JP2001308392A - Light-emitting diode and image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting diode wherein directivity is set according to, for example, the molded shape of and to apply the light-emitting diode to an image display device for less variation in directivity. SOLUTION: A light scattering member 12 which scatters light is provided near a light-emitting diode chip 3, and a lead frame 2A is provided with an alignment part 12 for the light-emitting diode chip 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode and an image display device, and more particularly to a light emitting diode whose directivity is set by a molding shape made of resin, and an image display device using the light emitting diode. can do. The present invention provides a light-scattering member that scatters light in the vicinity of a light-emitting diode chip, and provides a light-emitting diode chip positioning portion in a holding portion of a lead frame. A light emitting diode capable of reducing variation in directivity and an image display device using the light emitting diode are proposed.

[0002]

2. Description of the Related Art Conventionally, in a light emitting diode, a desired directivity is ensured by a molding shape made of resin. That is, FIG. 11A is a cross-sectional view illustrating this type of light emitting diode. The light-emitting diode 1 is formed by mounting and wiring the light-emitting diode chips 3 on a pair of lead frames 2A and 2B, and then molding the resin into a predetermined shape with a resin 4.

For this reason, a pair of lead frames 2A and 2A
B, one of the lead frames 2A has a light emitting diode chip as shown by a partially enlarged view A and a cross section of the light emitting diode 1 as viewed from the front direction enlarged by a letter B. 3 is mounted on the tip by a recess 2AA. Here, in the concave portion 2AA, for example, a substantially circular flat surface 2AB is formed at the center by a coining process, and a tapered surface 2AC is formed around the flat surface 2AB.

The light emitting diode 1 is, for example, a red light emitting diode chip 3 made of a gallium arsenide substrate.
The light emitting diode chip 3 is arranged on the central flat surface 2AB by a conductive adhesive, and the green and blue light emitting diode chips 3 on the sapphire substrate are:
The light emitting diode chip 3 is arranged on the central flat surface 2AB by an epoxy-based adhesive. Further, the light emitting diode chip 3 thus arranged and the other lead frame 2B are connected by wire bonding 5, and the light emitting diode chip 3 of the sapphire substrate is
Further, the light emitting diode chip 3 and the lead frame 2A are connected by wire bonding 6.

Thus, the light emitting diode 1 can apply a predetermined voltage to the lead frames 2A and 2B to cause the light emitting diode chip 3 to emit light.
The light emitted toward the back side of the light emitting diode 1 by this light emission is reflected to the front side of the light emitting diode 1 by the flat surface 2AB and the tapered surface 2AC forming the concave portion 2AA. With this configuration, the light emitting diode 1 emits light toward the rear side of the light emitting diode chip 3 toward the front side by the concave portion 2AA so that the light emitted from the light emitting diode chip 3 can be effectively used. Thereby, the concave portion 2AA constitutes a reflector that reflects the illumination light emitted backward from the light emitting diode chip 3 to the front side.

The molding by the resin 4 has a tip formed in a substantially hemispherical shape and functions as a lens so that the light emitted toward the front side of the light emitting diode 1 can be emitted with a desired directivity. It has been made to be.

In recent years, a light-emitting diode 1 of this type having a large amount of light and a high luminance has been obtained.
They are arranged in a matrix and used for displays.

[0008]

In a display, a local change in the amount of light on a display screen is perceived as uneven brightness, and when a color image is displayed by red, blue, and green light emitting diodes, each color is not displayed. The uneven brightness is perceived as uneven color. Thus, when a display is configured with light emitting diodes, even if it is adjusted so that luminance unevenness and color unevenness cannot be perceived when viewed from the front direction, it is considered that the directivity (orientation characteristics) of the light emitting diodes varies. Brightness unevenness depending on the direction,
Color unevenness will occur.

[0009] When the display is configured by this,
In a light emitting diode, it is required to reduce variation in directivity as compared with a case where a light source is simply configured.

On the other hand, in the light emitting diode 1, as shown in FIG. 12, the light emitting diode chip 3 may be mounted so as to be displaced from the center of the flat surface of the concave portion 2AA. When the light emitting diode chip 3 is arranged, the light L1 reflected in the front direction of the light emitting diode 1 by the tapered surface 2AC is not reflected by the tapered surface 2AC when the position is shifted as described above. On the opposite side, when the component L2 is arranged at the correct position in the center, the component L2 that is not blocked by the tapered surface 2AC is reflected by the tapered surface 2AC. As a result, in the light emitting diode 1, the emission direction of the illumination light changes due to the displacement of the light emitting diode chip 3. In a conventional light emitting diode, there is a large variation in directivity due to a change in emission direction, and when configuring a display, there is a problem that the directivity of emitted light is still insufficient for practical use.

FIG. 13 is a characteristic curve showing the directivity when the light emitting diode chip 3 is displaced. FIG. 14 is a characteristic curve showing the directivity when the light emitting diode chip 3 is correctly arranged in comparison with FIG. FIG. When the light emitting diode chip is displaced, the maximum or average emission direction of the emitted light changes as shown in FIG.

In the light emitting diode 1, FIG.
As shown in FIG. 14, the partial component L3 of the light emitted from the light-emitting diode chip 3 is totally reflected and emitted from the inner wall surface of the mold resin, so that the directivity of the conventional light-emitting diode 1 is (see FIG. And FIG. 15), in addition to the peak P1 of the emitted light due to the so-called main lobe centering on the front direction of the light emitting diode 1, the peak P2 due to the so-called side lobe in a direction inclined by about 60 degrees from the front direction.
Is formed.

In the light-emitting diode 1, when the light-emitting diode chip 3 is formed of a transparent substrate, such a peak P2 of the side lobe becomes large. In this case, when displaying a color image, the side lobe is displayed. Looking at the screen, the color of the display screen changes significantly. This also causes a problem that the directivity of the light emitting diode greatly varies, and when configuring a display, the directivity of emitted light is still insufficient for practical use.

The peak P2 of such a side lobe
As a method of suppressing the above, a method of mixing a light diffusing material that scatters light into the mold resin can be considered, but in practice, in this method, if the peak P2 is suppressed by increasing the mixing material, The function of the mold resin as a lens is impaired and the directivity in the front direction is deteriorated, which is not practical.

The present invention has been made in view of the above points, and it is an object of the present invention to propose a light emitting diode which can reduce the variation in directivity as compared with the related art, and an image display device using the light emitting diode. Things.

[0016]

According to a first aspect of the present invention, a light emitting diode chip is held at one end of a lead frame, and the lead frame and the light emitting diode chip are molded with a transparent resin or a translucent resin. A light scattering member that scatters outgoing light of the light emitting diode chip is disposed near the light emitting diode chip by applying to the light emitting diode.

Further, in the invention according to claim 4, a light emitting diode chip is held at one end of a lead frame, and the lead frame and the light emitting diode chip are applied to a light emitting diode molded with a transparent resin or a translucent resin. A positioning portion for positioning the light emitting diode chip is formed in the light emitting diode chip holding portion at one end.

According to a ninth aspect of the present invention, the present invention is applied to an image display device for displaying a desired image by lighting light-emitting diodes arranged in a matrix, and holding a light-emitting diode chip at one end of a lead frame. The light emitting diode is formed by molding the frame and the light emitting diode chip with a transparent resin or a translucent resin, and in the light emitting diode, in the vicinity of the light emitting diode chip,
A light scattering member for scattering the light emitted from the light emitting diode chip is disposed.

According to a tenth aspect of the present invention, the present invention is applied to an image display device for displaying a desired image by lighting light-emitting diodes arranged in a matrix, and holding a light-emitting diode chip at one end of a lead frame. A light emitting diode is formed by molding the frame and the light emitting diode chip with a transparent resin or a translucent resin. In the light emitting diode, a positioning portion for positioning the light emitting diode chip is formed in a holding portion of the light emitting diode chip at one end of the lead frame. .

According to the first aspect of the present invention, by disposing a light scattering member for scattering the light emitted from the light emitting diode chip in the vicinity of the light emitting diode chip, the light scattering member scatters the light emitted from the light emitting diode chip. Let me
The light scattering member may be configured as if it were a light source. Thus, even if the light emitting diode chip is displaced, even if the type of the substrate of the light emitting diode chip is different, the light emitting diode can be configured so that the light scattering member and the light emitting diode chip or the light scattering member are used as a light source, and the directivity is accordingly increased. Variability can be reduced.

According to the fourth aspect of the present invention, if the positioning portion for positioning the light emitting diode chip is formed in the holding portion of the light emitting diode chip at one end of the lead frame, the positioning portion can shift the position of the light emitting diode chip. Therefore, the variation in directivity due to the displacement can be reduced accordingly.

According to the ninth aspect of the present invention, the light emitting diode chip is held at one end of the lead frame, and the lead frame and the light emitting diode chip are molded with a transparent resin or a translucent resin to form a light emitting diode. In the diode, by disposing a light scattering member that scatters the light emitted from the light emitting diode chip in the vicinity of the light emitting diode chip, an image display device is constituted by the light emitting diode having reduced directivity variation, and the luminance unevenness is reduced. Thus, an image with less color unevenness can be displayed.

According to a tenth aspect of the present invention, a light emitting diode chip is held at one end of a lead frame, and the lead frame and the light emitting diode chip are molded with a transparent resin or a translucent resin to form a light emitting diode. By forming a positioning part for positioning the light emitting diode chip on the light emitting diode chip holding part at one end of the lead frame,
An image display device can be configured with a light emitting diode with reduced variation in directivity, and an image with less luminance unevenness and color unevenness can be displayed.

[0024]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(1) First Embodiment (1-1) Configuration of First Embodiment FIG. 1 shows a light emitting diode according to a first embodiment of the present invention in comparison with FIG. It is sectional drawing. The light emitting diode 11 scatters the light emitted from the light emitting diode chip 3 near the light emitting diode chip 3
Light scattering member 1 for positioning light emitting diode chip to A
2 are arranged.

That is, the light emitting diode 11 is provided with the concave portion 2A of the lead frame 2A on the side where the light emitting diode chip 3 is mounted in the process of processing the lead frames 2A and 2B.
A, a light scattering member 12 is disposed.
The light emitting diode chip 3 is mounted on the basis of.

Here, the light scattering member 12 is provided with a concave portion 2AA.
Is formed at the center of the lead frame 2A so as to form an opening having a rectangular cross section slightly larger than the outer shape of the light emitting diode chip 3 at a predetermined position. Even when the chip 3 is misaligned, the amount of misalignment is configured to be equal to or smaller than the difference between the size of the opening formed by the light scattering member 12 and the size of the light emitting diode chip 3, and accordingly, the light emitting diode chip 3 Is reduced so that the directivity variation due to the position shift is reduced.

The light scattering member 12 is made of, for example, a transparent resin such as epoxy, a transparent resin such as a small glass ball having a different refractive index from the transparent resin, or a silica or the like which efficiently reflects light emitted from the light emitting diode chip 3. Is formed by mixing fine powder of Thereby, the light scattering member 12 is formed of a translucent member surrounding the side of the light emitting diode chip 3, and scatters light emitted toward the side from the light emitting diode chip 3 in various directions. Variations in directivity are reduced, and peaks of side lobes are suppressed.

After the light emitting diode chip 3 is mounted on the lead frame 2A, the light emitting diode 11 is connected to the lead frames 2A, 2B by wire bonding 5, 6.
And then molded by the resin 4.

(1-2) Operation of the Embodiment In the above configuration, the light emitting diode 11 (FIG. 1)
In the step of forming the lead frames 2A and 2B, after a flat surface 2AB and a concave portion 2AA with a tapered surface 2AC are formed at the tip of one lead frame 2A by coining, an opening having a rectangular cross section is formed in the center of the concave portion 2AA. Is disposed. Further, the light emitting diode chip 3 is arranged in the opening of the light scattering member 12 thus created. Thereby, the light emitting diode 1
1, the flat surface 2AB
Although there is a possibility that the position is shifted over almost the entire surface of the light scattering member 12, the amount of the position shift can be reduced by the opening of the light scattering member 12, and the directivity variation due to the position shift can be reduced accordingly. .

Further, by positioning the light emitting diode chip 3 with reference to the opening having the rectangular cross section of the light scattering member 12 in this manner, the rotation of the light emitting diode chip 3 about the front direction of the light emitting diode 11 is reduced. can do.

In the case where the light emitting diode 11 is a red light emitting diode using a gallium arsenide substrate, the remaining lead frame 2B and the light emitting diode chip 3 are connected by wire bonding 5, and if the light emitting diode 11 is a blue or green light emitting diode using a sapphire substrate. In addition, the lead frame 2A and the light emitting diode chip 3 are further connected by wire bonding 6, and are molded by the resin 4.

As a result, the light emitted from the light emitting diode chip 3 is positioned with respect to the package made of resin with a remarkably higher precision than before, whereby the variation in directivity is remarkably reduced as compared with the conventional case. Is done.

In addition, since the rotation of the light emitting diode chip 3 can be prevented, the variation in directivity can be reduced. That is, in this type of light emitting diode chip, the electrode for wire bonding is formed on the flat surface on the front side of the light emitting diode 11, so that this electrode is slightly formed when viewed from the front. There is a feature that the directivity in the given direction is different from the directivity in other directions. However, if the rotation of the light emitting diode chip 3 is restricted as in this embodiment, the directionality of the directivity different from the other directions can be made constant with respect to the lead frames 2A and 2B. Therefore, the variation in directivity can be reduced by that amount.

The emitted light emitted to the side of the light emitting diode chip 3 is scattered by the light scattering member 12, and the surface light source emits light as if the entire front surface of the light scattering member 12 is emitting light. It is constituted by the scattering member 12. In the surface light source configured as described above, the change in the emission characteristics due to the displacement of the light emitting diode chip 3 is mitigated by being positioned with high precision in the resin package via the lead frame 2A. Also, in the light emitting diode 11, the variation in directivity can be reduced.

Further, even when the light emitting diode chip 3 is made of a transparent substrate, a surface light source in which the entire front surface of the light scattering member 12 is a light emitting surface is formed as in the case of a non-transparent substrate. Thereby, the peak of the side lobe when the light emitting diode chip 3 having such a transparent substrate is applied can be efficiently suppressed.

When the light emitted from the light emitting diode chip 3 is scattered as described above, the light emitted from the light emitting diode 11 is scattered only in the vicinity of the light emitting diode chip 3, so that the lens of the lens made of the molding resin is used. The desired directivity can be ensured by fully exerting the function.

FIG. 2 is a characteristic curve diagram showing the directivity of the light emitting diode 11 according to this embodiment in comparison with FIG. 13 and FIG. According to the characteristic curve diagram, it can be seen that the function of the lens by the resin mold can be sufficiently exhibited, and a smooth directivity can be ensured in which the peak P2 due to the side lobe is sufficiently suppressed. Thus, when the light emitting diodes 11 are arranged in a matrix to form an image display device of a single color or a color, simply adjusting the brightness to be uniform in the front direction of the display screen, from various directions. This makes it possible to display an image free from luminance unevenness and color unevenness.

(1-3) Effects of First Embodiment According to the above configuration, a positioning member having an opening having a rectangular cross section is arranged in the recess 2AA of the lead frame holding the light emitting diode chip 3. By doing so, the displacement and rotation of the light emitting diode chip can be reduced. Therefore, a variation in the directivity of the light emitting diode can be reduced correspondingly, and further, an image display device capable of displaying a high-quality image with less luminance unevenness and color unevenness by using such a light emitting diode. Can be obtained.

A light scattering member 1 for scattering the light emitted from the light emitting diode chip 3 near the light emitting diode chip 3.
By arranging the light emitting diode chip 2, even when the light emitting diode chip 3 is formed of various substrates, peaks due to side lobes can be sufficiently suppressed, and variation in directivity due to displacement of the light emitting diode chip 3 and the like can be reduced. can do. Further, it is possible to obtain an image display device capable of displaying a high-quality image with less luminance unevenness and color unevenness using such a light emitting diode.

Since the light scattering member 12 is arranged in the recess of the lead frame and is formed of a translucent member surrounding the side of the light emitting diode chip, the manufacturing process of the light emitting diode is hardly changed. Instead, the dispersion of directivity can be reduced by simply adding the step of forming the light scattering member 12 to the step of forming the lead frame.

Further, since the light scattering member 12 is a positioning portion for positioning the light emitting diode chip at a predetermined position of the concave portion of the lead frame, the position shift of the light emitting diode chip can be reduced. Further, variation in directivity can be further reduced.

(2) Second Embodiment FIG. 3 is a sectional view of a light emitting diode according to a second embodiment of the present invention, partially enlarged and viewed from the front and side, in comparison with FIG. It is. The light emitting diode 21 is formed by connecting the light emitting diode chip 3 to the recess 2A
A, and wire bonding is performed.
A light-diffusing resin 22 is filled so as to cover the light-emitting diode chip 3 together with A, and a light-scattering member that diffuses the light emitted from the light-emitting diode chip 3 in the vicinity of the light-emitting diode chip 3 is formed by the resin 22. The light emitting diode 21 is then molded with resin.

Here, in the light diffusing resin 22, for example, a transparent resin such as epoxy or the like, a transparent resin such as minute glass spheres having a different refractive index from the transparent resin, or the light emitted from the light emitting diode chip 3 is efficiently used. It is formed by mixing fine powder such as silica which reflects well. As a result, the light emitting diode 21 scatters light emitted from the light emitting diode chip 3 in various directions, so that the surface light source whose entire front side surface of the light emitting diode 21 of the resin 22 is a light emitting surface is formed inside the light emitting diode 21. In order to reduce the displacement, rotation, and variation in directivity of the light emitting diode chip 3 due to the substrate, the peak of the side lobe is suppressed.

According to the structure shown in FIG. 3, the first embodiment is also applicable to a case where the light scattering member 22 is arranged near the light emitting diode chip 3 by filling the resin so as to cover the light emitting diode chip 3. The same effect as described above can be obtained.

In this case, the dispersion of the directivity can be reduced only by adding the step of arranging the light scattering member 22 to the step of forming the light emitting diode 21.

(3) Third Embodiment FIG. 4 is a sectional view showing a light emitting diode according to a third embodiment of the present invention. In the light emitting diode 31, the light emitting diode chip 3 is mounted on the lead frames 2A and 2B in the same manner as in the related art, and is further wire-bonded.

The light emitting diode 31 is used in a subsequent resin molding step.
A transparent or translucent resin 32 used for manufacturing a normal light-emitting diode is allocated to the tip of the light-emitting diode. Is assigned and the molding process is executed. Here, as the light diffusing resin, for example, the resin of the light scattering member 12 described in the first embodiment is applied. Thus, the light-emitting diode 31 is configured such that a light-scattering member that scatters the emitted light is disposed near the light-emitting diode chip 3 so as to serve also as a package.

According to the structure shown in FIG. 4, even if a light scattering member for scattering outgoing light is arranged in the vicinity of the light emitting diode chip 3 by being used as a package, variations in directivity can be reduced. it can.

(4) Fourth Embodiment FIG. 5 is a sectional view showing a light emitting diode according to a fourth embodiment of the present invention in comparison with FIG. In the light emitting diode 41, a concave portion 42 for positioning the light emitting diode chip 3 is further formed at the center of the flat surface 2AB which is the bottom surface of the concave portion 2AA of the lead frame 2A.

The recess 42 has an opening having a rectangular cross section slightly larger than the outer shape of the light emitting diode chip 3, and the PN junction formed in the light emitting diode chip 3 is slightly smaller than the flat surface 2AB. Formed by the depth protruding to the front side of the. Thus, the light-emitting diode 41 is prevented from being displaced by the concave portion 42, and furthermore, the rotation of the light-emitting diode chip 3 can be restricted, so that the variation in directivity can be prevented accordingly.

The concave portion 42 is formed such that the PN junction protrudes slightly in front of the light emitting diode 41 from the flat surface 2AB.
Is formed, the outgoing light emitted from the PN junction in the lateral direction is efficiently guided to the tapered surface 2AC, and the peak due to the side lobe can be suppressed.

According to the configuration shown in FIG. 5, only the positioning portion is formed by the concave portion, so that the directivity due to the displacement and rotation of the light emitting diode chip 3 can be obtained only by changing the mold used for producing the lead frame. Variation can be reduced.

(5) Fifth Embodiment FIG. 6 is a sectional view showing a light emitting diode according to a fifth embodiment of the present invention in comparison with FIG. When viewed from the front side of the light emitting diode 51, the light emitting diode 51 has a rectangular concave portion 52AA so as to correspond to the horizontal and vertical directions on the display screen of the display.

That is, the concave portion 52AA has a shape slightly larger than the light-emitting diode chip 3, and a rectangular flat surface 52AB as a bottom surface is formed at the center, and a tapered surface 52AC due to an inclination opened in the front direction is formed on each side of the rectangular shape. It is formed. As a result, the light emitting diode 51 can position the light emitting diode chip 3 by the flat surface 52B, so that the position shift and rotation of the light emitting diode chip 3 can be reduced by that much. .

Further, the concave portion 52AA is provided with the light emitting diode 5
The light L4 emitted from the light emitting diode chip 3 at an inclination of about 60 degrees with respect to the front of
The size and the depth are set so as to be reflected at the front edge of the. Accordingly, the light emitted from the light emitting diode chip 3 by the light emitting diode 51 with an inclination of about 60 degrees with respect to the front is reflected by the tapered surface 52AC and emitted in the front direction. The light emitted from the light emitting diode chip 3 with the inclination closed by approximately 60 degrees is emitted directly in the front direction. In a light emitting diode, generally, an inclination of about 60 degrees with respect to the front is
This is a so-called half-value direction in which the amount of emitted light is about 1/2 with respect to the front direction. Thereby, in the light emitting diode 51, as shown in the directivity in FIG. 7, the light emitting diode 51 is applied to a display so that emitted light is not distributed in unnecessary directions.
The appropriate directivity is ensured accordingly.

According to the structure shown in FIG. 6, the concave portion of the lead frame is formed by a substantially rectangular flat surface on which the light emitting diode chip is mounted, and a tapered surface opened outward from the flat surface. By forming the positioning portion by the surface, the same effect as that of the fourth embodiment can be obtained with a simple configuration.

(6) Sixth Embodiment FIG. 8 is a cross-sectional view showing a light emitting diode according to a sixth embodiment of the present invention in comparison with FIG. 6B. The light emitting diode 61 is provided with the concave portion 42 described with reference to FIG.
Is constituted by a tapered surface.

As shown in FIG. 7, the same effect as in the fifth embodiment can be obtained even if the side surface of the concave portion is formed by a tapered surface.

(7) Seventh Embodiment FIG. 9 is a sectional view showing a light emitting diode according to a fifth embodiment of the present invention in comparison with FIG. In the light emitting diode 71, a positioning portion is formed only at a corner portion of the light emitting diode chip 3.

That is, in the light emitting diode 71, the concave portion 72AA of the lead frame has the tapered surface 72A.
A positioning projection 72AD is formed at a position that is constituted by AC and a flat surface 72AB that forms the bottom surface and that corresponds to a corner of the light emitting diode chip 3.

Thus, in the light emitting diode 71, the position deviation convex portion 72AD reduces the displacement and rotation of the light emitting diode chip 3, thereby reducing the variation in directivity. Further, on the side of the light emitting diode chip 3, the emitted light is prevented from being blocked as much as possible, so that the emitted light of the light emitting diode chip 3 can be efficiently emitted.

According to the configuration shown in FIG. 9, even if the positioning portion is configured to guide the corner of the light emitting diode chip, the same effect as that of the above embodiment can be obtained.

(8) Other Embodiments In the above-described embodiment, the case where one light emitting diode chip is arranged in one package has been described. However, the present invention is not limited to this, and the present invention is not limited to this. The present invention can be widely applied to a case where red, blue, and green light emitting diode chips are arranged. FIG. 10 is a sectional view showing a configuration in which the configuration described above with reference to FIG. 5 is applied to such a light emitting diode. Thus, even when the red, blue, and green light emitting diode chips are arranged in one package, the same effect as that of the above-described embodiment can be obtained.

In the above-described embodiment, the case where the light emitting diode chip is arranged in the concave portion of the lead frame has been described. However, the present invention is not limited to this, and does not have a reflector structure by such a concave portion. In such a case, it can be widely applied to light emitting diodes.

[0066]

As described above, according to the present invention, a light scattering member for scattering light is disposed in the vicinity of a light emitting diode chip, and a positioning portion for a light emitting diode chip is provided on a lead frame. Thus, it is possible to obtain a light emitting diode whose directivity can be sufficiently improved as compared with the above, and an image display device using this light emitting diode.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a light emitting diode according to a first embodiment of the present invention.

FIG. 2 is a characteristic curve diagram showing directivity of the light emitting diode of FIG.

FIG. 3 is a sectional view showing a part of a light emitting diode according to a second embodiment of the present invention.

FIG. 4 is a sectional view showing a part of a light emitting diode according to a third embodiment of the present invention.

FIG. 5 is a sectional view showing a part of a light emitting diode according to a fourth embodiment of the present invention.

FIG. 6 is a sectional view showing a part of a light emitting diode according to a fifth embodiment of the present invention.

FIG. 7 is a characteristic curve diagram showing directivity of the light emitting diode of FIG. 6;

FIG. 8 is a sectional view showing a part of a light emitting diode according to a sixth embodiment of the present invention.

FIG. 9 is a sectional view showing a part of a light emitting diode according to a seventh embodiment of the present invention.

FIG. 10 is a cross-sectional view showing a part of a light emitting diode according to another embodiment of the present invention.

FIG. 11 is a cross-sectional view showing a conventional light emitting diode.

12 is a cross-sectional view for explaining displacement of a light-emitting diode chip in the light-emitting diode of FIG. 11;

FIG. 13 is a characteristic curve diagram showing directivity of the light emitting diode of FIG.

14 is a characteristic curve diagram showing the directivity of the light emitting diode of FIG.

FIG. 15 is a cross-sectional view for explaining a side lobe in the directivity of FIG. 14;

[Explanation of symbols]

1, 11, 21, 31, 41, 51, 61, 71 ... light emitting diode, 2A, 2B ... lead frame, 2A
A, 42, 52AA, 72AA ... concave portion, 2AB, 52
AB, 72AB: Flat surface, 2AC, 52AC, 72A
C: tapered surface, 3: light-emitting diode chip, 1
2, 22: light scattering member, 72AD: positioning protrusion

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 23/31 H01L 23/30 F 23/48 (72) Inventor Kimi Igarashi Kita-Shinagawa, Shinagawa-ku, Tokyo 6-7-35 Sony Corporation F-term (reference) 4M109 AA02 BA01 DB15 EC11 FA01 GA01 5C094 AA03 AA55 BA24 CA19 ED11 ED13 5F041 AA06 AA07 AA10 AA37 CA12 CA13 CA35 CA46 DA07 DA12 DA13 DA18 DA25 DA26 DA44 FE06 5 AA02 BA01 CA21 CB02 DD12 FA01

Claims (10)

[Claims] 1. A light emitting diode in which a light emitting diode chip is held at one end of a lead frame and the lead frame and the light emitting diode chip are molded with a transparent resin or a translucent resin, wherein the light emitting diode is provided near the light emitting diode chip. A light emitting diode comprising a light scattering member for scattering light emitted from a chip. 2. The lead frame holds the light emitting diode chip in a concave portion formed at the one end, and the light scattering member is disposed in the concave portion of the lead frame so that a side of the light emitting diode chip is disposed. The light emitting diode according to claim 1, wherein the light emitting diode is a translucent member. 3. The light emitting diode according to claim 2, wherein said light scattering member is a positioning member for positioning said light emitting diode chip at a predetermined position of a concave portion of said lead frame. 4. A light emitting diode in which a light emitting diode chip is held at one end of a lead frame and the lead frame and the light emitting diode chip are molded with a transparent resin or a translucent resin. A light emitting diode, wherein a positioning portion for positioning the light emitting diode chip is formed in the holding portion. 5. The device according to claim 4, wherein the holding portion is a concave portion formed at one end of the lead frame, and the positioning portion is a concave portion formed on a bottom surface of the concave portion. Light emitting diode. 6. The holding portion is a concave portion formed at one end of the lead frame, wherein the concave portion has a substantially rectangular flat surface on which the light emitting diode chip is mounted, and opens outward from the flat surface. The light emitting diode according to claim 4, wherein the positioning portion is formed of a tapered surface, and the positioning portion is the flat surface. 7. The tapered surface reflects the light emitted from the light emitting diode chip at an angle of about 60 degrees with respect to the front of the light emitting diode at an edge on the front side. The light emitting diode according to claim 4, wherein: 8. The light emitting diode according to claim 4, wherein said positioning portion is a member for guiding a corner of said light emitting diode chip. 9. An image display device for displaying a desired image by lighting light-emitting diodes arranged in a matrix, wherein a light-emitting diode chip is held at one end of a lead frame, and said lead frame and said light-emitting diode chip are made of a transparent resin. Alternatively, the light emitting diode is formed by molding with a translucent resin, and in the light emitting diode, a light scattering member that scatters light emitted from the light emitting diode chip is disposed near the light emitting diode chip. Display device. 10. An image display device for displaying a desired image by lighting light-emitting diodes arranged in a matrix, wherein a light-emitting diode chip is held at one end of a lead frame, and said lead frame and said light-emitting diode chip are made of a transparent resin. Alternatively, the light emitting diode is formed by molding with a translucent resin, and in the light emitting diode, a positioning portion for positioning the light emitting diode chip is formed in a holding portion for holding the light emitting diode chip at one end of the lead frame. An image display device characterized by the above-mentioned.