JP2001284130A - Inductance device - Google Patents

Inductance device

Info

Publication number
JP2001284130A
JP2001284130A JP2000091822A JP2000091822A JP2001284130A JP 2001284130 A JP2001284130 A JP 2001284130A JP 2000091822 A JP2000091822 A JP 2000091822A JP 2000091822 A JP2000091822 A JP 2000091822A JP 2001284130 A JP2001284130 A JP 2001284130A
Authority
JP
Japan
Prior art keywords
conductive plates
primary
conductive
conductive plate
inductance element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000091822A
Other languages
Japanese (ja)
Inventor
Satoshi Tomioka
聡 富岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Lambda Corp
Original Assignee
TDK Lambda Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Lambda Corp filed Critical TDK Lambda Corp
Priority to JP2000091822A priority Critical patent/JP2001284130A/en
Publication of JP2001284130A publication Critical patent/JP2001284130A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide an inductance device which can be improved in conductor space factor and reduced in current loss. SOLUTION: Primary conductive plates 1, 1A, and 1B are connected together to constitute a winding structure, in a state in which they are stacked up. Likewise, secondary conductive plates 2 and 2A are superposed on the primary side to form a winding structure. The conductive plates 1, 1A, 1B, 2, and 2A, each formed as nearly a flat plate are used for a primary and a secondary side respectively, by which the inductance device of this constitution can be improved in conductor space factor. The conductive plates 1, 1A, 1B, 2, and 2A, serving as a winding structure, are regulated in thickness corresponding to an operating current, by which the inductance device can be reduced in current loss.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、空芯あるいは磁芯
入りのコイル,トランスなどの巻き線構造を有するイン
ダクタンス素子に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inductance element having a winding structure such as a coil or transformer having an air core or a magnetic core.

【0002】[0002]

【発明が解決しようとする課題】例えば、スイッチング
電源装置に用いられるコイル,トランスなどのインダク
タンス素子は、一般に、導電性を有する断面円形の線材
を、樹脂又は紙などからなるボビンに巻装し、このボビ
ンに巻装された導電体の中心部に、必要に応じて磁性部
材たるコアを挿入するようにしている。したがって、従
来におけるインダクタンス素子の製造工程では、少なく
とも導電体を巻くという作業が不可欠であり、製造工程
において、ボビンを回転させながら、導電体を均一に巻
かなければならず、これにより工数の削減や自動化生産
などを図ることが困難であるという問題があった。
For example, an inductance element such as a coil and a transformer used in a switching power supply device is generally formed by winding a conductive wire having a circular cross section on a bobbin made of resin or paper. A core as a magnetic member is inserted into the center of the conductor wound around the bobbin as necessary. Therefore, in the conventional manufacturing process of the inductance element, at least the work of winding the conductor is indispensable, and in the manufacturing process, the conductor must be wound uniformly while rotating the bobbin, thereby reducing the number of steps. And it is difficult to achieve automated production.

【0003】また、上記のような構成のトランスでは、
導体として断面円形の線材を使用するため、コア内部の
導体占有率が小さく、さらに、ボビンを必要とするた
め、ボビン分だけ、導体占有率が低下し、一般に、コア
内部における導体の占有率は30から40%となる。
[0003] In the transformer having the above configuration,
Since a wire having a circular cross section is used as the conductor, the conductor occupancy in the core is small, and furthermore, since a bobbin is required, the conductor occupancy is reduced by the amount of the bobbin. It becomes 30 to 40%.

【0004】一方、比較的薄型化が可能なものとして、
プレーナトランスがあり、このプレーナトランスでは多
層基板を構成する基材に圧銅箔により巻線部を形成する
が、0.1ミリ以上の圧銅箔を使用することは困難であ
り、前記基材の厚さを0.1ミリ以下にすることも困難
であるため、導体占有率は20から30%である。
[0004] On the other hand, as a device that can be relatively thinned,
There is a planar transformer, and in this planar transformer, a winding portion is formed by a copper foil on a base material constituting a multilayer substrate. However, it is difficult to use a copper foil having a thickness of 0.1 mm or more. It is also difficult to reduce the thickness of the conductor to 0.1 mm or less, so that the conductor occupancy is 20 to 30%.

【0005】さらに、上記線材を用いるものでは、外部
接続用に別個の端子金具などが必要になると共に、該端
子金具に線材を電気的に接続する工程を要するため、製
造工数の削減が困難であり、同様に前記プレーナトラン
スでも外部接続用の端子金具を別個に取り付ける必要が
ある。
Further, in the case of using the above-mentioned wire, a separate terminal fitting or the like is required for external connection, and a step of electrically connecting the wire to the terminal fitting is required, so that it is difficult to reduce the number of manufacturing steps. Yes, similarly, it is necessary to separately attach terminal fittings for external connection in the planar transformer.

【0006】そこで、本発明は上記問題点を解決して、
導体占有率を向上することができ、電流損失を低減でき
るインダクタンス素子を提供することを目的とし、さら
に、外部との接続構造が簡易となるインダクタンス素子
を提供することを目的とする。
Accordingly, the present invention solves the above problems,
It is an object of the present invention to provide an inductance element that can improve the conductor occupancy and reduce the current loss, and further provide an inductance element that has a simple connection structure with the outside.

【0007】[0007]

【課題を解決するための手段】請求項1の発明は、平板
状をなす環状体の一部に開口部を形成して端部を設ける
と共に、これら端部側に接続部を設けた1次側と2次側
の導電板を形成し、これら1次側と2次側の導電板の少
なくとも一方を複数用いると共に、それら1次側と2次
側の導電板を絶縁状態で重ね合せ、前記複数用いた側の
導電板は、上の導電板の一方の接続部を下の導電板の他
方の接続部に接続したものである。
According to a first aspect of the present invention, there is provided a primary element in which an opening is formed in a part of a plate-shaped annular body to provide an end, and a connecting part is provided on the end side. Side and secondary side conductive plates are formed, at least one of these primary side and secondary side conductive plates is used in plurality, and the primary side and secondary side conductive plates are superposed in an insulated state. The conductive plate on the side where a plurality of conductive plates are used has one connecting portion of the upper conductive plate connected to the other connecting portion of the lower conductive plate.

【0008】上記構成により、1次側及び2次側とも導
電板を用いるから、導体占有率を向上することができ、
また、巻き線となる導電板の厚さを、使用する電流に合
せることにより、電流損失を低減することができる。
According to the above configuration, since the primary and secondary sides use conductive plates, the conductor occupancy can be improved.
Further, the current loss can be reduced by adjusting the thickness of the conductive plate serving as a winding to the current to be used.

【0009】請求項2の発明は、前記複数用いた側の導
電板は、最上部の前記他方の接続部と最下部の前記一方
の接続部を外部端子としたものである。
According to a second aspect of the present invention, in the conductive plate on the plurality of sides, the other connection part at the top and the one connection part at the bottom are used as external terminals.

【0010】上記構成により、接続部を外部端子として
直接基板などに接続することにより、導電板側の熱を基
板側に効率よく放熱することができる。
According to the above configuration, by connecting the connecting portion directly to the substrate or the like as an external terminal, heat on the conductive plate side can be efficiently radiated to the substrate side.

【0011】請求項3の発明は、前記接続部は上下一側
に折曲形成されているものである。
According to a third aspect of the present invention, the connecting portion is formed to be bent on one side of the upper and lower sides.

【0012】上記構成により、板片部分を折曲げること
により接続部を簡便に形成することができる。
According to the above configuration, the connecting portion can be simply formed by bending the plate portion.

【0013】請求項4の発明は、前記重ね合わせた1次
側と2次側の導電板にコアを設けたものである。
According to a fourth aspect of the present invention, a core is provided on the superposed primary and secondary conductive plates.

【0014】上記構成により、コアと1次側と2次側の
導電板を備えたトランスが得られる。
According to the above configuration, a transformer having the core, the primary side and the secondary side conductive plates can be obtained.

【0015】請求項5の発明は、前記導電板は略四方形
をなし、重ね合わせ状態で前記1次側と2次側の導電板
はそれぞれの前記接続部を異なる辺に配置したものであ
る。
According to a fifth aspect of the present invention, the conductive plate has a substantially quadrangular shape, and the primary and secondary conductive plates are arranged on different sides in a superposed state. .

【0016】上記構成により、1次側と2次側がそれぞ
れ異なる位置に集まるため、それぞれの側での接続部同
士の接続作業が容易となる。
According to the above configuration, since the primary side and the secondary side are gathered at different positions, the connection work of the connecting portions on each side becomes easy.

【0017】請求項6の発明は、前記導電板は略長方形
をなし、重ね合わせ状態で前記1次側と2次側の導電板
はそれぞれの前記接続部を対向する短辺に配置したもの
である。
According to a sixth aspect of the present invention, the conductive plate has a substantially rectangular shape, and the primary and secondary conductive plates are arranged such that the connecting portions are disposed on opposite short sides in an overlapping state. is there.

【0018】上記構成により、1次側と2次側がそれぞ
れ異なる位置に集まるため、それぞれの側での接続部同
士の接続作業が容易で、かつ長片側に出っ張りがないた
め、トランスなどに適用したコンパクトに製造すること
ができる。
According to the above configuration, the primary side and the secondary side are gathered at different positions, respectively, so that the connection work of the connecting portions on each side is easy, and there is no protrusion on one long side. It can be manufactured compactly.

【0019】請求項7の発明は、前記重ね合わせた導電
板の間に絶縁用シートを配置したものである。
According to a seventh aspect of the present invention, an insulating sheet is disposed between the superposed conductive plates.

【0020】上記構成により、絶縁構造を簡略化し、製
造を容易に行うことができる。
According to the above configuration, the insulating structure can be simplified and the manufacturing can be easily performed.

【0021】請求項8の発明は、前記1次側と2次側の
導電板の一方を複数重ね合わせると共に、この重ね合わ
せた一方の導電板の上下に他方の導電板を重ね合わせた
ものである。
The invention according to claim 8 is the one wherein a plurality of one of the primary side and the secondary side conductive plates are overlapped, and the other conductive plate is overlapped above and below one of the stacked conductive plates. is there.

【0022】上記構成により、他方の導電板の間に、複
数重ね合せた導電板を挿入することにより組立てること
できるから、製造が容易となる。
According to the above configuration, the assembly can be performed by inserting a plurality of superposed conductive plates between the other conductive plates, thereby facilitating the manufacture.

【0023】[0023]

【発明の実施形態】以下、添付図面に基づき、本発明に
おけるインダクタンス素子の実施例を説明する。図1〜
図7は、本発明のインダクタンス素子をトランスに適用
した例を示すものであり、同図に示すように、1次側の
導電板1,1A,1B及び2次側の導電板2,2Aは、
銅,真鍮などに代表される導電性を有する金属板から形
成され、該金属板を打ち抜き(プレス)あるいはワイヤ
ーカットなどの機械的加工を施すことにより得られたも
のである。前記各導電板1,1A,1B,2,2Aは、
平面略長方形の環状体3を有し、この環状体3は内部に
略長方形の中空部4を有し、前記環状体3の一部に開口
部5,5A,5B,6,6Aを形成して該環状体3の端
部3T,3Tを形成している。すなわち、前記開口部
5,5A,5B,6,6Aを挟む両側に、環状体3の端
部3T,3Tがある。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an inductance element according to the present invention will be described below with reference to the accompanying drawings. Figure 1
FIG. 7 shows an example in which the inductance element of the present invention is applied to a transformer. As shown in FIG. 7, the primary conductive plates 1, 1A and 1B and the secondary conductive plates 2 and 2A are ,
It is formed from a conductive metal plate represented by copper, brass, or the like, and is obtained by subjecting the metal plate to mechanical processing such as punching (pressing) or wire cutting. The conductive plates 1, 1A, 1B, 2, 2A are:
The annular body 3 has a substantially rectangular planar shape. The annular body 3 has a substantially rectangular hollow portion 4 inside, and has openings 5, 5A, 5B, 6, 6A formed in a part of the annular body 3. Thus, the end portions 3T of the annular body 3 are formed. That is, the ends 3T, 3T of the annular body 3 are located on both sides of the openings 5, 5A, 5B, 6, 6A.

【0024】図4に示すように、1次側の前記導電板1
の一方の端部3Tには、一方の接続部である外部端子11
を形成し、他方の端部3Tには、他方の接続部11Aを形
成する。前記導電板1Aの一方の端部3Tには、一方の
接続部12を形成し、他方の端部3Tには、他方の接続部
12Aを形成する。前記導電板1Bの一方の端部3Tに
は、一方の接続部13を形成し、他方の端部3Tには、他
方の接続部である外部端子13Aを形成する。尚、前記開
口部5,5A,5Bは、前記環状体3の短片3Sの左,
中央,右に形成され、外部端子11,13A及び各接続部11
A,12,12A,13は前記短片3Sの周縁3Fから突出し
て形成されている。
As shown in FIG. 4, the conductive plate 1 on the primary side is
One end 3T has an external terminal 11 which is one connection part.
Is formed, and the other connecting portion 11A is formed at the other end 3T. One connecting portion 12 is formed at one end 3T of the conductive plate 1A, and the other connecting portion is formed at the other end 3T.
Form 12A. At one end 3T of the conductive plate 1B, one connecting portion 13 is formed, and at the other end 3T, an external terminal 13A as the other connecting portion is formed. The openings 5, 5A, 5B are located on the left of the short piece 3S of the annular body 3,
It is formed at the center and right, and the external terminals 11 and 13A and the connecting portions 11
A, 12, 12A and 13 are formed to protrude from the peripheral edge 3F of the short piece 3S.

【0025】そして、前記導電板1,1A,1Bを重ね
合せると共に、これらの間に絶縁用シート21を配置して
相互の絶縁を行う。尚、絶縁用シート21には例えば厚さ
が数十ミクロンのものが用いられる。前記導電板1にお
いて、前記外部端子11は下向きに折曲げた垂設部111と
この垂設部111の下部を外側水平に折曲げた接地部112と
を有し、一方、前記他方の接続部11Aは、短片3Sの周
縁3Fから突出する突出部111Aを形成し、この突出部1
11Aの先端を上向きに折曲形成してなる。前記導電板1
Aにおいて、前記一方の接続部12は、下の前記接続部11
Aに対応する位置に設けられており、周縁3Fから突出
する突出部121の先端を上向きに折曲形成してなり、こ
の突出部121に比べて前記突出部111Aは接続部11Aの厚
さ(導電板の厚さ)分だけ長く形成され、一方、前記他
方の接続部12Aは、短片3Sの周縁3Fから突出する突
出部121Aを形成し、この突出部121Aの先端を上向きに
折曲形成してなる。前記導電板1Bにおいて、前記一方
の接続部13は、下の前記接続部12Aに対応する位置に設
けられており、周縁3Fから突出する突出部131の先端
を上向きに折曲形成してなり、この突出部131に比べて
前記突出部121Aは接続部12Aの厚さ分だけ長く形成さ
れ、一方、前記外部端子13Aは下向きに折曲げた垂設部
131Aとこの垂設部131Aの下部を外側水平に折曲げた接
地部132Aとを有し、該外部端子13Aの高さは、導電板
1,1A,1Bの間に絶縁用シート21,21を挟んで重ね
合せた状態で、その接地部132Aと前記接地部112が同一
になるように設定されている。前記絶縁用シート21は前
記中空部4より狭い中空部21Aを有し、その外周は前記
環状体3の周縁3Fより広く形成されており、該絶縁用
シート21の短片21S及び長片21Lは前記環状体3の短片
3S及び長片より幅広に形成されている。また、図7示
すように、下の他方の接続部11Aと上の一方の接続部12
とが重ね合わされ、下の接続部11Aの先端11S側と上の
接続部12の側面とを半田や溶接などの接合部22により接
続し、これにより接続部11Aと接続部12とが電気的に接
続されると共に、上下の導電板1,1Aが一体化され、
また、これと同様にして、下の他方の接続部12Aと上の
一方の接続部13とが重ね合わされて接合部22により接続
される。
Then, the conductive plates 1, 1A, 1B are overlapped with each other, and an insulating sheet 21 is arranged between them to insulate each other. The insulating sheet 21 has a thickness of, for example, several tens of microns. In the conductive plate 1, the external terminal 11 has a vertically extending portion 111 bent downward and a grounding portion 112 having a lower portion of the vertically extending portion 111 horizontally bent outward, and one of the other connecting portions is provided. 11A forms a protruding portion 111A protruding from the peripheral edge 3F of the short piece 3S.
The tip of 11A is formed by bending upward. The conductive plate 1
A, the one connecting portion 12 is connected to the lower connecting portion 11.
A is provided at a position corresponding to A, and the tip of a protruding portion 121 protruding from the peripheral edge 3F is formed by bending upward, and the protruding portion 111A has a thickness ( On the other hand, the other connecting portion 12A forms a projecting portion 121A projecting from the peripheral edge 3F of the short piece 3S, and the tip of the projecting portion 121A is bent upward. It becomes. In the conductive plate 1B, the one connecting portion 13 is provided at a position corresponding to the lower connecting portion 12A, and is formed by bending a tip of a protruding portion 131 protruding from the peripheral edge 3F upward, The protruding portion 121A is formed longer than the protruding portion 131 by the thickness of the connecting portion 12A, while the external terminal 13A is formed by a downwardly bent vertical portion.
131A and a ground portion 132A obtained by bending a lower portion of the vertical portion 131A outward and horizontally. The height of the external terminal 13A is such that the insulating sheets 21, 21 are provided between the conductive plates 1, 1A, 1B. The grounding portion 132A and the grounding portion 112 are set to be the same in a state of being sandwiched and superposed. The insulating sheet 21 has a hollow portion 21A that is narrower than the hollow portion 4, and its outer periphery is formed wider than the peripheral edge 3F of the annular body 3. The short piece 21S and the long piece 21L of the insulating sheet 21 are The ring 3 is formed wider than the short piece 3S and the long piece. Also, as shown in FIG. 7, the lower other connecting portion 11A and the upper one connecting portion 12A
Are connected to each other, and the distal end 11S side of the lower connecting portion 11A and the side surface of the upper connecting portion 12 are connected by a connecting portion 22 such as solder or welding, so that the connecting portion 11A and the connecting portion 12 are electrically connected. While being connected, the upper and lower conductive plates 1 and 1A are integrated,
Similarly, the lower connecting portion 12A and the upper connecting portion 13 are overlapped and connected by the bonding portion 22.

【0026】図5に示すように、2次側の前記導電板2
の一方の端部3Tには、一方の接続部である外部端子14
を形成し、他方の端部3Tには接続部14Aを形成する。
前記導電板2Aの一方の端部3Tには、他方の接続部た
る外部端子15Aを形成する。前記開口部6,6Aは、前
記環状体3の短片3Sの左,右に形成され、外部端子1
4,15A及び各接続部14A,15は前記短片3Sの周縁3
Fから突出して形成されている。
As shown in FIG. 5, the conductive plate 2 on the secondary side
One end 3T has an external terminal 14 which is one connection part.
Is formed, and a connection portion 14A is formed at the other end 3T.
At one end 3T of the conductive plate 2A, an external terminal 15A as the other connecting portion is formed. The openings 6 and 6A are formed on the left and right of the short piece 3S of the annular body 3, and the external terminal 1
4 and 15A and the connecting portions 14A and 15 are formed on the periphery 3 of the short piece 3S.
It is formed to protrude from F.

【0027】そして、重ね合せた1次側の前記導電板
1,1A,1Bの上下に、前記絶縁用シート21,21を介
して、2次側の前記導電板2A,2が絶縁状態で重ね合
わされる。前記導電板2において、前記外部端子14は下
向きに折曲げた垂設部141とこの垂設部141の下部を外側
水平に折曲げた接地部142とを有し、一方、前記他方の
接続部14Aは、短片3Sの周縁3Fから突出する突出部
141Aを形成し、この突出部141Aの先端を上向きに折曲
形成してなる。前記導電板2Aにおいて、前記一方の接
続部15は、下の前記接続部14Aに対応する位置に設けら
れており、周縁3Fから突出する突出部151の先端を上
向きに折曲形成してなり、この突出部151に比べて前記
突出部141Aは接続部14Aの厚さ分だけ長く形成され、
一方、前記外部端子15Aは下向きに折曲げた垂設部151
Aとこの垂設部151Aの下部を外側水平に折曲げた接地
部152Aとを有し、該外部端子15Aの高さは、絶縁用シ
ート21,21,21,21と導電板1,1A,1Bとの上下か
ら、導電板2A,2を重ね合せた状態で、その接地部15
2Aと前記接地部142が同一になるように設定されてい
る。また、図7に示した下の他方の接続部11Aと上の一
方の接続部12との接続と同様にして、下の他方の接続部
14Aと上の一方の接続部15とが重ね合わされて接合部22
により接続される。
On the upper and lower sides of the superposed primary conductive plates 1, 1A, 1B, the secondary conductive plates 2A, 2 are superposed in an insulated state via the insulating sheets 21, 21. Is done. In the conductive plate 2, the external terminal 14 has a vertically extending portion 141 bent downward and a grounding portion 142 having a lower portion of the vertically extending portion 141 horizontally bent outwardly, and one of the other connecting portions. 14A is a protruding portion protruding from the peripheral edge 3F of the short piece 3S.
141A is formed, and the tip of the projection 141A is bent upward. In the conductive plate 2A, the one connecting portion 15 is provided at a position corresponding to the lower connecting portion 14A, and is formed by bending a tip of a protruding portion 151 protruding from the peripheral edge 3F upward, The projecting portion 141A is formed longer than the projecting portion 151 by the thickness of the connecting portion 14A,
On the other hand, the external terminal 15A is provided with a vertical portion 151 bent downward.
A and a grounding portion 152A obtained by bending the lower portion of the vertical portion 151A outward and horizontally. The height of the external terminal 15A is determined by the insulating sheets 21, 21, 21, 21 and the conductive plates 1, 1A, In the state where the conductive plates 2A and 2 are overlapped from above and below with respect to
2A and the ground part 142 are set to be the same. Also, in the same manner as the connection between the other lower connection portion 11A and the upper one connection portion 12 shown in FIG.
14A and the upper one connecting portion 15 are overlapped to form a joining portion 22.
Connected by

【0028】前記絶縁用シート21により相互に絶縁状態
で重ね合せた前記導電板2,1,1A,1B,2Aに
は、さらにその上下に前記絶縁用シート21を配置し、こ
れらの上下から上下一対のコア31,31が組み込まれ、こ
のコア31は磁性部材からなり、平板部32の両側に側壁3
3,33を設け、これら側壁33,33の間に、前記中空部
4,21A…に挿入配置する中央部34を有する。
On the conductive plates 2, 1, 1A, 1B, 2A which are superposed on each other in an insulating state by the insulating sheet 21, the insulating sheets 21 are further disposed above and below the conductive plates 2, 1, 1A, 1B, 2A. A pair of cores 31, 31 are incorporated, and the core 31 is made of a magnetic member.
3 and 33, and a central portion 34 inserted between the side walls 33 and 33 and inserted into the hollow portions 4, 21A.

【0029】次に前記トランスの製造方法につき説明す
ると、各導電板1,1A,1B,2,2Aは、外部端子
及び接続部を形成する板片部分を含めて環状体3を打ち
抜きなどにより形成する。例えば、導電板1であれば、
環状体3と外部端子11部分と接続部11A部分とを、1枚
の銅板から打ち抜く。次に、図4に示すように、折曲加
工により外部端子11と接続部11Aを形成する。同様にし
て、打ち抜き及び折曲加工により各導電板1A,1B,
2,2Aを形成する。次に、1次側においては、導電板
1,1A,1Bの間に絶縁用シート21,21を挟み、環状
体3部分を相互に絶縁した状態で重ね合せる。これによ
り、上下で対応する接続部11Aと接続部12、接続部12A
と接続部13が接触し、それぞれを接合部22,22により接
合する。これにより1次側の導電板1,1A,1Bが一
体化された1次側組立体35を形成し、外部端子11,下の
環状体3,接続部11A,接続部12,中の環状体3,接続
部12A,接続部13,上の環状体3,外部端子13Aの順で
連続する巻き線構造が形成される。また、2次側におい
ては、前記1次側組立体35を挿入可能な間隔H分だけ、
上下の導電板2A,2を離した状態で重ね合せ、接続部
14Aと接続部15とを接合部22により接合し、2次側の導
電板2,2Aが一体化された2次側組立体36を形成し、
外部端子14,下の環状体3,接続部14A,接続部15,上
の環状体3,外部端子15Aの順で連続する巻き線構造が
2次側の導電体2,2Aにより形成される。
Next, the method of manufacturing the transformer will be described. Each of the conductive plates 1, 1A, 1B, 2, 2A is formed by punching an annular body 3 including a plate piece forming an external terminal and a connecting portion. I do. For example, in the case of the conductive plate 1,
The annular body 3, the external terminal 11 and the connecting portion 11A are punched out of one copper plate. Next, as shown in FIG. 4, the external terminal 11 and the connection portion 11A are formed by bending. Similarly, each of the conductive plates 1A, 1B,
2, 2A are formed. Next, on the primary side, the insulating sheets 21, 21 are sandwiched between the conductive plates 1, 1A, 1B, and the annular members 3 are superposed in a state where they are insulated from each other. As a result, the upper and lower corresponding connection portions 11A, 12 and 12A
And the connecting portion 13 come into contact with each other, and are joined by the joining portions 22 and 22, respectively. As a result, a primary assembly 35 in which the primary conductive plates 1, 1A, 1B are integrated is formed, and the external terminal 11, the lower annular body 3, the connecting portion 11A, the connecting portion 12, and the inner annular body are formed. 3, the connecting portion 12A, the connecting portion 13, the upper annular body 3, and the external terminal 13A form a continuous winding structure in this order. Further, on the secondary side, only the interval H at which the primary side assembly 35 can be inserted is provided.
When the upper and lower conductive plates 2A and 2 are separated from each other,
14A and the connecting portion 15 are joined by the joining portion 22 to form a secondary assembly 36 in which the secondary conductive plates 2 and 2A are integrated,
A winding structure that is continuous with the external terminal 14, the lower annular body 3, the connecting portion 14A, the connecting portion 15, the upper annular body 3, and the external terminal 15A is formed by the conductors 2 and 2A on the secondary side.

【0030】そして、2次側組立体36の間に1次側組立
体35を厚さ方向から挿入して両者を組立て、さらに、そ
の上下からコア31,31を組み付け、図6に示すようなト
ランス37が得られ、各外部端子11,13A,14,15Aの接
地部112,132A,142,15Aは同一平面に位置する。そ
して、このようなに1次側の導電板1,1A,1Bを重
ね合せ状態で接続して巻き線構造を形成し、同様に2次
側の導電板2,2Aを1次側に重ね合せて巻き線構造を
形成することにより、全体の高さを抑えることができる
と共に、導体占有率を50から60%とすることができ
る。
Then, the primary assembly 35 is inserted between the secondary assemblies 36 from the thickness direction to assemble them, and the cores 31, 31 are assembled from above and below the primary assembly 35, as shown in FIG. The transformer 37 is obtained, and the grounding portions 112, 132A, 142, 15A of the external terminals 11, 13A, 14, 15A are located on the same plane. Then, the primary side conductive plates 1, 1A, 1B are connected in a superposed state to form a winding structure, and similarly, the secondary side conductive plates 2, 2A are superposed on the primary side. By forming the winding structure, the overall height can be suppressed and the conductor occupancy can be set to 50 to 60%.

【0031】このように本実施例では、請求項1に対応
して、平板状をなす環状体3の一部に開口部5,5A,
5B,6,6Aを形成して端部3T,3Tを設けると共
に、これら端部3T,3T側に接続部11,11A,12,12
A,13,13A,14,14A,15,15Aを設けた1次側と2
次側の導電板1,1A,1B,2,2Aを形成し、これ
ら1次側と2次側の導電板1,1A,1B,2,2Aの
少なくとも一方を複数用いると共に、(本実施例では、
1次側及び2次側の両方に複数の導電板を用いた)それ
ら1次側と2次側の導電板1,1A,1B,2,2Aを
絶縁状態で重ね合せ、前記複数用いた側の導電板1,1
A,1B,2,2Aは、上の導電板の一方の接続部12,
13,15を下の導電板の他方の接続部11A,12A,14Aに
接続したから、1次側及び2次側とも略平板状の導電板
1,1A,1B,2,2Aを用いることにより、導体占
有率を向上することができ、また、巻き線構造となる導
電板1,1A,1B,2,2Aの厚さを使用する電流に
合せることにより、電流損失を低減することができる。
As described above, in the present embodiment, the openings 5, 5A, 5A,
5B, 6 and 6A are formed to provide ends 3T and 3T, and connecting portions 11, 11A, 12, and 12 are provided on the ends 3T and 3T.
Primary side with A, 13,13A, 14,14A, 15,15A and 2
The conductive plates 1, 1A, 1B, 2, 2A on the secondary side are formed, and at least one of the conductive plates 1, 1A, 1B, 2, 2A on the primary side and the secondary side is used in a plural number (this embodiment Then
(A plurality of conductive plates are used for both the primary side and the secondary side.) The primary side and the secondary side conductive plates 1, 1A, 1B, 2, 2A are superposed in an insulated state, and the plurality of sides are used. Conductive plate 1, 1
A, 1B, 2, 2A are connected to one connecting portion 12,
Since 13 and 15 are connected to the other connecting portions 11A, 12A and 14A of the lower conductive plate, the primary and secondary sides use substantially flat conductive plates 1, 1A, 1B, 2, and 2A. The conductor occupancy can be improved, and the current loss can be reduced by adjusting the thickness of the conductive plates 1, 1A, 1B, 2, 2A having a winding structure to the current to be used.

【0032】また、このように本実施例では、請求項2
に対応して、前記複数用いた側の導電板1,1A,1B
は、最上部の前記他方の接続部と最下部の前記一方の接
続部を外部端子13A,11とし、また、前記複数用いた側
の導電板2,2Aは、最上部の前記他方の接続部と最下
部の前記一方の接続部を外部端子15A,14としたから、
接続部を外部端子11,13A,14,15Aとして直接基板な
どに接続することにより、導電板1,1A,1B,2,
2A側の熱を基板側に効率よく放熱することができ、比
較的大きな電流を使用するに適したものとなる。そし
て、外部端子11,13A,14,15Aの接地部112,132A,
142,15Aを外部の基板等に半田付けすれば、一層放熱
性に優れたものとなる。
Further, as described above, in this embodiment, claim 2
Corresponding to the plurality of conductive plates 1, 1A, 1B
Are the external terminals 13A and 11 as the uppermost other connecting portion and the lowermost one connecting portion, and the plurality of conductive plates 2 and 2A are the uppermost other connecting portion. And the one connection part at the bottom was made external terminals 15A and 14,
By connecting the connecting portions directly to the substrate or the like as the external terminals 11, 13A, 14, 15A, the conductive plates 1, 1A, 1B, 2,
The heat on the 2A side can be efficiently radiated to the substrate side, which is suitable for using a relatively large current. Then, the grounding portions 112, 132A of the external terminals 11, 13A, 14, 15A,
If 142 and 15A are soldered to an external substrate or the like, the heat radiation can be further improved.

【0033】このように本実施例では、請求項3に対応
して、接続部11A,12,12A,13,14A,15は上下一側
に折曲形成されているから、板片部分を折曲げることに
より接続部11A,12,12A,13,14A,15を簡便に形成
することができる。
As described above, according to the third embodiment, since the connecting portions 11A, 12, 12A, 13, 14A, and 15 are formed to be bent at the upper and lower sides, the plate piece is folded. The connection portions 11A, 12, 12A, 13, 14A, and 15 can be easily formed by bending.

【0034】このように本実施例では、請求項4に対応
して、前記重ね合わせた1次側と2次側の導電板1,1
A,1B,2,2Aにコア31,31を設けたから、コア3
1,31と1次側と2次側の導電板1,1A,1B,2,
2Aを備え、大電流に適用可能となり、所謂パワートラ
ンスに適したものとなる。
As described above, in this embodiment, the first and second conductive plates 1 and 1 overlapped with each other.
A, 1B, 2, 2A are provided with cores 31, 31,
1, 31 and primary and secondary conductive plates 1, 1A, 1B, 2,
2A, it can be applied to a large current, and is suitable for a so-called power transformer.

【0035】このように本実施例では、請求項5に対応
して、導電板1,1A,1B,2,2Aは略四方形をな
し、重ね合わせ状態で1次側と2次側の導電板1,1
A,1B,2,2Aはそれぞれの接続部11,11A,12,
12A,13,13A,14,14A,15,15Aを異なる辺に配置
したから、1次側の接続部11,11A,12,12A,13,13
Aが集まり、異なる片に2次側の接続部14,14A,15,
15Aが集まるから、それぞれの側での接続部同士の接続
作業が容易となる。
As described above, in the present embodiment, the conductive plates 1, 1A, 1B, 2, and 2A have a substantially quadrangular shape, and the conductive plates on the primary side and the secondary side are overlapped with each other. Board 1,1
A, 1B, 2, 2A are connection parts 11, 11A, 12,
Since 12A, 13, 13A, 14, 14A, 15, 15A are arranged on different sides, the connection parts 11, 11A, 12, 12A, 13, 13 on the primary side are arranged.
A gathers and the secondary side connection parts 14, 14A, 15,
Since 15A is gathered, the connection work between the connection parts on each side becomes easy.

【0036】このように本実施例では、請求項6に対応
して、導電板1,1A,1B,2,2Aは略長方形をな
し、重ね合わせ状態で前記1次側と2次側の導電板1,
1A,1B,2,2Aはそれぞれの接続部11,11A,1
2,12A,13,13A,14,14A,15,15Aを対向する短
辺3S,3Sに配置したから、それぞれの側での接続部
11,11A,12,12A,13,13A,14,14A,15,15A同
士の接続作業が容易で、かつ導電板はその長片側に出っ
張りがないため、トランスなどに適用してコンパクトな
製品を製造することができる。
As described above, according to the present embodiment, the conductive plates 1, 1A, 1B, 2, 2A have a substantially rectangular shape, and the primary and secondary conductive plates are overlapped with each other. Plate 1,
1A, 1B, 2, 2A are connection parts 11, 11A, 1 respectively.
2,12A, 13,13A, 14,14A, 15,15A are arranged on the opposite short sides 3S, 3S, so the connection part on each side
The connection work between 11, 11A, 12, 12A, 13, 13A, 14, 14A, 15, 15A is easy, and the conductive plate has no protrusion on one long side. Can be manufactured.

【0037】このように本実施例では、請求項7に対応
して、前記重ね合わせた導電板1,1A,1B,2,2
Aの間に絶縁用シート21を配置したから、絶縁構造を簡
略化し、製造を容易に行うことができる。
As described above, in the present embodiment, the conductive plates 1, 1A, 1B, 2, 2
Since the insulating sheet 21 is arranged between A, the insulating structure can be simplified and the manufacturing can be performed easily.

【0038】このように本実施例では、請求項8に対応
して、1次側と2次側の導電板の一方である1次側の導
電板1,1A,1Bを複数重ね合わせると共に、この重
ね合わせた一方の導電板1,1A,1Bの上下に他方の
導電板2A,2を重ね合わせたから、他方の導電板2,
2Aの間に、複数重ね合せた導電板1,1A,1Bを挿
入することにより組立を行うことができ、製造が容易と
なる。
As described above, in this embodiment, a plurality of primary conductive plates 1, 1A, and 1B, which are one of the primary and secondary conductive plates, are overlapped with each other. Since the other conductive plates 2A and 2 are overlapped on the upper and lower sides of the one conductive plate 1, 1A and 1B,
By inserting a plurality of superposed conductive plates 1, 1A, 1B between 2A, assembly can be performed, and manufacturing becomes easy.

【0039】本発明は上記実施例に限定されるものでは
なく、本発明の要旨の範囲において種々の変形実施が可
能である。例えば、実施例では、面実装トランスを例に
説明したが、各種のインダクタンス素子に適用可能であ
る。また、1次側と2次側で一方が1枚の導電板のみ用
いるものでもよく、実施例では、1次側が3枚で2次側
が2枚で説明したが、これ以上でもよいことは言うまで
もない。さらに、使用条件により、1次側と2次側で導
電板の厚さを変えることができる。
The present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention. For example, in the embodiment, the surface mount transformer has been described as an example, but the present invention can be applied to various inductance elements. In addition, one of the primary side and the secondary side may use only one conductive plate. In the embodiment, three primary sides and two secondary sides have been described. However, it goes without saying that more may be used. No. Furthermore, the thickness of the conductive plate can be changed between the primary side and the secondary side depending on the use conditions.

【0040】[0040]

【発明の効果】請求項1の発明は、平板状をなす環状体
の一部に開口部を形成して端部を設けると共に、これら
端部側に接続部を設けた1次側と2次側の導電板を形成
し、これら1次側と2次側の導電板の少なくとも一方を
複数用いると共に、それら1次側と2次側の導電板を絶
縁状態で重ね合せ、前記複数用いた側の導電板は、上の
導電板の一方の接続部を下の導電板の他方の接続部に接
続したものであり、導体占有率を向上することができ、
電流損失を低減できるインダクタンス素子を提供するこ
とができる。
According to the first aspect of the present invention, an opening is formed in a part of a flat plate-shaped annular body to provide an end, and a connecting part is provided at the end side of the primary side and the secondary side. Side conductive plate is formed, and at least one of these primary side and secondary side conductive plates is used in plurality, and the primary side and secondary side conductive plates are overlapped in an insulated state, and The conductive plate is one in which one connection portion of the upper conductive plate is connected to the other connection portion of the lower conductive plate, and the conductor occupancy can be improved,
An inductance element capable of reducing current loss can be provided.

【0041】請求項2の発明は、前記複数用いた側の導
電板は、最上部の前記他方の接続部と最下部の前記一方
の接続部を外部端子としたものであり、外部との接続構
造が簡易で、導体占有率を向上することができ、電流損
失を低減できるインダクタンス素子を提供することがで
きる。
According to a second aspect of the present invention, the conductive plate on the plurality of sides uses the other connection part at the top and the one connection part at the bottom as an external terminal, and is connected to the outside. It is possible to provide an inductance element that has a simple structure, can improve the conductor occupancy, and can reduce current loss.

【0042】請求項3の発明は、前記接続部は上下一側
に折曲形成されているものであり、導体占有率を向上す
ることができ、電流損失を低減できるインダクタンス素
子を提供することができる。
According to a third aspect of the present invention, there is provided an inductance element in which the connection portion is bent at one of the upper and lower sides, so that the conductor occupancy can be improved and the current loss can be reduced. it can.

【0043】請求項4の発明は、前記重ね合わせた1次
側と2次側の導電板にコアを設けたものであり、導体占
有率を向上することができ、電流損失を低減できるイン
ダクタンス素子を提供することができる。
According to a fourth aspect of the present invention, there is provided an inductance element in which a core is provided on the superposed primary and secondary conductive plates, whereby the conductor occupancy can be improved and the current loss can be reduced. Can be provided.

【0044】請求項5の発明は、前記導電板は略四方形
をなし、重ね合わせ状態で前記1次側と2次側の導電板
はそれぞれの前記接続部を異なる辺に配置したものであ
り、導体占有率を向上することができ、電流損失を低減
できるインダクタンス素子を提供することができる。
According to a fifth aspect of the present invention, the conductive plate has a substantially rectangular shape, and the primary and secondary conductive plates are arranged on different sides in a superposed state. Thus, it is possible to provide an inductance element that can improve the conductor occupancy and reduce the current loss.

【0045】請求項6の発明は、前記導電板は略長方形
をなし、重ね合わせ状態で前記1次側と2次側の導電板
はそれぞれの前記接続部を対向する短辺に配置したもの
であり、導体占有率を向上することができ、電流損失を
低減できるインダクタンス素子を提供することができ
る。
According to a sixth aspect of the present invention, the conductive plate has a substantially rectangular shape, and the primary and secondary conductive plates are arranged such that the respective connection portions are arranged on opposite short sides in an overlapping state. In addition, it is possible to provide an inductance element that can improve the conductor occupancy and reduce current loss.

【0046】請求項7の発明は、前記重ね合わせた導電
板の間に絶縁用シートを配置したものであり、導体占有
率を向上することができ、電流損失を低減できるインダ
クタンス素子を提供することができる。
According to a seventh aspect of the present invention, there is provided an inductance element in which an insulating sheet is arranged between the superposed conductive plates, whereby the conductor occupancy can be improved and the current loss can be reduced. .

【0047】請求項8の発明は、前記1次側と2次側の
導電板の一方を複数重ね合わせると共に、この重ね合わ
せた一方の導電板の上下に他方の導電板を重ね合わせた
ものであり、導体占有率を向上することができ、電流損
失を低減できるインダクタンス素子を提供することがで
きる。
According to an eighth aspect of the present invention, a plurality of one of the primary side and the secondary side conductive plates are overlapped, and the other conductive plate is overlapped above and below one of the stacked conductive plates. In addition, it is possible to provide an inductance element that can improve the conductor occupancy and reduce current loss.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例を示す分解斜視図である。FIG. 1 is an exploded perspective view showing one embodiment of the present invention.

【図2】同上1次側の導電体の斜視図である。FIG. 2 is a perspective view of a primary-side conductor according to the first embodiment;

【図3】同上2次側の導電体の斜視図である。FIG. 3 is a perspective view of a secondary-side conductor according to the first embodiment;

【図4】同上組立前の1次側の導電体の斜視図である。FIG. 4 is a perspective view of a primary-side conductor before assembling.

【図5】同上組立前の2次側の導電体と絶縁用シートの
斜視図である。
FIG. 5 is a perspective view of a secondary-side conductor and an insulating sheet before assembling.

【図6】同上組立状態の斜視図である。FIG. 6 is a perspective view of the same assembling state.

【図7】同上接続部同士の接合を説明する断面図であ
る。
FIG. 7 is a cross-sectional view illustrating the joining of the connection parts.

【符号の説明】[Explanation of symbols]

1,1A,1B 導電体(1次側の導電板) 2,2A 導電体(2次側の導電板) 3 環状体 3S 短片 11 外部端子(一方の接続部) 13A 外部端子(他方の接続部) 12,13,15 接続部(一方の接続部) 14 外部端子(一方の接続部) 15A 外部端子(他方の接続部) 11A,12A,14A 接続部(他方の接続部) 21 絶縁用シート 31 コア 1, 1A, 1B conductor (primary side conductive plate) 2, 2A conductor (secondary side conductive plate) 3 annular body 3S short piece 11 external terminal (one connection part) 13A external terminal (the other connection part) 12, 13, 15 Connections (one connection) 14 External terminals (one connection) 15A External terminals (the other connection) 11A, 12A, 14A Connections (the other connection) 21 Insulation sheet 31 core

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 平板状をなす環状体の一部に開口部を形
成して端部を設けると共に、これら端部側に接続部を設
けた1次側と2次側の導電板を形成し、これら1次側と
2次側の導電板の少なくとも一方を複数用いると共に、
それら1次側と2次側の導電板を絶縁状態で重ね合せ、
前記複数用いた側の導電板は、上の導電板の一方の接続
部を下の導電板の他方の接続部に接続したことを特徴と
するインダクタンス素子。
An opening is formed in a part of a flat plate-shaped annular body to provide an end portion, and a primary side and a secondary side conductive plate provided with a connecting portion at the end side are formed. A plurality of at least one of these primary side and secondary side conductive plates,
The primary and secondary conductive plates are superposed in an insulated state,
The inductance element, wherein the plurality of conductive plates on one side have one connection portion of an upper conductive plate connected to the other connection portion of a lower conductive plate.
【請求項2】 前記複数用いた側の導電板は、最上部の
前記他方の接続部と最下部の前記一方の接続部を外部端
子としたことを特徴とする請求項1記載のインダクタン
ス素子。
2. The inductance element according to claim 1, wherein the conductive plate on the plurality of sides uses the other connection part at the top and the one connection part at the bottom as external terminals.
【請求項3】 前記接続部は上下一側に折曲形成されて
いることを特徴とする請求項1記載のインダクタンス素
子。
3. The inductance element according to claim 1, wherein the connection portion is formed to be bent at one side in the upper and lower directions.
【請求項4】 前記重ね合わせた1次側と2次側の導電
板にコアを設けたことを特徴とする請求項1〜3のいず
れか1項に記載のインダクタンス素子。
4. The inductance element according to claim 1, wherein a core is provided on the superposed primary and secondary conductive plates.
【請求項5】 前記導電板は略四方形をなし、重ね合わ
せ状態で前記1次側と2次側の導電板はそれぞれの前記
接続部を異なる辺に配置したことを特徴とする1〜4の
いずれか1項に記載のインダクタンス素子。
5. The conductive plate according to claim 1, wherein said conductive plate has a substantially quadrangular shape, and said primary and secondary conductive plates have their connection portions arranged on different sides in a superposed state. The inductance element according to any one of the above.
【請求項6】 前記導電板は略長方形をなし、重ね合わ
せ状態で前記1次側と2次側の導電板はそれぞれの前記
接続部を対向する短辺に配置したことを特徴とする請求
項1〜4のいずれか1項に記載のインダクタンス素子。
6. The conductive plate according to claim 1, wherein the conductive plate has a substantially rectangular shape, and the primary and secondary conductive plates are arranged on the opposite short sides in a superposed state. The inductance element according to any one of claims 1 to 4.
【請求項7】 前記重ね合わせた導電板の間に絶縁用シ
ートを配置したことを特徴とする1〜6のいずれか1項
に記載のインダクタンス素子。
7. The inductance element according to claim 1, wherein an insulating sheet is arranged between the superposed conductive plates.
【請求項8】 前記1次側と2次側の導電板の一方を複
数重ね合わせると共に、この重ね合わせた一方の導電板
の上下に他方の導電板を重ね合わせたことを特徴とする
請求項1〜7のいずれか1項に記載のインダクタンス素
子。
8. The semiconductor device according to claim 1, wherein one of the primary and secondary conductive plates is overlapped with a plurality of conductive plates, and the other conductive plate is overlapped above and below one of the stacked conductive plates. The inductance element according to any one of claims 1 to 7.
JP2000091822A 2000-03-29 2000-03-29 Inductance device Pending JP2001284130A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000091822A JP2001284130A (en) 2000-03-29 2000-03-29 Inductance device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000091822A JP2001284130A (en) 2000-03-29 2000-03-29 Inductance device

Publications (1)

Publication Number Publication Date
JP2001284130A true JP2001284130A (en) 2001-10-12

Family

ID=18607243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000091822A Pending JP2001284130A (en) 2000-03-29 2000-03-29 Inductance device

Country Status (1)

Country Link
JP (1) JP2001284130A (en)

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Publication number Priority date Publication date Assignee Title
WO2003036665A1 (en) * 2001-10-24 2003-05-01 Matsushita Electric Industrial Co., Ltd. Low-profile transformer and method of manufacturing the transformer
JP2005129590A (en) * 2003-10-21 2005-05-19 Tdk Corp Magnetically coupled element
JP2008537354A (en) * 2005-04-21 2008-09-11 ピーエステック カンパニーリミテッド Transformer having laminated winding structure
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CN105702426A (en) * 2014-11-28 2016-06-22 吴李文相 Planar coil, fabrication method thereof and planar transformer

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003036665A1 (en) * 2001-10-24 2003-05-01 Matsushita Electric Industrial Co., Ltd. Low-profile transformer and method of manufacturing the transformer
US6859130B2 (en) 2001-10-24 2005-02-22 Matsushita Electric Industrial Co., Ltd. Low-profile transformer and method of manufacturing the transformer
JP2005129590A (en) * 2003-10-21 2005-05-19 Tdk Corp Magnetically coupled element
JP4547889B2 (en) * 2003-10-21 2010-09-22 Tdk株式会社 Magnetic coupling element
JP2008537354A (en) * 2005-04-21 2008-09-11 ピーエステック カンパニーリミテッド Transformer having laminated winding structure
JP4838842B2 (en) * 2005-04-21 2011-12-14 ピーエステック カンパニーリミテッド Transformer having laminated winding structure
CN104766704A (en) * 2014-01-06 2015-07-08 吴李文相 Plane coil module and plane transformer using same
CN104766706A (en) * 2014-01-06 2015-07-08 吴李文相 Modular coil plate and coiling assembly thereof, and plane transformer comprising coil plate or coil assembly
CN105702425A (en) * 2014-11-28 2016-06-22 吴李文相 Planar coil and planar transformer
CN105702426A (en) * 2014-11-28 2016-06-22 吴李文相 Planar coil, fabrication method thereof and planar transformer

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