JP2001307051A - Circuit substrate with antenna, method for manufacturing circuit substrate with antenna, circuit substrate with capacitance, method for manufacturing circuit substrate with capacitance, circuit substrate with antenna and capacitance, method for manufacturing circuit substrate with antenna and capacitance and non- contact information transfer device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate and device with antenna and capacity with high use efficiency of a substrate surface at low manufacturing cost. SOLUTION: An antenna pattern Apn and a first polar plate pattern are integrally provided on one surface of a substrate Sbt, and a second connection pattern p2 is provided on the lower side by etching, etc., separately from the patterns. A non-conductive layer covering the first polar plate pattern, crossing the antenna pattern Apn, covering its outside end Aoe and exposing part of the second connection pattern p2 on the lower side and the outside and Aoe is provided with a prescribed dielectric factor and thickness by application, etc. A second polar plate pattern Plt2 superposed on the first polar plate pattern and an upper second connection pattern to reach the exposed part of the outside end Aoe from the exposed part of the lower second connection pattern p2 by crossing the antenna pattern Apn are integrally formed as a conductive layer Cdp on the non-conductive layer Ins by printing, etc. The conductive layer Cdp and each exposed part are joined and electrically connected by welding, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board and a method of manufacturing the same, and a non-contact type information exchange device and a method of manufacturing the same. The present invention relates to a method and a non-contact type information exchange device in which an integrated circuit element is mounted on a circuit board having an antenna and a capacitor formed on one surface, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A non-contact type information exchange device is also called a non-contact type data carrier (RFID), has a function of exchanging information with an external device in response to an electromagnetic field in a non-contact state, and includes a data recording medium. It is a new device whose demand is expected to expand in various fields. This non-contact type information transfer device is embodied as a non-contact type card device having a size of a financial card and a non-contact type information tag having a size of a stamp. Contactless card devices are used in the financial field to provide electronic money services, the logistics field such as warehouse management, the ID card used in the entry / exit management system, the transport traffic field such as bus boarding / exiting cards and railway ticket gate cards, and entertainment. Applications in the industrial field and the like are contemplated. On the other hand, a non-contact type information tag includes a non-contact type IC memory label and a non-contact type IC memory tag, and is embodied as an LSI built-in electronic tag represented by Tele-File (Telefile: trade name). "Telefile" has a thin semiconductor integrated circuit chip with a non-contact communication function and a data storage function attached to a mount with an antenna, and is provided as a portable product label or product tag that can be easily attached to an article with the mount. It is intended to be applied to a wide range of industrial fields, such as management of rental books at libraries, management of displayed products at sales stores, management of rental items at rental stores, or inventory management of goods at production sites and warehouses. I have.

[0003] Such a non-contact type information exchange device includes an antenna and a semiconductor integrated circuit unit, and the semiconductor integrated circuit unit further includes transmission / reception means, data processing means, memory means and the like. Drive power is supplied externally by contactless remote supply via an electromagnetic field from a distant reader / writer, but a thin battery is used as an auxiliary power supply. There is also. External supply of electric power is based on an inductance coupling method using a high-frequency magnetic field (100 kHz to several tens of MHz). The power for driving is obtained and used as a power source.
Depending on the cross-sectional area of the built-in antenna circuit, the number of turns of the antenna coil, and the strength and distribution of the supplied magnetic field, the distance between the reader / writer and the reader / writer is practically about 1 mm to several tens of cm. Remote power supply with a separation distance of m or more is also in the range of practical use. If the frequency of the magnetic field used is on the order of megahertz (MHz), the clock of the semiconductor integrated circuit can be obtained from the power supply.

Next, data input / output to / from a non-contact type information transmitting / receiving apparatus is performed by means of a capacitance coupling (D is within several mm) or a frequency of 100 kHz to 500 kHz, where D is a distance suitable for use. Medium wave (D is several c
m to several tens of cm), a short wave of about 1 MHz to 20 MHz (D is within several meters), and a microwave represented by 2450 MHz (D is several meters or more) is used. Therefore, if the non-contact type information exchange device is placed on the reader / writer or passes over the vicinity of several tens of centimeters of the reader / writer, the application of the medium wave and the short wave is suitable. In addition, microwaves are suitable for configurations requiring a longer reach (remote distance).

[0005] FIG. 18 is a front-side pattern configuration diagram of a conventional non-contact type information exchange device using double-sided connection. FIG. 19 is a back side pattern configuration diagram of a conventional non-contact type information exchange device using double-sided connection. As shown in FIG.
A loop-shaped antenna pattern 101 is formed on one side of the front surface 100 of the substrate, and a land 102 is provided at the outer end of the antenna pattern 101. Perforated. A first connection pattern 104 is integrally formed on the inner end of the antenna pattern 101, and the first connection pattern 104 is bifurcated.
One end of the connection pattern 104 is the front side electrode plate pattern 10.
5, and the other end is connected to one terminal of the integrated circuit device 200. The front electrode plate pattern 105 is formed in close contact with the front surface 100 of the substrate. Further, on the front surface 100 of the substrate, a land-shaped second connection pattern 106 independent of other patterns is provided, and its extension is connected to the other terminal of the integrated circuit element 200. In the center of the second connection pattern 106, a through hole 107 reaching the back surface 110 of the substrate is formed.

On the other hand, as shown in FIG. 19, a back side connection pattern 111 is provided on the back surface 110 of the substrate, and lands 112 and lands 113 are formed at both ends thereof. An electrode plate pattern 116 is formed. The land 112 is located opposite the land 102 on the front surface, and the through hole 103 extending from the front surface 100 of the substrate is connected to the center of the land 112.
The land 113 is located at a position facing the land 106 on the front surface, and the through hole 107 extending from the front surface 100 of the substrate is connected to the center of the land 113. The back electrode pattern 116 is located on the front surface 100 of the substrate at a position opposite to the front electrode pattern 105 on the back surface 11 of the substrate.
0 is formed in close contact. As a result, the front electrode pattern 105 and the rear electrode pattern 116 and the substrate (having a predetermined dielectric constant) sandwiched between these two electrode patterns form a capacitor. As described above, the parallel resonance circuit in which the antenna and the capacitor are connected in parallel using both sides of the substrate is formed, and the integrated circuit device 200
To form a non-contact type information exchange device using an antenna and a substrate with a capacitor. The tuning frequency of this parallel resonance circuit is the reciprocal of the root of the product of the inductance and capacitance of the antenna pattern,
If the inductance is insufficient to make the tuning frequency match the communication frequency with the reader / writer to be communicated with, the adjustment is made by increasing the capacitance of the capacitor.

[0007] As described above, the loop-shaped antenna pattern is usually formed spirally on one surface of the substrate. For this reason,
One end of the spiral pattern, the outer end, is at the outermost periphery of the spiral, and the other end, the inner end, is at the innermost periphery of the spiral. Therefore, in order to connect both ends of the antenna pattern to the integrated circuit element located in the inner area of the antenna pattern, it is necessary to draw the outer end inside the antenna pattern. On the other hand, when a capacitor is provided as a frequency adjustment capacitor for tuning the above antenna pattern to the communication frequency with the reader / writer, an electrode plate pattern is provided on both sides of the substrate, and the substrate acts as a dielectric, and the substrate itself is used. When a capacitor is formed in such a manner as to sandwich the electrode plate, it is necessary to provide a through hole in the substrate and draw the electrode plate pattern on the back surface onto the front surface.

Therefore, in the prior art, the through hole 103
The outermost end of the spiral is drawn out to the back surface 110 of the substrate, and further, by the connection pattern 111 provided on the back surface 110,
The antenna pattern 101 is connected to the integrated circuit element 200 by connecting the through hole 103 and the through hole 107 provided in the land 106 formed on the front surface on the back surface. Similarly, the electrode pattern 116 provided on the back surface 110 is connected to the integrated circuit element 2 through the through hole 107.
00 was connected. As described above, the configuration using both surfaces of the substrate has been adopted.

[0009]

Conventionally, a double-sided printed wiring board has been applied to a substrate for the above reasons. However, using a double-sided printed wiring board for a substrate increases the component cost and increases the utilization of the board surface. There is a disadvantage that the efficiency is reduced. Further, as a manufacturing process, a process of punching through holes in the substrate, two etching processes for forming patterns on both surfaces of the substrate, and a plating process (including deposition, washing and drying) for connecting through holes are required. Therefore, there are disadvantages that the number of manufacturing steps increases, the time required for manufacturing increases, and that the manufacturing cost including the treatment of parts further increases. In addition, there is a problem that the yield is reduced due to passing through many steps.

On the other hand, as another manufacturing method, a chip capacitor can be mounted in the same manner as an integrated circuit element. However, since the use of the chip capacitor requires an increase in component costs and a mounting operation, the manufacturing cost cannot be reduced.
Conversely, there was a fear that the number of mounting components would increase the number of causes of failure. The antenna pattern may be formed by winding a wire having a circular or square cross section and increasing the number of turns to increase the inductance, thereby omitting a capacitor. However, it is difficult to improve the winding efficiency of the wire. In addition, there is a problem that automation is difficult due to the interposition of a wire soldering process, work costs are increased, and further, there is a limit to a reduction in thickness due to its structure.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems in the prior art, and is suitable for automation of manufacturing by improving the efficiency of use of a substrate. It is an object of the present invention to provide a low-cost circuit board and a method for manufacturing the same, and a non-contact type information exchange device and a method for manufacturing the same.

[0012]

The means according to the present invention will be described below. In order to solve the problem of the prior art and to achieve the object, the circuit board with an antenna according to claim 1 of the present invention is formed by depositing or etching or printing or coating or embossing a conductive material on one surface of the substrate. Provided, a loop-shaped antenna pattern having an inner end and an outer end, and an inner region of the antenna pattern,
A pattern comprising: a first connection pattern provided in conduction with the inner end portion; and a second connection pattern provided separately from the antenna pattern and the first connection pattern in a region inside the antenna pattern. A non-conductive layer that covers the antenna pattern located at least across the outer end and the second connection pattern, and exposes at least a portion of the outer end and the second connection pattern; and A conductive layer that is partially laminated on the non-conductive layer, overlaps at least the exposed portion of the outer end portion and the second connection pattern, and extends from the outer end portion to between the second connection pattern; And the conductive layer and the exposed portion of the outer end portion are bonded by pressure bonding or at least one of adhesion and welding with a conductive adhesive. Is passing capable joined, the exposed portion of the second connection patterns and the conductive layer, characterized in that it is conductively bonded by at least one of gluing or welding by crimping or electrically conductive adhesive.

According to the circuit board with the antenna, the lower pattern layer on one side of the substrate is covered with the non-conductive layer, so that the upper conductive layer formed on the non-conductive layer and the corresponding portion of the pattern layer are formed. Is insulated on one side of the substrate. Therefore, the conductive layer formed on the non-conductive layer allows the antenna pattern to be easily pulled into the inner area of the outer end portion using only one side of the substrate, and therefore the use of both sides of the substrate and the connection portion between both sides of the substrate are omitted. You.

A circuit board with an antenna according to a second aspect of the present invention is provided on one side of the board by vapor deposition, etching, printing, coating or embossing of a conductive material,
A loop-shaped antenna pattern having an inner end and an outer end, an outer region of the antenna pattern, a second connection pattern provided in conduction with the outer end, and an outer region of the antenna pattern, A pattern layer having an antenna pattern and a first connection pattern provided separately from the second connection pattern, and covering the antenna pattern located at least across the inner end and the first connection pattern; A non-conductive layer exposing at least a portion of the inner end and the first connection pattern; and at least a portion laminated on the non-conductive layer, and at least the exposed portion of the inner end and the first connection pattern. And a conductive layer extended from the inner end portion to between the first connection patterns, and the conductive layer and the conductive layer The exposed portion of the side end is conductively joined by at least one of pressure bonding or bonding or welding with a conductive adhesive, and the conductive layer and the exposed portion of the first connection pattern are bonded by pressure bonding or conductive bonding. It is characterized in that it is conductively joined by at least one of adhesion and welding by a material.

According to the circuit board with the antenna, the lower pattern layer is covered with the non-conductive layer on one side of the substrate, so that the upper conductive layer formed on the non-conductive layer and the corresponding portion of the pattern layer are formed. Is insulated on one side of the substrate. Therefore, the conductive layer formed on the non-conductive layer can easily be pulled out to the outer region of the inner end portion of the antenna pattern using only one side of the substrate, so that the use of both sides of the substrate and the connection portion between both sides of the substrate are omitted. You.

According to a third aspect of the present invention, there is provided a method for manufacturing a circuit board with an antenna, comprising: a loop-shaped antenna pattern having an inner end and an outer end on one surface of the substrate; A pattern layer having a first connection pattern electrically connected to the inner end and a second connection pattern separated from the antenna pattern and the first connection pattern in a region inside the antenna pattern is formed by depositing a conductive material. Or a first step provided by etching, printing, coating, or embossing, and covering the antenna pattern located at least between the outer end and the second connection pattern, and covering the outer end and the second connection pattern. A second step of providing a non-conductive layer having at least a portion of the outer end exposed; And, and the second conductive layer overlapping at least the exposed portion of the connection pattern, wherein said outer end portion by laminating a portion on the non-conductive layer a second
The conductive layer and the exposed portion of the outer end portion are conductively joined to each other by a third step of extending between the connection patterns and / or bonding or welding with a conductive adhesive material, and And a fourth step of electrically connecting the layer and the exposed portion of the second connection pattern.

According to the method of manufacturing a circuit board with an antenna, the lower pattern layer is covered with the non-conductive layer on one side of the substrate, and then the upper conductive layer and the pattern formed on the non-conductive layer are covered with the non-conductive layer. Insulation with the relevant part of the layer is provided on one side of the substrate. Therefore, the drawing of the antenna pattern outside end into the inside region by forming the conductive layer on the non-conductive layer is easily performed using only one side of the substrate, thereby omitting the use of both sides of the substrate and the connection process between both sides of the substrate. Is done.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a circuit board with an antenna, comprising: a loop-shaped antenna pattern having an inner end and an outer end on one surface of the substrate; A pattern layer having a second connection pattern electrically connected to the outer end portion and a first connection pattern separated from the antenna pattern and the second connection pattern in a region outside the antenna pattern is formed by vapor deposition of a conductive material. Or a first step provided by etching, printing, coating or embossing, and covering the antenna pattern located at least between the inner end and the first connection pattern, and covering the inner end and the first connection pattern. A second step of providing a non-conductive layer having at least a portion of the inner end exposed, and overlapping with at least the exposed portion of the inner end. And, and the conductive layer overlapping at least the exposed portion of the first connection pattern, wherein said inner end portions by laminating a portion on the non-conductive layer first
The conductive layer and the exposed portion of the inner end portion are conductively joined to each other by a third step of extending between the connection patterns and / or bonding or welding with a conductive adhesive material, and And a fourth step of electrically connecting the layer and the exposed portion of the first connection pattern.

According to the method of manufacturing the circuit board with the antenna, the lower pattern layer is covered with the non-conductive layer on one side of the substrate, and then the upper conductive layer and the pattern formed on the non-conductive layer are covered. Insulation with the relevant part of the layer is provided on one side of the substrate. Therefore, the formation of the conductive layer on the non-conductive layer allows the antenna pattern to be easily pulled out to the outer region from the inner end portion using only one side of the substrate, thereby omitting the use of both sides of the substrate and the connection process between both sides of the substrate. Is done.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a circuit board with an antenna according to any one of the third and fourth aspects, wherein the non-conductive layer is coated using a fluid non-conductive material. Alternatively, it is formed by printing. According to this, a coating film can be easily formed on one surface of the substrate, and a coating film having a desired shape can be easily formed, and insulation between a corresponding portion of the lower pattern layer and a corresponding portion of the upper conductive layer can be achieved. Is made on one side of the substrate.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a circuit board with an antenna according to the third aspect, wherein the non-conductive layer is formed by sandwiching a film-shaped non-conductive material. It is characterized by being formed. According to this, an insulating film having a uniform thickness can be easily formed on one surface of the substrate, and a non-conductive material, which is difficult to process in a fluid state, can be applied in a film form. This facilitates insulation between a corresponding portion of the lower pattern layer and a corresponding portion of the upper conductive layer on one surface of the substrate.

According to a seventh aspect of the present invention, there is provided a method of manufacturing a circuit board with an antenna according to the third or fourth aspect, wherein at least the antenna pattern is coated or printed using a fluid conductive material. It is characterized by being formed by. According to this, even a conductive material that is difficult to deposit or process a foil is applied by coating or printing.
Further, the process is simplified and the processing time is shortened as compared with the vapor deposition / etching.

A circuit board with a capacitance according to claim 8 of the present invention comprises a first electrode plate pattern and a first electrode plate pattern provided on one surface of the substrate by vapor deposition, etching, printing, coating or embossing of a conductive material. A pattern layer having a first conductive portion integrated with an electrode plate pattern, a lower second conductive portion separated from the first electrode plate pattern and the first conductive portion, and at least the first electrode plate pattern. A non-conductive layer having a predetermined dielectric constant and a predetermined thickness to cover, a second electrode plate pattern laminated on the non-conductive layer and having an overlapping portion with the first electrode plate pattern, and the second electrode A conductive layer integrated with a plate pattern and having an upper second conductive portion superimposed on at least a part of the lower second conductive portion, and the upper second conductive portion of the conductive layer and the pattern The lower second conduction of the layer At least a portion of the overlapping portion of the can, characterized in that it is conductively bonded by at least one of gluing or welding by crimping or electrically conductive adhesive.

According to the circuit board with the capacitor, the lower pattern layer is covered with the non-conductive layer on one side of the substrate, so that the upper conductive layer and the corresponding portion of the pattern layer formed on the non-conductive layer are covered. Is insulated on one side of the substrate. Therefore, the formation of the capacitor dielectric by the non-conductive layer and the connection of the second electrode plate pattern by the conductive layer formed on the non-conductive layer to the pattern layer on one side of the substrate can be easily performed using only one side of the substrate. Therefore, the use of both sides of the substrate and the connection between the both sides of the substrate are omitted.

According to a ninth aspect of the present invention, in the method of manufacturing a circuit board with a capacitance, the first electrode plate pattern and the first conductive portion integral with the first electrode plate pattern are formed on one surface of the substrate. A first step of providing a pattern layer having an electrode plate pattern and a lower second conductive part separated from the first conductive part by vapor deposition or etching or printing or coating or embossing of a conductive material; A second step of covering the first electrode plate pattern with a non-conductive layer having a predetermined permittivity and a predetermined thickness, and forming a second electrode plate pattern as a conductive layer on the non-conductive layer by the first electrode plate pattern; And an upper second electrode integrated with the second electrode plate pattern.
A third step of superposing and stacking a conductive portion on at least a portion of the lower second conductive portion; and forming the conductive layer between the upper second conductive portion of the conductive layer and the lower second conductive portion of the pattern layer. And a fourth step in which at least a part of the overlapped portion is conductively joined by at least one of pressure bonding or adhesion or welding with a conductive adhesive.

According to the method of manufacturing a circuit board with a capacitor, the lower pattern layer is covered with the non-conductive layer on one surface of the substrate, so that the upper conductive layer and the pattern layer formed on the non-conductive layer are covered. Insulation with the corresponding part is performed on one side of the substrate. Therefore, the formation of the capacitor dielectric by the non-conductive layer and the connection of the second electrode plate pattern by the conductive layer formed on the non-conductive layer to the pattern layer on one side of the substrate can be easily performed using only one side of the substrate. Therefore, the use of both sides of the substrate and the connection process between both sides of the substrate are omitted.

According to a tenth aspect of the present invention, there is provided a method of manufacturing a circuit board with a capacitance according to the ninth aspect, wherein the non-conductive layer is formed by coating or printing using a fluid non-conductive material. It is characterized by. According to this, a coating film is easily formed on one surface of the substrate by using a non-conductive material, and a coating film having a desired shape is easily formed. Insulation with the part is made on one side of the substrate.

[0028] A method for manufacturing a circuit board with a capacitance according to claim 11 of the present invention is the method according to claim 9, wherein the non-conductive layer is formed by sandwiching a film-shaped non-conductive material. I do. According to this, an insulating film having a uniform thickness can be easily formed on one surface of the substrate, and a non-conductive material which is difficult to process in a fluid state can be applied in a film form. This makes it easy to insulate the corresponding portion of the lower pattern layer and the corresponding portion of the upper conductive layer on one surface of the substrate, and furthermore, it is extremely easy to form a capacitor dielectric having a uniform thickness by the insulating film having a uniform thickness. You.

According to a twelfth aspect of the present invention, there is provided a method of manufacturing a circuit board with a capacitance according to the ninth aspect, wherein the pattern layer is formed by coating or printing using a fluid conductive material. And According to this, even a conductive material which is difficult to deposit or foil is applied by coating or printing. Further, the process is simplified and the processing time is shortened as compared with the vapor deposition / etching.

An antenna and a circuit board with a capacitor according to a thirteenth aspect of the present invention are provided by depositing or etching or printing or coating or embossing a conductive material on one side of the board, and having an inner end and an outer end. A loop-shaped antenna pattern, a first electrode plate pattern provided in an inner region of the antenna pattern, and a first connection for conducting the inner end portion and the first electrode plate pattern to an inner region of the antenna pattern. A pattern layer having a pattern and a lower second connection pattern provided separately from the antenna pattern, the first electrode plate pattern, and the first connection pattern in a region inside the antenna pattern;
A first dielectric material having a predetermined dielectric constant and a predetermined thickness;
And covering the electrode pattern and covering the antenna pattern located between the lower second connection pattern and the outer end, and at least a part of the outer end and at least a part of the lower second connection pattern. A non-conductive layer exposing a second electrode plate pattern laminated on the non-conductive layer and having an overlapping portion with the first electrode plate pattern;
At least the exposed portion of the outer end portion, which is superposed on at least a portion of the lower second connection pattern integrally with the second electrode plate pattern and is further extended on the non-conductive layer covering the antenna pattern; A conductive layer forming an overlapped upper second connection pattern, and at least one of pressure bonding or adhesion or welding with a conductive adhesive, and the upper second connection pattern and the outer end portion The exposed portion is joined so as to be able to conduct, and at least a part of the overlapping portion of the upper second connection pattern and the lower second connection pattern is joined so as to be able to conduct.

According to the antenna and the circuit board with a capacitor, the lower pattern layer is covered with the non-conductive layer on one side of the substrate, so that the upper conductive layer and the pattern layer formed on the non-conductive layer are covered. Insulation with the corresponding part is performed on one side of the substrate. Accordingly, the conductive layer formed on the non-conductive layer leads to the inside of the outer end of the antenna pattern, the capacitor dielectric is formed by the non-conductive layer, and the second electrode is formed by the conductive layer formed on the non-conductive layer. The connection of the board pattern to the pattern layer on one side of the substrate can be easily made using only one side of the substrate, so that the use of both sides of the substrate and the connection between the both sides of the substrate are omitted.

An antenna and a circuit board with a capacitor according to a fourteenth aspect of the present invention are provided by depositing or etching or printing or coating or embossing a conductive material on one side of the board, and having an inner end and an outer end. A loop-shaped antenna pattern, a first electrode plate pattern provided in an outer region of the antenna pattern, and a first connection for conducting the outer end portion and the first electrode plate pattern to an outer region of the antenna pattern. A pattern layer having a pattern and a lower second connection pattern provided separately from the antenna pattern, the first electrode plate pattern, and the first connection pattern in a region outside the antenna pattern;
A first dielectric material having a predetermined dielectric constant and a predetermined thickness;
And covering the electrode pattern and covering the antenna pattern located between the lower second connection pattern and the inner end, and at least a part of the inner end and at least a part of the lower second connection pattern. A non-conductive layer exposing a second electrode plate pattern laminated on the non-conductive layer and having an overlapping portion with the first electrode plate pattern;
The second electrode plate pattern is formed integrally with and overlaps at least a portion of the lower second connection pattern, and is further extended on the non-conductive layer covering the antenna pattern to expose at least the inner end. And a conductive layer forming an upper second connection pattern superimposed on the portion.
The upper second connection pattern and the exposed portion of the inner end portion are conductively joined to each other by at least one of pressure bonding or adhesion or welding with a conductive adhesive, and furthermore, the upper second connection pattern and the lower side. At least a part of the overlapping portion with the second connection pattern is connected to be conductive.

According to the antenna and the circuit board with a capacitor, the lower pattern layer on one side of the substrate is covered with the non-conductive layer, so that the upper conductive layer and the pattern layer formed on the non-conductive layer are covered. Insulation with the corresponding part is performed on one side of the substrate. Accordingly, the conductive layer formed on the non-conductive layer leads to the outside of the inner end of the antenna pattern, the capacitor dielectric is formed by the non-conductive layer, and the second electrode is formed by the conductive layer formed on the non-conductive layer. The connection of the board pattern to the pattern layer on one side of the substrate can be easily made using only one side of the substrate, so that the use of both sides of the substrate and the connection between the both sides of the substrate are omitted.

According to a fifteenth aspect of the present invention, in the method of manufacturing an antenna and a circuit board with a capacitor, a loop-shaped antenna pattern having an inner end and an outer end on one surface of the substrate; A first electrode plate pattern, a first connection pattern for electrically connecting the inner end portion and the first electrode plate pattern, and provided separately from the antenna pattern, the first electrode plate pattern, and the first connection pattern. A first step of providing a pattern layer having a lower second connection pattern by vapor deposition or etching or printing or coating or embossing of a conductive material; and printing or printing a non-conductive material having a predetermined dielectric constant. As a non-conductive layer by coating, it covers at least the first electrode plate pattern with a predetermined thickness, and crosses between the lower second connection pattern and the outer end. Covering the antenna pattern to location, second to and expose at least a portion of at least a portion and said lower second connection pattern of the outer edge
Process, as a conductive layer using a conductive material, a second electrode plate pattern having a portion overlapping with the first electrode plate pattern is laminated on the non-conductive layer, and integrally with the second electrode plate pattern,
An upper second connection pattern superimposed on at least a portion of the lower second connection pattern and further extended on the non-conductive layer covering the antenna pattern and superposed on at least the exposed portion of the outer end portion; The upper second connection pattern and the exposed portion of the outer end portion are electrically connected to each other by a third step of laminating and / or bonding or welding with a conductive adhesive, and further, the upper second And a fourth step of electrically connecting at least a part of the overlapping portion between the connection pattern and the lower second connection pattern.

According to the method of manufacturing the antenna and the substrate with the capacitor, the lower pattern layer is covered with the non-conductive layer on one side of the substrate, and then the upper conductive layer formed on the non-conductive layer is covered with the upper conductive layer. Insulation with the corresponding portion of the pattern layer is performed on one side of the substrate. Therefore, the antenna pattern is drawn into the inner region of the outer end portion by forming the conductive layer on the non-conductive layer, the capacitor dielectric is formed by the non-conductive layer, and the second electrode is formed by the conductive layer formed on the non-conductive layer. The connection of the board pattern to the pattern layer on one side of the substrate can be easily made using only the one side of the substrate, thereby omitting the use of both sides of the substrate and the connection process between both sides of the substrate.

A method of manufacturing an antenna and a substrate with a capacitance according to a sixteenth aspect of the present invention is a method of manufacturing a loop-shaped antenna pattern having an inner end and an outer end on one surface of a substrate and an outer region of the antenna pattern. A first electrode plate pattern, a first connection pattern for conducting the outer end portion and the first electrode plate pattern, and provided separately from the antenna pattern, the first electrode plate pattern, and the first connection pattern. A first step of providing a pattern layer having a lower second connection pattern by vapor deposition, etching, printing, coating or embossing of a conductive material, and printing or coating of a non-conductive material having a predetermined dielectric constant. A non-conductive layer according to (1), covering at least the first electrode plate pattern with a predetermined thickness, and traversing the space between the lower second connection pattern and the inner end. Covering the antenna pattern that,
And at least a portion of the inner end and the lower second
A second step of exposing at least a portion of the connection pattern, and laminating a second electrode pattern having an overlapping portion with the first electrode pattern on the non-conductive layer as a conductive layer formed by printing or applying a conductive material. And the second
An upper second connection pattern integral with the electrode plate pattern is superimposed on at least a part of the lower second connection pattern;
A third step of forming over the non-conductive layer covering the antenna pattern so as to overlap with at least the exposed portion of the inner end, and at least one of bonding or welding by crimping or a conductive adhesive; Upper second
A fourth step in which the connection pattern and the exposed portion of the inner end portion are conductively joined, and further, at least a part of the overlapping portion of the upper second connection pattern and the lower second connection pattern is conductively joined. And characterized in that:

According to the above-described method of manufacturing the antenna and the circuit board with the capacitor, the lower pattern layer is covered with the non-conductive layer on one surface of the substrate, and then the upper conductive layer formed on the non-conductive layer is formed. And the corresponding portion of the pattern layer are insulated on one side of the substrate. Therefore, the antenna layer is drawn out to the outer region from the inner end portion by forming the conductive layer on the non-conductive layer, the capacitor dielectric is formed by the non-conductive layer, and the second electrode is formed by the conductive layer formed on the non-conductive layer. The connection of the board pattern to the pattern layer on one side of the substrate is easily made using only the one side of the substrate, thereby eliminating the use of both sides of the substrate and the connection process between both sides of the substrate.

According to a seventeenth aspect of the present invention, there is provided a method of manufacturing an antenna and a circuit board with a capacitor according to any one of the fifteenth and sixteenth aspects, wherein the non-conductive layer is formed by using a fluid non-conductive material. It is characterized by being formed by coating or printing. According to this, a coating film is easily formed on one surface of the substrate by using a non-conductive material, and a coating film having a desired shape is easily formed. Insulation with the part is made on one side of the substrate.

The method for manufacturing an antenna and a circuit board with a capacitance according to claim 18 of the present invention is the method according to claim 15 or 16, wherein the non-conductive layer is sandwiched between a film-shaped non-conductive material. It is characterized by being formed by. According to this, an insulating film having a uniform thickness can be easily formed on one surface of the substrate, and the non-conductive material which is difficult to process in a fluid state can be applied in a film form. This makes it easy to insulate the corresponding portion of the lower pattern layer and the corresponding portion of the upper conductive layer on one surface of the substrate, and furthermore, it is extremely easy to form a capacitor dielectric having a uniform thickness by the insulating film having a uniform thickness. You.

According to a nineteenth aspect of the present invention, there is provided a method of manufacturing an antenna and a circuit board with a capacitor according to any one of the fifteenth and sixteenth aspects, wherein the pattern layer is coated or coated using a fluid conductive material. It is characterized by being formed by printing. According to this, even a conductive material that is difficult to deposit or process a foil is applied by coating or printing. Further, the process is simplified and the processing time is shortened as compared with the vapor deposition / etching.

According to a twentieth aspect of the present invention, there is provided a non-contact type information transmitting / receiving apparatus provided on one surface of a substrate by vapor deposition, etching, printing, coating or embossing of a conductive material, and having an inner end and an outer end. A loop-shaped antenna pattern, a first electrode plate pattern provided in an inner region of the antenna pattern, and a first connection for conducting the inner end portion and the first electrode plate pattern to an inner region of the antenna pattern. A pattern layer having a pattern and a lower second connection pattern provided separately from the antenna pattern, the first electrode plate pattern, and the first connection pattern in a region inside the antenna pattern; At least the first electrode plate pattern has a dielectric constant and a predetermined thickness, and crosses between the lower second connection pattern and the outer end. A non-conductive layer that covers the antenna pattern to be placed and exposes at least a portion of the outer end and at least a portion of the lower second connection pattern; and a first electrode plate laminated on the non-conductive layer. A second electrode plate pattern having an overlapping portion with the pattern, and the non-conductive layer integrally formed with the second electrode plate pattern, overlapped on at least a part of the lower second connection pattern, and further covering the antenna pattern. An upper second portion which is extended on and overlaps at least the exposed portion of the outer end portion
And a conductive layer that forms the connection pattern, and the upper second connection pattern and the exposed portion of the outer end portion can be made conductive by at least one of pressure bonding or bonding with a conductive adhesive. And at least a part of the overlapping portion of the upper second connection pattern and the lower second connection pattern is connected to be conductive, and is connected to at least the first connection pattern and the lower second connection pattern. And an active circuit capable of receiving or transmitting information in a non-contact manner by the antenna pattern.

According to the above-mentioned non-contact type information exchange device, the lower pattern layer is covered with the non-conductive layer on one surface of the substrate, so that the upper conductive layer and the pattern layer formed on the non-conductive layer are covered. Insulation with the corresponding part is performed on one side of the substrate. Accordingly, the conductive layer formed on the non-conductive layer leads to the inside of the outer end of the antenna pattern, the capacitor dielectric is formed by the non-conductive layer, and the second electrode is formed by the conductive layer formed on the non-conductive layer. The connection of the board pattern to the pattern layer on one side of the substrate can be easily made using only one side of the substrate, so that the use of both sides of the substrate and the connection between the both sides of the substrate are omitted. In addition, since the active circuit is connected to the pattern layer, a non-contact information exchange device using only one side of the substrate is realized.

According to a twenty-first aspect of the present invention, there is provided a non-contact type information transmitting / receiving apparatus provided on one surface of a substrate by vapor deposition, etching, printing, coating or embossing of a conductive material. A loop-shaped antenna pattern, a first electrode plate pattern provided in an outer region of the antenna pattern, and a first connection for conducting the outer end portion and the first electrode plate pattern to an outer region of the antenna pattern. A pattern layer having a pattern and a lower second connection pattern provided separately from the antenna pattern, the first electrode plate pattern, and the first connection pattern in a region outside the antenna pattern; At least the first electrode plate pattern having a dielectric constant and a predetermined thickness, and traversing between the lower second connection pattern and the inner end. A non-conductive layer that covers the antenna pattern to be placed and exposes at least a portion of the inner end and at least a portion of the lower second connection pattern; and a first electrode plate laminated on the non-conductive layer. A second electrode plate pattern having an overlapping portion with the pattern, and the non-conductive layer integrally formed with the second electrode plate pattern, overlapped on at least a part of the lower second connection pattern, and further covering the antenna pattern. An upper second portion which is extended upward and overlaps at least the exposed portion of the inner end portion
And a conductive layer forming the connection pattern, and the upper second connection pattern and the exposed portion of the inner end portion are made conductive by at least one of pressure bonding or adhesion or welding with a conductive adhesive. And at least a part of the overlapping portion of the upper second connection pattern and the lower second connection pattern is connected to be conductive, and is connected to at least the first connection pattern and the lower second connection pattern. And an active circuit capable of receiving or transmitting information in a non-contact manner by the antenna pattern.

According to the above-mentioned non-contact type information exchange device, the lower pattern layer on one side of the substrate is covered with the non-conductive layer, so that the upper conductive layer and the pattern layer formed on the non-conductive layer are covered. Insulation with the corresponding part is performed on one side of the substrate. Accordingly, the conductive layer formed on the non-conductive layer leads to the outside of the inner end of the antenna pattern, the capacitor dielectric is formed by the non-conductive layer, and the second electrode is formed by the conductive layer formed on the non-conductive layer. The connection of the board pattern to the pattern layer on one side of the substrate can be easily made using only one side of the substrate, so that the use of both sides of the substrate and the connection between the both sides of the substrate are omitted. In addition, since the active circuit is connected to the pattern layer, a non-contact information exchange device using only one side of the substrate is realized.

[0045]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. The embodiment described below is a part of a preferred example for showing the essential configuration and operation of the present invention, and therefore, various restrictions which are preferable in the technical configuration may be given. The scope of the invention is not limited to these embodiments unless otherwise specified in the following description.

FIG. 1 is an exploded perspective view of one embodiment of a non-contact type information exchange device according to the present invention. As shown in FIG. 1, a non-contact type information transfer device TF according to the present invention includes a substrate (substrate) Sbt on which a circuit pattern or component is formed or mounted on one surface (front surface), and a substrate Sbt. Reinforcing plate (spacer) Spc laminated in contact with the front surface
A front surface material Srf1 laminated on the other surface of the reinforcing plate Spc via the adhesive layer Adh1, and a back surface material Srf2 laminated on the back surface of the substrate Sbt and the adhesive layer Adh2.
Has a structure integrated by lamination. Substrate Sbt
A pattern layer including the antenna pattern Apn and a capacitor C are formed on one side of the substrate, thereby forming an antenna and a circuit board with a capacitor. A semiconductor integrated circuit element IC is further mounted on the antenna and the circuit board with the capacitor, and the antenna pattern Apn and the capacitor C
To form a main part of the non-contact type information exchange device TF.

The substrate Sbt is made of, for example, a heat-resistant flexible printed circuit sheet or a rigid printed circuit board, the reinforcing plate Spc is made of a resin plate, and the adhesive layer Ad is used.
h1 and the adhesive layer Adh2 are made of a pressure-sensitive adhesive, and the front face material Srf1 and the back face material Srf2 are each made of a resin plate.

The capacitor C formed on one side of the substrate Sbt adjusts the tuning frequency. The substrate Sb
semiconductor integrated circuit device IC mounted on one side of
Has a built-in non-volatile memory and the like, and has an appropriate thickness.
vy is provided to absorb the thickness of the semiconductor integrated circuit device IC. A front face material Srf1 is adhered to the upper surface of the substrate Sbt by an adhesive layer Adh1, and a back face material Sr is adhered to the lower surface of the substrate Spc by an adhesive layer Adh2.
f2 is bonded to form a non-contact type information transfer device TF integrated in this manner.

The substrate Sbt has a polyimide film having a thickness of 25 μm and a 12 μm copper foil deposited on one surface of the polyimide film. As the substrate material, glass epoxy, polyester, paper phenol, paper epoxy, composite material, and the like can be applied in addition to heat-resistant resins such as polyimide, polyamide, and polyimide amide. In addition, the reinforcing plate Spc, the front surface material Srf1,
PET as a resin plate applied to the back surface material Srf2
Plastic materials such as (polyethylene terephthalate) and PVC can be applied, and paper and the like can also be used. The shape is arbitrary, and it can be formed to any other size including credit card size. Furthermore, it is also possible to print patterns, characters, etc. on the surface. When laminating, the front face material Srf1 and the back face material Srf2 may be thermally welded and laminated without using a pressure-sensitive adhesive, or they may be integrated by molding.

FIG. 2 is a front view of the pattern layer Ptn formed on one side (front side) of the substrate Sbt of the non-contact type information transfer device TF shown in FIG. Pattern layer Ptn
Is an antenna that forms a spiral from the inner end Aie to the outer end Aоe as a loop antenna, which is provided by etching a conductive material deposited on one surface of the substrate Sbt, printing or coating or embossing the conductive material. The pattern Apn and the land Lnd3 connected to the outer end Aоe
And the inner area Ir where the antenna pattern Apn is stretched.
a, the inner end Aie and the first electrode plate pattern P
a first connection pattern p1 that connects lt1 to the land Lnd2 for conduction, a lower second connection pattern p2 in the inner region Ira and independent of other patterns, and a continuous connection to the lower second connection pattern p2; Provided land Lnd1. In addition, other than this, a ground terminal pattern or the like may be provided. The lands Lnd1 and Lnd2 are connected to a semiconductor integrated circuit element mounted later. The first electrode plate pattern Plt1 is for forming a capacitance (capacitor), and is formed in a substantially rectangular shape having a predetermined area as one flat electrode plate of the capacitor. Thus, the pattern layers Ptn are all on one side (front side) of the substrate Sbt.
It is formed on the upper surface and there is no need to form a pattern on the other surface (the back surface).

When the antenna pattern Apn is formed by etching a metal conductive material such as a copper layer or by embossing a metal foil, there are advantages in that the resistance value is low and the inductance L can be increased by forming a narrow pattern width. is there. Further, it is easy to manufacture an antenna having various shapes with high accuracy. On the other hand, when the antenna pattern Apn is formed by printing or applying a conductive ink, a conductive paste, or a conductive paint, simple equipment can be applied as compared with the above-described etching and the like, and post-processing can be simplified. It can be manufactured at low cost and the manufacturing time can be reduced. In addition, there is no need for a post-process such as a waste liquid treatment such as an etching process, so that safety at the manufacturing site is ensured and no environmental problem occurs.

FIG. 3 shows the pattern layer Ptn shown in FIG.
Non-conductive layer Ins formed on substrate Sbt on which is formed
FIG. The non-conductive layer Ins is formed of a non-conductive resist or a non-conductive ink having a predetermined dielectric constant (for example, 3.5) and a first electrode plate pattern Plt1 with a predetermined thickness (for example, 12 μm thickness) by silk screen printing or the like. ,
And at least a portion where the antenna pattern Apn crosses between the lower second connection pattern p2 and the outer end Aоe,
An opening Holl1 is formed above a land Lnd3 connected to the outer end Aоe, and an opening Hol2 is formed above a lower second connection pattern p2.
That is, an opening Hol1 is formed in a portion of the pattern layer Ptn facing the land Lnd3, and an opening Hol2 is formed in a portion of the pattern layer Ptn facing the lower second connection pattern p2. This insulates the first electrode plate pattern Plt1 and the portion of the antenna pattern Apn crossing between the lower second connection pattern p2 and the outer end Aоe, and the land Ln connected to the outer end Aоe.
d3 and at least a lower second connection pattern p2
Is at least partially exposed. FIG. 4
FIG. 5 is a perspective view for illustrating a positional relationship between a position, a shape and a dimension of a non-conductive layer Ins, and a pattern layer Ptn. Alternatively, a cutout for exposing at least a part of the land Lnd3 and at least a part of the lower second connection pattern p2 may be provided instead of the opening Hol1 and the opening Hol2.

In place of the formation of the non-conductive layer Ins by the coating of the non-conductive resist or the non-conductive ink, the non-conductive layer Ins can be formed by sticking a non-conductive film. Such a configuration made of a non-conductive film is effective when a desired insulation property, a desired thickness, and a desired dielectric constant cannot be adjusted by a non-conductive resist or a non-conductive ink. When the conductive resist or the coating of the non-conductive ink is incompatible, it can be replaced by, for example, a non-conductive heat-resistant film of polyimide or the like. Moreover, there is an advantage that the manufacturing process can be constructed by a dry process.

Next, the pattern layer Ptn shown in FIG.
Then, a conductive layer Cdp is formed over the non-conductive layer Ins shown in FIG. FIG. 5 shows the conductive layer Cdp
FIG. 4 is a front view of an antenna and a circuit board with capacitance WB on which antennas are formed. The conductive layer Cdp is formed on the non-conductive layer Ins and the pattern layer Ptn in a predetermined thickness and shape by applying or printing a conductive paste or conductive ink adjusted to a predetermined conductivity. In the present embodiment, a silver paste is used as the conductive paste, and 20 μm is used for screen printing or the like.
It is applied with a thickness of about m. The conductive paste contains various resins and solvents such as phenol-based, epoxy-based, and urethane-based resins for maintaining adhesion between metal particles such as silver, copper, and aluminum and the base film. The conductive layer Cdp is
A second rectangular plate pattern Plt2 laminated on the non-conductive layer Ins covering the first polar plate pattern Plt1 and having an overlapping portion with the first polar plate pattern Plt1, and connected to the second polar plate pattern Plt2; Antenna pattern Apn
Upper second connection pattern p3 which is formed on the non-conductive layer Ins and covers the exposed portion of the land Lnd3.
And an upper second connection pattern p4, which is also connected to the second electrode plate pattern Plt2, is extended to the lower second connection pattern p2, and overlaps the exposed portion of the lower second connection pattern p2. It is composed. That is, the second electrode plate pattern Plt2 and the upper second connection patterns p3 and p4 are formed by the printing layer of the conductive paste.

Next, the electrical connection between the pattern layer Ptn and the conductive layer Cdp will be described with reference to FIG. FIG. 8 is a schematic diagram showing a bonding state between the conductive layer and the pattern layer. When the conductive paste or the conductive ink is applied or printed in the shape as described above, a part of the lower land Lnd3 is exposed from the opening Hol1 of the nonconductive layer Ins (see FIG. 4).
From the opening Hol2, the lower second connection pattern p2 in the lower layer
Is exposed (see FIG. 4), when the conductive paste or conductive ink is filled into the opening Holl1, a filling portion Fil1 is formed, and the land Lnd3 exposed at the bottom of the opening Holl1 is formed. Thus, the upper second connection pattern p3 is electrically connected to the land Lnd3. On the other hand, when the conductive paste is filled into the opening Hol2 of the non-conductive layer Ins in the lower layer, the upper second connection pattern p4 forms the filling portion Fil2, thereby forming the lower portion exposed at the bottom of the opening Hol2. Side second connection pattern p2,
Thereby, the upper second connection pattern p4 is electrically connected to the lower second connection pattern p2.

In the above, the electrical connection is made by the filling portion using the fluidity and adhesiveness at the time of application of the conductive paste or conductive ink. However, the present invention is not limited to this. It is also possible to make electrical connection by crimping, which always applies a pressing force in a dry state, or to make electrical connection by joining by ultrasonic welding. FIG.
FIG. 3 is a schematic view showing a bonding state of a conductive layer and a pattern layer by ultrasonic welding. Ultrasonic welding is 40kHz to 60k
A joint portion Crp is formed by applying a vibration having a vibration speed of 0.2 to 2 m / sec at about Hz to the joint surface. During welding, a static pressure F is applied to the joint surface. In order to improve the processing accuracy, it is preferable to use a high frequency ultrasonic wave such as 120 kHz. Thus, the joint Cr
When p formation (clipping) is performed, a stable electrical connection is maintained without the subsequent application of a pressing force.

On the other hand, the second electrode plate pattern Plt2 is formed to face the first electrode plate pattern Plt1 with the non-conductive layer Ins interposed therebetween. Thereby, the first electrode plate pattern Plt
A capacitor C having a capacitance based on the area of the overlapping portion of the first and second electrode plate patterns Plt2, the dielectric constant of the non-conductive layer Ins, and the thickness of the non-conductive layer Ins is formed. The antenna and the circuit board with capacitance WB shown in FIG. 5 connect the antenna pattern Apn having inductance and the capacitor C having capacitance in parallel as described above. Moreover, it is not necessary to use both sides of the substrate Sbt, and it can be constituted by only one side. Therefore, the through-hole punching step and the through-hole plating step, which are conventionally required, can be omitted, and the manufacturing time can be shortened and the cost can be reduced.

Further, as described above, the antenna pattern Ap
By connecting n and the capacitor C in parallel, a current-driven tuning circuit is formed so as to perform voltage resonance (so-called parallel resonance) in which the impedance is minimized and the voltage is maximized at the time of tuning, and the resonance frequency ω is It is the reciprocal of the root of the product of the inductance L and the capacitance C. Therefore,
The inductance L is adjusted by changing the number of turns and dimensions of the antenna pattern Apn, and the first electrode plate pattern Plt1 is adjusted.
A desired resonance frequency ω is realized by changing the area of the region where the second electrode plate pattern Plt2 overlaps with the second electrode plate pattern Plt2 and changing the material (dielectric constant) and thickness of the non-conductive layer Ins to adjust the capacitance C. can do. Next, the method of determining the specifications will be described. The tuning capacitance required for impedance matching is determined based on the resonance frequency ω and the inductance L of the antenna pattern Apn, and the capacitance C is determined in consideration of the substrate stray capacity and the like. Based on
Further, the area of the second electrode plate pattern and the overlapping portion thereof, the permittivity and the thickness of the non-conductive layer Ins, and the like are determined. In this configuration, about 90 pF is obtained as the capacitor capacity.

As described above, according to the antenna and the circuit board with capacitance WB according to the present embodiment, the use efficiency of the substrate Sbt is improved and the thickness of the circuit substrate can be reduced by forming the substrate Sbt on one side. become. Further, by processing only one side, the through-hole drilling step and the through-hole plating step, which are required in the conventional double-sided configuration, can be omitted, and the process can be automated. Further, manufacturing time can be reduced by reducing the number of steps. Further, the production yield is improved and the production cost can be reduced. In addition, by forming the antenna pattern by printing the conductive paste, the etching process can be omitted, and the antenna pattern can be manufactured at lower cost and in a shorter time. Moreover, the yield can be improved by omitting a post-process such as waste liquid treatment. In addition, by forming the antenna pattern with a metal foil and forming the capacitor using a conductive paste, excellent communication characteristics can be maintained, and a low-cost antenna and a substrate WB with a capacitor can be manufactured.

Next, a semiconductor integrated circuit device IC is mounted and connected using an antenna and a substrate WB with a capacitance to form a non-contact information transfer device TF. FIG. 6 is a front view of a main part of the non-contact information transfer device TF shown in FIG. An anisotropic conductive film (both not shown) is additionally provided on the terminal of the semiconductor integrated circuit element IC, and this is connected to the antenna pattern Apn.
By bonding the semiconductor integrated circuit element IC and the antenna pattern Apn to each other and conducting flip-chip mounting, it is possible to easily conduct the semiconductor integrated circuit element IC to the antenna pattern Apn. Semiconductor integrated circuit device IC
Has a thickness of about 200 μm as an active circuit capable of receiving or transmitting information in a non-contact manner, and by flip-chip mounting with an anisotropic conductive film, both terminals of the semiconductor integrated circuit element IC and the lands Lnd1 and Land Lnd
2 are electrically connected to each other. By applying the anisotropic conductive film, the manufacturing process can be automated.

Next, a method of manufacturing the circuit board WB with antenna and the non-contact type information exchange device TF according to the present invention will be described. FIG. 7 is a manufacturing process diagram of the non-contact information transfer device TF shown in FIG. As shown in FIG. 7, in the method for manufacturing the non-contact type information transfer device TF according to the present embodiment, as a first step, a film-like substrate Sbt on which copper foil is vapor-deposited on one side is transferred, and the pattern layer is etched. P
Create tn (step PR1).

Next, a non-conductive resist is applied on the pattern layer Ptn by roller coating to form a non-conductive layer Ins.
Is formed (Step PR2), and then a conductive paste is printed by screen printing to form a conductive layer Cdp (Step PR3), and is sent to a curing furnace in Step PR4 for curing. The antenna and the circuit board with capacitance WB are manufactured as described above.

Then, the semiconductor integrated circuit device IC having the anisotropic conductive film attached thereto is mounted and connected to the antenna and the circuit board with capacitance WB by an IC chip mounting machine (step P).
R5). Next, the reinforcing plate Spc is mounted on the front surface of the antenna and the circuit board with capacitance WB (step PR6) and laminated. Thereafter, the process proceeds to a coating process.

As for the coating, the adhesive sheet Adh1 and the surface material Srf1 were both prepared as roll-wound films for covering the front side, and the adhesive sheet A
Both dh2 and the surface material Srf2 are prepared as roll-wound films. These films are supplied by a supply machine (not shown), and are simultaneously laminated and attached to the front and back surfaces by an attaching machine (steps PR7A and PR7B).
Thus, the non-contact type information exchange device T shown in FIG.
F is manufactured. Alternatively, the adhesive sheets Adh1 and Adh2
Alternatively, a step of applying an adhesive on the surfaces of the surface materials Srf1 and Srf2 can be adopted. Alternatively, it is also possible to adopt a process in which an adhesive is applied to both surfaces of the antenna and the circuit board with capacitance WB, and the surface materials Srf1 and Srf2 are attached.

As described above, according to the manufacturing method of the present invention, the conventional through-hole drilling step and through-hole plating step can be omitted, and the cost can be reduced and the manufacturing time can be significantly reduced. In addition, since the antenna pattern is made of metal and only the capacitor portion is formed of conductive paste, the communication substrate has excellent communication characteristics, low cost and stable characteristics for the RFID substrate,
In addition, the non-contact information transfer device TF for RFID can be mass-produced.

In the manufacturing method of the above embodiment, etching is employed as a step of laying the conductive layer constituting the pattern layer Ptn. However, this step is replaced with a step of applying a conductive ink or a method of stamping with a conductive foil. It is also possible.

Further, in the manufacturing method of the above embodiment,
It is also possible to use a method in which the formation of the non-conductive layer In is replaced by attaching a non-conductive film. FIG. 10 is a manufacturing process diagram of the non-contact information transfer device TF in which the non-conductive layer Ins is formed of such a non-conductive film. In the manufacturing method, as a first step, a film-like substrate Sb on which copper foil is deposited on one side
t is transferred and a pattern layer Ptn is formed by etching (step PR11A), and at the same time, a non-conductive film prepared separately is perforated (step PR11B).

Next, the perforated non-conductive film is transferred and adhered on the pattern layer Ptn (step PR12).
Next, a conductive paste is printed by screen printing on the non-conductive film and the pattern layer Ptn that are stuck to form a conductive layer Cdp (step PR13), thereby manufacturing an antenna and a circuit board WB with a capacitor. The subsequent steps PR14 to PR16A and PR16B are substantially the same as the above steps PR5 to PR7A and PR7B. This manufacturing method can further reduce the manufacturing time.

FIG. 11 shows a non-conductive layer I made of a non-conductive film.
It is another manufacturing process figure of the non-contact type information transfer apparatus TF which forms n. In this manufacturing method, as a first step, a film-shaped substrate Sbt on which copper foil is vapor-deposited on one side is transferred and etched to form a pattern layer Ptn (step PR2).
At the same time as 1A), a hole is formed in a separately prepared non-conductive film (step PR21B).

Next, a conductive paste is printed on the perforated non-conductive film by screen printing to form a conductive layer Cd.
p is formed (step PR22), and then transferred.
Affixed on the pattern layer Ptn of the film substrate Sbt,
By clipping by ultrasonic welding (process P
R23), and a circuit board WB with an antenna and a capacitor is manufactured. Subsequent steps PR24 to PR26A and PR2
Step 6B is substantially the same as steps PR5 to PR7A and PR7B described above. According to this manufacturing method, the printed conductive layer C
Since the drying of dp can be performed during the transfer period, the manufacturing time can be reduced. Also, good connection is made by welding.

FIG. 12 is a front view of a main part of a non-contact type information exchange device having another configuration. In this configuration, the non-conductive layer Ins is formed on the substrate Sbt on which the pattern layer Ptn is formed, and the semiconductor integrated circuit element IC is mounted and connected. The non-conductive layer Ins is formed by applying a non-conductive resist or by attaching a non-conductive film. On the other hand, FIG. 13 is a front view showing the inverted conductive layer formed on the reinforcing plate surface of the non-contact type information exchange device of FIG. As shown, the substrate Sb of the reinforcing plate Spc
The conductive layer Cdp ′ is printed in a reverse pattern on the surface facing t. Therefore, when the surface of the reinforcing plate Spc is laminated in contact with the surface of the substrate Sbt, the conductive layer Cdp ′ having the inverted pattern is covered with the non-conductive layer Ins, so that the conductive layer Cdp similar to that shown in FIG. Non-conductive layer In
s. In short, in the configuration of the present embodiment, instead of forming the conductive layer Cdp on the non-conductive layer Ins by printing, the conductive layer C
dp '. Thus, the substrate Sbt
After the reinforcing plate Spc is laminated on the conductive layer Cdp ′, the conductive layer Cdp ′ and the pattern layer Ptn on the substrate Sbt are joined by, for example, ultrasonic welding, and thus the non-contact type information exchange device similar to that shown in FIG. The main part of the TF is formed.

FIG. 14 is a manufacturing process diagram of the non-contact type information transfer device shown in FIGS. As shown in FIG. 14, in the method of manufacturing the non-contact type information exchange device TF according to the present embodiment, as a first step, a film-like substrate Sbt on which copper foil is vapor-deposited on one side is transferred, and the pattern layer is etched. Ptn is created (step PR31).
Next, on the pattern layer Ptn, a non-conductive resist is applied by roller coating to form a non-conductive layer Ins (step PR32), and then, using an IC chip mounting machine, a semiconductor integrated device having an anisotropic conductive film attached thereto. The circuit element IC is mounted and connected to the film substrate Sbt (step PR33).
A). On the other hand, a conductive paste is printed on the separately prepared reinforcing plate Spc by screen printing to form a conductive layer Cdp ′ in an inverted pattern (step PR33B).

Next, the reinforcing plate Spc is transferred, and the film-like substrate Sbt on which the semiconductor integrated circuit element IC is mounted is mounted.
(Step PR34), and the pattern layer Ptn and the conductive layer Cdp 'of the film-like substrate Sbt are formed by ultrasonic welding.
Are clipped and laminated (step PR35).
Thereafter, the process proceeds to a coating process. Step PR36A and PR3
6B is substantially the same as the above-described steps PR7A and PR7B. Thus, the non-contact type information transfer device TF shown in FIG. 1 is manufactured.

Each of the above-described embodiments has a configuration in which an antenna pattern Apn having an inductance and a capacitor C having a capacitance are connected in parallel. As a current-driven tuning circuit, the impedance becomes minimum during tuning and the voltage is reduced. Maximal voltage resonance (so-called parallel resonance)
The resonance frequency ω is the reciprocal of the root of the product of the inductance L and the capacitance C. On the other hand, the present invention is not limited to the above configuration, and can be configured as a voltage-driven tuning circuit in which an antenna pattern Apn having an inductance and a capacitor C having a capacitance are connected in series. This is a current resonance (so-called series resonance) in which the impedance is minimized and the current is maximized during tuning.
The resonance frequency ω is the reciprocal of the root of the product of the inductance L and the capacitance C, as in the voltage resonance described above.

In the latter series connection, the inner end Aie (or the outer end Aоe) of the antenna pattern Apn is connected to the first electrode plate pattern Plt1 as the pattern layer Ptn, and the conductive layer Cdp is connected to the antenna pattern Apn. A pattern for connecting the outer end Aоe (or the inner end Aie) to one terminal of the integrated circuit element IC;
The second electrode plate pattern Plt2 and a pattern connecting the second electrode plate pattern Plt2 and the other terminal of the integrated circuit element IC are formed. In this case, the inductance L is adjusted by changing the number of turns and dimensions of the antenna pattern Apn, and the area of the region where the first electrode plate pattern Plt1 and the second electrode plate pattern Plt2 overlap and the material of the non-conductive layer Ins (dielectric A desired resonance frequency can be realized by designing the capacitance C by adjusting the ratio) and the thickness.

Next, FIG. 15 is a front view of a pattern layer according to another embodiment of the non-contact type information exchange device according to the present invention, in which the main pattern is disposed outside the antenna pattern. FIG. 16 is a front view of a non-conductive layer formed on the pattern layer shown in FIG. FIG. 17 is a front view showing a main part of another embodiment of the non-contact type information exchange device according to the present invention, which has the pattern layer and the non-conductive layer shown in FIGS.

The pattern layer Ptn2 shown in FIG.
An antenna pattern Apn that forms a spiral from the inner end Aie to the outer end Aоe as a loop antenna, provided by etching a conductive material deposited on one side of the substrate, printing or applying or embossing the conductive material; ,
A land Lnd23 connected to the inner end Aie, and an outer end Aоe, the first pole plate pattern Plt21 and the land Lnd22, both of which are disposed in the outer region Ora of the antenna pattern Apn, are electrically connected. 1 connection pattern p21, a lower second connection pattern p22 in the outer area Ora and independent of other patterns, and a lower second connection pattern p22.
A land Lnd21 connected to the connection pattern p22 is provided. The lands Lnd21 and Lnd22 are connected to a semiconductor integrated circuit element mounted later. The first electrode plate pattern Plt21 is for forming a capacitance (capacitor), and is formed in a substantially rectangular shape having a predetermined area as one flat electrode plate of the capacitor. As described above, the pattern layer Ptn2 is entirely formed on one surface of the substrate, so that it is not necessary to form a pattern on the other surface.

The antenna pattern Apn is formed by etching a metal-based conductive material such as a copper layer or embossing a metal foil, or by forming a conductive ink, a conductive paste or a conductive paint, as in the above-described embodiment. It is formed by printing or coating. The advantages in each case refer to the description in the above embodiment.

FIG. 16 shows the pattern layer P shown in FIG.
Non-conductive layer Ins formed on substrate on which tn2 is formed
2 is a front view of FIG. It should be noted that the position, the shape and the size of the non-conductive layer Ins2, and the positional relationship with the pattern layer Ptn2 are shown in a perspective view. The non-conductive layer Ins2 is made of a non-conductive resist or a non-conductive ink having a predetermined dielectric constant (for example, 3.5) and a first electrode plate pattern Plt21 with a predetermined thickness (for example, 12 μm thickness) by silk screen printing or the like.
And the antenna pattern Apn covers at least a portion crossing between the lower second connection pattern p22 and the inner end Aie, and the first connection pattern p21 is between the lower second connection pattern p22 and the first electrode plate pattern Plt21. Are formed so as to cover a portion that traverses the lower second connection pattern p22 and at least a part of the land Lnd23 is exposed. Thereby, the entire surface of the first electrode plate pattern Plt21 and the portion of the antenna pattern Apn crossing between the lower second connection pattern p22 and the land Lnd23 are insulated, and the lower second
The portion of the first connection pattern p21 that crosses between the connection pattern p22 and the first electrode plate pattern Plt21 is insulated,
Further, at least a portion of the land Lnd23 connected to the inner end portion Aie and at least a portion of the lower second connection pattern p22 are exposed.

Further, instead of the formation of the non-conductive layer Ins2 by the coating of the non-conductive resist or the non-conductive ink described above,
It is also possible to form the non-conductive layer Ins2 by sticking a non-conductive film. Such a configuration made of a non-conductive film is effective when a desired insulation property, a desired thickness, and a desired dielectric constant cannot be adjusted by a non-conductive resist or a non-conductive ink. When the conductive resist or the coating of the non-conductive ink is incompatible, it can be replaced by, for example, a non-conductive heat-resistant film of polyimide or the like.

Next, the pattern layer Pt shown in FIG.
By forming the conductive layer Cdp2 over the n2 and the non-conductive layer Ins2 shown in FIG. 16, a circuit board with an antenna and a capacitor is completed. FIG. 17 is a front view of the non-contact type information transfer device TF2 in which the semiconductor integrated circuit element IC is mounted on the antenna and the circuit board with capacitance on which the conductive layer Cdp2 is formed as described above. The conductive layer Cdp2 is formed on the non-conductive layer Ins2 and the pattern layer Ptn2 in a predetermined thickness and shape by applying or printing a conductive paste or conductive ink adjusted to a predetermined conductivity. For the preparation and characteristics of the conductive paste and the conductive ink, the description in the above embodiment is cited. The conductive layer Cdp2 is laminated on the non-conductive layer Ins2 that covers the first electrode plate pattern Plt21, and has a rectangular second electrode plate pattern Plt22 having an overlapping portion with the first electrode plate pattern Plt21, and the second electrode plate pattern Plt22. Plt22 and the first connection pattern p21
Lower second connection pattern p2 on the non-conductive layer Ins2 covering
2 and overlaps with the exposed portion of the lower second connection pattern p22 and overlaps with the exposed portion of the land Lnd23, and is formed on the non-conductive layer Ins2 that covers the antenna pattern Apn. It is configured to have two connection patterns p23. That is, the second electrode plate pattern Plt
22 and the upper second connection pattern p23 are formed by a printed layer of a conductive paste.

The electrical connection between the land Lnd23 and the upper second connection pattern p23, and the lower second connection pattern p23
22 and the upper second connection pattern p23
Conductive bonding or crimping, as shown in the previous embodiment,
Alternatively, they are joined by ultrasonic welding. For the details of the description, the description in the above-described embodiment is cited.

On the other hand, the second electrode plate pattern Plt22 is formed to face the first electrode plate pattern Plt21 with the non-conductive layer Ins2 interposed therebetween. Thereby, the area of the overlapping portion of the first electrode plate pattern Plt21 and the second electrode plate pattern Plt22, the dielectric constant of the non-conductive layer Ins2, and the non-conductive layer Ins
A capacitor C having a capacity based on the thickness of 2 is formed. The capacitor C is connected in parallel to the antenna pattern Apn having inductance by the above-described pattern and conductive layer. As described above, even when the capacitor C is provided in the outer region Ora of the antenna pattern Apn, it is not necessary to use both surfaces of the substrate, and it is possible to form the capacitor C on only one surface. Therefore, the through-hole punching step and the through-hole plating step, which are conventionally required, can be omitted, and the manufacturing time can be shortened and the cost can be reduced.

FIG. 17 is a front view of a main part of a non-contact type information transfer device TF2 in which a semiconductor integrated circuit element IC is mounted and connected using the above-mentioned antenna and a circuit board with a capacitor.
An anisotropic conductive film (not shown) is additionally provided on the connection terminals of the semiconductor integrated circuit element IC, and the anisotropic conductive film is adhered to the lands Lnd21 and Lnd22 and flip-chip mounted, so that the semiconductor integrated circuit element IC and the antenna are mounted. The pattern Apn is made conductive. The semiconductor integrated circuit device IC functions as an active circuit capable of receiving or transmitting information without contact. By using an anisotropic conductive film in this manner, the manufacturing process can be automated. The other advantages are substantially the same as the advantages described in the above embodiment, and thus the description given above is used.

In each of the embodiments described above, the antenna and the circuit board with the capacitor are manufactured from the board, and thus the antenna and the capacitor are formed on the board. However, the present invention is not limited to this. Instead, a circuit board in which an antenna is formed on a board can be used. Similarly, a circuit board in which a capacitor is formed on a board can be used. In each case, as in the above embodiments,
By forming a pattern using only one side of the substrate, laying a non-conductive layer on the pattern, and further laying a conductive layer on the non-conductive layer and the pattern, easy and low cost without adopting a through hole configuration In addition, a circuit board with an antenna or a circuit board with a capacitor can be supplied in a short manufacturing time. Note that the configurations and manufacturing steps of these circuit boards are substantially the same as those in the above-described embodiments, and thus the details described above are referred to.

As shown in the above embodiments,
According to the present invention, the following advantages can be realized. 1. By using a single-sided substrate, the utilization efficiency of the substrate is improved. Also, the device can be made thinner. 2. By forming a pattern and a circuit only on one side of the substrate, a through-hole drilling step and a through-hole plating step for using both sides can be omitted, and the processing is easy and the process can be automated. 3. Further, manufacturing time can be reduced by reducing the number of steps. 4. Further, the production yield is improved and the production cost can be reduced. 5. By forming a non-conductive layer using a non-conductive film, a non-conductive material that cannot be adjusted as a resist that can be applied or silk-screen printed can be applied in a film form. As a result, a desired dielectric constant and thickness can be selected, and devices having various capacitances and various circuit characteristics can be manufactured. 6. In addition, by forming the antenna pattern with a metal foil and forming the capacitance using a conductive paste, excellent communication characteristics can be maintained and low cost can be realized. 7. By forming the antenna pattern by printing the conductive paste, the etching process can be omitted and the antenna pattern can be manufactured at lower cost and in a shorter time. In addition, there is no need for a post-process such as waste liquid treatment, so that safety at the manufacturing site is ensured and no environmental problem occurs.

[0087]

As described in detail above, claim 1 of the present invention
The circuit board with antenna according to the above, by covering the lower pattern layer on one side of the substrate with a non-conductive layer, insulates the upper conductive layer formed on the non-conductive layer and the corresponding portion of the pattern layer on one side of the substrate it can. Therefore, the conductive layer formed on the non-conductive layer can easily draw the outer end of the antenna pattern into the inner region using only one surface of the substrate. As a result, it is not necessary to use both sides of the substrate, and a conventionally used connection part between both sides of the substrate is omitted, and a thinned circuit board with an antenna is realized in which the utilization efficiency of the substrate using only one side of the substrate is high.

The circuit board with antenna according to claim 2 of the present invention is characterized in that the lower pattern layer is covered with a non-conductive layer on one side of the substrate, so that the upper conductive layer and the pattern layer formed on the non-conductive layer are covered. The corresponding part can be insulated on one side of the substrate.
Therefore, the conductive layer formed on the non-conductive layer can easily be pulled out to the outer region of the inner end of the antenna pattern using only one surface of the substrate. This eliminates the need for the use of both sides of the board, and eliminates the connection between the two sides of the board, which has been done in the past.
A thinner circuit board with antenna is realized.

According to a third aspect of the present invention, there is provided a method of manufacturing a circuit board with an antenna, wherein a lower pattern layer is covered by a non-conductive layer on one surface of the substrate, and then the upper conductive layer and the pattern formed on the non-conductive layer are patterned. Insulate the relevant part of the layer on one side of the substrate. Therefore, when the conductive layer is formed on the non-conductive layer, the drawing process into the inner region of the outer end of the antenna pattern can be easily performed using only one surface of the substrate, thereby eliminating the need for using both surfaces of the substrate. This eliminates the connection process between both sides of the substrate, and enables the manufacture of a thinner circuit board with an antenna, in which the efficiency of use of the substrate using only one side of the substrate is high.

A method of manufacturing a circuit board with an antenna according to a fourth aspect of the present invention is directed to a method of manufacturing a circuit board with an antenna, comprising: covering a lower pattern layer on one surface of the substrate with a non-conductive layer; Insulate the relevant part of the layer on one side of the substrate. Therefore, when the conductive layer is formed on the non-conductive layer, the drawing process to the outside area of the inner end portion of the antenna pattern can be easily performed using only one side of the substrate, which eliminates the use of both sides of the substrate. This eliminates the connection process between both sides of the substrate, and enables the manufacture of a thinner circuit board with an antenna, in which the efficiency of use of the substrate using only one side of the substrate is high.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a circuit board with an antenna according to the third or fourth aspect, wherein the non-conductive layer is coated or printed using a fluid non-conductive material. Thus, a coating film of a desired shape can be easily formed on one side of the substrate, and a coating film of a desired shape can be easily formed. Therefore, the corresponding portion of the lower pattern layer and the corresponding portion of the upper conductive layer are formed on the substrate. It can be easily insulated on one side.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a circuit board with an antenna according to the third or fourth aspect, wherein the non-conductive layer is formed by sandwiching a film-shaped non-conductive material. Accordingly, an insulating film having a uniform thickness can be easily formed on one surface of the substrate, and a non-conductive material which is difficult to process in a fluid state can be applied in a film form. Thus, the corresponding portion of the lower pattern layer and the corresponding portion of the upper conductive layer can be easily insulated on one surface of the substrate.

According to a seventh aspect of the present invention, there is provided a method of manufacturing a circuit board with an antenna according to the third or fourth aspect, wherein the antenna pattern is formed by coating or printing using a fluid conductive material. Therefore, even a conductive material that is difficult to deposit or foil can be applied by coating or printing. Also, the process can be simplified compared to evaporation and etching.
Processing time can be reduced. In addition, there is no need for a post-process such as waste liquid treatment, so that safety at the manufacturing site can be ensured and the environmental load can be reduced.

In the circuit board with a capacitance according to claim 8 of the present invention, the lower pattern layer is covered with a non-conductive layer on one side of the substrate, and the upper conductive layer formed on the non-conductive layer and a corresponding portion of the pattern layer are formed. Are insulated on one side of the substrate. Therefore, the capacitor dielectric by the non-conductive layer can be easily formed, and the second electrode plate pattern by the conductive layer formed on the non-conductive layer and the pattern layer on one side of the substrate can be easily connected using only one side of the substrate. . As a result, it is possible to omit the conventional use of both sides of the substrate and the connection portion between both sides of the substrate.

According to the method of manufacturing a circuit board with a capacitance according to claim 9 of the present invention, the lower conductive layer is formed on the non-conductive layer by covering the lower pattern layer on one surface of the substrate with the non-conductive layer. The corresponding portion of the pattern layer can be insulated on one side of the substrate. Therefore, the formation of the capacitor dielectric by the non-conductive layer and the connection between the second electrode plate pattern by the conductive layer formed on the non-conductive layer and the pattern layer on one side of the substrate can be easily processed using only one side of the substrate. As a result, it is possible to omit the conventional use of both sides of the substrate and the connection portion between both sides of the substrate.

According to a tenth aspect of the present invention, there is provided a method of manufacturing a circuit board with a capacitor according to the ninth aspect, wherein the non-conductive layer is formed by coating or printing using a fluid non-conductive material. A coating film of a non-conductive material can be easily formed on one side, and a coating film of a desired shape can be easily formed, whereby a corresponding portion of the lower pattern layer and a corresponding portion of the upper conductive layer are formed on the substrate. It can be easily insulated on one side.
Further, the capacitor dielectric can be formed very easily.

According to a method of manufacturing a circuit board with a capacitance according to claim 11 of the present invention, since the non-conductive layer is formed by sandwiching a film-shaped non-conductive material according to the ninth aspect, the non-conductive layer is uniformly formed on one surface of the substrate. A thick insulating film can be easily formed, and a non-conductive material which is difficult to process into a fluid state can be applied as a film. As a result, the corresponding portion of the lower pattern layer and the corresponding portion of the upper conductive layer can be easily insulated on one surface of the substrate, and a uniform-thickness capacitor dielectric can be formed very easily with a uniform-thickness insulating film. Can be. Further, a desired dielectric constant and thickness can be selected, and a circuit board with a capacitor having a capacitor of a desired capacity can be manufactured.

According to a twelfth aspect of the present invention, there is provided a method of manufacturing a circuit board with a capacitor, wherein the pattern layer is formed by coating or printing using a fluid conductive material. It can be applied by coating or printing even if the conductive material is difficult. In addition, the process can be simplified and the processing time can be shortened as compared with vapor deposition and etching. In addition, there is no need for a post-process such as waste liquid treatment, so that safety at the manufacturing site can be ensured and the environmental load can be reduced.

According to a thirteenth aspect of the present invention, in the antenna and the circuit board with the capacitor, the lower pattern layer is covered with a non-conductive layer on one surface of the substrate, and the upper conductive layer and the pattern layer formed on the non-conductive layer are formed on the non-conductive layer. Insulate the relevant part on one side of the board,
The outer end of the antenna pattern formed by the conductive layer formed on the non-conductive layer is drawn into the inner region, a capacitor dielectric is formed by the non-conductive layer, and the second electrode pattern formed by the conductive layer formed on the non-conductive layer is formed on the substrate Connect to the pattern layer on one side. This eliminates the use of both sides of the substrate and the connection between the two sides as in the conventional configuration, and realizes a thinner antenna and a circuit board with a capacitor with high utilization efficiency of the substrate using only one side of the substrate.

According to a fourteenth aspect of the present invention, there is provided an antenna and a circuit board with a capacitor, wherein a lower pattern layer is covered with a non-conductive layer on one surface of the substrate, and the upper conductive layer and the pattern layer formed on the non-conductive layer are separated from each other. Insulate the relevant part on one side of the board,
The inner end of the antenna pattern formed by the conductive layer formed on the non-conductive layer is drawn out to the outer region, a capacitor dielectric is formed by the non-conductive layer, and the second electrode plate pattern formed by the conductive layer formed on the non-conductive layer is formed on the substrate. Connect to the pattern layer on one side. This eliminates the use of both sides of the substrate and the connection between the two sides as in the conventional configuration, and realizes a thinner antenna and a circuit board with a capacitor with high utilization efficiency of the substrate using only one side of the substrate.

According to a method of manufacturing an antenna and a circuit board with a capacitance according to claim 15 of the present invention, a pattern layer which is a lower layer on one surface of the substrate is covered with a non-conductive layer, and then an upper layer formed on the non-conductive layer is formed. The conductive layer and the corresponding portion of the pattern layer can be easily insulated on one surface of the substrate. Therefore, the antenna layer is drawn into the inner region of the outer end portion by forming the conductive layer on the non-conductive layer, the capacitor dielectric is formed by the non-conductive layer, and the second electrode plate is formed by the conductive layer formed on the non-conductive layer. The connection of the pattern with the pattern layer on one side of the substrate can be easily processed using only one side of the substrate, thereby eliminating the use of both sides of the substrate and the connection process between both sides of the substrate, which has been conventionally done. It is possible to manufacture a thin antenna and a circuit board with a capacitor, which have a high use efficiency of a board using only the antenna.

According to a method of manufacturing an antenna and a substrate with a capacitance according to a sixteenth aspect of the present invention, a pattern layer, which is a lower layer, is covered with a non-conductive layer on one surface of the substrate, and then a conductive layer of an upper layer formed on the non-conductive layer is formed. The layer and the corresponding part of the pattern layer can be easily insulated on one side of the substrate. Therefore, the antenna pattern is drawn out to the outside area by forming the conductive layer on the non-conductive layer, the capacitor dielectric is formed by the non-conductive layer, and the second electrode plate is formed by the conductive layer formed on the non-conductive layer. The connection of the pattern with the pattern layer on one side of the substrate can be easily processed using only one side of the substrate, thereby eliminating the use of both sides of the substrate and the connection process between both sides of the substrate, which has been conventionally done. It is possible to manufacture a thin antenna and a circuit board with a capacitor, which have a high use efficiency of a board using only the antenna.

A method for manufacturing an antenna and a circuit board with a capacitance according to claim 17 of the present invention is the method according to claim 15 or 16, wherein the non-conductive layer is coated or coated using a fluid non-conductive material. Since it is formed by printing, a coating film of a non-conductive material can be easily formed on one side of the substrate, a coating film of a desired shape can be easily formed, and a corresponding portion of the pattern layer as a lower layer and a conductive layer as an upper layer Can be easily insulated from one side of the substrate.

The method for manufacturing an antenna and a circuit board with a capacitor according to claim 18 of the present invention is the method according to claim 15 or 16, wherein the non-conductive layer is formed by sandwiching a film-shaped non-conductive material. Therefore, an insulating film having a uniform thickness can be easily formed on one surface of the substrate, and a non-conductive material which is difficult to process in a fluid state can be applied in a film form. As a result, the corresponding portion of the lower pattern layer and the corresponding portion of the upper conductive layer can be easily insulated on one surface of the substrate, and a uniform-thickness capacitor dielectric can be formed very easily with a uniform-thickness insulating film. Can be. In addition, a desired dielectric constant and thickness can be selected, and an antenna including a capacitor having a desired capacity and a circuit board with a capacity can be manufactured.

A method of manufacturing an antenna and a circuit board with a capacitor according to claim 19 of the present invention is the method according to claim 15 or 16, wherein the pattern layer is formed by coating or printing using a fluid conductive material. Since it is formed, even a conductive material which is difficult to deposit or foil can be applied by coating or printing. In addition, the process can be simplified and the processing time can be shortened as compared with vapor deposition and etching. In addition, there is no need for a post-process such as waste liquid treatment, so that safety at the manufacturing site can be ensured and the environmental load can be reduced.

The non-contact type information exchange device according to the twentieth aspect of the present invention is characterized in that the lower pattern layer is covered with the non-conductive layer on one surface of the substrate, so that the upper conductive layer formed on the non-conductive layer and the The corresponding layer is insulated from one side of the substrate, the outer end of the antenna pattern formed by the conductive layer is drawn into the inner area, and the capacitor dielectric is formed by the non-conductive layer, and the conductive layer is formed on the non-conductive layer. The second electrode plate pattern is connected to the pattern layer on one side of the substrate, and the active circuit is connected to the pattern layer, so that the use efficiency of the substrate using only one side of the substrate is high and the non-contact type information is thin. Implement a transfer device. Therefore, it is possible to omit the use of both sides of the substrate and the connection part between both sides of the substrate in the conventional configuration.

The non-contact type information exchange device according to claim 21 of the present invention is characterized in that a lower pattern layer is covered with a non-conductive layer on one surface of the substrate, so that the upper conductive layer and the upper conductive layer formed on the non-conductive layer are covered. Conductive layer formed on the non-conductive layer by insulating the corresponding part of the layer on one side of the substrate, drawing out the inner end of the antenna pattern formed of the conductive layer to the outer region, and forming the capacitor dielectric by the non-conductive layer The second electrode plate pattern is connected to the pattern layer on one side of the substrate, and the active circuit is connected to the pattern layer, so that the use efficiency of the substrate using only one side of the substrate is high and the non-contact type information is thin. Implement a transfer device. Therefore, it is possible to omit the use of both sides of the substrate and the connection part between both sides of the substrate in the conventional configuration.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of one embodiment of a non-contact type information exchange device according to the present invention.

FIG. 2 is a front view of a pattern layer formed on a substrate of the non-contact type information transfer device shown in FIG.

FIG. 3 is a front view of a non-conductive layer formed on a substrate of the non-contact type information exchange device shown in FIG.

FIG. 4 is a perspective view of a non-conductive layer shown in FIG.

FIG. 5 is a front view of an embodiment of an antenna and a circuit board with a capacitor according to the present invention.

FIG. 6 is a front view of a main part of the non-contact information transfer device shown in FIG. 1;

FIG. 7 is a manufacturing process diagram of the non-contact type information exchange device shown in FIG. 1;

FIG. 8 is a schematic diagram showing a bonding state between a conductive layer and a pattern layer.

FIG. 9 is a schematic view showing a bonding state of a conductive layer and a pattern layer by welding.

FIG. 10 is a manufacturing process diagram of a non-contact type information exchange device in which a non-conductive layer is formed with a non-conductive film.

FIG. 11 is another manufacturing process diagram of a non-contact type information exchange device in which a non-conductive layer is formed with a non-conductive film.

FIG. 12 is a front view of a main part of a non-contact information exchange device having another configuration.

13 is a front view showing an inverted conductive layer formed on the reinforcing plate surface of the non-contact type information exchange device of FIG.

FIG. 14 is a manufacturing process diagram of the non-contact type information exchange device shown in FIGS. 12 and 13;

FIG. 15 is a front view of a pattern layer according to another embodiment of the non-contact information exchange device according to the present invention, in which a main pattern is disposed outside an antenna pattern.

FIG. 16 is a front view of a non-conductive layer formed on the pattern layer shown in FIG.

FIG. 17 is a front view showing a main part of another embodiment of the non-contact type information exchange device according to the present invention, having the pattern layer and the non-conductive layer shown in FIGS. 15 and 16;

And FIG. 18 is a front-side pattern configuration diagram of a conventional non-contact type information exchange device using double-sided connection.

FIG. 19 is a backside pattern configuration diagram of a conventional non-contact type information exchange device using double-sided connection.

[Explanation of symbols]

TF: non-contact type information exchange device, Sbt: substrate, Pln: pattern layer, Apn: antenna pattern, Aie: inner end, Aоe: outer end, Ir
a... inside region, p1... first connection pattern, Plt1
... 1st electrode plate pattern, p2... Lower second connection pattern, Ins... Non-conductive layer, Hol1.
2 ... opening, Cdp ... conductive layer, Plt2 ... second electrode plate pattern, p3 ... upper second connection pattern, p4 ...
Upper second connection pattern, IC: integrated circuit element

 ──────────────────────────────────────────────────の Continued on front page (54) [Title of the Invention] Circuit board with antenna, method for manufacturing circuit board with antenna, circuit board with capacitor, method for manufacturing circuit board with capacitor, antenna, circuit board with capacitor, and antenna AND METHOD FOR PRODUCING CIRCUIT BOARD WITH CAPACITOR AND NON-CONTACT INFORMATION TRANSFER DEVICE

Claims (21)

[Claims] 1. A loop-shaped antenna pattern having an inner end and an outer end provided on one surface of a substrate by vapor deposition, etching, printing, coating, or embossing of a conductive material, and an inner area of the antenna pattern. A first connection pattern provided in conduction with the inner end portion; and a second connection pattern provided separately from the antenna pattern and the first connection pattern in a region inside the antenna pattern. A pattern layer having at least a non-conductive layer that covers the antenna pattern positioned across at least the outer end and the second connection pattern, and that exposes at least a portion of the outer end and the second connection pattern. At least a portion thereof is laminated on the non-conductive layer, and at least the exposed portions of the outer end portion and the second connection pattern are formed. A conductive layer overlapped with the portion and extended from the outer end to the second connection pattern, and the exposed portion of the conductive layer and the outer end is press-bonded or a conductive adhesive. The conductive layer and the exposed portion of the second connection pattern are electrically connected by at least one of adhesion and welding.
A circuit board with an antenna, wherein the circuit board is electrically connected by at least one of pressure bonding, bonding with a conductive adhesive, and welding. 2. A loop-shaped antenna pattern having an inner end and an outer end provided on one surface of a substrate by vapor deposition, etching, printing, coating or embossing of a conductive material, and an outer region of the antenna pattern. A second connection pattern provided in conduction with the outer end portion, and a first connection pattern provided separately from the antenna pattern and the second connection pattern in an outer region of the antenna pattern. A pattern layer having at least a non-conductive layer covering the antenna pattern positioned across the inner end and the first connection pattern, and exposing at least a part of the inner end and the first connection pattern. At least a portion is laminated on the non-conductive layer, and at least the exposed portions of the inner end portion and the first connection pattern are formed. A conductive layer overlapped with a portion and extended from the inner end to between the first connection patterns, and the exposed portion of the conductive layer and the inner end is press-bonded or a conductive adhesive. The conductive layer and the exposed portion of the first connection pattern are bonded by at least one of adhesion and welding by the conductive layer.
A circuit board with an antenna, wherein the circuit board is electrically connected by at least one of pressure bonding, bonding with a conductive adhesive, and welding. 3. A loop-shaped antenna pattern having an inner end and an outer end on one surface of a substrate; a first connection pattern electrically connected to the inner end in an inner area of the antenna pattern; A second connection pattern separated from the antenna pattern and the first connection pattern in an inner region of the pattern, a pattern layer having a pattern formed by vapor deposition, etching, printing, coating, or embossing of a conductive material;
And providing a non-conductive layer covering at least the antenna pattern positioned between the outer end and the second connection pattern, and exposing at least a portion of the outer end and the second connection pattern. A step of laminating a part of the conductive layer overlapping the at least the exposed part of the outer end part and at least the exposed part of the second connection pattern on the non-conductive layer; And a third process of extending between the second connection pattern and the second connection pattern; and bonding the conductive layer and the exposed portion of the outer end portion in a conductive manner by at least one of pressure bonding or adhesion or welding with a conductive adhesive. And the conductive layer and the second
And a fourth step of electrically connecting the exposed portion of the connection pattern. 4. A loop-shaped antenna pattern having an inner end and an outer end on one surface of a substrate; a second connection pattern electrically connected to the outer end in an outer region of the antenna pattern; A first connection pattern separated from the antenna pattern and the second connection pattern in an outer region of the pattern, a pattern layer having a conductive layer formed by vapor deposition or etching, printing, coating, or embossing of a conductive material;
And providing a non-conductive layer that covers at least the antenna pattern positioned between the inner end and the first connection pattern and that exposes at least a portion of the inner end and the first connection pattern. A step of laminating a portion of the conductive layer overlapping the at least the exposed portion of the inner end portion and at least the exposed portion of the first connection pattern on the non-conductive layer; And a third step of extending between the first connection pattern and the first connection pattern; and bonding the conductive layer and the exposed portion of the inner end portion in a conductive manner by at least one of pressure bonding or adhesion or welding with a conductive adhesive. And the conductive layer and the first
And a fourth step of electrically connecting the exposed portion of the connection pattern. 5. The method for manufacturing a circuit board with an antenna according to claim 3, wherein the non-conductive layer is formed by coating or printing using a fluid non-conductive material. 6. The method according to claim 3, wherein the non-conductive layer is formed by sandwiching a film-shaped non-conductive material. 7. The method for manufacturing a circuit board with an antenna according to claim 3, wherein at least the antenna pattern is formed by coating or printing using a fluid conductive material. 8. A first electrode plate pattern and a first conductive portion integral with the first electrode plate pattern provided on one surface of the substrate by vapor deposition, etching, printing, coating, or embossing of a conductive material; A pattern layer having the first electrode plate pattern and a lower second conductive portion separated from the first conductive portion; and a predetermined dielectric constant and a predetermined thickness covering at least the first electrode plate pattern. A non-conductive layer, a second electrode plate pattern laminated on the non-conductive layer and having an overlapping portion with the first electrode plate pattern, and the lower second electrode integrated with the second electrode plate pattern. A conductive layer having an upper second conductive portion superimposed on at least a portion of the conductive portion, and the upper second conductive portion of the conductive layer and the lower second conductive portion of the pattern layer. At least part of the overlap Capacitance with the circuit board, characterized in that it is conductively bonded by at least one of gluing or welding by crimping or electrically conductive adhesive. 9. A first electrode plate pattern and a first conductive portion integral with the first electrode plate pattern on one surface of the substrate; and a lower side separated from the first electrode plate pattern and the first conductive portion. A second step of providing a pattern layer having a second conductive portion by vapor deposition or etching, printing, coating, or embossing of a conductive material; and providing at least the first electrode plate pattern with a predetermined dielectric constant and a predetermined thickness. A second step of covering with a non-conductive layer having a thickness, and, on the non-conductive layer, laminating a second electrode plate pattern as a conductive layer so as to overlap the first electrode plate pattern, A third step of laminating an integral upper second conductive portion on at least a portion of the lower second conductive portion and laminating the upper second conductive portion; and the upper second conductive portion of the conductive layer and the lower second conductive portion of the pattern layer. Of the overlapping portion with the conducting portion Without even a portion, fourth step and capacitance circuit with the substrate manufacturing method characterized by comprising the to be conductively joined by at least one of gluing or welding by crimping or electrically conductive adhesive. 10. The method according to claim 9, wherein the non-conductive layer is formed by applying or printing a fluid non-conductive material. 11. The non-conductive layer is formed by sandwiching a film-shaped non-conductive material.
A method for manufacturing the circuit board with capacitance according to the above. 12. The method according to claim 9, wherein the pattern layer is formed by applying or printing using a fluid conductive material. 13. A loop-shaped antenna pattern having an inner end and an outer end provided on one surface of a substrate by vapor deposition, etching, printing, coating, or embossing of a conductive material, and an inner region of the antenna pattern. A first electrode pattern, a first connection pattern for conducting the inner end portion and the first electrode plate pattern in an area inside the antenna pattern, and an antenna pattern in an area inside the antenna pattern. And a pattern layer having a lower second connection pattern provided separately from the first electrode plate pattern and the first connection pattern; and at least the first layer having a predetermined dielectric constant and a predetermined thickness. 1
And covering the electrode pattern and covering the antenna pattern located between the lower second connection pattern and the outer end, and at least a part of the outer end and at least a part of the lower second connection pattern. A second electrode plate pattern laminated on the non-conductive layer and having an overlapping portion with the first electrode plate pattern; and a lower electrode integrally formed with the second electrode plate pattern. An upper second connection pattern which is superimposed on at least a part of the two connection patterns and further extended on the non-conductive layer covering the antenna pattern to overlap at least the exposed portion of the outer end portion. A conductive layer, and the upper second connection pattern and the exposed portion at the outer end portion by pressure bonding or at least one of adhesion and welding with a conductive adhesive. There are conductively joined, further the upper second connection pattern and the lower second at least a portion, characterized in that is conductively bonded antenna and a capacitor with the circuit board of the superimposed portion between the connection pattern. 14. A loop-shaped antenna pattern provided on one surface of a substrate by vapor deposition, etching, printing, coating, or embossing of a conductive material, having a loop-shaped antenna pattern having an inner end and an outer end, and an outer region of the antenna pattern A first electrode plate pattern provided on the outer surface of the antenna pattern, a first connection pattern for conducting the outer end portion and the first electrode plate pattern, and an antenna pattern on an outer region of the antenna pattern. And a pattern layer having a lower second connection pattern provided separately from the first electrode plate pattern and the first connection pattern; and at least the first layer having a predetermined dielectric constant and a predetermined thickness. 1
The antenna pattern covers an electrode plate pattern and covers the antenna pattern positioned between the lower second connection pattern and the inner end, and at least a part of the inner end and at least a part of the lower second connection pattern. A second electrode plate pattern laminated on the non-conductive layer and having an overlapped portion with the first electrode plate pattern; and a lower electrode integrally formed with the second electrode plate pattern. An upper second connection pattern superimposed on at least a portion of the side second connection pattern, further extended on the non-conductive layer covering the antenna pattern, and superimposed on at least the exposed portion of the inner end. A conductive layer to be formed, and wherein at least one of pressure bonding or bonding with a conductive adhesive material or welding is performed before the upper second connection pattern and the inner end portion. An antenna and a circuit board with a capacitance, wherein an exposed portion is connected to be conductive, and at least a part of the overlapping portion of the upper second connection pattern and the lower second connection pattern is connected to be conductive. . 15. A loop-shaped antenna pattern having an inner end and an outer end on one surface of a substrate, a first electrode plate pattern in an area inside the antenna pattern, the inner end and the first end. First to conduct the electrode plate pattern
A pattern layer having a connection pattern and the lower second connection pattern provided separately from the antenna pattern, the first electrode plate pattern, and the first connection pattern is formed by depositing or etching or printing a conductive material. Or a first step of providing by applying or embossing, as a non-conductive layer by printing or applying a non-conductive material having a predetermined dielectric constant, covering at least the first electrode plate pattern with a predetermined thickness, and A second step of covering the antenna pattern positioned between the second side connection pattern and the outer end and exposing at least a portion of the outer end and at least a portion of the lower second connection pattern; As a conductive layer using a conductive material, a second electrode plate pattern having an overlapping portion with the first electrode plate pattern is laminated on the non-conductive layer, A second electrode plate pattern, integrally with at least a part of the lower second connection pattern, and further extended on the non-conductive layer covering the antenna pattern to form at least the exposed portion of the outer end; The upper second connection pattern can be electrically connected to the exposed portion of the outer end portion by a third step of laminating the superimposed upper second connection pattern and / or bonding or welding with a conductive adhesive. And a fourth step of connecting at least a part of the overlapping portion of the upper second connection pattern and the lower second connection pattern so as to be conductive. Substrate manufacturing method. 16. A loop-shaped antenna pattern having an inner end and an outer end on one surface of a substrate, a first electrode plate pattern, an outer end and the first end in an area outside the antenna pattern. First to conduct the electrode plate pattern
A pattern layer having a connection pattern and the lower second connection pattern provided separately from the antenna pattern, the first electrode plate pattern, and the first connection pattern is formed by depositing or etching or printing a conductive material. Or a first step of providing by applying or embossing, as a non-conductive layer by printing or applying a non-conductive material having a predetermined dielectric constant, covering at least the first electrode plate pattern with a predetermined thickness, and A second step of covering the antenna pattern positioned across the second side connection pattern and the inner end, and exposing at least a portion of the inner end and at least a portion of the lower second connection pattern; A second electrode pattern having an overlapping portion with the first electrode pattern as a conductive layer formed by printing or coating a conductive material; An upper second connection pattern formed integrally with the second electrode plate pattern and superimposed on at least a portion of the lower second connection pattern, and further on the non-conductive layer covering the antenna pattern. A third step of overlapping the inner end portion with at least the exposed portion of the inner end portion, and bonding and / or welding the upper end second connection pattern and the inner end portion by at least one of pressure bonding or a conductive adhesive. And a fourth step of joining the exposed portion in a conductive manner and further joining at least a part of the overlapping portion of the upper second connection pattern and the lower second connection pattern in a conductive manner. And a method of manufacturing a circuit board with a capacitor. 17. The production of an antenna and a circuit board with a capacitance according to claim 15, wherein the non-conductive layer is formed by applying or printing using a fluid non-conductive material. Method. 18. The method according to claim 1, wherein the non-conductive layer is formed by sandwiching a film-shaped non-conductive material.
17. A method for manufacturing the antenna and the circuit board with a capacitor according to any one of 5 and 16. 19. The method of manufacturing an antenna and a circuit board with a capacitance according to claim 15, wherein the pattern layer is formed by coating or printing using a fluid conductive material. 20. A loop-shaped antenna pattern provided on one surface of a substrate by vapor deposition, etching, printing, coating, or embossing of a conductive material, having a loop-shaped antenna pattern having an inner end and an outer end, and an inner area of the antenna pattern. A first electrode pattern, a first connection pattern for conducting the inner end portion and the first electrode plate pattern in an area inside the antenna pattern, and an antenna pattern in an area inside the antenna pattern. And a pattern layer having a lower second connection pattern provided separately from the first electrode plate pattern and the first connection pattern; and at least the first layer having a predetermined dielectric constant and a predetermined thickness. 1
And covering the electrode pattern and covering the antenna pattern located between the lower second connection pattern and the outer end, and at least a part of the outer end and at least a part of the lower second connection pattern. A second electrode plate pattern laminated on the non-conductive layer and having an overlapped portion with the first electrode plate pattern; and a lower electrode integrally formed with the second electrode plate pattern. An upper second connection pattern superimposed on at least a portion of the side second connection pattern, further extended on the non-conductive layer covering the antenna pattern, and superimposed on at least the exposed portion of the outer end. A conductive layer to be formed, and at least one of bonding or welding with a pressure-sensitive adhesive or a conductive adhesive, between the upper side second connection pattern and the outer end portion. The exposed portion is joined so as to be able to conduct, and at least a part of the overlapping portion of the upper second connection pattern and the lower second connection pattern is joined so as to be able to conduct, at least the first connection pattern and the lower second connection pattern. A non-contact information exchange device comprising an active circuit connected to the two connection patterns and capable of receiving or transmitting information in a non-contact manner by the antenna pattern. 21. A loop-shaped antenna pattern having an inner end and an outer end provided on one surface of a substrate by vapor deposition, etching, printing, coating, or embossing of a conductive material, and an outer region of the antenna pattern. A first electrode plate pattern provided on the outer surface of the antenna pattern, a first connection pattern for conducting the outer end portion and the first electrode plate pattern, and an antenna pattern on an outer region of the antenna pattern. And a pattern layer having a lower second connection pattern provided separately from the first electrode plate pattern and the first connection pattern; and at least the first layer having a predetermined dielectric constant and a predetermined thickness. 1
The antenna pattern covers an electrode plate pattern and covers the antenna pattern positioned between the lower second connection pattern and the inner end, and at least a part of the inner end and at least a part of the lower second connection pattern. A second electrode plate pattern laminated on the non-conductive layer and having an overlapped portion with the first electrode plate pattern; and a lower electrode integrally formed with the second electrode plate pattern. An upper second connection pattern superimposed on at least a portion of the side second connection pattern, further extended on the non-conductive layer covering the antenna pattern, and superimposed on at least the exposed portion of the inner end. And a conductive layer to be formed,
The upper second connection pattern and the exposed portion of the inner end portion are conductively joined to each other by at least one of pressure bonding and adhesion or welding with a conductive adhesive, and furthermore, the upper second connection pattern and the lower side. At least a part of the overlapped portion with the second connection pattern is conductively joined, and is connected to at least the first connection pattern and the lower second connection pattern to receive or transmit information in a non-contact manner by the antenna pattern. A non-contact type information exchange device, comprising an active circuit capable of performing the operation.