JP2001296253A5 - - Google Patents
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- JP2001296253A5 JP2001296253A5 JP2000110809A JP2000110809A JP2001296253A5 JP 2001296253 A5 JP2001296253 A5 JP 2001296253A5 JP 2000110809 A JP2000110809 A JP 2000110809A JP 2000110809 A JP2000110809 A JP 2000110809A JP 2001296253 A5 JP2001296253 A5 JP 2001296253A5
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000110809A JP2001296253A (ja) | 2000-04-12 | 2000-04-12 | 半導体装置用検査装置及び半導体装置の検査方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000110809A JP2001296253A (ja) | 2000-04-12 | 2000-04-12 | 半導体装置用検査装置及び半導体装置の検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001296253A JP2001296253A (ja) | 2001-10-26 |
JP2001296253A5 true JP2001296253A5 (enrdf_load_stackoverflow) | 2007-05-17 |
Family
ID=18623257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000110809A Pending JP2001296253A (ja) | 2000-04-12 | 2000-04-12 | 半導体装置用検査装置及び半導体装置の検査方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001296253A (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12116219B2 (en) * | 2019-02-19 | 2024-10-15 | Fuji Corporation | Component mounter |
WO2021202211A1 (en) * | 2020-03-29 | 2021-10-07 | Kulicke And Soffa Industries, Inc. | Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods |
CN112633439B (zh) * | 2020-12-28 | 2025-01-24 | 昆山丘钛光电科技有限公司 | 一种电子产品的生产卡控方法、装置、系统、设备及介质 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06324004A (ja) * | 1993-05-12 | 1994-11-25 | Shinko Electric Ind Co Ltd | 画像処理装置 |
JP3476311B2 (ja) * | 1996-08-02 | 2003-12-10 | 松下電器産業株式会社 | 実装装置における電子部品保持装置及び実装装置における電子部品保持方法 |
JPH10300441A (ja) * | 1997-04-25 | 1998-11-13 | Mitsubishi Electric Corp | 半導体検査装置 |
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2000
- 2000-04-12 JP JP2000110809A patent/JP2001296253A/ja active Pending