JP2009226845A - Production method of inkjet recording head and production method of microstructure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a production method of an inkjet recording head (or a mircostructure) capable of accurately forming a microstructure (an ink discharge opening, etc.) of desired shape for a resin 9 to be coated. <P>SOLUTION: The production method of the inkjet recording head (or the microstructure) consists of forming a mold pattern of an ink passage on a substrate 1 formed with an ink-discharge energy generating element 2, coating with the resin 9 to be coated and thereafter forming the ink passage by dissolving the mold pattern to be removed, wherein the production method has at least the step for carrying out a pattern exposure using the i line for the resin 9 to be coated and also at least a part (a resin layer (2)6) of the mold pattern of the ink passage is formed by a positive type photosensitivity resist having the absorbance in the wavelength of 365 nm of 0.1 or above or a positive type photosensitive resist for the i line containing diazonaphthoquinone. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an ink jet recording head for recording on various recording media such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, ceramics, and a fine structure having a desired pattern. It relates to the manufacturing method. In particular, the present invention relates to a method for manufacturing an ink jet recording head capable of stably discharging minute droplets capable of high image quality and realizing high-speed recording. In the present invention, “recording” means not only giving an image having a meaning such as a character or a figure to a recording medium but also giving an image having no meaning such as a pattern.

  As a general ink jet recording head, there is an ink jet recording head in which ink is ejected in a direction perpendicular to an ink ejection energy generating element surface. In recent years, with the miniaturization and high density of ink jet recording heads, a method of incorporating an electric control circuit for driving an ink ejection energy generating element in a substrate using a semiconductor manufacturing technique has been proposed. Such an ink jet recording head has a structure in which a common ink supply port is formed by penetrating the substrate from the back side of the substrate, and ink is supplied from the common ink supply port to a plurality of ink discharge ports (nozzles).

  Patent Document 1 discloses a method for manufacturing an ink jet recording head having the above structure. In addition, as a step of the manufacturing method, a step of forming a flow path by eluting a resin layer (mold pattern) that can be dissolved and removed formed on a silicon substrate is exemplified.

  Patent Document 2 exemplifies a process for changing the shape of a flow path in a three-dimensional direction by forming a two-stage mold pattern using two types of positive photosensitive materials having different photosensitive wavelength regions. Has been. According to this method, it is possible to provide an ink jet recording head that can refill ink by optimizing the shape of the flow path, suppressing meniscus vibration at high speed.

In Patent Document 2, a positive photosensitive material mainly composed of methacrylic acid ester and a positive photosensitive material mainly composed of polymethylisopropenyl ketone are used as two types of positive photosensitive materials. These materials do not absorb i-line (365 nm). FIG. 5 is a graph showing absorption wavelengths of a positive photoresist (trade name ODUR, manufactured by Tokyo Ohka Kogyo Co., Ltd.) mainly composed of polymethylisopropenyl ketone and polymethyl methacrylate (PMMA). As shown in this graph, no absorption is observed in the wavelength region of 365 nm.
Japanese Patent Laid-Open No. 9-11479 JP 2004-042389 A

  In Patent Document 1 and Patent Document 2, after forming a mold pattern, a coating resin layer that is a negative resist is formed thereon, and pattern exposure and development using i-line are performed to form an ink discharge port. is doing. However, in this step, the ink discharge port may be deformed and a predetermined discharge port area may not be obtained. This problem tends to be suppressed by reducing the exposure amount. However, at least, an exposure amount for curing the coating resin layer (negative resist) is necessary, and this problem may occur even at the minimum exposure amount.

  The present invention has been made to solve the above problems. That is, an object of the present invention is to provide a method for manufacturing an ink jet recording head capable of accurately forming a fine structure (ink discharge port or the like) having a desired shape on a coating resin, suppressing occurrence of uneven printing density, and capable of good recording. Is to provide. Furthermore, the objective of this invention is providing the manufacturing method of the microstructure which can form the microstructure of desired shape in coating resin with sufficient precision.

  As a result of intensive studies to achieve the above object, the present inventors have found that it is very effective to form a mold pattern using a specific positive resist, and have completed the present invention. It was.

  That is, according to the present invention, an ink flow path is formed by forming a mold pattern of an ink flow path on a substrate on which an ink discharge energy generating element is formed, covering the mold pattern with a coating resin, and then dissolving and removing the mold pattern. In the method of manufacturing an ink jet recording head for forming a path, the method includes at least a step of performing pattern exposure using i-line on the coating resin, and at least part of the mold pattern of the ink flow path has a wavelength of 365 nm. An ink jet recording head manufacturing method comprising forming a positive photosensitive resist having an absorbance of 0.1 or more.

  Further, according to the present invention, an ink flow path is formed by forming a mold pattern of an ink flow path on a substrate on which an ink ejection energy generating element is formed, covering the mold pattern with a coating resin, and then dissolving and removing the mold pattern. In the method of manufacturing an ink jet recording head for forming a path, the method has at least a step of performing pattern exposure using i-line on the coating resin, and at least part of the mold pattern of the ink flow path is made of diazonaphthoquinone. An ink jet recording head manufacturing method comprising: forming a positive photosensitive resist for i-line contained therein.

  Furthermore, the present invention provides a method for producing a microstructure in which a mold pattern consisting of an upper layer and a lower layer is formed on a substrate, the mold pattern is coated with a coating resin, and then the mold pattern is dissolved and removed. And forming at least one of the upper layer and the lower layer of the mold pattern with a positive photosensitive resist having an absorbance at a wavelength of 365 nm of 0.1 or more. This is a method for manufacturing a fine structure.

  Furthermore, the present invention provides a method for producing a microstructure in which a mold pattern consisting of an upper layer and a lower layer is formed on a substrate, the mold pattern is coated with a coating resin, and then the mold pattern is dissolved and removed. And at least a step of performing pattern exposure using i-line, and forming either the upper layer or the lower layer of the mold pattern with a positive photosensitive resist for i-line containing diazonaphthoquinone. It is the manufacturing method of the featured micro structure.

  According to the method for manufacturing an ink jet recording head of the present invention, ink jet recording capable of forming a fine structure (ink discharge port or the like) having a desired shape with high accuracy in a coating resin, suppressing occurrence of uneven printing density, and performing good recording. A head is obtained. In particular, when the ink discharge port is formed in the coating resin, it can be accurately formed with a predetermined discharge port area, which is very effective in suppressing the occurrence of uneven print density.

  Moreover, according to the manufacturing method of the fine structure of the present invention, a fine structure having a desired shape can be accurately formed in the coating resin.

  The reason why the above effect can be obtained is that when pattern exposure using i-line is performed on the coating resin, the i-line is reflected by another member (silicon substrate, etc.) to expose the unnecessary portion of the coating resin. This phenomenon is considered to be suppressed by the i-line absorption of the mold pattern. For example, when the coating resin is made of a negative resist, the exposure unnecessary portion of the coating resin is a portion to be removed (non-cured portion). In the conventional technique, the portion to be removed may be hardened by the reflected light and may be difficult to remove, which causes a problem that the accuracy of the pattern is lowered. On the other hand, in the present invention, the i-line is absorbed by the mold pattern and hardly reaches the substrate, and the reflected light from the substrate is also absorbed, so that a fine structure (such as an ink discharge port) can be formed with high accuracy. In addition, in the present invention, since the mold pattern for forming another fine structure (ink flow path or the like) absorbs i-line, the manufacturing process is simple as compared with the case where a specific antireflection film is provided.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 4 is a schematic partial sectional view showing an example of an ink jet recording head manufactured by the method of the present invention. On the substrate 1 of the ink jet recording head (liquid discharge head), the ink discharge energy generating elements 2 are formed in two rows at a predetermined pitch, and a coating resin 9 constituting the wall of the ink flow path 16 is laminated. ing. The fine structure of the coating resin 9 serves as a wall, and an ink flow path 16 that is a flow path for individually filling ink (liquid) on each ink discharge energy generating element 2 is formed. The ink flow path 16 is a space having a fine structure formed by forming a mold pattern that can be dissolved and removed in a flow path formation scheduled portion on the substrate and removing the mold pattern. Further, the coating resin 9 is formed with an ink discharge port 11 which is a through hole. The position of each ink discharge port 11 corresponds to the position of each ink discharge energy generating element 2 and is formed so as to open a wall above each ink discharge energy generating element 2. An ink supply port 13 is formed at a position between the two rows of the ink discharge energy generating elements 2 on the substrate 1. The ink supply port 13, the ink flow path 16, and the ink discharge port 11 communicate with each other.

  This ink jet recording head is arranged so that the surface on which the ink discharge ports 11 are formed faces the recording surface of the recording medium. The ink supplied from the ink supply port 13 is filled in each ink flow path 16, and when discharge energy is applied from the ink discharge energy generating element 2, ink droplets are discharged from the ink discharge port 11, and the recording medium And recording is performed.

[First Embodiment]
1A to 1H are schematic cross-sectional views showing the steps of the first embodiment of the present invention. Each of these figures corresponds to a cross-sectional view taken along line AA ′ of FIG. This embodiment is an example in the case of forming a mold pattern (a two-stage mold pattern) made of two types of resins that can be dissolved and removed.

  First, as shown in FIG. 1A, a substrate 1 on which an ink ejection energy generating element 2 is formed is prepared. In particular, in this embodiment, a sacrificial layer 15, an insulating layer (thermal oxide film) 5, a silicon oxide film 3, an ink ejection energy generating element 2, a silicon nitride film 4, and a cavitation resistant film (tantalum film) are formed on the silicon substrate 1. What formed each film | membrane of predetermined patterns, such as 14, is used. Each film is formed by a photolithography technique.

  Next, as shown in FIG. 1B, a nozzle adhesion improving layer 7 is formed on the silicon nitride film 4, and then predetermined patterning is performed. The nozzle adhesion improving layer 7 is a layer that plays a role of improving adhesion with the coating resin 9 described later. The nozzle adhesion improving layer 7 is preferably made of a thermoplastic resin such as thermoplastic polyetheramide. As a method for forming the nozzle adhesion improving layer 7, for example, there is a method of coating by spin coating or the like. As a method of patterning the nozzle adhesion improving layer 7, for example, there is a method of performing exposure and development using a positive resist.

  Next, as shown in FIG. 1C, a dissolvable resin layer (1) 8 and a dissolvable resin layer (2) are formed on the substrate 1 on which each film such as the ink discharge energy generating element 2 is formed. 6 is formed. In this embodiment, the resin layer (1) 8 corresponds to the lower layer of the ink flow path mold pattern, and the resin layer (2) 6 corresponds to the upper layer of the ink flow path mold pattern. It has become. If such a two-stage pattern pattern having different pattern shapes is used for the lower layer and the upper layer, the three-dimensional shape including the height direction of the ink flow path can be optimized and the ink jet recording performance can be improved. In the present invention, at least a part of the mold pattern is a positive photosensitive resist whose absorbance at a wavelength of 365 nm is 0.1 or more, or a positive photosensitive resist for i-line containing diazonaphthoquinone (DNQ). To form. For example, when the mold pattern is composed of an upper layer and a lower layer as in this embodiment, one of the upper layer and the lower layer may be formed of the specific positive photosensitive resist.

Specifically, in this embodiment, a conventional positive photosensitive resist is applied onto the substrate 1 by spin coating or the like, and baked as necessary to form a soluble resin layer (1) 8. To do. Here, the conventional positive photosensitive resist means a resist having no i-line (356 nm) absorption wavelength. Further, the baking temperature is preferably in the range of 80 ° C. to 150 ° C., and may be set as appropriate in consideration of the patterning property and removability.

Next, on the resin layer (1) 8, a positive photosensitive resist having an absorbance at a wavelength of 365 nm of 0.1 or more, or a positive photosensitive resist for i-line containing diazonaphthoquinone is spin-coated, etc. Apply as necessary and bake as necessary. Thereby, the meltable resin layer (2) 6 is formed. The baking temperature is the same as described above. Then, an upper layer of the mold pattern is formed by performing pattern exposure and development using i-line on the resin layer (2) 6. Pattern exposure using i-line may be performed using, for example, an i-line stepper. In addition, since the lower resin layer (1) 8 does not have an absorption wavelength of i-line (356 nm),
When the upper layer pattern is exposed, the lower layer is not slipped.

Next, as shown in FIG. 1D, pattern exposure and development are performed on the resin layer (1) 8, thereby forming a lower layer of the mold pattern. When i-line is included in the wavelength of this pattern exposure, it is necessary to prevent the upper layer from being damaged by preventing light from hitting the upper layer. In this case, for example, the product may be designed such that the end portion of the remaining pattern shape of the lower layer is outside the end portion of the remaining pattern shape of the upper layer.

In this embodiment, as described above, a conventional resist is used as the lower resin layer (1) 8, and the specific resist of the present invention is used as the upper resin layer (2) 6. However, the present invention is not limited to this embodiment. For example, a specific resist of the present invention may be used for the former and a conventional resist may be used for the latter. However, the wavelength of the upper layer pattern exposure is i
When a line is included, the lower layer is slightly slipped, so it is preferable to set the thickness of the lower layer to be thick beforehand.

  Next, as shown in FIG. 1E, a mold pattern [resin layer (1) 8 and resin layer (2) 6] composed of an upper layer and a lower layer is coated with a coating resin 9, and ink is further applied to the coating resin 9. A discharge port 11 is formed. In this embodiment, first, the coating resin 9 is applied by spin coating or the like on a mold pattern composed of an upper layer and a lower layer. As the coating resin 9, it is preferable to use a negative photosensitive resist. Next, the ink ejection port 11 is formed by performing pattern exposure using i-line on the coating resin 9 and developing the pattern resin. When the coating resin 9 is a negative photosensitive resist, the exposed portion is cured. Then, the non-exposed portion (for example, the uncured portion shielded by a photomask) is removed by the development process, and this becomes the ink discharge port 11. In this embodiment, when pattern exposure is performed on the coating resin 9, the upper layer of the mold pattern [dissolvable resin layer (2) 6] absorbs i-line, so that the i-line hardly reaches the silicon substrate 1. Further, the reflected light from the silicon substrate 1 is also absorbed by the upper layer. Therefore, deformation of the ink discharge port 11 can be prevented, and a desired shape can be formed with high accuracy.

  Next, as shown in FIG. 1F, an ink supply port 13 is formed in the substrate 1. In this embodiment, first, the thermal oxide film 5 on the back surface of the substrate 1 is patterned by wet etching or the like to expose the silicon surface that is the starting surface for anisotropic etching. Then, the ink supply port 13 is formed by etching the exposed surface. As this anisotropic etching, for example, there is a wet etching method using a strong alkaline solution of TMAH (tetramethylammonium hydroxide) or KOH. Also, techniques such as dry etching and laser may be used.

  Next, as shown in FIG. 1G, the silicon oxide film 3 above the ink supply port 13 is removed by wet etching, and the silicon oxide film 4 is further removed by dry etching or the like.

  Next, as shown in FIG. 1H, an ink flow path is formed by dissolving and removing the mold pattern [resin layer (1) 8 and resin layer (2) 6] composed of an upper layer and a lower layer. As a method for this dissolution and removal, for example, there is the following method. First, the whole surface exposure using Deep UV light etc. is performed with respect to a type | mold pattern. By this whole surface exposure, the upper and lower layers of the mold pattern become soluble. This is immersed in a developer and dissolved, and an ultrasonic wave is applied as necessary, so that the dissolved resin is eluted from the ink discharge port 11 and the ink supply port 13. As a result, an ink flow path as shown in FIG. 1H is formed.

  The substrate 1 on which the nozzle portion is formed by the above steps is separated and cut into chips by a dicing saw or the like. After that, electrical connection for driving the ink discharge energy generating element 2 is performed, and a chip tank member for supplying ink is connected to complete the main configuration of the ink jet recording head.

[Second Embodiment]
2A to 2H are schematic cross-sectional views showing the steps of the second embodiment of the present invention. In the first embodiment described above, a two-stage mold pattern composed of a lower layer and an upper layer is formed. In the second embodiment, a one-stage mold pattern composed of one kind of resin is formed. The other points are the same as in the first embodiment.

  First, as shown in FIGS. 2A to 2B, predetermined layers are formed on the substrate 1 in the same manner as in the first embodiment.

  Next, as shown in FIG. 2C, a soluble resin layer (2) 6 is formed on the substrate 1. In this embodiment, a positive photosensitive resist having an absorbance at a wavelength of 365 nm of 0.1 or more, or a positive photosensitive resist for i-line containing diazonaphthoquinone is applied by spin coating or the like. Bake. Thereby, the meltable resin layer (2) 6 is formed.

  Next, as shown in FIG. 2D, a pattern pattern is formed by performing pattern exposure and development using i-line on the resin layer (2) 6. That is, in this embodiment, the entire mold pattern is formed by the specific resist of the present invention. Here, pattern exposure using i-line may be performed using, for example, an i-line stepper.

  Thereafter, as shown in FIGS. 2E to 2H, the ink pattern is formed by covering the mold pattern with the coating resin 9, and then dissolving and removing the mold pattern. Each of these steps is the same as the steps of FIGS. 1E to 1H of the first embodiment. In the present embodiment, the pattern pattern [dissolvable resin layer (2) 6] absorbs i-line when pattern exposure is performed on the coating resin 9, so that the i-line hardly reaches the silicon substrate 1, and silicon Reflected light from the substrate 1 is also absorbed by the upper layer. Therefore, deformation of the ink discharge port 11 can be prevented, and a desired shape can be formed with high accuracy.

[Third Embodiment]
3A to 3H are schematic cross-sectional views showing the steps of the third embodiment of the present invention. In the first embodiment, the upper layer is patterned and then the lower layer is patterned. In the third embodiment, the lower layer is patterned first, and then the upper layer is formed. The other points are the same as in the first embodiment.

  First, as shown in FIGS. 3A to 3B, predetermined layers are formed on the substrate 1 in the same manner as in the first embodiment.

  Next, as shown in FIG. 3C, a dissolvable resin layer (1) 8 is formed on the substrate 1, and this is patterned to form a lower layer of the mold pattern. Specifically, first, as in the first embodiment, a conventional positive photosensitive resist is applied on the substrate 1 to form a soluble resin layer (1) 8. The resin layer (1) 8 is subjected to pattern exposure and development to form a lower layer of the mold pattern. The light to be exposed is not particularly limited as long as it includes the photosensitive wavelength of the resin layer (1) 8.

Next, as shown in FIG. 3D, a dissolvable resin layer (2) 6 is formed on the lower layer [resin layer (1) 8] of the mold pattern, and this is patterned to form an upper layer of the mold pattern. Form. Specifically, in this embodiment, on the lower layer of the mold pattern, a positive photosensitive resist whose absorbance at a wavelength of 365 nm is 0.1 or more, or a positive photosensitive resist for i-line containing diazonaphthoquinone. Is applied by spin coating or the like and baked as necessary. Thereby, the meltable resin layer (2) 6 is formed. Then, an upper layer of the mold pattern is formed by performing pattern exposure and development using i-line on the resin layer (2) 6. Pattern exposure using i-line may be performed using, for example, an i-line stepper. The lower resin layer (
1) Since 8 does not have an i-line (356 nm) absorption wavelength, there is no film slippage in the lower layer during upper pattern exposure.

In this embodiment, as described above, a conventional resist is used as the lower resin layer (1) 8, and the specific resist of the present invention is used as the upper resin layer (2) 6. However, the present invention is not limited to this embodiment. For example, a specific resist of the present invention may be used for the former and a conventional resist may be used for the latter. However, the wavelength of the upper layer pattern exposure is i
When a line is included, the lower layer is slightly slipped, so it is preferable to set the thickness of the lower layer to be thick beforehand.

  Thereafter, as shown in FIGS. 3E to 3H, the ink pattern is formed by covering the mold pattern with the coating resin 9 and then dissolving and removing the mold pattern. Each of these steps is the same as the steps of FIGS. 1E to 1H of the first embodiment. In the present embodiment, as in the first embodiment, the upper layer of the mold pattern [dissolvable resin layer (2) 6] absorbs i-line during pattern exposure of the coating resin 9, so that i-line is silicon. It becomes difficult to reach the substrate 1, and the reflected light from the silicon substrate 1 is also absorbed by the upper layer. Therefore, deformation of the ink discharge port 11 can be prevented, and a desired shape can be formed with high accuracy.

  As described above, a part of the mold pattern (first and third embodiments) or the whole (second embodiment) is formed of the specific resist of the present invention, so that the fine structure (ink discharge) of the coating resin can be obtained. And the like can be formed with high accuracy. The present invention is not limited to the manufacture of an ink jet recording head, and is very useful in the case of manufacturing a fine structure similar to this. That is, even when a fine structure having a fine structure space similar to an ink flow path or an ink discharge port is manufactured, a desired structure can be formed with high accuracy.

  Hereinafter, the present invention will be described in more detail by way of examples.

<Example 1>
In this example, an ink jet recording head was manufactured as follows in accordance with the steps shown in FIGS.

  First, a sacrificial layer 15, an insulating layer (thermal oxide film) 5, a silicon oxide film 3, an ink ejection energy generating element 2, a silicon nitride film 4, and an anti-cavitation film (tantalum film) 14 are photo-coated on the silicon substrate 1. It was formed by a lithography technique [FIG. 1 (A)].

  Next, a polyetheramide resin (trade name HL-1200, manufactured by Hitachi Chemical Co., Ltd.) was applied onto the silicon nitride film 4 by spin coating, and exposure and development were performed to form a 2 μm thick nozzle adhesion improving layer 7. [FIG. 1 (B)].

Next, a positive photosensitive resist (trade name: ODUR-1010, manufactured by Tokyo Ohka Kogyo Co., Ltd. (Hereinafter referred to as “ODUR”) was applied by spin coating. Furthermore, it was baked at 150 ° C. to form a soluble resin layer (1) 8 having a thickness of 14 μm. As shown in FIG. 5, the resin layer (1) 8 made of ODUR does not have an absorption wavelength of i-line (356 nm).

  Next, on this resin layer (1) 8, a positive photosensitive resist for i-line (trade name iP5700HP, manufactured by Tokyo Ohka Kogyo Co., Ltd.) containing diazonaphthoquinone was applied by spin coating. Furthermore, the resin layer (2) 6 having a thickness of 6 μm was formed by baking at 90 ° C. The absorbance at a wavelength of 365 nm of the i-line positive photosensitive resist of the resin layer (2) 6 is 0.15.

  Next, the resin layer (2) 6 is subjected to pattern exposure using an i-line stepper (trade name i5, manufactured by Canon), and a predetermined developer (trade name NMD-3, manufactured by Tokyo Ohka Kogyo Co., Ltd.) is used. Development was performed to form an upper layer of the mold pattern [FIG. 1C].

  Next, pattern exposure is performed on the resin layer (1) 8 using a proximity exposure machine (wavelength region 250 nm to 400 nm), and development is performed using a predetermined developer (methyl isobutyl ketone). A lower layer of the pattern was formed [FIG. 1 (D)].

  Next, a negative photosensitive resin containing an epoxy resin and a cationic polymerization initiator is spin-coated as a coating resin 9 on a mold pattern [resin layer (1) 8 and resin layer (2) 6] composed of an upper layer and a lower layer. It was applied by coating. The coating resin 9 was subjected to pattern exposure using an i-line stepper (trade name i5, manufactured by Canon) and developed to form an ink discharge port 11 [FIG. 1 (E)]. The ink discharge port 11 was not deformed and could be accurately formed with a predetermined discharge port area.

  Next, the thermal oxide film 5 on the back surface of the substrate 1 was patterned by wet etching using the thermoplastic resin film 7 as a mask to expose the silicon surface serving as the starting surface for anisotropic etching. Then, the ink supply port 13 was formed by performing anisotropic etching using a strong alkali solution on the exposed surface [FIG. 1 (F)].

  Next, the silicon oxide film 3 above the ink supply port 13 was removed by wet etching, and the silicon oxide film 4 was removed by dry etching [FIG. 1 (G)].

  Next, the mold pattern composed of the upper layer and the lower layer [resin layer (1) 8 and resin layer (2) 6] was subjected to overall exposure using deep UV light so that the mold pattern could be dissolved. This was immersed in a developer and dissolved, and ultrasonic waves were applied to elute the dissolved resin from the ink discharge port 11 and the ink supply port 13 to form an ink flow path [FIG. 1 (H)].

  The substrate 1 on which the nozzle portion was formed by the above steps was separated and cut into chips by a dicing saw. Further, electrical connection for driving the ink discharge energy generating element 2 was performed, and a chip tank member for supplying ink was connected, thereby completing the main configuration of the ink jet recording head.

  In this ink jet recording head, the ink discharge ports are formed with high accuracy, so that there is no occurrence of uneven printing density and good recording is possible.

  In this example, the absorbance at a wavelength of 365 nm of the upper layer [resin layer (2) 6] of the mold pattern was set to 0.15, but the absorbance was changed by changing the material composition of the resin layer (2) 6. The presence or absence of deformation of the discharge port was confirmed. The results are shown in Table 1 below.

  In the above, “◯” means that the ink ejection port is not deformed, and “x” means that the ink ejection port is deformed. From the above results, when the absorbance at a wavelength of 365 nm of the upper layer [resin layer (2) 6] of the mold pattern is 0.1 or more, the ink discharge port is not deformed and can be accurately formed with a predetermined discharge port area. I understand.

<Example 2>
In this example, an ink jet recording head was manufactured as follows in accordance with the steps shown in FIGS.

  First, as shown in FIGS. 2A to 2B, predetermined layers were formed on the substrate 1 in the same manner as in Example 1.

  Next, a positive photosensitive resist for i-line (trade name iP5700HP, manufactured by Tokyo Ohka Kogyo Co., Ltd.) containing diazonaphthoquinone was applied on the substrate 1 by spin coating. Furthermore, it was baked at 90 ° C. to form a soluble resin layer (2) 6 having a thickness of 14 μm [FIG. 2 (C)]. The absorbance at a wavelength of 365 nm of the i-line positive photosensitive resist of the resin layer (2) 6 is 0.3.

  Next, pattern exposure is performed on the resin layer (2) 6 using an i-line stepper (trade name i5, manufactured by Canon), and a predetermined developer (trade name NMD-3, manufactured by Tokyo Ohka Kogyo Co., Ltd.) is used. Development was performed to form a mold pattern [FIG. 2D].

  Thereafter, as shown in FIGS. 2E to 2H, the ink pattern was formed by coating the mold pattern with the coating resin 9, and then dissolving and removing the mold pattern. These steps are the same as those shown in FIGS. 1E to 1H of the first embodiment.

  In this embodiment, the ink discharge port 11 is not deformed and can be formed with high accuracy in a predetermined discharge port area. In addition, the ink jet recording head of the present embodiment has the ink discharge ports formed with high accuracy, so that there is no occurrence of uneven print density and good recording is possible.

<Example 3>
In this example, an ink jet recording head was manufactured as follows in accordance with the steps shown in FIGS.

  First, as shown in FIGS. 3A to 3B, predetermined layers were formed on the substrate 1 in the same manner as in Example 1.

  Next, a positive photosensitive resist (ODUR) was applied onto the substrate 1 by spin coating, and baked at 150 ° C. to form a 14 μm-thick soluble resin layer (1) 8. Then, pattern exposure is performed on the resin layer (1) 8 using a proximity exposure machine (wavelength region 250 nm to 400 nm), and development is performed using a predetermined developer (methyl isobutyl ketone). The lower layer was formed [FIG. 3C].

  Next, a positive photosensitive resist for i-line (trade name iP5700HP, manufactured by Tokyo Ohka Kogyo Co., Ltd.) containing diazonaphthoquinone was applied on the lower layer of the mold pattern by spin coating. Furthermore, the resin layer (2) 6 having a thickness of 6 μm was formed by baking at 90 ° C. The resin layer (2) 6 is subjected to pattern exposure using an i-line stepper (trade name i5, manufactured by Canon), and a predetermined developer (trade name NMD-3, manufactured by Tokyo Ohka Kogyo Co., Ltd.) is used. Development was performed to form an upper layer of the mold pattern [FIG. 3D].

  Thereafter, as shown in FIGS. 3E to 3H, the ink pattern was formed by covering the mold pattern with the coating resin 9, and then dissolving and removing the mold pattern. These steps are the same as those shown in FIGS. 1E to 1H of the first embodiment.

  In this embodiment, the ink discharge port 11 is not deformed and can be formed with high accuracy in a predetermined discharge port area. In addition, the ink jet recording head of the present embodiment has the ink discharge ports formed with high accuracy, so that there is no occurrence of uneven print density and good recording is possible.

(A)-(H) are typical sectional drawings which show each process of the 1st Embodiment of this invention. (A)-(H) are typical sectional drawings showing each process of a 2nd embodiment of the present invention. (A)-(H) are typical sectional views showing each process of a 3rd embodiment of the present invention. It is a typical fragmentary sectional view showing an example of an ink jet recording head manufactured by a method of the present invention. It is a graph which shows the absorption wavelength of the positive photoresist (ODUR) which has a polymethyl isopropenyl ketone as a main component, and a polymethylmethacrylate (PMMA).

Explanation of symbols

1: Substrate 2: Ink ejection energy generating element 3: Silicon oxide film 4: Silicon nitride film 5: Insulating layer (thermal oxide film)
6: Dissolvable resin layer (2)
7: Nozzle adhesion improving layer 8: Dissolvable resin layer (1)
9: Coating resin 11: Ink discharge port 13: Ink supply port 14: Anti-cavitation film (tantalum film)
15: Sacrificial layer 16: Ink flow path

Claims (7)

Ink jet recording in which an ink flow path mold pattern is formed on a substrate on which an ink discharge energy generating element is formed, the mold pattern is coated with a coating resin, and then the mold pattern is dissolved and removed to form an ink flow path. In the head manufacturing method,
At least a step of performing pattern exposure using i-line on the coating resin;
And a method of manufacturing an ink jet recording head, wherein at least a part of the mold pattern of the ink flow path is formed of a positive photosensitive resist having an absorbance at a wavelength of 365 nm of 0.1 or more. Ink jet recording in which an ink flow path mold pattern is formed on a substrate on which an ink discharge energy generating element is formed, the mold pattern is coated with a coating resin, and then the mold pattern is dissolved and removed to form an ink flow path. In the head manufacturing method,
At least a step of performing pattern exposure using i-line on the coating resin;
A method for producing an ink jet recording head, wherein at least a part of a mold pattern of the ink flow path is formed of an i-line positive photosensitive resist containing diazonaphthoquinone.   3. The method of manufacturing an ink jet recording head according to claim 1, wherein the ink discharge port is formed by performing pattern exposure using i line and development on the coating resin.   An ink is obtained by performing pattern exposure and development using i-line on a positive-type photosensitive resist having an absorbance at a wavelength of 365 nm of 0.1 or more or an i-type positive photosensitive resist containing diazonaphthoquinone. The method of manufacturing an ink jet recording head according to any one of claims 1 to 3, wherein at least a part of a flow path pattern is formed.   The mold pattern is composed of an upper layer and a lower layer, and either one of the upper layer and the lower layer is a positive type photosensitive resist having an absorbance of wavelength of 365 nm or more, or a positive type for i-line containing diazonaphthoquinone. The manufacturing method of the inkjet recording head as described in any one of Claims 1-4 formed with a photosensitive resist. In a manufacturing method of a fine structure in which a mold pattern consisting of an upper layer and a lower layer is formed on a substrate, the mold pattern is coated with a coating resin, and then the mold pattern is dissolved and removed.
At least a step of performing pattern exposure using i-line on the coating resin;
In addition, a method for manufacturing a fine structure, wherein either one of the upper layer and the lower layer of the mold pattern is formed of a positive photosensitive resist having an absorbance at a wavelength of 365 nm of 0.1 or more. In a manufacturing method of a fine structure in which a mold pattern consisting of an upper layer and a lower layer is formed on a substrate, the mold pattern is coated with a coating resin, and then the mold pattern is dissolved and removed.
At least a step of performing pattern exposure using i-line on the coating resin;
And either the upper layer or lower layer of the said pattern is formed with the i-line positive photosensitive resist containing diazonaphthoquinone, The manufacturing method of the microstructure characterized by the above-mentioned.