JP2001284776A - Method for cleaning printed board by using electrolytic ionized water - Google Patents
Method for cleaning printed board by using electrolytic ionized waterInfo
- Publication number
- JP2001284776A JP2001284776A JP2000329695A JP2000329695A JP2001284776A JP 2001284776 A JP2001284776 A JP 2001284776A JP 2000329695 A JP2000329695 A JP 2000329695A JP 2000329695 A JP2000329695 A JP 2000329695A JP 2001284776 A JP2001284776 A JP 2001284776A
- Authority
- JP
- Japan
- Prior art keywords
- water
- cleaning
- circuit board
- printed circuit
- electrolysis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品を半田付
けにて実装したプリント基板を洗浄する方法に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cleaning a printed circuit board on which electronic components are mounted by soldering.
【０００２】[0002]
【従来の技術】従来使用済みの電子部品実装プリント基
板はリサイクル事業のため再利用されている。その再利
用されるにあたり該プリント基板を洗浄し使用してい
る。従来のプリント基板の洗浄方法として、中性洗剤を
使用して洗浄を行った後純水にてすすぎ洗浄を行ってい
る。2. Description of the Related Art A conventionally used printed circuit board on which electronic parts are mounted is reused for a recycling business. The printed circuit board is cleaned and used before being reused. As a conventional method of cleaning a printed circuit board, a cleaning is performed using a neutral detergent, and then a rinsing is performed with pure water.
【０００３】[0003]
【発明が解決しようとする課題】この方法は、中性洗剤
を使用するため洗浄液が劣化した場合液全量を入れ替え
る必要があり、その洗浄液の再生には多大な費用を要す
る。又、洗剤であるために泡立ち等が起こり作業が煩雑
になる。さらに洗浄液の劣化に伴い洗浄品質が著しく低
下する。なお又純水を使用しているため、コストアップ
につながっている。According to this method, since a neutral detergent is used, when the cleaning liquid deteriorates, it is necessary to replace the entire amount of the cleaning liquid, and regeneration of the cleaning liquid requires a large cost. In addition, since the detergent is used, foaming or the like occurs and the operation becomes complicated. Further, the cleaning quality deteriorates significantly with the deterioration of the cleaning liquid. In addition, since pure water is used, the cost is increased.
【０００４】[0004]
【課題を解決するための手段】本発明は上記課題を解決
するためになされたものである。即ち、電子部品を半田
付けにて実装したプリント基板を洗浄する方法におい
て、洗浄水として電気分解によって生成したアルカリ性
水又は酸性水を圧力水にしてプリント基板に噴射して洗
浄する方法である。又、洗浄水としてｐＨ５．５以下、
温度２０℃以上８０℃以下の酸性水を用いる洗浄方法で
ある。さらに噴射圧力を０．５ＭＰａ以上３０ＭＰａ以
下とする洗浄方法である。さらに又、電子部品を半田付
けにて実装したプリント基板を洗浄する方法において、
洗浄水として電気分解によって生成したアルカリ性水を
圧力水にしてプリント基板に噴射したその後、酸性水で
プリント基板を洗浄する方法である。なお、電気伝導度
が４００μｓ／ｃｍ以下の電解イオン水で洗浄する方法
である。なお又、電解補助剤として、炭酸アルカリ金属
塩、炭酸アルカリ土類金属塩、炭酸水素アルカリ金属
塩、炭酸水素アルカリ土類金属塩のいずれかを添加し
て、生成したイオン水を用いて洗浄する方法である。な
お又、電子部品を半田付けにて実装したプリント基板を
洗浄する方法において、洗浄水として、電気分解によっ
て生成したアルカリ性水を圧力水にしてプリント基板の
実装面（１）に噴射し、酸性水を圧力水にしてプリント
基板のハンダ付け面（２）に噴射して洗浄する方法であ
る。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems. That is, in a method of cleaning a printed circuit board on which electronic components are mounted by soldering, a method in which alkaline water or acidic water generated by electrolysis as cleaning water is used as pressure water and sprayed onto the printed circuit board for cleaning. Moreover, pH 5.5 or less as washing water,
This is a washing method using acidic water at a temperature of 20 ° C. or more and 80 ° C. or less. Further, this is a cleaning method in which the injection pressure is 0.5 MPa or more and 30 MPa or less. Furthermore, in a method of cleaning a printed circuit board on which electronic components are mounted by soldering,
This is a method in which alkaline water generated by electrolysis as pressure water is jetted onto a printed circuit board as cleaning water, and then the printed circuit board is washed with acidic water. Note that this is a method of washing with electrolytic ion water having an electric conductivity of 400 μs / cm or less. Further, any one of an alkali metal carbonate, an alkaline earth metal salt, an alkali metal hydrogen carbonate, and an alkaline earth metal hydrogen carbonate is added as an electrolysis auxiliary, and the resultant is washed with ion water generated. Is the way. In a method of cleaning a printed circuit board on which electronic components are mounted by soldering, alkaline water generated by electrolysis is used as cleaning water, which is sprayed onto the mounting surface (1) of the printed circuit board as pressurized water. And pressurized water is applied to the soldering surface (2) of the printed circuit board for cleaning.
【０００５】[0005]
【発明の実施の形態】この発明の実施の形態について以
下説明する。電解イオン水を洗浄タンクに入れ、その際
洗浄液としてｐＨ８．０以上、温度２０℃以上８０℃以
下のアルカリ性水、又はｐＨ５．５以下、温度２０℃以
上８０℃以下の酸性水で、電気伝導度が４００μｓ／ｃ
ｍ以下の電解イオン水で、電解補助剤として、炭酸アル
カリ金属塩、炭酸アルカリ土類金属塩、炭酸水素アルカ
リ金属塩、炭酸水素アルカリ土類金属塩のいずれかを添
加して、生成したイオン水を用いる。Embodiments of the present invention will be described below. Electrolytic ionized water is put into a washing tank. At this time, alkaline water having a pH of 8.0 or more and a temperature of 20 to 80 ° C. or acidic water having a pH of 5.5 or less and a temperature of 20 to 80 ° C. Is 400 μs / c
m or less of electrolytic ionic water, and an alkali metal carbonate, an alkaline earth metal salt, an alkali metal hydrogencarbonate, or an alkaline earth metal hydrogencarbonate is added as an electrolysis aid to form ionic water. Is used.
【０００６】実際に洗浄を行った際、洗浄装置のタンク
の洗浄液を、ポンプを用いてノズルから０．５ＭＰａ以
上３０ＭＰａ以下の噴射を行いプリント基板を一定時間
洗浄する。又、電子部品の実装面（１）にはアルカリ性
水を使用し、ハンダ付け面（２）には酸性水を使用して
洗浄するのが好ましい。洗浄されたプリント基板に付着
した水分を圧力０．１ＭＰａ以上１ＭＰａ以下のエアー
ブローにて１０秒以上１８０秒以下の水切り、水分の除
去を行う。さらにエアーブロー工程にて水分を除去され
たプリント基板に４０℃以上７０℃以下の温風を１０分
ないし６０分あて、さらに細部の水分を除去する。When the cleaning is actually performed, the cleaning liquid in the tank of the cleaning device is sprayed from a nozzle at a pressure of 0.5 MPa or more and 30 MPa or less using a pump to wash the printed circuit board for a predetermined time. Further, it is preferable to wash the electronic component mounting surface (1) using alkaline water and the soldering surface (2) using acidic water. The water adhering to the washed printed circuit board is drained by an air blow at a pressure of 0.1 MPa or more and 1 MPa or less for 10 seconds to 180 seconds to remove water. Further, the printed circuit board from which water has been removed in the air blow step is exposed to warm air of 40 ° C. or more and 70 ° C. or less for 10 to 60 minutes to further remove water in detail.
【０００７】[0007]
【実施例１】電子レンジの電子部品を半田付けにて実装
したプリント基板を洗浄する方法において、洗浄水とし
て、電気分解によって生成したｐＨ９．５、温度６５℃
のアルカリ性水をポンプを使用し噴射圧力を１．０ＭＰ
ａの圧力水としてプリント基板に上下横方向より噴射し
て洗浄した。その際にプリント基板自らも回転テーブル
上に乗せてテーブルを回転させることにより洗浄水がく
まなくあたるようにした。又使用したアルカリ性水は、
電解補助剤として、炭酸アルカリ金属塩を添加して生成
したイオン水を用いて、電気伝導度が３５０μｓ／ｃｍ
であった。上記の条件の洗浄液を使用し１分間洗浄機を
運転したところプリント基板は良好な状態で洗浄され
た。Embodiment 1 In a method of cleaning a printed circuit board on which electronic components of a microwave oven are mounted by soldering, a pH of 9.5 generated by electrolysis and a temperature of 65 ° C. are used as cleaning water.
Injection pressure of 1.0MP using alkaline water pump
Cleaning was performed by spraying the pressure water of a on the printed circuit board from above and below in the horizontal direction. At that time, the printed circuit board itself was put on a rotary table and the table was rotated so that the washing water was applied all over. The alkaline water used is
Using ion water generated by adding an alkali metal carbonate as an electrolysis auxiliary, the electric conductivity is 350 μs / cm.
Met. When the cleaning machine was operated for 1 minute using the cleaning liquid under the above conditions, the printed circuit board was cleaned in a good condition.
【０００８】[0008]
【実施例２】テレビの電子部品を半田付けにて実装した
プリント基板を洗浄する方法において、洗浄水として、
電気分解によって生成したｐＨ９．５、温度６５℃のア
ルカリ性水をポンプを使用し噴射圧力を１．０ＭＰａの
圧力水としてプリント基板に上下横方向より噴射して洗
浄した。その際にプリント基板自らも回転テーブル上に
乗せてテーブルを回転させることにより洗浄水がくまな
くあたるようにし、その後さらに洗浄水として、電気分
解によって生成したｐＨ２．９、温度４５℃の酸性水を
ポンプを使用し噴射圧力を２．５ＭＰａの圧力水として
プリント基板に上下横方向より噴射して洗浄した。その
際にもプリント基板自ら回転テーブル上に乗せてテーブ
ルを回転させることにより洗浄水がくまなくあたるよう
にした。又使用した酸性水は、電解補助剤として、炭酸
水素アルカリ金属塩を添加して生成したイオン水を用い
て、電気伝導度が３３０μｓ／ｃｍであった。上記の条
件の洗浄液を使用し合計２分間洗浄機を運転したところ
プリント基板は良好な状態で洗浄された。図１に示すよ
うにその後エアーブローの水切りを行い乾燥工程を経て
洗浄を終了した。Embodiment 2 In a method for cleaning a printed circuit board on which electronic components of a television are mounted by soldering,
The alkaline water having a pH of 9.5 and a temperature of 65 ° C. generated by the electrolysis was sprayed onto the printed circuit board from above and below in a horizontal direction by using a pump as a pressure water having an injection pressure of 1.0 MPa and washed. At that time, the printed circuit board itself is put on a rotary table and the table is rotated so that the washing water is applied all over, and then, as washing water, acidic water of pH 2.9 and temperature of 45 ° C. generated by electrolysis is further used. Using a pump, the jet pressure was sprayed onto the printed circuit board from the upper and lower sides as pressure water of 2.5 MPa to wash the printed circuit board. At that time, the printed circuit board itself was put on a rotary table and the table was rotated so that the washing water was applied all over. The acidic water used was ion water produced by adding an alkali metal hydrogencarbonate as an electrolysis auxiliary, and had an electric conductivity of 330 μs / cm. When the cleaning machine was operated for a total of 2 minutes using the cleaning liquid under the above conditions, the printed circuit board was cleaned in a good condition. After that, as shown in FIG. 1, the water was removed by air blow, and the washing was completed through a drying process.
【０００９】[0009]
【実施例３】電子レンジの電子部品を半田付けにて実装
したプリント基板を洗浄する方法において、洗浄水とし
て、電気分解によって生成したｐＨ１０．４、温度６５
℃のアルカリ性水をポンプを使用し噴射圧力を３．０Ｍ
Ｐａの圧力水としてプリント基板に上面方向より噴射し
て実装面（１）を洗浄し、同時に下面方向より洗浄水と
して、電気分解によって生成したｐＨ２．８、温度６５
℃の酸性水をポンプを使用し噴射圧力を２．０ＭＰａの
圧力水としてプリント基板のハンダ付け面（１）に噴射
して洗浄した。その際にプリント基板自らも回転テーブ
ル上に乗せてテーブルを回転させることにより洗浄水が
くまなくあたるようにした。又使用したアルカリ性水
は、電解補助剤として、炭酸アルカリ金属塩を添加して
生成したイオン水を用いて、電気伝導度が３５０μｓ／
ｃｍであった。上記の条件の洗浄液を使用し３分間洗浄
機を運転したところプリント基板は良好な状態で洗浄さ
れた。Embodiment 3 In a method of cleaning a printed circuit board on which electronic components of a microwave oven are mounted by soldering, a pH of 10.4 and a temperature of 65 generated by electrolysis are used as cleaning water.
Injection pressure of 3.0M alkaline water using a pump and 3.0M
The mounting surface (1) is washed by spraying from the upper surface direction onto the printed circuit board as the pressure water of Pa, and at the same time, the washing water is washed from the lower surface direction, pH 2.8 generated by electrolysis, temperature 65
Cleaning was performed by injecting acidic water at a temperature of 2.0 ° C. into a soldering surface (1) of a printed circuit board using a pump at an injection pressure of 2.0 MPa as pressure water. At that time, the printed circuit board itself was put on a rotary table and the table was rotated so that the washing water was applied all over. The alkaline water used was ionic water generated by adding an alkali metal carbonate as an electrolysis auxiliary, and the electric conductivity was 350 μs /
cm. When the cleaning machine was operated for 3 minutes using the cleaning liquid under the above conditions, the printed circuit board was cleaned in a good condition.
【００１０】[0010]
【発明の効果】請求項１記載の方法による効果について
は、従来の洗剤による方法は繰り返し使用すると劣化す
るが、本発明によるイオン水は蒸発分の補充によって洗
浄性が維持できる。又環境に悪影響を及ぼす成分を含ま
ない。さらにイオン水と圧力噴射を組み合わせると、洗
浄効果が相乗的に高まる。なお従来行っていた純水での
すすぎ洗浄は必要としない。As to the effect of the method according to the first aspect, the conventional method using a detergent deteriorates when it is repeatedly used. However, the ion water according to the present invention can maintain its cleaning property by replenishing the evaporation. In addition, it does not contain components that adversely affect the environment. Further, when ion water and pressure injection are combined, the cleaning effect is synergistically enhanced. The conventional rinsing with pure water is not required.
【００１１】請求項２記載の方法による効果について
は、アルカリ水は油分除去効果が高く、再生プリント基
板のゴミ汚れ除去に有効である。又酸性水はフラックス
除去の際白色変色がないため再生プリント基板の劣化が
ない。さらに温度が２０℃ないし８０℃の範囲で洗浄す
ると、イオン水の効果が高まる、又乾燥性が良くなり処
理速度が速くできる。なお又乾燥温度が低くでき、又乾
燥時間が短くできるため電子部品への熱影響が防げる。In the method according to the second aspect, alkaline water has a high oil removing effect, and is effective for removing dust and dirt from a recycled printed circuit board. The acidic water does not discolor the white color when the flux is removed, so that the recycled printed circuit board does not deteriorate. Further, washing at a temperature in the range of 20 ° C. to 80 ° C. enhances the effect of ionized water, improves the drying property, and can increase the processing speed. In addition, since the drying temperature can be lowered and the drying time can be shortened, heat influence on the electronic components can be prevented.
【００１２】請求項３記載の方法による効果について
は、洗浄性が高くなり、ＩＣの足・チップ部品・コイル
の隙間の汚れ等の細かな電子部品の細部に付着した汚れ
の除去効果が高まる。With respect to the effect of the method according to the third aspect, the cleaning property is improved, and the effect of removing dirt attached to fine details of electronic components such as dirt in gaps between IC feet, chip components, and coils is enhanced.
【００１３】請求項４記載の方法による効果について
は、アルミニウム等のアルカリ水に長時間接触している
と変色が見られる金属には、酸性水洗浄で中和すること
で防止できる。[0013] The effect of the method according to claim 4 can be prevented by neutralizing a metal such as aluminum which is discolored when exposed to alkaline water for a long time by washing with acidic water.
【００１４】請求項５記載の方法による効果について
は、イオン残渣が問題になる精密なプリント基板でも純
水によるすすぎが不要である。[0014] Regarding the effect of the method according to the fifth aspect, rinsing with pure water is unnecessary even for a precise printed circuit board in which ionic residues are a problem.
【００１５】請求項６記載の方法による効果について
は、電解補助剤にハロゲン化塩を添加すると、ハロゲン
化物イオンが電子部品の電気導通部表面の腐食を促進
し、錆の発生につながるが、本発明ではこれを防止でき
る。The effect of the method according to claim 6 is that, when a halide is added to the electrolysis auxiliary, halide ions promote corrosion of the surface of the electrically conductive portion of the electronic component and lead to rust. The invention can prevent this.
【００１６】請求項７記載の方法による効果について
は、アルカリ水は油分除去効果が高く、再生プリント基
板のゴミ汚れ除去に有効である。又酸性水はフラックス
除去の際白色変色がないため再生プリント基板の劣化が
ない。このことからそれぞれの液を同時に噴射すること
で工程の短縮ができ、同時に排水が中和され排水工程の
簡略化が図れる。In the method according to the seventh aspect, alkaline water has a high oil removing effect, and is effective in removing dust and dirt from a recycled printed circuit board. The acidic water does not discolor the white color when the flux is removed, so that the recycled printed circuit board does not deteriorate. Therefore, the process can be shortened by simultaneously injecting the respective liquids, and at the same time, the wastewater is neutralized, and the wastewater process can be simplified.
【図１】本発明に係る洗浄方法の工程図である。FIG. 1 is a process chart of a cleaning method according to the present invention.
【図２】プリント基板の実装面とハンダ付け面を示す図
である。FIG. 2 is a diagram illustrating a mounting surface and a soldering surface of a printed circuit board.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 三宅 俊幸 滋賀県東浅井郡びわ町大字細江30番地 高 橋金属株式会社内 (72)発明者 大塚 俊實 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 栗田 均 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 山田 隆 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 十河 正親 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 3B201 AA01 AB01 AB34 BB82 BB90 BB96 CC12 5E343 AA02 AA11 CC33 CC43 CC52 CC54 EE01 EE04 EE18 FF23 GG11 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshiyuki Miyake 30 Hosoe, Oji, Biwa-cho, Higashi-Asai-gun, Shiga Prefecture Inside Takahashi Metal Co., Ltd. Inside (72) Inventor Hitoshi Kurita 1006 Kadoma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Takashi Yamada 1006 Odaka, Kazuma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Masachika Togawa 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term (reference) 3B201 AA01 AB01 AB34 BB82 BB90 BB96 CC12 5E343 AA02 AA11 CC33 CC43 CC52 CC54 EE01 EE04 EE18 FF23 GG11
Claims (7)
基板を洗浄する方法において、洗浄水として、電気分解
によって生成したアルカリ性水又は酸性水を圧力水にし
てプリント基板に噴射して洗浄する方法。1. A method for cleaning a printed circuit board on which electronic components are mounted by soldering, wherein alkaline water or acid water generated by electrolysis is used as cleaning water, and the water is jetted onto the printed circuit board for cleaning. .
以上８０℃以下のアルカリ性水、又はｐＨ５．５以下、
温度２０℃以上８０℃以下の酸性水を用いる請求項１記
載の洗浄方法。2. The washing water has a pH of 8.0 or more and a temperature of 20 ° C.
At least 80 ° C. or less alkaline water, or pH 5.5 or less,
The cleaning method according to claim 1, wherein acidic water having a temperature of 20C to 80C is used.
下とする請求項１又は２記載の洗浄方法。3. The cleaning method according to claim 1, wherein the injection pressure is 0.5 MPa or more and 30 MPa or less.
基板を洗浄する方法において、洗浄水として、電気分解
によって生成したアルカリ性水を圧力水にしてプリント
基板に噴射したその後、酸性水でプリント基板を洗浄す
る方法。4. A method for cleaning a printed circuit board on which electronic components are mounted by soldering, wherein alkaline water generated by electrolysis is pressured as a cleaning water and jetted onto the printed circuit board. How to wash.
イオン水で洗浄する請求項１乃至４記載のいずれかであ
る洗浄方法。5. The cleaning method according to claim 1, wherein the cleaning is performed with electrolytic ion water having an electric conductivity of 400 μs / cm or less.
炭酸アルカリ土類金属塩、炭酸水素アルカリ金属塩、炭
酸水素アルカリ土類金属塩のいずれかを添加して、生成
したイオン水を用いて洗浄することを特徴とする請求項
１乃至５記載のいずれかの洗浄方法。6. An alkali metal carbonate as an electrolysis auxiliary,
The method according to any one of claims 1 to 5, wherein one of an alkaline earth metal carbonate, an alkali metal hydrogencarbonate, and an alkaline earth metal hydrogencarbonate is added, and washing is performed using the generated ionic water. How to wash.
基板を洗浄する方法において、洗浄水として、電気分解
によって生成したアルカリ性水を圧力水にしてプリント
基板の実装面（１）に噴射し洗浄を行う。又、酸性水を
圧力水にしてプリント基板のハンダ付け面（２）に噴射
して洗浄する方法。7. A method for cleaning a printed circuit board on which electronic components are mounted by soldering, wherein alkaline water generated by electrolysis is used as cleaning water, and the cleaning water is sprayed onto the mounting surface (1) of the printed circuit board. I do. Also, a method of cleaning by spraying the soldering surface (2) of the printed circuit board using acidic water as pressure water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000329695A JP2001284776A (en) | 2000-01-26 | 2000-09-22 | Method for cleaning printed board by using electrolytic ionized water |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-57863 | 2000-01-26 | ||
| JP2000057863 | 2000-01-26 | ||
| JP2000329695A JP2001284776A (en) | 2000-01-26 | 2000-09-22 | Method for cleaning printed board by using electrolytic ionized water |
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| Publication Number | Publication Date |
|---|---|
| JP2001284776A true JP2001284776A (en) | 2001-10-12 |
Family
ID=26586668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000329695A Pending JP2001284776A (en) | 2000-01-26 | 2000-09-22 | Method for cleaning printed board by using electrolytic ionized water |
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| Country | Link |
|---|---|
| JP (1) | JP2001284776A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011005466A (en) * | 2009-06-29 | 2011-01-13 | Asahi Kasei Chemicals Corp | Cleaning method of electronic apparatus and cleaning apparatus for electronic apparatus |
| WO2016038701A1 (en) * | 2014-09-10 | 2016-03-17 | 中川特殊鋼株式会社 | Method for cleaning wire and device therefor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH067749A (en) * | 1992-06-29 | 1994-01-18 | Hitachi Chem Co Ltd | Method and apparatus for cleaning metal foil clad laminate |
| JPH08112573A (en) * | 1994-08-26 | 1996-05-07 | Toyota Central Res & Dev Lab Inc | Cleaner and cleaning method |
-
2000
- 2000-09-22 JP JP2000329695A patent/JP2001284776A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH067749A (en) * | 1992-06-29 | 1994-01-18 | Hitachi Chem Co Ltd | Method and apparatus for cleaning metal foil clad laminate |
| JPH08112573A (en) * | 1994-08-26 | 1996-05-07 | Toyota Central Res & Dev Lab Inc | Cleaner and cleaning method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011005466A (en) * | 2009-06-29 | 2011-01-13 | Asahi Kasei Chemicals Corp | Cleaning method of electronic apparatus and cleaning apparatus for electronic apparatus |
| WO2016038701A1 (en) * | 2014-09-10 | 2016-03-17 | 中川特殊鋼株式会社 | Method for cleaning wire and device therefor |
| US10689765B2 (en) | 2014-09-10 | 2020-06-23 | Nakagawa Special Steel Inc. | Method for cleaning wire and device therefor |
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