JP2001313224A - Manufacturing method of high-frequency module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a high-frequency module having high production efficiency. SOLUTION: This manufacturing method includes an electronic component packaging process 62 that is composed of a plurality of child substrates 22 that have the same circuit pattern and a parent substrate 21 that is formed by interlocking the child substrates 22 and mounts electronic components to the child substrates 22; a process 64 where a slit for electrically separating an integrated signal terminal is provided after the process 62; a process 66 that allows a pin 39 of an inspection tool to come into contact with the signal terminal of trimming by a laser after the process 64; and a separation process 72 that separates the child substrate 22 from the parent substrate 21 after the process 66, thus improving the productivity of the high-frequency module.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a high-frequency module used for a portable telephone or the like.

[0002]

2. Description of the Related Art A conventional voltage controlled oscillator (hereinafter referred to as V
Called CO. This is used as an example of the high-frequency module. 17), first, as shown in FIG. 17, a plurality of sub-boards 2 having the same pattern are connected to each other in a parent board 1, and a first board for mounting electronic components on the sub-board 2 is provided. And after the first step, a second step of dividing the child board 2 connected to the parent board 1 into individual pieces as shown in FIG. 18, and after the second step, A third step of applying power to each of the divided sub-substrates 2 to confirm the operation, trimming the inductance of the resonator formed in the pattern with a laser beam, and adjusting the frequency, and the third step. After the step, as shown in FIG.
And after the fourth step, a fifth inspection for performing a final inspection.
And the process of

FIG. 20 is an enlarged view of a main part of the main board 1, in which a plurality of rectangular sub boards 2 are connected in the main board 1. It is connected to connecting portions 4 formed at both ends. Reference numerals 5, 6, 7, and 8 denote signal terminals, which are provided on the lateral side surface 10 of the child board 2. Reference numeral 9 denotes a ground terminal provided on the lateral side surface 10, and reference numeral 11 denotes a ground terminal provided on the vertical side surface 12. For example, the signal terminal 5 is connected to the first circuit 13 in a pattern, and the first circuit 13 is connected to the signal terminal 6 via the second circuit 14 in a pattern. The signal terminal 7 is connected to the signal terminal 8 via a third circuit 15 in a pattern. Reference numeral 16 denotes a dummy portion punched out by a die, which was punched out by a die to form the lateral side surface 10 of the daughter board 2. The vertical side surface 12 was provided with a V-shaped groove, and was split later to separate the sub-substrate 2.

[0004]

However, in such a conventional method of manufacturing a high-frequency module typified by a VCO, the child substrate 2 is separated from the parent substrate 1 in the second step. In this process, it was necessary to arrange all the sub-boards 2 again to adjust the frequency, and the production efficiency was low.

Accordingly, the present invention has been made to solve this problem, and has as its object to provide a method of manufacturing a high-frequency module with high production efficiency.

[0006]

In order to achieve this object, a method for manufacturing a high-frequency module according to the present invention comprises a plurality of substantially rectangular sub-boards provided with the same circuit pattern and having a plurality of substantially rectangular sub-boards. A signal terminal connected to the first circuit is provided on a lateral side surface of the child substrate, and the signal terminal is formed adjacently. Formed integrally with the signal terminal connected to the second circuit of the other daughter board,
A first step of mounting electronic components on these child boards, and after this first step, the signal terminals of the integrally formed child board and the signal terminals of other adjacent child boards are connected to the parent board. A second step of electrically separating leaving the connection portions provided at both ends of the first substrate, and after the second step, a pin of an inspection jig is brought into contact with a signal terminal of the daughter board by the first step. The method includes a third step of performing an inspection and, after the third step, a fourth step of cutting the vertical side surface of the child substrate to separate the child substrate from the parent substrate. Thereby, the productivity of the high-frequency module is improved.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a method of forming a plurality of substantially rectangular sub-boards provided with the same circuit pattern and connecting these sub-boards to each other. A signal terminal connected to the first circuit is provided on the lateral side surface of the child substrate, and the signal terminal is provided on both sides of the parent substrate having a connecting portion. A first step of integrally molding the signal terminals connected to the second circuit and mounting electronic components on these child boards; and, after the first step, the signal terminals of the integrally formed child boards. A second step of electrically separating the signal terminals of the other adjacent sub-boards from the signal terminals of the other sub-boards, leaving connection portions provided at both ends of the main board; and after the second step,
A third step of performing a first inspection by bringing a pin of an inspection jig into contact with a signal terminal of the daughter board, and after the third step,
A method for manufacturing a high-frequency module having a fourth step of cutting the vertical side surface of the child substrate and separating the child substrate from the parent substrate, wherein the lateral side surfaces of the child substrate provided in an integrated manner are integrally formed. Since the second step of electrically separating the provided signal terminals from each other is provided, it is possible to perform the inspection in the third step in a worksheet shape. By doing so, the division of the daughter board into individual pieces is performed after the third step, and the labor of re-arranging and inspecting the divided parts as in the related art is omitted, and productivity is remarkably increased. improves.

Further, since the signal terminals provided on the lateral side surfaces are directly separated from each other, the dummy portion punched out by a mold is not required as in the prior art, and the material removal of the substrate is improved. Low price can be realized.

According to a second aspect of the present invention, there is provided the method of manufacturing a high-frequency module according to the first aspect, wherein the separation of the signal terminals in the second step is performed by slits. Electrical separation between the signal terminals is ensured. Further, since the separation is performed mechanically, it is possible to save the trouble of, for example, dividing the lateral side surface of the child substrate later by the manufacturer's hand.

According to a third aspect of the present invention, there is provided the method for manufacturing a high-frequency module according to the first aspect, wherein the separation of the signal terminals in the second step is performed by forming a groove. Therefore, even if it is electrically separated, it is not mechanically separated, so that even when the pins are brought into contact in the third step, the child substrate is not deformed and bent by the contact force and is securely brought into contact, The reliability of the first inspection in the third step is improved.

According to a fourth aspect of the present invention, in the third step, the ground pin is brought into contact with any of the pins before the pins are brought into contact with each other, and the ground pins are put behind any of the pins when the pins are detached. 2. The method for manufacturing a high-frequency module according to claim 1, wherein an electrically stable inspection can be realized by performing such a shield case of turning on the power.

The first inspection of the invention according to the fifth aspect is the method for manufacturing a high-frequency module according to the first aspect, wherein a plurality of daughter boards are inspected simultaneously, and the inspection efficiency is improved.

According to a sixth aspect of the present invention, in the method of manufacturing a high-frequency module according to the first aspect, a fifth step of performing a second inspection after the fourth step, This is a method for manufacturing a high-frequency module having a sixth step of taping and mounting the high-frequency module later. Since the second inspection is finally performed after individualizing the high-frequency module, a high-frequency module with uniform performance can be obtained. . Further, since the high-frequency module is taped, the efficiency of assembling into the device is improved. Furthermore, since taping is performed, management becomes easy.

According to a seventh aspect of the present invention, there is provided a plurality of substantially rectangular sub-boards provided with the same circuit pattern and formed by connecting the sub-boards with connecting portions at both ends. A signal terminal connected to the first circuit is provided on a lateral side surface of the child substrate, and the signal terminal is connected to a second circuit of another child substrate formed adjacently. A first step of being integrally formed with the signal terminals on the lateral side and electrically separating the vertical sides of these daughter boards, and a second step of mounting electronic components on the daughter boards after the first step. After the second step, the signal terminals of the integrally formed sub-board and the signal terminals of the adjacent sub-boards are electrically separated except for the connecting portions provided at both ends of the parent board. A third step to be performed, and after the third step, A fourth step of performing an inspection by contacting the pins of the test fixture to the signal terminal, after the fourth step,
A method of manufacturing a high-frequency module, comprising: a fifth step of cutting a vertical side surface of the child substrate and separating the child substrate from the parent substrate. And a third step of electrically separating the lateral side surface, so that the fourth step, which is almost the final step, is performed.
It is possible to perform the inspection of the process in the form of a work sheet. In this way, the sub-substrate is divided into the individual pieces after the fourth step, and the sub-substrate is finally divided into electric components without being rearranged and inspected as in the related art. Since the inspection can be performed, a great deal of trouble is saved as compared with the related art, and productivity is remarkably improved.

In addition, since the signal terminals provided on the lateral side surfaces are directly electrically separated from each other, the dummy portions punched out by a die as in the related art become unnecessary, and material removal of the substrates is not required. Improved and lower prices can be realized.

The invention according to claim 8 is the method for manufacturing a high-frequency module according to claim 7, wherein the separation of the signal terminals in the third step is performed by slits. The electrical separation between the signal terminals is ensured. Also, because separation is performed mechanically,
For example, it is possible to eliminate the trouble of dividing the lateral side of the daughter board later by the manufacturer.

According to a ninth aspect of the present invention, in the method of manufacturing a high-frequency module according to the seventh aspect, the separation of the signal terminals in the third step is performed by forming a groove. Therefore, even if electrically separated, it is not mechanically separated, so even if the pins are brought into contact in the fourth step, the child substrate is not deformed by the contact force and bent without being bent, The reliability of the inspection in the fourth step is improved.

According to a tenth aspect of the present invention, in the fourth step, when the pins are brought into contact with each other, the ground pin is brought into contact with any of the pins first, and when the pins are released, the ground pin comes after any of the pins. 8. The method for manufacturing a high-frequency module according to claim 7, wherein an electrically stable inspection can be realized by performing such a power-on sequence.

According to an eleventh aspect of the present invention, the inspection in the fourth step is a method for manufacturing a high-frequency module according to the seventh aspect, wherein a plurality of daughter boards are inspected simultaneously, and the inspection efficiency is improved.

According to a twelfth aspect of the present invention, in the inspection in the fourth step, an electrical signal is conducted by pressing a pin at substantially the same position with respect to a signal terminal of each daughter board.
1. The method for manufacturing a high-frequency module according to item 1, wherein each sub-substrate can be inspected under the same conditions.

According to a thirteenth aspect of the present invention, after the third step of electrically separating adjacent child substrates while leaving the connecting portions provided at both ends of the parent substrate, a shield case is attached to the child substrate. 9. The method for manufacturing a high-frequency module according to claim 8, further comprising the step of inserting, wherein the shield case is put on the daughter board, so that the module can be easily handled.
Also, it is not affected by external noise,
It does not emit noise to the outside.

According to a fourteenth aspect of the present invention, there is provided the method of manufacturing a high-frequency module according to the thirteenth aspect, wherein a cut surface of the sub-substrate separated by the slit is cut so as to protrude from the shield case. Since the cut surface protrudes from the shield case, when dividing the child board from the parent board,
The blade for splitting does not scratch the shield case. Further, even if an external force is applied, the external force is not directly transmitted to the soldered portion of the shield case, and the occurrence of cracks can be prevented.

According to a fifteenth aspect of the present invention, there is provided the method of manufacturing a high-frequency module according to the thirteenth aspect, wherein the cut surface of the daughter board separated by the slit and the side surface of the shield case are cut so as to be substantially equal. Since the surface does not protrude from the side surface of the daughter board, it is possible to reduce the size of the high-frequency module. Also, the material removal of the sub-substrate is improved.

According to a sixteenth aspect of the present invention, there is provided the method for manufacturing a high-frequency module according to the fifteenth aspect, wherein the side surface of the shield case is formed with a rough surface as compared with the top surface. The surface area of the case increases,
Heat dissipation performance is improved. Further, by forming the rough surface, the frictional force increases, and the high-frequency module can be easily held.

According to a seventeenth aspect of the present invention, in the step of separating the sub-substrate, a rotary blade is used for cutting, and the rotary blade forms a rough surface on the side surface of the shield case.
The method for manufacturing a high-frequency module according to the item 1, does not require a separate step for forming a rough surface, and improves productivity.

In the invention according to claim 18, the shield case is formed by punching with a mold, and is bent in the punching direction to form a bent portion. 14. The method for manufacturing a high-frequency module according to claim 13, wherein the solder is soldered to a ground terminal formed on the ground terminal. , The solder is uniformly filled, so that the conduction resistance is reduced and strong adhesion is obtained. Further, since the burrs are located inside the side surfaces of the sub-substrates, the distance between the sub-substrates can be reduced, and the number of substrates to be removed can be improved.

According to a nineteenth aspect of the present invention, there is provided the method for manufacturing a high-frequency module according to the thirteenth aspect, wherein the top surface of the shield case is stamped with a laser beam. be able to. Also, since the marking is performed by a laser beam, the marking can be easily performed even in a narrow place. Furthermore, since it is stamped with a laser beam, it does not disappear even if it is rubbed by hand.

According to a twentieth aspect of the present invention, in the method for manufacturing a high-frequency module according to the seventh aspect, a sixth step of taping and mounting the high-frequency module after the fifth step of separating the daughter board from the parent board. This is a method of manufacturing a high-frequency module having the following features. Since the high-frequency module is taped after being divided into individual pieces, the efficiency of incorporation into a device is improved. Furthermore, since taping is performed, management becomes easy.

According to a twenty-first aspect of the present invention, a plurality of substantially rectangular sub-boards provided with the same circuit pattern are formed by connecting the sub-boards to each other, and have connecting portions at both ends. A first step of mounting an electronic component on the daughter board, a second step of inserting a shield case into the daughter board after the first step, and a second step of After that, a method of manufacturing a high-frequency module including a third step of cutting the side surface of the child substrate and separating the child substrate from the parent substrate, which can cover the shield case in a worksheet state. As a result, a great deal of time is saved and productivity is remarkably improved.
In addition, since the shield case is covered, handling as a module becomes easy. Further, there is no influence from external noise, and no noise is emitted to the outside.

The invention according to claim 22 is the method for manufacturing a high-frequency module according to claim 21, wherein the cut surface obtained by cutting the side surface of the daughter board is cut so as to protrude beyond the shield case. Since the cut surface protrudes beyond the shield case, when the child substrate is divided from the parent substrate, the blade for the division does not scratch the shield case. Further, even if an external force is applied, the external force is not directly transmitted to the soldered portion of the shield case, and the occurrence of cracks can be prevented.

The invention according to claim 23 is the method for manufacturing a high-frequency module according to claim 21, wherein the cut surface of the daughter board and the side surface of the shield case are cut so as to be substantially equal. Since it does not protrude from the side surface, the high-frequency module can be downsized. Also, the material removal of the sub-substrate is improved.

According to a twenty-fourth aspect of the present invention, there is provided the method for manufacturing a high-frequency module according to the twenty-third aspect, wherein the side surface of the shield case is formed with a rough surface as compared with the top surface. The surface area of the case increases,
Heat dissipation performance is improved. Further, by forming the rough surface, the frictional force increases, and the high-frequency module can be easily held.

According to a twenty-fifth aspect of the present invention, in the separating step of the sub-substrate, a rotary blade is used for cutting, and a rough surface is formed on a side surface of the shield case by the rotary blade.
The method for manufacturing a high-frequency module according to the item 1, does not require a separate step for forming a rough surface, and improves productivity.

According to a twenty-sixth aspect of the present invention, between the second step and the third step, a step of performing an inspection by bringing a pin of an inspection jig into contact with a signal terminal provided on the daughter board is performed. 22. The method for manufacturing a high-frequency module according to claim 21, wherein the sub-substrate is performed in the form of a worksheet until the final electrical inspection without re-arranging and inspecting the divided substrates as in the related art. As a result, a great deal of trouble is saved as compared with the related art, and productivity is remarkably improved.

According to a twenty-seventh aspect of the present invention, the shield case is formed by punching with a die, and is bent in the punching direction to form a bent portion. 22. The method of manufacturing a high-frequency module according to claim 21, wherein a solder is soldered to a ground terminal formed on the side surface, and a burr generated by punching out the shield case creates a gap between the shield and the ground terminal. Since the solder is uniformly filled by the phenomenon, the conduction resistance is reduced and a strong adhesion is obtained. Further, since the burrs are located inside the side surfaces of the sub-substrates, the distance between the sub-substrates can be reduced, and the number of substrates to be removed can be improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1) Hereinafter, Embodiment 1 will be described using a VCO as an example of a high-frequency module. FIG.
Is a plan view of the parent substrate 21. The parent substrate 21 has four layers. The mother board 21 has an outer dimension of 91 mm × 94 mm, and includes 6.5 mm × 5.3 mm.
Are formed by connecting 168 child substrates 22. Each of the sub-boards 22 is formed of the same pattern wiring and has electronic components mounted thereon. 2
Reference numeral 3 denotes a fixing hole, and reference numeral 24 denotes a mark for confirming a position when the electronic component is mounted.

As shown in FIG. 3, slits 25 are provided by dicing along the lateral side surfaces of the plurality of connected sub-substrates 22, as shown in FIG. At this time, since the connecting portions 26 are formed at both ends of the parent substrate 21, the child substrate 22 does not fall apart and has a worksheet shape. This manufacturing method is described in detail in Japanese Patent Application No. 8-220942. Note that the slit 25 may be a groove since it is sufficient that the signal terminal of the daughter board 22 is electrically separated. However, in this case, it is necessary to mechanically separate the lateral side surface of the daughter board 22 again later.

FIG. 4 is a plan view of a main part of the motherboard 21. As shown in FIG.
In FIG. 4, a rectangular sub-substrate 22 is provided in a parent substrate 21.
Are connected to each other, and the ends of the daughter board 22 are connected to connecting portions 26 formed at both ends of the parent board 21.

Reference numerals 27, 28, 29, and 30 denote signal terminals, which are provided on the lateral side surface 31 of the daughter board 22. Also,
Reference numeral 32 denotes a ground terminal provided on the lateral side surface 31;
Reference numeral 3 denotes a ground terminal provided on the vertical side surface 34. For example, the signal terminal 27 is connected to the first circuit 3 in a pattern.
The first circuit 35 is connected to the signal terminal 28 via a second circuit 36 in a pattern.
The signal terminal 29 is connected to the signal terminal 30 via a third circuit 37 in a pattern.

Reference numeral 25 denotes a slit formed by dicing along the lateral side surface 31 of the child substrate 22, and electrically connects the signal terminals 27 and 28 and the signal terminals 29 and 30 provided on the adjacent child substrates 22. And mechanically separated.
As described above, since the child board 22 is electrically separated by the lateral side surfaces 31 of the child board 22, it is independently connected to the signal terminals 27, 28, 29, 30 in a state where the child board 22 is connected to the parent board 21 by the connecting portion 26. The signals can be connected to operate the VCO. Note that 25 may be a groove instead of a slit.
In this case, it is necessary to separate the daughter board 22 by dividing it later. FIG. 5 is a partially enlarged view of the adjacent sub-board 22.

FIG. 6 shows an inspection apparatus used in the first inspection. In FIG. 6, reference numeral 38 denotes a pressing portion. A pin 39 urged upward by a spring force is implanted in the pressing portion 38, and a signal of the pin 39 is connected to the inspection apparatus main body 40. . Reference numeral 21 denotes a parent board, on which a child board 22 is provided in a connected manner. When the pressing portion 38 rises in the direction A or descends in the direction B, the pins 39 are attached to the signal terminals 2 provided on the daughter board 22.
7, 28, 29, and 30, and come off. While the pins 39 are in contact with each other, the VCOs provided in the child substrate 22 are sequentially operated one by one, and the inductance is cut by laser trimming to adjust the frequency.

Reference numeral 41 denotes a base placed on the daughter board 22, the surface of which is linear so that the plurality of pins 39 abut simultaneously. In this way,
By providing the slits 25 in the master board 21, the connected slave boards 22 are pressed so as not to bend, and the contact between the pins 39 and the signal terminals 27, 28, 29, 30 is ensured. The base 41 is pressed by a plunger from above, and a pin 39 urged by a spring from below.
Rises, so that the pin 39 is securely connected to the signal terminals 27 and 2.
8, 29, 30. The inspection apparatus may be turned upside down. In this way, when the inspection of the sub-boards 22 formed in one horizontal row is completed, the inspection of the sub-boards in the next row is sequentially performed. Hereinafter, the same applies.

Here, the contact of the pin 39 is made by bringing the ground pin into contact with the signal terminal before any of the pins and, when the pin 39 is detached, by detaching the ground pin after any of the pins. The supply is being stabilized.

The power test is applied to each of the connected sub-substrates 22 to perform the operation test and the laser trimming, but a plurality of the pins 39 can be performed at one time. In this way, the efficiency is further improved. As described above, in the high-frequency module manufactured by using the inspection apparatus used in the present invention, traces of the pins 39 having the same depth remain at substantially the same positions at the corresponding positions.

FIG. 7 shows a VCO as a high-frequency module.
FIG. In FIG. 7, reference numeral 42 denotes a resonance circuit. The resonance circuit 42 varies the capacitance of the varicap diode 44 with a signal input from a control signal input terminal 43 to change the resonance frequency. Reference numeral 45 denotes an inductor formed in a pattern.
By trimming 5 with a laser beam, the inductance value is changed to adjust the resonance frequency. This resonance circuit 42 is connected to an oscillation circuit 46, and an oscillation output terminal 47
Output from A power input terminal 48 supplies power to the VCO circuit. Here, for example, as shown in FIG. 4, the control signal input terminal 43 corresponds to the signal terminal 27, the oscillation output terminal 47 corresponds to the signal terminal 28, and the power supply input terminal 48 corresponds to the signal terminal 29. Also,
The signal terminal 30 is connected to the ground.

FIG. 8 shows a VCO as a high-frequency module.
FIG. 3 is a circuit diagram of / PLL. In FIG. 8, 50 is a VCO
Reference numeral 51 denotes a PLL circuit, and reference numeral 52 denotes a low-pass filter. In this configuration, the output 53 of the VCO circuit 50 is input to one input 54 of the PLL circuit 51, and the reference frequency of the crystal oscillator is input to the other comparison input 55 from the signal terminal 56. The output 56a is supplied to the VCO circuit 50 via the low-pass filter 52.
Is connected to the varicap diode 57 in which the resonance circuit is formed. The output 53 of the VCO circuit 50 is output from a signal terminal 58. Reference numeral 59 denotes an inductance formed by a pattern, which adjusts the inductance of the resonance circuit by trimming with a laser beam.

In the VCO / PLL configured as described above, the oscillation output frequency output from the signal terminal 58 is set by changing the capacitance of the varicap diode 57 in accordance with the data signal input from the signal terminal 60. I have. In this circuit, more signal terminals are led out to the lateral side surface 31 of the daughter board 22 as compared with the VCO of FIG. However, also in this case, the signal terminal (for example,
It is important that all of 80 to 85) are provided on the side surface. Only the ground terminal 86 may be a vertical side surface. In the second embodiment, even signals other than the ground terminal 86 can be provided on the vertical side surface.

Next, the manufacturing process of these high-frequency modules will be described with reference to FIG. First, cream solder is printed 61 on a worksheet-shaped master board 21 formed by connecting a plurality of slave boards 22. Next, the electronic components are mounted 62 and then reflowed 63 so that the electronic components are
Stick to Next, the slit 25 is formed 64 on the lateral side surface 31 of the daughter board 22 by dicing. As a result, the signal terminals of the adjacent sub-boards 22 can be electrically separated. Then, a drainer 65 for discharging water used at the time of dicing is performed. Next, power is supplied to the daughter board 22 from the pins 39, and the frequency is adjusted by performing laser trimming 66 while checking the oscillation frequency with the inspection apparatus main body 40. These 66 steps are called first inspection. Next, cleaning 67
After that, the shield case is covered 68 and the shield case is stamped 69. And transfer cream solder 7
Then, the sub-board 22 and the shield case are fixed by reflow 71. As described above, the work board-shaped parent substrate 21 remains up to the step 71. Therefore, the production efficiency becomes very high.

Then, the sub-board 22 is divided 72 from the main board 21 into individual pieces. The divided sub-substrate 22 is subjected to a final performance inspection (second inspection) 73 such as electric performance, and is brought into a completed VCO state. Next, the VCO is taped 74 and stored 75.

(Second Embodiment) In the second embodiment, the second inspection centering on the electrical inspection performed after the sub-substrate 22 is divided in the first embodiment will be described.
This is performed before dividing 2. In order to realize this, first, in the first step, the horizontal electrical connection between the adjacent sub-boards is electrically separated at the vertical side surfaces of the sub-boards. Then, in the second step, the electrical connection on the lateral side surfaces of the adjacent sub-boards is separated. Thus, at this point, each of the daughter boards is completely electrically independent. In this manner, all the inspections of the individual high-frequency modules can be completed in the state of the work sheet-like substrate before the child substrate is divided from the parent substrate, and the productivity is greatly improved.

That is, in this production method, as shown in FIG. 9, first, a parent substrate is prepared. This mother board is the first embodiment.
And is substantially square. Sub-substrates are connected vertically and horizontally in the parent substrate. In the first step from the parent substrate, the electrical connection in the horizontal direction between adjacent child substrates is separated by trimming 101 (that is, electrical separation on the vertical side). Note that this can be disconnected in a pattern in the initial state of the parent board. This technique will be described later with reference to FIGS.

In the next step, cream solder is printed on the mother board 1
02. After printing the cream solder 102, the electronic components are mounted 103, and then the electronic components are fixed to all of the daughter boards through a reflow furnace 104.

Next, slits are formed 105 on the lateral side surfaces of the daughter board by dicing. This makes it possible to electrically separate the signal terminals of the adjacent sub-boards on the lateral side. Then, a drainer 106 for discharging the water used at the time of dicing is performed.

Next, power is supplied to the daughter board from the pins of the inspection jig, and the laser trimming 107 is performed to adjust the frequency while checking the oscillation frequency with the inspection apparatus. This 10
Step 7 is referred to as first inspection.

Next, after cleaning 108, the shield case is covered 109 and the shield case is stamped 110. Then, the cream solder is transferred 111 and reflowed 11
2 secures the daughter board and the shield case. Next, a second inspection 11 for final electrical performance inspection
Perform Step 3.

Then, the child substrate is divided 114 from the parent substrate into individual pieces. The divided sub-board is in the state of a completed VCO, and then the VCO is taped 115 and stored 116. In this way, the steps up to the second inspection 113 are performed with the worksheet-shaped parent substrate. Therefore, the production efficiency becomes very high.

FIG. 10 shows a mother board 1 according to the second embodiment.
It is a top view of the principal part of 21. Reference numeral 122 denotes a daughter board, which is connected to the mother board 121 as in the first embodiment. 1
Reference numeral 23 denotes a connecting portion, and reference numeral 124 denotes a slit provided by dicing. The slit 124 may be a groove since it is only necessary to electrically separate the signal terminals of the adjacent daughter boards 122. However, in this case, it is necessary to mechanically separate the lateral side surface of the daughter board 122 later.

In FIG. 10, reference numerals 125 to 132 denote signal terminals, which are the horizontal side 133 and the vertical side 136 of the sub-board 122.
It is provided in. Reference numeral 134 denotes a ground terminal provided on the horizontal side surface 133, and reference numeral 135 denotes a ground terminal provided on the vertical side surface 136. For example, the signal terminal 125 is connected to the first circuit 137 in a pattern, and the first circuit 137 is connected to the second circuit 1 in a pattern.
It is connected to a signal terminal 128 via. The signal terminal 130 is connected to the signal terminal 131 via the third circuit 139 in a pattern.

Reference numeral 124 denotes a lateral side surface 13 of the sub-substrate 122.
3 are slits formed by dicing along, for example, separating the signal terminal 125 and the signal terminal 128 both electrically and mechanically.

FIG. 11 is a partially enlarged view of the vicinity of the vertical side surface 136 of the daughter board 122. The ends of the through holes 140, 141, 142 provided in the vertical side surface 136 and the direction of the vertical side surface 136 are cut 143 by an end mill to electrically separate the adjacent sub-boards 122 by the vertical side surface 136. . Reference numerals 144 and 145 denote adjacent child substrates 122, respectively.
In the vertical side surface 136, the patterns 144 and 145 are not connected but are electrically separated. As a result, even if the same signal is supplied to the patterns 144 and 145, the same performance is obtained at high frequencies. That is, the performance does not change even if the division is performed.

When the sub-substrate 122 is divided 114, it is cut by a cutter along the vertical side surface 136. Note that a V-groove may be formed along the vertical side surface 136 and then divided.

As described above, the sub-board 122 is
And the vertical side surface 136 is completely electrically separated. Accordingly, the signal terminals 125 to 132 are also electrically separated from the adjacent sub-board 122, so that the sub-board 122 is
In a state (sheet state) connected to 1 by the connecting portion 123,
By connecting a signal to the signal terminals 125 to 132, the operation of the VCO on the connected substrate can be performed under the same conditions as when the VCO is used alone. The description of the same components as those of the first embodiment is simplified.

Next, a description will be given of the seal case 150 and the seal that are put on the daughter board 122. The shield case 150 and the seal are the same in the first embodiment. FIG. 12 is a perspective view in which a shield case 150 is placed on each of the child substrates 122 formed on the parent substrate 121. 151 are legs soldered by reflow to a ground terminal 134 formed on the lateral side surface 133 of the daughter board 122. FIG. 13 is a sectional view thereof. That is, the parent board 1
Ground terminal 13 formed on the side of slit 124 of 21
4 to solder leg 1 of shield case 150
At step 60, soldering (reflow soldering) 112 is performed. Here, reference numeral 152 denotes an electronic component mounted on the daughter board 122.

FIG. 14 is a plan view of the high-frequency module after the secondary board 122 is covered with the shield case 150 and soldered. In FIG. 14, 133a is the child substrate 12
2 is a cut surface of the horizontal side surface 133, and 136a is a vertical side surface 1
36 is a cut surface. In the present embodiment, the cut surface 1
An interval 161 of 0.07 to 0.15 mm is provided between the legs 33a and 136a and the legs 151 of the shield case 150. That is, the cut surface 133 corresponds to the interval 161.
a and 136a protrude from the legs 151 provided on the side surface of the shield case 150. For this reason, when dividing the child board 122 from the parent board 121, the cutting case does not damage the shield case 150.
If the protrusion is small, the side surface of the shield case 150 may be damaged when divided. In addition, when the protrusion is increased, the shape becomes large. In addition, 162 is a signal terminal.

Further, since the shield case 150 is put on the worksheet of the master substrate 121, the cream solder 16
0 is transferred onto the back surface of the parent substrate 121. Therefore, after the soldering 112, the ground terminal 13
Traces 160a of the solder 160 remain on the bottom portions 134a and 135a of the fourth and 135.

Thus, the leg 151 of the shield case 150, the ground terminals 134, 135 and the solder 11
5, the cut surfaces 133a, 133
Since 6a protrudes from the leg 151, cracks do not occur in the solder connecting the ground terminals 134 and 135 and the leg 151 even if an external force is applied.

Next, the shield case 150 and the sub-board 12
Another example of the relationship with 2 will be described. Shield case 150
If the surface is roughened, the surface area increases, so that even if there is a heat-generating component in the daughter board 122, the heat radiation performance is improved. To realize this, the lateral side 1
A rough surface can be formed on the side surface of the shield case 150 using a dicing blade when the slits 124 are formed by dicing.

As a result, the surface area of the side surface of the shield case 150 increases, so that the heat radiation performance improves. Further, in this case, the cut surface 133a of the daughter board 122 does not protrude from the side surface of the shield case 150, and the size can be reduced. Further, the rough surface can be formed in the same step as the cutting of the sub-substrate 122 by dicing, and there is no need to provide a separate step of forming a rough surface. The rough surface may be provided on the entire side surface, or may be provided on only one side surface. In addition, since the top surface is not formed with a rough surface, the appearance is not impaired.

As shown in FIG. 15, a metal plate (tin plate) 154 is provided on a mold base 153 as shown in FIG.
And punching is performed by lowering the punch 155. At this time, burrs 156 are formed at the punched portions of the metal plate 154.

Next, as shown in FIG. 16, a bent portion 158 is formed by bending in the punching direction 157, and a leg 151 is formed at the tip of the bent portion 158 to complete the shield case 150. This shield case 15
0 is inserted into the ground terminal 134 of the daughter board 122. Then, a gap 159 is formed between the wall surface 134 a of the ground terminal 134 and the leg 151 due to the burr 156.
Due to the gap 159, the solder is melted by the reflow heat and the solder is uniformly soldered by the capillary phenomenon. Also,
Since the burrs 156 do not protrude toward the adjacent sub-substrate 122, the distance between the adjacent sub-substrate 122 can be reduced. Also, it is safe to touch the outside of the high-frequency module.

Next, the top surface of the shield case 150 is stamped. Since the stamping is performed in the form of a work sheet, the stamping can be performed at a time, thereby improving work efficiency. In addition, laser light is used for this seal. Therefore, the stamp position does not vary depending on the product, and is excellent in aesthetic appearance. Also,
By using a laser beam, a small module can be easily stamped, and its printing speed is high.
Also, since it is a laser beam, it does not disappear even if it is rubbed by hand.

[0073]

As described above, according to the present invention, a plurality of substantially rectangular sub-boards provided with the same circuit pattern are formed by connecting the sub-boards to each other and connected to both ends. A signal terminal connected to a first circuit on a lateral side surface of the child substrate, and the signal terminal is connected to a second circuit of another child substrate formed adjacently. A first step of mounting an electronic component on these daughter boards, which is integrally formed with the signal terminals connected to the second board; and, after this first step, other parts adjacent to the signal terminals of the one-piece mother board are formed. A second step of electrically separating the signal terminals of the secondary board from the signal terminals of the parent board while leaving the connecting portions provided at both ends of the parent board; A third step of performing a first inspection by contacting the pins of the tool; A method of manufacturing a high-frequency module including a fourth step of separating the child substrate from the parent substrate by separating the child substrate from the parent substrate after the third step. Has a second step of electrically separating signal terminals provided integrally with the lateral side surfaces from each other, so that the inspection in the third step can be performed in the form of a work sheet. By doing so, the division of the daughter board into individual pieces is performed after the third step,
The labor of re-arranging and inspecting the divided parts as in the related art is eliminated, and productivity is remarkably improved.

Further, since the signal terminals provided on the lateral sides are directly separated from each other, the dummy portions punched out by a die as in the related art become unnecessary, and the material removal of the substrate is improved. , And lower prices can be realized.

[Brief description of the drawings]

FIG. 1 is a process chart of a method for manufacturing a high-frequency module according to Embodiment 1 of the present invention.

FIG. 2 is a plan view of a parent substrate forming the high-frequency module.

FIG. 3 is a plan view of the parent substrate during the same process.

FIG. 4 is a plan view of a main part of the motherboard;

FIG. 5 is a partially enlarged view of a child substrate in the parent substrate.

FIG. 6 is an explanatory diagram of the inspection device.

FIG. 7 is a circuit diagram of a VCO as the high-frequency module.

FIG. 8 shows a VCO / PLL as a high-frequency module.
Circuit diagram of

FIG. 9 is a process chart of a method for manufacturing a high-frequency module according to Embodiment 2 of the present invention.

FIG. 10 is a plan view of a main part of the motherboard.

FIG. 11 is a partially enlarged view of a child substrate in the parent substrate.

FIG. 12 is a perspective view of the same parent board covered with a shield case.

FIG. 13 is a sectional view of a main part of the same.

FIG. 14 is a plan view of the high-frequency module covered with a shield case.

FIG. 15 is a sectional view of a main part of the same shield case mold.

FIG. 16 is a sectional view of an essential part of the high-frequency module covered with a shield case.

FIG. 17 is a plan view of a parent substrate forming a conventional high-frequency module.

FIG. 18 is a plan view of the child substrate.

FIG. 19 is a perspective view of the high-frequency module.

FIG. 20 is a plan view of a main part of the parent board;

[Explanation of symbols]

 Reference Signs List 21 parent board 22 child board 25 slit 26 connecting part 27 signal terminal 28 signal terminal 29 signal terminal 30 signal terminal 31 lateral side 34 vertical side 39 pin 40 inspection apparatus main body 62 electronic component mounting step 64 step of providing slit in parent board 66 laser First inspection step for trimming 72 Division step

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takahiro Yajima 1006 Kazuma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. Terms (reference) 5E062 DD01 DD09

Claims (27)

[Claims] 1. A semiconductor device comprising: a plurality of substantially rectangular sub-boards provided with the same circuit pattern and having a substantially rectangular shape; and a parent board formed by connecting the sub-boards and having connecting portions at both ends, A signal terminal connected to a first circuit is provided on a lateral side surface of the daughter board, and the signal terminal is integrally formed with a signal terminal connected to a second circuit of another daughter board formed adjacently. A first step of mounting electronic components on these child boards, and after this first step, the signal terminals of the integrally formed child board and the signal terminals of other child boards adjacent thereto are connected to the parent board. A second step of electrically separating leaving the connecting portions provided at both ends of the board, and after the second step, a pin of an inspection jig is brought into contact with a signal terminal of the daughter board by the first step. A third step of inspecting the substrate, and after the third step, A method for manufacturing a high-frequency module, comprising: a fourth step of cutting a vertical side surface of a plate to separate the child substrate from the parent substrate. 2. The method according to claim 2, wherein the separation of the signal terminals in the second step is performed as follows.
The method for manufacturing a high-frequency module according to claim 1, wherein the high-frequency module is separated by a slit. 3. The method according to claim 2, wherein the signal terminals are separated in the second step.
The method for manufacturing a high-frequency module according to claim 1, wherein the separation is performed by forming a groove. 4. At the time of contact of the pin in the third step,
2. The method of manufacturing a high-frequency module according to claim 1, wherein the ground pin is brought into contact with any of the pins first, and the ground pin is released after any of the pins when the pins are released. 5. The method for manufacturing a high-frequency module according to claim 1, wherein the first inspection includes simultaneously inspecting a plurality of daughter boards. 6. The method of manufacturing a high-frequency module according to claim 1, further comprising: a fifth step of performing a second inspection after the fourth step; and taping and mounting the high-frequency module after the fifth step. A method of manufacturing a high-frequency module having a sixth step. 7. A plurality of substantially rectangular sub-boards provided with the same circuit pattern and a parent board formed by connecting the sub-boards and having connecting portions at both ends, A signal terminal connected to a first circuit is provided on a lateral side surface of the child board, and the signal terminal is connected to a signal terminal on a lateral side connected to a second circuit of another child substrate formed adjacently. A first step of integrally molding and electrically separating the vertical side surfaces of these sub-boards from each other; a second step of mounting electronic components on said sub-boards after said first step; A third step of electrically separating the signal terminals of the integrally formed sub-board and the signal terminals of adjacent sub-boards after the step, except for connecting portions provided at both ends of the parent board. And inspecting the signal terminals of the daughter board after the third step. A fourth step of performing an inspection by contacting pins of a jig, and a fifth step of cutting the vertical side surface of the sub board to separate the sub board from the parent board after the fourth step A method for manufacturing a high-frequency module having: 8. The method according to claim 8, wherein the signal terminal is separated in the third step.
The method for manufacturing a high-frequency module according to claim 7, wherein the high-frequency module is separated by a slit. 9. The separation of signal terminals in the third step is as follows:
The method for manufacturing a high-frequency module according to claim 7, wherein the separation is performed by forming a groove. 10. The method according to claim 7, wherein in the fourth step, the ground pin is brought into contact with any of the pins before the pins are brought into contact with each other, and the ground pins are detached after any of the pins when the pins are detached. A method for manufacturing the high-frequency module according to the above. 11. The method for manufacturing a high-frequency module according to claim 7, wherein the inspection in the fourth step includes simultaneously inspecting a plurality of daughter boards. 12. The method for manufacturing a high-frequency module according to claim 11, wherein in the inspection in the fourth step, an electrical signal is conducted by pressing a pin at substantially the same position with respect to a signal terminal of each daughter board. 13. The method according to claim 1, further comprising the step of inserting a shield case into said child board after the third step of electrically separating adjacent child boards while leaving the connecting portions provided at both ends of the parent board. Item 9. The method for manufacturing a high-frequency module according to Item 8. 14. The method for manufacturing a high-frequency module according to claim 13, wherein a cut surface of the daughter board separated by the slit is cut so as to protrude from the shield case. 15. The method for manufacturing a high-frequency module according to claim 13, wherein the cut surface of the daughter board separated by the slit and the side surface of the shield case are cut so as to be substantially equal. 16. The method for manufacturing a high-frequency module according to claim 15, wherein a side surface of the shield case has a rough surface as compared with a top surface. 17. The method of manufacturing a high-frequency module according to claim 16, wherein in the step of separating the daughter board, the rotary blade is cut using a rotary blade, and the rotary blade forms a rough surface on a side surface of the shield case. 18. The shield case is formed by punching out with a mold, and is bent in the punching direction to form a bent portion. The method for manufacturing a high-frequency module according to claim 13, wherein the soldering is performed. 19. The method according to claim 13, wherein the top surface of the shield case is stamped with a laser beam. 20. The method of manufacturing a high-frequency module according to claim 7, further comprising a sixth step of taping and mounting the high-frequency module after the fifth step of separating the daughter board from the parent board. . 21. A plurality of substantially rectangular sub-boards provided with the same circuit pattern and a parent board formed by connecting the sub-boards to each other and having connecting portions at both ends, A first step of mounting an electronic component on the daughter board; a second step of inserting a shield case into the daughter board after the first step; and a step of inserting the shield case into the daughter board after the second step. A method for manufacturing a high-frequency module, comprising a third step of cutting a side surface to separate the child substrate from the parent substrate. 22. A cut surface obtained by cutting the side surface of the daughter board so as to protrude from the shield case.
2. The method for manufacturing the high-frequency module according to 1. 23. The method according to claim 21, wherein the cut surface of the daughter board and the side surface of the shield case are cut so as to be substantially equal. 24. The method for manufacturing a high-frequency module according to claim 23, wherein a side surface of the shield case has a rough surface formed as compared with a top surface. 25. The method of manufacturing a high-frequency module according to claim 24, wherein in the step of separating the daughter board, the rotary blade is cut using a rotary blade, and the rotary blade forms a rough surface on a side surface of the shield case. 26. The method according to claim 21, further comprising, between the second step and the third step, a step of performing an inspection by bringing a pin of an inspection jig into contact with a signal terminal provided on the daughter board. Method of manufacturing high frequency module. 27. The shield case is formed by punching out with a mold, and is bent in the punching direction to form a bent portion. 22. The method for manufacturing a high-frequency module according to claim 21, wherein the high-frequency module is soldered.