JP2001296253A5 - - Google Patents

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Publication number
JP2001296253A5
JP2001296253A5 JP2000110809A JP2000110809A JP2001296253A5 JP 2001296253 A5 JP2001296253 A5 JP 2001296253A5 JP 2000110809 A JP2000110809 A JP 2000110809A JP 2000110809 A JP2000110809 A JP 2000110809A JP 2001296253 A5 JP2001296253 A5 JP 2001296253A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000110809A
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Japanese (ja)
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JP2001296253A (ja
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Priority to JP2000110809A priority Critical patent/JP2001296253A/ja
Priority claimed from JP2000110809A external-priority patent/JP2001296253A/ja
Publication of JP2001296253A publication Critical patent/JP2001296253A/ja
Publication of JP2001296253A5 publication Critical patent/JP2001296253A5/ja
Pending legal-status Critical Current

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JP2000110809A 2000-04-12 2000-04-12 半導体装置用検査装置及び半導体装置の検査方法 Pending JP2001296253A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000110809A JP2001296253A (ja) 2000-04-12 2000-04-12 半導体装置用検査装置及び半導体装置の検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000110809A JP2001296253A (ja) 2000-04-12 2000-04-12 半導体装置用検査装置及び半導体装置の検査方法

Publications (2)

Publication Number Publication Date
JP2001296253A JP2001296253A (ja) 2001-10-26
JP2001296253A5 true JP2001296253A5 (enrdf_load_stackoverflow) 2007-05-17

Family

ID=18623257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000110809A Pending JP2001296253A (ja) 2000-04-12 2000-04-12 半導体装置用検査装置及び半導体装置の検査方法

Country Status (1)

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JP (1) JP2001296253A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12116219B2 (en) * 2019-02-19 2024-10-15 Fuji Corporation Component mounter
WO2021202211A1 (en) * 2020-03-29 2021-10-07 Kulicke And Soffa Industries, Inc. Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods
CN112633439B (zh) * 2020-12-28 2025-01-24 昆山丘钛光电科技有限公司 一种电子产品的生产卡控方法、装置、系统、设备及介质

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06324004A (ja) * 1993-05-12 1994-11-25 Shinko Electric Ind Co Ltd 画像処理装置
JP3476311B2 (ja) * 1996-08-02 2003-12-10 松下電器産業株式会社 実装装置における電子部品保持装置及び実装装置における電子部品保持方法
JPH10300441A (ja) * 1997-04-25 1998-11-13 Mitsubishi Electric Corp 半導体検査装置

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