JP2001316894A - Liquid treatment device, liquid treatment system, and liquid treatment method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid treatment device, a liquid treatment system, and a liquid treatment method capable of reducing the liquid to a little quantity by lessening the exchange frequency of a treatment liquid and applying a uniform liquid treatment onto a face to be treated of a base board. SOLUTION: A used plating liquid containing an additive emitted from plating treatment units M1-M4 and plating treatment units M1'-M4' is transferred to a recycle tank 160 through reservoir tanks 50a, 50b. Impurities such as the additive and particles are removed from the plating liquid by means of a filter 163, a heater 164, and a metallic mesh filter 165 in a recycle tank 160. After the impurities such as the additive and the particles are removed, the concentration of each component of the plating liquid is measured and insufficient components in the plating liquid are added to readjust the plating liquid. The readjusted plating liquid is supplied again to the plating treatment units M1-M4 and plating tretment units M1'-M4' through a buffer tank 180 and the reservoir tanks 50a, 50b to operate plating treatment.

Description

DETAILED DESCRIPTION OF THE INVENTION

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid processing technique for a substrate to be processed, such as a semiconductor wafer, and more particularly, to a liquid processing apparatus, a liquid processing system, and a liquid processing method for preparing used liquid processing again. About.

2. Description of the Related Art Conventionally, as a processing apparatus for forming a metal layer on a surface of a substrate to be processed such as a semiconductor wafer W (hereinafter simply referred to as a "wafer"), for example, a sputtering apparatus for forming a metal layer in a vapor phase Processing apparatuses have been used, but with the improvement in the degree of integration of semiconductor devices, the use of plating apparatuses that form a metal layer in a liquid phase due to the problem of embedding is becoming mainstream. FIG. 12 is a schematic vertical sectional view of a typical plating apparatus. As shown in FIG. 12, the wafer holder 202 holding the wafer W in the plating solution tank 201 containing the plating solution is lowered, and the plating solution is brought into contact with the surface of the wafer W to be plated. Form a plating layer. Incidentally, an additive is usually added to the plating solution contained in the plating solution tank 202 so as to have a certain concentration in order to suppress generation of voids and to promote deposition during formation of the plating layer. This additive is consumed when the plating layer is formed on the surface to be plated of the wafer W, but also causes chemical change by contact with a metal such as the anode 203, and mainly contains copper oxide formed on the anode 203. The film may be consumed as a part of a so-called black film. In some cases, it may be decomposed electrically or spontaneously, and may be consumed as a decomposition product. Therefore, it is necessary to add a new additive to maintain a constant concentration in the plating solution. Therefore, cyclic voltammeter stripping (CV
After the concentration of the additive in the plating solution is measured in S) or the like, and the additive no longer serves as an additive, the additive is newly added. After repeating this operation and using the plating solution for a certain period, the plating solution is replaced with a new plating solution.

However, since all used plating solutions are replaced with new plating solutions, there is a problem that a large amount of waste solution is produced and the cost increases. Further, a new additive is added to the wafer W without removing the exfoliated products and decomposition products of the black film.
Since the plating layer is formed on the surface to be plated, the delamination product of the black film and the decomposition product of the additive adhere as particles to the surface to be plated of the wafer W to form a uniform plating layer on the surface to be plated of the wafer W. There is a problem that it cannot be formed. The present invention has been made to solve the above-mentioned conventional problems. That is, a liquid processing apparatus, a liquid processing system, and a liquid processing method capable of reducing the amount of waste liquid by reducing the frequency of replacement of the processing liquid and performing uniform liquid processing on the surface to be processed of the substrate to be processed. The purpose is to provide.

According to a first aspect of the present invention, there is provided a liquid processing apparatus comprising: a processing tank configured to store a processing liquid for performing a predetermined liquid processing on an object to be processed; and a processing tank provided in the processing tank. A processing apparatus comprising: a processing liquid circulating system; and a removing unit provided in the processing liquid circulating system, wherein the removing unit irradiates the processing liquid with the processing liquid when circulating the processing liquid. It is characterized in that a reaction product contained and generated by the treatment liquid is at least removable.
The liquid processing apparatus according to claim 1, wherein the removing unit is provided to remove a reaction product contained in the processing liquid and generated by the processing liquid during circulation of the processing liquid. Can be. The liquid processing apparatus according to claim 2 is the liquid processing apparatus according to claim 1.
The liquid processing apparatus according to the above, further comprising an additive supply means capable of supplying an organic component additive and / or a sulfur component additive into the treatment liquid. In the liquid processing apparatus according to the second aspect, since the additive supply means is provided, it is possible to supply the organic component additive and / or the sulfur component additive to the treatment liquid. The liquid processing apparatus according to claim 3 is
3. The liquid processing apparatus according to claim 1, wherein the processing liquid contains an organic component additive and a sulfur component additive in advance, and further includes a concentration measuring unit capable of measuring the concentration of the additive. It is characterized by having. In the liquid processing apparatus according to the third aspect, the concentration of the organic component additive and the sulfur component additive previously contained in the processing liquid can be measured because the concentration measuring means is provided. The liquid processing apparatus according to claim 4 is the liquid processing apparatus according to any one of claims 1 to 3, further comprising a measuring unit configured to measure a volume or a weight of the processing liquid after the circulation of the processing liquid. It is characterized by the following. In the liquid processing apparatus according to the fourth aspect, since the measuring device is provided, it is possible to measure the volume or weight of the processing liquid after circulation. A liquid processing apparatus according to a fifth aspect is the liquid processing apparatus according to the first to fourth aspects, wherein the removal unit is configured to be capable of being removed by trapping the reaction product. In the liquid processing apparatus according to the fifth aspect, the reaction product can be trapped. The liquid processing apparatus of claim 6 is claim 1.
The liquid processing apparatus according to claim 4, wherein the removing means is configured to be capable of removing the reaction product by heating. In the liquid processing apparatus according to the sixth aspect, the reaction product can be removed by heating. The liquid processing system according to the seventh aspect includes a processing tank configured to store a processing liquid for applying a predetermined processing liquid. A first processing liquid circulation system provided in the processing tank, a recycling tank provided in the first processing liquid circulation system and configured to store a predetermined amount of processing liquid, and a recycling tank provided in the recycling tank. A second circulating system, wherein the second circulating system includes the processing liquid while circulating the processing liquid, A removing unit configured to remove at least a reaction product generated by the liquid. In the liquid processing system according to claim 7, since the second circulation system is provided with the removing means,
During the circulation of the treatment liquid, reaction products contained in the treatment liquid and generated by the treatment liquid can be removed. The liquid processing system according to claim 8 is the liquid processing system according to claim 7, wherein a predetermined amount of the processing liquid is stored between the processing tank and the recycle tank in the first circulation system. A reservoir tank that is configured to
It is further characterized by being provided. In the liquid processing system according to the eighth aspect, since the reservoir tank is provided, a predetermined amount of the processing liquid can be stored. The liquid processing system according to claim 9 is the liquid processing system according to claims 7 to 8,
On the downstream side of the recycling tank in the first circulation system,
A buffer tank configured to store a predetermined amount of processing solution,
It is further characterized by being provided. A liquid processing method according to claim 10, wherein a processing tank configured to store a processing liquid for performing a predetermined liquid processing on an object to be processed, a processing liquid circulation system provided in the processing tank, and a processing liquid A liquid processing apparatus provided with a removing unit provided in a circulating system, wherein the processing liquid is used when the object to be processed is subjected to a predetermined liquid processing or after the predetermined liquid processing. A step of circulating the liquid in a circulation system, and a step of removing a reaction product contained in the processing liquid and generated by the liquid processing by the removing unit when the processing liquid is circulated. , Is provided.

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment)
A description will be given of the plating processing equipment according to the first embodiment of the present invention.
I will tell. The plating processing equipment according to the present embodiment
Plating process for forming a plating layer on the surface to be plated of W
System and is used repeatedly in the plating system
Plating to re-prepare plating solution with reduced plating capacity
And a liquid regeneration unit. Hereinafter, the present invention
A plating system according to the first embodiment will be described.
I will tell. FIG. 1 shows a plating system according to the present embodiment.
FIG. 2 is a plan view of the plating system.
FIG. 3 is a front view of the plating system.
FIG. 4 is a side view of the plating system. Figure 1 to Figure
As shown in FIG. 4, the plating system 1
Carrier station 2 for loading and unloading and carrying
Process station 3 that actually processes Eha W
It is composed of Carrier station 2 has wafer W
Table 21 for accommodating
Access the rear cassette C to access the rear cassette.
Take out the wafer W or store the processed wafer W
And a sub-arm 22 that can be used. Carry
A plurality of, for example, 25 wafers W are stored in the cassette A.
It is housed vertically at equal intervals
Swelling. For example, on the mounting table 21 in the X direction in FIG.
Four carrier cassettes C are provided.
You. The sub arm 22 is a rail arranged in the X direction in FIG.
As it moves on the top, the vertical direction (Z direction), ie, the paper in FIG.
A structure that can move up and down in a direction perpendicular to the surface and rotate in a horizontal plane
It has a structure. The sub arm 22 extends in a substantially horizontal plane.
It has a retractable wafer holding member 23 and
On the mounting table 21 by expanding and contracting the eha holding member 23
Unprocessed wafers W in the carrier cassette C placed in the
Removed from carrier cassette C or completed processing
The wafer W is stored in the carrier cassette C.
ing. The sub arm 22 is connected to a process
Transfer wafers W before and after processing even to station 3
It is supposed to do. Process station 3
As shown in FIGS. 1 to 4, the appearance of a rectangular parallelepiped or cube
The entire surrounding area is made of corrosion-resistant material, for example, resin
Or a metal plate whose surface is coated with resin
It is covered with a housing 31. Process station 3
Inside is substantially cubic or rectangular as shown in Figs.
And has a processing space S inside.
Have been. The processing space S is straightforward as shown in FIGS.
This is a rectangular processing chamber, and a bottom plate 33 is provided at the bottom of the processing space S.
Is attached. The processing space S includes a plurality of processing units.
Knit, for example, four plating units M1 to M4
For example, a main arm 35 described below in the processing space S
It is arranged around each. Shown in FIGS. 1 and 2
To transport the wafer W to the substantially center of the bottom plate 33 as shown in FIG.
Main arm 35 is disposed. This main arm
The arm 35 can be moved up and down and rotated in a substantially horizontal plane.
Holding two upper and lower wafers that can expand and contract in a substantially horizontal plane
A member 36 is provided.
It is arranged around the main arm 35 by expanding and contracting.
The wafers W before and after processing into and out of the processed processing unit
Can be used. The main arm 35 is vertical
Moves in the vertical direction to access the upper processing unit
From the lower processing unit to the upper processing unit.
Transfer the wafer W to the processing unit, and vice versa
Wafer W from the processing unit on the lower side to the processing unit on the lower side
Is transported. Furthermore, this main arm 3
5 is provided with a mechanism for turning the held wafer W upside down.
The wafer W from one processing unit to another processing unit.
Equipped with a structure that allows the wafer W to be turned upside down while transferring
I have. The function of reversing the wafer W is provided by the main arm.
This is not an essential function of the system 35. Other processing units are on the upper side.
The cleaning unit 100, for example, has two
The side near the rear station, that is, the plating unit
M1 and M2, respectively. Also,
For example, the annealing processing unit has two carriers, for example.
Station far side, that is, the plating unit
It is provided above each of the sockets M3 and M4. this
The plating system includes plating units M1 to M4
The cleaning unit 100 and the annealing unit
The footprint is kept small because
Can be. Of the housing 31 of the process station 3
Of which is located at a position facing carrier station 2.
The opened housing 31a has three openings as shown in FIG.
Openings G1 to G3 that can be closed are provided. these
G1 is a plating unit M1 disposed on the lower side.
Corresponds to the position of the intermediary mounting table 37 disposed between
Opening from the carrier cassette C to the sub-arm
The unprocessed wafer W taken out by 22 is processed by a process station.
It is used when carrying in to room 3. Open when importing
The sub-arm holding the unprocessed wafer W with the section G1 opened
22 extends the wafer holding member 23 into the processing space S
The wafer W is placed on the relay mounting table 37. This relay mounting table 3
7, the main arm 35 extends the wafer holding member 36.
To hold the wafer W placed on the
Up to the inside of the processing units such as the stick processing units M1 to M4
Carry. The remaining openings G2 and G3 carry the processing space S.
The cleaning unit provided near the station 2
It is located at a position corresponding to
The sub arm 22 is placed in the processing space S through the mouths G2 and G3.
Directly to the cleaning unit 100 disposed on the upper side of the
Wafer W processed by extending eha holding member 23
Can be received. Also processing
In the space S, a downward airflow is formed from above in FIG.
Clean air supplied from outside the system
The cleaning unit 100 is supplied from the upper part of the space S,
Flow down to the plating units M1 to M4
So that it is exhausted from the bottom of the space S and exhausted out of the system
It has become. Thus, the processing space S is cleaned from top to bottom.
By flowing clean air, the lower plating unit
From M1 to M4 to the upper cleaning unit 100
The air does not flow. Therefore, always wash
The processing unit side is maintained in a clean atmosphere. Furthermore,
Plating units M1 to M4 and cleaning unit 10
The inside of each processing unit such as 0 is larger than the processing space S of the system.
Negative pressure is maintained, and the air flow is from the processing space S side
Flows into each processing unit, and from each processing unit
It is exhausted outside the stem. Therefore, from the processing unit side
Dirt is prevented from being diffused to the processing space S side. next,
A description will be given of the plating unit M1 according to the present embodiment.
I will tell. FIG. 5 shows a plating unit according to the present embodiment.
FIG. 4 is a schematic vertical sectional view including a partially enlarged view of M1;
FIG. 6 is a schematic plan view of the plating unit M1.
As shown in FIGS. 5 and 6, this plating unit M
In 1, the whole unit is covered with a housing 41 having a closed structure.
Have been done. The housing 41 is also made of a corrosion-resistant material such as resin.
Fees. The inside of the housing 41 is up and down 2
Stage, that is, the first processing unit A located in the lower stage and the first processing unit A located in the upper stage
And a second processing unit B. First
A plating bath 42 is provided inside the processing section A.
You. This plating solution tank 42 has an inner tank 42a and an outer tank 42a.
Double outer tank 42b arranged concentrically with inner tank 42a on the side
It is composed of a tank. The inner tank 42a has a substantially cylindrical shape with a bottom.
The bottom of the inner tank 42a is formed inside the inner tank 42a.
A jet pipe 43 for jetting a plating solution from the surface side toward the upper surface
Is protruding. Around the ejection pipe 43, for example, a plurality of copper
An electrode as a substantially disk-shaped anode formed by collecting spheres
44 is provided concentrically with the inner tank 42a. Squirt pipe 4
3 between the outer periphery of the end and the inner tank 42a.
A diaphragm 45 is provided above the electrode 44 for partitioning into
Above the inner tank 42 a partitioned by the diaphragm 45 (hereinafter referred to as “
Above the tank ". ) Is supplied with the plating solution of the ejection pipe 43.
Under the inner tank 42a partitioned by the diaphragm 45 (hereinafter referred to as "
The lower side of the tank. ) Is plated from circulation piping described later
The liquid is supplied. Also, this diaphragm 45
Permeates ions, but dissolves copper spheres as electrodes 44
Impurities and the surface of the wafer W to be plated
Through bubbles such as oxygen and hydrogen generated during the
It is configured not to let it pass. In addition, the inner tank 42a
Circulation pipes 46 and 47 are located at positions eccentric from the center of the bottom.
Provided between the circulation pipes 46 and 47.
No pumps are provided. The outer tub 42b includes the inner tub 4
2a, it is formed in a substantially cylindrical shape with a bottom.
A pipe 48 is connected to the bottom of 2b. With piping 48
A pump 49 is provided between the discharge pipe 43 and the discharge pipe 43.
The pump 49 is operated to overflow from the inner tank 42a.
The plating solution stored in the outer tank 42b is returned to the inner tank 42 again.
is supplied to the upper side of a. In addition, piping 48
a represents a plating solution regenerating unit containing a plating solution, which will be described later.
The reservoir tank 50a disposed in the
And a valve 52a. This pump 5
1a and opening the valve 52a.
The plating solution in the reservoir tank 50a is supplied to the inner tank 42a.
To be paid. In addition, this reservoir tank 5
0a is a pipe 48b of the plating units M2 to M4.
48d is pumps 51b to 51d and valves 52b to 52d
Connected to each other. The second processing unit B
The driver 61 as a holding mechanism for holding the wafer W is
It is disposed directly above the center of the liquid tank 42. Also Dora
The wafer 61 has a holding portion 62 for holding the wafer W,
Motor 6 for rotating the wafer W together with the part 62 in a substantially horizontal plane
And 3. It is shown in a partially enlarged view in FIG.
For example, on the inside of the bottom surface of the holding portion 62,
Contact for applying a voltage to the wafer W at the closed position
A gate 64 is provided. This convex contact 64 is shown in FIG.
It is in electrical contact with a power supply (not shown) via a conductor. Convex
For example, the contact 64
A wafer W on which a copper thin film has been formed in advance by sputtering
The voltage applied to the convex contact 64 is
The voltage is also applied to the surface of the wafer W to be plated. The holding unit 6
A seal member 65 is provided inside the bottom surface of 2. Mo
The cover 63 is made of a corrosion-resistant material such as resin.
6 is covered. The outer container of the motor 63 is
A support beam 67 for supporting the driver 61 is attached.
The end of the support beam 67 is in contact with the inner wall of the housing 41.
It is attached so as to be able to go up and down through the id rail 68.
You. The support beam 67 is further provided with a cylinder 6 which can expand and contract vertically.
9 and is attached to the housing 41 via
Driving cylinder 69 supports beam 67
Driver 61 moves up and down along guide rail 68
Then, the wafer W is moved up and down. Specifically
Is placed on the holding portion 62 of the driver 61 as shown in FIG.
The transferred wafer W is transferred to a transfer position (I) for transfer, and
Cleaning position for cleaning the EHA W plating surface
(II) for cleaning the convex contact 64
A position (III) slightly higher than the cleaning position (II) and extra
Spin dry to remove the plating solution and moisture
Dry position (IV) and plating on the surface to be plated of wafer W
In the plating solution tank 42 with the plating position (V) for forming the layer
Up and down between five different height positions on the mandrel
I do. Cleaning between the first processing unit A and the second processing unit B
Built-in nozzle 70 and exhaust port 71 arranged below it
A separator 72 is provided. This separator
The wafer W held by the driver 61 is located at the center of 72.
It can move back and forth between the first processing unit A and the second processing unit B
A through hole is provided as described above. Also, the first processing unit A
To the housing corresponding to the boundary between
Is a gate for loading / unloading the wafer W into / from the plating unit M1.
A port valve 73 is provided. Next, the wafer W
A plating system 1 for forming a plating layer on the surface of the pin and
Flow of plating process performed in plating unit M1
Will be described. FIG. 7 shows a plating process according to the present embodiment.
Is a flowchart showing the flow of the entire management system 1.
FIG. 8 shows a plating unit M1 according to the present embodiment.
Flowchart showing the flow of the plating process performed in
It is. As shown in FIG.
It is carried into the system 1 (step 1). Then, as shown in FIG.
A plating layer is formed on the surface to be plated of the wafer W by such a flow.
(Step 2 (1) to Step 2 (14)). Ue
After forming a plating layer on the surface to be plated of W,
And annealing treatment, and the plating system 1
Eha W is carried out (steps 3 to 5). Next
Next, the plating solution regeneration unit according to the present embodiment
explain. FIG. 9 shows a plating solution regenerating unit according to the present embodiment.
FIG. As shown in FIG.
The pipes 48a to 48d of the knits M1 to M4 are described above.
Solution supplied to plating units M1 to M4
Alternatively, the message discharged from the plating units M1 to M4 may be used.
The reservoir tank 50a for storing the liquid is a pump 51a.
Through 51d and valves 52a through 52d, respectively.
Has been continued. These pumps 51a to 51d and valve
The reservoirs are controlled by controlling the
The plating solution can be freely supplied from the bath tank 50a.
M1 to M4 or plating solution processing units M1 to M
4 can be discharged. Likewise
Plating unit installed in another plating system
The pipes 48a 'to 48d' of the cuts M1 'to M4'
Pump 50a'-51d 'and valve
Are connected via the buses 52a 'to 52d', respectively.
You. These pumps 51a'-51d 'and valve 52
a 'to 52d', respectively, to control the reservoir.
Plating unit that can freely supply plating solution from tank 50b
Supply or plating solution processing unit M1 'to M1' to M4 '
~ M4 '.
This ensures that the concentration of the plating solution in the reservoir tank is
When the value becomes, the control means (not shown) will be described later.
It is configured so that plating solution can be supplied to the recycling tank.
You. An illustration not shown in the reservoir tanks 50a and 50b
For example, concentration measuring devices such as CVS are provided.
The concentration of the additives contained in each plating solution.
It can be measured. In addition, reservoir tank 5
Piping with switching valve 120 for 0a and 50b
121 is connected, and this piping 121 is described later.
Connected to a plating solution regenerating device 150. This distribution
By operating the switching valve 120 of the pipe 121,
For example, plating units M1 to M4 and another plating
From the plating units M1 'to M4' of the processing system
The discharged and stored in the reservoir tanks 50a and 50b.
The product containing additives decomposed by the reaction
The plating solution (hereinafter referred to as “used plating solution”)
It can be transferred to the plating solution regenerating device 150
Swelling. The plating solution regenerating device 150 is used
From plating solution, additives, decomposition products of additives and particles
Plating solution from which impurities such as metal
Tank for adding deficient components (including additives) to water
160 and added the missing components and readjusted to the prescribed formulation
Buffer as processing solution storage means for storing plating solution
And a tank 180. In recycling tank 160
Is connected to the pipe 121, and the reservoir tank 5
Store used plating solution transferred from 0a, 50b
It is supposed to be. In addition, in recycling tank 160
Has a pipe 161 connected to the recycle tank 160 at both ends.
Have been killed. This pipe 161 is used for a used plating solution.
It is sent to a filter 163 described later,
The filtered plating solution is returned to the recycling tank 160 again.
It has a circulatory structure that returns. This pipe 161
Includes a pump 162 and a filter as a filtering member, for example.
163 is provided and used by the operation of the pump 162
Filter the plating solution with a filter 163.
And the additive contained in the used plating solution by
Removes decomposition products and particles of additives.
ing. Here, the additive is generally added to the plating layer on the wafer W.
Promotes the growth of, for example, copper crystals as a substance forming
It is composed of an accelerator that suppresses growth and an inhibitor that suppresses growth.
You. This accelerator is mainly composed of organic components,
Inhibitors are mainly composed of sulfur-based components. This file
The main components in the additives that can be removed by
It is a mechanical component, and specifically, has a diameter similar to that of a polymer compound.
It is a large compound. The filter 163 is connected to a pipe 161.
And the roughness of the filter 163
Remove large compounds such as high molecular compounds.
And specifically, for example, the first fill
Use a filter with a roughness of 0.1μm or more for the filter 163a
The second filter 163b has, for example, 0.1 μm or less.
Use a roughness filter. Also, preferably the first
A filter having a roughness of 0.1 μm is used for the filter 163a.
And the second filter 163b has a roughness of 0.05 μm.
Use filters. Here, filters with different roughness
163 is provided at two locations because of the roughness of 0.1 μm or more.
Most of the large diameter compounds are filtered by the first filter 163a.
The second fill having a roughness of 0.1 μm or less
Filter 163b, the diameter of which has passed through the first filter 163a.
This is for surely removing the threshold compound. Also, resai
A heating unit for heating the used plating solution
For example, a heater 164 is provided as a material. this
The used message in the recycle tank 160 is
Additives, additives decomposition products and
It removes particles. Where
The components in additives that can be removed by heat are mainly organic
System components, specifically, such as acetone
Can be removed by the first and second filters 163a and 163b.
It is a low molecular compound having a small diameter and a low boiling point.
The heating temperature of the heater 164 is a low boiling low molecular compound.
To separate low molecular weight compounds and copper sulfate aqueous solution
Temperature, specifically, for example, 40 ° C. to 6 ° C.
0 ° C., preferably about 50 ° C. Heater 164
The heating temperature of the above is set to the above range, if it exceeds this range
Because it is close to the boiling point of water, it can be regarded as the main component of the plating solution
If the copper sulfate aqueous solution evaporates, the plating solution
There is a problem that the volume will decrease, and if it falls below this range
Low-molecular compounds with low boiling points such as acetone reach the boiling point
Low molecular weight compounds and copper sulfate aqueous solution
There is a problem that they cannot be divided. Furthermore, Lisa
In the tank 160, for example, as a metallic adsorption member,
The mesh filter 165 is disposed in a substantially horizontal plane.
A power supply 166 is connected to the mesh filter 165.
Have been. With the electricity supplied from the power supply 166,
A current flows through the mesh filter 165.
By passing a current through the mesh filter 165,
The additive, decomposition products of the additive, and particles.
It is designed to be adsorbed on a filter and removed. This
Here, it is necessary to supply a current to the mesh filter 165.
The components in the additives that can be removed more are mainly sulfur-based components.
Minutes. Both ends of the recycling tank 160 are recycled.
Piping 16 with pump 167 connected to
8 is connected to operate this pump 167
So that the plating solution circulates in the recycling tank 160
It has become. In addition, for example, liquid
Volume measurement device (not shown) such as surface sensor or weight measurement
The volume measuring device or the weight
The filter 163, the heater 164, and the
Decomposition of additives and additives using the ash filter 165
Plating to remove impurities such as objects and particles
The volume or weight of the liquid is measured. Further
In addition, the recycling tank 160 has a message such as CVS.
A concentration measuring device 169 for measuring the concentration of each component of the solution is provided.
Has been established. The additive,
Removes impurities such as decomposition products and particles of additives.
I began to measure the concentration of each component of the plating solution
I have. In addition, the recycling tank 160 is provided with the above volume measuring device.
Alternatively, the measurement result of the weight measuring device and the concentration measuring device 169
Based on the measurement result, the control means (not shown)
An addition device 170 for adding each component of the liquid concentrate is provided.
You. Further, the addition device 170 includes a buffer tank described later.
Alternatively, a configuration in which a predetermined amount of additive can be supplied may be adopted. This
When each deficient component of the plating solution is added by the adding device 170 of
Used plating solution by controlling the amount of addition
The concentration of each component contained in the plating solution
Can be returned to the minute concentration. here
Then, the substance to be added to the plating solution by the adding device 170 is
Are mainly additives and others such as water, copper, salt
Acids and sulfuric acid are also added. Also, the recycling tank 160
Has one end connected to the recycle tank 160 and the other end
A pipe 171 connected to the tank 180 is provided.
You. This pipe 171 has a pump 172 and a valve 173.
Operating the pump 172 and the valve 1
By opening 73, the recycle tank 160
Transfer the plating solution whose components have been readjusted to the buffer tank 180.
It is designed to be sent. Buffer tank 180 has both ends
A pipe 181 connected to the buffer tank 180 is provided.
The pipe 181 is supplied from the buffer tank 180 by a predetermined amount.
The reconstituted plating solution is sent to a filter 183 described later.
The plating solution filtered by the filter 183.
It returns to the buffer tank 180 again. This distribution
The pipe 181 is provided with a pump 182 and a filter 183.
Has been re-adjusted to the prescribed formulation by the operation of the pump 182.
When the plating solution passes through the filter 183, it is recovered.
Particles not removed in cycle tank 160
Such impurities are removed. The above filter
183 are provided at two places in the pipe 181,
The roughness of the filter 183 is not removed in the recycle tank 160.
Impurities such as decomposed products and particles of additives
The roughness is such that can be removed.
Filter 183a has a roughness of 1 μm or more.
Used, and the fourth filter 183b has, for example, 0.1 μm
It is preferable to use a filter having the above roughness. Ma
Both ends of the buffer tank 180 are in contact with the buffer tank 180.
A pipe 186 provided with a continuous pump 185 is connected.
By operating the pump 185, the buffer tank
The plating solution re-adjusted to the prescribed composition circulates inside 180.
It has become so. Further, the buffer tank 180 has
One end is connected to the buffer tank 180, and the other end is a reservoir tank.
Pipes 187 connected to the pipes 50a and 50b are provided.
I have. This pipe 187 is connected to a pump 188 and a switching valve
189 to operate the pump 188
By switching the switching valve 189 to
The plating solution re-adjusted to the prescribed composition is
It can be supplied to the reservoir tanks 50a and 50b freely.
It has become. Next, the flow of the plating solution regeneration unit
Will be described. FIG. 10 shows the plating solution according to the present embodiment.
Flow chart showing the flow of plating solution regeneration performed in the raw unit
It is a low chart. As shown in FIG.
For example, C (not shown) provided in
The concentration of each reservoir tank is measured with a concentration measuring device such as VS.
Measure the concentration of the additive contained in the solution and use it as an additive.
To determine whether or not it has plating processing capability (step
6 (1)). Plating in each reservoir tank 50a, 50b
If it is determined that it has the processing capacity,
Key processing is performed. In each reservoir tank 50a, 50b
If it is determined that the additive has no plating capacity
Operates, for example, the pump 51a and the valve 5
2a is opened and the used plating solution is poured into the plating solution tank M1.
From the tank to the reservoir tank 50a via the pipe 48a
(Step 6 (2)). And then the reservoir
Switching valve in the pipe 121 connected to the
Activate the valve 120 and discharge from the plating unit M1
Used message stored in the reservoir tank 50a.
Transfer the liquid to the recycling tank 160 (Step 6)
(3)). Used waste transferred to recycling tank 160
Piping 168 connected to recycle tank 160 for plating solution
The pump 167 is operated to circulate through the recycle tank 160.
Ring. The used plating solution is stored in the recycling tank 1
With the operation of the pump 162 in the pipe 161 connected to 60
The first filter 163a and the second filter 163b
Passed and filtered. This first filter 1
63a and the second filter 163b fill the plating solution.
Included in the used plating solution
Additives, large in size like high molecular compounds of organic components
Compounds can be removed and the diameter is relatively small.
Large particles can also be removed. Also,
The used plating solution in the recycling tank 160 is the heater 1
64, contained in the used plating solution
Low molecular weight compounds with a small boiling point and a small organic component diameter
Decomposition products of additives and particles evaporate. plating
Since the difference in boiling point between the liquid and the additive is used,
More reliably remove additives, mainly organic components, from the liquor
be able to. Further, the electric power supplied from the power supply 166
By supplying electricity to the metallic mesh filter 165 with
Current flows through the mesh filter 165 and the used mesh
Additives, mainly sulfur-based components, contained in
Adsorbed on the filter 165. Energized mesh filter 1
Additives are adsorbed to 65, so used plating solution
Additives, mainly sulfur-based components, can be removed more reliably.
(Step 6 (4)). Additives, decomposition products of additives and
Used plating solution with impurities such as particles and particles
After use, for example, used with a weighing device (not shown)
The weight of the plating solution is measured (step 6 (5)). Me
Plating solution from which impurities were removed after measuring the weight of the solution
For example, CVS provided in the recycling tank 160
The concentration of each component of the plating solution is measured by a simple concentration measuring device 169.
The measurement is performed (Step 6 (6)). The message with impurities removed
After measuring the concentration of each component of the liquor,
Based on the measurement result and the measurement result of the concentration measurement device 169,
Each missing component of the plating solution is converted into the plating solution by the adding device 170.
And re-prepared to the prescribed formulation (step 6
(7)). Additives and parties from used plating solution
After removing the particles, add an additive to the plating solution
The plating solution is re-prepared to the specified formulation, so the plating solution needs to be changed frequently.
To reduce the amount of waste liquid
The strike can be reduced. In addition, according to the present embodiment,
Multiple plating systems are installed in the plating facility
The plating solution regenerating apparatus 150
One can process. In other words, there is no message
There are multiple plating systems in the processing equipment.
The plating solution regenerating device 150 is sufficient.
As a result, the cost can be reduced. Then Lisa
Inside pipe 171 connecting cycle tank 160 and buffer tank 180
Of the pump 172 and opening of the valve 173
Release the components of the plating solution in the recycling tank 160
The transferred plating solution is transferred to the buffer tank 180 (step
6 (8)). Predetermined formulation transferred to buffer tank 180
The re-adjusted plating solution is supplied to the port provided in the pipe 186.
The operation of the pump 185 circulates in the buffer tank 180. Ma
In addition, the plating solution re-prepared to a predetermined composition
Pump 18 disposed in a pipe 181 connected to
In operation 2, the third filter 183a and the fourth filter
183b. This third filter 183a and
The reconditioned plating solution passes through the fourth filter 183b.
Was not removed in the recycle tank 160
Removes impurities such as decomposition products and particles of additives
(Step (9)). Buffer tank 18
The third filter 183a provided in the pipe 181
And passing the plating solution through the fourth filter 183b.
After removing the impurities in the liquid,
The operation of the pump 188 disposed in the connected pipe 187
Operation and switching of the switching valve 189 to a predetermined arrangement.
The reconditioned plating solution is supplied to the reservoir tank 50a.
(Step (10)). In reservoir tank 50a
The stored plating solution that has been readjusted to the prescribed composition is supplied to the pipe 4
Of the pump 51a and the valve 52
is transferred to the plating solution processing unit M1 again by opening a.
(Step 6 (11)). After that, the plating unit
The plating process is started in the procedure M1 by the above operation procedure. (Second Embodiment) Hereinafter, a second embodiment of the present invention will be described.
Will be described. The first embodiment of the present embodiment
The description of the contents overlapping with the embodiment is omitted. Book
In the embodiment, an impurity removing means is provided below the inner tank.
The configuration was adopted. FIG. 11 shows the plating solution tank according to the present embodiment.
FIG. 12 is a schematic vertical sectional view of the inner tank 42a, as shown in FIG.
The inner tank 42 in the plating unit M1 of the present embodiment
One end of a pipe 190 is connected to a. Also plumbing
The other end of 190 is connected to the circulation pipe 46 and the inner tank 4
Returning the plating solution discharged from 2a to the inner tank 42a again
Is available. Impure inside the pipe 190
For example, the membrane filter 191 as an object removing means
It is arranged. This membrane filter 191 is an inner tank
For example, the amount of the additive contained in the plating solution on the lower side of 42a
The main component is the decomposition product and copper oxide formed on the electrode 44.
Film, such as a peeled black film
Use a filter with a roughness capable of collecting pure substances, preferably
A filter with a roughness of 0.1 μm is used. This membrane
Filter 191 is disposed between the diaphragm 45 and the circulation pipe 46.
The additives can be decomposed electrically or spontaneously
Separation of decomposed decomposition products and exfoliated black film
It can be collected before passing through the membrane 45. Also,
Measures decomposition products of additives and exfoliated black film.
The current density is improved by collecting with the membrane filter 191.
The surface of the wafer W to be plated more uniformly.
A key layer can be formed. The present invention relates to the first method.
And what is described in the second embodiment.
However, the structure, material, arrangement of each member, etc.
It can be changed as appropriate without departing from the scope. For example, the first
In the embodiment, the recycle tank 160 is provided with an additive and a
Filter 163 and heat
164 and a mesh filter 165
At least one of the filter 163 and the heater 164
It is sufficient if one is provided. Further, the first embodiment
Then, the plating solution regenerating device 150 is
And a buffer tank 180.
180 may not be provided. That is, the recycling tank 16
From 0 to each reservoir tank 50a, 50b.
A supplied plating solution may be supplied. In addition, the first embodiment
In the embodiment, the reservoir
The tanks 50a and 50b are provided, but the reservoir tank 5
It is not necessary to dispose 0a and 50b. In other words, each plating
Plating solution directly from processing unit to recycling tank 160
May be discharged. Also, re-prepared in the recycling tank 160
May be supplied directly to each plating unit.
No. In the first embodiment, the plating equipment
There are multiple plating systems in the building, but one
May be. In other words, one for one plating system
May be provided. Also on
In the first embodiment, the plating process will be described.
However, if it is related to liquid treatment, it can be applied.
Noh. In the second embodiment, the impurity removal is performed.
Although a membrane filter is used as a
The filter is not limited to a filter such as a Blen filter. One
Of the decomposition products and black by sedimentation or centrifugation.
It is also possible to remove the exfoliated material of the film. Further
In the first and second embodiments, the substrate to be processed is
LCD glass base for liquid crystal
It is also possible to use plates.

As described above in detail, according to the processing liquid regenerating method, the processing liquid regenerating apparatus and the liquid processing equipment of the present invention,
Remove the additives and the decomposition products of the additives contained in the processing solution from the processing solution, measure the concentration of each component of the processing solution, add each component to the processing solution, and have a predetermined composition. Re-prepare. Therefore, the frequency of replacement of the processing liquid can be reduced, and the amount of waste liquid can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a plating system according to a first embodiment.

FIG. 2 is a plan view of the plating system according to the first embodiment.

FIG. 3 is a front view of the plating system according to the first embodiment.

FIG. 4 is a side view of the plating system according to the first embodiment.

FIG. 5 is a schematic vertical sectional view including a partially enlarged view of the plating unit according to the first embodiment.

FIG. 6 is a schematic plan view of a plating unit according to the first embodiment.

FIG. 7 is a flowchart showing a flow of the entire plating system according to the first embodiment;

FIG. 8 is a flowchart showing a flow of a plating process performed by the plating unit according to the first embodiment.

FIG. 9 is a schematic diagram of a plating solution regenerating unit according to the first embodiment.

FIG. 10 is a flowchart showing a flow of plating solution regeneration performed by a plating solution regeneration unit according to the first embodiment.

FIG. 11 is a schematic vertical sectional view of an inner tank of a plating solution tank according to a second embodiment.

FIG. 12 is a schematic vertical sectional view of a conventional plating apparatus.

[Explanation of symbols]

 W: Wafer M1 to M4: Plating unit M1 'to M4': Plating unit 150: Plating solution regenerating unit 160: Recycling tank 163: Filter 164: Heater 165: Mesh filter 169: Concentration measuring device 170: Addition device 180: Buffer tank

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C25D 21/18 C25D 21 / 18GH H01L 21/304 648 H01L 21/304 648Z (72) Inventor Hiroshi Sato F-term (reference) 4K024 AA09 BA11 BB12 BC10 CB26 in 650 Misasa, Hosaka-cho, Nirasaki-shi, Yamanashi Prefecture

Claims (10)

[Claims] 1. A processing tank configured to store a processing liquid for performing a predetermined liquid processing on an object to be processed, a processing liquid circulation system provided in the processing tank, and a processing liquid circulation system provided in the processing liquid circulation system. And a removing unit provided, wherein the removing unit circulates the processing liquid,
A liquid processing apparatus, wherein a reaction product contained in the processing liquid and generated by the processing liquid is at least removable. 2. An organic component additive and / or
The liquid processing apparatus according to claim 1, further comprising an additive supply means capable of supplying a sulfur-based component additive. 3. The processing solution according to claim 1, wherein the processing liquid contains an organic component additive and a sulfur component additive in advance, and further comprises a concentration measuring means capable of measuring the concentration of these additives. Liquid treatment equipment. 4. The liquid processing apparatus according to claim 1, further comprising a measuring unit configured to measure a volume or a weight of the processing liquid after the circulation of the processing liquid. 5. The liquid processing apparatus according to claim 1, wherein said removing means is configured to be able to remove said reaction product by trapping said reaction product. 6. The apparatus according to claim 1, wherein the removing unit is configured to remove the reaction product by heating.
A liquid processing apparatus according to any one of claims 1 to 4. 7. A processing tank configured to store a processing liquid for applying a predetermined processing liquid, a first processing liquid circulation system provided in the processing tank, and a first processing liquid circulation system. And a second circulating system provided in the recycling tank, wherein the second circulating system is provided with a recycling tank configured to store a predetermined amount of the processing liquid. Removing means configured to be able to at least remove a reaction product contained in the processing liquid and generated by the processing liquid when the processing liquid is being circulated. A liquid processing system characterized by the above. 8. The method according to claim 1, further comprising a reservoir tank configured to store a predetermined amount of the processing liquid between the processing tank and the recycle tank in the first circulation system. The liquid processing system according to claim 7, wherein 9. The apparatus according to claim 7, further comprising a buffer tank configured to be able to store a predetermined amount of the processing liquid, on a downstream side of the recycle tank in the first circulation system. 9. The liquid processing system according to any one of items 1 to 8. 10. A processing tank configured to store a processing liquid for performing a predetermined liquid processing on an object to be processed, a processing liquid circulation system provided in the processing tank, and a processing liquid circulation system provided in the processing liquid circulation system. A liquid processing apparatus using the liquid processing apparatus, comprising: performing a predetermined liquid processing on the object to be processed, or after performing the predetermined liquid processing, by using the processing liquid circulation system. And circulating the processing liquid, and removing the reaction product contained in the processing liquid and generated by the liquid processing by the removing unit. A liquid processing method characterized by the above-mentioned.