JP2001308244A - Stratified heat sink device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To contrive the increase of cooling efficiency by allowing air current to reach the center part of a device being at the highest temperature to which the air current does not reach. SOLUTION: The inside of the device is divided into a suction layer L1 and a diffusion layer L2 by a partition wall 1 drilling a ventilating hole 4, the suction layer L1 and the diffusion layer L2 communicate with each other, outside air is sucked by the negative pressure of the air current W1 from a fan F to make air current W2 reaching the center part of the device, and after heat exchange, the air current W2 is made to flow to the diffusion layer L2 from the ventilating hole 4, and smoothly diffused to the outside as air current W3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink apparatus for cooling an MPU used in various computers, home appliances, precision machines, and the like. MPU stands for micro processing uni
Some dictionaries use the abbreviation t for microprocessor units. In Japanese, the term "microcomputer" or "computer" is common.

[0002]

2. Description of the Related Art An MPU to which a layered heat sink device of the present invention is mounted is a CPU of various computers.
(Central processing unit / central processing unit, hereafter referred to as CP
U), and the related art described below will also be described with reference to the case. In computer terms, C
PU and MPU are often treated as substantially synonymous,
In the following description, only the word CPU will be used.

The term "computer" includes a supercomputer, a minicomputer, an office computer, a personal computer, and the like, and any of them can be mounted with the heat sink device of the present invention as long as the MPU is used as the CPU. Things.

However, the demand layer of the heat sink device of the present invention is considered to be a so-called "personal computer remodeling enthusiast", that is, there are many people who remodel the inside of a personal computer or purchase parts to make the personal computer itself. Therefore, the following description also relates to the technology of the conventional heat sink device for the CPU of the personal computer.

However, the object to which the heat sink device of the present invention is to be mounted is not limited to the one to be mounted only on the CPU of the personal computer, as a matter of course.
Of course, U can be worn in general.

A personal computer CPU card (a card with a CPU chip mounted thereon) is of a so-called slot type which is vertically mounted on a motherboard and a so-called socket type which is horizontally mounted on a motherboard. Although there are two types of the type called "so-called", the type of the socket type has been increasing slightly nowadays.

Also, there are many so-called "overclock manias" in which the CPU is operated with the operating frequency (clock frequency) of the CPU higher than the rated value, and the CPU operated with the frequency exceeding the rated frequency naturally generates a large amount of heat. High temperature. In order to operate the CPU at a high temperature in a stable manner, the cooling ability of a heat sink device of a genuine component of the CPU manufacturer is insufficient, and various high-performance heat sink devices have been developed.

[0008] In recent years, the overclocking taste has become more and more heated, and a heat sink that realizes higher performance has been developed due to an increase in the speed of the CPU itself (an increase in the rated frequency) and the desire of people to operate it at a higher speed. At present, there is a need for a device.

[0009]

SUMMARY OF THE INVENTION Slot type CP
In the U card, the heat sink device is also substantially rectangular because of its substantially rectangular shape, so that a substantially square fan can be used.
It is relatively easy to realize a high cooling capacity by providing the heat sink device, and a high-performance heat sink device of a slot type CPU card is relatively common.

However, since the socket type CPU card has a substantially square shape, basically one fan can be mounted on the heat sink device. In addition, at present, the amount of heat generated is constantly increasing by increasing the rated frequency of the CPU and operating it at a higher speed.

[0011] It is required to cool the increasingly hot CPU with a single fan, but there is a limit to the capacity (blowing capacity) of the fan due to its size, power consumption, generated noise and the like. Therefore, a method of realizing a further cooling capacity by devising the configuration of the heat sink device is eventually required.

FIGS. 17A and 17B show an example of a genuine heat sink device H ₁ (fan integrated type) manufactured by a CPU manufacturer. 18, 19, and 20 show heat sink devices H ₂ , H ₃ , and H ₄ other than genuine standard products. H _1, a heat sink device of H _2, H _3, H ₄ is obtained by assuming that both are mounted on the substantially square socket type CPU card.

The heat sink device H shown in FIGS. 17a and 17b
_In FIG. ₁ , a cooling fin row 17a is provided in a parallel plate shape as is apparent from the plan view of FIG. 17b. For this reason, the airflow W generated by the rotational force of the fan F
₄ is forcibly converted to a linear shape by colliding with the plate-shaped fin row 17a.

[0014] Although the heat exchange efficiency is good because strikes the fin rows 17a to cold air flow at this time is heated (heat through the bottom plate 17b from the surface of the CPU chip T), since the air flow W ₄ itself is weakened by the collision momentum of the air flow W ₄ discharged from the end of the arrangement of fins is weakened, eventually cooling performance heat muffled inside does not increase much.

FIGS. 18 and 19 attempt to improve this point.
Heat sink devices H ₂ and H ₃ . The heat sink device H ₂ in the cooling fin row 18 of FIG. 18 arranged so as airflow W ₅ flows through the vortex-like, also the air flow W ₆ fins column 19 of the heat sink device H ₃ in cooling of Figure 19 is radially This arrangement solves the problem that the air flow from the fan F is blocked by the fin rows 18 and 19 and stays and weakens (FIG. 18).
In the heat sink device H ₂ (not shown) on the apparatus top fan is mounted).

Further, a heat sink device H ₄ shown in FIG.
In the above, the fan F is arranged in an annularly arranged fin row 20.
Of it adopts a construction to get a surprise that is centrally located, the basic concept is the same as the device of H _2, H _3, the By also smoothly dissipated to the outside airflow W ₇ from the central portion An attempt was made to solve the problem.

In the heat sink devices H ₂ , H ₃ , H ₄ , the flow of the air flows W ₅ , W ₆ , W ₇ is certainly improved, and the genuine standard heat sink device H ₁ shown in FIGS. 17A and 17B is used.
The cooling capacity was higher than that of. However, as a point to be further improved, there is a problem that the airflow W ₅ , W ₆ , W ₇ does not flow in the center of the apparatus where the temperature is the highest.

[0018] Figure 17a this regard, the heat sink device H ₁ genuine standard product of Figure 17b is also exactly the same. As is clear from FIG. 17A, the surface of the CPU chip T, which is a heat source, comes into contact with the lower surface of the bottom plate 17b. Thus, the fin said center portion disposed portion in the column 17a per airflow W _4, where like structure airflow W ₄ which is heated by performing heat exchange can be smoothly exhausted to the outside of the apparatus is highest cooling It brings performance.

[0019] However, Figure 17a, are located the motor part F ₁ of the fan F at the center portion of the device as is apparent in FIG. 17b, the air flow W ₄ caused by the blade portion F ₂ is the motor unit F ₁ And is exhausted to the outside without reaching the center of the device.

This situation is exactly the same in the heat sink device H ₂ in FIG. 18, the heat sink device H ₃ in FIG. 19, and the heat sink device H _{4 in} FIG. 20, and the air flows W ₅ , W ₆ , and W ₇ reach the central portion. Absent. Therefore, even if the heat is smoothly discharged from the peripheral portion having a relatively low temperature, the heat remains in the central portion where the temperature becomes the highest, and the cooling capacity is reduced accordingly.

From the circumstances described above, A sufficiently cold air stream reaches the central part of the device; In addition, the airflow heated at the central portion is smoothly exhausted to the outside of the device. At present, there is a need for a socket-type heat sink device for a CPU having a configuration capable of solving the above two problems.

[0022]

SUMMARY OF THE INVENTION The present invention has been made to solve the above two problems. In the present invention, in order to solve the above two problems, a concept completely opposite to that of the conventional heat sink device is adopted. That is, while the conventional heat sink device considers the arrangement of the fin rows based solely on the idea of smoothly dissipating the airflow to the outside of the device, in the present invention, on the contrary, the external cold air Is drawn into the inside of the device, a cool airflow reaches the central part of the device where the temperature is the highest, and after sufficient heat exchange is performed, the heated airflow is smoothly diffused out of the device. Was.

For this reason, the inside of the device is separated by one or more partitions.
By providing a suction layer for sucking cold outside air and a diffusion layer for dissipating the heated air after heat exchange to the outside by dividing into the above-mentioned layers, ventilation holes formed in the partition by layers having different roles. Alternatively, by communicating with the gap between the plurality of partition walls, the outside cold air is sucked into the inside of the device, the air flow reaches the central portion of the device having the highest temperature, and after sufficient heat exchange is performed, The idea was that the heated airflow was smoothly dissipated outside the device.

That is, at least one suction layer is provided immediately below the fan so that the cooling fin row is disposed so as to smoothly suck the outside air. The fan is a fan for sucking outside air, and the air forcibly sucked from the fan flows down the suction layer to generate a negative pressure, whereby the outside air is sucked into the suction layer.

The sucked outside air reaches the central portion of the apparatus where the heat is the highest because the fin rows are arranged in a vortex or radial manner so that the air flow smoothly guides the air stream to the central portion of the apparatus. After being heated sufficiently by performing heat exchange at, it is forced to flow down by the blown air of the fan, and from the ventilation holes drilled in the partition below the fin row or the gap between the multiple partitions to the lower layer Sent out.

In the lower layer, that is, in the radiation layer, the cooling fin rows are arranged in an arc shape or a radial shape so as to smoothly radiate the air inside the apparatus to the outside, and the heated air flow smoothly flows to the outside. Is discharged. At least one such diffusion layer is formed. The present invention achieves a high cooling effect that cannot be achieved by the conventional heat sink device by the above-described configuration and operation.

The above is summarized as follows. That is, the present invention provides: 1) The cooling fin row has at least one suction layer arranged so as to smoothly suck the outside air. 2) The cooling fin row has at least one diffusion layer arranged so as to smoothly diffuse the air inside the apparatus to the outside. 3) The above-mentioned layers communicate with each other by ventilation holes formed in the partition walls or gaps between the plurality of partition walls. According to the above 1), 2) and 3), the above-mentioned object is achieved by providing a layered heat sink device which realizes a high cooling effect which cannot be achieved by the conventional heat sink device.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described in detail with reference to the drawings. 1 is an external perspective view of one embodiment of the present invention, FIG. 2 is a plan view, FIG. 3 is a bottom view, FIG.
FIG. 5 is a right side view. 6 to 9 are longitudinal sectional views. Hereinafter, the configuration of the present embodiment will be described with reference to the above drawings.

As shown in FIGS. 1 and 4 to 9, the heat sink device H of this embodiment is composed of a suction layer L ₁ and a radiation layer L ₂ separated by a single partition 1. On the suction layer L ₁ is a fan F is screwed, CPU card C loaded on CPU socket S is below the dissipating layer L ₂ is挾着secured by a mounting plate 6,6. The CPU chip T, which is a heat source,
4 and 5 are attached and fixed to the CPU card C so as to slightly protrude from the substantially central portion of the plane of the CPU card C as seen in FIGS.

As shown in FIG. 2, the partition 1 has a substantially square shape slightly longer in the left-right direction, as shown in FIG.
As can be seen from FIG.
As can be seen from the figure, the line connecting the peak of the chevron and the center of the planar shape is a ridge line 1a on the upper surface, the valley line 1b on the lower surface, and the line connecting the four vertices of the planar shape and the central portion of the planar shape is the valley line 1b on the upper surface. And the ridgeline 1a on the lower surface.

As shown in the vertical sectional views of FIGS.
Has a substantially rectangular box shape, and the substantially rectangular bottom plate 5 (formed integrally with the partition wall 1) of the recessed portion is polished on its lower surface to become a smooth surface and adheres to the surface of the CPU chip T. I do. On the upper surface of the bottom plate 5, a center fin 2a having a substantially cross shape in cross section is planted integrally with the bottom plate 5.

As shown in FIGS. 2 and 3, the partition wall 1 is provided with four ventilation holes 4 having a substantially trapezoidal plane shape between adjacent ridge lines 1a and valley lines 1b. Figure 1 and the suction layer L ₁ and dissipating layer L ₂ seen in FIGS. 4-9 by ventilation holes 4 is brought communicated. As shown in FIG. 1, the ventilation holes 4 have the same gradient with respect to the horizontal plane as the partition wall 1 in the portion where the ventilation holes 4 are formed with respect to the horizontal plane (the same applies to all four locations). Gradient).

The partition wall 1 of the upper surface i.e. the suction layer L ₁ side of the plane fins 2c for the plurality of cooling as seen in FIG. 2, 2c, ... is as if forming a vortex around the center fins 2a as a whole The fin row 2 arranged and arranged is integrally implanted with the partition wall 1.

[0034] corner fins 2b of four locations disposed on the nearest part to the apex of the four positions of the partition walls 1, among the fin column 2 as seen in FIG. 2, the valley of the suction layer L ₁ side of the partition wall 1 In the vicinity of the portion in contact with the line 1b, cylindrical corner poles 7 having screw holes 7a for screwing the fan F (see FIG. 1) on the upper surface are integrally fixed respectively. The upper surface of the corner pole 7 and the upper surface of the corner fin 2b are coplanar with no steps, as seen in FIGS.

As shown in FIG. 2, a cylindrical screw guide 1c having a screw hole 1d for screwing the mounting plate 6 is integrally fixed near the center of each short side of the partition wall 1. As shown in FIG. 5, the lower surface of the screw guide 1 c is configured to be flush with the lower surface of the partition 1.

The partition wall 1 of the lower surface i.e. dissipating layer L ₂ side more than the side as seen in Figure 3 of the cooling fins 3a, 3a, ... valley lines 1b, 1b, 1b, 1b and a circle intersecting substantially at right angles A fin row 3 arranged in an arc shape is integrally implanted in the partition wall 1.

Further, FIG. 3 and the partition wall 1 as seen in FIG. 5 the lower surface i.e. dissipating layer on each short side of the L ₂ side surface cross-sectional shape for fixing the mounting plate 6 is substantially L-shaped Mounting plates 8a, 8
b are respectively implanted integrally with the partition wall 1.

As shown in FIGS. 1 to 7, a screw 6d is inserted and screwed into a screw hole 1d (see FIG. 2) formed in a screw guide 1c integrally fixed to each short side of the partition wall 1. The screw 6d is further provided with a screw hole 6 formed in the projection 6c of the mounting plate 6.
a (see FIG. 3). The lower portion of the mounting plate 6 is intended are bored substantially rectangular mounting holes 6b are two places, the mounting hole 6b, the claw portions S _1, S ₁ of the CPU socket S and 6b are inserted (Fig. 4, see FIG. 5).

In the heat sink device H of the present embodiment, a configuration is employed in which the cooling efficiency is increased also in the shape of each fin 2c constituting the fin row 2. 12a to 12d schematically show the configuration of the individual fins 2c. As shown in the vertical cross-sectional view of FIG. 12a, the individual fins 2c have a thicker root near the partition 1 and a larger tip. It is tapered so that it becomes thinner as it goes to the part.

The heat of the partition wall 1 is efficiently conducted to the fins 2c because the root portion is thick, and the air currents W ₁ and W ₂ (see FIGS. 8 and 9) are smooth because the tip portion is thin. The heat conducted to the fins 2c is efficiently dissipated without obstructing the flow. In this embodiment, for each fin 3a of the fin row 3, the fin 3a has a heat exchange effect, but the air flow W ₃ (see FIG. 11).
Rectification is the main purpose, so the above configuration is not adopted,
Of course, the individual fins 3a of the fin row 3 may be configured as described above.

The configuration of this embodiment is as described above. In addition, as the material of the present embodiment, any material can be used as long as it is a material having a high heat conduction efficiency and a certain degree of hardness. In general, metals, especially aluminum, aluminum alloys, copper, copper Alloys and the like are suitable materials.

Further, the in this embodiment, the fin rows 2 and 3 for cooling the suction layer L ₁ in the vortex-like, had been arranged in dissipating layer L ₂ in an arc shape, the suction layer which L ₁ may be arranged radially around the center fin 2a, and the diffused layer L2 may be arranged radially around the ventilation holes 4, ₄ , 4, 4.

Hereinafter, the operation of the present embodiment will be described in detail with reference to the drawings. As shown in FIG. 1, the fan F is screwed and fixed to the screw holes 7a, 7a, 7a, 7a of the four conner poles 7, 7, 7, 7. Next, the CPU card C in which the heat sink device H of this embodiment is attached to the CPU socket S
Is placed on the so that the lower surface of the bottom plate 5 correctly contacts the surface of the CPU chip T (see FIGS. 4 and 5).

Next, mounting holes 6b of two mounting plates 6, 6,
6b, 6b, 6b have claw portions S ₁ , S ₁ ,
S ₁ , S ₁ are sufficiently inserted and the screws 6d, 6d are tightened (see FIGS. 1, 4 and 5). As a result, the heat sink device H of the present embodiment is sandwiched and fixed at the correct position between the CPU socket S and the CPU card C, and the surface of the CPU chip T comes into close contact with the lower surface of the bottom plate 5.

In this case, if the CPU socket S is mounted horizontally with respect to the motherboard (not shown), the heat sink device H of this embodiment is also mounted on the motherboard (not shown).
The CPU socket S and the CPU card C are vertically aligned with respect to the motherboard (not shown) using a CPU converter card (not shown) on a slot type motherboard (not shown). , The heat sink device H of this embodiment is also in a state perpendicular to the motherboard (not shown).

In the following description, it is assumed that the heat sink device H of the present embodiment is also mounted horizontally with respect to a motherboard (not shown). The function and effect are substantially the same even when mounted vertically with respect to (not shown).

When the mounting on the CPU socket S and the CPU card C is completed, the fan F is rotated by connecting the cord (not shown) of the fan F. Since the fan F mounted on the heat sink device H of the present embodiment is an intake fan for sucking outside air, the external air is acted on by the action of the fan F as shown in FIGS. H
It is sucked within airflow W ₁ is generated.

The suction this time, negative pressure is generated in the suction layer L ₁ by a gas stream W _1, to the outside air from the gap of the fin rows 2 disposed in the suction layer L ₁ by the negative pressure in the suction layer L ₁ is, the airflow W ₂ occurs. Suction layer L ₁ is sink device H of the smooth embodiment the fin column 2 the air flow W ₂ as seen in FIG. 10
Are arranged in a vortex shape so as to be introduced into the central portion of the heat sink device H of the present embodiment.

In the center of the heat sink device H of this embodiment, a center fin 2a is implanted directly on the bottom plate 5 as an integral unit. 4 to 9, the bottom surface of the bottom plate 5 is in close contact with the surface of the CPU chip T, and the heat on the surface of the CPU chip T is transferred directly from the bottom plate 5 to the center fin 2a.
The center fin 2a has the highest temperature in the fin row 2.

[0050] Since the heat sink device H of this embodiment the air flow W ₂ generated by the sucking action of the suction layer L ₁ is delivered to the center fins 2a as seen in FIG. 10, sufficient heat exchange line at center fins 2a The center fin 2a is sufficiently cooled, and the bottom plate 5 is also sufficiently cooled.
4 to 9 are sufficiently cooled. Also,
A plurality of fins 2c, 2c,... Other than the center fin 2a.
And the corner fins 2b, 2b, 2b, 2b also have the airflow W _2.
Needless to say, the heat is exchanged with the heat to sufficiently cool.

Center fin 2a and plural fins 2
c, 2c,... and corner fins 2b, 2b, 2b, 2
airflow W ₂ that is high temperature performing b and heat exchange 8-10
It flows into the vent holes 4, 4, 4 and 4, as seen in, the air flow W ₃ and flows further dissipating layer L _2. Fin column 3 so as to dissipate the smooth external airflow W ₃ flowing from the vent holes 4, 4, 4 and 4, as shown in FIG. 11 there are disposed constructed in an arc shape at dissipating layer L ₂ since, air flow W ₃ that high temperature is caused to smoothly dissipated to the outside of the heat sink device H of this embodiment.

The heat sink device H of this embodiment has the function of dissipating the heat generated on the surface of the CPU chip T (see FIGS. 4 to 9) very smoothly in the above process, thereby efficiently cooling the CPU chip T. Have Incidentally, the flow of air flow W _1, W _2, W ₃ in the above process 8 to
Indeed that is present in the form as shown in FIG. 11, in the experiment for generating smoke around the sink device H of this embodiment, the smoke is reliably sucked into the suction layer L _1, the central portion of the device Reaches through the vent holes 4,4,4,4.
Confirmed by emission from ₂ .

In order for the above operation to proceed smoothly, the above-described configuration of the heat sink device H of the present embodiment is closely associated with and cooperated. For example, without taking to FIG. 4, as seen in Figure 9 configuration of the heat sink device H of this embodiment is divided into the suction layer L ₁ and dissipating layer L _2, the conventional heat sink device (e.g., FIGS. 17 to 20 If a similar single-layer structure as a device) as shown, the air flow sucked from the blade portion F ₂ of the fan F (not shown) without reaching the center fins 2a directly below the motor section F ₁ The center fin 2a discharged from the apparatus and having the highest temperature is not sufficiently cooled, so that the cooling of the CPU chip T becomes insufficient.

[0054] Moreover, even if they become even two-layer structure, the air flow unless the ventilation holes 4, 4, 4 and 4 in the partition wall 1 is bored from the air flow W ₂ to the air flow W ₃ being not occur As a result, as in the case of the single-layered device, the central portion of the device having the highest temperature is not sufficiently cooled.

[0055] Further, vent holes 4, 4, 4 and 4 in the partition wall 1 becomes a two-layer structure is being drilled, the fin column 2 leads to a smooth center fins 2a airflow W _2, and the fin column 3 If the air flow W ₃ is not arranged so as to be smoothly radiated to the outside, the air flow W ₂ and the air flow W ₃ are stagnated, and as a result, a sufficient cooling effect cannot be produced.

As can be seen from the above, the suction layer L by the partition 1
₁ a two-layer structure of dissipating layer L _2, ventilation holes 4, 4, 4 and 4 is formed in the partition wall 1 and the embodiment are all I phase俟arrangement and configuration of the arrangement of fins 2 and the fin column 3, The above-described operation of the heat sink device H is brought about, and as a result, a high cooling effect is brought about. It is also worth noting that the large-area partition wall 1 itself functions as a large-area fin and plays a role in heat exchange.

In the heat sink device H of this embodiment, the suction layer L ₁ and the diffusion layer L ₂ do not have outer walls.
Is therefore intended to dissipate the smooth airflow W ₂ of the suction and air flow W ₃ is possible, the hole of the large-area area of the outer wall may have an outer wall is the outer wall or a small has been drilled When a large number of holes having a small area are drilled or a net-like outer wall is provided, the same effect can be obtained as a matter of course, and a heat sink device having an outer wall having the above configuration is included in the present invention. It is.

In order to confirm the cooling effect of the present embodiment,
Figure 17a, was compared experiments with genuine heat sink device H ₁ and the conventional product heat sink device of the CPU manufacturer shown in FIG 17b. Conventional products sink device, 18, 19, adopted the heatsink device H ₄ shown in FIG. 20, which seems to most popular even in the current market of the apparatus shown in FIG. 20.

In the experiment, although not shown, an aluminum plate (about 2 mm thick) having the same size and the same shape as the CPU chip was fixed to the tip of the solder iron with a slight distance by an aluminum bar.
When the temperature of the aluminum plate becomes constant (221 ° C.), the aluminum plate is removed from the CPU of each heat sink device.
The surface of the chip was brought into close contact with the place where it should be in contact, the switch of each heat sink device was turned on, the fan continued to rotate, and the cooling effect of each heat sink device caused the temperature of the aluminum plate to drop to a constant temperature. At that time, the temperature of the aluminum plate corresponding to the surface of the CPU chip was measured and recorded. Table 1 shows the results.

[0060]

[Table 1]

As can be seen from Table 1, in the present embodiment, a temperature difference of about 12 ° C. was actually brought about lower than that of the genuine heat sink apparatus H ₁ , and about 4 ° C. as compared with the conventional heat sink apparatus H _4. It has been found that this results in a low temperature difference. As described above, the conventional heat sink device H
₄ is a product that has been highly evaluated by enthusiasts in terms of its cooling performance, but a remarkable difference clearly appears as compared with the heat sink device H ₄ , and the heat sink devices H ₁ and H ₄ This experiment clearly confirmed that the above-described configuration and operation unique to the present embodiment, which do not exist in the above, certainly reflected the cooling performance.

The configuration and operation of this embodiment have been described above. In the present embodiment, the number of the partition walls 1 is one, but another configuration is also possible for the partition walls 1, and examples thereof are shown in FIGS. In FIGS. 13 to 16, the configuration of the fins other than the center fins 2 a and 2 d is omitted for clarity of the configuration of the partition walls 9, 11, 13, and 15. 11, 11, and 15 are provided with fin rows according to the present embodiment.

FIG. 13 shows valley lines 9a, 9a, 9a,
An example in which four partition walls 9, 9, 9, 9 having 9a are slightly displaced from each other to form gaps 10, 10, 10, 10 therebetween, and four center fins 2a are implanted in the center. And the gap 10 corresponds to the ventilation hole 4 in the above embodiment.
Has the same function as.

FIG. 14 shows a structure in which three partition walls 11, 11, 11 each having a substantially circular plane shape are slightly displaced from each other so that gaps 12, 12, 12 are formed therebetween.
This is an example in which the center fin 2d of the wing is planted,
Has the same function as the ventilation hole 4 in the above embodiment.

FIG. 15 shows that the plane shape is substantially square and the ridge lines 13a, 13a, 13a 13a and the valley lines 13b, 13
b,..., and the adjacent ridge line 13a and valley line 13
This is an example in which two partitions 13 having ventilation holes 14 between b are vertically stacked and four center fins 2a are planted in the center, and the whole has a three-layer structure.

FIG. 16 shows a plurality of ventilation holes 16, 1.
In the example in which three wings of center fins 2d are implanted at the center of the spiral partition wall 15 in which 6,... Are bored, the whole has a five-layer structure. Of course, since the partition wall 15 has a spiral shape, each layer is a single body, but when viewed from the front, it has a five-layer structure. In addition, regarding the configuration of the partition wall, there may be various examples in addition to the above-described configuration. However, a configuration in which the partition wall forms a layer structure and each layer communicates with a ventilation hole or a gap is included in the scope of the present invention. Included.

[0067]

According to the present invention, the internal structure of the heat sink device is made to have a layer structure having two or more layers separated by one or more partition walls on which cooling fin rows are implanted. Since a ventilation hole is formed or a gap is provided between two or more of the partition walls to allow the two or more layers to communicate with each other, the air in the apparatus and the suction layer that sucks outside air by negative pressure due to the airflow of the fan are removed. A radiation layer that diffuses to the outside is formed,
As a result, the airflow of the outside air sucked at the same time as the airflow of the fan also reaches the central portion of the apparatus where the airflow of the fan did not reach the highest temperature, and the cooling efficiency could be dramatically increased.

Further, in the suction layer, the cooling fin rows are arranged in a vortex or radial manner so that the air flow is smoothly concentrated on the central portion of the heat sink device. Reach the part,
The central part of the device, which has the highest temperature, could be cooled efficiently.

Further, in the radiation layer, cooling fin rows are arranged in an arc shape or a radial shape so that an air flow is smoothly radiated from a central portion of the heat sink device. As a result, the ventilation holes or the voids are formed. The high-temperature airflow that flowed into the diffusion layer from the portion was smoothly diffused to the outside of the device, and the cooling efficiency could be further increased.

Further, the individual fins constituting the cooling fin row are formed so that the root portion integrally implanted in the partition is thicker and becomes thinner toward the tip, so that the fins are conducted to the partition. Heat can be efficiently transferred to the individual fins and dissipated into the air, further improving cooling efficiency.

It is also noteworthy that the large-area partition walls themselves function as large-area fins, thereby serving as one blade for heat exchange, and contributing to an increase in cooling efficiency.

As described above, the present invention employs various unique structures which have not existed in the past. As a result, the cooling efficiency is much better than that of the conventional products, and as a result, the apparatus itself can be constructed extremely compact. Even if it is mounted on a motherboard on which components are mounted, it does not interfere with other components.

Since the present invention has many of the above-mentioned excellent characteristics, it is a matter of course that heat sink devices for cooling CPUs of various computers, which will be increasingly accelerated in the future, will be more widely used. It also provides an excellent cooling effect for cooling.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a layered heat sink device according to an embodiment of the present invention, with a portion cut away.

FIG. 2 is a plan view of one embodiment of the layered heat sink device of the present invention.

FIG. 3 is a bottom view of one embodiment of the laminated heat sink device of the present invention.

FIG. 4 is a front view of one embodiment of the layered heat sink device of the present invention.

FIG. 5 is a right side view of one embodiment of the laminated heat sink device of the present invention.

FIG. 6 is a sectional view taken along line AA in FIG. 2 of one embodiment of the laminated heat sink device of the present invention.

FIG. 7 is a sectional view taken along the line BB in FIG. 2 of one embodiment of the layered heat sink device of the present invention.

FIG. 8 is a sectional view taken along the line CC of FIG. 2 of one embodiment of the laminated heat sink device of the present invention.

FIG. 9 is a sectional view taken along the line DD in FIG. 2 of one embodiment of the laminated heat sink device of the present invention.

FIG. 10 is a reference schematic plan view for explaining the flow of air flow in the suction layer of the embodiment of the laminated heat sink device of the present invention.

FIG. 11 is a reference schematic bottom view for explaining the flow of airflow in the diffusion layer of one embodiment of the laminated heat sink device of the present invention.

FIG. 12A is a reference longitudinal sectional view for explaining the configuration of individual fins of one embodiment of the layered heat sink device of the present invention. b is a reference plan view for explaining the configuration of individual fins in one embodiment of the layered heat sink device of the present invention. c It is EE sectional drawing of FIG. 12a. d It is FF sectional drawing of FIG. 12a.

FIG. 13 is a reference external perspective view showing a configuration of a partition wall of another embodiment of the laminated heat sink device of the present invention.

FIG. 14 is a reference external perspective view showing a configuration of a partition wall of another embodiment of the layered heat sink device of the present invention.

FIG. 15 is a reference external perspective view showing a configuration of a partition wall of another embodiment of the layered heat sink device of the present invention.

FIG. 16 is a reference external perspective view showing a configuration of a partition wall of another embodiment of the layered heat sink device of the present invention.

FIG. 17A is a right side view of an example of a genuine heat sink device of a CPU maker. b is a plan view of an example of a genuine heat sink device of a CPU maker.

FIG. 18 is an external perspective view of an example of a conventional heat sink device.

FIG. 19 is a plan view of an example of a conventional heat sink device.

FIG. 20 is an external perspective view of an example of a conventional heat sink device.

[Explanation of symbols]

Reference Signs List 1 partition wall 1a ridge line 1b valley line 1c screw guide 1d screw hole 2 fin row 2a center fin 2b corner fin 2c fin 2d center fin 3 fin row 3a fin 4 ventilation hole 5 bottom plate 6 mounting plate 6a screw hole 6b mounting hole 6c convex portion Screw 7 Corner pole 7a Screw hole 8a Mounting plate 8b Mounting plate 9 Partition 9a Valley line 10 Gap 11 Partition 12 Gap 13 Partition 13a Ridge line 13b Valley line 14 Ventilation hole 15 Partition 16 Ventilation hole 17a Fin row 17b Bottom plate 18 Fin row 19 Fin row 20 Fin row C CPU card F Fan F ₁ Motor section F ₂ Blade section H Heat sink device H ₁ Heat sink device H ₂ Heat sink device H ₃ Heat sink device H ₄ Heat sink device L ₁ Suction layer L ₂ Dispersion layer S CPU socket S ₁ Claw portion T CPU chip W ₁ airflow W ₂ airflow W ₃ air flow W ₄ airflow W ₅ air flow W ₆ care Flow W ₇ Airflow

Claims (1)

[Claims] 1. An MPU (microcomputer / micro proces)
A heat sink device for cooling a sing unit or a microprocessor unit) has a layer structure having two or more layers separated by one or more partition walls on which cooling fin rows are implanted. None, a ventilation hole formed in the partition wall or a void portion provided between the two or more partition walls communicates between the two or more layers in a state where air flow can flow, and the two or more layers are connected to each other. At least one of the layers is a suction layer in which cooling fin rows are arranged in a swirling or radial manner so that an air flow is smoothly concentrated on a central portion of the heat sink device, and at least one of the two or more layers is formed. A cooling fin row is formed as an arc-shaped or radially-dissipated diffusion layer from the ventilation holes or the gaps so that the airflow is smoothly radiated from the inside of the heat sink device to the outside. In the process in which the air flow sucked by the suction layer smoothly reaches the central portion of the heat sink device, heat exchange is performed by the cooling fin rows in the suction layer, and then the air flow passes through the ventilation holes or the gap portions. The heat dissipating layer is configured to be smoothly radiated to the outside of the heat sink device, and the lowermost partition wall or the fin row having a smooth surface on the lower surface which is in close contact with the surface of the MPU chip as a heat source. A layered heat sink device comprising a continuous bottom plate.