method. Next, in FIG. 1F, the substrate 1001 is removed,
The nozzle forming member having the ink-repellent surface film 1009 formed thereon is completed. At this time, the shape of the obtained nozzle hole is
According to the shape of the organic mold part 1007 for electroforming, a controlled reverse taper shape of about 1 degree to about 40 degrees can be obtained with the ejection surface facing upward. In general, the nozzle forming member is then heat-treated to improve ink repellency and ink corrosion resistance.

Next, FIG. 2 is a sectional view of an ink jet head using the nozzle forming member shown in FIG. An energy generating means 402 is formed on a substrate 401 made of Si or the like. The energy generation means 402 is an electromechanical conversion element such as a piezoelectric element or an electrostatic element. On top of this, a vibration plate 403 is provided, and a pressure chamber 405 is partitioned by a liquid chamber constituting member 404 such as Si. The nozzle forming member shown in FIG. 1 is disposed thereon. In FIG. 2, ink is supplied from an ink supply port 406, and is supplied to a pressure chamber 405 through a fluid resistance part 407. Then, the energy is supplied from the energy generation means 402 to the pressure chamber 405.
Is transmitted to the ink inside the nozzle hole 408 of the nozzle forming member.
More ink is ejected. In the above description, an electromechanical transducer is used as the energy generating means. However, the present invention is not limited to this, and a thermomechanical transducer such as a thermal resistor (heater) may be used.

FIG. 3 is a sectional view showing a manufacturing process of a nozzle forming member in an ink head jet according to a second embodiment of the present invention. In the figure, the formation of the nozzle forming member is shown, but the present invention is not limited to the nozzle forming member, and may be used for, for example, an ink supply portion, for example, an ink pressure chamber or an ink flow path generally provided on an energy generating means. Can be. Further, an arbitrary portion of the photosensitive film formed by the diffused light can be used as a constituent member of the inkjet head. In FIG. 3A, a photosensitive film 2002 is disposed on a substrate 2001 having an arbitrary conductive or conductive film. The photosensitive film 2002
A liquid coating type resist or a dry film type resist may be used. In FIG. 3B, in an exposure apparatus such as a contact type alignment exposure apparatus, a light-shielding film 2003 having a hole corresponding to a nozzle hole and a photosensitive film 2002 are arranged so as to be in close contact with each other.
A diffusion plate 2005 is arranged on the 004. A parallel light 2006 enters a mask 2004 through a diffusion plate 2005 from a light source (not shown). Note that in FIG. 3B, the photosensitive film 2002 and the light-shielding film 2003 of the photomask 2004 do not necessarily have to be in close contact with each other, and a light-transmitting film or the like may be present therebetween, There may be. However, it is desirable that the interval be controlled. FIG. 3C shows the details of the process of FIG. 3B. The parallel light 2006 is changed to the diffused light 2007 by passing through the diffuser 2005. Here, FIGS. 4A and 4B are schematic diagrams showing the change in the angle of the outgoing light with respect to the incident light by the type of the diffusion plate, and the angle of the outgoing light with respect to the incident light depends on the type of the diffusion plate. , 0 to 60 degrees. Therefore, in FIG. 3D, the tapered shape of the exposed region 2008, that is, the taper angle can be arbitrarily selected. In FIG. 3E, the unexposed areas are selectively removed by a developing process using a developing solution, and the electroforming mold of the present invention is completed. In addition, as shown in FIG. 4A, the taper angle θ of the electroforming mold is set to be perpendicular to the substrate surface.
As shown in FIG. 4B, when a 20-degree diffusion plate is used, a tapered shape of about 1 to 10 degrees is obtained depending on the exposure amount, and when a 30-degree diffusion plate is used. The taper shape of about 1 to 20 degrees is obtained depending on the exposure amount, and when a diffuser 60 degree product is used, 10 to 10 degrees depends on the exposure amount.
A tapered shape of about 40 degrees was obtained. The reason that the taper angle changes depending on the exposure amount is due to the progress of the crosslinking reaction.

Next, specific examples and comparative examples of the present invention will be described. (Specific Example 1) As the substrate 1001 in FIG.
The photosensitive film 1002 was a negative type dry film resist having a thickness of 40 μm. Light shielding film 1
The opening diameter of the portion corresponding to the nozzle hole of No. 003 was 22 μm, and as the diffusion plate 1005, a diffusion plate manufactured by NABA Co., Ltd., which can obtain diffused light of 0 to 20 degrees, and a beam shaping diffuser LSD20 series were used. The organic mold part 1007 for electroforming is manufactured by using a contact type alignment exposure machine and adjusting the exposure amount incident on the photomask 1004 via the diffusion plate 1005 to 100 to 1000 in terms of a wavelength of 365 nm.
An organic mold part 1007 for electroforming was manufactured by changing to mJ / cm ² . Using the above members, an organic mold part for electroforming was manufactured by the manufacturing process shown in FIG. 3, and a nozzle forming member was manufactured by using the organic die portion by the manufacturing process shown in FIG. 1, and shown in FIG. An inkjet head was manufactured. The finished outlet diameter of the nozzle hole was 25 μm.

(Specific Example 2) As the substrate 1001 in FIG.
A 625 μm thick Si substrate was used, and a conductive TiSi ₂ film was disposed on the Si substrate. As the photosensitive film 1002, a negative dry film resist having a thickness of 40 μm was used. The opening diameter of the portion corresponding to the nozzle hole of the light-shielding film 1003 is 20 μm.
A beam shaping diffuser LSD30 series manufactured by NABA Co., Ltd., which can obtain 0 degree diffused light, was used. The organic mold part 1007 for electroforming is manufactured by using a contact type alignment exposure machine and changing the exposure amount incident on the photomask 1004 via the diffusion plate 1005 to 100 to 1000 mJ / cm ^{2 in} terms of a wavelength of 365 nm. An organic mold part 1007 for casting was produced. Using the above members, an organic mold part for electroforming was manufactured by the manufacturing process shown in FIG. 3, and a nozzle forming member was manufactured by using the organic die portion by the manufacturing process shown in FIG. 1, and shown in FIG. An inkjet head was manufactured. The finished outlet diameter of the nozzle hole was 25 μm.

(Specific Example 3) As the substrate 1001 in FIG.
A 1 mm thick SUS substrate was used, and a negative dry film resist 40 μm thick was used as the photosensitive film 1002. The opening diameter of the portion corresponding to the nozzle hole of the light-shielding film 1003 is 18 μm.
A beam shaping diffuser LSD60 series manufactured by NABA Co., Ltd., which can obtain 0 degree diffused light, was used. The organic mold part 1007 for electroforming is manufactured by using a contact type alignment exposure machine and changing the exposure amount incident on the photomask 1004 via the diffusion plate 1005 to 100 to 1000 mJ / cm ^{2 in} terms of a wavelength of 365 nm. An organic mold part 1007 for casting was produced. Using the above members, an organic mold part for electroforming was manufactured by the manufacturing process shown in FIG. 3, and a nozzle forming member was manufactured by using the organic die portion by the manufacturing process shown in FIG. 1, and shown in FIG. An inkjet head was manufactured. The finished outlet diameter of the nozzle hole was 25 μm.

(Comparative Example) As a comparative example, an organic mold part for electroforming was manufactured without using diffused light, a nozzle forming member was manufactured using the same, and an ink jet head was manufactured using the nozzle forming member. An example of fabrication is shown. Substrate 1001 in FIG.
SUS substrate 1mm thick, photosensitive film 10
As 02, a negative dry film resist having a thickness of 40 μm was used. The opening diameter of the portion corresponding to the nozzle hole of the light-shielding film 1003 was set to 27 μm in order to make the outlet diameter of the finished nozzle hole equal to that of the first and second examples. No diffuser plate was used. The production of the organic mold part 1010 for electroforming is as follows.
Using a contact type alignment exposure machine, the exposure amount incident on the photomask is 100 to 1000 m in terms of a wavelength of 365 nm.
The organic mold part 1010 for electroforming was manufactured by changing to J / cm ² . Using the above members, an organic mold part for electroforming and a nozzle forming member were manufactured by the manufacturing process shown in FIG.
Was manufactured. The finished outlet diameter of the nozzle hole was 25 μm.

Next, FIG. 6 shows the relationship between the taper angle of the organic mold part θ for electroforming and the exposure amount obtained in the specific examples 1 to 3 and the comparative example. FIG. 7 shows the relationship between the taper angle θ of the nozzle hole of the nozzle forming member and the exposure amount obtained in Specific Examples 1 to 3 and Comparative Example. In FIG. 6, it can be seen that the taper angle θ of the organic mold part for electroforming can be controlled to an arbitrary taper angle depending on the type of the diffusion plate and the exposure amount. In FIG. 7, the taper angle θ of the nozzle hole of the nozzle forming member is obtained in accordance with the taper angle θ of the organic mold part for electroforming, so that the taper angle of the nozzle hole can be controlled. Understand. FIG. 8 shows a schematic diagram of a cross-sectional shape near the nozzle hole of the nozzle forming member manufactured according to the first specific example. FIG. 9 shows a schematic diagram of a cross-sectional shape near a nozzle hole of a nozzle forming member manufactured according to a comparative example. In both cases, the diameter of the discharge port is 25 μm, and the diameter of the inflow port is 43 μm in the specific example 1 according to the present invention, and the comparative example has a straight shape of 25 μm. In FIG. 8, the reason for having a slight roundness near the discharge port is that electroforming proceeds along the organic mold part for electroforming from the inflow side,
This is characteristic when a tapered shape is formed. Using the nozzle forming member shown in FIGS. 8 and 9, the ink jet head shown in FIG. 2 was manufactured, and the result of comparing the ejection performance using the black pigment ink is shown in FIG. Note that an electrostatic electromechanical transducer was used as the energy generating means. As can be seen from FIG. 10, in Example 1, the resistance of the nozzle portion was calculated to be 4.5E12 Pa · s / m ³ , and in the comparative example, the resistance of the nozzle portion was calculated to be 1.0E13 Pa · s / m ³ .
s / m ³ . In FIG. 10, the specific example 1 shows an improvement in the injection speed due to the lower resistance of the nozzle hole compared to the comparative example. This indicates that the energy loss from the energy generating means is suppressed. Further, the yield in the injection direction was almost 100%, and the yield reduction seen in the comparative example did not occur. This is because the diameter decreases from the inflow port to the discharge port, and the direction is narrowed. Further, high-frequency operation is possible up to a high frequency region as compared with the comparative example. Generally, when designing the ejection performance, it is necessary to control the ratio between the resistance component of the ink supply port and the resistance component of the nozzle portion, and when the resistance of the nozzle portion is high, the ink is adjusted accordingly. It is also necessary to increase the resistance of the supply port. In that case,
As shown in FIG. 10, in the comparative example, since the resistance of the nozzle portion is high, it is necessary to increase the resistance of the ink supply port portion in accordance with the high resistance, which makes it difficult to operate at a high frequency. On the other hand, in Example 1, since the resistance of the nozzle portion is relatively low, the resistance of the ink supply port portion can be designed to be low, and the operating range in a high frequency region is widened.

Here, the reason why it is difficult to process a negative photosensitive film into a forward tapered shape and the fact that the present invention is excellent in processing a negative photosensitive film into a forward tapered shape will be described below. I do. FIG. 11 is a diagram schematically showing a progress state of a crosslinking reaction at the time of exposure in a nozzle hole using a negative photosensitive film. FIG. 11A shows the case where the diffused light of the present invention is incident, and FIG. 11B shows the case where the vertical light is incident as shown in FIG. In FIG. 11B, the vertical light that has passed through the photomask 2004 attenuates while arriving at a region near the substrate 2001, and the cross-linking reaction near the substrate is insufficient. (Region 1201 in the figure). Therefore, the organic mold part 2008 for electroforming has an inverted tapered shape. In contrast, in the present invention shown in FIG.
Although 201 occurs, a sufficiently forward tapered shape is obtained even after the development is removed.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications and substitutions can be made within the scope of the claims.

[0025]

As described above, according to the method for producing an electroforming mold of the present invention for producing an electroforming mold, a photosensitive film is formed on a substrate, and a light-shielding film is formed on the photosensitive film. To form
Then, a diffused light is irradiated from above the light-shielding film, and a forward tapered electroforming mold in which an arbitrary portion exposed by the developing process using the diffused light remains is formed. Therefore, the electroforming mold of the nozzle forming member can be processed into a forward tapered shape with good controllability.

According to another aspect of the present invention, there is provided a nozzle forming member having a nozzle hole for discharging ink, a liquid chamber communicating with the nozzle hole, and energy generating means for pressurizing the ink in the liquid chamber. According to the ink jet head manufacturing method of manufacturing an ink jet head for recording on a recording medium by ejecting ink droplets from a nozzle hole and pressurizing ink in a liquid chamber by an energy generating means based on an input, a photosensitive material is exposed on a substrate. A light-shielding film is formed on the photosensitive film. Then, a diffused light is irradiated from above the light-shielding film to form a forward tapered electroforming mold in which an arbitrary portion exposed by the developing process using the diffused light passing through the hole remains. Then, an electroformed film is deposited by an electroforming method, an ink-repellent surface film is formed on the electroformed film, the substrate and the electroforming mold are removed, and the cross-sectional shape is an inverted tapered shape with the ejection surface facing upward. Is formed. Therefore, the electroforming mold of the nozzle forming member is processed into a forward tapered shape with good controllability, and the reverse tapered nozzle hole matched to the electroforming mold can be formed with good controllability by the electroforming method. In addition to stabilizing the position and suppressing variations in the ejection direction, a nozzle hole having a small discharge port diameter and a moderately large inlet diameter can be formed, and loss of discharge energy given by the energy generation means can be suppressed.

Further, since the photosensitive film is of a negative type, first, deformation during electroforming can be suppressed as compared with a general positive type mold material. Secondly, in the case of making the nozzle hole into a forward tapered shape, it is desirable that the region where the light is incident remains according to the principle of diffused light, and the cross-linking reaction is promoted and the remaining negative type forms a forward tapered type. Can be easily done. Third, the shape retention of the mold at the time of development is superior to that of the positive mold.
This is remarkable when the thickness is more than μm.

The diffused light is obtained by making parallel light incident on a diffuser plate, and the diffused angle of the diffused light is set according to the taper angle of the electroforming mold.
An inkjet head having a desired reverse taper angle can be provided.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a manufacturing process of a nozzle forming member in an ink jet head according to a first embodiment of the present invention.

FIG. 2 is a sectional view of an inkjet head using the nozzle forming member shown in FIG.

FIG. 3 is a cross-sectional view illustrating a manufacturing process of a nozzle forming member in an ink head jet according to a second embodiment of the present invention.

FIG. 4 is a schematic diagram showing a change in an angle of outgoing light with respect to incident light by a type of a diffusion plate.

FIG. 5 is a cross-sectional view illustrating a process of manufacturing a nozzle forming member in an ink head jet according to a comparative example.

FIG. 6 is a diagram showing a relationship between a taper angle of an organic mold part θ for electroforming and an exposure amount obtained in Specific Examples 1 to 3 and Comparative Example.

FIG. 7 is a diagram illustrating a relationship between a taper angle θ of a nozzle hole of a nozzle forming member and an exposure amount obtained in Specific Examples 1 to 3 and Comparative Example.

FIG. 8 is a schematic diagram of a cross-sectional shape near a nozzle hole of a nozzle forming member manufactured according to Specific Example 1.

FIG. 9 is a schematic diagram of a cross-sectional shape near a nozzle hole of a nozzle forming member manufactured according to a comparative example.

FIG. 10 is a diagram showing a result of comparing the injection performance between a specific example 1 and a comparative example.

FIG. 11 is a view schematically showing the progress of a crosslinking reaction at the time of exposure in a nozzle hole using a negative photosensitive film.

FIG. 12 is a schematic view of the vicinity of a nozzle hole in a manufacturing process of a nozzle forming member according to Conventional Example 1.

FIG. 13 is a sectional view of a nozzle forming member of Conventional Example 2.

FIG. 14 is a schematic view of the vicinity of a nozzle hole in a manufacturing process of a nozzle forming member of Conventional Example 3.

[Explanation of symbols]

1001; substrate, 1002; photosensitive film, 1003; light-shielding film, 1004; photomask, 1005;
1006; collimated light, 1007; organic mold part, 1008;
Electroformed film, 1009; surface film.

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Shinji Tezuka 1-3-6 Nakamagome, Ota-ku, Tokyo F-term in Ricoh Co., Ltd. 2C057 AF93 AG02 AG07 AG12 AP13 AP38 AP60

Claims (8)

[Claims] 1. A method for manufacturing an electroforming mold for manufacturing an electroforming mold, comprising: forming a photosensitive film on a substrate, forming a light-shielding film on the photosensitive film, and diffusing from above the light-shielding film. A method for manufacturing an electroforming mold, comprising irradiating light to form a forward tapered electroforming mold in which an arbitrary portion exposed by the development processing using the diffused light remains. 2. The photosensitive film according to claim 1, wherein said photosensitive film is of a negative type.
The method for producing an electroforming mold according to the above. 3. The method according to claim 1, wherein the diffused light is obtained by making parallel light incident on a diffuser plate. 4. The method for manufacturing an electroforming mold according to claim 1, wherein a diffusion angle of the diffused light is set according to a taper angle of the electroforming mold. 5. A nozzle forming member having a nozzle hole for discharging ink, a liquid chamber communicating with the nozzle hole, and energy generating means for pressurizing the ink in the liquid chamber, the energy being generated based on a recording signal input. An ink jet head manufacturing method for manufacturing an ink jet head for recording on a recording medium by ejecting ink droplets from a nozzle hole to pressurize ink in a liquid chamber by a generating means, forming a photosensitive film on a substrate, Forming a light-shielding film on the photosensitive film, irradiating diffused light from above the light-shielding film, and forming a forward-tapered electroforming mold in which an arbitrary portion exposed by the developing treatment with the diffused light remains. Depositing an electroformed film by an electroforming method, forming an ink-repellent surface film on the electroformed film, removing the substrate and the electroforming mold, and reversing the cross-sectional shape with the ejection surface facing upward. A method for manufacturing an inkjet head, comprising forming a nozzle hole having a tapered shape. 6. The photosensitive film is of a negative type.
The manufacturing method of the inkjet head according to the above. 7. The method according to claim 5, wherein the diffused light is obtained by making parallel light incident on a diffuser plate. 8. The method according to claim 5, wherein the diffusion angle of the diffused light is set according to a taper angle of the electroforming mold.