JP2001298043A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2001298043A5 JP2001298043A5 JP2000279987A JP2000279987A JP2001298043A5 JP 2001298043 A5 JP2001298043 A5 JP 2001298043A5 JP 2000279987 A JP2000279987 A JP 2000279987A JP 2000279987 A JP2000279987 A JP 2000279987A JP 2001298043 A5 JP2001298043 A5 JP 2001298043A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000279987A JP2001298043A (ja) | 2000-02-08 | 2000-09-14 | 半導体装置およびその製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000030651 | 2000-02-08 | ||
| JP2000-30651 | 2000-02-08 | ||
| JP2000279987A JP2001298043A (ja) | 2000-02-08 | 2000-09-14 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001298043A JP2001298043A (ja) | 2001-10-26 |
| JP2001298043A5 true JP2001298043A5 (no) | 2007-11-01 |
Family
ID=26585046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000279987A Pending JP2001298043A (ja) | 2000-02-08 | 2000-09-14 | 半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001298043A (no) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018179265A1 (ja) * | 2017-03-30 | 2018-10-04 | シャープ株式会社 | 表示デバイス、表示デバイスの製造方法、表示デバイスの製造装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234431A (ja) * | 1985-11-01 | 1987-02-14 | Minolta Camera Co Ltd | 光通信用受信装置 |
| JPS6393124A (ja) * | 1986-10-07 | 1988-04-23 | Sharp Corp | Ｌｓｉチツプの接続方式 |
| JPH0362542A (ja) * | 1989-07-31 | 1991-03-18 | Seiko Epson Corp | 半導体装置及びその製造方法 |
| JPH08167630A (ja) * | 1994-12-15 | 1996-06-25 | Hitachi Ltd | チップ接続構造 |
| JPH0917828A (ja) * | 1995-04-28 | 1997-01-17 | Asahi Denka Kenkyusho:Kk | 回路基板 |
| JPH09107165A (ja) * | 1995-10-13 | 1997-04-22 | Japan Aviation Electron Ind Ltd | Ｂｇａ部品実装用基板 |
| JP3248149B2 (ja) * | 1995-11-21 | 2002-01-21 | シャープ株式会社 | 樹脂封止型半導体装置及びその製造方法 |
| JPH09219415A (ja) * | 1996-02-13 | 1997-08-19 | Kokusai Electric Co Ltd | ベアチップ薄膜回路素子の実装用配線基板および実装構造 |
| JP2845218B2 (ja) * | 1996-10-02 | 1999-01-13 | 日本電気株式会社 | 電子部品の実装構造およびその製造方法 |
| JPH10209204A (ja) * | 1997-01-24 | 1998-08-07 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
-
2000
- 2000-09-14 JP JP2000279987A patent/JP2001298043A/ja active Pending