JP2001297942A - Electronic parts with terminal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide electronic parts which are provided with terminals, exert durability against stresses applied from a circuit board when the parts are mounted on the board by soldering, and are constituted in a flat structure in which insufficiency, failure, and sucking up of mounting solder hardly occur. SOLUTION: The electronic parts with L-shaped terminals are constituted by respectively connecting conductive connecting members 3 (four members in total) to external electrodes 3 (four in total) on both side faces (end faces in the longitudinal direction) of two electronic parts 10 and 11 laid upon another in one direction, and, at the same time, attaching L-shaped terminal parts 15 (two in total) having bent sections to the connecting members 3. The bent sections of the parts 15 and their vicinities including the outer end sections of mounting sections 15b mounted on the mounting surface of the circuit board are formed in outward overhung sections 15a, so as to prevent the sucking up of the solder used at the time of mounting the parts on the circuit board, and, in addition, to relieve the stresses applied from the circuit board. Therefore, the heights of the parts 10 and 11 are reduced and the parts 10 and 11 are brought nearer to the mounting surface of the circuit board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly provides electronic components, such as surface-mounted ceramic capacitors and ceramic varistors, having terminal components for soldering and mounting to a mounting surface of a circuit board provided for mounting. The present invention relates to an electronic component with a terminal.

[0002]

2. Description of the Related Art Conventionally, there are various types of general surface-mounting electronic components. When these electronic components are directly soldered and mounted on a mounting surface of an aluminum circuit board, the circuit board is mounted on the circuit board. The electronic component may be damaged by stress generated by thermal expansion or thermal contraction of the electronic component, and in such a case, the characteristic of the electronic component often deteriorates.

Therefore, in order to alleviate the stress due to thermal expansion and contraction from the circuit board, a plurality of electronic components are superimposed, or a metal terminal component is fitted into an external electrode of the electronic component as one, or There has been proposed a configuration in which the terminal components are soldered and further mounted on the mounting surface of the circuit board by soldering, that is, a configuration in which the electronic component is a terminal-equipped electronic component having the terminal component.

[0004] Such terminal components may have a U-shape as disclosed in Japanese Patent Application Laid-Open No. 10-312932, a folded type as disclosed in Japanese Patent Application Laid-Open No. Hei 11-233370, and a Japanese Utility Model. There are various types such as an L-type as disclosed in Japanese Patent Application Laid-Open No. 14458, and any terminal component is commercialized as a terminal-attached electronic component in a form attached to the electronic component.

FIG. 9 is a side view showing a basic structure of a conventional electronic component having a U-shaped terminal as an example of a terminal component having such various shapes.

In this electronic component with a U-shaped terminal, a conductive connecting member 3 made of solder or conductive resin is connected to the external electrodes 2 on both sides in one direction of the electronic component 1. A conductive U-shaped terminal component 4 having a bent portion is mounted thereon, and the electronic component 1 and the connecting member 3 are arranged at a portion closer to one corner side of the U-shaped terminal component 4, and the other corner is provided. The portion closer to the section is configured as a stress relaxation section 4a at the time of soldering mounting to the mounting surface of the circuit board.

That is, in the electronic component with the U-shaped terminal, the stress relaxation portion 4 which is a local portion of the pair of U-shaped terminal components 4 is provided.
a is used as a portion for mitigating the thermal expansion or thermal contraction from the circuit board during the solder mounting on the mounting surface of the circuit board to the electronic component 1, and on both sides of the electronic component 1 and the U-shaped terminal component 4. The connecting member 3 disposed between the portions serves as a solder suction preventing portion at the time of soldering and mounting on the mounting surface of the circuit board.

[0008]

In the case of the above-mentioned electronic component with terminals, if the height of the terminal component is reduced and the electronic component is arranged close to the mounting surface of the circuit board, a low profile structure is adopted.
Regardless of the type of terminal component, the connecting members provided between the electronic component and the terminal component necessarily approach the mounting surface of the circuit board, and when soldering to the mounting surface of the circuit board, the mounting solder is placed inside the terminal component. If the solder is insufficient, or if the electronic components are fixed to the mounting surface of the circuit board by the mounting solder together with the terminal components, the stress from the circuit board cannot be reduced by the terminal components. This makes it easy to cause a problem that the electronic component is damaged by the stress from the circuit board, and as a result, it is difficult to realize a low-profile structure in which the electronic component is brought close to the mounting surface of the circuit board. .

FIG. 10 is a side view showing a state in which a conventional electronic component having an L-shaped terminal is mounted on a mounting surface of a circuit board 7 by soldering, and FIG. FIG. 4B shows the state of the solder 6 'in the state of abnormal penetration and fixation.

The L-shaped terminal-equipped electronic component is provided on the external electrodes 2 on both sides in one direction of the electronic component 1 so that the electronic component 1 is disposed at the corner of the L-shaped terminal component 5. Although it is configured as a low-profile structure in which a conductive connecting member 3 made of solder or conductive resin or the like is connected, and a conductive L-shaped terminal component 5 having a bent portion is mounted on the connecting member 3. In a normal state at the time of soldering mounting on the mounting surface of the circuit board 7, as shown in FIG. 10A, the mounting solder 6 is fixed only to the outer portion of the L-shaped terminal component 5, and the surface mounting is performed without any problem. Is performed.

However, at the time of soldering mounting on the mounting surface of the circuit board 7, as shown in FIG. 10 (b), the mounting solder 6 'climbs over the L-shaped terminal part 5 for some reason and enters the inner part. In the case of abnormal penetration and fixation, the mounting solder 6 ′ comes into contact with the connection member 3 and the external electrode 2 of the electronic component 1, and in particular, the connection member 3 and the external electrode 2 of the electronic component 1 are solder-compatible materials. In such a case, the mounting solder 6 ′ may be sucked up, resulting in a shortage of the mounting solder 6 ′ or a failure such that the action of relaxing the stress from the circuit board 7 is disabled. There is.

The disadvantage of the low profile structure in which the electronic component 1 is brought close to the mounting surface of the circuit board 7 is described in FIG.
This occurs not only in the electronic component with an L-shaped terminal described in (a) and (b) but also in the electronic component with a U-shaped terminal described in FIG. Also, the spring acting portions of the terminal components 4 and 5 for relaxing the stress from the circuit board 7 cannot be sufficiently secured, and the stress from the circuit board 7 reaches the electronic component 1 and the electronic component 1 is easily damaged. It will be.

In the case of the above-mentioned electronic parts with terminals, regardless of the type of the terminal parts, if the bent parts of the terminal parts are square, even if the terminal parts are made of a material which is not compatible with solder, such as metal. When performing bending, processing wrinkles are generated inside the bent portion, and the processing wrinkles cause a capillary phenomenon at the time of soldering and mounting on the mounting surface of the circuit board, so that the mounting solder is drawn into the inner part of the terminal component. In the same manner as described above, it is easy to cause a defect such as a shortage of the mounting solder or a state in which the action of relaxing the stress from the circuit board becomes impossible, and as a result, the shape of the bent portion in the terminal component is also improved. There is room to be done.

SUMMARY OF THE INVENTION The present invention has been made to solve such problems, and its technical problem is to have excellent durability against stress from a circuit board during soldering and mounting, It is an object of the present invention to provide an electronic component with a terminal having a highly reliable and low-profile structure which is less likely to cause insufficient soldering or suction.

[0015]

According to the present invention, a conductive connecting member is connected to external electrodes on both side surfaces of at least one electronic component in one direction, and a bent portion is formed on the connecting member. In an electronic component with a terminal formed by attaching a conductive terminal component having a terminal component,
The shape in the vicinity of the bent portion is a protruding portion that protrudes outward, and as the electronic component, an electronic component with terminals disposed close to the mounting surface of the circuit board provided for mounting is obtained.

Further, according to the present invention, at least one electronic component is connected to the external electrodes on both side surfaces in one direction of the electronic component, and has a bent portion on the connection member. In a terminal-equipped electronic component having the terminal component attached thereto, the terminal component has a curved shape in which a cross-sectional shape on a plane perpendicular to both side surfaces in one direction of the electronic component is defined by a predetermined radius of curvature. As described above, the electronic component is formed into a curved surface, and as the electronic component, an electronic component with terminals disposed close to the mounting surface of the circuit board used for mounting is obtained.

Further, according to the present invention, in any of the above-mentioned electronic components with terminals, the terminal component is a terminal whose inside surface in a mounting portion connected to a mounting surface of a circuit board has solder incompatibility. With this, an electronic component with the same is obtained.

In addition, according to the present invention, in the electronic component with a terminal, the terminal component is an electronic component with a terminal in which an inner surface of a protruding portion or a bent portion extending from a mounting portion has solder incompatibility. can get.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The following is a detailed description of an electronic component with terminals according to the present invention with reference to the drawings.

FIG. 1 is a side view showing a basic configuration of an electronic component having a substantially L-shaped terminal according to a first embodiment of the present invention. FIG. Figure (b) relates to a lateral view in the lateral direction.

The electronic component with the substantially L-shaped terminal has two
Conductive connecting members 3 (total of four) made of solder, conductive resin, or the like are respectively applied to external electrodes 2 (total of four places) on both side surfaces (end faces in the longitudinal direction) in one direction of the stacked electronic components 10 and 11. ) And a conductive substantially L-shaped terminal component 1 having a bent portion on the connecting member 3.
5 (two in total) are attached, and the substantially L-shaped terminal component 15 is near a bent portion including an outer end of a mounting portion 15b mounted on a mounting surface of a circuit board provided for mounting. Is formed as an overhanging portion 15a which protrudes outward in order to prevent absorption of solder used for soldering and to reduce stress from the circuit board, whereby the electronic components 10, 11 are mounted on the circuit board. It is a low profile structure that is deployed close to the surface.

Among them, a pair of substantially L-shaped terminal parts 15
A bent portion including an outer end of a flat mounting portion 15b opposed to sandwich the two electronic components 10 and 11 is formed as a protruding portion 15a projecting in a semicircular convex shape. There is a space inside, and the same direction (mounting of the circuit board) as a flat plate extending from the projecting portion 15a opposite to the mounting portion 15b is substantially perpendicular to the extending direction of the mounting portion 15b. A pair of frame plates is used to change the shape of the vicinity of the bent portion so as to be parallel to each other on both side surfaces on which the connecting members 3 of the electronic components 10 and 11 are provided. It has a substantially L-shaped structure with an overhang 15a. Incidentally, the substantially L-shaped terminal component 15 is composed of the two electronic components 10 and 11 described here.
It is also possible to modify the type to connect and hold one or three or more electronic components in place of connecting and holding the object.

The two electronic components 10 and 11 are ceramic capacitor elements, and the external electrodes 2 on both side surfaces of the two electronic components 10 and 11 are connected to each other through the connecting member 3 so as to project from the mounting portion 15b of the substantially L-shaped terminal component 15 on the opposite side. It is connected to a plate-like portion extending from 15a. By the way, the electronic components 10,
11 can be applied not only to a ceramic capacitor element but also to a varistor, a resistor, or a component combining these.

In such an electronic component with a substantially L-shaped terminal, the electronic components 10, 11 are mounted on the mounting surface of the circuit board.
(Especially, the electronic component 11 is shown here.) The height is reduced and the overhanging portion 15a of the substantially L-shaped terminal component 15 is soldered to the mounting surface of the circuit board from the circuit board. Since the distance between the external electrode 2 of the electronic component 1 and the electronic component 1 can be increased while sufficiently retaining the stress transmission alleviating effect, the electronic component 1 exhibits an excellent alleviating effect against stress due to thermal expansion and thermal contraction from the circuit board during soldering and mounting. (E.g., the overhang 15a and the electronic components 10, 1)
1 to prevent suction of the solder for mounting).

Therefore, as shown in FIG. 1 (a), a dimension a (m) from the surface of the external electrode 2 of the electronic component 11 to the maximum convex portion of the inner wall in the longitudinal direction at the overhang portion 15a.
m), a dimension b (mm) from a mounting surface (indicating a portion connected to the mounting portion 15b of the outer wall) in a direction perpendicular to the mounting surface of the circuit board to a contour end of the outer wall, and Solder suction test on an electronic component with terminals configured by changing the dimension c (mm) from the mounting surface (indicating a portion connected to the mounting portion 15b on the outer wall) in the vertical direction to the surface of the electronic component 11 in various ways Was performed, the relationship of the number of occurrences of solder suction / the number of tests was a = 0.05 (a state where the connection member 3 was separated in thickness and no overhang), and b =
In the case of 0.2 and c = 0.2, 30/30, and a =
8/30 when 0.15, b = 0.3 and c = 0.2
When a = 0.2, b = 0.3 and c = 0.2, 0/30 is obtained, and a = 0.3, b = 0.3 and c = 0.
In the case of 2, it was 0/30. However, at the time of soldering mounting, cream solder with a thickness of 200μ
m, and heated with a hot plate to perform soldering. When the solder is melted, the circuit board is intentionally shaken to substantially swing the L-shaped terminal component 15 (including the L-shaped terminal component having no overhang portion 15a). ) So that the solder easily enters the inside of

From the results of the solder suction test, it is found that approximately L
It has been found that good results are obtained when the dimension a indicating the distance between the overhang 15a of the character-shaped terminal component 15 and the electronic component 11 is 0.2 mm or more. Note that this test result is merely an example, and it is expected that a better result can be obtained by increasing the distance of b or c, thereby shortening the distance of a.

Next, the conventional U-shaped terminal component 4 described with reference to FIG. 9 and a = 0.
05, b = 0.2, overhang 15 in case of c = 0.2
a conventional L-shaped terminal component 5 described with reference to FIG.
And a = 0.2, b which did not cause the solder to be sucked up
= 0.3 and c = 0.2, the terminal-equipped electronic component formed using the substantially L-shaped terminal component 15 according to the first embodiment having the overhang portion 15a is described in [JIS C5102.
-1994], the temperature cycle test was performed based on the test conditions, and the relationship between the number of defects and the number of tests was 0/30 in the conventional product using the conventional U-shaped terminal part 4 with 100 cycles. The conventional product using the conventional L-shaped terminal component 5 is 30/30, and the substantially L-shaped terminal component 1 according to the first embodiment.
5 is 0/30 for a new product using 5 and the number of subsequent cycles is 200, 300, 500 (in the case of a conventional product using the conventional L-shaped terminal part 5, all of the products become defective at 200 or more cycles) The test is omitted because it is self-evident.) The conventional product using the conventional U-shaped terminal component 4 is 0/30, and the new product using the substantially L-shaped terminal component 15 according to the first embodiment. In the conventional product using the conventional U-shaped terminal part 4 with the cycle number 700, 1/30,
The new product using the substantially L-shaped terminal component 15 according to the first embodiment is 0/30, and the conventional product using the conventional U-shaped terminal component 4 with a cycle number of 1000 is 2/30, according to the first embodiment. In the case of a new product using the substantially L-shaped terminal part 15, the ratio was 0/30.

From the results of the temperature cycle test, it is found that the substantially L-shaped terminal component 1 according to the first embodiment having the overhang portion 15a is provided.
In the case of the new product using No. 5 (the electronic component with a substantially L-shaped terminal according to the first embodiment shown in FIG. 1), it can be seen that the durability is significantly improved in the temperature cycle.

By the way, in the electronic component with the substantially L-shaped terminal according to the embodiment, the substantially L-shaped terminal component 15 having the overhang portion 15a is used.
The same effect can be obtained when a terminal component having another shape with a different shape is used.

For example, in the electronic component with a step-shaped terminal according to the second embodiment shown in FIG. 2, a flat plate-like portion bent and extended from the outer end of the flat mounting portion 16b parallel to the circuit board 7 is provided. The overhanging portion 16a is connected to the connection member 3 at a local portion above the external electrode 2 of the electronic component 1, and extends over three portions from an upper piece parallel to the circuit board 7 to form a step and extend over the circuit board 7. Step-type terminal component 16 extending in a direction perpendicular to the mounting surface of the electronic component 1, the gap between the overhang 16 a and the surface of the external electrode 2 of the electronic component 1 is sufficiently ensured, and the solder 6 is sucked. Can be sufficiently prevented.

Also, in the electronic component with a U-shaped terminal according to the third embodiment shown in FIG. 3, a U-shaped terminal having the same shape as the conventional product using the U-shaped terminal component 4 described with reference to FIG. The U-shaped terminal component 14 is used. Here, one flat lower piece of the U-shaped terminal component 14 parallel to the circuit board 7 is used as the mounting portion 14b, and a local portion of the other flat upper piece is used. Is connected to the connection member 3 in the local area above the external electrode 2 of the electronic component 1, so that the upper and lower pieces are connected and bent to extend in a direction perpendicular to the mounting surface of the circuit board 7. The connection piece as the overhang portion 14a secures a sufficient gap to the surface of the external electrode 2 of the electronic component 1 so that the solder 6 can be sufficiently prevented from being sucked.

Further, in the electronic component with a one-sided protrusion type terminal according to the fourth embodiment shown in FIG. 4, it is gently bent from the outer end of the flat mounting portion 17b parallel to the circuit board 7 and extends. The overhanging portion 17a is connected to the connection member 3 at a local portion above the external electrode 2 of the electronic component 1, and bulges out downward from a flat upper piece existing in a direction perpendicular to the mounting surface of the circuit board 7. The extended one-sided terminal component 17 is used. Also in this case, a gap between the overhang portion 17a and the surface of the external electrode 2 of the electronic component 1 is sufficiently ensured, and the suction of the mounting solder 6 can be sufficiently prevented. It has become.

In addition, in the electronic component with the both ends projecting type terminal according to the fifth embodiment shown in FIG. 5, the electronic component 1 is connected to the connecting members 3 on both side surfaces of the external electrode 2 of the electronic component 1 and provided for mounting. The terminal component 18 has a projecting portion 18a which has a projecting portion 18a which bulges up and down in both directions from a plate-shaped connecting piece existing in a direction perpendicular to the mounting surface of the circuit board to be mounted. A portion extending in a flat plate shape parallel to the circuit board is a mounting portion 18b, and a gap between the overhang portion 18a and the surface of the external electrode 2 of the electronic component 1 is sufficiently ensured to sufficiently absorb the solder for mounting. Can be prevented.

That is, in the case of the electronic component with the terminal with the overhang-type terminal according to the fifth embodiment using the terminal component 18 with the both-end overhang, one sheet of the electronic component with the terminal according to the first to fourth embodiments described above. Unlike the type mounted on the mounting surface of the circuit board, the type can be mounted by being sandwiched between two circuit boards.

As a modified form of the other terminal parts, for example, as shown in FIG. 6, in the case of the anchor type terminal part 19 applied to the electronic part with the anchor type terminal according to the sixth embodiment, the circuit An overhang portion 1 that is gently bent and extends from the outer end of a flat mounting portion 19b parallel to the substrate.
9a is connected to a connection member at a local portion above the external electrode of the electronic component, and is bent at two places from a flat upper piece existing in a direction perpendicular to the mounting surface of the circuit board to form a small step, and FIG.
In the case of the hanger-type terminal component 20 applied to the hanger-type terminal-equipped electronic component according to the seventh embodiment as shown in FIG. 7, the terminal is bent from the outer end of the flat mounting portion 20b parallel to the circuit board. Extending portion 20a is connected to a connection member at a local upper portion of the external electrode of the electronic component, and is bent from a flat upper piece existing in a direction perpendicular to the mounting surface of the circuit board to be laterally bent. It is in a form of being inclined and protruding.

In any of the electronic components with terminals according to the embodiments using such various types of terminal components having overhangs, a low-profile electronic component with a reduced distance from the mounting surface of the circuit board is provided. In addition to the structure, it is possible to increase the distance between the external electrodes of the electronic components while sufficiently retaining the effect of mitigating stress transmission from the circuit board during soldering to the mounting surface of the circuit board at the overhang of each terminal component. Therefore, during soldering and mounting, it exhibits excellent relaxation action against stress due to thermal expansion and thermal contraction from the circuit board and has durability, and even if the mounting solder gets over each terminal component, the electronic component Since the distance to the external electrode and the connection member is large, the solder is not sucked between each terminal component and the external electrode of the electronic component. It becomes hard to produce a good or suction.

By the way, for example, in the electronic component with the substantially L-shaped terminal according to the first embodiment shown in FIGS. 1A and 1B, the mounting surface of the pair of substantially L-shaped terminal components 15 on the circuit board 7. By applying a solder incompatibility treatment to the mounting solder on the inner portion of the mounting portion 15b, the effect of preventing the suction of the mounting solder can be further enhanced.

More specifically, the material of the entire substantially L-shaped terminal component 15 is made of a material which is incompatible with solder, and the surface outside the mounting portion 15b connected to the mounting surface of the circuit board has a solder affinity. By performing the processing (solder plating) and not performing the solder affinity processing on the inner surface of the mounting portion 15b (leaving the background of the material), the solder incompatibility processing is performed on the substantially L-shaped terminal component 15. gave.

Therefore, such a substantially L-shaped terminal component 15
The electronic components with substantially L-shaped terminals according to the seventh embodiment in which the surface on the inner side of the mounting portion 15b is subjected to the solder incompatibility treatment also have the dimensions a (mm) and b ( m
m) and the size c (mm) were variously changed, and when a solder suction test was performed on electronic components with terminals, the relationship between the number of occurrences of solder suction / the number of tests was a.
= 0.05 (in the state where the connection member 3 is separated in thickness and there is no overhang), when b = 0.2 and c = 0.2, 30/30, and a = 0.1, b = 0.2, c = 0.
In the case of 2, it becomes 2/30, and a = 0.15, b = 0.
3, c = 0.2, 0/30, and a = 0.
2, when b = 0.3 and c = 0.2, it becomes 0/30, and when a = 0.3, b = 0.3 and c = 0.2, it becomes 0/30.
/ 30. However, the additional conditions at the time of solder mounting were the same as in the case of the first embodiment.

From the results of the solder suction test, it was found that approximately L
It was found that good results were obtained when the dimension a indicating the distance between the overhang 15a of the character-shaped terminal component 15 and the electronic component 11 was 0.15 mm or more. Note that the test results here are merely examples, and it is expected that better results can be obtained by increasing the distances b and c, thereby shortening the distance a.

Next, the conventional U-shaped terminal component 4 described with reference to FIG.
05, b = 0.2, overhang 15 in case of c = 0.2
a conventional L-shaped terminal component 5 described with reference to FIG.
And a = 0.2, b which did not cause the solder to be sucked up
= 0.3 and c = 0.2, the terminal-equipped electronic component having the overhang portion 15a and the substantially L-shaped terminal component 15 according to the seventh embodiment which has been subjected to the solder incompatibility treatment. When a temperature cycle test was performed based on test conditions according to [JIS C5102-1994], the relationship between the number of failures / the number of tests was 100 in the number of cycles and that of the conventional product using the conventional U-shaped terminal component 4. 0/30, 30/30 for the conventional product using the conventional L-shaped terminal component 5, 0/30 for the new product using the substantially L-shaped terminal component 15 according to the seventh embodiment, and the number of subsequent cycles is 200. , 300,5
00 (also here, the test is omitted because it is obvious that the conventional product using the conventional L-shaped terminal part 5 becomes defective after 200 or more cycles). 0/30,
The new product using the substantially L-shaped terminal component 15 according to the seventh embodiment is 0/30, and the conventional product using the conventional U-shaped terminal component 4 with a cycle number of 700 is 1/30, according to the seventh embodiment. The new product using the substantially L-shaped terminal part 15 is 0/30, the cycle number is 1000, the conventional product using the conventional U-shaped terminal part 4 is 2/30, and the substantially L-shaped terminal according to the seventh embodiment. It was 0/30 for the new product using the part 15.

From the results of the temperature cycle test, it is found that the new product using the substantially L-shaped terminal component 15 according to the seventh embodiment having the overhang portion 15a and having been subjected to the solder incompatibility treatment, It can be seen that the durability is remarkably improved.

In the electronic component with the substantially L-shaped terminal according to the seventh embodiment, the pair of substantially L-shaped terminal components 15 are mounted on the mounting surface 15b of the mounting surface of the circuit board 7 in addition to the mounting portion. If the solder incompatibility treatment for the mounting solder is performed also on the inner portion of the overhang portion 15a which is a bent portion extending from the portion 15b, the effect of preventing suction of the mounting solder can be further enhanced.

More specifically, the entire material of the substantially L-shaped terminal component 15 is made of a material which is not compatible with solder, and the mounting portion 15b connected to the outer surface of the overhang portion 15a and the mounting surface of the circuit board. The outer surface of the substrate is subjected to a solder affinity treatment (solder plating), and the inner surface of the overhang portion 15a and the inner surface of the mounting portion 15b are not subjected to the solder affinity treatment (the surface of the material remains as it is). And the material of the entire L-shaped terminal component 15 is made of a material that is not compatible with solder, and the outer surface of the overhang portion 15a and the outer surface of the mounting portion 15b connected to the mounting surface of the circuit board are formed. The surface is subjected to a solder affinity treatment (solder plating) and the overhang portion 15
a) No solder affinity treatment (solder plating) is applied to the outer surface of the substrate a, and no solder affinity treatment is applied to the inner surface of the overhang portion 15a and the inner surface of the mounting portion 15b (leave the surface of the material). Of the other form was obtained.

Therefore, such a substantially L-shaped terminal component 15
The solder incompatible treatment is performed on the inner surfaces of the overhanging portion 15a and the mounting portion 15b,
The former in which the outer surface of b is subjected to solder affinity treatment (one form)
The electronic component with a substantially L-shaped terminal according to Example 8 also has dimensions a (mm) and dimensions b (m) shown in FIG.
m) and the size c (mm) were variously changed, and when a solder suction test was performed on electronic components with terminals, the relationship between the number of occurrences of solder suction / the number of tests was a.
= 0.05 (in a state where the connection member 3 is separated in thickness and there is no overhang), and when b = 0.2 and c = 0.2, 30/30, and a = 0.15, b = 0.3, c =
In the case of 0.2, it becomes 5/30, and a = 0.2, b =
0/30 when 0.3 and c = 0.2, and a =
In the case of 0.3, b = 0.3 and c = 0.2, it was 0/30. However, the additional conditions at the time of solder mounting were the same as in the case of the first embodiment.

From the results of the solder suction test, the dimension a indicating the distance between the overhang portion 15a of the substantially L-shaped terminal component 15 and the electronic component 11 is 0.1 in comparison with the case of the first embodiment.
It was found that the solder sucking rate at 5 mm was improved by 10%.

Similarly, the inwardly extending portion 15a of the substantially L-shaped terminal component 15 and the inner surface of the mounting portion 15b are subjected to a solder non-affinity treatment, and the outer surface of the mounting portion 15b is subjected to a solder affinity treatment. The electronic component with a substantially L-shaped terminal according to the ninth embodiment of the latter (other embodiment) in which the outer surface of 15a is not subjected to the solder affinity treatment also has dimensions a (mm) and dimensions shown in FIG. b (mm) and dimension c (mm)
When a solder suction test was performed on an electronic component with terminals configured by changing variously, the relationship of the number of occurrences of solder suction / the number of tests was a = 0.05 (the thickness of the connection member 3 is separated. State without overhang), b =
When 0.2 and c = 0.2, it becomes 28/30, and a =
When 0.1, b = 0.2, c = 0.2, it becomes 0/30, when a = 0.15, b = 0.3, c = 0.2, it becomes 0/30, a = 0.2, b = 0.3, c = 0.
In the case of 2, 0/30, a = 0.3, b = 0.
In the case of 3, c = 0.2, it was 0/30. However, the additional conditions at the time of solder mounting were the same as in the case of the first embodiment.

From the results of the solder suction test, the dimension a indicating the distance between the overhang portion 15a of the substantially L-shaped terminal component 15 and the electronic component 11 was 0.0 in comparison with the case of the first embodiment.
It was found that the solder sucking rate in the case of 5 mm was improved by 6.7%, and good results were obtained when the dimension a was 0.1 or more.

In the seventh, eighth and ninth embodiments, substantially L
In addition to using the entire material of the character-shaped terminal component 15 as a material having incompatibility with solder, the inner surface of the mounting portion 15b is made to have incompatibility with solder, and the outer surface is made to have affinity for solder, or further extended. At least the inner surface of the mounting portion 15b is made to be non-solder compatible by making the inner surface of the portion 15a non-solder compatible and the outer surface to be solder compatible or non-solder compatible. Although the case has been described, such a form is also applicable to the case where the material of the substantially L-shaped terminal component 15 as a whole is made of a material having solder affinity. Can be obtained in a similar manner by adding a film by film formation or the like.

Furthermore, in the electronic parts with terminals of the above-described embodiments 1 to 9, the shape near the bent part of the terminal part is formed as the overhanging part, so that the stress transmission from the circuit board at the time of solder mounting at the overhanging part. Although the configuration has been described in which the shortage of mounting solder and insufficient suction and suction are prevented, the same effect can be obtained even if the shape of the bent portion is formed to be a curved surface defined by a predetermined radius of curvature R.

FIG. 8 is a side view showing a basic configuration of an electronic component with a substantially L-shaped terminal according to Embodiment 10 of the present invention. FIG. 8 (a) relates to a longitudinal side view. Figure (b) relates to a lateral view in the lateral direction.

The electronic component with the substantially L-shaped terminal is formed by applying conductive materials such as solder or conductive resin to external electrodes 2 (total two locations) on both side surfaces (end surfaces in the longitudinal direction) of the electronic component 1 in one direction. Are connected to the connection member 3 (total of two), and the conductive substantially L-shaped terminal parts 21 (total of two) each having a bent portion are mounted on the connection member 3, and are substantially L-shaped. The shape of the bent part 21c including the outer end of the mounting part 21b mounted on the mounting surface of the circuit board 7 provided for mounting prevents the terminal component 21 from sucking up the mounting solder 6 used at the time of solder mounting. And the circuit board 7
In order to alleviate the stress from the electronic component 1, the electronic component 1 is formed into a curved surface so that a cross-sectional shape on a plane perpendicular to both side surfaces in one direction is a curve defined by a predetermined radius of curvature R,
Thus, the electronic component 1 has a low-profile structure in which the electronic component 1 is arranged close to the mounting surface of the circuit board 7.

The pair of substantially L-shaped terminal parts 21
A flat portion extending from the mounting portion 15b includes bent portions 21c each including an outer end of a flat mounting portion 21b facing the electronic component 1 so as to sandwich the electronic component 1 and extending from the mounting portion 15b. Are bent by R processing in the same direction (indicating a direction perpendicular to the mounting surface of the circuit board 7) so as to be substantially perpendicular to the extending direction of the mounting portion 21b, and the connecting member 3 of the electronic component 1 is bent.
Is formed in a substantially L-shaped structure in which a bent portion 21c is formed in an R-shape by a pair of frame plates so as to have a parallel arrangement relationship on both side surfaces on which are disposed. Incidentally, the substantially L-shaped terminal component 21 can be modified to a type that targets two or more electronic components other than the one electronic component 1 described here.

Such an electronic component with a substantially L-shaped terminal has a low-profile structure in which the distance of the electronic component 1 to the mounting surface of the circuit board 7 is reduced, Since the bent portion 21c is formed by the R processing, the generation of the capillary phenomenon due to the processing wrinkle can be suppressed without generating the processing wrinkle inside, and as a result, the suction of the mounting solder can be effectively prevented.

The electronic component with a substantially L-shaped terminal according to the tenth embodiment in which the bent portion 21c of the substantially L-shaped terminal component 21 is R-processed also has a dimension R (m) indicating a radius of curvature.
When a solder suction test was performed on an electronic component with terminals configured by variously changing m), the relationship of the number of occurrences of solder suction / the number of tests was R = 0.0 (bent portion 21).
In the case of c being a square shape), it is 10/30,
6/30 when R = 0.1, 0/30 when R = 1.0, and 0/30 when R = 2.0.
It became. However, additional conditions for soldering mounting are
The operation was performed in the same manner as in Example 1.

From the results of the solder suction test, it is found that
It has been found that good results are obtained when the dimension R, which is the radius of curvature of the bent portion 21c of the V-shaped terminal component 21, is 1.0 mm or more.

In the electronic component with a substantially L-shaped terminal according to the tenth embodiment, if at least the inner surface of the mounting portion 21b is made to be solder-incompatible as described above, the mounting solder 6 The effect of preventing siphoning can be further enhanced. That is, in the above-described embodiments 7, 8,
Even in a terminal component in which the inner surface of the mounting portion has solder incompatibility as in the case of No. 9, if the bent shape of the overhanging portion is square, wrinkles are generated inside at the time of bending to cause capillary action. In some cases, the solder may be sucked up. (Conventionally, in order to prevent the generation of processing wrinkles, bending is performed two or three times with a lot of man-hours.) Since the occurrence can be easily suppressed, suction of the mounting solder can be effectively prevented. Therefore, FIG.
Example 2 shown in FIG. 2, Example 3 shown in FIG. 3, and FIG.
As in the case of the electronic component with a terminal according to the seventh embodiment shown in FIG. 7, when the shape of the bent portion of the overhanging portion of the terminal component is square, it is more effective to further process this bent portion into a radius. Although it is preferable to prevent the suction of the solder, the embodiment shown in FIGS. 1A and 1B, the embodiment shown in FIG. 4, the embodiment shown in FIG. 5, and the embodiment shown in FIG. In the case of the electronic component with terminals according to the sixth embodiment, since the shape of the projecting portion itself in the terminal component is similar to that of the R processing, it is not necessary to perform the R processing on these terminal components.

[0058]

As described above, according to the electronic component with terminal of the present invention, the shape near the bent portion of the terminal component is formed as an overhanging portion, or the shape of the bent portion is rounded. And the inside surface of the mounting portion to be mounted on at least the mounting surface of the circuit board provided for mounting on the terminal components has a solder incompatibility, so that the circuit board In addition to the low profile structure that shortens the distance of electronic components to the mounting surface, it also has excellent durability against stress caused by thermal expansion and thermal contraction from the circuit board during soldering and has durability. At the same time, it is possible to properly prevent insufficient shortage and suction of the mounting solder. As a result, it is possible to provide an electronic component with a terminal having a low profile that can improve the reliability at the time of mounting, which is unprecedented, and to reduce the overall manufacturing cost due to the simple structure of the terminal component. This means that even when mounting on a circuit board such as an aluminum substrate with a different coefficient of thermal expansion, damage to the electronic components attached to the terminal components can be minimized, so that a wide range of electronic components can be applied. Be profitable.

[Brief description of the drawings]

1A and 1B are side views showing a basic configuration of an electronic component with a substantially L-shaped terminal according to a first embodiment of the present invention, wherein FIG. 1A is related to a side view in a longitudinal direction, and FIG. It relates to a side view in the direction.

FIG. 2 is a side view showing a basic configuration of an electronic component with a step-shaped terminal according to a second embodiment of the present invention.

FIG. 3 is a side view showing a basic configuration of an electronic component with U-shaped terminals according to Embodiment 3 of the present invention.

FIG. 4 is a side view showing a basic configuration of an electronic component with a one-sided protrusion type terminal according to a fourth embodiment of the present invention.

FIG. 5 is a side view showing a basic configuration of an electronic component with a terminal with an overhang-type terminal according to Embodiment 5 of the present invention.

FIG. 6 is a side view showing an external configuration of an anchor-type terminal component applied to an electronic component with an anchor-type terminal according to Embodiment 6 of the present invention.

FIG. 7 is a side view showing an external configuration of a hanger-type terminal component applied to an electronic component with a hanger-type terminal according to a seventh embodiment of the present invention.

8A and 8B are side views showing a basic configuration of an electronic component with a substantially L-shaped terminal according to Embodiment 10 of the present invention, wherein FIG. 8A relates to a side view in the longitudinal direction, and FIG. It relates to a side view in the direction.

FIG. 9 is a side view showing a basic configuration of a conventional electronic component with a U-shaped terminal.

FIGS. 10A and 10B are side views showing a state in which a conventional electronic component having an L-shaped terminal is mounted on a mounting surface of a circuit board by soldering, wherein FIG. Is related to the state of abnormal penetration and fixation of the mounting solder.

[Explanation of symbols]

1, 10, 11 Electronic component 2 External electrode 3 Connection member 4, 14 U-shaped terminal component 4a Stress relief portion 5 L-shaped terminal component 6, 6 'Mounting solder 7 Circuit board 14a, 15a, 16a, 17a, 18a, 19a, 2
0a Overhangs 14b, 15b, 16b, 17b, 18b, 19b, 2
0b, 21b Mounting part 15, 21 Substantially L-shaped terminal part 16 Stepped terminal part 17 One-sided protruding type terminal part 18 Both-sided protruding type terminal part 19 Anchor type terminal part 20 Hanger type terminal part 21c Bending part

Claims (4)

[Claims] 1. A method for connecting a conductive connecting member to external electrodes on both sides in at least one direction of at least one electronic component, and mounting conductive terminal components each having a bent portion on the connecting member. In the electronic component with a terminal, the terminal component has a protruding portion that protrudes outward in a shape near the bent portion, and the electronic component includes:
An electronic component with terminals, wherein the electronic component with terminals is provided in proximity to a mounting surface of a circuit board provided for mounting. 2. A method according to claim 1, further comprising: connecting at least one electronic component to external electrodes on both side surfaces in one direction of the electronic component, and attaching conductive terminal components each having a bent portion to the connection member. In the terminal-equipped electronic component, the terminal component is configured such that a shape of the bent portion is a curve whose cross-sectional shape on a plane perpendicular to both side surfaces in the one direction in the one direction is defined by a predetermined radius of curvature. An electronic component with a terminal, wherein the electronic component is formed in a curved shape, and the electronic component is arranged close to a mounting surface of a circuit board provided for mounting. 3. The electronic component with terminals according to claim 1, wherein the terminal component has an inner surface of a mounting portion connected to a mounting surface of the circuit board having solder incompatibility. Characteristic electronic components with terminals. 4. The electronic component with a terminal according to claim 3, wherein the terminal component has an inward surface of the overhanging portion or the bent portion extending from the mounting portion, which is incompatible with solder. Electronic parts with terminals.