JP2001314979A - Method for producing ceramics and copper clad material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing stably a clad material composed with ceramics and Cu, making thick metal lamination with ceramics possible. SOLUTION: Between ceramics and Cu, at least one of Ti, Zr, Hr of 10-50% is contained, at least one of 1-10% out of V, Nb, Cr, Mo, Mn, Ni is added to the alloy amorphous alloy composed with residue Cu and inevitable impurity is intervened and by making the temperature kept so that the amorphous alloy only is melted, liquid phase diffusion bonding is performed to produce the clad material having sufficient joint strength.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a clad material composed of ceramics and copper.

[0002]

2. Description of the Related Art Ceramics have various characteristics and are widely used as industrial materials, but have poor machinability,
It is not widely used for applications requiring precise processing.
In order to supplement the workability of this ceramic, it has been devised to bond a metal having good workability. So far, metal such as vapor deposition can be deposited in a gaseous state.

[0003]

However, in the above-mentioned method, it is impossible to bond a metal very thin, for example, to a thickness of 1 mm or more, and it has been difficult to apply the method to a field having a large processing amount. The present invention has been conceived in order to solve the above-mentioned problems, and for example, it has become possible to bond a thick metal of 1 mm or more to ceramics, and to produce a clad material having a sufficient bonding strength. The purpose is to do.

[0004]

The gist of the present invention for solving the above problems is as follows. (1) Between ceramics and copper, at least one of Ti, Zr, and Hf is contained in an amount of 10 to 50 at%, and the balance is C
ceramics and copper which are heated at a temperature not lower than the melting point of the amorphous alloy to be used and not higher than the melting point of the copper for a period of not less than 3 minutes and not more than 2 hours by interposing an amorphous alloy comprising u and unavoidable impurities. Manufacturing method of clad material. (2) At least one of Ti, Zr, and Hf is contained between 10 and 50 at% between ceramics and copper;
It contains at least one of Nb, Cr, Mo, Mn, and Ni in an amount of 0.1 to 10 at%, and the balance is at least the melting point of the amorphous alloy used, A method for manufacturing a clad material of ceramics and copper, wherein the heating is performed at a temperature of not more than the melting point of not more than 3 minutes and not more than 2 hours.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The method of the present invention employs copper as a metal to be bonded to ceramics, laminates a predetermined amorphous alloy as an intermediate material between ceramics and copper, and heats the laminated material. Then, only the amorphous alloy is melted and liquid-phase diffusion-bonded to form a clad material. By manufacturing such a clad material, it is possible to bond a thick metal to ceramics.

In order to realize liquid phase diffusion bonding using an amorphous alloy, it is necessary to heat the laminated material composed of ceramic and copper to a temperature higher than the melting temperature of the amorphous alloy. However, in order to prevent both ceramics and copper from melting, the heating temperature is set to the upper limit of the heating temperature at the lower melting point of copper.

Further, in order to obtain a liquid-phase diffusion bond having a sufficient strength, it is necessary to maintain the above-mentioned heating temperature to some extent. In liquid phase diffusion bonding using an amorphous alloy, since the solute element in the amorphous alloy diffuses into the material to be joined and the melting point of the amorphous alloy itself increases to cause solidification, the bonding is developed. This is because it takes time. In the present invention, this time is set to 3 minutes or more and 2 hours or less.

[0008] The reason for the limitation of the holding time will be explained. The higher the holding temperature, the shorter the holding time, but at least 3 minutes are required to obtain a stable bonding strength. Conversely, a longer holding time is better, but an excessive holding time is disadvantageous in terms of time and manufacturing cost. In this regard, in the case of the amorphous alloy used in the present invention, it is sufficient to hold for 2 hours even if the temperature is held just above the melting point.

The amorphous alloy used as the intermediate material in the present invention contains at least one of Ti, Zr, and Hf in an amount of 10 to 50 at%, or contains V, Nb, Cr, Mo, Mn, and Ni in addition to the alloy. At least one of
It is an amorphous alloy containing 0.1 to 10 at% of a seed, the balance being Cu and unavoidable impurities. Here, the remainder is made of Cu in order to obtain amorphous formation and bonding strength, and unavoidable impurities are trace amounts of gas components such as Fe, nitrogen, and oxygen. By using these amorphous alloys, a sufficient bonding strength can be obtained stably.

The reasons for limiting the content of each constituent element in these alloys are as follows. Basically, it is desirable that the intermediate material used for the liquid phase diffusion bonding has a low melting point and a uniform composition. Therefore, in the present invention, it is preferable to use an amorphous alloy. Therefore, Ti,
The content of at least one of Zr and Hf is adjusted to 10 to 50.
At% range. Although the melting point of the amorphous alloy depends on the alloy components, the melting point of the amorphous alloy can be further reduced by containing at least one of V, Nb, Mo, Mn, and Ni in the range of 0.1 to 10 at%. Can be achieved.

When such an amorphous alloy is used,
By liquid phase diffusion bonding of ceramics and copper, a clad material having high bonding strength enough to withstand various types of machining can be manufactured, and a thick metal can be bonded to ceramics. Since the thickness of copper can be changed arbitrarily, a metal having an arbitrary thickness can be bonded to ceramics.

Further, when holding the laminated material composed of ceramics and copper in the heating condition range of the present invention, it is preferable to apply a pressure of about 10 kPa or more. Of course, this degree of pressure can also be achieved by the weight of the base material. This is because the materials to be joined must be in contact with each other in order for the solute element in the amorphous alloy to diffuse, and a certain degree of pressurization is required to realize this.

According to the method of the present invention, the ceramics and copper can be formed in a tube or any other shape in addition to the plate shape. Liquid phase diffusion bonding is possible. Moreover, the obtained clad material has strong bonding strength, and can be used as a product in the same shape.

In the method of the present invention, heating can be performed in the air, and a general-purpose heating device without a conventional vacuum exhaust device or an atmosphere adjusting device for providing a non-oxidizing atmosphere can be used. Further, as the ceramic used in the method of the present invention, various fixed ceramics such as alumina, magnesia, and silicon nitride can be used.

[0015]

EXAMPLE 1 One round bar-shaped alumina having a diameter of 30 mm and a length of 50 mm and two pure coppers having a diameter of 30 mm and a length of 100 mm were used. As shown in FIG. Pure copper was butted up and down, and No. 1 in Table 1 was used as an intermediate material at two butted portions of alumina and pure copper. 1 to
The two butted portions were heated with the amorphous alloy foil shown in FIG. 6 interposed. The pressure during butting is 5MPa
And The heating was performed in the air by a high frequency induction method as shown in FIG. The heating rate during heating is about 5 ° C /
In a minute, the material was heated to a predetermined temperature, kept at that temperature for a predetermined time, and then allowed to cool to obtain a clad material. Table 1 also shows the holding temperature and the holding time.

The obtained clad material was subjected to a tensile test using an Instron type tensile tester. The obtained results are shown in Table 1. All the samples were found to have a base material fracture in alumina, and the strength was about 20 MPa. It has been found that a clad material having high bonding strength can be obtained by the method of the present invention.

[0017]

[Table 1]

Example 2 One round bar-shaped silicon nitride having a diameter of 30 mm and a length of 50 mm and a diameter of 30 mm and a length of 100 mm
A bonding experiment was performed under the same conditions as in Example 1 using two round bar-shaped pure coppers. No. in Table 1 was used as the intermediate material.
The amorphous alloys 7 to 12 were used. The obtained clad material was subjected to a tensile test in the same manner as in Example 1. The results are shown in Table 1. As shown in Table 1, all the samples were fractured in the base material in silicon nitride, and the strength was 15MPa.
a. It has been found that a clad material having high bonding strength can be obtained by the method of the present invention.

[0019]

According to the method of the present invention, ceramics on which a thick metal is adhered can be manufactured at low cost and easily.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of the method of the present invention.

[Explanation of symbols]

 1: Ceramics 2: Copper 3: Intermediate material 4: Heating coil

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C04B 37/02 C04B 37/02 B // B23K 35/30 310 B23K 35/30 310C F-term (reference) 4E067 AA07 AA18 AB04 AC03 AD03 BA05 DC03 DC06 EB11 EC05 4G026 BA03 BB22 BF38 BF42 BG06 BG22 BG30 BH01

Claims (2)

[Claims] 1. Ti, Z between ceramics and copper
At least one of r and Hf is contained in an amount of 10 to 50 at%, and the remainder is formed by interposing an amorphous alloy containing Cu and unavoidable impurities at a temperature not lower than the melting point of the amorphous alloy to be used and not higher than the melting point of copper. A method for producing a clad material of ceramics and copper, wherein heating is performed within a range of not less than minutes and not more than 2 hours. 2. Ti, Z between ceramics and copper
At least one of r and Hf is contained at 10 to 50 at%, and at least one of V, Nb, Cr, Mo, Mn and Ni is contained at 0.1 to 10 at%, and the balance is Cu and unavoidable impurities. A method for producing a clad material of ceramics and copper, comprising heating at a temperature not lower than the melting point of the amorphous alloy to be used and not higher than the melting point of the copper for 3 minutes to 2 hours with an amorphous alloy comprising .