JP2001311674A - Pressure sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make surely manufacturable a pressure sensor without time and labor. SOLUTION: This pressure sensor has a silicon substrate 1 with a sheet- shaped diaphragm formed by partly thinning the substrate and a joining member 2 joined to the substrate 1 to be opposite to the diaphragm 1c. The pressure sensor detects a pressure change from the quantity of deflection of the diaphragm 1c when receiving a pressure from the opposite side face 1f of a face 1a opposite to the joining member 2. The diaphragm 1c can butt against the joining member 2 by deflecting when an excessive pressure is transmitted thereto. The joining member 2 has a communication hole 2a formed penetrating from the outside. The communication hole 2a communicates with an opposite space 1g to the diaphragm 1c. Moreover, one of the diaphragm 1c and the joining member 2 is provided with a projection 1h of a separate body which can butt against the other when the diaphragm 1c deflects. The projection 1h is formed of a metal and has an elasticity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a strain gauge type semiconductor pressure sensor.

[0002]

2. Description of the Related Art A conventional pressure sensor of this type is disclosed in Japanese Utility Model Laid-Open No. 3-88137. As shown in FIG. 12, a silicon substrate A provided with a plate-shaped diaphragm A ₁ by locally forming a thin film, and a glass bonded to the substrate A opposed to the diaphragm A ₁ as shown in FIG. And a substrate (joining member) B, which detects a pressure change by the amount of deflection of the diaphragm A ₁ by receiving a pressure from an opposite surface A ₃ opposite to the opposite surface A ₂ to the glass substrate B. is there. More specifically, this diaphragm has A ₁ , and an SiO ₂ film A ₄ is formed on a surface A ₂ facing the glass substrate B.

[0003] Generally, this type of pressure sensor involves heating when the glass substrate B and the substrate A are joined together, so that heat is dissipated and the facing space A ₅ between the glass substrate B and the diaphragm A ₁ is released.
Is reduced in pressure. Then, at the time of this joining, the diaphragm A ₁ is subjected to external pressure from the opposite face A _3, and I bonded to the glass substrate B flexes easily toward the glass substrate B, but no longer can be manufactured a pressure sensor Is disclosed in Japanese Utility Model Application Laid-Open No. 3-88137.
Since the SiO ₂ film A ₄ is formed on the surface A ₂ facing the glass substrate B in A ₁ , the pressure sensor can be manufactured without joining with the glass substrate B.

[0004]

In the conventional pressure sensor mentioned above in which [0005] is, the diaphragm A _1, as described above,
Since the SiO ₂ film A ₄ is formed on the surface A ₂ facing the glass substrate B, the SiO ₂ film A ₄ is not bonded to the glass substrate B, and a pressure sensor can be manufactured.

However, since a relatively complicated process of forming the SiO ₂ film A ₄ on the surface A ₂ of the diaphragm A ₁ facing the glass substrate B is required, the production is troublesome.

The present invention has been made in view of the above points, and an object of the present invention is to provide a pressure sensor which can be reliably manufactured without any trouble.

[0007]

According to a first aspect of the present invention, there is provided a pressure sensor, comprising: a silicon substrate provided with a plate-shaped diaphragm by locally forming the diaphragm; A joining member joined to the substrate facing the joining member, wherein the diaphragm detects a pressure change by an amount of deflection of the diaphragm caused by receiving a pressure from a surface opposite to a surface facing the joining member; Can be brought into contact with the joining member by excessive pressure being transmitted and flexing, and the joining member has a communication hole communicating with an opposing space between the diaphragm and the through hole penetrating from an outer surface. And one of the diaphragm and the joining member has a separate projection that can abut the other by bending the diaphragm. Be those provided, the projection is a configuration having a are elastic metallic.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS.

Reference numeral 1 denotes an n-type silicon substrate having both sides polished and having a crystal orientation (100) plane. The bonding member 2 side described later is anisotropically etched with KOH or NaOH to form a bonding member 2. Opposing surface 1a that faces
Is provided on the bottom surface. The bottom of the concave portion 1b serves as a diaphragm 1c to be described later,
Boron is ion-implanted or thermally diffused using O ₂ as a mask to provide a strain gauge resistor 1d. Also,
This substrate 1 is provided with a wiring pattern (not shown) and electrode pads 1e by vacuum evaporation of Al. The electrode pad 1e is connected to a wiring pattern provided on an external substrate (not shown) by wire bonding with an Au line or an Al line.

Next, the bottom of the concave portion 1b, on the side opposite to the facing surface 1a, is formed, for example, by using SiN or SiO ₂ as a mask.
The plate-shaped diaphragm 1c is formed by being locally thinned by etching with a 5% KOH aqueous solution. The diaphragm 1c has an SiO ₂ film (not shown) on an opposite surface 1f opposite to the opposite surface 1a.
Is coated. Note that a SiN film may be coated.

Next, the substrate 1, the bonding member 2 and the pedestal 3, which will be described later, are bonded by anodic bonding. Specifically, the substrate 1 is used as an anode, the bonding member 2 and the pedestal 3 are used as negative electrodes, and
In a vacuum atmosphere of 0 ° C., a DC voltage of about 400 to
By applying 600 V, anodic bonding is performed. Thus, the diaphragm 1c of the substrate 1 faces the bonding member 2 with the facing space 1g therebetween.

The joining member 2 is made of hard glass and has a thickness of about 0.1 mm.
A communication hole 2a formed to a thickness of 3 to 0.6 mm and communicating with an opposing space 1g between the diaphragm 1c and the diaphragm 1c is pierced by vibrating a pin. The reference pressure of the atmospheric pressure is applied to the facing surface 1a of the diaphragm 1c.

The pedestal 3 is a pressure sensor chip together with the substrate 1.
10. The hard glass is used to form about 0.1.
A pressure introducing hole 3a formed to a thickness of 5 to 2 mm and reaching the opposite surface 1f side of the substrate 1 is provided by a so-called ultrasonic machining method or an electric discharge machining method in which a pin is vibrated to form a hole. By introducing a gas or a liquid into the pressure introduction hole 3a,
Pressure is transmitted to the diaphragm 1c of the substrate 1. As described above, the diaphragm 1c is in a state where the reference pressure of the atmospheric pressure is applied to the opposed surface 1a, and the pressure is transmitted by introducing the gas or the liquid to the opposite surface 1f, and the diaphragm 1c is
Bends, the opposite surface 1f with its strain gauge resistance 1d
Can measure the pressure of the gas or liquid transmitted to it.

When an excessive pressure is transmitted to the opposite surface 1f of the diaphragm 1c, the diaphragm 1c is bent when its opposing surface 1a comes into contact with the joining member 2 as shown in FIG. Is regulated, so that destruction due to excessive bending is prevented.

In such a pressure sensor, the joining member 2
The opposing space 1g between the diaphragm 1c and the
Since the communication hole 2a communicating with 1g is provided to penetrate from the outer surface of the joining member 2, even when heating is performed at the time of joining the joining member 2 and the substrate 1, the facing space 1g is decompressed with heat radiation. Even if the diaphragm 1c receives an external pressure from the opposite surface 1f opposite to the facing surface 1a between the joining member 2 and the diaphragm 1c, the diaphragm 1c may bend toward the joining member 2 and join with the joining member 2. It can be manufactured reliably. Moreover, unlike the conventional example, a relatively complicated process of forming an SiO ₂ film on the surface of the diaphragm 1c facing the glass substrate is not a relatively complicated process, but the connecting member 2 is provided with a communication hole 2a communicating from the outer surface to the facing space. It requires only a relatively simple process, so that production is not troublesome.

Further, since the diaphragm 1c is coated with SiO ₂ on the opposite surface 1f opposite to the opposite surface 1a, even if pressure is transmitted by a corrosive fluid such as water, oil, gas, etc. You won't have to.

Next, a second embodiment of the present invention will be described below with reference to FIG. Note that members having substantially the same functions as those of the first embodiment are denoted by the same reference numerals, and only differences from the first embodiment will be described. In the first embodiment, the opposed space 1g is formed by providing the recess 1b in the substrate 1, but in the present embodiment, the opposed space 1g is formed by providing the recess 2b in the joining member 2. I have.

More specifically, the bonding member 2 is provided with the concave portion 2b by mechanical polishing or chemical etching using hydrofluoric acid or the like.

In such a pressure sensor, in addition to the effect of the first embodiment, excessive pressure is transmitted and the joining member 2
Is not necessarily provided with a plate-like diaphragm 1c by forming it locally thin, as in the case of the substrate 1, so that it is as careful as when the concave space 1b is provided in the substrate 1 to form the facing space 1g. It is not necessary to process, and the production becomes easier than in the first embodiment.

Next, a third embodiment of the present invention will be described below with reference to FIGS. The members having substantially the same functions as those of the first embodiment are denoted by the same reference numerals,
Only different points from the first embodiment will be described. In the first embodiment, the surface 2c of the joining member 2 facing the diaphragm 1c
Has a flat shape, but in the present embodiment, has a configuration in which a protrusion 2d is provided.

More specifically, the joining member 2 is provided with a projection 2d having a substantially flat tip surface by chemical etching using hydrofluoric acid or the like. The start position of the chemical etching is indicated by a broken line in FIG. 4 which is a plan view of the pressure sensor chip. Therefore, even if excessive pressure is transmitted and the diaphragm 1c bends and abuts on the projection 2d, the diaphragm 1c does not crack. Further, the projection 2d is provided at a position not opposed to the strain gauge resistor 1d so that even if the diaphragm 1c is bent and abuts on the projection 2d, the projection 2d does not abut on the strain gauge resistor 1d provided on the diaphragm 1c and is not damaged. ing. Note that the protrusion 2d may be provided by mechanical polishing.

In such a pressure sensor, in addition to the effect of the first embodiment, excessive pressure is transmitted and the joining member 2
The diaphragm 1c bent to the side is joined to the joining member 2 via the protrusion 2d.
When the deflection is regulated by contacting the
By changing the height of the projection 2d provided on the joining member 2, the durability of the diaphragm 1c can be adjusted.

Next, a fourth embodiment of the present invention will be described below with reference to FIG. Note that members having substantially the same functions as those of the third embodiment are denoted by the same reference numerals, and only differences from the third embodiment will be described. In the third embodiment, the joining member 2 is made of hard glass, but in this embodiment, it is made of silicon.

More specifically, the joining member 2 is provided with a recess 2b and a projection 2d substantially at the center of the recess 2b by anisotropic etching. The joining member 2 is provided with a communication hole 2a from an outer surface opposite to the opposing surface 2c by anisotropic etching, plasma etching RIE, or isotropic etching using an HF aqueous solution. This joining member 2 is
When heated to 1000 ° C. in a state of polymerization with
Joined to. The substrate 1 is bonded to the pedestal 3 by anodic bonding as described above.

In this pressure sensor, in addition to the effect of the third embodiment, the diaphragm 1c comes into contact with the elastic projection 2d of the joining member 2 because it is made of silicon. The shock at the time of contact is buffered, so that the diaphragm 1c is not damaged.

Since the joining member 2 is made of silicon, it can be made thinner than in the third embodiment.
The pressure sensor itself can be reduced in size.

In this embodiment, the joining member 2 is provided with the projection 2d. However, for example, when there is no need to adjust the durability of the diaphragm 1c, the projection 2d is not provided. In that case, the processing of the joining member 2 becomes easier. Further, even when the projection 2d is not provided on the joining member 2 as described above, the excessive pressure is transmitted to the diaphragm 1c, so that the diaphragm 1c comes into contact with the elastic joining member 2 because it is made of silicon. Therefore, the shock at the time of abutment is buffered, so that breakage does not occur.

Next, a fifth embodiment of the present invention will be described below with reference to FIG. Note that members having substantially the same functions as those of the third embodiment are denoted by the same reference numerals, and only differences from the third embodiment will be described. In the third embodiment, the projection 2d is provided on the joining member 2, whereas in the present embodiment, the substrate 1 is provided with the projection 1h.

More specifically, when the concave portion 1b is provided by anisotropic etching, the substrate 1 is provided with a projection 1h substantially at the center of the concave portion 1b.

In such a pressure sensor, in addition to the effects of the third embodiment, the diaphragm 1c receives the excessive pressure, and the elastic projection 1h because it is made of silicon.
Therefore, the impact at the time of contact is buffered, and the diaphragm 1c
Will not be damaged.

Next, a sixth embodiment of the present invention will be described below with reference to FIGS. The members having substantially the same function as in the fifth embodiment are denoted by the same reference numerals,
Only different points from the fifth embodiment will be described. In the fifth embodiment, the protrusion 1h is made of silicon, whereas in the present embodiment, the protrusion 1h is made of metal, and has elasticity.

More specifically, the projections 1h are provided on the substrate 1 by a plating method or a stud bump method. When the projection 1h is provided by a plating method, for example, Au, Cu or Al
Is plated on the substrate 1. In the case where the protrusion 1h is provided by the stud bump method, for example, wire bonding is performed using an Au wire, and as shown in FIG.
1 to form a pad portion 1j and a wire portion 1k following the pad portion 1j, and cut a boundary portion between the pad portion 1j and the wire portion 1k, that is, a so-called neck portion 1m, to thereby form a projection.
1h is provided.

With such a pressure sensor, the same effects as in the fifth embodiment can be obtained.

Next, a seventh embodiment of the present invention will be described with reference to FIGS.
This will be described below based on No. 11. The members having substantially the same functions as those of the first embodiment are denoted by the same reference numerals,
Only different points from the first embodiment will be described. In the first embodiment, while the substrate 1 is joined to the joining member 2,
In the present embodiment, a configuration is adopted in which the package is housed by a facing member 4 arranged to face the diaphragm 1c and a package 5 joined to the facing member 4. 10 and 11
In the figure, the strain gauge resistance provided in the diaphragm 1c is omitted.

More specifically, the substrate 1 is mounted on the bottom of a package 5 to be described later by bonding a pedestal 3 with an adhesive 5a, and its electrode pads (not shown) and external connection through the package 5 are provided. Lead wire 5b is connected by wire bonding. And this board 1
Is sealed on its opposing surface 1a side with a gel-like silicon resin 1n.

As will be described later in detail, the facing member 4 is covered by covering the opening of the package 5 so that
It faces the diaphragm 1c via the silicone resin 1n, and forms an opposing space 1g between the diaphragm 1c and the opposing space.
A communication hole 4a communicating with 1g is provided to penetrate from the outer surface. The opposing member 4 has a projection 4b on an opposing surface 4a facing the diaphragm 1c.

The package 5 is formed of a plastic such as PPS, PBT or the like in a box shape with one opening, and the opening is covered with the opposing member 4, so that the pressure sensor chip 10 and the electrode pads 1e are connected to the outside. The wire bonding portion connecting to the connection lead wire 5b is mechanically protected from external force or the like. The package 5 is provided with a communication hole 5c communicating with the opposing space and a pressure introduction hole 5d reaching the opposite surface 1f side of the substrate 1.

When an excessive pressure is transmitted to the opposite surface 1f of the diaphragm 1c, the diaphragm 1c is brought into contact with the projection 4b of the opposing member 4 by the opposing surface 1a as shown in FIG. Since the bending is restricted, destruction due to excessive bending is prevented.

In such a pressure sensor, the opposing member 4
The opposing space 1g between the diaphragm 1c and the
The communication holes 4a and 5c communicating with 1g are the opposing member 4 and the package.
5 through the outer surface
Even when heating is performed by soldering, welding, or the like at the time of joining the package 4 and the package 5, the opposed space is not depressurized with heat radiation, and the diaphragm 1c is opposed to the opposed surface 1a of the opposed member 4 opposite to the opposed surface 1a. Even if external pressure from 1f is received,
It does not bend toward and is not joined to the opposing member 4, and it can be manufactured reliably. Moreover, it is not a relatively complicated process of forming an SiO ₂ film on the surface of the diaphragm 1c facing the glass substrate as in the conventional example, but is connected to the facing member 1 and the package 5 from the outer surface to the facing space 1g. Since only a relatively simple process of providing the communication holes 4a and 5c is required, the production is not troublesome.

Further, excessive pressure is transmitted to the opposing member 4
The diaphragm 1c bent to the side faces the opposing member 4 via the projection 4b.
When the deflection is regulated by contacting the
By changing the height of the projection 4b provided on the facing member 4, the amount of deflection of the diaphragm 1c can be adjusted.

In this embodiment, the communication holes 4a and 5c are
Although provided on the opposing member 4 and the package 5, the same effect can be obtained even if provided on one of them, and in that case, the trouble of providing the communication hole is reduced,
Processing becomes easier.

In the present embodiment, the projection 4b is provided on the facing member 4, but the same effect can be obtained even if it is provided on the diaphragm 1c.

In this embodiment, the opposing member 4 has a projection.
4b is provided, for example, for example, a diaphragm
If you do not need to adjust the durability of 1c,
May not be provided, in which case the processing of the facing member 4 becomes easier.

[0044]

According to the pressure sensor of the first aspect, the facing space between the joining member and the diaphragm has a communication hole communicating with the facing space penetrating from the outer surface of the joining member. Even when heating is performed at the time of joining the joining member and the substrate, the facing space is not depressurized with heat radiation, and even if the diaphragm receives external pressure from the surface opposite to the facing surface with the joining member, it faces the joining member. It can be reliably manufactured without being bent and joined to the joining member. Moreover, it is not a relatively complicated process of forming an SiO ₂ film on the surface of the diaphragm facing the glass substrate as in the conventional example, but a relatively complicated process of providing a communication hole from the outer surface to the facing space in the joining member. Since only a simple process is required, the production is not troublesome.

Further, when excessive pressure is transmitted and the diaphragm bent toward the joining member comes into contact with the joining member via the projection, and the deflection is regulated, at least one of the diaphragm and the joining member is applied. By changing the height of the provided projection, the amount of bending can be adjusted.

Further, the diaphragm which has been bent toward the joining member due to the transmission of excessive pressure abuts on the joining member via a metal elastic projection, so that the shock at the time of contact is buffered. In other words, the diaphragm is not damaged.

[Brief description of the drawings]

FIG. 1 is a sectional view of a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a state in which the diaphragm is bent.

FIG. 3 is a sectional view of a second embodiment of the present invention.

FIG. 4 is a sectional view of a third embodiment of the present invention.

FIG. 5 is a plan view of the same pressure sensor chip.

FIG. 6 is a sectional view of a fourth embodiment of the present invention.

FIG. 7 is a sectional view of a fifth embodiment of the present invention.

FIG. 8 is a sectional view of a sixth embodiment of the present invention.

FIG. 9 is an explanatory diagram showing a procedure when the projection is provided by a stud bump method.

FIG. 10 is a sectional view of a seventh embodiment of the present invention.

FIG. 11 is a cross-sectional view showing a state in which the diaphragm is bent.

FIG. 12 is a sectional view of a conventional example.

[Explanation of symbols]

 1 Substrate 1a Opposite surface 1c Diaphragm 1f Opposite surface 1g Opposite space 1h Projection 2 Joining member 2a Communication hole 2b Depression 2d Projection 4 Opposing member 4a Communication hole 4b Projection 5 Package 5c Communication hole

Claims (1)

[Claims] 1. A silicon substrate provided with a plate-shaped diaphragm by locally forming a thin plate, and a joining member joined to the substrate in opposition to the diaphragm, and a surface facing the joining member. A pressure sensor that detects a pressure change based on the amount of deflection of the diaphragm caused by receiving a pressure from the opposite surface, wherein the diaphragm is capable of coming into contact with the joining member by bending when an excessive pressure is transmitted. The connecting member is provided with a communication hole communicating with an opposing space between the diaphragm and the diaphragm, the communication hole being provided from an outer surface thereof,
In addition, one of the diaphragm and the joining member is provided with a projection which can be brought into contact with the other by bending the diaphragm, and the projection is made of metal and has elasticity. Pressure sensor characterized in that: