JP2001288599A - Electric-plating cell - Google Patents
Electric-plating cellInfo
- Publication number
- JP2001288599A JP2001288599A JP2000103337A JP2000103337A JP2001288599A JP 2001288599 A JP2001288599 A JP 2001288599A JP 2000103337 A JP2000103337 A JP 2000103337A JP 2000103337 A JP2000103337 A JP 2000103337A JP 2001288599 A JP2001288599 A JP 2001288599A
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- JP
- Japan
- Prior art keywords
- electrode
- base body
- plating
- base
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electroplating Methods And Accessories (AREA)
Abstract
Description
【０００１】[0001]
【発明が属する技術分野】本発明は、ストリップ鋼板の
電気めっきラインにおいて、Ｚｒ、Ｓｎ、Ｃｒめっきを
行うために用いられる電気めっきセルに関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroplating cell used for performing Zr, Sn, and Cr plating in a strip steel plate electroplating line.
【０００２】[0002]
【従来の技術】例えば、水平型の電気めっきセルを用い
た電気めっきラインで鋼ストリップの両面にめっきを施
す場合には、図３に示すように、前後に間隔Ｌをおいて
配置したコンダクタロール１ａ、１ｂ間において、被め
っき材である鋼ストリップ２の通板ラインを挟んで、電
極触媒機能を有する電気めっき電極３ａ、３ｂを所定の
間隔ａをおいて対向配置し、この電気めっき電極３ａ、
３ｂ間に形成した空間にめっき液（電解液）４を供給
し、形成されためっき浴４ｏ中に鋼ストリップ２を通板
して、電気めっき電極３ａ、３ｂと陰極である鋼ストリ
ップ２間に通電することにより、鋼ストリップ２の両面
にめっきを施してめっき鋼板２ｚを製造することが行わ
れている。（参考技術 特開昭８−２７７４９３号公
報）2. Description of the Related Art For example, when plating is performed on both sides of a steel strip in an electroplating line using a horizontal type electroplating cell, as shown in FIG. 1a, between 1b, across the strip passing line of the steel strip 2 as an object to be plated, the electroplating electrode 3a having the electrode catalyst function, 3b opposed to each other by a predetermined distance a, the electroplating electrode 3a ,
A plating solution (electrolyte solution) 4 is supplied to the space formed between the electroplating electrodes 3a and 3b and the steel strip 2 serving as a cathode. By energizing, both sides of the steel strip 2 are plated to produce a plated steel sheet 2z. (Reference technology JP-A-8-277493)
【０００３】また、垂直型の電気めっきセルを用いた電
気めっきラインで鋼ストリップの両面にめっきを施す場
合には、図４に示すように、前後に間隔をおいて配置し
たコンダクタロール１ａ、１ｂ間において、下部にめっ
き層５を配置し、このめっき層にめっき液４を供給して
めっき浴４ｏを作り、このめっき浴４ｏ中において被め
っき材である鋼ストリップ２の通板ラインを挟んで、電
極触媒機能を有する電気めっき電極３ａ、３ｂを所定の
間隔をおいて対向配置し、このめっき浴４ｏ中の電気め
っき電極３ａ、３ｂ間にローラー６を介して鋼ストリッ
プ２を引き込んで通板し、電気めっき電極３ａ、３ｂと
陰極である鋼ストリップ２間に通電することにより、鋼
ストリップ２の両面にめっきを施してめっき鋼板２ｚを
製造することが行われている。（参考技術 特開昭８−
１２７８９５号公報）In the case of plating both sides of a steel strip in an electroplating line using a vertical electroplating cell, as shown in FIG. 4, conductor rolls 1a and 1b arranged at an interval in front and rear are provided. In between, a plating layer 5 is arranged at the lower part, a plating solution 4 is supplied to the plating layer to form a plating bath 4o, and a plating line of the steel strip 2 to be plated is sandwiched in the plating bath 4o. The electroplating electrodes 3a and 3b having an electrode catalyst function are arranged facing each other at a predetermined interval, and the steel strip 2 is drawn through the rollers 6 between the electroplating electrodes 3a and 3b in the plating bath 4o via a roller 6 to pass the steel plate. and, electroplating electrodes 3a, by energizing between the steel strip 2 is 3b and the cathode, the line is possible to manufacture a coated steel sheet 2z by plating on both surfaces of the steel strip 2 It has been. (Reference technology
No. 127895)
【０００４】上記の電気めっきラインで用いられる、電
気めっき電極３ａ、３ｂは、より具体的には、図５に示
すように、Ｔｉ層で覆われた鋼材で形成された保持基体
７と、この保持基体７のＴｉ層に接合されたＴｉからな
る電極基体９と、この電極基体９の表面に被覆されたＰ
ｔ、ＩｒＯ2 等からなる電極触媒８によって構成された
ものであり、鋼ストリップ２の両面にめっきを施す場合
には、めっき浴４ｏ中を通板する鋼ストリップ２を挟ん
で対向配置されるものであり、片面にめっきを施す場合
には、通板する鋼ストリップ２の片面側に配置されるも
のであり、この場合、めっき浴４ｏは、鋼ストリップ２
と電気めっき電極３ａ（３ｂ）間に形成される。The electroplating electrodes 3a and 3b used in the above electroplating line are, more specifically, as shown in FIG. 5, a holding base 7 formed of a steel material covered with a Ti layer, and An electrode substrate 9 made of Ti bonded to the Ti layer of the holding substrate 7 and a P layer coated on the surface of the electrode substrate 9
t, IrO 2, etc., and when the both sides of the steel strip 2 are to be plated, they are opposed to each other with the steel strip 2 passing through the plating bath 4o interposed therebetween. When plating is performed on one side, the steel strip 2 is disposed on one side of the steel strip 2 to be passed. In this case, the plating bath 4o is
And the electroplating electrode 3a (3b).
【０００５】このような電気亜鉛めっきラインでは、め
っき浴４ｏ中を通板する鋼ストリップ２と各電極触媒８
の表面間の距離ｂは、厚みの均一なめっき層を安定確保
するために、１〜２０mmに設定されるが、鋼ストリップ
２が通板する際には、多少のばたつきを生じることは避
けられない。鋼ストリップ２にばたつきが生じた場合に
は、通板中の鋼ストリップ２の表面が電極触媒８に容易
に接触することになり、摩耗しやすい電極触媒８層に不
均一な摩耗が生じる場合が多い。そのため、電極触媒機
能が早期に低下し、めっきの均一性が早期に損なわれ良
好なめっきができなくなるという問題がある。In such an electrogalvanizing line, a steel strip 2 passing through a plating bath 4o and each electrode catalyst 8
The distance b between the surfaces is set to 1 to 20 mm in order to stably secure a plating layer having a uniform thickness. However, when the steel strip 2 passes through, it is possible to avoid occurrence of slight fluttering. Absent. When the steel strip 2 flaps, the surface of the steel strip 2 in the passing plate easily comes into contact with the electrode catalyst 8, and uneven wear may occur in the easily worn electrode catalyst 8 layer. Many. Therefore, there is a problem that the electrode catalyst function is reduced early, and the uniformity of plating is impaired at an early stage, so that good plating cannot be performed.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、上記の電極
触媒の損耗の問題を有利に解消して、長時間にわたって
電極機能を安定維持して、均一なめっき層を安定的に実
現できる電気めっきセルを提供するものである。SUMMARY OF THE INVENTION The present invention advantageously solves the above-mentioned problem of the wear of the electrode catalyst, maintains the electrode function stably for a long time, and stably realizes a uniform plating layer. A plating cell is provided.
【０００７】[0007]
【課題を解決するための手段】本発明は、以下の（１）
〜（５）の発明から構成されるものである。 （１）．電極、電極触媒を有する電気めっきセルにおい
て、電極が電極基体とその裏面側に配置した保持基体か
らなり、この電極基体と保持基体が支持部材を介して連
結され、電極基体と保持基体間に電解液またはめっき液
の流通空間が形成されており、電極触媒が電極基体の裏
面に施工されていることを特徴とする電気めっきセル。 （２）．（１）において、電極基体が、分割された複数
の分割電極基体からなり、隣接する分割電極基体間に所
定間隙が形成されていることを特徴とする電気めっきセ
ル。 （３）．（１）または（２）において、保持基体が、少
なくとも電解液またはめっき液に接触する表層を電極基
体と同種の金属で被覆した鉄系合金で形成されているこ
とを特徴とする電気めっきセル。 （４）．（１）〜（３）のいずれかにおいて、電極基
体、保持基体、支持部材がＴｉ、Ｚｒ、ＮｂまたはＴａ
で形成されていることを特徴とする電気めっきセル。 （５）．（１）〜（４）のいずれかにおいて、電極触媒
が、Ｐｔ、ＰｂＯ2 、ＴａまたはＩｒＯ2 −Ｔａ
2 Ｏ5 、またはＩｒＯ2 で形成されていることを特徴と
する電気めっきセル。The present invention provides the following (1).
To (5). (1). In an electroplating cell having an electrode and an electrode catalyst, the electrode comprises an electrode base and a holding base arranged on the back side thereof, the electrode base and the holding base are connected via a support member, and an electrolytic solution is provided between the electrode base and the holding base. An electroplating cell, wherein a flow space for a solution or a plating solution is formed, and an electrode catalyst is applied to the back surface of the electrode substrate. (2). (1) The electroplating cell according to (1), wherein the electrode substrate is composed of a plurality of divided electrode substrates, and a predetermined gap is formed between adjacent divided electrode substrates. (3). (1) The electroplating cell according to (1) or (2), wherein the holding substrate is formed of an iron-based alloy in which at least a surface layer in contact with an electrolytic solution or a plating solution is coated with the same kind of metal as the electrode substrate. (4). In any one of (1) to (3), the electrode base, the holding base, and the support member are Ti, Zr, Nb, or Ta.
An electroplating cell characterized by being formed of: (5). In any one of (1) to (4), the electrode catalyst is Pt, PbO 2 , Ta or IrO 2 -Ta
An electroplating cell formed of 2 O 5 or IrO 2 .
【０００８】[0008]
【発明の実施の形態】本発明は、基本的には、電極、電
極触媒を有する電気めっきセルであって、被めっき材に
面した電極基体と、この電極基体の裏面側（めっき材に
面する面と反対側の面）に位置する電極基体と機能的に
同種の材料からなる保持基体と、電極基体と保持基体を
電解液またはめっき液の流通空間を形成して連結する電
極基体と保持基体と機能的に同種の材料からなる支持部
材と、電極基体の裏面に施工された電極触媒層とから構
成されるものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is basically an electroplating cell having an electrode and an electrode catalyst, comprising: an electrode substrate facing a material to be plated; And a holding base made of a material that is functionally the same as the electrode base located on the side opposite to the surface to be contacted), and an electrode base that connects the electrode base and the holding base by forming a flow space for the electrolyte or plating solution. It comprises a support member made of the same material as the substrate and an electrode catalyst layer provided on the back surface of the electrode substrate.
【０００９】本発明では、電極触媒はＰｔ、ＰｂＯ2 、
ＩｒＯ2 −Ｔａ2 Ｏ5 、ＩｒＯ2 などで、電極基体の裏
面に施工し、被めっき材と直接接触することはないの
で、摩耗することはなく長時間にわたって電極機能を安
定維持して、均一なめっき層を形成することができる。
電極基体は、被めっき材と接触することがあるが、例え
ばＴｉ、Ｚｒ、Ｎｂ、Ｔａおよびこれらの合金系の材料
で形成されており、電極基体、被めっき材、電極触媒と
もに摩耗することはなく、めっき性能が低下することも
ない。In the present invention, the electrode catalyst is Pt, PbO 2 ,
IrO 2 -Ta 2 O 5 , IrO 2, etc. are applied to the back of the electrode substrate and do not come into direct contact with the material to be plated. It is possible to form a suitable plating layer.
The electrode substrate may come into contact with the material to be plated, but is made of, for example, Ti, Zr, Nb, Ta or an alloy-based material thereof, and the electrode substrate, the material to be plated, and the electrode catalyst may not be worn. Also, the plating performance does not decrease.
【００１０】なお、本発明においては、電解液、めっき
液が電極基体および電極触媒に十分に接触して電極反応
を十分に起こせるように、保持基体と電極基体間にめっ
き液の流通空間を形成する。めっき液の流通をさらに良
好にするために電極基体を複数分割して、隣接する分割
電極基体間に間隙（０．２〜１mm程度）を形成すること
も有効である。電極基体を複数分割した場合には、電極
基体の製作の容易性の確保、部分交換によるコスト削
減、形状維持の容易性の確保等の観点からも有効であ
る。In the present invention, a plating solution flow space is formed between the holding substrate and the electrode substrate so that the electrolytic solution and the plating solution sufficiently come into contact with the electrode substrate and the electrode catalyst so that the electrode reaction is sufficiently caused. I do. In order to further improve the flow of the plating solution, it is effective to divide the electrode substrate into a plurality of portions and form a gap (about 0.2 to 1 mm) between adjacent divided electrode substrates. When the electrode substrate is divided into a plurality of parts, it is effective from the viewpoints of securing the easiness of manufacturing the electrode substrate, reducing the cost by replacing parts, securing the easiness of maintaining the shape, and the like.
【００１１】[0011]
【実施例】以下に本発明の電気めっきセルの基本構成例
について詳細に説明する。 （実施例１）図１において、３ｃ、３ｄは、対向配置さ
れた電気めっきセルであり、この実施例では、鋼ストリ
ップ２の両面にめっきを施すように配置したものであ
る。７は板状の保持基体、９は板状の電極基体（バルブ
金属）で内面側に電極触媒８を配したものである。１０
は支持部材で保持基体７と電極基体９を、めっき浴４ｏ
の流通空間を形成して連結するものであり、保持基体７
と電極基体９の間隔ｃが一定になるように配置するもの
である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of the basic structure of an electroplating cell according to the present invention will be described below in detail. (Embodiment 1) In FIG. 1, reference numerals 3c and 3d denote electroplating cells arranged opposite to each other. In this embodiment, the electroplating cells are arranged so that plating is applied to both surfaces of a steel strip 2. Reference numeral 7 denotes a plate-shaped holding base, and 9 denotes a plate-shaped electrode base (valve metal) on which an electrode catalyst 8 is disposed on the inner surface side. 10
Is a supporting member, which holds the holding base 7 and the electrode base 9 in the plating bath 4o.
Are formed and connected to each other.
And the electrode base 9 is arranged so that the distance c is constant.
【００１２】支持部材１０と保持基体７および電極基体
９と連結構造は、ここでは支持部材１０を、一方の端部
に係止頭１０ｐを有し端部にネジ孔（図示省略）を有す
るボルト状に形成し、保持基体７に設けた挿通孔７ｏか
ら挿入して、係止頭１０ｐを挿通孔７ｏ部で係止して電
極基体９に設けた挿通孔９ｏに挿入し、電極基体９に設
けたネジ孔９ｓと支持部材のネジ孔にネジ１２をネジ込
むようにしているが、他の連結構造を採用してもよい。The connection structure between the support member 10, the holding base 7 and the electrode base 9 is such that the support member 10 is a bolt having a locking head 10p at one end and a screw hole (not shown) at the end. It is inserted into the insertion hole 7o provided in the holding base 7, and the locking head 10p is locked in the insertion hole 7o and inserted into the insertion hole 9o provided in the electrode base 9, and is inserted into the electrode base 9. Although the screw 12 is screwed into the provided screw hole 9s and the screw hole of the support member, other connection structures may be adopted.
【００１３】（１）電極基体９は、希流酸等を含むめっ
き液４（または電解液）に対する耐蝕性のあるＴｉ、Ｚ
ｒ、Ｎｂ、Ｔａおよびこれらの合金で形成するもので、
めっき材の種類に応じて下記のように使い分けることが
好ましい。 ・めっき材がＺｎの場合：Ｔｉ ・めっき材がＮｉの場合：Ｔｉ ・めっき材がＳｎの場合：Ｔｉ ・めっき材がＣｒの場合：Ｎｂ（使い分けの理由：Ｃｒ
めっき中ではＮｂの耐蝕性が高いため）(1) The electrode base 9 is made of Ti, Z having corrosion resistance to the plating solution 4 (or electrolytic solution) containing a dilute acid or the like.
formed of r, Nb, Ta and their alloys,
It is preferable to use differently according to the type of plating material as follows. -When the plating material is Zn: Ti-When the plating material is Ni: Ti-When the plating material is Sn: Ti-When the plating material is Cr: Nb (Reason for proper use: Cr)
(Because Nb has high corrosion resistance during plating)
【００１４】（２）保持基体７は、電極基体９を支持部
材１０を介して支持するものであり、強度を確保しコス
トを節減するため鉄系合金をベースとしたものが好まし
く、少なくともめっき液（電解液）に接触する表層に
は、電極基体９と機能的に同種の材料（同材質のものを
含む）で形成したものを用いることが好ましい。(2) The holding base 7 supports the electrode base 9 via the support member 10, and is preferably based on an iron-based alloy in order to secure strength and reduce costs. It is preferable to use a material formed of the same material (including the same material) as the electrode substrate 9 for the surface layer in contact with the (electrolyte solution).
【００１５】（３）電極触媒８は、電解（めっき）に不
可欠なものであり、電極基体９の裏面に配するものであ
り、側面の被めっき材と接触しない領域にも配すること
は有効である。この電解触媒８としては、Ｐｔ、ＰｂＯ
2 、ＩｒＯ2 −Ｔａ2 Ｏ5 、ＩｒＯ2を用いるものであ
り、めっき材に応じて下記のように使い分けるものであ
る。 ・めっき材がＺｎの場合：ＰｂＯ2 、ＩｒＯ2 −Ｔａ2
Ｏ5 、ＩｒＯ2 ・めっき材がＮｉの場合：Ｐｔ、ＩｒＯ2 −Ｔａ
2 Ｏ5 、ＩｒＯ2 ・めっき材がＳｎの場合：Ｐｔ ・めっき材がＣｒの場合：ＰｂＯ2 この電解触媒８の厚みは、１〜１００μｍが好ましい。
１μｍ未満では電極触媒として寿命が極端に短く、１０
０μｍ超では剥離しやすい。この電解触媒８は電極基体
９への施工方法としては、塗布・焼き付けが簡易な方法
である。ただし、これに限定されるものではない。(3) The electrode catalyst 8 is indispensable for electrolysis (plating), and is disposed on the back surface of the electrode substrate 9. It is effective to dispose the electrode catalyst 8 also on the side surface which is not in contact with the material to be plated. It is. Examples of the electrocatalyst 8 include Pt, PbO
2 , IrO 2 -Ta 2 O 5 , and IrO 2 are used, and are selectively used as follows according to a plating material. If the plating material is a Zn: PbO 2, IrO 2 -Ta 2
If O 5, IrO 2 · plating material is Ni: Pt, IrO 2 -Ta
2 O 5 , IrO 2 · When the plating material is Sn: Pt · When the plating material is Cr: PbO 2 The thickness of the electrolytic catalyst 8 is preferably 1 to 100 μm.
If it is less than 1 μm, the life as an electrode catalyst is extremely short,
If it exceeds 0 μm, it is easy to peel off. The application and baking of the electrolytic catalyst 8 on the electrode substrate 9 is a simple method. However, it is not limited to this.
【００１６】（４）支持部材１０は、保持基体７と電極
基体９を等間隔で保持して連結するものであり、電極基
体９と機能的に同種の材料（同材質のものを含む）で形
成し、保持基体７と電極基体９間のめっき液４の流通を
密に、かつ均一にできるように、小径の棒状体（断面形
状は主として円形、楕円、角型等で中実、中空のいずれ
でもよく、任意に選択できる）を規則的（千鳥状を含
む）に配置することが加工、施工が簡易である。(4) The supporting member 10 connects the holding base 7 and the electrode base 9 while holding them at equal intervals, and is made of a material (including the same material) functionally the same as the electrode base 9. A small-diameter rod-shaped body (mainly circular, elliptical, square, etc., having a solid or hollow cross-section) so that the plating solution 4 can be densely and uniformly distributed between the holding substrate 7 and the electrode substrate 9. It is easy to process and construct by arranging (regardlessly, which can be arbitrarily selected) regularly (including staggered).
【００１７】この支持部材１０を保持基体７と電極基体
９に固定する場合には、例えば保持基体７と電極基体９
にネジで固定したり、嵌合するなどして所定の間隔ｃで
安定的に固定することができる。保持基体７と電極基体
９間に流通空間を形成する理由は、電極反応を起させる
ために、電解液としての例えば希硫酸、めっき液として
のＺｎ2+イオン含有５％硫酸を流通させるためで、この
保持基体７と電極基体９間の間隔ｃは、これらの液の流
通を円滑にするために、少なくとも１mm以上あることが
好ましい。あまり大きくすると大型化して設備コスト
増、設置スペース増となるので、上限は適度に設定す
る。When the support member 10 is fixed to the holding base 7 and the electrode base 9, for example, the holding base 7 and the electrode base 9 are fixed.
Can be stably fixed at a predetermined interval c by screwing or fitting. The reason why the flow space is formed between the holding base 7 and the electrode base 9 is that, for example, dilute sulfuric acid as an electrolytic solution and Zn 2+ ion-containing 5% sulfuric acid as a plating solution flow in order to cause an electrode reaction. The distance c between the holding base 7 and the electrode base 9 is preferably at least 1 mm or more in order to facilitate the flow of these liquids. If the size is too large, the size will increase, and the equipment cost and installation space will increase, so the upper limit is set appropriately.
【００１８】（実施例２）図２は、めっき液の流通をよ
り確かなものにして上記電極反応を十分に起こさせるた
め、および電極基体９の製作および局部交換の容易性、
形状維持（平坦度）の容易性等の観点から、実施例１
（図１）の基本構成例をベースとし、電極基体９を複数
分割して、各分割電極基体９ａをそれぞれ複数本（ここ
では４本）の支持部材１０で保持基体７に間隔ｃを形成
して連結し、かつ、隣接する分割電極基体（ここでは四
角形状であるが、他の形状でもよい。）９ａ間に間隙
（スリット）１１を形成した電気めっき電極３ｅ、３ｆ
の場合の構成例を示したものである。(Example 2) FIG. 2 shows that the flow of the plating solution is made more reliable and the above-mentioned electrode reaction is sufficiently caused, and that the electrode base 9 is easily manufactured and exchanged locally.
Example 1 from the viewpoint of easiness of shape maintenance (flatness)
Based on the basic configuration example of FIG. 1 (FIG. 1), the electrode base 9 is divided into a plurality of parts, and each divided electrode base 9a is formed with a plurality (four in this case) of support members 10 to form an interval c on the holding base 7. Electrodes 3e, 3f in which gaps (slits) 11 are formed between adjacent divided electrode bases 9a (here, a rectangular shape, but other shapes are also possible).
In this case, a configuration example is shown.
【００１９】この電気めっき電極３ｅ、３ｆにおいて
は、分割電極基体９ａの１辺の大きさは、製作および形
状維持の容易性の観点から１０〜５００mm程度とし、そ
れらを並べ合わせることが好ましい。このように分割し
た場合には、一辺が５００〜２５００mmの大きさの形状
精度の良好な電極基体９を容易に得ることができる。な
お、電極基体９ａ間の間隙１１の幅ｄは、０．１〜１．
０mm程度あれば、上記電極反応を十分に起こさせること
ができる。In the electroplated electrodes 3e and 3f, the size of one side of the divided electrode base 9a is preferably about 10 to 500 mm from the viewpoint of easy production and shape maintenance, and it is preferable to arrange them. When divided in this way, it is possible to easily obtain an electrode substrate 9 having a shape of 500 to 2500 mm on one side and good shape accuracy. The width d of the gap 11 between the electrode bases 9a ranges from 0.1 to 1.
If it is about 0 mm, the above-mentioned electrode reaction can be sufficiently caused.
【００２０】なお、電気めっき電極３ｅと３ｆを対向配
置する場合には、電気めっき電極３ｅと３ｆがそれぞれ
同じ構造であることは不可欠ではない。電気めっきセル
の配置条件によっては、めっき液４の流通状態をコント
ロールするために、例えば電極基体９の分割条件、間隙
ｄの形成条件等に差をつけることも有効である。また、
図１の電気めっき電極３ｃ（３ｄ）と図２の電気めっき
電極３ｅ（３ｆ）を対向配置することも考慮することが
できる。When the electroplated electrodes 3e and 3f are arranged to face each other, it is not essential that the electroplated electrodes 3e and 3f have the same structure. Depending on the arrangement conditions of the electroplating cells, it is effective to make a difference in, for example, the conditions for dividing the electrode substrate 9 and the conditions for forming the gap d in order to control the flow state of the plating solution 4. Also,
It can be considered that the electroplated electrode 3c (3d) in FIG. 1 and the electroplated electrode 3e (3f) in FIG.
【００２１】[0021]
【実験例】実施例１と実施例２の電気めっき電極３ｂ〜
３ｆを用い、各種の電気めっきラインにおいて、めっき
材をＺｎ、Ｓｎ、Ｃｒ、Ｎｉとして、厚み１mmの鋼スト
リップ２を電気めっきセル表面から距離９〜１０mm離れ
た位置を通板させながら厚み２０〜３０μｍの電気めっ
きを行い、電気めっきセルの性能を評価した。その評価
結果と、実験条件を比較例の場合とともに表１に示す。
なお、比較例は、図５に示した従来の電気めっきセルの
場合である。この実験例での評価結果での通電特性と
は、電極反応に必要な通電が行われていたかどうかを示
すものである。また、耐久性とは、電極触媒の損耗が十
分抑制できたかどうかを示すものである。[Experimental example] Electroplating electrodes 3b of Examples 1 and 2
Using 3f, in various electroplating lines, the plating material is Zn, Sn, Cr, and Ni, and a steel strip 2 having a thickness of 1 mm is passed through a position at a distance of 9 to 10 mm from the surface of the electroplating cell, and a thickness of 20 to 10 mm. Electroplating of 30 μm was performed, and the performance of the electroplating cell was evaluated. Table 1 shows the evaluation results and the experimental conditions together with the case of the comparative example.
The comparative example is the case of the conventional electroplating cell shown in FIG. The energization characteristics in the evaluation results in this experimental example indicate whether energization required for an electrode reaction has been performed. The durability indicates whether the wear of the electrode catalyst has been sufficiently suppressed.
【００２２】[0022]
【表１】 [Table 1]
【００２３】本発明の各実験例１〜２４においては、通
電特性はいずれも満足できるものであり、電極触媒の損
耗を、比較例より格段に少なくすることができ、電気め
っきセル全体としての寿命を大幅に延長できることが確
認された。なかでも電極基体を４０枚に分割した、実験
例３〜５、９〜１２、１５〜１８、２１〜２４の場合に
は、通電特性が比較例に比べて全く遜色がなかった。こ
れは電極基体、支持部材、電極触媒間の通電が十分に行
われ、電極基体の分割と分割基体間の間隙効果により、
めっき液が十分に流通した結果、電極反応が十分に行わ
れた結果と考えられる。In each of Experimental Examples 1 to 24 of the present invention, the current-carrying characteristics are all satisfactory, and the wear of the electrode catalyst can be remarkably reduced as compared with the comparative example. It has been confirmed that can be greatly extended. In particular, in the case of Experimental Examples 3 to 5, 9 to 12, 15 to 18, and 21 to 24 in which the electrode substrate was divided into 40 sheets, the current-carrying characteristics were not inferior to those of the comparative example. This is because the current flow between the electrode substrate, the support member and the electrode catalyst is sufficiently performed, and the division of the electrode substrate and the gap effect between the divided substrates cause
It is considered that as a result of the plating solution flowing sufficiently, the electrode reaction was sufficiently performed.
【００２４】なお、本発明の電気めっきセルは、上記の
実施例、実験例に限定されるものではない。例えば、本
発明の電気めっきセルの適用は、鋼ストリップの水平型
の電気めっきラインに限定されるものではなく、鋼板以
外の金属板を対象した場合を含み、垂直型の電気めっき
ラインでの適用も可能であり、片面、両面のいずれの電
気めっきにも適用できる。It should be noted that the electroplating cell of the present invention is not limited to the above embodiments and experimental examples. For example, the application of the electroplating cell of the present invention is not limited to the horizontal type electroplating line of steel strip, but includes the case where a metal plate other than a steel plate is targeted, and is applied to a vertical type electroplating line. It is also possible to apply to both single-sided and double-sided electroplating.
【００２５】また、例えば、電極基体、保持基体、支持
部材の構造、寸法、形状、材料の組み合わせ、連結構造
条件、電気めっきセルの配置等については、被めっき材
条件（材料、サイズ）、通板条件（速度、張力）、めっ
き材、片面または両面のめっき条件（温度、速度、厚み
等）等に応じて選択されるものであり、上記本発明の請
求項の範囲内で変更があるものである。For example, regarding the structure, dimensions, shape, combination of materials, connection structure conditions, arrangement of electroplating cells, etc. of the electrode base, the holding base, and the support member, the conditions of the material to be plated (material, size), It is selected according to plate conditions (speed, tension), plating material, plating conditions on one side or both sides (temperature, speed, thickness, etc.), etc., and is changed within the scope of the claims of the present invention. It is.
【００２６】[0026]
【発明の効果】本発明の電気めっきセルでは、電極基体
と保持基体を支持部材を介して、めっき液（電解液）の
流通空間を形成して連結し、電極触媒を電極基体の裏面
に配したので、電極触媒が被めっき材と直接に接触する
ことがなく損耗が極めて軽微で、長時間にわたって電極
機能を安定維持して、通電不良もなく均一なめっき層を
安定的に実現できる。また、電極基体を複数分割して隣
接する分割電極基体間に所定の間隙を形成することによ
り、めっき液の流通を良くして、電極反応を良好にする
ことができるし、電極基体を複数分割した場合には、電
極基体の製作、局部交換が容易であり、形状維持も容易
である。According to the electroplating cell of the present invention, the electrode substrate and the holding substrate are connected via a support member to form a space for flowing a plating solution (electrolyte solution), and the electrode catalyst is disposed on the back surface of the electrode substrate. Therefore, the electrode catalyst does not come into direct contact with the material to be plated, the wear is extremely small, the electrode function is stably maintained for a long time, and a uniform plating layer can be stably realized without poor current. Further, by dividing the electrode substrate into a plurality and forming a predetermined gap between adjacent divided electrode substrates, it is possible to improve the flow of the plating solution, improve the electrode reaction, and divide the electrode substrate into a plurality. In such a case, it is easy to manufacture the electrode base, replace the local part, and easily maintain the shape.
【図１】（ａ）図は、本発明の電気めっきセルの実施例
１を示す部分側断面説明図、（ｂ）図は、（ａ）図の平
面説明図。FIG. 1 (a) is a partial cross-sectional view showing Example 1 of an electroplating cell of the present invention, and FIG. 1 (b) is a plan view of FIG. 1 (a).
【図２】（ａ）図は、本発明の電気めっきセルの実施例
２を示す部分側断面説明図、（ｂ）図は、（ａ）図の平
面説明図。FIG. 2A is a partial cross-sectional explanatory view showing Example 2 of the electroplating cell of the present invention, and FIG. 2B is a plan explanatory view of FIG.
【図３】公知の水平型の電気めっきセルを用いた電気め
っきラインの構成例を示す側断面説明図。FIG. 3 is an explanatory side sectional view showing a configuration example of an electroplating line using a known horizontal electroplating cell.
【図４】公知の垂直型の電気めっきセルを用いた電気め
っきラインの構成例を示す側断面説明図。FIG. 4 is an explanatory side sectional view showing a configuration example of an electroplating line using a known vertical electroplating cell.
【図５】従来の電気めっきセルの構造例を示す側断面説
明図。FIG. 5 is an explanatory side sectional view showing a structural example of a conventional electroplating cell.
１ａ、１ｂ コンダクタロール ２ 鋼ストリップ ２ｚ めっき鋼板（鋼帯） ３ａ、３ｂ 電気めっき電極 ３ｃ、３ｄ 電気めっき電極 ３ｅ、３ｆ 電気めっき電極 ４ めっき液（電解液） ４ｏ めっき浴 ５ めっき層 ６ ロール ７ 保持基体 ７ａ 被覆層 ８ 電極触媒 ９ 電極基体 ９ａ 分割電極基体 ９ｏ 挿通孔 ９ｓ ネジ孔 １０ 支持部材 １０ｏ 挿通孔 １０ｐ 係止頭 １０ｓ ネジ孔 １１ 間隙（スリット） １２ ネジ1a, 1b Conductor roll 2 Steel strip 2z Plated steel plate (steel strip) 3a, 3b Electroplated electrode 3c, 3d Electroplated electrode 3e, 3f Electroplated electrode 4 Plating solution (electrolyte) 4o Plating bath 5 Plating layer 6 Roll 7 Retention Base 7a Coating layer 8 Electrode catalyst 9 Electrode base 9a Divided electrode base 9o Insertion hole 9s Screw hole 10 Support member 10o Insertion hole 10p Locking head 10s Screw hole 11 Gap (slit) 12 Screw
Claims (5)
において、電極が電極基体とその裏面側に配置した保持
基体からなり、この電極基体と保持基体が支持部材を介
して連結され、電極基体と保持基体間に電解液またはめ
っき液の流通空間が形成されており、電極触媒が電極基
体の裏面に施工されていることを特徴とする電気めっき
セル。In an electroplating cell having an electrode and an electrode catalyst, the electrode comprises an electrode base and a holding base disposed on the back side thereof, and the electrode base and the holding base are connected via a supporting member, and the electrode base and the holding base are connected to each other. An electroplating cell, wherein a flow space for an electrolytic solution or a plating solution is formed between holding substrates, and an electrode catalyst is applied to the back surface of the electrode substrate.
基体からなり、隣接する分割電極基体間に所定間隙が形
成されていることを特徴とする請求項１記載の電気めっ
きセル。2. The electroplating cell according to claim 1, wherein the electrode substrate comprises a plurality of divided electrode substrates, and a predetermined gap is formed between adjacent divided electrode substrates.
っき液に接触する表層を電極基体と同種の金属で被覆し
た鉄系合金で形成されていることを特徴とする請求項１
または請求項２記載の電気めっきセル。3. The holding substrate is formed of an iron-based alloy in which at least a surface layer in contact with an electrolytic solution or a plating solution is coated with a metal of the same kind as the electrode substrate. 1
Or an electroplating cell according to claim 2.
Ｚｒ、ＮｂまたはＴａで形成されていることを特徴とす
る請求項１〜請求項３のいずれかに記載の電気めっきセ
ル。4. An electrode substrate, a holding substrate, and a supporting member are made of Ti,
The electroplating cell according to any one of claims 1 to 3, wherein the electroplating cell is formed of Zr, Nb, or Ta.
はＩｒＯ2 −Ｔａ2Ｏ5 、またはＩｒＯ2 で形成されて
いることを特徴とする請求項１〜請求項４のいずれかに
記載の電気めっきセル。5. The method according to claim 1, wherein the electrode catalyst is formed of Pt, PbO 2 , Ta or IrO 2 —Ta 2 O 5 , or IrO 2 . Electroplating cell.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000103337A JP2001288599A (en) | 2000-04-05 | 2000-04-05 | Electric-plating cell |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000103337A JP2001288599A (en) | 2000-04-05 | 2000-04-05 | Electric-plating cell |
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| Publication Number | Publication Date |
|---|---|
| JP2001288599A true JP2001288599A (en) | 2001-10-19 |
Family
ID=18617071
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|---|---|---|---|
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003105598A (en) * | 2001-09-27 | 2003-04-09 | Tdk Corp | Electrode device |
-
2000
- 2000-04-05 JP JP2000103337A patent/JP2001288599A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003105598A (en) * | 2001-09-27 | 2003-04-09 | Tdk Corp | Electrode device |
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