JP2015118986A - Winding component and power supply - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress parasitic capacitance between conductors.SOLUTION: In a winding component 10, a protrusion is provided so as not to overlap conductor patterns in plan view, thus making a coil winding 30 to be spaced apart from a coil substrate 20. This causes a gap to be formed between the conductor patterns (a first pattern and a second pattern) on the coil substrate 20 and the coil winding 30. Consequently, a region with a lower dielectric constant than that of an insulation material constituting the coil substrate 20 is provided between the coil winding 30 and the conductor patterns. With such a constitution, it is possible to reduce parasitic capacitance generated between the conductor patterns and the coil winding 30, when compared with a case where the coil winding 30 comes into contact with the coil substrate 20.

Description

  The present invention relates to a winding component and a power supply device using the winding component.

  In a switching power supply device such as an in-vehicle DC-DC converter, as a method for integrating electronic components including a coil such as a transformer with a substrate, for example, as shown in Patent Document 1, a component including a coil such as a transformer is used. A method of cutting out a substrate in a region to be formed and connecting electronic components is known. However, this method has a problem of increasing the cost because it is necessary to discard the cutout substrate and connect the electronic component to the substrate using screws or the like. Further, when the electronic component to be connected is a coil, it is necessary to radiate heat using an insulating heat radiating sheet or the like, which may increase the cost.

  Therefore, as shown in Patent Document 2, a method of manufacturing a coil portion by forming a coil pattern in a substrate and connecting the coil pattern and a sheet metal coil has been studied.

Japanese Patent No. 3334620 Japanese Patent No. 4635969

  However, when the coil described in Patent Document 2 is applied to the choke coil of the smoothing circuit in the switching power supply device, a parasitic capacitance is generated between the pattern coil and the sheet metal coil, which is generated in the switching element in the previous stage of the smoothing circuit. High-frequency components easily pass through the parasitic capacitance generation part, and high-frequency noise may occur. A method of dealing with high-frequency noise by providing a noise filter is also conceivable. However, in that case, there is a possibility that a new problem such as an increase in size and cost of the power supply device may occur.

  The present invention has been made in view of the above, and an object of the present invention is to provide a winding component capable of suppressing parasitic capacitance between conductors and a power supply device including the winding component.

  In order to achieve the above object, a winding component according to an embodiment of the present invention includes a coil substrate in which a conductor pattern wound around an axis is provided, and the coil on one surface of the coil substrate. A coil winding provided at a distance from the substrate and having one end connected to one end of the conductor pattern to form a coil wound around the axis along with the conductor pattern, the coil winding comprising: And a protrusion that protrudes toward the coil substrate at a position that does not overlap the conductor pattern in plan view, and the protrusion is fixed to the coil substrate.

  According to the winding component, the gap is provided between the conductor pattern of the coil substrate and the coil winding by disposing the coil winding away from the coil substrate. By providing the air gap, a region having a low dielectric constant is provided between the coil winding and the conductor pattern. Therefore, the conductor pattern is compared with the case where the coil winding is in contact with the coil substrate. The parasitic capacitance generated between the coil winding and the coil winding can be reduced. For example, high frequency noise components generated by elements such as MOS-FETs and rectifier diodes constituting the switching circuit upstream of the coil are in this region. It can suppress passing.

  Here, the said coil board | substrate can be set as the aspect which has a land for fixing the said protrusion part, and has a through-hole penetrated in the thickness direction between the said land and the said conductor pattern.

  In this case, a gap having a low dielectric constant formed by a through hole is provided between the land on which the projecting portion of the coil winding is fixed and the conductor pattern, thereby reducing the parasitic capacitance generated between the two. Can do.

  The coil substrate has a through hole penetrating in the thickness direction between conductors corresponding to positions separated from each other in the conductor pattern.

  If conductors corresponding to positions separated from each other in the coil among conductor patterns included in the coil substrate are arranged close to each other, parasitic capacitance may be generated between them. Therefore, the generation of parasitic capacitance can be suppressed by providing a through hole between the two.

  Further, the coil winding has a number of turns in a spiral shape on the same plane, and the outermost turn portion protrudes outward with respect to the axis and does not overlap the conductor pattern in plan view. The outer protrusion protruding toward the coil substrate and the inner protrusion protruding inward with respect to the axis at the innermost turn portion and protruding toward the coil substrate at a position not overlapping the conductor pattern in plan view An outer protrusion and the inner protrusion are fixed to the coil substrate.

  In this case, even in the case of a coil winding having a number of turns of a plurality of turns formed in a spiral shape, the outermost turn portion is fixed to the coil substrate by the outer protruding portion, and the innermost turn portion is fixed to the coil substrate. On the other hand, since it is fixed by the inner projecting portion, the generation of parasitic capacitance between the coil winding and the coil substrate can be suppressed, and the coil winding can be stably supported while being separated from the coil substrate.

  The coil board further includes a second coil winding that is provided on the other surface different from the one surface of the coil substrate so as to be separated from the coil substrate and forms the coil together with the conductor pattern and the coil winding. The second coil winding includes a second protrusion that protrudes toward the coil substrate at a position that does not overlap the conductor pattern and the protrusion of the coil winding in plan view, and the second protrusion is the coil. It can be set as the aspect fixed with respect to a board | substrate.

  As described above, when the second coil winding is provided, the second coil winding is also arranged so as to be separated from the coil substrate by the second protrusion, so that the conductor pattern of the coil substrate is provided. And a second coil winding. Thereby, the area | region where a dielectric constant is low compared with the insulating material which comprises a coil board | substrate will be provided between a 2nd coil winding and a conductor pattern. Therefore, by having such a configuration, the parasitic capacitance generated between the conductor pattern and the second coil winding is reduced as compared with the case where the second coil winding is in contact with the coil substrate. be able to. In addition, since the position where the second protrusion is fixed is a position that does not overlap the conductor pattern and the protrusion of the coil winding, it is possible to prevent the protrusion and the second protrusion from approaching each other.

  Here, the said coil board | substrate is equipped with the 2nd land for fixing the said 2nd protrusion part in planar view, and the aspect which has a through-hole penetrated in the thickness direction between the said 2nd land and the said conductor pattern It can be.

  Thus, by providing a gap with a low dielectric constant formed from a through hole between the second land and the conductor pattern, it is possible to reduce parasitic capacitance generated between the two lands.

  The coil winding is connected to the second coil winding via a conductor in the coil substrate on the other end side different from the one end side connected to the conductor pattern, and the conductor pattern, the coil winding A wire and the second coil winding may be connected in this order to form the coil.

  Thus, when the conductor pattern, the coil winding, and the second coil winding are connected in this order to form the coil, the use of two coil windings and the generation of parasitic capacitance between the conductors are suppressed. The winding component having the coil formed can be made smaller.

  In addition, this invention can also be called invention of a power supply device provided with winding components. Specifically, a power supply device according to the present invention includes the above-described winding component. In this case, the power supply device includes a winding component in which the coil winding is disposed apart from the coil substrate, so that the conductor pattern and the coil are compared with the case where the coil winding is in contact with the coil substrate. Parasitic capacitance generated between the coil and the winding can be suppressed, and high-frequency noise components generated in the MOS-FET or rectifier diode preceding the winding component can be suppressed from passing through the region.

  ADVANTAGE OF THE INVENTION According to this invention, the winding component which can suppress the parasitic capacitance between conductors, and a power supply device provided with this winding component are provided.

It is an exploded perspective view concerning an inductor constituted including winding components concerning a 1st embodiment. It is a perspective view of the coil board | substrate which comprises the coil | winding components which concern on 1st Embodiment. It is a perspective view explaining the conductor pattern in a coil board | substrate. It is a perspective view of the coil winding which comprises the coil components concerning a 1st embodiment. It is a perspective view of the coil | winding components after an assembly. It is a circuit block diagram of the power supply device to which winding components are applied. It is a perspective view of the coil winding which comprises the coil components concerning a 2nd embodiment. It is a perspective view from the lower surface side (bottom surface side) of a coil winding. It is a perspective view of the coil board | substrate which comprises the coil | winding components which concern on 2nd Embodiment. It is a perspective view of the coil | winding components after an assembly. It is a perspective view which shows the structure of the coil | winding components which concern on 3rd Embodiment. It is a perspective view of the coil board | substrate which comprises the coil | winding components which concern on 3rd Embodiment. It is a bottom view (bottom view) of the coil substrate of FIG. It is a perspective view which shows the structure of the coil winding which comprises the coil | winding components which concern on 3rd Embodiment. It is a perspective view which shows the structure of the 2nd coil winding which comprises the coil | winding components which concern on 3rd Embodiment. It is a disassembled perspective view explaining the assembly method of winding components. It is the disassembled perspective view which looked at FIG. 16 from the lower surface side.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

(First embodiment)
The winding component according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an exploded perspective view of an inductor including a winding component. FIG. 2 is a perspective view of a coil substrate constituting the winding component, and FIG. 3 is a perspective view for explaining a conductor pattern in the coil substrate. FIG. 4 is a perspective view of a coil winding constituting the winding component, and FIG. 5 is a perspective view of the winding component after assembly. FIG. 6 is a circuit configuration diagram of a power supply device to which a winding component is applied. In each figure, XYZ axes are described as necessary for the explanation of the configuration.

  The inductor 1 shown in FIG. 1 includes a winding component 10 and a pair of magnetic cores 5A and 5B that sandwich the winding component. The inductor 1 can be applied to, for example, a transformer or a choke coil in an electronic device. The winding component 10 includes a coil substrate 20 and a coil winding 30.

  In the winding component 10, a coil wound around an axis A extending in the Z-axis direction is formed by a conductor pattern in the coil substrate 20 extending along the XY plane and the coil winding 30. The pair of magnetic cores 5A and 5B are magnetic cores having a center leg portion called E type and two outer legs. Specifically, the magnetic cores 5A and 5B are so-called EER type magnetic cores in which the center leg is cylindrical and the inner side of the outer leg is provided with R along the cylindrical shape of the center leg.

  The coil substrate 20 is a multilayer printed circuit board in which insulating layers made of an insulating material and conductor layers on which a conductor pattern made of a conductor is formed are alternately stacked and the surface is covered with a resist layer. The coil substrate 20 according to the present embodiment is a four-layer printed board on which four conductor layers 21A to 21D are formed as shown in FIG. The shapes of the four conductor layers 21A to 21D can be changed for each layer to have different functions. However, in the coil substrate 20, the four conductor layers have the same function. In the description, the conductive pattern 21 will be described as shown in FIG.

  As shown in FIG. 2, a circular opening 22 is formed in the coil substrate 20. Further, the conductor pattern 21 formed inside the coil substrate 20 includes a first pattern 210 and a second pattern 220 that are formed apart from each other. The first pattern 210 is an end ring-shaped coil part 212 formed so as to be wound around an axis A passing through the center of the circular opening 22, and an end part on one side of the coil part 212, A connection portion 214 connected to a coil winding 30 described later and an end portion 216 connected to an external electronic component or the like on the other side of the coil portion 212 are continuously formed. The connection portion 214 is formed by exposing the uppermost conductor layer 21A to the outside. The end 216 is provided with a through hole 218. The through hole 218 is used as a via hole for connecting the four conductor layers 21A to 21D. Similarly, the through hole 219 on the connection part 214 side is also used as a via hole for connecting the four conductor layers 21A to 21D. 2 shows a configuration in which the conductor layers 21A to 21D are interrupted at the end portion 216 and the end portion 224, a circuit pattern related to other electronic components is formed on the coil substrate 20. The configuration may be continuous with the pattern.

  The second pattern 220 includes a connection portion 222 for connecting a coil winding 30 described later and an end portion 224 connected to an external electronic component or the like. The connecting portion 222 is formed by exposing the uppermost conductor layer 21A to the outside. Moreover, the through-hole for connecting the four conductor layers 21A-21D can also be formed as needed.

  In addition to the conductor pattern 21, the coil substrate 20 is formed with lands 231 to 233 made of a conductor. As shown in FIG. 3, the lands 231 to 233 are formed simultaneously with the first pattern 210 and the second pattern 220. That is, the lands 231 to 233 are formed by exposing the surface of the uppermost conductor layer 21 </ b> A, and are formed at three locations outside the coil portion 212 of the first pattern 210. The lands 231 to 233 are arranged so as to be dispersed on the outer peripheral side of the substantially circular coil portion 212. The number of land portions is not particularly limited, but the land portions are regions that fix coil windings 30 described later, and are preferably determined appropriately in consideration of stability.

  As shown in FIG. 3, the lands 231 to 233 are formed of a conductor that is not continuous with the coil portion 212. In addition, through holes 251 to 253 are formed between the lands 231 to 233 and the coil portion 212, as shown in FIG. Moreover, the coil part 212 is provided with recesses 213A to 213C at positions corresponding to the through holes 251 to 253 so that the conductor is not exposed to the through holes 251 to 253. The through holes 251 to 253 are provided between the lands 231 to 233 connected to the coil winding 30 and the coil portion 212, particularly in order to prevent a region where both are close from being continuous only by the insulating material of the coil substrate 20. It is done. For this reason, the through holes 251 to 253 have a size substantially corresponding to the lands 231 to 233. Note that the gap formed by the through holes 251 to 253 between the coil part 212 and the lands 231 to 233 is preferably formed in the entire area where they are close to each other, but at least a part of the gap is formed. It only has to be.

  In addition, a slit 29 cut from the outer edge of the coil substrate 20 is formed between the first pattern 210 and the second pattern 220 of the coil substrate 20. The slit 29 is provided in order to form a gap between the first pattern 210 and the second pattern 220 in the vicinity of each other. The slit 29 is preferably formed in the entire area where both are close to each other, but it is sufficient that a gap is formed at least in part. Further, a through hole may be formed instead of the slit 29.

  Next, the coil winding 30 formed from a conductor plate extending along the XY plane will be described. As shown in FIG. 4, the end ring-shaped coil winding 30 is substantially C-shaped and has a circular opening 31 in the center. The shape of the coil winding need not be substantially C-shaped, and may be another shape such as an elliptical shape or a rectangular shape. The coil winding 30 can be manufactured by punching a conductive metal plate such as copper.

  A first terminal portion 33 that is bent downward in the figure along the Z-axis direction is integrally provided at one end portion of the coil winding 30, and a similar second terminal portion is also provided at the other end portion. 34 is provided integrally. A C-shaped region between the first terminal portion 33 and the second terminal portion 34 functions as the coil portion 35. The coil winding 30 is provided with projecting portions 41 to 43 that project outward with respect to the axis A and are bent downward in the figure along the Z-axis direction. The positions where the protrusions 41 to 43 are provided correspond to the lands 231 to 233 formed on the coil substrate 20, but the coil winding 30 is more dispersed with respect to the axis A (not biased to one side). Can be stably supported. In addition, the edge part of the side connected to the land 231-233 of the protrusion parts 41-43 is the lower surface 37 (surface on the opposite side to the surface 36 visible in FIG. 4) which is one side surface of the coil winding 30. Need to be lower than. Moreover, it is preferable that the edge part of the protrusion parts 41-43 is the same height as the lower surface 37 side of the 1st terminal part 33, and the lower surface 37 side of the 2nd terminal part 34. FIG. Thereby, the coil winding 30 can be suitably fixed to the coil substrate 20.

  Next, the winding component combining the coil substrate 20 and the coil winding 30 will be described. As shown in FIG. 5, the winding component 10 is coil-wound in a state where the coil portion 35 is separated from the coil substrate 20 on one surface of the coil substrate 20 (the surface on which the connection portions 214 and 222 are formed). A wire 30 is attached. Specifically, the protruding portion 41 of the coil winding 30 contacts the land 231 of the coil substrate 20. Similarly, the projecting portion 42 of the coil winding 30 contacts the land 232 of the coil substrate 20, and the projecting portion 43 of the coil winding 30 contacts the land 233 of the coil substrate 20. Further, the first terminal portion 33 of the coil winding comes into contact with the connection portion 214 of the coil substrate 20, and the second terminal portion 34 comes into contact with the connection portion 222. Between the protruding part 41 and the land 231, between the protruding part 42 and the land 232, between the protruding part 43 and the land 233, between the first terminal part 33 and the connecting part 214, and the second terminal. The part 34 and the connection part 222 are fixed by soldering. As a result, the winding component 10 in which the coil winding 30 is fixed to the coil substrate 20 is obtained in a state where the coil portion 35 of the coil winding 30 is separated from the coil substrate 20. In the present embodiment, the protrusions 41 to 43 are configured to protrude outward with respect to the axis A. However, the present invention is not limited thereto, and for example, the protrusions 41 to 43 are provided on the inner peripheral side of the coil portion 35. Further, it is possible to adopt an aspect that protrudes inward with respect to the axis A. Moreover, it is good also as a structure which provided only the protrusion part 42 in the inner peripheral side of the coil part 35, and protruded the protrusion parts 41 and 43 outside, and depending on the thickness or material of the coil part 35, a protrusion part may be a coil part. You may provide in both the inner peripheral side and outer peripheral side of 35.

  Further, by assembling the winding component 10 by the above method, the opening 31 of the coil winding 30 and the opening 22 of the coil substrate 20 are in communication with each other in the Z-axis direction. 30 to obtain a coil wound around the axis A. That is, the winding component 10 is a coil winding that is connected to the connection portion 214 of the first pattern 210 with the end portion 216 of the first pattern 210 of the coil substrate 20 as the starting point and the coil portion 212 of the coil substrate 20 as the first turn. The coil part 35 from the first terminal part 33 of the wire 30 is the second turn, and the end of the second pattern 220 passes through the connection part 222 in the second pattern 220 of the coil substrate 20 connected to the second terminal part 34. A coil that terminates at the portion 224 is formed.

  Thereafter, returning to FIG. 1, the inductor 1 can be configured by attaching the pair of magnetic cores 5 </ b> A and 5 </ b> B to the winding component 10. The inductor 1 is configured such that two magnetic cores 5A and 5B, which are two E-type cores having three leg portions extending from a plate-like flat plate portion, face each other. Specifically, along the axis A of the coil formed by the winding component 10, the central leg 52 </ b> A among the three legs 51 </ b> A to 53 </ b> A of the magnetic core 5 </ b> A and the three legs of the magnetic core 5 </ b> B. The central leg part 52B of the parts 51B to 53B and the central part of the winding component 10 are inserted in a state of being opposed to each other, and the remaining leg parts 51A, 53A, 51B, 53B are along the outside of the winding component 10 The magnetic cores 5A and 5B are arranged so as to face each other.

  Next, an example of a power supply device that includes the winding component 10 will be described. FIG. 6 is a diagram showing an example of a circuit configuration diagram of the switching power supply device 70 when the inductor 1 shown in FIG. 1 is used as the smoothing choke coil 81 in the output smoothing circuit.

  The switching power supply device 70 includes four switching elements 71 to 74, and is a full bridge type bridge circuit that generates an input AC voltage based on a DC input voltage, a primary side winding 76, and a secondary side winding. A transformer 75 having lines 77 and 78, which transforms the input AC voltage to generate an output AC voltage, and diodes 79 and 80 that are provided on the secondary side of the transformer and are a plurality of rectifying elements. A full-wave rectifier circuit that rectifies the output AC voltage using the plurality of rectifier elements, a smoothing circuit having a smoothing choke coil 81 that converts the full-wave rectified pulse waveform into a direct current, and a capacitor 82 that is a capacitive element; A driving circuit for driving the bridge circuit, and connected between the output terminals.

  An outline of the operation of the circuit shown in FIG. 6 will be described below. First, the voltage of the high voltage battery 86 is applied to the input terminal 83, and the DC voltage is operated by the PWM control, the phase shift PWM control or the like using the switching elements 71 to 74, and the primary side winding 76 of the transformer 75 is operated. Applied as alternating current. The AC voltage applied to the primary side winding 76 is transmitted at a voltage corresponding to the ratio with the secondary side windings 77 and 78, is full-wave rectified by the diodes 79 and 80, and is applied to the smoothing choke coil 81 and the capacitive element. A smoothing circuit having a capacitor 82 is led to the output terminal 84 as a direct current. As a load connected to the output terminal 84, a low voltage battery 87 and auxiliary machinery 85 are connected. The control circuit 88 controls the voltage between the output terminals 84, performs the control as described above, and sends a drive signal to the switching elements 71 to 74 through the drive circuit 89 to perform the above operation. .

  The inductor 1 shown in FIG. 1 is regarded as the smoothing choke coil 81 shown in FIG. 6, and the end 216 of the winding component 10 shown in FIG. 5 is connected to the cathodes of the diodes 79 and 80 shown in FIG. They are connected by conductor patterns and terminals. Further, the end 224 is connected to one terminal of the capacitor 82 of FIG. 6 as a subsequent circuit and one input end of the control circuit 88 by a conductor pattern or a terminal provided on the substrate.

  Here, in the above-described winding component 10, the protruding portions 41 to 43 protrude from the coil winding 30 toward the coil substrate 20 at positions that do not overlap the conductor pattern 21 of the coil substrate 20 in plan view. The protrusions 41 to 43 are bent toward the lower coil substrate 20, and the protrusions 41 to 43 are fixed to the lands 231 to 233 formed separately from the first pattern 210 and the second pattern 220, respectively. Thus, the coil winding 30 is provided away from the coil substrate 20. As described above, the coil winding 30 is disposed away from the coil substrate 20, so that the conductor pattern 21 (particularly, the first pattern 210 and the second pattern 220) of the coil substrate 20 and the coil winding 30 are arranged. A void is provided. The provision of the air gap means that a region having a lower dielectric constant than that of the insulating material constituting the coil substrate 20 is provided between the coil winding 30 and the conductor pattern 21. Therefore, by having such a configuration, the parasitic capacitance generated between the conductor pattern 21 and the coil winding 30 is reduced as compared with the case where the coil winding 30 is in contact with the coil substrate 20. Therefore, it is possible to suppress a high-frequency noise component generated by an element such as a MOS-FET or a rectifier diode constituting the switching circuit upstream of the coil from passing through the region.

  Accordingly, in the power supply apparatus that accommodates the winding component 10 as described above, the generation of parasitic capacitance in the region formed by the winding component 10 can be similarly reduced, so that it is generated in the preceding MOS-FET or rectifier diode. The high frequency noise component to be transmitted can be suppressed from passing through the region.

  Further, in the winding component 10 described above, the protruding portions 41 to 43 made of a conductor formed integrally with the coil winding 30 are fixed to the lands 231 to 233 provided on the coil substrate 20 by soldering. . That is, the coil winding 30 and the lands 231 to 233 are electrically connected. On the other hand, through holes 213A to 213C are also formed between the lands 231 to 233 and the coil portion 212 of the first pattern 210 which is a conductor pattern close to the lands 231 to 233, respectively. That is, a gap is provided between each of the lands 231 to 233 and the coil portion 212. Therefore, the parasitic capacitance generated between the lands 231 to 233 and the coil part 212 can be suppressed, and the passage of high-frequency noise components can also be suppressed.

  Further, in the coil substrate 20 in the above-described embodiment, through-holes penetrating in the thickness direction are formed between conductors corresponding to positions separated from each other in the coil in the conductor pattern 21. Specifically, a slit 29 is formed between the first pattern 210 and the second pattern 220. In the first pattern 210, the vicinity of the connection portion 214 on the second pattern 220 side is the vicinity of the terminal end of the first turn among the coils formed by the winding component 10. On the other hand, the vicinity of the connection portion 222 of the second pattern 220 is near the end of the second turn of the coil formed by the winding component 10. That is, the vicinity of the connection portion 214 of the first pattern 210 and the second pattern 220 which are close to each other via the slit 29 are conductors forming the same coil, but correspond to positions separated from each other. Therefore, by forming a gap by providing a through hole (slit) that penetrates in the thickness direction of the coil substrate 20 between the two, parasitic capacitance generated between the two can be suppressed and high-frequency noise components can be passed. Can also be suppressed.

(Second Embodiment)
Next, the winding component according to the second embodiment will be described with reference to FIGS. FIG. 7 is a perspective view of a coil winding constituting the winding component according to the second embodiment, and FIG. 8 is a perspective view from the lower surface side (bottom surface side) of the coil winding. FIG. 9 is a perspective view of a coil substrate constituting the winding component according to the second embodiment. FIG. 10 is a perspective view of the winding component after assembly. The winding component according to the second embodiment is different from the winding component according to the first embodiment in the following points. That is, the number of turns in the coil winding is increased, and the number of fixing points with respect to the coil substrate is increased corresponding to the increase in the number of turns.

  First, the coil winding will be described. The coil winding 30A shown in FIGS. 7 and 8 is formed from a substantially spiral conductive plate extending along the XY plane, and has a circular opening 31 in the center.

  A first terminal portion 33 that is bent downward in the figure along the Z-axis direction is provided integrally with the coil portion 35 at one end portion of the coil winding 30A. The coil portion 35 is formed by continuously forming a first coil portion 351 on the inner peripheral side and a second coil portion 352 on the outer peripheral side. The first terminal portion 33 is provided at the end of the first coil portion 351 opposite to the side connected to the second coil portion 352. A second terminal portion 34 bent downward in the drawing along the Z-axis direction is integrally formed at the end of the second coil portion 352 opposite to the side connected to the first coil portion 351. Is provided.

  Further, the coil winding 30A is provided with projecting portions 44A to 44C and projecting portions 45A to 45C that are bent downward in the figure along the Z-axis direction. The protrusions 44A to 44C (inner protrusions) protrude inward with respect to the axis A from the first coil portion 351 and are bent downward in the figure. Further, the protruding portions 45A to 45C (outside protruding portions) protrude outward from the axis A from the second coil portion 352 and are bent downward in the figure. The positions where the projecting portions 44A to 44C and 45A to 45C are provided correspond to land portions (described later) formed on the coil substrate 20A, but are more dispersed with respect to the axis A (not biased toward one side). The winding 30A can be stably supported. Similarly to the coil winding 30 of the first embodiment, the end portions on the side connected to the lands 231 to 233 and the lands 241 to 243 of the protrusions 44A to 44C and 45A to 45C are on one side of the coil winding 30A. The lower surface 37 </ b> A (see FIG. 8), which is the surface of FIG. Moreover, it is preferable that the edge part of protrusion part 44A-44C and 45A-45C is the same height as the lower surface 37A side of the 1st terminal part 33, and the lower surface 37A side of the 2nd terminal part 34. FIG. Thereby, the coil winding 30A can be suitably fixed to the coil substrate 20A.

  The coil substrate 20A shown in FIG. 9 is different from the coil substrate 20 according to the first embodiment in that lands corresponding to the protruding portions of the coil winding 30A are newly provided. Specifically, the conductor pattern 21 formed inside the coil substrate 20A includes a first pattern 210 and a second pattern 220 that are formed apart from each other. The first pattern 210 includes an end ring-shaped coil part 212 formed so as to be wound around an axis A passing through the center of the circular opening 22, and one end part of the coil part 212. Thus, a connection portion 214 connected to a coil winding 30A described later and an end portion 216 connected to an external electronic component or the like on the other side of the coil portion are continuously formed. In addition, the second pattern 220 includes a connection portion 222 that connects the coil winding 30A and an end portion 224 that is connected to an external electronic component or the like. The connecting portion 222 is formed by exposing the uppermost conductor layer 21A to the outside. These configurations are the same as those of the coil substrate 20.

  In the coil substrate 20 </ b> A, lands 241 to 243 are formed in addition to the lands 231 to 233. The lands 231 to 233 are formed by exposing the surface of the uppermost conductor layer 21 </ b> A, and are formed at three locations outside the coil portion 212 of the first pattern 210. On the other hand, the lands 241 to 243 are formed by exposing the surface of the uppermost conductor layer 21 </ b> A, and are formed at three locations inside the coil portion 212 of the first pattern 210.

  The lands 241 to 243 are formed of a conductor that is not continuous with the coil portion 212, similarly to the lands 231 to 233. Further, through holes 251 to 253 are formed between the lands 231 to 233 and the coil part 212, and through holes 261 to 263 are formed between the lands 241 to 243 and the coil part 212, respectively. . Moreover, the coil part 212 is provided with recesses 213A to 213F so that the conductor is not exposed to the through holes 251 to 253 and the through holes 261 to 263. The through holes 251 to 253 and the through holes 261 to 263 have a size substantially corresponding to each of the lands 231 to 233 and the lands 241 to 243. Note that the gap formed by the through holes 251 to 253 between the coil part 212 and the lands 231 to 233 is preferably formed in the entire area where they are close to each other, but at least a part of the gap is formed. It only has to be.

  Further, in the coil substrate 20A, a slit 29 cut from the outer edge of the coil substrate 20A is formed between the first pattern 210 and the second pattern 220 in the same manner as the coil substrate 20. It is provided to form a gap between the two. The slit 29 is preferably formed in the entire area where both are close to each other, but it is sufficient that a gap is formed at least in part. Further, a through hole may be formed instead of the slit 29.

  Next, a winding component in which the coil substrate 20A and the coil winding 30A are combined will be described. This will be described with reference to FIG. In the winding component 10A according to the second embodiment, the coil winding 35 is separated from the coil substrate 20A on one surface of the coil substrate 20A (the surface on which the connection portions 214 and 222 are formed). 30A is attached. Specifically, the protruding portion 44A protruding from the first coil portion 351 of the coil winding 30A comes into contact with the land 241 of the coil substrate 20A. Similarly, the protruding portion 44B of the coil winding 30A comes into contact with the land 242 of the coil substrate 20A, and the protruding portion 44C of the coil winding 30A comes into contact with the land 243 of the coil substrate 20A. Further, the protruding portion 45A protruding from the second coil portion 352 of the coil winding 30A contacts the land 231 of the coil substrate 20A. Similarly, the protrusion 45B of the coil winding 30A contacts the land 232 of the coil substrate 20A, and the protrusion 45C of the coil winding 30A contacts the land 233 of the coil substrate 20A. Further, the first terminal portion 33 of the coil winding 30 </ b> A abuts on the connection portion 214 of the coil substrate 20 </ b> A, and the second terminal portion 34 abuts on the connection portion 222. Between each protrusion part 44A-44C and land 241-243, between each protrusion part 45A-45C and land 231-233, between 1st terminal part 33 and connection part 214, and 2nd terminal The part 34 and the connection part 222 are fixed by soldering. Thus, the coil winding 30A is fixed to the coil substrate 20A in a state where the coil portions 35 (the first coil portion 351 and the second coil portion 352) of the coil winding 30A are separated from the coil substrate 20A. A winding component 10A is obtained.

  Further, by assembling the winding component 10A by the above method, the opening 31 of the coil winding 30A and the opening 22 of the coil substrate 20A are in communication with each other in the Z-axis direction. A coil that winds around the axis A is obtained by 30A. That is, in the winding component 10A, the coil winding is connected to the connection portion 214 of the first pattern 210 with the end portion 216 of the first pattern 210 of the coil substrate 20A as the starting point and the coil portion 212 of the coil substrate 20A as the first turn. The first coil portion 351 on the inner peripheral side from the first terminal portion 33 of the wire 30A is set as the second turn, and the second coil portion 352 on the outer peripheral side of the coil winding 30A connected to the first coil portion 351 is turned three turns. A three-turn coil that terminates at the end portion 224 of the second pattern 220 is formed through the connection portion 222 in the second pattern 220 of the coil substrate 20 </ b> A connected to the second terminal portion 34.

  As described above, in the winding component 10A of the second embodiment, the coil winding 30A has a number of turns of two turns spirally on the same plane, and in the second coil portion 352 that is the outer turn portion of them, Outer protrusions (protrusions 45A to 45C) that protrude outward with respect to the axis A and protrude toward the coil substrate in a position that does not overlap the conductor pattern (particularly the coil part 212) in plan view are provided. The first coil portion 351, which is the innermost turn portion of the coil portion 35 of the coil winding 30A, projects inward with respect to the axis A and overlaps with the conductor pattern (particularly the coil portion 212) in plan view. Inner protrusions (protrusions 44 </ b> A to 44 </ b> C) that protrude toward the coil substrate at positions that do not become necessary. In this way, when the coil winding 30A has a plurality of turns, an outer protrusion is formed that protrudes outward from the outermost turn portion, and protrudes inward from the innermost turn portion. By forming the inner protrusions and fixing these protrusions to the coil substrate 20A, the coil winding 30A can be stably supported with respect to the coil substrate 20A even when the coil winding 30A is separated from the coil substrate 20A. A wound winding component 10A can be obtained. Moreover, when fixing an inner side protrusion part (protrusion part 44A-44C) and an outer side protrusion part (protrusion part 45A-45C) by soldering compared with the case where a protrusion part is provided between spiral coil windings. Fixing is easy and workability is improved.

  In the second embodiment, the case where the number of turns in the coil winding 30A is two turns has been described, but it may be three turns or more. In this case, it is only necessary to provide an inner protrusion in the innermost turn portion and an outer protrusion in the outermost turn portion. For the turn located between the innermost turn and the outermost turn, The protrusion may not be provided.

(Third embodiment)
Next, the winding component according to the third embodiment will be described with reference to FIGS. FIG. 11 is a perspective view showing a configuration of a winding component according to the third embodiment. FIG. 12 is a perspective view of the coil substrate constituting the winding component, and FIG. 13 is a bottom view (bottom view) of the coil substrate of FIG. FIG. 14 is a perspective view showing the configuration of the coil winding constituting the winding component, and FIG. 15 is a perspective view showing the configuration of the second coil winding. FIG. 16 is an exploded perspective view for explaining how to assemble the winding component, and FIG. 17 is an exploded perspective view of FIG. 16 viewed from the lower surface side. The winding component according to the third embodiment is different from the winding component of the first embodiment in the following points. That is, a point using two coil windings, a coil winding and a second coil winding, a point where the number of fixing points with respect to the coil substrate is increased corresponding to the increase in winding, and a conductor pattern on the coil substrate This is a change.

  As shown in FIG. 11, the winding component 10B according to the third embodiment is arranged in the Z-axis direction by the conductor pattern in the coil substrate 20B extending along the XY plane, the coil winding 30B, and the second coil winding 50B. A coil that is wound around the extending axis A is formed. Among these, the coil winding 30B is attached above the coil substrate 20B (Z-axis positive direction), and the second coil winding 50B is attached below the coil substrate 20B (Z-axis negative direction). Since the coil substrate 20B is configured to be sandwiched between the coil winding 30B and the second coil winding 50B, the coil winding 30B and the second coil winding 50B are compared with the coil substrate 20 of the first embodiment. The position of the land for fixing is changed, and a region for connecting each conductor is newly provided.

  First, the coil substrate 20B will be described. The conductor pattern 21 in the coil substrate 20B shown in FIGS. 12 and 13 includes a first pattern 210 formed around the circular opening 22, a second pattern 220 and a third pattern 220 spaced apart from the opening 22. A pattern 230 is included. In the first pattern 210, a coil part 212, a connection part 214, and an end part 216 are formed continuously. The connection portion 214 is formed by exposing the uppermost conductor layer 21A to the outside. The end 216 is provided with a through hole 218. The through hole 218 is used as a via hole for connecting the four conductor layers 21A to 21D. Similarly, the through hole 219 on the connection part 214 side is also used as a via hole for connecting the four conductor layers 21A to 21D.

  The second pattern 220 is continuously formed on the lower surface side (see FIG. 13) with a connecting portion 226 that connects a second coil winding 50B described later and an end 224 that is connected to an external electronic component or the like. ing. The connecting portion 226 is formed by exposing the lowermost conductor layer 21D out of the four conductor layers 21A to 21D (see FIG. 3).

  The third pattern 230 is formed apart from the first pattern 210 and the second pattern 220. The third pattern 230 is formed by four conductor layers 21A to 21D, and is connected to the coil winding 30B on the front surface side (see FIG. 12) and the second coil winding on the lower surface side (see FIG. 13). A connecting portion 282 connected to the line 50B and a through hole 283 functioning as a via hole connecting at least the conductor layer 21A and the conductor layer 21D among the four conductor layers 21A to 21D are provided. The connecting portion 281 is formed by exposing the uppermost conductor layer 21A among the four conductor layers 21A to 21D to the outside. The connecting portion 282 is formed by exposing the lowermost conductor layer 21D out of the four conductor layers 21A to 21D to the outside. Accordingly, the third pattern 230 functions as a connection member that connects the coil winding 30B and the second coil winding 50B.

  In addition to the conductor pattern 21, lands 231, 233, 271, and 272 made of a conductor are formed on the coil substrate 20B. Among these, the lands 231 and 233 are formed by exposing the surface of the uppermost conductor layer 21A on the surface (coil winding 30B side) of the coil substrate 20B, and the coil portion 212 of the first pattern 210. Two places are formed on the outside. The lands 271 and 272 (second lands) are formed by exposing the surface of the lowermost conductor layer 21D on the lower surface (the second coil winding 50B side) of the coil substrate 20B. Two portions are formed outside the coil portion 212 of the pattern 210. The lands 231, 233, 271, and 272 are disposed so as to be dispersed on the outer peripheral side of the substantially circular coil portion 212 and at different positions in plan view. This prevents the lands from being arranged close to each other. Although the number of lands is not particularly limited, the lands are preferably determined in consideration of stability because they are regions for fixing a coil winding 30B and a second coil winding 50B described later.

  As shown in FIG. 12, the lands 231 and 233 are formed of a conductor that is not continuous with the coil portion 212. Further, through holes 251 and 253 are formed between the lands 231 and 233 and the coil portion 212, respectively. Similarly, as illustrated in FIG. 13, the lands 271 and 272 are formed of a conductor that is not continuous with the coil portion 212. Further, through holes 255 and 256 are formed between the lands 271 and 272 and the coil portion 212, respectively. Moreover, the coil part 212 is provided with recesses 213A, 213C, 213G, and 213H corresponding to the through holes 251, 253, 255, and 256 so that the conductor is not exposed in the through holes 251, 253, 255, and 256. It is preferable that the gaps formed by the through holes 251, 253, 255, and 256 between the coil portion 212 and the lands 231, 233, 271, and 272 are formed in the entire area where both are close, It is sufficient that voids are formed at least in part.

  Further, a slit 291 cut from the outer edge of the coil substrate 20B is formed between the first pattern 210 and the second pattern 220 of the coil substrate 20B. The slit 291 is provided in order to form a gap between the first pattern 210 and the second pattern 220 in the vicinity of each other. A through hole 292 extending in the thickness direction of the coil substrate 20B is formed between the first pattern 210 and the third pattern 230. The slit 291 and the through-hole 292 are preferably formed in the entire area where they are close to each other, but it is sufficient that a gap is formed at least in part.

  Next, the coil winding 30B will be described. As shown in FIG. 14, the end-ring-shaped coil winding 30B has substantially the same configuration as the coil winding 30 according to the first embodiment. The difference is that the protruding portion 42 is not provided as compared with the coil winding 30 and the second terminal portion 38 is provided at a position corresponding to the connection portion 281 of the third pattern 230 of the coil substrate 20B. It is. The reason why the coil winding 30B does not include the protruding portion 42 is that the arrangement of lands for fixing the second coil winding 50B described later is considered.

  Next, the second coil winding 50B will be described. As shown in FIG. 15, the end ring-shaped second coil winding 50 </ b> B formed of a conductor plate extending along the XY plane has a substantially C shape and has a circular opening 51 in the center. doing. The shape of the coil winding need not be substantially C-shaped, and may be another shape such as an elliptical shape or a rectangular shape.

  A first terminal portion 53 bent upward in the figure along the Z-axis direction is integrally provided at one end portion of the second coil winding 50B, and a similar second terminal is also provided at the other end portion. A terminal portion 54 is provided integrally. A C-shaped region between the first terminal portion 53 and the second terminal portion 54 functions as the coil portion 55. The second coil winding 50 is provided with projecting portions 57 and 58 (second projecting portions) that project outward with respect to the axis A and are bent upward in the figure along the Z-axis direction. . The positions where the protrusions 57 and 58 are provided correspond to the lands 271 and 272 formed on the coil substrate 20B. However, it is more dispersible with respect to the axis A (is not biased to one side) by the coil substrate 20B. The second coil winding 50B can be stably supported. In addition, the edge part of the side connected to the land 271,272 of the protrusion parts 57 and 58 needs to be above the surface 56 which is a surface of the one side of 2nd coil winding 50B. The ends of the protrusions 57 and 58 on the side connected to the lands 271 and 272 have the same height as the front surface 56 side of the first terminal portion 53 and the lower surface 59 side of the second terminal portion 54. Is preferred. Thereby, the second coil winding 50B can be suitably fixed to the coil substrate 20B.

  Next, the winding component combining the coil substrate 20B, the coil winding 30B, and the second coil winding 50B will be described. As shown in FIGS. 16 and 17, in the winding component 10B, the coil portion 35 is separated from the coil substrate 20B on one surface of the coil substrate 20B (the surface on which the connection portions 214 and 281 are formed). The coil winding 30B is attached and the second coil winding 50B is attached on the other surface in a state where the coil portion 55 is separated from the coil substrate 20B. First, with respect to the coil winding 30B, the protruding portion 41 of the coil winding 30B comes into contact with the land 231 of the coil substrate 20B. Similarly, the protrusion 43 of the coil winding 30B contacts the land 233 of the coil substrate 20B. Further, the first terminal portion 33 of the coil winding 30 </ b> B abuts on the connection portion 214 of the coil substrate 20 </ b> B, and the second terminal portion 34 abuts on the connection portion 281. Between the protruding portion 41 and the land 231, between the protruding portion 43 and the land 233, between the first terminal portion 33 and the connecting portion 214, and between the second terminal portion 34 and the connecting portion 281. , Each is fixed by soldering. Accordingly, the coil winding 30B is fixed to the coil substrate 20B in a state where the coil portion 35 of the coil winding 30B is separated from the coil substrate 20B.

  Further, the protrusion 57 of the second coil winding 50B comes into contact with the land 271 of the coil substrate 20B. Similarly, the protrusion 43 of the second coil winding 50B contacts the land 233 of the coil substrate 20B. In addition, the first terminal portion 53 of the second coil winding 50 </ b> B abuts on the connection portion 282 of the coil substrate 20 </ b> B, and the second terminal portion 34 abuts on the connection portion 226. Between the protruding portion 57 and the land 271, between the protruding portion 58 and the land 272, between the first terminal portion 53 and the connecting portion 282, and between the second terminal portion 54 and the connecting portion 226. , Each is fixed by soldering. Accordingly, the second coil winding 50B is fixed to the coil substrate 20B in a state where the coil portion 55 of the second coil winding 50B is separated from the coil substrate 20B. Thereby, the winding component 10B is obtained.

  By assembling the winding component 10B by the above method, the opening 31 of the coil winding 30B, the opening 22 of the coil substrate 20B, and the opening 51 of the second coil winding 50B are in communication with each other in the Z-axis direction. A coil wound around the axis A is obtained by the conductor pattern 20B, the coil winding 30B, and the second coil winding 50B. That is, the winding component 10B forms a three-turn coil. In this coil, starting from the end 216 of the first pattern 210 of the coil substrate 20, the coil portion 212 of the coil substrate 20B forms the first turn. In addition, the coil portion 35 from the first terminal portion 33 of the coil winding 30B connected to the connection portion 214 of the first pattern 210 forms a second turn. Then, the second terminal portion 34 and the connection portion 281 are connected, and the coil portion 55 from the first terminal portion 53 of the second coil winding 50B connected to the connection portion 282 of the third pattern 230 of the coil substrate 20B. Forms a third turn, and forms a coil that terminates at the end 224 of the second pattern 220 through the connection portion 226 in the second pattern 220 of the coil substrate 20B connected to the second terminal portion 54.

  In the winding component 10B, the protruding portions 41 and 43 protrude from the coil winding 30B to the coil substrate 20B side at a position that does not overlap the conductor pattern 21 of the coil substrate 20B in plan view. Further, the protrusions 57 and 58 protrude from the second coil winding 50B toward the coil substrate 20B at a position that does not overlap the conductor pattern 21 of the coil substrate 20B in plan view. These protrusions 41, 43, 57, 58 are fixed to the lands 231, 233, 271, 272, respectively, so that the coil winding 30B and the second coil winding 50B are separated from the coil substrate 20B, respectively. Is provided. As described above, even when the coil winding is provided on both surfaces of the coil substrate, the coil winding 30B is arranged away from the coil substrate 20B, so that the conductor pattern 21 and the coil winding of the coil substrate 20B are arranged. A gap is provided between the line 30B. In addition, with respect to the second coil winding 50B, the second coil winding 50B is disposed away from the coil substrate 20B, whereby a gap is formed between the conductor pattern 21 of the coil substrate 20B and the second coil winding 50B. Provided. Here, the gap is provided between the conductor pattern 21 and each coil winding, that is, the region having a lower dielectric constant than the insulating material constituting the coil substrate 20B is the coil winding 30B and the conductor pattern. 21 and between the second coil winding 50 </ b> B and the conductor pattern 21. Therefore, by having such a configuration, the coil winding 30B or the second coil winding 50B is located between the conductor pattern 21 and the coil winding 30 as compared with the case where the coil winding 30B or the second coil winding 50B is in contact with the coil substrate 20B. Parasitic capacitance generated and parasitic capacitance generated between the conductor pattern 21 and the second coil winding 50B can be reduced, and elements such as a MOS-FET and a rectifier diode that constitute a switching circuit preceding the coil It is possible to suppress the high-frequency noise component that is generated from passing through the region.

  Further, in the above-described winding component 10B, the projecting portions 41 and 43 made of a conductor formed integrally with the coil winding 30B are fixed to the lands 231 and 233 provided on the coil substrate 20B by soldering. . That is, the coil winding 30B and the lands 231 and 233 are electrically connected. On the other hand, through holes 251 and 253 are formed between the lands 231 and 233 and the coil portion 212 of the first pattern 210 which is a conductor pattern close to the lands 231 and 233, respectively. Similarly, projecting portions 57 and 58 made of a conductor formed integrally with the second coil winding 50B are fixed to the lands 271 and 272 provided on the coil substrate 20B by soldering. That is, the second coil winding 50B and the lands 271 and 272 are electrically connected. On the other hand, through holes 255 and 256 are formed between the lands 271 and 273 and the coil portion 212 of the first pattern 210 which is a conductor pattern close to the lands 231 and 233, respectively. Thus, by providing the gaps formed by the through holes 251, 253, 255, 256 between the lands 231, 233, 271, 272 and the coil part 212, the conductor pattern 21, the coil winding 30B and the first Parasitic capacitance generated between the two coil windings 50B can be suppressed, and the passage of high-frequency noise components can also be suppressed.

  In the coil substrate 20B, lands 231, 233, 271, and 272 are formed at different positions in plan view. In this case, since the land 231 and the land 271 are formed so as to be separated from each other as compared with the case where the land 271 and the land 271 overlap with each other in plan view, the parasitic capacitance generated between the land 231 and the land 271. Is suppressed.

  In the winding component 10B, the first pattern 210, the coil winding 30B, and the second coil winding 50B are connected in this order to form a coil. In this case, a winding component having a coil that uses two coil windings and suppresses the generation of parasitic capacitance between conductors can be made smaller.

  Further, in the coil substrate 20B in the above-described embodiment, through-holes penetrating in the thickness direction are formed between conductors corresponding to positions spaced apart from each other in the coil in the conductor pattern 21. Specifically, a slit 291 is formed between the first pattern 210 and the second pattern 220. A through hole 292 is formed between the first pattern 210 and the third pattern 230. The end portion 216 side of the first pattern 210 is in the vicinity of the first turn start point of the coil formed by the winding component 10 </ b> B, and the connection portion 214 on the second pattern 220 side of the first pattern 210. The vicinity is near the end of the first turn of the coil formed by the winding component 10B. The third pattern 230 is near the end of the second turn of the coil, and the vicinity of the connection portion 222 of the second pattern 220 is near the end of the third turn of the coil formed by the winding component 10B. As described above, the first pattern 210, the second pattern 220, and the third pattern 230 included in the coil substrate 20B are conductors that form the same coil, but correspond to positions separated from each other. Therefore, by forming a gap by providing a through hole (slit) penetrating in the thickness direction of the coil substrate 20B between the two, the parasitic capacitance generated between the two can be suppressed and the passage of the high-frequency noise component can be suppressed. Can be suppressed.

  In the case where conductors corresponding to different positions in the coil are formed on the same substrate, the parasitic capacitance generated between them is greatly reduced if the two are spaced apart from each other.

  As mentioned above, although embodiment of this invention was described, the coil | winding components and power supply device which concern on this invention are not limited to the above, A various change can be performed.

  For example, in the above-described embodiment, the configuration in which the coil winding is fixed to the coil substrate by soldering has been described. However, the fixing method is not limited to soldering, and for example, adhesion by an adhesive or the like may be employed. . When fixing the protruding portion of the coil winding to the coil substrate by a method other than soldering, it is not necessary to form a land on the coil substrate side, so a through hole provided between the land and the coil portion 212 is provided. Although it is possible to suppress the generation of parasitic capacitance without forming it, it is preferable to form a through hole in order to further suppress the generation of parasitic capacitance.

  Further, the protrusion provided in the coil winding does not have to be integrally formed by the conductor forming the coil part, and the protrusion is formed by fixing another member or the like to the coil winding. May be. Furthermore, although the said embodiment demonstrated the case where the protrusion part had the shape bent by the coil board | substrate side, the protrusion part does not necessarily need to be the shape bent. The protrusion provided in the coil winding can be fixed to the coil substrate at a position that does not overlap with the conductor pattern in plan view, and the coil winding is only required to support the coil winding in a state of being separated from the coil substrate. The shape of the protrusion for that is not specifically limited.

  Moreover, although this embodiment demonstrated the choke coil, it is applicable also to electronic components other than a choke coil. For example, when the above inductor is applied to a transformer, for example, a coil portion provided on a coil substrate is a primary side, and a coil winding is a secondary side, and the primary side and the secondary side are electrically insulated. What should I do?

10, 10A, 10B ... Winding parts 20, 20A, 20B ... Coil substrate, 30, 30A, 30B ... Coil winding, 35 ... Coil part, 41-43 ... Projection part, 50B ... Second coil winding, 210 ... 1st pattern, 212 ... Coil part, 220 ... 2nd pattern, 231-233 ... Land.

Claims (8)

A coil substrate provided with a conductor pattern wound around an axis, and
Coil winding which is provided on one surface of the coil substrate so as to be separated from the coil substrate, and which has one end connected to one end of the conductor pattern and forms a coil wound around the axis together with the conductor pattern. Lines and,
With
The coil winding includes a protruding portion that protrudes toward the coil substrate at a position that does not overlap the conductor pattern in plan view,
A winding component in which the protrusion is fixed to the coil substrate. The coil substrate is
A land for fixing the protrusion,
The winding component according to claim 1, further comprising a through hole penetrating in a thickness direction between the land and the conductor pattern. The coil substrate is
The winding component according to claim 1, wherein in the conductor pattern, a through-hole penetrating in a thickness direction is provided between conductors corresponding to positions separated from each other. The coil winding is
Has the number of turns of a plurality of turns spirally on the same plane,
In the outermost turn portion, an outer protrusion that protrudes outward with respect to the axis and protrudes toward the coil substrate at a position that does not overlap the conductor pattern in plan view;
In the innermost turn portion, an inner projecting portion projecting inward with respect to the axis and projecting toward the coil substrate at a position not overlapping the conductor pattern in plan view,
With
The winding component according to any one of claims 1 to 3, wherein the outer protrusion and the inner protrusion are fixed to the coil substrate. A second coil winding provided on the other surface different from the one surface of the coil substrate and spaced apart from the coil substrate, and forming the coil together with the conductor pattern and the coil winding;
The second coil winding includes a second protrusion that protrudes toward the coil substrate at a position that does not overlap with the conductor pattern and the protrusion of the coil winding in plan view,
The winding component according to any one of claims 1 to 4, wherein the second protrusion is fixed to the coil substrate. The coil substrate is
A second land for fixing the second protrusion,
The winding component according to claim 5, further comprising a through hole penetrating in a thickness direction between the second land and the conductor pattern. The coil winding is connected to the second coil winding via a conductor in the coil substrate on the other end side different from the one end side connected to the conductor pattern,
The winding component according to claim 5 or 6, wherein the conductor pattern, the coil winding, and the second coil winding are connected in this order to form the coil.   A power supply apparatus provided with the coil | winding components as described in any one of Claims 1-7.