JP2001328100A - Optical device, method of manufacturing the same, optical module and optical pick-up using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical device superior in the mass productivity and the stability and capable of being applied for the visible light, a method of manufacturing the optical device, and an optical module and an optical pick-up using the same. SOLUTION: This optical device is composed of a base and an optical element formed by an optical film placed on the base, and the optical element is formed by bending and standing a part of the optical film from the base.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device, a method of manufacturing the same, an optical module and an optical pickup using the same, and more particularly, to an optical device in which an optical element such as a lens or a diffraction element is provided on a substrate, The present invention relates to an optical module and an optical pickup manufactured using the optical device.

[0002]

2. Description of the Related Art Heretofore, as such a technology,
“Self-aligned hybrid integration of semiconductor
lasers with micromachined micro-optics for optoele
ctronic packaging ”(Applied Physics Letters Vol. 6
6, pp 2946-2948) is known.

[0003] This is a technique for forming an optical device by processing a silicon film using a surface micromachining technique, and an example of the configuration is shown in FIG. As shown in FIG. 11, the optical device 43 includes a semiconductor laser 32,
A Fresnel lens 38 a for converting the light 42 emitted from the semiconductor laser 32 into parallel light is integrated on the silicon substrate 31.

The Fresnel lens 38a and the semiconductor laser 3
2 and a fixing plate 3 for fixing the Fresnel lens 38a
4, 35 and 36 are structures of a polycrystalline silicon film,
It has a structure that rotates around a side that is in contact with the silicon substrate 31 as a rotation axis.

[0005] A method of manufacturing this structure will be described with reference to FIG. First, as shown in FIG. 12A, a sacrificial layer (phosphorus silica glass) 37 is formed on a silicon substrate 31 to a thickness of about 2 μm. Next, a polycrystalline silicon film 38 is formed to a thickness of about 2 μm, and is etched using a photolithography method to form a Fresnel lens 38a and a hinge pin 38b.

Next, as shown in FIG. 12B, a sacrifice layer (phosphorus silica glass) 39 is further formed thereon to a thickness of about 0.5.
μm, and as shown in FIG.
Contact holes 40a and 40b are formed for layers 7 and 39.

Next, as shown in FIG. 12D, a hinge film 41 is formed by forming a polycrystalline silicon film. Next, as shown in FIG. 12E, the sacrificial layer 3 is formed using hydrofluoric acid.
7 and 39 are selectively removed by etching, and the polycrystalline silicon film 38 is separated from the substrate 31.

As a result, as shown in FIG.
The polycrystalline silicon film 38 rotates about the hinge pin 38b, and the Fresnel lens 38a formed on the polycrystalline silicon film 38 stands upright on the substrate 31.

By utilizing the same steps as above,
The fixing plates 34, 35, 36 shown in FIG. 11 can be formed. The Fresnel lens 38a is fixed upright by combining with the fixing plate 36.

[0010]

SUMMARY OF THE INVENTION Conventional optical devices are:
The use of the hinge structure raises the optical element upward, and the manufacturing process of the hinge structure is complicated. In the hinge structure, it is necessary to perform a step of erecting and fixing the optical element for each element. However, since the size of the optical element is small and large, the step is extremely complicated.
In addition, since the optical element is supported by a minute hinge, attention must be paid to the strength of the hinge, and particularly attention must be paid to the adhesion between the hinge fastener and the substrate. further,
Since a polycrystalline silicon film having a large absorption of visible light was used as a material of the optical element, only an infrared optical system could be manufactured.

The present invention has been made in consideration of the above-described circumstances, and is capable of mass production by bending an optical film formed on a substrate from the substrate to form an optical element.
An object of the present invention is to provide an optical device which is excellent in stability and can be used for visible light, a method for manufacturing the same, and an optical module and an optical pickup using the same.

[0012]

SUMMARY OF THE INVENTION The present invention comprises a substrate and an optical element comprising an optical film formed on the substrate, wherein the optical element is formed by bending a part of the optical film from the substrate. And an optical device characterized by being formed by: The present invention also provides a first step of forming a sacrificial layer on the substrate, a second step of forming an optical film on the sacrificial layer, and a third step of etching the optical film.
Another object of the present invention is to provide a method for manufacturing an optical device including a step, a fourth step of removing a sacrificial layer, and a fifth step of forming an optical element by bending a part of an optical film from a substrate to stand up. The present invention also includes a substrate, at least one optical element including an optical film formed on the substrate, and a semiconductor laser mounted on the substrate.
The optical element also provides an optical module characterized by being formed by bending a part of an optical film from a substrate and standing up. The present invention also provides a substrate, at least one optical element formed of an optical film formed on the substrate, a semiconductor laser mounted on the substrate, and an objective lens for condensing light emitted by the semiconductor laser on an optical disk. And an optical detector configured to detect a return light from the optical disk, wherein the optical element is formed by bending a part of the optical film from the substrate to stand up. It is also a thing.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION An optical device according to the present invention has a bending angle of about 45 degrees or about 90 degrees with respect to a substrate of an optical film.
Degree. In the optical device according to the present invention, the optical film may be made of a polymer material. Also,
In the optical device according to the present invention, a plurality of optical elements having different functions may be formed on the substrate by processing the optical film.

The method for manufacturing an optical device according to the present invention is as follows.
The third step of etching the optical film may include a step of etching the bent portion of the optical film while keeping a predetermined thickness. In the method for manufacturing an optical device according to the present invention, the third step of etching the optical film may include a step of etching the optical film to form a plurality of optical elements. Further, in the method for manufacturing an optical device according to the present invention, the fifth step of forming an optical element by bending a part of the optical film from the substrate and standing up includes bonding at least a part of the bent optical film to the substrate. A fixing step may be included.

[0015] As described above, the optical device of the present invention comprises:
Since it can be formed by a semiconductor process in which a film forming step and an etching step using a photolithography method are combined, reproducibility and mass productivity are extremely excellent.

In addition, since the optical element is formed by patterning the surface of the flat optical film, aberrations generated in the optical element can be suppressed to a low level. If a transparent optical film is used, the optical element can be used for visible light. Optical device can be provided.

Further, since the bent portion of the optical film has a simple structure in which the bent portion of the optical film is thinly etched, not a complicated structure such as a hinge and a fastener as in the related art, the fabrication is easy. It is.

Conventionally, it was necessary to raise each optical element on the substrate from the substrate. However, according to the present invention, as described in detail in a later embodiment, a plurality of optical elements are set up at once. And the manufacturing process can be shortened. Further, the arrangement of the optical elements and the interval between the optical elements can be adjusted with the etching accuracy by the photolithography method. By combining these technologies with a semiconductor laser or a photodetector, the size and weight of an optical module or an optical pickup can be reduced.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the drawings. The present invention is not limited by the embodiment.

Embodiment 1 A method for manufacturing an optical device according to Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1 is a process diagram schematically showing a method for manufacturing an optical device according to Example 1. As shown in FIG. 1C, the optical device 21 according to the first embodiment includes a substrate 1 and an optical element 4 including an optical film 2 formed on the substrate 1, and the optical element 4 is an optical film. 2
Is formed by bending a part of the substrate 1 from the substrate 1 and standing up.

The optical device 21 is etched in the manufacturing process as shown in FIG. 1A, and only the substrate fixing portion 2a is fixed to the substrate 1. The broken line portion is etched so that the film thickness of the optical film 2 becomes thin, so that it can be easily bent in a later step.
An optical element 4 such as a Fresnel lens is formed on the surface of the optical element forming region 2b of the optical film 2.

As shown in FIG. 1B, when the sliders 2c and 2d of the optical film 2 are slid in the directions of the arrows,
When the optical element forming region 2b on which the optical element 4 is formed rises and is further slid, the optical element forming region 2b stands upright as shown in FIG. 1C, and the optical device 21 is completed.

If such a method is used, in addition to the optical element 4 (Fresnel lens), a diffraction grating, a mirror,
An optical element such as a beam splitter is formed upright on the substrate to form an integrated optical system for the light 3 (FIG. 1C) traveling parallel to the substrate surface.

The above-mentioned optical elements such as the Fresnel lens, diffraction grating, mirror and beam splitter can be formed by etching an optical film on a substrate or forming a metal film or a dielectric film on the optical film. . For example, a Fresnel lens or a diffraction grating can be formed by etching an optical film, and a mirror can be formed by forming a metal film on the optical film surface. Further, if a dielectric multilayer film is formed, a polarization separation element and a wavelength selection element can be formed. Further, a lens can be formed by processing an optical film or a dielectric film formed on the optical film on a spherical surface.

The conventional optical system has been manufactured by forming these optical elements individually, adjusting the positions of the optical elements, and then bonding and fixing them. However, the optical device of the present invention is collectively manufactured by a semiconductor process. Therefore, the manufacturing cost can be significantly reduced. In addition, since the position of the optical element can be positioned with high accuracy by utilizing the photolithography technology, complicated position adjustment is not required.

Hereinafter, a method for manufacturing the optical device 21 according to the first embodiment will be described in more detail with reference to FIGS. 2 and 3 are corresponding process diagrams, respectively. FIG. 2 is a process diagram viewed from a plane, and FIG. 3 is a process diagram showing a cross section taken along line AA of FIG. FIG. 4 is a block diagram illustrating a manufacturing method.

First, as shown in FIGS. 2A and 3A, a sacrificial layer (phosphorus silica glass) 5 having a thickness of about 2 μm is formed on a substrate (silicon) 1 by spin coating. After that, the sacrificial layer 5 is formed using a photolithography method.
Then, a part of the sacrificial layer 5 is removed (FIG. 4 (S1)).

Next, as shown in FIG. 2B and FIG. 3B, an optical film (polyimide) 2 is formed on the sacrificial layer 5. The optical film 2 is formed by applying a polyamic acid varnish by a method such as a spin coating method or an applicating method, and by heating and baking. The thickness of the optical film 2 is set to, for example, about 50 μm. (FIG. 4 (S2)).

Next, as shown in FIGS. 2C and 3C, the optical film 2 is etched, and the support arms 2e and 2f are etched.
And the optical element 4 are formed. Specifically, RIE (re
The optical film 2 is etched by a method such as active ion etching) or a laser ablation method, and the optical element formation region 2b, the sliders 2c and 2d, and the support arm 2 are formed.
e, 2f, constricted portion (bending portion of optical film) 6a, 6
b and 6c are formed, and the surface of the optical element forming region 2b is processed to form an optical element 4 such as a Fresnel lens or a diffraction grating. Note that only the substrate fixing portion 2a is directly fixed to the substrate 1.

At this time, the length L of the support arms 2e, 2f
1 is longer than the length L2 of the side of the optical element formation region 2b. With this configuration, when the optical element 4 is upright (see FIGS. 2D and 3D), the support arm 2e,
2f becomes like a rigid rod sandwiched between the optical element 4 and the substrate 1, and the blur of the optical element 4 can be suppressed.

In the constricted portions 6a, 6b and 6c, the optical film 2
Is left thin (for example, about 10 μm). For this purpose, an etching technique that can change the etching depth depending on the etching location is required. However, in the laser ablation method, the etching depth can be partially controlled by controlling the number of irradiation pulses. .

In the case of the RIE method, etching of different depths can be performed by repeating the photolithography step and the etching step several times. Constriction 6
Reference numerals a, 6b, and 6c are provided to facilitate bending of the optical film 2, and it is important that the optical film 2 is left thin enough to not break when bent. (FIG. 4 (S
3)).

Next, as shown in FIGS. 2D and 3D, the sacrificial layer 5 (FIGS. 2C and 3C) is removed (FIG. 4S4). A slider portion 2c of the optical film 2,
2d is slid up to raise the optical element 4 upright, and the sliders 2c and 2d are adhered and fixed to the substrate 1. (FIG. 4 (S5)).

The removal of the sacrificial layer 5 is performed by wet etching using hydrofluoric acid. However, since the substrate 1 and the optical film (polyimide) 2 are not affected by hydrofluoric acid, only the sacrificial layer (phosphorus silica glass) 5 is removed. It is selectively etched.

As the material of the optical film 2, a polymer material which becomes more flexible when it is made shallower may be used. In addition to the above-mentioned polyimide, PET (polyethylene terephthalate),
An optical film such as PEN (polyethylene naphthalate) may be used. In this case, it is fixed to the substrate with an adhesive.

The optical device 2 according to the first embodiment as described above
According to the first manufacturing method, the following effects can be obtained. Various optical elements can be manufactured in large quantities with high precision by a semiconductor process in which a film forming step and an etching step using a photolithography method are combined. Since the productivity is high, the cost of the optical element can also be kept low.

Further, since the optical element is formed on the surface of the flat optical film, the aberration generated in the optical element can be suppressed low. If a transparent optical film is used, it can be used for visible light. As described above, since a silicon film was conventionally used, it could be used only for infrared rays.

In the past, complicated steps were required to form hinges and fasteners. However, the present invention has a simple structure in which the bent portions of the optical film are thin, so that the fabrication is easy. is there. The thinned polymer material has good flexibility and is less likely to be broken by bending.

Embodiment 2 A method for manufacturing an optical device according to Embodiment 2 of the present invention will be described with reference to FIG. FIG. 5 is a process chart illustrating a method for manufacturing the optical device according to the second embodiment. Note that members having the same names as in the first embodiment will be described using the same reference numerals. In addition, the materials and methods for forming the substrate, the sacrificial layer, and the optical film, and the bonding process after the optical film is started are the same as those in the first embodiment, and thus description thereof will be omitted, and only different structural portions will be described.

As shown in FIG. 5C, an optical device 22 according to the second embodiment is an optical device comprising an optical film 2 and a reflective film (for example, a metal film made of gold or aluminum) 7 formed thereon. The element 4 (mirror) is raised so as to form an angle of about 45 degrees with the substrate 1. The inclination angle of the optical element 4 can be changed depending on the length of the support arms 2e and 2f.

The optical film 2 is etched as shown in FIG. 5A, and a reflective film 7 is formed on the surface of the optical element forming region 2b.
Is formed. After that, as shown in FIG. 5B, the sliders 2c and 2d of the optical film 2 are slid so that the optical element tilted at about 45 degrees with respect to the substrate 1 as shown in FIG. 5C. 4 can be produced. The optical element 4 changes the traveling direction of the light 3 traveling in the direction parallel to the substrate surface to the normal direction of the substrate surface.

By applying the second embodiment, an optical element (not shown) having a reflection film on the lower surface of the optical film 2 can be formed. When providing a reflective film on the lower surface of the optical film,
After the formation of the sacrificial layer, a reflective film can be formed on the sacrificial layer, and an optical film can be further formed on the reflective film.

If a reflecting film is provided on the lower surface of the optical film, the traveling direction of light traveling in a direction parallel to the substrate surface is bent toward the substrate surface side, and is used for optical coupling to a photodiode integrated on the substrate. be able to.

Third Embodiment A method for manufacturing an optical device according to a third embodiment of the present invention will be described with reference to FIG. FIG. 6 is a process chart illustrating a method for manufacturing the optical device according to the third embodiment. Note that members having the same names as in the first and second embodiments will be described using the same reference numerals. The materials and methods for forming the substrate, the sacrificial layer, and the optical film, and the bonding process after the optical film was started are described in Example 1.
Since these are the same as those in FIGS. 2 and 3, their description will be omitted, and only different parts will be described.

As shown in FIG. 6C, in the optical device 23 according to the third embodiment, the optical elements 4a and 4b are formed continuously on the optical film 2, and the optical elements 4a and 4b are simultaneously activated. Can be.

In the third embodiment, the etching of the optical film 2 is performed in a manner as shown in FIG. The optical elements 4a and 4b are connected to the slider portions 2c and 2d of the optical film 2, respectively, and as shown in FIG.
When d is slid in the direction of the arrow, the optical elements 4a (Fresnel lens) and 4b (grating) rise at once, and finally have a form as shown in FIG.

The optical device 2 according to the third embodiment as described above
According to the manufacturing method 3, the following effects can be obtained. A plurality of optical elements can be erected or inclined at a time, and assembly of an optical device having a plurality of optical elements can be simplified. Furthermore, the position of each optical element is
Since the positioning is performed with high accuracy by using the photolithography technology, each optical element can be arranged with high precision.
Further, it is also possible to start up the optical elements on a plurality of optical devices at once by this method. That is, the connected optical elements are fixed upright or inclined and bonded and fixed,
After that, by dividing each device unit,
The optical elements on a plurality of optical devices can be started at once, and the start-up process can be further simplified.

Embodiment 4 A method for manufacturing an optical device according to Embodiment 4 of the present invention will be described with reference to FIG. FIG. 7 is a process chart illustrating a method for manufacturing an optical device according to Example 4. The members having the same names as those of the first to third embodiments will be described using the same reference numerals.
Further, each material and each forming method of the substrate, the sacrificial layer and the optical film, and the bonding process after the optical film was started are described in Examples 1 to 3.
Therefore, the description thereof will be omitted, and only different parts will be described.

As shown in FIG. 7 (c), the optical device 24 according to the fourth embodiment has a series of optical elements 4a and 4b as in the third embodiment (FIG. 6). Embodiment 4 is different from Embodiment 3 in that 4a and 4b are connected via a connection region 2h.

In the third embodiment, the two optical elements 4a, 4b
Although the distance between the optical elements could not be reduced below the size of the optical element, in Example 4, the distance between the optical elements 4a and 4b was adjusted by the length L3 of the side of the connection region 2h (FIG. 7A). it can.

In the fourth embodiment, the etching of the optical film 2 is performed as shown in FIG. Only the substrate fixing portion 2a of the optical film 2 is fixed to the substrate 1, and the optical elements 4a, 4a
b are connected via the connection area 2h. FIG.
As shown in (b), the slider portions 2c, 2c of the optical film 2
When d is slid in the direction of the arrow, the optical elements 4a, 4a
b rises at a time and finally has a form as shown in FIG.

Embodiment 5 A method for fabricating an optical device according to Embodiment 5 of the present invention will be described with reference to FIG. FIG. 8 is a process chart illustrating a method for manufacturing an optical device according to Example 5. Note that members having the same names as those in Examples 1 to 4 will be described using the same reference numerals.
Further, the materials and the respective forming methods of the substrate, the sacrificial layer and the optical film, and the bonding process after the optical film was started are described in Examples 1 to 4.
Therefore, the description thereof will be omitted, and only different parts will be described.

As shown in FIG. 8B, the optical device 25 according to the fifth embodiment is arranged with a reduced distance between the optical elements 4a and 4b and activated at the same time as in the fourth embodiment (FIG. 7). However, the fourth embodiment is different from the fourth embodiment in that the optical elements 4a and 4b are independently started and the starting directions are different.

In the fifth embodiment, the etching of the optical film 2 is performed as shown in FIG. Only the substrate fixing portion 2a of the optical film 2 is fixed to the substrate 1, and the optical elements 4a, 4a
“b” is formed with the region of the substrate fixing portion 2a interposed therebetween. As shown in FIG. 8B, when the sliders 2c and 2d of the optical film 2 are respectively slid in the opposite directions indicated by arrows, the optical elements 4a and 4b are individually raised, and finally, as shown in FIG. It will be in the form like

In the fifth embodiment, the distance between the optical elements 4a and 4b can be adjusted by the length L4 of the side of the substrate fixing portion 2a (FIG. 8A). Further, the inclination angles of the optical elements 4a and 4b can be set independently.

Embodiment 6 An optical module according to Embodiment 6 of the present invention will be described with reference to FIG. FIG. 9 is a perspective view showing an optical module according to Embodiment 6 of the present invention. Examples 1 to 5
Members having the same names as those described above will be described using the same reference numerals. Also,
Substrate, each material and each forming method of the sacrificial layer and the optical film,
Since the bonding process after the optical film is set up is the same as in Examples 1 to 5, the description thereof will be omitted, and only different structural portions will be described.

As shown in FIG. 9, the optical module 26 according to the sixth embodiment includes an optical element 4a (45-degree mirror), 4b
The semiconductor laser 8 is mounted on the substrate 1 on which the (Fresnel lens) is formed.

The optical elements 4a and 4b are fixed to the substrate 1 by the substrate fixing portions 2a, respectively, and the sliders 2c and 2d of the optical film 2 are slid to form the optical elements 4a and 4b in the same manner as in the third embodiment. Has been launched. The semiconductor laser 8 is die-bonded to a predetermined position on the substrate 1.

In the sixth embodiment, the outgoing light 3 from the semiconductor laser 8 is NA-converted by the optical element 4b (Fresnel lens), and the traveling direction is changed by the optical element 4a (45-degree mirror). It is emitted in a linear direction. The optical module 26 according to the sixth embodiment can reduce the spread of the light 3 emitted from the semiconductor laser 8 and emit the light 3 in the normal direction of the substrate surface.

Conventionally, to achieve such a function,
A bulk-type lens having a size of several mm was required. However, in the optical module according to the sixth embodiment, the semiconductor laser 8
And the small optical elements 4a and 4b can be integrated, so that a significant reduction in size can be achieved. Further, the optical elements 4a and 4b can be formed at once by a semiconductor process, and furthermore, their position adjustment is unnecessary, so that mass productivity is good.

Embodiment 7 FIG. 1 shows an optical pickup according to Embodiment 7 of the present invention.
Description will be made based on 0. FIG. 10 shows Embodiment 7 of the present invention.
FIG. 4 is a process chart showing a method for manufacturing an optical pickup according to the first embodiment.
Note that members having the same names as those in Examples 1 to 6 will be described using the same reference numerals. Further, the respective materials and respective forming methods of the substrate, the sacrificial layer and the optical film, and the bonding process after the optical film is started are the same as those in Examples 1 to 6, so that the description thereof will be omitted, and only different structural portions will be described. .

As shown in FIG. 10 (b), an optical pickup 27 according to the seventh embodiment has an optical element 4a (a three-beam splitting grating) and 4b (a hologram element) on a substrate 1 on which a photodiode 11 is formed. , 4c (45-degree mirror), and a semiconductor laser 8 mounted on a predetermined position of the substrate 1.

As shown in FIGS. 10A and 10B, the optical elements 4a and 4b formed on the optical film 2 are formed in the same manner as in the fourth embodiment, and the optical element 4c is used in the second embodiment. It is formed in the same way as described above. However, the optical element 4c is formed by forming a reflection film (not shown) on the lower surface of the optical film 2.

The semiconductor laser 8 is die-bonded on the bonding pad 9. The light 3 emitted from the semiconductor laser 8 passes through the optical elements 4a and 4b, and is focused on an optical disk (not shown) by an objective lens (not shown). At this time, two sub beams are generated by the optical element 4a, and the sub beams are used for generating a tracking error signal.

Return light 1 reflected on the information surface of the optical disk
0 is again guided to the optical element 4b through the objective lens and diffracted, and after passing through the optical element 4c, the photodiode 11
It is led to. The photodiode 11 is divided into a plurality of light receiving sections (not shown), and the return light 10 incident on each of the light receiving sections is converted into an electric signal, and the signal is converted into an optical disk reproduction signal, a tracking error signal, and a focusing error. A signal is generated.

In the optical pickup 27 according to the seventh embodiment, the optical elements 4a, 4b, and 4c can be formed at once by a semiconductor process, and the position adjustment can be omitted. In addition, the optical pickup 27 can be configured simply by mounting the semiconductor laser 8 on the same substrate 1 and preparing an objective lens as another element, so that a significant reduction in size can be achieved.

[0067]

According to the present invention, since the optical element is formed by bending a part of the optical film from the substrate and standing up, the light is excellent in mass productivity and stability and can be used for visible light. A device, a method for manufacturing the same, an optical module and an optical pickup using the same can be provided.

[Brief description of the drawings]

FIG. 1 is a process chart schematically showing a method for manufacturing an optical device according to Example 1 of the present invention.

FIG. 2 is a process chart showing a method for manufacturing an optical device according to Example 1 of the present invention.

FIG. 3 is a process chart showing a method for manufacturing an optical device according to Example 1 of the present invention.

FIG. 4 is a block diagram illustrating a manufacturing process of the optical device according to the first embodiment of the present invention.

FIG. 5 is a process chart showing a method for manufacturing an optical device according to Example 2 of the present invention.

FIG. 6 is a process chart showing a method for manufacturing an optical device according to Embodiment 3 of the present invention.

FIG. 7 is a process chart showing a method for manufacturing an optical device according to Example 4 of the present invention.

FIG. 8 is a process chart showing a method for manufacturing an optical device according to Example 5 of the present invention.

FIG. 9 is a perspective view showing an optical module according to Embodiment 6 of the present invention.

FIG. 10 is a process chart showing a method for manufacturing an optical pickup according to Embodiment 7 of the present invention.

FIG. 11 is a perspective view showing a configuration of a conventional optical device.

FIG. 12 is a process chart showing a conventional method for manufacturing an optical device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Optical film 2a ... Substrate fixing part 2b ... Optical element formation area 2c, 2d ... Slider part 2e, 2f ... Support arm part 3 ... Light 4. ..Optical elements 21 ... Optical devices

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI theme coat ゛ (Reference) G11B 7/135 G11B 7/135 A 7/22 7/22 H01S 5/022 H01S 5/022

Claims (10)

[Claims] 1. An optical device comprising: a substrate; and an optical element formed of an optical film formed on the substrate, wherein the optical element is formed by bending a part of the optical film from the substrate to stand up. And optical devices. 2. The bending angle of the optical film with respect to the substrate is 4
The optical device according to claim 1, wherein the angle is 5 degrees or 90 degrees. 3. The optical device according to claim 1, wherein the optical film is made of a polymer material. 4. An optical element comprising a plurality of optical elements having different functions, wherein the plurality of optical elements are formed by processing an optical film. The optical device according to any one of the above. 5. A first step of forming a sacrificial layer on a substrate, a second step of forming an optical film on the sacrificial layer, a third step of etching the optical film, and removing the sacrificial layer. A method for manufacturing an optical device, comprising: a fourth step of forming an optical element by bending a part of an optical film from a substrate to stand up, thereby forming an optical element. 6. The method for manufacturing an optical device according to claim 5, wherein the third step includes a step of etching the bent portion of the optical film while leaving a predetermined thickness. 7. The method for manufacturing an optical device according to claim 5, wherein the third step includes a step of forming a plurality of optical elements by etching the optical film. 8. The optical device according to claim 5, wherein the fifth step includes a step of bonding and fixing at least a part of the bent optical film to a substrate. Production method. 9. A semiconductor device comprising: a substrate; at least one optical element formed of an optical film formed on the substrate; and a semiconductor laser mounted on the substrate. An optical module characterized by being formed by bending and standing up. 10. A substrate, at least one optical element comprising an optical film formed on the substrate, a semiconductor laser mounted on the substrate, and an objective lens for condensing light emitted by the semiconductor laser on an optical disk. And an optical detector configured to detect return light from an optical disk, wherein the optical element is formed by bending a part of an optical film from a substrate to stand up.