JP2001284857A - Mounting structure of electric circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting structure of an electric circuit device wherein, with efficient heat radiation, assembly processes, part cost, and board cost are reduced while high-frequency characteristics is improved, and the work precision of a bottom-less case and a heat radiator is not required to be raised. SOLUTION: A board 3 is held between a heat radiator 4 and a bottom-less case 8, and a heating part 7 is directly fitted to the heat radiator 4 through a part fitting hole 11 provided at the board 3. A high-frequency board 9 is fitted to the part fitting hole 11 of the board 3, and a high-frequency signal input connector 5 is connected to a high-frequency line 15 of the board 3. A high-frequency signal output connector 6 is connected to a high-frequency line 16 of the high-frequency board 9 through a cable fitting hole 14 provided at the bottom-less case 8 using an SJ cable 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of an electric circuit device, and more particularly to a mounting structure of an electric circuit device suitable for efficiently dissipating heat from a heat-generating component of a high-frequency power amplifier.

[0002]

2. Description of the Related Art Conventionally, in a device such as a high-frequency power amplifier for a micro radio or a mobile radio base station, a structure for dissipating heat generated from a mounted heat-generating component and shielding a high-frequency signal is used. I have. FIG. 2 is an exploded perspective view showing a mounting structure of a conventional high-frequency power amplifier. In a conventional high-frequency power amplifier, a high-frequency board 29, a high-frequency signal input connector (hereinafter, RF IN) 25, a high-frequency signal output connector (hereinafter, RF OUT) 26, A structure in which a heat-generating component 27 and a feedthrough capacitor 30 are mounted, a lid 21 is mounted on an upper portion of a case 22 having a bottom, a radiator 24 is mounted on a lower portion of the case 22 having a bottom, and a substrate 23 is further mounted on a terminal of the feedthrough capacitor 30. It has become.

In the mounting structure of the conventional high-frequency power amplifier shown in FIG. 2, the high-frequency part and the non-high-frequency part are separated by the bottomed case 2, so that the shielding effect of the high-frequency signal is ensured and In order to connect the high frequency substrate 29 to the high frequency substrate 29,
Need to be installed.

On the other hand, as a mounting structure of a high-frequency power amplifier which does not require a feedthrough capacitor and integrates a high-frequency portion and a non-high-frequency portion, there is a conventional mounting structure as shown in FIG. FIG. 3 is an exploded perspective view showing a mounting structure of another conventional high-frequency power amplifier. In another conventional high-frequency power amplifier, a heat-generating component 37 is mounted in a component mounting hole 41 of a substrate 33, and an RF IN3 is connected to a high-frequency line 39 of the substrate 33.
5. Attach the RF OUT 36 and attach a case 38 with no bottom (hereinafter referred to as a bottomless case) 38 on the top of the substrate 33,
Further, the lid 31 is attached to the upper part of the bottomless case 38, and the radiator 34 is attached to the lower part of the substrate 33.

On the other hand, even in a mounting structure of a CPU mounted on a device such as a personal computer or a work station and its peripheral parts, signal processing exceeding 1 GHz is executed even if a feedthrough capacitor is not used. The mounting structure as shown in FIG.

[0006]

However, the above-described prior art has the following problems.

In the mounting structure of the conventional high-frequency power amplifier as shown in FIG. 2, the high-frequency portion and the non-high-frequency portion are separated by the bottomed case 22, as described above, so that the high-frequency signal shielding effect is obtained. However, in order to connect the substrate 23 and the high-frequency substrate 29, it is necessary to attach the feedthrough capacitor 30 to the bottomed case 22. For this reason, the number of assembling man-hours and parts costs have been increased. Further, since the bottomed case 22 is provided between the heat-generating component 27 and the radiator 24, the thermal resistance in heat conduction is increased, and the heat radiation efficiency is deteriorated.

On the other hand, in the mounting structure of another conventional high-frequency power amplifier as shown in FIG. 3, the substrate 33 is not divided into a high-frequency portion and a non-high-frequency portion. However, it was necessary to use expensive high-frequency substrate materials even for non-high-frequency parts. Alternatively, in order to reduce the cost, it is necessary to use a substrate material having a large loss at a high frequency up to the high frequency portion, and it has been difficult to compensate for the conflicting advantages of the two.

Further, in the mounting structure of the other conventional high-frequency power amplifier shown in FIG. 3, a high-frequency signal connector (RF I
N35, RF OUT36)
For the purpose of reliably converting the ground of the high-frequency line 39 and preventing leakage of high-frequency signals, the bottomless case 38, the board 33, and the radiator 34 are aligned so that their respective end faces are located on the same plane. And RF OUT3
6, it is necessary to make contact with the outer conductor on the ground side.
Further, in order to further secure the contact, the respective end faces of the bottomless case 38, the substrate 33, and the radiator 34, and the RF OU
In some cases, the ground may be accurately taken with a metal fitting having a spring property interposed between the outer conductor of T36 and the outer conductor. For this reason, the number of assembling man-hours and parts costs have been increased.

When the RF IN 35 and the RF OUT 36 are mounted on the surfaces facing each other, the bottomless case 38, the substrate 33, and the radiator 34 are made the same size in order to align the end faces, and the processing accuracy is increased and there is no deviation. You need to do that. Therefore, RF IN35 and RF OUT
The mounting position of 36 was restricted, and the processing cost was expensive.

[0011] On the other hand, the mounting structure of a microprocessor mounted on a computer device such as a personal computer also has disadvantages such as poor heat dissipation efficiency and large assembly man-hours and parts cost, as described above.

It is an object of the present invention to efficiently dissipate heat, reduce assembling man-hours, reduce parts cost, improve high-frequency characteristics, reduce the cost of a board, and further increase the processing accuracy of a bottomless case and a radiator. It is intended to provide a mounting structure of an electric circuit device which eliminates the need.

[0013]

According to the present invention, there is provided a mounting structure of an electric circuit device including a substrate, a high-frequency substrate, a circuit element, and a radiator, wherein the substrate is sandwiched between the radiator and a case. A heat-generating component as a circuit element is directly mounted on the radiator through a component mounting hole provided in the board, the high-frequency board is mounted in the component mounting hole of the board, and a high-frequency connector as the circuit element is mounted on the case. And connected to the high-frequency board by a SJ cable of a coaxial tube through a cable mounting hole provided in the above.

The mounting structure of the electric circuit device according to the present invention will be described with reference to FIG. 1. An electric circuit comprising a substrate (3), a high-frequency substrate (9), a circuit element and a radiator (4). In the mounting structure of the device, the substrate is sandwiched between the radiator and the case (8), and the heat-generating component (7) as the circuit element is inserted through a component mounting hole (11) provided in the substrate. The SJ cable (12) is directly attached to a radiator, the high-frequency board is mounted in the component mounting hole of the board, and the high-frequency connector (6) as a circuit element is provided through a cable mounting hole (14) provided in the case. ) To connect to the high frequency substrate.

[Operation] In the mounting structure of the electric circuit device of the present invention, the heat-generating component is directly attached to the radiator. Therefore, heat can be efficiently dissipated. Also, as before,
There is no need to provide a feedthrough capacitor for connecting the substrate and the high-frequency substrate, and the substrate material can be used separately for the high-frequency portion and the non-high-frequency portion. For this reason, it is possible to reduce the number of assembling steps, the cost of parts, the improvement of high-frequency characteristics, and the cost of boards. Furthermore, since the high-frequency line ground conversion between the high-frequency board and the high-frequency connector is performed via the SJ cable, there is no need to perform the ground conversion by aligning the respective end surfaces of the case, the board, and the radiator, and the spring property is improved. It is not necessary to sandwich the bracket with For this reason, the number of assembly steps and the cost of parts can be reduced. Furthermore, as described above, since the high-frequency line ground conversion between the high-frequency board and the high-frequency connector is performed via the SJ cable,
Since it is not necessary to align the respective end surfaces of the case, the substrate, and the radiator, it is not necessary to adjust the size of the radiator to the case as in the related art. Therefore, the degree of freedom of the mounting position of the high-frequency connector is increased, and it is not necessary to increase the processing accuracy of the case and the radiator.

[0016]

[Embodiment] Next, an embodiment of the present invention will be described in detail with reference to the drawings.

(1) Description of Configuration The mounting structure of the high-frequency power amplifier according to the embodiment of the present invention is particularly applied to a high-frequency (several hundred MHz to several tens GHz) high-output (several W to several tens W or more) power amplifier. Heating components such as a high-frequency transistor of a power amplifying element, a power-amplifying field-effect transistor (hereinafter, PWR FET) and an absorption resistor of an isolator are directly attached to a radiator to connect a high-frequency signal connector to a board. The feature is that an SJ cable is used.

FIG. 1 is an exploded perspective view showing a mounting structure of a high-frequency power amplifier according to an embodiment of the present invention. A high-frequency power amplifier according to an embodiment of the present invention is mounted on an electronic device, and includes a lid 1, a substrate 3, a radiator 4, and an RF of a coaxial connector.
IN 5, RF OUT 6, heat-generating component 7, bottomless case 8, high-frequency board 9, SJ cable 12, and cable retainer 13. In the figure, reference numeral 11 denotes a component mounting hole of the substrate 3, 14 denotes a cable mounting hole of the bottomless case 8, 15 denotes a high-frequency line of the substrate 3, and 16 denotes a high-frequency line of the high-frequency substrate 9. Reference numeral 17 denotes a notch for holding down the RF IN5.

More specifically, the component mounting hole 11 is formed in the substrate 3, the high-frequency substrate 9 is mounted in the component mounting hole 11 of the substrate 3, and the RF IN5 is provided.
Is attached to the longitudinal end of the substrate 3. The board 3 is mounted on the radiator 4, and the heat generating component 7 of the power amplifying element is directly mounted via the component mounting hole 11 of the board 3. The bottomless case 8 is attached to the upper part of the substrate 3, and a cable mounting hole 14 through which the SJ cable 12 connected to the end of the RF OUT 6 can penetrate is formed on the longitudinal end face of the bottomless case 8. I have.

The RF OUT 6 is attached to the outside of the bottomless case 8, and the SJ cable 12 passes through the cable attachment hole 14 and is radiated by the cable holding metal 13.
And mounted on the high-frequency substrate 9. The SJ cable 12 is made of a coaxial tube and formed by plating the inner conductor and the outer conductor of the core wire with a copper material or by plating the same.
Whether the Teflon (registered trademark) is filled between the core wire and the outer conductor as a coaxial cable with an impedance of Ω,
Teflon spacers are arranged at predetermined intervals as semi-resids to fix the core wire and the outer conductor, and have flexibility such as bending. And since the outer conductor can be soldered and can be grounded as a ground potential, it also has a heat dissipation effect,
The heat can be diffused outside through the RF OUT 6 of the coaxial connector.

The lid 1 is attached to the upper part of the bottomless case 8. More specifically, the substrate 3 includes a bottomless case 8.
It is attached in a state sandwiched between the heat sink 4 and the heat sink 4.
The substrate 3 is provided with a large number of conductive holes, and the side surface of the substrate 3 is configured by metal plating or the like so that high-frequency leakage does not occur. The lid 1 is mounted on the upper part of the bottomless case 8 and shields the bottomless case 8 in high frequency.
Here, by forming the component mounting holes 11 in the substrate 3, the heat generating components 7 can be directly mounted on the radiator 4 as described above. As the heat generating component 7, PWR
In addition to the FET, there are an isolator, a power absorption resistor, and the like.

The input connector RF IN5
Are mounted from the side of the substrate 3 and have notches 17 so that the core of the signal line does not contact the bottomless case 8.
And is connected to the high-frequency line 15 of the substrate 3.
RFOUT6 which is the output side connector is SJ cable 1
2 connects to the high frequency substrate 9. Here, the inner conductor that is the core wire of the SJ cable 12 is connected to the high-frequency line 16 of the high-frequency board 9, and the outer conductor of the SJ cable 12 is attached to the radiator 4 by the cable retainer 13 and dropped to the ground. Have been.

(2) Description of Operation Next, the operation of the embodiment of the present invention will be described in detail with reference to FIG.

In the mounting structure of the high frequency power amplifier according to the embodiment of the present invention, since the component mounting hole 11 is formed in the substrate 3 as shown in FIG. Can be attached. Also, RF OU
Since the SJ cable 12 is used for connection between the T6 and the high-frequency board 9, the outer conductor of the RF OUT6 is a bottomless case 8.
Only need to be contacted. Thereby, the heat generating component 7
Efficient heat radiation is possible. Further, it is not necessary to align the respective end faces of the bottomless case 8, the substrate 3, and the radiator 4 so as to be located on the same plane as in the related art.

That is, according to the embodiment of the present invention, the substrate 3
By forming the component mounting hole 11 in the heat generating component 7, the heat generating component 7 can be directly mounted on the radiator 4, whereby an effect of efficiently dissipating heat can be obtained.

Further, unlike the related art, there is no need to provide a feedthrough capacitor for connecting the substrate 3 and the high-frequency substrate 9, and the substrate material can be used separately for the high-frequency portion and the non-high-frequency portion. It also has the effect of reducing the cost of components, reducing the cost of parts, improving high-frequency characteristics, and reducing the cost of boards.

Furthermore, since the high-frequency line ground conversion between the high-frequency board 9 and the RF OUT 6 is performed via the SJ cable 12, the bottomless case 8, the board 3, and the radiator 4
There is no need to make ground conversion by aligning the respective end faces, and it is not necessary to sandwich a metal fitting having spring properties. As a result, the effects of reducing the number of assembly steps and the cost of parts can be obtained.

Furthermore, as described above, the high-frequency substrate 9
The high-frequency line ground conversion between the RF OUT 6 and the RF OUT 6 means that the ground potential is accurately secured at a high frequency, and the grounding is performed via the SJ cable 12.
Since it is not necessary to align the respective end faces of the substrate 3 and the radiator 4, it is not necessary to adjust the size of the radiator 4 to the bottomless case 8 as in the related art.
There is also an effect that the degree of freedom of the mounting position of OUT6 is increased, and it is not necessary to increase the processing accuracy of the bottomless case 8 and the radiator 4.

[Other Embodiments] In addition to the above-described embodiment, the present invention may be embodied in the following other embodiments.

In another embodiment of the present invention, the basic configuration is as shown in FIG. 1. In the embodiment of FIG. 1, a high-frequency signal output connector (RF OUT) 6
However, the present invention is not limited to this, and as another embodiment, a high-frequency signal input connector (RF IN) 5 or another high-frequency connector (for example, It is also applicable to a high-frequency signal monitoring connector using a coupler.

In the embodiment shown in FIG. 1, the outer conductor of the SJ cable 12 is attached to the radiator 4 by the cable retainer 13, but the present invention is not limited to this. The outer conductor of the SJ cable 12 may be attached to the substrate 3 by soldering. In this case, the component mounting hole 11 is not opened at the position where the SJ cable 12 is mounted. This eliminates the necessity of attaching the cable retainer 13, thereby achieving an effect of further reducing the number of assembling steps and parts cost. Alternatively, the outer conductor of the SJ cable 12 can be attached to the radiator 4 with a conductive adhesive.

Further, in the embodiment shown in FIG. 1, the high-frequency substrate 9 is used only for the output portion. However, the present invention is not limited to this. However, it can be used in places where the loss of other high-frequency signals is desired to be reduced.

Further, in the embodiment of FIG. 1, the mounting structure of the high-frequency power amplifier mounted on the electronic device is described as an example. However, the present invention is not limited to this. For example, the present invention can be applied to a mounting structure of a CPU or a drive IC mounted on a personal computer or a workstation.

[0034]

As described above, according to the present invention, in a mounting structure of an electric circuit device including a substrate, a high-frequency substrate, a circuit element, and a radiator, the substrate is sandwiched between the radiator and the case. A heat-generating component as the circuit element is directly attached to the radiator through a component attachment hole provided in the board, the high-frequency board is attached to the component attachment hole of the board, and a high-frequency connector as the circuit element Is connected to the high-frequency board by an SJ cable via a cable mounting hole provided in the case, and thus the following effects are obtained.

The heat-generating component can be directly attached to the heat radiator, which has the effect of efficiently dissipating heat.

Further, unlike the related art, it is not necessary to provide a feedthrough capacitor for connecting the substrate and the high-frequency substrate, so that the substrate material can be selectively used for the high-frequency portion and the non-high-frequency portion, thereby reducing the number of assembling steps. -It also has the effect of reducing parts costs, improving high-frequency characteristics, and reducing board costs.

Further, since the high-frequency line ground conversion between the high-frequency board and the high-frequency connector is performed via the SJ cable, it is not necessary to perform the ground conversion by aligning the respective end surfaces of the case, the board, and the radiator. In addition, there is no need to sandwich a metal fitting having a spring property, whereby the effect of reducing the number of assembly steps and the cost of parts can be obtained.

Further, as described above, the high-frequency line ground conversion between the high-frequency board and the high-frequency connector is performed by S
Since it is performed through a J cable, there is no need to align the respective end faces of the case, the substrate, and the radiator, so there is no need to adjust the size of the radiator to the case as in the conventional case. There is also an effect that the degree of freedom of the mounting position of the radiator increases, and it is not necessary to increase the processing accuracy of the case and the radiator.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a mounting structure of a high-frequency power amplifier according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing a mounting structure of a conventional high-frequency power amplifier.

FIG. 3 is an exploded perspective view showing a mounting structure of another conventional high-frequency power amplifier.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 cover 3 substrate 4 radiator 5 RF IN 6 RF OUT 7 heat-generating component 8 bottomless case 9 high-frequency substrate 11 component mounting hole 12 SJ cable 13 cable retainer 14 cable mounting hole 15, 16 high-frequency line

Claims (7)

[Claims] 1. A mounting structure of an electric circuit device comprising a substrate, a high-frequency substrate, a circuit element, and a radiator, wherein the substrate is sandwiched between the radiator and a case, and a heat-generating component as the circuit element is provided. Directly attached to the radiator through a component mounting hole provided in the board, the high-frequency board is mounted in the component mounting hole of the board, and a high-frequency connector as the circuit element is provided through a cable mounting hole provided in the case. A mounting structure of the electric circuit device, wherein the electric circuit device is connected to the high-frequency board by a coaxial SJ cable. 2. An inner conductor of the SJ cable is connected to a high-frequency line of the high-frequency board, and an outer conductor of the SJ cable is mounted on the radiator by metal fittings through the component mounting hole of the board. The mounting structure of the electric circuit device according to claim 1. 3. The electric circuit according to claim 1, wherein an inner conductor of the SJ cable is connected to a high-frequency line of the high-frequency board, and an outer conductor of the SJ cable is attached to the board by soldering. Device mounting structure. 4. The radiator according to claim 1, wherein an inner conductor of the SJ cable is connected to a high-frequency line of the high-frequency board, and an outer conductor of the SJ cable is attached to the radiator with a conductive adhesive. Mounting structure of electric circuit device. 5. The apparatus according to claim 1, wherein a side surface of the substrate is formed by metal plating or the like so as not to leak at a high frequency, and a lid for shielding the case at a high frequency is attached to an upper portion of the case. 4. A mounting structure of the electric circuit device according to any one of 1 to 3. 6. The mounting structure for an electric circuit device according to claim 1, wherein the mounting structure is applicable to a high-frequency power amplifier mounted on an electronic device. 7. The mounting structure of an electric circuit device according to claim 1, wherein the mounting structure is applicable to a power amplifier mounted on audio equipment.