JP2001287982A - Susceptor and method for producing the same - Google Patents
Susceptor and method for producing the sameInfo
- Publication number
- JP2001287982A JP2001287982A JP2000103665A JP2000103665A JP2001287982A JP 2001287982 A JP2001287982 A JP 2001287982A JP 2000103665 A JP2000103665 A JP 2000103665A JP 2000103665 A JP2000103665 A JP 2000103665A JP 2001287982 A JP2001287982 A JP 2001287982A
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- composite conductive
- sintered body
- susceptor
- internal electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Ceramic Products (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、サセプタ及びその
製造方法に関し、特にサセプタの内部に内蔵された内部
電極に確実に通電可能なサセプタ、及び該サセプタを歩
留まりよく廉価に製造することが可能なサセプタの製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a susceptor and a method of manufacturing the same, and more particularly, to a susceptor capable of reliably energizing an internal electrode built in the susceptor, and capable of manufacturing the susceptor with good yield and low cost. The present invention relates to a method for manufacturing a susceptor.
【０００２】[0002]
【従来の技術】近年、ＩＣ、ＬＳＩ、ＶＬＳＩ等の半導
体の製造工程において使用されるドライエッチング装置
や、ＣＶＤ装置等においては、エッチングやＣＶＤによ
る成膜をウエハ毎に均一に行うため、半導体ウエハ、液
晶基板ガラス、プリント基板等の板状試料を、１枚ずつ
処理する枚葉化がすすんでいる。この枚葉式プロセスに
おいては、板状試料を１枚ずつ処理室内に保持するため
に、この板状試料をサセプタと称される試料台（台座）
に載置し、所定の処理を施している。このサセプタは、
プラズマ中での使用に耐え、かつ高温での使用に耐え得
る必要があることから、耐プラズマ性に優れ、熱伝導率
が大きいことが要求される。このようなサセプタとして
は、耐プラズマ性、熱伝導性に優れたセラミックス焼結
体からなるサセプタが使用されている。2. Description of the Related Art In recent years, in a dry etching apparatus or a CVD apparatus used in a manufacturing process of semiconductors such as ICs, LSIs, VLSIs, etc., a semiconductor wafer is formed in order to uniformly form a film by etching or CVD for each wafer. In addition, sheet-like processing of processing plate-like samples such as liquid crystal substrate glass and printed circuit boards one by one is progressing. In this single-wafer process, in order to hold the plate-like samples one by one in the processing chamber, the plate-like sample is placed on a sample stage (pedestal) called a susceptor.
And subjected to predetermined processing. This susceptor
Since it is necessary to withstand use in plasma and withstand use at high temperature, it is required to have excellent plasma resistance and high thermal conductivity. As such a susceptor, a susceptor made of a ceramic sintered body having excellent plasma resistance and thermal conductivity is used.
【０００３】このようなサセプタには、その内部に電荷
を発生させて静電吸着力で板状試料を固定するための静
電チャック用電極、通電発熱させて板状試料を加熱する
ためのヒータ電極、高周波電力を通電してプラズマを発
生させてプラズマ処理するためのプラズマ発生用電極等
の内部電極を配設したものがある。Such a susceptor has an electrostatic chuck electrode for generating electric charges therein and fixing the plate-like sample by electrostatic attraction, and a heater for energizing and heating the plate-like sample. 2. Description of the Related Art Some electrodes are provided with internal electrodes such as electrodes for generating plasma for generating plasma by applying high-frequency power to perform plasma processing.
【０００４】図３は、このような内部電極が内蔵された
サセプタの一例を示したものである。サセプタ５は、板
状試料（図示せず）を載置する載置板１と、この載置板
１を支える支持板３と、この載置板１と支持板３に挟ま
れて保持される内部電極２と、この内部電極２に接する
ように支持板３内に埋設され、電流を内部電極２に供給
する給電用端子４，４からなる。FIG. 3 shows an example of a susceptor having such an internal electrode built therein. The susceptor 5 has a mounting plate 1 on which a plate-shaped sample (not shown) is mounted, a support plate 3 for supporting the mounting plate 1, and is held between the mounting plate 1 and the support plate 3. The internal electrode 2 includes power supply terminals 4 and 4 buried in the support plate 3 so as to be in contact with the internal electrode 2 and supply current to the internal electrode 2.
【０００５】このようなサセプタ５の製造方法として
は、例えば、予め支持板３に、給電用端子４，４を内部
電極２につなげるための固定孔を形成し、この固定孔に
金属製の給電用端子４，４を固定し、この給電端子４，
４を有する支持板３と、載置板１との間に、タングステ
ン等の高融点金属からなる内部電極２を配し、これらを
各種接合剤により加圧下にて接合する方法が挙げられ
る。しかしながら、このようなサセプタ５の製造方法に
おいては、載置板１と、給電用端子４，４を有する支持
板３との接合の際に、前記載置板１や前記支持板３の熱
膨張率と、給電用端子４，４の熱膨張率とを近似させる
のが困難であった。また給電用端子４，４を形成する金
属には、耐熱性に富む高価な高融点金属を用いる必要が
あった。As a method of manufacturing such a susceptor 5, for example, a fixing hole for connecting the power supply terminals 4 and 4 to the internal electrode 2 is formed in the support plate 3 in advance, and a metal power supply hole is formed in the fixing hole. Terminals 4 and 4 are fixed.
A method in which an internal electrode 2 made of a high-melting-point metal such as tungsten is arranged between the support plate 3 having the base member 4 and the mounting plate 1 and these are joined under pressure with various joining agents. However, in such a method of manufacturing the susceptor 5, when the mounting plate 1 is joined to the supporting plate 3 having the power supply terminals 4 and 4, the thermal expansion of the mounting plate 1 and the supporting plate 3 is performed. It was difficult to approximate the rate and the thermal expansion coefficient of the power supply terminals 4 and 4. Further, as the metal forming the power supply terminals 4 and 4, it was necessary to use an expensive refractory metal having high heat resistance.
【０００６】さらに、加圧下での高温接合の際に、金属
製の給電用端子４，４のヤング率と、載置板１や支持板
３のヤング率が大きく異なるため、大きな圧力で加圧す
ると、これらの変形率の差により、これらに破壊が生じ
るため、十分に加圧することができずに、給電用端子
４，４と内部電極２との電気的な連結が十分でなかった
り、内部電極２と載置板１との間に空隙が生じて、内部
電極２の用途により、静電吸着性能が低下したり、ヒー
タ加熱性能が低下したり、載置板１上にプラズマが発生
しなかったりすることがあり、更に接合剤が露出して接
合剤成分が揮発、飛散して板状試料を汚染することもあ
った。Further, during the high-temperature bonding under pressure, the Young's modulus of the metal power supply terminals 4 and 4 and the Young's modulus of the mounting plate 1 and the support plate 3 are greatly different. Then, because of the difference between these deformation rates, they are destroyed, so that sufficient pressure cannot be applied, and the electric connection between the power supply terminals 4 and 4 and the internal electrode 2 is not sufficient, A gap is generated between the electrode 2 and the mounting plate 1, and depending on the use of the internal electrode 2, the electrostatic adsorption performance is reduced, the heater heating performance is reduced, or plasma is generated on the mounting plate 1. In some cases, the bonding agent was exposed, and the bonding agent component was volatilized and scattered, thereby contaminating the plate sample.
【０００７】そこで、これらの不都合を解消するため、
サセプタ５内部に内部電極２を形成する方法として、例
えば、所定のパターン形状で、内部電極２となる電極材
料を支持板３上に印刷し、この支持板３と、載置板１と
を、前記電極材料が印刷された面を介して重ね合わせて
一体焼結した後、内部電極２とサセプタ５の外部との間
に導電回路を形成するために、支持板３に、内部電極２
に到達するように孔を穿設する作業を行い、この孔にリ
ード線等の金属製給電用端子４，４を収め、ろう材を介
して金属製給電用端子４，４と内部電極２とを接合する
製造方法が一般的に行われている。Therefore, in order to solve these inconveniences,
As a method of forming the internal electrode 2 inside the susceptor 5, for example, an electrode material to be the internal electrode 2 is printed on the support plate 3 in a predetermined pattern shape, and the support plate 3 and the mounting plate 1 are After the electrode material is superposed and integrally sintered through the surface on which the electrode material is printed, a support circuit 3 is formed on the support plate 3 to form a conductive circuit between the internal electrode 2 and the outside of the susceptor 5.
The metal power supply terminals 4 and 4 such as lead wires are placed in the holes, and the metal power supply terminals 4 and 4 and the internal electrode 2 are connected to each other through a brazing material. Is generally performed.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、このよ
うなサセプタ５の製造方法における、上記給電用端子
４，４を固定するための孔の穿設作業は、支持板３の表
面から掘り進み、内部電極２に接触する面で正確に孔の
形成を止めなくてはならない。また、内部電極２と給電
用端子４，４は良好に接触し、電気的に完全に接合され
ることが要求されるが、内部電極２まで到達していない
場合はもちろん、内部電極２を貫通してしまった場合に
は電気的な接合は不完全となり、内部電極２への通電は
不確実なものとなってしまう。また、一般に内部電極２
の厚さは数十μmオーダーであり、内部電極２の厚さの
オーダー以下の穿設速度で加工を行う必要上、穿設作業
は極めて効率の悪い作業となり、また、正確に止め位置
を決定することができないため、加工歩留まり低下の原
因ともなっている。さらに、内部電極２が、双極型静電
チャック用電極のように、内部電極２のパターン平面上
の給電用端子４，４の位置が重要となる場合は、Ｘ線透
過装置等を用いて穿設位置をモニタリングしながら慎重
に穿設作業を行う必要があり、手間を要する作業となっ
てしまう。However, in such a method of manufacturing the susceptor 5, the work of forming the holes for fixing the power supply terminals 4 and 4 is performed by digging from the surface of the support plate 3, and The formation of the hole must be stopped exactly at the surface that contacts the electrode 2. In addition, it is required that the internal electrode 2 and the power supply terminals 4 and 4 be in good contact with each other and be electrically joined completely. In such a case, the electrical connection becomes incomplete, and the energization to the internal electrodes 2 becomes uncertain. Generally, the internal electrode 2
Thickness is on the order of several tens of μm, and it is necessary to perform the drilling at a speed less than the order of the thickness of the internal electrode 2, and the drilling work is extremely inefficient, and the stop position is accurately determined. Since it cannot be performed, it also causes a reduction in processing yield. Further, when the position of the power supply terminals 4 and 4 on the pattern plane of the internal electrode 2 is important, such as an electrode for a bipolar electrostatic chuck, the internal electrode 2 is pierced using an X-ray transmission device or the like. It is necessary to carefully perform the drilling operation while monitoring the installation position, which is a time-consuming operation.
【０００９】このように、従来においては、内部電極２
と、給電用端子４，４を正確な位置に形成し、確実に内
部電極２に通電可能なサセプタ５、及び該サセプタ５を
歩留まりよく廉価に製造することが可能なサセプタ５の
製造方法として適切なものがなかった。本発明は、これ
らの問題点に鑑みてなされたものであり、その為に具体
的に設定された課題は、サセプタの内部に形成された内
部電極に確実に通電可能なサセプタ、及び該サセプタを
歩留まりよく廉価に製造することが可能なサセプタの製
造方法を提供することにある。As described above, conventionally, the internal electrode 2
And a susceptor 5 capable of forming the power supply terminals 4 and 4 at accurate positions to reliably supply current to the internal electrodes 2 and a method of manufacturing the susceptor 5 capable of manufacturing the susceptor 5 with good yield and at low cost. There was nothing. The present invention has been made in view of these problems, and a problem specifically set for that purpose is to provide a susceptor capable of reliably supplying an internal electrode formed inside the susceptor, and a susceptor. An object of the present invention is to provide a method for manufacturing a susceptor that can be manufactured at a low cost with good yield.
【００１０】[0010]
【課題を解決するための手段】本発明者らは、上記課題
解決のため鋭意検討した結果、特定組成の導電性材料に
より内部電極と給電用端子を形成し、載置板と支持板と
を加圧下で熱処理して一体化することにより上記課題を
効率よく解決し得ることを知見し、本発明を完成するに
至った。即ち、第１の発明においては、試料を載置する
載置板と、この載置板と一体化される支持板と、これら
載置板と支持板との間に設けられた内部電極と、この内
部電極に接するように前記支持板に貫通して設けられた
給電用端子とからなり、前記内部電極と給電用端子がア
ルミナ−タンタルカーバイト複合導電性焼結体、アルミ
ナ−タングステン複合導電性焼結体、及びアルミナ−炭
化珪素複合導電性焼結体のうちいずれかの複合導電性焼
結体からなるものであるサセプタを提案する。Means for Solving the Problems The inventors of the present invention have made intensive studies to solve the above problems, and as a result, formed an internal electrode and a power supply terminal with a conductive material having a specific composition, and formed a mounting plate and a support plate. The inventors have found that the above problem can be solved efficiently by heat treatment under pressure and integration, and have completed the present invention. That is, in the first invention, a mounting plate for mounting a sample, a support plate integrated with the mounting plate, an internal electrode provided between the mounting plate and the support plate, A power supply terminal provided through the support plate so as to be in contact with the internal electrode, wherein the internal electrode and the power supply terminal are formed of an alumina-tantalum carbide composite conductive sintered body, an alumina-tungsten composite conductive body. A susceptor made of any one of a sintered body and an alumina-silicon carbide composite conductive sintered body is proposed.
【００１１】第２の発明においては、第１の発明におい
て、前記のアルミナ−タンタルカーバイト複合導電性焼
結体が５４〜７１重量％のタンタルカーバイトを含有す
るものであるサセプタを提供する。第３の発明において
は、請求項１の発明において、前記のアルミナ−タング
ステン複合導電性焼結体が５４〜９５重量％のタングス
テンを含有するものであるサセプタを提供する。第４の
発明においては、第１の発明において、前記のアルミナ
−炭化珪素複合導電性焼結体が５〜３０重量％の炭化珪
素を含有するものであるサセプタを提供する。第５の発
明においては、第１〜第４の発明において、前記載置板
と前記支持板がアルミナ基焼結体からなるものであるサ
セプタを提供する。According to a second aspect of the present invention, there is provided the susceptor according to the first aspect, wherein the alumina-tantalum carbide composite conductive sintered body contains 54 to 71% by weight of tantalum carbide. According to a third aspect, there is provided a susceptor according to the first aspect, wherein the alumina-tungsten composite conductive sintered body contains 54 to 95% by weight of tungsten. According to a fourth aspect, there is provided the susceptor according to the first aspect, wherein the alumina-silicon carbide composite conductive sintered body contains 5 to 30% by weight of silicon carbide. According to a fifth aspect of the present invention, there is provided the susceptor according to the first to fourth aspects, wherein the mounting plate and the support plate are made of an alumina-based sintered body.
【００１２】第５の発明においては、支持板に固定孔を
形成し、ついで、この固定孔にアルミナ−タンタルカー
バイト複合導電性焼結体、アルミナ−タングステン複合
導電性焼結体、及びアルミナ−炭化珪素複合導電性焼結
体のうちのいずれかの複合導電性焼結体からなる給電用
端子を、前記支持板を貫通するようにして固定し、つい
で、この給電用端子を保持する支持板上に、給電用端子
に接するように、アルミナ−タンタルカーバイト複合導
電性材料、アルミナ−タングステン複合導電性材料、及
びアルミナ−炭化珪素複合導電性材料のうちのいずれか
の複合導電性材料からなる塗布材を塗布して、乾燥さ
せ、ついで、この塗布材の塗布面を介して支持板と載置
板とを重ね合わせ、加圧下にて熱処理することによりこ
れらを一体化すると共に、これらの支持板と載置板との
間に、前記の複合導電性材料に対応する複合導電性焼結
体からなる内部電極を形成することを特徴とするサセプ
タの製造方法を提供する。In a fifth aspect of the present invention, a fixing hole is formed in the support plate, and the alumina-tantalum carbide composite conductive sintered body, the alumina-tungsten composite conductive sintered body, and the alumina-fixing hole are formed in the fixing hole. A power supply terminal made of any one of the composite conductive sintered bodies of the silicon carbide composite conductive sintered body is fixed so as to penetrate the support plate, and then a support plate for holding the power supply terminal On the upper side, made of any one of an alumina-tantalum carbide composite conductive material, an alumina-tungsten composite conductive material, and an alumina-silicon carbide composite conductive material so as to be in contact with the power supply terminal. The coating material is applied, dried, and then the support plate and the mounting plate are overlapped with each other through the coating surface of the coating material, and these are integrated by heat treatment under pressure. In, between the mounting plate and these support plates, to provide a method of manufacturing a susceptor, which comprises forming an inner electrode made of a composite conductive sintered body corresponding to the composite conductive material.
【００１３】[0013]
【発明の実施の形態】以下、発明の実施の形態を掲げ、
本発明を詳述する。なお、この発明の実施の形態は、特
に限定のない限り発明の内容を制限するものではない。
図１は、本発明のサセプタの一例を示したものである。
サセプタ１５は、板状試料を載置する載置板１１と、こ
の載置板１１と一体化される支持板１３と、この載置板
１１と支持板１３との間に形成された内部電極１２と、
この内部電極１２に通じ、前記支持板１３内部に貫通す
るようにして設けられた給電用端子１４、１４とからな
るものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described.
The present invention will be described in detail. Note that the embodiments of the present invention do not limit the contents of the invention unless otherwise limited.
FIG. 1 shows an example of the susceptor of the present invention.
The susceptor 15 includes a mounting plate 11 on which a plate-shaped sample is mounted, a support plate 13 integrated with the mounting plate 11, and an internal electrode formed between the mounting plate 11 and the support plate 13. 12 and
The power supply terminals 14 are provided so as to communicate with the internal electrodes 12 and penetrate inside the support plate 13.
【００１４】上記載置板１１および支持板１３は、その
重ね合わせ面の形状を同じくし、ともに、アルミナ基焼
結体からなるものである。前記のアルミナ基焼結体とし
ては、特に限定されるものではなく、一般に市販されて
いるものでよい。また、前記アルミナ基焼結体は、焼結
性や耐プラズマ性を向上させるために、イットリア（Ｙ
2Ｏ3）、カルシア（ＣａＯ）、マグネシア（ＭｇＯ）、
炭化珪素（ＳｉＣ）、チタニア（ＴｉＯ2）から選択さ
れた１種または２種以上を合計で０．１〜１０．０重量
％含有するようにしてもよい。The mounting plate 11 and the support plate 13 have the same overlapping surface shape, and both are made of an alumina-based sintered body. The alumina-based sintered body is not particularly limited, and may be a commercially available one. The alumina-based sintered body is made of Yttria (Y) to improve sinterability and plasma resistance.
2 O 3 ), calcia (CaO), magnesia (MgO),
One or more selected from silicon carbide (SiC) and titania (TiO 2 ) may be contained in a total amount of 0.1 to 10.0% by weight.
【００１５】上記内部電極１２は、電荷を発生させて静
電吸着力で板状試料を固定するための静電チャック用電
極、通電発熱させて板状試料を加熱するためのヒータ電
極、高周波電力を通電してプラズマを発生させてプラズ
マ処理するためのプラズマ発生用電極等として用いられ
るもので、その用途によって、その形状や、大きさが適
宜調整される。この内部電極１２は、アルミナ−タンタ
ルカーバイト複合導電性焼結体、アルミナ−タングステ
ン複合導電性焼結体、及びアルミナ−炭化珪素複合導電
性焼結体のうちいずれかの複合導電性焼結体からなる。The internal electrode 12 is an electrode for an electrostatic chuck for generating an electric charge and fixing the plate-shaped sample by electrostatic attraction, a heater electrode for heating the plate-shaped sample by energizing and generating heat, and a high frequency power. Is used as a plasma generating electrode or the like for performing plasma processing by generating plasma by applying a current, and its shape and size are appropriately adjusted depending on the application. The internal electrode 12 is made of any one of an alumina-tantalum carbide composite conductive sintered body, an alumina-tungsten composite conductive sintered body, and an alumina-silicon carbide composite conductive sintered body. Consists of
【００１６】そして、これらの複合導電性焼結体のう
ち、アルミナ−タンタルカーバイト複合導電性焼結体と
アルミナ−タングステン複合導電性焼結体とは、特に低
い体積固有抵抗値（１×１０-1〜１×１０-5Ωｃｍ）を
有するため、静電チャック用電極、通電発熱させて板状
試料を加熱するためのヒータ電極、及び高周波電力を通
電してプラズマを発生させてプラズマ処理するためのプ
ラズマ発生用電極に好適に用いられる。一方、アルミナ
−炭化珪素複合導電性焼結体は、他の複合導電性焼結体
よりも高い体積固有抵抗値（１×１０4〜１×１０5Ωｃ
ｍ）を有するため、静電チャック用電極、通電発熱させ
て板状試料を加熱するためのヒータ電極に好適に用いら
れる。Among these composite conductive sintered bodies, the alumina-tantalum carbide composite conductive sintered body and the alumina-tungsten composite conductive sintered body have particularly low volume resistivity (1 × 10 4). −1 to 1 × 10 −5 Ωcm), an electrode for an electrostatic chuck, a heater electrode for heating a plate-shaped sample by energizing and heating, and generating a plasma by applying a high frequency power to perform a plasma process. Used for the electrode for plasma generation. On the other hand, the alumina-silicon carbide composite conductive sintered body has a higher volume resistivity (1 × 10 4 to 1 × 10 5 Ωc) than other composite conductive sintered bodies.
m), it is suitably used as an electrode for an electrostatic chuck and a heater electrode for heating a plate-like sample by energizing and heating.
【００１７】上記アルミナ−タンタルカーバイト複合導
電性焼結体としては、タンタルカーバイトの含有量が５
４〜７１重量％であるものであることが望ましい。タン
タルカーバイトの含有量を５４〜７１重量％としたの
は、５４重量％未満では内部電極１２の抵抗値が高くな
り、内部電極１２として機能しなくなり、７１重量％を
超えると、内部電極１２の熱膨張率が、前記載置板１１
と前記支持板１３を形成するアルミナ基焼結体と大きく
異なり、後工程の加圧熱処理により熱応力破壊するため
である。The alumina-tantalum carbide composite conductive sintered body has a tantalum carbide content of 5%.
Desirably, the content is 4 to 71% by weight. The reason why the content of tantalum carbide is set to 54 to 71% by weight is that when the content is less than 54% by weight, the resistance value of the internal electrode 12 increases, and the internal electrode 12 does not function. Has a thermal expansion coefficient of
This is greatly different from the alumina-based sintered body forming the support plate 13, because thermal stress destruction is caused by pressure heat treatment in a later step.
【００１８】また、上記アルミナ−タングステン複合導
電性焼結体としては、タングステンの含有量が５４〜９
５重量％であるものであることが望ましい。タングステ
ンの含有量を５４〜９５重量％としたのは、５４重量％
未満では内部電極１２の抵抗値が高くなり、内部電極１
２として機能しなくなり、９５重量％を超えると、内部
電極１２の熱膨張率が、前記載置板１１と前記支持板１
３を形成するアルミナ基焼結体と大きく異なり、後工程
の加圧熱処理により熱応力破壊するためである。Further, the alumina-tungsten composite conductive sintered body has a tungsten content of 54 to 9%.
Preferably, it is 5% by weight. The reason why the content of tungsten is set to 54 to 95% by weight is that 54% by weight is used.
If it is less than 1, the resistance value of the internal electrode 12 increases, and the internal electrode 1
When the internal electrode 12 exceeds 95% by weight, the coefficient of thermal expansion of the internal electrode 12 becomes less than that of the mounting plate 11 and the supporting plate 1.
This is because it is significantly different from the alumina-based sintered body forming No. 3 and is thermally broken by a pressure heat treatment in a later step.
【００１９】更に、上記アルミナ−炭化珪素複合導電性
焼結体としては、炭化珪素の含有量が５〜３０重量％で
あるものであることが望ましい。炭化珪素の含有量を５
〜３０重量％としたのは、５重量％未満では内部電極１
２の抵抗値が高くなり、内部電極１２として機能しなく
なり、３０重量％を超えると、内部電極１２の熱膨張率
が、前記載置板１１と前記支持板１３を形成するアルミ
ナ基焼結体と大きく異なり、後工程の加圧熱処理により
熱応力破壊するためであるFurthermore, it is desirable that the alumina-silicon carbide composite conductive sintered body has a silicon carbide content of 5 to 30% by weight. Silicon carbide content of 5
The reason why the content is set to 30% by weight is that the internal electrode 1
2 becomes high and does not function as the internal electrode 12, and if it exceeds 30% by weight, the coefficient of thermal expansion of the internal electrode 12 becomes less than that of the alumina-based sintered body forming the mounting plate 11 and the support plate 13. Significantly different from the above, due to thermal stress destruction by post-pressure heat treatment
【００２０】上記給電用端子１４，１４は、内部電極１
２に電流を供給するために設けられたもので、その数、
形状、大きさ等は、内部電極１２の形状と、態様（即ち
静電チャック用電極、ヒータ電極、プラズマ発生電極等
のいずれのタイプの内部電極１２とするか）により決定
される。この給電用端子１４は、アルミナ粉末とタンタ
ルカーバイト粉末とを混合するか、またはアルミナ粉末
とタングステン粉末とを混合するか、若しくはアルミナ
粉末と炭化珪素粉末とを混合し、この混合粉末を加圧焼
結した複合導電性焼結体からなり、その混合比は、上記
内部電極１２と同様であることが望ましい。そして、ア
ルミナ−タンタルカーバイト複合導電性焼結体とアルミ
ナ−タングステン複合導電性焼結体とは、上述のように
充分に低い体積固有抵抗値を有するため、大電力を上記
内部電極１２に投入することができ、上記内部電極１２
をプラズマ発生電極として用いるときは高密度のプラズ
マを発生させることができるので好適であるThe power supply terminals 14 are connected to the internal electrodes 1.
2 is provided to supply current, the number of which is
The shape, size, and the like are determined by the shape and mode of the internal electrode 12 (that is, the type of the internal electrode 12 such as an electrostatic chuck electrode, a heater electrode, or a plasma generation electrode). The power supply terminal 14 is formed by mixing alumina powder and tantalum carbide powder, mixing alumina powder and tungsten powder, or mixing alumina powder and silicon carbide powder, and pressing the mixed powder. It is desirable that the composite electrode is made of a sintered composite conductive sintered body, and the mixing ratio thereof is the same as that of the internal electrode 12. Since the alumina-tantalum carbide composite conductive sintered body and the alumina-tungsten composite conductive sintered body have sufficiently low volume resistivity as described above, large power is applied to the internal electrodes 12. The internal electrode 12
It is preferable to use as a plasma generation electrode because high density plasma can be generated.
【００２１】次に、このようなサセプタ１５の製造方法
を説明する。図２は、サセプタ１５の製造工程を示した
ものである。まず、アルミナ基焼結体からなる支持板１
３に、予め給電用端子１４，１４を組み込み保持するた
めの固定孔１６，１６を形成する。この固定孔１６，１
６の穿設方法は、特に制限されるものでなく、例えば、
ダイヤモンドドリルによる孔あけ加工法、レーザ加工
法、放電加工法、超音波加工法を用いて穿設することが
できる。また、その加工精度は、通常の加工精度でよ
く、歩留まりはほぼ１００％で加工できる。なお、固定
孔１６，１６の穿設位置および数は、内部電極１２の態
様と形状により決定される。Next, a method of manufacturing such a susceptor 15 will be described. FIG. 2 shows a manufacturing process of the susceptor 15. First, a support plate 1 made of an alumina-based sintered body
3, fixing holes 16 are formed in advance for incorporating and holding the power supply terminals 14. These fixing holes 16, 1
The drilling method of No. 6 is not particularly limited.
Drilling can be performed using a diamond drilling method, a laser processing method, an electric discharge machining method, or an ultrasonic machining method. Further, the processing accuracy may be a normal processing accuracy, and the processing can be performed with a yield of almost 100%. The positions and number of the fixing holes 16 are determined by the form and shape of the internal electrode 12.
【００２２】次に、給電用端子１４を、上記支持板１３
の固定孔１６に密着固定し得る大きさ、形状となるよう
に作製する。給電用端子１４の作製方法は、アルミナ粉
末とタンタルカーバイト粉末とを混合するか、またはア
ルミナ粉末とタングステン粉末とを混合するか、若しく
はアルミナ粉末と炭化珪素粉末とを混合し、この混合粉
末を加圧焼結することによる。このとき、混合粉末の混
合比は、上述の内部電極１２に示した各焼結体での混合
比と同様であることが好ましい。このような範囲を超え
ると、給電用端子１４の抵抗値が高くなったり、また、
給電用端子１４の熱膨張率が、前記載置板１１と前記支
持板１３を形成するアルミナ基焼結体と大きく異なり、
後工程の加圧熱処理により熱応力破壊したりして不都合
となる。この給電用端子１４の加工精度は、後の加圧熱
処理で熱変形して固定されるので、日本工業規格（ＪＩ
Ｓ）の標準公差レベルでクリアランスをもっていてもよ
い。Next, the power supply terminal 14 is connected to the support plate 13.
It is manufactured so as to have a size and a shape that can be tightly fixed to the fixing hole 16. The method of manufacturing the power supply terminal 14 is to mix alumina powder and tantalum carbide powder, or to mix alumina powder and tungsten powder, or to mix alumina powder and silicon carbide powder, and By sintering under pressure. At this time, the mixing ratio of the mixed powder is preferably the same as the mixing ratio of each sintered body shown in the internal electrode 12 described above. Beyond such a range, the resistance value of the power supply terminal 14 increases,
The coefficient of thermal expansion of the power supply terminal 14 is significantly different from the alumina-based sintered body forming the placing plate 11 and the support plate 13,
This is inconvenient because thermal stress is destroyed by the pressure heat treatment in the subsequent step. The processing accuracy of the power supply terminal 14 is thermally deformed and fixed in a later pressurized heat treatment.
The clearance may be provided at the standard tolerance level of S).
【００２３】次に、この給電用端子１４，１４を、支持
板１３の固定孔１６，１６に嵌め込む。次に、給電用端
子１４，１４が組み込まれた支持板１３の表面の所定領
域に、前記給電用端子１４，１４に接触するように、ア
ルミナ粉末とタンタルカーバイト粉末の混合粉末、また
はアルミナ粉末とタングステン粉末との混合粉末、若し
くはアルミナ粉末と炭化珪素粉末との混合粉末を、エチ
ルアルコール等の有機溶媒に分散した内部電極形成用塗
布剤を塗布し、乾燥して内部電極形成層１２’を形成す
る。混合粉末の混合比は、、上述の内部電極１２に示し
た各焼結体での混合比と同様であることが好ましい。こ
のような塗布液の塗布方法としては、均一な厚さに塗布
する必要があることから、スクリーン印刷法等を用いる
ことが望ましい。また、上記混合粉末の混合比は、上記
サセプタ１５の内部電極１２における混合比となるよう
に混合される。また、内部電極形成層１２’の形成位置
以外の支持板１３の表面領域に、絶縁性を向上させるた
めにアルミナ粉末等の絶縁材層を介在させてもよい。Next, the power supply terminals 14, 14 are fitted into the fixing holes 16, 16 of the support plate 13. Next, a mixed powder of alumina powder and tantalum carbide powder or alumina powder is placed on a predetermined region of the surface of the support plate 13 in which the power supply terminals 14, 14 are incorporated so as to contact the power supply terminals 14, 14. A coating powder for forming an internal electrode, in which a mixed powder of aluminum and tungsten powder or a mixed powder of alumina powder and silicon carbide powder is dispersed in an organic solvent such as ethyl alcohol, is applied and dried to form an internal electrode forming layer 12 ′. Form. The mixing ratio of the mixed powder is preferably the same as the mixing ratio of each sintered body shown in the internal electrode 12 described above. As a method for applying such a coating liquid, it is necessary to apply the coating liquid to a uniform thickness, and thus it is desirable to use a screen printing method or the like. Further, the mixing ratio of the mixed powder is set so as to be the mixing ratio of the internal electrode 12 of the susceptor 15. Further, an insulating material layer such as alumina powder may be interposed in the surface region of the support plate 13 other than the position where the internal electrode forming layer 12 'is formed in order to improve the insulating property.
【００２４】次に、内部電極形成層１２’を形成した支
持板１３上に、該内部電極形成層１２’を介するように
載置板１１を重ねた後、これらを加圧下にて熱処理して
一体化する。このように、この製造方法においては、前
記支持板１３と、前記載置板１１との間に接合剤を介在
させることなく、加圧下での熱処理のみで、載置板１１
と指示板１３との接合一体化を達成することができる。
このときの熱処理の条件としては、熱処理雰囲気は真
空、Ａｒ、Ｈｅ、Ｎ2などの不活性雰囲気であるのが好
ましい。加圧力は５〜１０ＭＰａが望ましく、また熱処
理温度は１６００〜１８５０℃が望ましい。Next, after placing the mounting plate 11 on the support plate 13 on which the internal electrode forming layer 12 'is formed with the internal electrode forming layer 12' interposed therebetween, these are heat-treated under pressure. Integrate. As described above, in this manufacturing method, the mounting plate 11 is formed only by heat treatment under pressure without interposing a bonding agent between the support plate 13 and the mounting plate 11.
And the indicator plate 13 can be joined and integrated.
As a condition of the heat treatment at this time, it is preferable that the heat treatment atmosphere is an inert atmosphere such as vacuum, Ar, He, and N 2 . The pressure is desirably 5 to 10 MPa, and the heat treatment temperature is desirably 1600 to 1850 ° C.
【００２５】そして、このとき、支持板１３上に形成さ
れた内部電極形成層１２’は、上記混合粉末が焼成され
て、それぞれに対応する複合導電性焼結体製の内部電極
１２とされる。また、給電用端子１４，１４は、加圧下
での熱処理で熱変形して支持板１３の固定孔１６，１６
に固定される。At this time, the internal electrode forming layer 12 'formed on the support plate 13 is formed by firing the mixed powder to form the corresponding internal electrode 12 made of a composite conductive sintered body. . Further, the power supply terminals 14, 14 are thermally deformed by heat treatment under pressure and are fixed by the fixing holes 16, 16
Fixed to
【００２６】このようなサセプタの製造方法によれば、
支持板１３に孔を形成して、給電用端子１４を取り付け
る後加工の作業なしに、サセプタ１５を製造することが
できる。また、内部電極１２および給電用端子１４，１
４に、上記複合導電性焼結体からなるものを用いている
ので、載置板１１と支持板１３とを一体化させる処理に
おいて内部電極１２を容易に形成することができ、給電
用端子１４，１４を支持板１３に固定させることがで
き、また、内部電極１２と、給電用端子１４との接続も
確実に行うことができる。さらに、給電用端子１４を安
価に製造することができる。このように、サセプタ１５
の製造方法によれば、内部電極１２に確実に通電可能な
サセプタ１５を得ることができ、サセプタ１５を歩留ま
りよく廉価に製造することができる。According to such a susceptor manufacturing method,
The susceptor 15 can be manufactured without a post-processing operation of forming a hole in the support plate 13 and attaching the power supply terminal 14. Further, the internal electrode 12 and the power supply terminals 14, 1
4, the internal electrode 12 can be easily formed in the process of integrating the mounting plate 11 and the support plate 13, and the power supply terminal 14. , 14 can be fixed to the support plate 13, and the connection between the internal electrode 12 and the power supply terminal 14 can be reliably performed. Further, the power supply terminal 14 can be manufactured at low cost. Thus, the susceptor 15
According to the manufacturing method of (1), the susceptor 15 that can reliably supply current to the internal electrode 12 can be obtained, and the susceptor 15 can be manufactured at a high yield and at low cost.
【００２７】[0027]
【実施例】以下、内部電極１２を静電チャック用電極と
した場合の実施例を掲げ、本発明を更に詳述する。 （実施例１） 「給電用端子の作製」アルミナ粉末（平均粒径０．２μ
ｍ、大明化学工業（株）製）４０重量部、タンタルカー
バイト粉末（平均粒径１μｍ、日本新金属（株）製）６
０重量部、イソプロピルアルコール１５０重量部とを混
合し、更に遊星型ボールミルを用いて均一に分散させて
スラリーを得た。このスラリーから、アルコール分を、
吸引ろ過して除去し、乾燥してアルミナータンタルカー
バイト複合粉末を得た。次に、上記複合粉末を成型、焼
結し、直径２．５ｍｍ、長さ５ｍｍの棒状アルミナータ
ンタルカーバイト複合導電性焼結体を得、これを給電用
端子１４とした。焼結は温度１７００℃、圧力２０ＭＰ
ａの条件でホットプレスによる加圧焼結を行った。焼結
後のアルミナータンタルカーバイト複合導電性焼結体の
相対密度は９８％以上であった。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in further detail below with reference to an embodiment in which the internal electrode 12 is an electrode for an electrostatic chuck. (Example 1) "Production of power supply terminal" alumina powder (average particle size 0.2 μm)
m, manufactured by Daimei Chemical Co., Ltd.), 40 parts by weight, tantalum carbide powder (average particle size: 1 μm, manufactured by Nippon Shinmetal Co., Ltd.) 6
0 parts by weight and 150 parts by weight of isopropyl alcohol were mixed and uniformly dispersed using a planetary ball mill to obtain a slurry. From this slurry, the alcohol content,
It was removed by suction filtration and dried to obtain an alumina-tantalum carbide composite powder. Next, the composite powder was molded and sintered to obtain a rod-shaped alumina-tantalum carbide composite conductive sintered body having a diameter of 2.5 mm and a length of 5 mm. Sintering temperature 1700 ° C, pressure 20MP
Pressure sintering by hot pressing was performed under the condition of a. The relative density of the alumina-tantalum carbide composite conductive sintered body after sintering was 98% or more.
【００２８】「支持板の作製」アルミナ粉末（平均拉径
０．２μｍ、大明化学工業（株）製）を成型、焼結し、
直径２３０ｍｍ、厚さ５ｍｍの円盤状アルミナ焼結体
（支持板１３）を得た。焼結時の条件は、上記給電用端
子１４の作製時と同様とした。次いで、このアルミナ焼
結体に、給電用端子１４，１４を組み込み固定するため
の固定孔１６，１６を、ダイヤモンドドリルによって孔
あけ加工することにより穿設し、アルミナ焼結体製の支
持板１３を得た。[Preparation of support plate] Alumina powder (average diameter 0.2 μm, manufactured by Daimei Chemical Co., Ltd.) was molded and sintered,
A disc-shaped alumina sintered body (support plate 13) having a diameter of 230 mm and a thickness of 5 mm was obtained. The sintering conditions were the same as those for the production of the power supply terminal 14. Next, fixing holes 16, 16 for incorporating and fixing the power supply terminals 14, 14 are formed in the alumina sintered body by drilling with a diamond drill, and a support plate 13 made of an alumina sintered body is formed. I got
【００２９】「載置板の作製」上記アルミナ基焼結体製
の支持板１３の作製方法に準じて、直径２３０ｍｍ、厚
さ５ｍｍの円盤状アルミナ基焼結体を得た。次いで、こ
の円盤状アルミナ基焼結体の一面（板状試料の載直面）
を平坦度が１０μｍ以下となるよう研摩し、アルミナ基
焼結体製の載置板１１を得た。[Preparation of mounting plate] A disk-shaped alumina-based sintered body having a diameter of 230 mm and a thickness of 5 mm was obtained according to the method of preparing the support plate 13 made of the alumina-based sintered body. Next, one surface of the disc-shaped alumina-based sintered body (the mounting surface of the plate-shaped sample)
Was polished so as to have a flatness of 10 μm or less to obtain a mounting plate 11 made of an alumina-based sintered body.
【００３０】「一体化」上記支持板１３に穿設された前
記固定孔１６，１６に、前記の給電用端子１４，１４を
押し込み、組み込み固定した。次いで、図２−（ｂ）に
示すように、この給電用端子１４，１４が組み込み固定
された支持板１３上に、後の加圧下での熱処理工程で内
部電極１２となるよう、４０重量％のアルミナ粉末と６
０重量％のタンタルカーバイト粉末を含む、アルミナー
タンタルカーバイト複合導電性材料からなる塗布剤を、
スクリーン印刷法にて印刷塗布し、乾燥して、内部電極
形成層１２’を形成した。次いで、図２−（ｃ）に示す
ように、この内部電極形成層１２’（印刷面）を挟み込
むように、また、前記載置板１１の研摩面が上面となる
ように、前記支持板１３と載置板１１とを重ね合わせ
て、ホットプレスにて加圧下にて熱処理して一体化して
実施例１のサセプタ１５を作製した。このときの加圧、
熱処理条件は、温度１７５０℃、圧力７．５ＭＰａの条
件にて行った。"Integrally" The power supply terminals 14, 14 were pushed into the fixing holes 16, 16 formed in the support plate 13, and fixed. Next, as shown in FIG. 2B, 40% by weight is formed on the support plate 13 on which the power supply terminals 14 and 14 are incorporated and fixed so as to become the internal electrodes 12 in a heat treatment process under pressure later. Alumina powder and 6
A coating agent comprising an alumina-tantalum carbide composite conductive material containing 0% by weight of tantalum carbide powder,
It was printed and applied by a screen printing method and dried to form an internal electrode forming layer 12 '. Next, as shown in FIG. 2C, the support plate 13 is sandwiched so that the internal electrode forming layer 12 ′ (printed surface) is sandwiched between the support plate 13 and the polishing surface of the mounting plate 11. The susceptor 15 of Example 1 was manufactured by stacking the mounting plate 11 and a heat treatment under a hot press under pressure. Pressurization at this time,
The heat treatment was performed at a temperature of 1750 ° C. and a pressure of 7.5 MPa.
【００３１】「評価」このようにして作製されたサセプ
タ１５の接合断面をＳＥＭ観察したところ、前記載置板
１１と、前記支持板１３と、前記給電用端子１４，１４
とは良好に接合されていた。また、接合された前記載置
板１１、前記支持板１３、前記給電用端子１４，１４に
亀裂等の発生は無く、内部電極１２の剥離も認められな
かった。また、前記給電用端子１４，１４と前記内部電
極１２との聞の導通も良好であり、電気的に確実に連結
されていることも確認された。[Evaluation] When the joined cross section of the susceptor 15 thus manufactured was observed by SEM, the mounting plate 11, the support plate 13, and the power supply terminals 14, 14 were described.
And were well joined. In addition, no cracks or the like were generated in the joined mounting plate 11, the support plate 13, and the power supply terminals 14, 14, and no peeling of the internal electrode 12 was observed. In addition, the electric connection between the power supply terminals 14 and 14 and the internal electrode 12 was good, and it was confirmed that they were electrically connected securely.
【００３２】（実施例２）タンタルカーバイト粉をタン
グステン粉（平均粒径０．５μm、東京タングステン
（株）製）に変えた以外は、実施例１と同様にして、実
施例２のサセプタ１５を得た。このサセプタ１５の接合
断面をＳＥＭ観察したところ、前記載置板１１と、前記
支持板１３と、前記給電用端子１４，１４とは良好に接
合されていた。また、接合された前記載置板１１、前記
支持板１３、前記給電用端子１４，１４に亀裂等の発生
は無く、内部電極１２の剥離も認められなかった。ま
た、前記給電用端子１４，１４と前記内部電極１２との
間の導通も良好であり、電気的に確実に連結されている
ことも確認された。Example 2 The susceptor 15 of Example 2 was changed in the same manner as in Example 1 except that the tantalum carbide powder was changed to tungsten powder (average particle size: 0.5 μm, manufactured by Tokyo Tungsten Co., Ltd.). I got When the joining cross section of the susceptor 15 was observed by SEM, the mounting plate 11, the support plate 13, and the power supply terminals 14, 14 were satisfactorily joined. In addition, no cracks or the like were generated in the joined mounting plate 11, the support plate 13, and the power supply terminals 14, 14, and no peeling of the internal electrode 12 was observed. In addition, conduction between the power supply terminals 14 and 14 and the internal electrode 12 was also good, and it was confirmed that they were electrically connected securely.
【００３３】（実施例３）タンタルカーバイト粉を炭化
珪素粉（平均粒径０．０５μm、住友大阪セメント
（株）製）に変え、混合粉末組成をアルミナ粉末：９０
重量部、炭化珪素粉末：１０重量部とした以外は、実施
例１と同様にして、実施例３のサセプタ１５を得た。こ
のサセプタ１５の接合断面をＳＥＭ観察したところ、前
記載置板１１と、前記支持板１３と、前記給電用端子１
４，１４とは良好に接合されていた。また、接合された
前記載置板１１、前記支持板１３、前記給電用端子１
４，１４に亀裂等の発生は無く、内部電極１２の剥離も
認められなかった。また、前記給電用端子１４，１４と
前記内部電極１２との間の導通も良好であり、電気的に
確実に連結されていることも確認された。Example 3 Tantalum carbide powder was changed to silicon carbide powder (average particle size: 0.05 μm, manufactured by Sumitomo Osaka Cement Co., Ltd.), and the mixed powder composition was changed to alumina powder: 90
A susceptor 15 of Example 3 was obtained in the same manner as in Example 1, except that the weight was changed to 10 parts by weight of silicon carbide powder. When the joining cross section of the susceptor 15 was observed by SEM, the mounting plate 11, the support plate 13, and the power supply terminal 1 were described.
4, 14 were satisfactorily joined. In addition, the mounting plate 11, the support plate 13, and the power supply terminal 1 which are joined to each other.
No cracks or the like were found in Nos. 4 and 14, and peeling of the internal electrode 12 was not observed. In addition, conduction between the power supply terminals 14 and 14 and the internal electrode 12 was also good, and it was confirmed that they were electrically connected securely.
【００３４】[0034]
【発明の効果】以上説明したように、本発明のサセプタ
は、給電用端子が内部電極と確実、強固に連結されてお
り、通電確実性が極めて高いものである。また、上記サ
セプタの内部電極および給電用端子が、タンタルカーバ
イトを５４〜７１重量％含むアルミナ−タンタルカーバ
イト複合導電性焼結体か、またはタングステンを５４〜
９５重量％含むアルミナータングステン複合導電性焼結
体か、若しくは炭化珪素を５〜３０重量％含むアルミナ
−炭化珪素複合導電性焼結体からなるものであれば、そ
の製造時における各部材間の熱膨張率の違い等に起因す
る熱応力による破壊を防ぐことができるので、これら
が、確実、強固に連結され、通電確実性がより高いもの
となる。また、このようなサセプタによれば、前記給電
用端子と前記内部電極との間の導通も良好であり、電気
的に確実に連結される。また、本発明のサセプタの製造
方法によれば、上記の特性を備えたサセプタを高度な後
加工なしに歩留まり良く、しかも廉価に製造することが
できる。As described above, in the susceptor of the present invention, the power supply terminal is securely and firmly connected to the internal electrode, and the energization reliability is extremely high. The internal electrode and the power supply terminal of the susceptor may be made of an alumina-tantalum carbide composite conductive sintered body containing 54 to 71% by weight of tantalum carbide, or tungsten may be made of 54 to 71% by weight.
If it is made of an alumina-tungsten composite conductive sintered body containing 95% by weight, or an alumina-silicon carbide composite conductive sintered body containing 5 to 30% by weight of silicon carbide, the components between the members at the time of the production are Since destruction due to thermal stress due to a difference in thermal expansion coefficient or the like can be prevented, these are securely and firmly connected, and the reliability of energization is higher. Further, according to such a susceptor, the conduction between the power supply terminal and the internal electrode is good, and the susceptor is electrically connected securely. Further, according to the susceptor manufacturing method of the present invention, a susceptor having the above-described characteristics can be manufactured at a high yield without any advanced post-processing and at a low cost.
【図１】 本発明のサセプタの一例を示す断面図であ
る。FIG. 1 is a sectional view showing an example of a susceptor of the present invention.
【図２】 本発明のサセプタの製造方法の一例を示す工
程図である。FIG. 2 is a process chart showing an example of a method for manufacturing a susceptor of the present invention.
【図３】 従来のサセプタの一例を示す断面図である。FIG. 3 is a cross-sectional view illustrating an example of a conventional susceptor.
１１ 載置板 １２ 内部電極 １３ 支持板 １４ 給電用端子 １５ サセプタ １６ 固定孔 11 mounting plate 12 internal electrode 13 support plate 14 power supply terminal 15 susceptor 16 fixing hole
Claims (6)
一体化される支持板と、これら載置板と支持板との間に
設けられた内部電極と、この内部電極に接するように前
記支持板に貫通して設けられた給電用端子とからなり、
前記内部電極と給電用端子が、アルミナ−タンタルカー
バイト複合導電性焼結体、アルミナ−タングステン複合
導電性焼結体、及びアルミナ−炭化珪素複合導電性焼結
体のうちいずれかの複合導電性焼結体からなるものであ
るサセプタ。1. A mounting plate on which a sample is mounted, a supporting plate integrated with the mounting plate, an internal electrode provided between the mounting plate and the supporting plate, A power supply terminal provided through the support plate so as to be in contact with the power supply terminal,
The internal electrode and the power supply terminal may be any one of an alumina-tantalum carbide composite conductive sintered body, an alumina-tungsten composite conductive sintered body, and an alumina-silicon carbide composite conductive sintered body. A susceptor made of a sintered body.
導電性焼結体が、５４〜７１重量％のタングステンを含
有するものである請求項１に記載のサセプタ。2. The susceptor according to claim 1, wherein the alumina-tantalum carbide composite conductive sintered body contains 54 to 71% by weight of tungsten.
性焼結体が５４〜９５重量％のタングステンを含有する
ものである請求項１記載のサセプタ。3. The susceptor according to claim 1, wherein said alumina-tungsten composite conductive sintered body contains 54 to 95% by weight of tungsten.
結体が５〜３０重量％の炭化珪素を含有するものである
請求項１記載のサセプタ。4. The susceptor according to claim 1, wherein the alumina-silicon carbide composite conductive sintered body contains 5 to 30% by weight of silicon carbide.
結体からなるものである請求項１〜４のいずれか一項に
記載のサセプタ。5. The susceptor according to claim 1, wherein the mounting plate and the support plate are made of an alumina-based sintered body.
固定孔にアルミナ−タンタルカーバイト複合導電性焼結
体、アルミナ−タングステン複合導電性焼結体、及びア
ルミナ−炭化珪素複合導電性焼結体のうちいずれかの複
合導電性焼結体からなる給電用端子を、支持板を貫通す
るようにして固定し、ついで、この給電用端子を保持す
る支持板上に、給電用端子に接するように、アルミナ−
タンタルカーバイト複合導電性材料、アルミナ−タング
ステン複合導電性材料、及びアルミナ−炭化珪素複合導
電性材料のうちいずれかの複合導電性材料からなる塗布
材を塗布して、乾燥させ、ついで、この塗布材の塗布面
を介して支持板と載置板とを重ね合わせ、加圧下にて熱
処理することによりこれらを一体化すると共に、これら
の支持板と載置板との間に、前記複合導電性材料に対応
する複合導電性焼結体からなる内部電極を形成すること
を特徴とするサセプタの製造方法。6. A fixing hole is formed in a support plate, and then an alumina-tantalum carbide composite conductive sintered body, an alumina-tungsten composite conductive sintered body, and an alumina-silicon carbide composite conductive hole are formed in the fixing hole. A power supply terminal made of any of the composite conductive sintered bodies among the sintered bodies is fixed so as to penetrate the support plate, and then on the support plate holding the power supply terminal, the power supply terminal Alumina
A coating material made of any one of a tantalum carbide composite conductive material, an alumina-tungsten composite conductive material, and an alumina-silicon carbide composite conductive material is applied, dried, and then applied. The support plate and the mounting plate are overlapped with each other via the material application surface, and heat treatment is performed under pressure to integrate them, and between the support plate and the mounting plate, the composite conductive material is placed. A method for manufacturing a susceptor, comprising forming an internal electrode made of a composite conductive sintered body corresponding to a material.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000103665A JP3746935B2 (en) | 2000-04-05 | 2000-04-05 | Susceptor and manufacturing method thereof |
| US09/825,860 US6693789B2 (en) | 2000-04-05 | 2001-04-03 | Susceptor and manufacturing method thereof |
| KR1020010017907A KR100553444B1 (en) | 2000-04-05 | 2001-04-04 | Susceptors and the methods of manufacturing them |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000103665A JP3746935B2 (en) | 2000-04-05 | 2000-04-05 | Susceptor and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001287982A true JP2001287982A (en) | 2001-10-16 |
| JP3746935B2 JP3746935B2 (en) | 2006-02-22 |
Family
ID=18617331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000103665A Expired - Lifetime JP3746935B2 (en) | 2000-04-05 | 2000-04-05 | Susceptor and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3746935B2 (en) |
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| US6689984B2 (en) | 2001-11-13 | 2004-02-10 | Sumitomo Osaka Cement Co., Ltd. | Susceptor with built-in electrode and manufacturing method therefor |
| US6768079B2 (en) | 2001-11-08 | 2004-07-27 | Sumitomo Osaka Cement Co. Ltd. | Susceptor with built-in plasma generation electrode and manufacturing method therefor |
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