JP2001312868A - Head supporting mechanism for disk device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To slightly displace a heat highly accurately and efficiently for tracking correction or the like. SOLUTION: A slider 2 provided with a head 1 for performing at least data reproducing for a disk to be rotary-driven is disposed to be slightly rotated in all of a pitch direction, a rolling direction and yawing direction by a dimple 4g. The dimple 4g as the rotational center of the slider 2 is matched with the center of gravity of a very small movement part including the slider 2 and a slider holding plate 3 for holding the slider 2, or this part is positioned between the center of gravity and the head 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a head support mechanism used for storing and reproducing information on a magnetic disk such as a magnetic disk device used as a storage device of a computer, and more particularly, to a head support mechanism provided in the magnetic disk device. The present invention relates to an optimal head support mechanism for increasing the density of information recording on a magnetic disk.

[0002]

2. Description of the Related Art In recent years, the recording density of a magnetic disk provided in a magnetic disk device has been increasing with each passing day. A magnetic head used for recording and reproducing data on and from a magnetic disk is usually mounted on a slider, and the slider on which the magnetic head is mounted is supported by a head support mechanism provided in the magnetic disk device. . The head support mechanism has a head actuator arm to which a slider is attached, and this head actuator arm is connected to a voice coil motor (VC
M). Then, by controlling the voice coil motor, the head mounted on the slider is positioned at an arbitrary position on the magnetic disk.

In order to record data on a magnetic disk at a higher density, it is necessary to position the magnetic head with respect to the magnetic disk with higher precision. However, in such a configuration in which the head actuator arm is rotated by the VCM to position the magnetic head,
There is a problem that the magnetic head cannot be positioned with higher accuracy. To this end, a head support mechanism for positioning the magnetic head with high accuracy has already been proposed.

FIG. 18 is a plan view showing an example of a head support mechanism of a conventional magnetic disk drive. A head 102 for recording / reproducing data on a magnetic disk (not shown) driven to rotate is supported by one end of a suspension arm 104. Suspension arm 10
The other end of 4 is rotatably supported by a projection 108 provided at the tip of the carriage 106 within a small angle range around the projection 108. The base end of the carriage 106 is rotatably supported by a shaft member 110 fixed to the housing of the magnetic disk drive.

A permanent magnet (not shown) is fixed to the carriage 106. The permanent magnet is controlled by controlling an exciting current flowing through a drive coil 114 which is a part of a magnetic circuit 112 fixed to the housing. For magnets,
The carriage 106 rotates with respect to the shaft member 110. As a result, the head 102 moves in a substantially radial direction of the magnetic disk.

A pair of piezoelectric elements 116, 116 are provided between the carriage 106 and the suspension arm 104. Each piezoelectric element 116 is
Are attached in such a manner that the respective longitudinal directions are slightly inclined in directions opposite to each other. And
Each of the piezoelectric elements 116 is expanded and contracted in a direction indicated by an arrow A14 in FIG. 18, so that the suspension arm 104 is moved in a small angle range along the surface of the carriage 106 around the projection 108 with respect to the carriage 106. To rotate. Thereby, the suspension arm 1
The head 102 attached to the tip of the magnetic disk 04 is displaced in a minute range along the surface of the magnetic disk, and can be positioned at an arbitrary position on the magnetic disk with high accuracy.

[0007]

In the conventional head support mechanism shown in FIG. 18, each piezoelectric element 116 is sandwiched between members provided on the suspension arm 104 and the carriage 106, respectively. ,
Each side of each piezoelectric element 116 along the longitudinal direction (indicated by an arrow A14) is in contact with each member of the suspension arm 104 and the carriage 106. And
Due to the bulk deformation of each piezoelectric element 116, the suspension arm 104 is rotated, and the head 102 is slightly displaced. Thus, each piezoelectric element 1
16, the suspension arm 10
4, the head 102 does not always follow the voltage applied to each piezoelectric element 116 with high precision because the head 102 is displaced minutely. May not be able to be positioned.

An object of the present invention is to solve such a problem, and an object of the present invention is to provide a head support mechanism for a disk drive capable of finely displacing a head with high precision for tracking correction of a magnetic disk or the like. Is to provide.

Another object of the present invention is to provide a head support mechanism of a disk drive capable of minutely displacing a head with high precision by controlling a voltage.

A further object of the present invention is to provide a thin film piezoelectric actuator suitably used for such a head support mechanism.

[0011]

According to the present invention, there is provided a head supporting mechanism for a disk drive, comprising: a slider provided with a head for reproducing at least data from a rotationally driven disk; and moving the slider at least in a yaw direction. A supporting means for supporting the slider so as to be rotatable at a small displacement angle; and a driving means for rotating the slider at a small displacement angle in the yaw direction. Or a position between the center of gravity of the minute rotating portion and the head.

[0012] The center of rotation of the slider in the yaw direction coincides with the center of the air bearing surface formed on the surface of the slider facing the disk.

[0013] The supporting means is a dimple for supporting the slider pointwise so as to be rotatable in all directions of a pitch direction, a roll direction and a yaw direction.

[0014] The driving means includes an operation board for supporting the slider rotatably in the yaw direction on a tip end thereof, and both side portions of the operation board substantially with respect to the surface of the disk. And a driving member for deforming in different directions in a direction perpendicular to the driving direction.

The driving members are thin-film piezoelectric members provided on both sides of the operation board in a laminated state.

Further, the head supporting mechanism of the disk drive of the present invention comprises a slider provided with a head for reproducing at least data on a rotationally driven disk, and rotating the slider at least by a small displacement angle in the yaw direction. Movably supporting means, and driving means for rotating the slider at a slight displacement angle in the yaw direction, the driving means being capable of rotating the slider in the yaw direction on the tip end. An operation board supported in a state, and a driving member for deforming both side portions of the operation board at different phases in a direction substantially perpendicular to the surface of the disk.

The driving members are thin-film piezoelectric members provided on both sides of the operation board in a laminated state.

[0018]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view from the disk side showing the entire structure of a head support mechanism 100 of a disk drive according to an embodiment of the present invention, and FIG. 2 is a head support mechanism 10 of FIG.
FIG.

The head support mechanism 100 of the disk drive according to this embodiment includes a slider 2 on which a head 1 is mounted.
A slider holding plate 3 for holding the slider 2; a load beam 4 for rotatably supporting the slider 2 and the slider holding plate 3 on the distal end; and supporting the slider 2 on the load beam 4 on the distal end. Then, the thin film piezoelectric substrate 8 as an operation substrate for rotating the slider 2 and the thin film piezoelectric substrate 8
And a second wiring pattern 7 provided along the first wiring pattern 12 from the upper side to the base end side.

The load beam 4 has a square base portion 4a, a neck portion 4b extending from the base portion 4a toward the distal end, and a tapered shape extending further from the neck portion 4b toward the distal end. Beam portion 4c.

On the lower surface of the base end 4a of the load beam 4, a square base plate 5 corresponding to the base end 4a is attached by beam welding or the like. The base plate 5 is a head actuator (not shown)
Is installed in a shallow sea, and the load beam 4
The head actuator rotates the distal end of the beam portion 4c about the proximal end 4a so as to move along a substantially radial direction of the magnetic disk (not shown). Accordingly, the head 1 is moved substantially in the radial direction of the magnetic disk by the turning drive of the load beam 4 in this manner.

An opening 4d is provided at the center of the neck 4b of the load beam 4, and the opening 4d is provided.
The two side portions of the opening portion 4d are leaf spring portions 4 respectively.
e, 4e. The beam part 4c is provided for each leaf spring part 4
As a result, the beam portion 4c is elastically displaced in a direction perpendicular to the surface of the magnetic disk, and the beam portion 4c is elastically displaced to load the slider 2 provided at the tip end of the beam portion 4c. A load is applied.

A dimple 4g projecting hemispherically toward the upper surface is integrally formed at the tip of the beam portion 4c. A pair of regulating portions 4f, 4f linearly extending from the distal end of the beam portion 4c toward the base end side are provided at the distal end portion of the beam portion 4c. Each restricting portion 4f is provided with an appropriate gap above the upper surface of the beam portion 4c,
It extends toward the base end.

The slider holding plate 3 is arranged on the tip of the beam portion 4c. The slider 2 is held on the slider holding plate 3 via the tip of the thin-film piezoelectric substrate 8. As shown in FIG. 2, the slider holding plate 3 has a substrate bonding portion 3 bonded to the lower surface of the front end portion of the thin film piezoelectric substrate 8.
b is provided at the tip. A pair of balance weights 3c extending toward the base end is provided on each side of the board joint 3b.
And 3c are provided, and at the center of the substrate joining portion 3b, a small protruding portion 3a protruding in a semicircular shape toward the base end is provided between the balance weight portions 3c.

The slider holding plate 3 has the lower surface of the projection 3a supported from below by dimples 4g provided at the tip of the beam portion 4c of the load beam 4 in point contact with each other. Each of the regulating portions 4f provided at the tip of the portion 4c is regulated with an appropriate minute interval. Thus, the slider holding plate 3 is supported so as to be able to rotate in all directions at a small displacement angle together with the slider 2 provided thereon. The position of the center of gravity of the minute rotation of the slider holding plate 3 provided with the slider coincides with the dimple 4g which is the center of rotation.

FIG. 3 is a perspective view of the slider 2. The head 1 including the MR element is arranged at the center of the upper edge of the slider 2 at the tip end surface. Four terminals 2a to 2d are provided on the lower edge of the front end surface of the slider 2 in a state of being arranged in the horizontal direction. The upper surface of the slider 2 is a disk facing surface facing the surface of the magnetic disk. The upper surface is provided with an air bearing surface 2e that allows an air flow generated by the magnetic disk driven in rotation to flow along the tangential direction of the magnetic disk to form an air lubricating film with the magnetic disk. I have.

The center of the air bearing surface 2e coincides with the dimple 4g, which is the center of rotation (position of the center of gravity) of the minutely rotating portion of the slider holding plate 3. Therefore, slider 2
Is the head 1 with respect to the center of the air bearing surface 2e.
The pitch direction, which is the rotation direction about the axis along the longitudinal direction of the beam portion 4c passing through the beam, and the rotation about the axis along the air bearing surface 2e orthogonal to the axis along the longitudinal direction of the beam 4c It is possible to make small rotations in all directions in the yaw direction, which is the rotation direction about the roll direction and the center axes of the pitch direction and the roll direction. The slider 2 is rotated at a slight displacement angle in the yaw direction, so that the head 1 is moved.
Moves minutely along the substantially radial direction of the magnetic disk.

The head 1 has a surface of a magnetic disk,
More specifically, they are arranged so as to face the tangential direction of the magnetic disk.

FIGS. 4 and 5 are a plan view and a bottom view of the thin film piezoelectric substrate 8 disposed on the load beam 4 and its periphery, respectively. FIG. 6 is a cross-sectional view taken along line XX of FIG. FIG. 7 and FIG. 7 are cross-sectional views taken along line YY in FIG.

The thin film piezoelectric substrate 8 has a long plate shape extending from the distal end to the proximal end of the load beam 4.
It is arranged along the surface of the magnetic disk. As the material of the thin film piezoelectric substrate 8, a thin stainless steel plate having flexibility is used.

The slider 2 is attached to the top of the thin film piezoelectric substrate 8 at the top, and the bottom is the slider holding plate 3.
Is provided with a slider supporting portion 8a joined to the substrate joining portion 3b. The slider 2 is mounted on the upper surface of the slider support portion 8a with approximately half of the distal end thereof being attached to the upper surface of the slider support portion 8a.

On the base end side of the slider supporting portion 8a, a pair of deforming operation portions 8d and 8e that deform in different phases in the direction perpendicular to the surface of the magnetic disk via elastic hinge portions 8f and 8g, respectively. , Are provided integrally. A fixing portion 8c fixed to the upper surface of the beam portion 4c of the load beam 4 is provided on the base end side of the deforming operation portions 8d and 8e.

The pair of deforming operation portions 8d and 8e are arranged in parallel at a predetermined interval by slits provided in the widthwise intermediate portion of the substrate 8 for thin film piezoelectric material.
Separated from each other. A pair of elastic hinge portions 8f and 8
g is formed by reducing the width dimension of the distal end portions of the deformable operation portions 8d and 8e. The slider supporting portion 8a is rotatable in directions other than the yaw direction by the elastic hinge portions 8f and 8g. Therefore, the slider 2 and the slider supporting portion 8a disposed on the slider supporting portion 8a are located below the slider supporting portion 8a. The placed slider holding plate 3 is fixed without rotating in the yaw direction.

On the lower surface of the thin film piezoelectric substrate 8, first and second thin film piezoelectric members 11a and 11b are provided. The first and second thin film piezoelectric members are arranged in a stacked state from the lower surface of the pair of deforming operation portions 8d and 8e of the thin film piezoelectric substrate 8 to the lower surface of the fixed portion 8c, and the thin film is formed by the flexible material 6 covering these. It is integrated with the piezoelectric substrate 8. When a voltage is applied between the upper surface and the lower surface, each of the thin film piezoelectric members 11a and 11b is elongated in a longitudinal direction corresponding to the amount of the voltage.
And 11b, the deformation operation part 8d
And 8e are each warped in the thickness direction. This causes a displacement in the direction perpendicular to the surface of the magnetic disk on the thin film piezoelectric substrate 8.

An upper electrode 9a and a lower electrode 9b made of platinum are provided on the upper and lower surfaces of the first thin film piezoelectric member 11a, respectively. Similarly, upper and lower electrodes 9a and 9b made of platinum are provided on the upper and lower surfaces of the second thin film piezoelectric member 11b, respectively.

On the lower surface of the fixing portion 8c of the thin film piezoelectric substrate 8, three terminal portions 13a, 13b and 13c are provided in a state of being exposed from the flexible material 6, respectively.
The pair of terminal portions 13a and 13b are connected to the lower surface electrodes 9 on both sides.
b and 9b, in electrical contact with the base end,
Each is attached. In addition, another terminal 13c
Are arranged on the base end side of these terminal portions 13a and 13b, and this terminal portion 13c is connected to a short-circuit member 14 for electrically short-circuiting the base end portions of the upper surface electrodes 9a and 9a. With the upper surface electrodes 9a and 9a.

The head 1 is provided on the upper surface of the thin film piezoelectric substrate 8.
Is provided with a first wiring pattern 12 for transferring a recording / reproducing signal with respect to the first wiring pattern. This first wiring pattern 12
Is composed of four wiring lines 12a to 12d. One end of each of the wiring lines 12 a to 12 d is connected to each terminal 2 of the slider 2 provided on the upper surface of the slider support 8 a on the slider support 8 a of the thin film piezoelectric substrate 8.
a to 2d, respectively.

The pair of wiring lines 12a and 12b of the first wiring pattern 12 are drawn out to the base end side through the one deforming operation part 8d and the fixing part 8c of the thin film piezoelectric substrate 8, respectively. . The other pair of wiring lines 12c and 12d pass through the other deformation operation section 8e and the fixed section 8c of the thin-film piezoelectric substrate 8 and are drawn out toward the base end.

The four wiring lines 12a to 12d drawn to the base end side of the thin film piezoelectric substrate 8 pass through the wiring portion 12e of the first wiring pattern 12, reach the terminal holding portion 12f, and are External connection terminal 12 on holding portion 12f
a 'to 12d'.

The four wiring lines 12a to 12d
Are fixed to the upper surface of the thin film piezoelectric substrate 8 by the flexible material 6.

The second wiring pattern 7 is composed of the first and second thin film piezoelectric members 1 disposed on the lower surface of the thin film piezoelectric substrate 8.
Used for driving 1a and 11b. The wiring pattern 7 has three wiring lines, and one end of each wiring line is connected to the internal connection terminals 15a to 15c by a terminal holding portion 7a. And 3
The three internal connection terminals 15a to 15c are connected to three terminal portions 13a to 13c provided on the lower surface of the fixed portion 8c of the thin film piezoelectric substrate 8, respectively.
c is fixed to the upper surface of the beam portion 4c of the load beam 4 via the terminal holding portion 7a.

The three wiring lines provided on the wiring pattern 7 pass over the wiring portion 7c of the second wiring pattern 7 and reach the terminal holding portion 7b. They are connected to the external connection terminals 16a, 16b, 16c, respectively.

Terminal holding portion 12 of first wiring pattern 12
f and the terminal holding portion 7b of the second wiring pattern 7 are attached to one side edge of the base end portion 4a of the load beam 4 in the longitudinal direction of the load beam 4.

The operation of the head support mechanism 100 of the disk device having such a configuration will be described with reference to FIGS.

Upper surface electrodes 9a and 9a provided on the upper surfaces of first and second thin film piezoelectric members 11a and 11b, respectively.
Are the short-circuit member 14, the terminal portion 13c, the internal connection terminal 15c and the external connection terminal 16c of the second wiring pattern 7.
, Respectively, to the ground level.

The lower electrode 9b joined to the lower surface of the first thin film piezoelectric member 11a is connected to the external connection terminal 16a and the internal connection terminal 15a of the second wiring pattern 7 and the terminal portion 13a. , A voltage V is applied. Further, the lower surface electrode 9b provided on the lower surface of the second thin film piezoelectric body 11b is connected to the external connection terminal 1 of the second wiring pattern 7.
6b, internal connection terminal 15b, and terminal portion 13b
A voltage 0 is applied via.

Thus, the upper electrode 9a and the lower electrode 9b
Is applied to the first thin-film piezoelectric element 11a. As a result, as shown in FIG. 8, the first thin-film piezoelectric element 11a elongates in its longitudinal direction (the direction indicated by arrow A1 in FIG. 8).

In this case, one deformation operation section 8 of the thin film piezoelectric substrate 8 laminated with the first thin film piezoelectric body 11a is formed.
Since d is made of a stainless steel plate or the like, its rigidity is high in the elongation direction (the direction indicated by the arrow A1). For this reason, as shown in FIG. 8, the first thin film piezoelectric member 11a and one of the deforming portions 8d of the thin film piezoelectric substrate 8 move away from the surface of the magnetic disk by the pie morph effect as shown in FIG. Warpage occurs so as to protrude toward the 11b side.

On the other hand, no voltage is applied to the second thin film piezoelectric body 11b. For this reason, as shown in FIG.
The second thin-film piezoelectric body 11b and the other deformable operation portion 8e of the thin-film piezoelectric body substrate 8 laminated with the second thin-film piezoelectric body 11b are not particularly warped.

As described above, when the deformation operation portion 8d is warped, the length in the longitudinal direction of the deformation operation portion 8d projected on the same plane as the deformation operation portion 8e that does not warp does not warp. It is shorter than the deforming operation part 8e by the minute displacement δ1 (FIG. 10). Therefore, the slider supporting portion 8a of the thin film piezoelectric substrate 8 slightly rotates in the yaw direction indicated by the arrow A2 in FIG. 10, and the slider 2 and the slicing plate 3 also move.
It will be slightly rotated in the same direction around the dimple 4g.

Conversely, a voltage 0 is applied to the lower surface electrode 9b provided on the lower surface of the first thin film piezoelectric member 11a, and a voltage V is applied to the lower electrode 9b provided on the lower surface of the second thin film piezoelectric member 11b. Then, the first thin-film piezoelectric body 11a and one of the deforming portions 8d of the thin-film piezoelectric body substrate 8 laminated with the first thin-film piezoelectric body 11a do not warp, and the second thin-film piezoelectric body 11b and the laminated state with the second thin-film piezoelectric body 11b The other deformation operation portion 8e of the thin film piezoelectric substrate 8 becomes warped.

As a result, the slider supporting portion 8a of the thin film piezoelectric substrate 8 slightly rotates in the yaw direction opposite to the direction indicated by the arrow A2 in FIG. As a result, the slider 2 and the slider holding plate 3 slightly rotate around the dimple 4g in the same direction.

As described above, the head 1 mounted on the slider 2 is moved in the radial direction of the magnetic disk, that is, by applying the driving voltages of opposite phases to the first and second thin film piezoelectric members 11a and 11b. In the width direction of each track provided concentrically with the track, it moves with a high degree of precision by a minute deformation amount corresponding to the applied voltage.
Thus, an on-track operation for following the track of the head 1 can be performed with high accuracy.

The elastic hinges 8g and 8f, which are the connecting portions between the slider supporting portion 8a and the deformable operating portions 8d and 8e of the thin film piezoelectric substrate 8, are connected to the wiring lines 12a and 12b of the wiring pattern 12 and the wiring lines. 12c and 12d to the minimum required width dimension respectively arranged,
Each is designed. Therefore, the load required for rotating the slider supporting portion 8a is reduced, and the slider supporting portion 8a can be reliably rotated with a small load.

Further, the load load (20 to 3) is applied to the slider 2 by the leaf spring portions 4e and 4e of the load beam 4.
0 mN) is applied, and when the slider holding plate 3 is rotated, this load load acts between the dimple 4 g and the slider holding plate 3. Therefore, a frictional force determined by the friction coefficient between the slider holding plate 3 and the dimple 4g acts on the slider holding plate 3. Therefore, although the protrusion 3a and the dimple 4g of the slider holding plate 3 are rotatable, there is no possibility that a displacement occurs due to frictional force.

The first thin film piezoelectric member 11a and the second thin film piezoelectric member 11b operate equally when the same voltage is applied. Accordingly, the thin film piezoelectric members 11a and 11b are configured to bend when no voltage is applied, and by applying voltages of opposite phases to the first thin film piezoelectric member 11a and the second thin film piezoelectric member 11b. The first thin-film piezoelectric element 11a and the deformation operation section 8d may be driven, and the second thin-film piezoelectric substance 11b and the deformation operation section 8e may be driven.

In this embodiment, the thin film piezoelectric member 11a
When a voltage is applied to the thin film piezoelectric body 11a
In this configuration, the piezoelectric element is displaced so as to protrude toward the thin film piezoelectric bodies 11a and 11b when voltage is applied.

Since the elastic hinge portions 8g and 8f have a flexible structure that can be rotated in the roll direction and the pitch direction of the slider 2, respectively, the slider with respect to the magnetic disk is formed by the air bearing by the air bearing surface 2e. 2 is improved.

Next, the dynamic characteristics of the head support mechanism of the disk drive according to the present invention will be described.

FIGS. 11 and 12 are schematic views showing models of two types of head support mechanisms.
FIG. 11 shows that the center of gravity G in the minute rotating portion including the slider 2 and the slider holding plate 3 is the dimple 4 g and the head 1.
And a head support mechanism located between the head support mechanism and the head. FIG.
Shows the head support mechanism 100 of the present invention in which the position of the center of gravity G in the minute rotating portion including the slider 2 and the slider holding plate 3 matches the position of the dimple 4g.

The thin film piezoelectric member 11a and the thin film piezoelectric member 11b
When voltages are applied in opposite phases to each other, one deformation operation unit 8d contracts and the other deformation operation unit 8e expands,
The follow-up characteristics of the head 1 with respect to the target track on the magnetic disk are greatly affected by the position of the center of gravity G.

First, the slider 2 and the slider holding plate 3
The case of FIG. 11 in which the center of gravity G in the micro-rotational portion including the above is located between the dimple 4g and the head 1 will be described.

As shown in FIG. 11A, the deforming operation unit 8
Due to the contraction and extension of d and 8e, acting forces f1 and f2 in opposing directions are generated in the elastic hinge portions 8g and 8f, respectively, as shown in the figure. At this time, the slider holding plate 3 holds the load beam 4
The deformation operation portion 8d is formed by the dimple 4g formed in
And 8e can be freely displaced in the direction of expansion and contraction, while the deforming portions 8d and 8e are restrained by a frictional force in the warping direction. As a result, the action force f is applied to the slider 2 and the slider holding plate 3.
The rotation moment Ma about the center of gravity G acts by 1 and f2.

As shown in FIG. 11, when the center of gravity G and the dimple 4g are separated by a distance Sa with respect to the longitudinal direction of the beam portion 4c of the load beam 4, the dimple 4g has Ra = Ma / A reaction force Ra of Sa is generated. Due to this reaction force Ra, the beam portion 4c of the load beam 4 is deformed. FIG. 11B is a schematic diagram showing the state of this deformation.

As shown in FIG. 11 (b), even if the slider 2 rotates counterclockwise, since the deforming portions 8d and 8e are deformed by the reaction force Ra, the head 1 does not move over a predetermined amount. Become. In addition, since the slider 2 and the slider holding plate 3 have mass, a response to the deformation of the deformation operation units 8d and 8e is delayed.

FIG. 14 is a graph showing the follow-up characteristics of the head with respect to the target track in the head support mechanism shown in FIG. 11, and FIG.
(B) shows the phase characteristics.

In FIGS. 14A and 14B, J1
J5 indicate resonance points when the thin film piezoelectric members 11a and 11b in the head support mechanism shown in FIG. 11 are driven. J1 is a torsional primary mode of the beam portion 4c in the load beam 4 shown in FIG.
Is the torsional secondary mode of the beam part 4c in the load beam 4 shown in FIG. 13B, and J3 is the resonance in the plane vibration mode (Sway) of the beam part 4c in the load beam 4 shown in FIG. In addition, J4 and J5 indicate resonance points in the resonance mode of the deformation operation units 8d and 8e in the thin film piezoelectric substrate 8, respectively.

From the viewpoint of the dynamic characteristics of the head support mechanism, it is desirable to increase the frequencies of these resonance modes to a sufficiently high frequency range that does not affect the head positioning control. However, since each of J1 to J3 is a characteristic caused by the structure of the load beam 4, there is necessarily a limit to greatly increasing the resonance frequency. Therefore, it is necessary to improve the phase delay of the responsiveness at the resonance points of J1 to J3.

FIG. 12 shows a head support mechanism 10 according to the present invention in which the position of the center of gravity G of the minutely rotating portion of the slider 2 and the slider holding plate 3 matches the position of the dimple 4g.
FIG. 9 is a schematic diagram for explaining the operation of No. 0. As shown in FIG. 12A, since the position of the center of gravity G and the position of the dimple 4g match, the reaction force Rb due to the rotational moment Mb
Does not occur. Therefore, as shown in FIG.
The amount of displacement by the deforming operation units 8d and 8e is
In the yaw direction. FIG. 15 shows the response characteristics at this time.

As shown in FIG. 15, the position of the center of gravity G in the minute rotation portion of the slider 2 and the slider holding plate 3 is made to coincide with the position of the dimple 4g, so that the resonance amplitude characteristic of the torsional secondary mode J2 and The phase characteristics are improved, and the parallel vibration J3 hardly appears.

As described above, the head support mechanism 10 of the present invention
At 0, the position of the center of gravity G in the minute rotating portion of the slider 2 and the slider holding plate 3 coincides with the position of the dimple 4g, so that when driving the thin film piezoelectric members 11a and 11b at a high frequency, the response is improved. Excellent characteristics can be obtained.

The slider 2 and the slider holding plate 3
Is supported by the dimple 4g so as to be rotatable not only in the yaw direction but also in all directions, so that the friction loss when the slider holding plate 3 rotates can be extremely reduced. This makes it possible to increase the displacement of the head 1 with a small driving force.

Since the slider 2 is held so that the center position of the air bearing surface 2b coincides with the center of rotation, for example, the slider 2 is affected by disturbance such as air viscous friction force. There is no possibility that the position of the head 1 changes.

Further, the beam structure composed of the thin film piezoelectric substrate 8 and the thin film piezoelectric members 11a and 11b has high rigidity in the direction A1 shown in FIG. The resonance point can be raised.

FIG. 16 is a schematic view showing a modeled head support mechanism of a disk drive according to another embodiment of the present invention. Note that the basic configuration is the same as that of the above embodiment, and the description of each unit will be omitted.

The feature of the present embodiment is that, as shown in FIG.
And between the center of gravity G and the head 1 in the minute rotating portion of the slider holding plate 3.

In order to slightly displace the head 1 with respect to the target track position, voltages are applied to the thin-film piezoelectric members 11a and 11b in opposite phases, respectively, and one of the deforming operation portions of the thin-film piezoelectric substrate 8 is applied. 8d contracts, and the other deforming operation part 8e expands. Due to the contraction and extension of each of the deforming operation portions 8d and 8e, the acting forces f1 and f2 are applied to the elastic hinge portions 8g and 8f, respectively, as shown in FIG.
Acts in the directions shown in FIG.

At this time, the slider holding plate 3 can be displaced in the direction of expansion and contraction of each of the deforming operation portions 8d and 8e by the dimples 4g formed on the load beam 4, but each of the deforming operation portions 8d and 8e Is restrained by the frictional force in the direction of the warpage, and a rotational moment Mc in the yaw direction about the center of gravity G acts on the slider 2 and the slider holding plate 3 by the acting forces f1 and f2. The distance Sc is between the center of gravity G and the dimple 4g.
Because it is in a separated state, 4 g of dimples
A reaction force Rc of Rc = Mc / Sc is generated.

This reaction force Rc deforms the beam portion 4c of the load beam 4 but, unlike the case of FIG. 11, acts in the direction in which the head 1 is displaced. Will be encouraged. FIG.
FIG. 6B is a schematic diagram showing this state.

Since the slider 2 and the slider holding plate 3 have mass, the phase of the slider 2 and the slider holding plate 3 is advanced with respect to the input signal for commanding the movement of the head 1.

FIG. 17 is a graph showing the follow-up characteristics of the head with respect to the target track in the head support mechanism of FIG. 16. FIG. 17 (a) shows the gain characteristics and FIG. 17 (b) shows the phase characteristics.

J1 to J5 in FIG. 17 indicate resonance points when the thin film piezoelectric members 11a and 11b in the head support mechanism are driven, respectively. J1 is the first-order torsion mode shown in FIG. 13A, J2 is the second-order torsion mode shown in FIG. 13B, and J3 is the plane vibration mode (Sway) shown in FIG. 13C. Resonance points are indicated, and J4 and J5 indicate resonance points in the resonance mode of the deformation operation portions 8d and 8e in the thin-film piezoelectric substrate 8, respectively.

The phase characteristics of J2 and J3 in FIG. 17 are both advantageous in obtaining the stability of control since the phases are both advanced. Further, when the peak values of the gain characteristics at J2 and J3 are attenuated by a damper or the like not shown, it is possible to obtain better control characteristics.

As described above, according to the present embodiment, the dimple 4g serving as the center of rotation is located between the center of gravity G and the head 1 in the minute rotation portion of the slider 2 and the slider holding plate 3. When the thin-film piezoelectric body is driven at a high frequency, it is possible to obtain characteristics excellent in operation responsiveness. Further, more stable control characteristics can be realized in consideration of variations in the position of the center of gravity.

[0086]

The head support mechanism of the disk drive of the present invention can precisely and minutely displace the head for tracking correction and the like, and can effectively displace the head with respect to the applied voltage. Can be done. In particular, by optimizing the position of the center of gravity of the minute rotating portion including the slider, it is possible to greatly improve the harmful resonance characteristics that the load beam potentially has. Further, by adopting a simple configuration in which a thin film piezoelectric body is provided on one side of the substrate for minute displacement of the head, it is possible to greatly reduce the manufacturing cost.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an embodiment of a head support mechanism of the present invention.

FIG. 2 is an exploded perspective view showing the head support mechanism.

FIG. 3 is a perspective view of a slider used for the head support mechanism.

FIG. 4 is a plan view of a thin film piezoelectric substrate used in the head support mechanism and the vicinity thereof.

FIG. 5 is a bottom view of the thin film piezoelectric substrate and its vicinity.

FIG. 6 is a sectional view taken along line XX of FIG. 2;

FIG. 7 is a sectional view taken along line YY of FIG. 5;

FIG. 8 is a side view of a main part for explaining the operation of the head support mechanism.

FIG. 9 is a side view of a main part for explaining the operation of the head support mechanism.

FIG. 10 is a plan view of a main part for explaining the operation of the head support mechanism.

FIGS. 11A and 11B are schematic diagrams of a head support mechanism shown as a comparative example for explaining the operation of the head support mechanism of the present invention.

FIGS. 12A and 12B are schematic configuration diagrams for explaining the operation of the head support mechanism of the present invention.

13 (a) to 13 (c) are perspective views each showing a vibration mode of a load beam.

FIGS. 14A and 14B are graphs each showing a response characteristic of the head support mechanism of FIG. 11 shown as a comparative example.

FIGS. 15A and 15B are graphs respectively showing response characteristics of the head support mechanism of FIG. 12 shown as an embodiment of the present invention.

FIGS. 16A and 16B are schematic configuration diagrams for explaining the operation of a head support mechanism shown as another embodiment of the present invention.

FIGS. 17A and 17B are graphs each showing a response characteristic of the head support mechanism.

FIG. 18 is a plan view showing an example of a head support mechanism of a conventional disk drive.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Head 2 Slider 2e Air-bearing surface 3 Slider holding plate 4 Load beam 4g Dimple 8 Thin film piezoelectric substrate (operation substrate) 7, 12 Wiring pattern 8d, 8e Deformation operation part 8g, 8f Elastic hinge part 11a, 11b Thin film piezoelectric body

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5D042 LA01 MA15 5D059 AA01 BA01 CA14 DA19 DA26 EA08 5D096 NN03 NN07

Claims (7)

[Claims] 1. A slider provided with a head for at least reproducing data on a disk driven to rotate, and a support means for supporting the slider so as to be able to rotate at least at a small displacement angle in the yaw direction. Driving means for rotating the slider at a minute displacement angle in the yaw direction, wherein the center of rotation of the slider in the yaw direction coincides with the position of the center of gravity of the minute rotating portion including the slider, or A head support mechanism for a disk drive, which is located between the position of the center of gravity and the head. 2. A head support mechanism for a disk drive according to claim 1, wherein the center of rotation of the slider in the yaw direction coincides with the center of an air bearing surface formed on the surface of the slider facing the disk. . 3. The head support mechanism according to claim 1, wherein said support means is a dimple for point-supporting said slider rotatably in all directions of a pitch direction, a roll direction and a yaw direction. 4. An operation board, which supports the slider in a rotatable state in the yaw direction, on a distal end portion, and both side portions of the operation board, with respect to a surface of the disk. 2. A head support mechanism for a disk drive according to claim 1, further comprising: a driving member that deforms in a substantially perpendicular direction at a different phase. 5. The head support mechanism for a disk drive according to claim 4, wherein said driving members are thin-film piezoelectric members provided on both sides of said operation board in a stacked state. 6. A slider provided with a head that reproduces at least data on a disk that is driven to rotate, a supporter that rotatably supports the slider at least in a yaw direction at a small displacement angle, and the slider. A driving means for rotating the slider at a slight displacement angle in the yaw direction, the driving means comprising, on a tip end thereof, an operation board for supporting the slider so as to be rotatable in the yaw direction; And a driving member for deforming both side portions of the disk at different phases in a direction substantially perpendicular to the surface of the disk. 7. The head support mechanism of a disk drive according to claim 6, wherein said driving members are thin-film piezoelectric members provided on both sides of said operation board in a stacked state.