JP2001281870A - Lithographic printing plate - Google Patents
Lithographic printing plateInfo
- Publication number
- JP2001281870A JP2001281870A JP2000095597A JP2000095597A JP2001281870A JP 2001281870 A JP2001281870 A JP 2001281870A JP 2000095597 A JP2000095597 A JP 2000095597A JP 2000095597 A JP2000095597 A JP 2000095597A JP 2001281870 A JP2001281870 A JP 2001281870A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- printing plate
- lithographic printing
- silver halide
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 33
- -1 silver halide Chemical class 0.000 claims abstract description 33
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052709 silver Inorganic materials 0.000 claims abstract description 26
- 239000004332 silver Substances 0.000 claims abstract description 26
- 239000000839 emulsion Substances 0.000 claims abstract description 23
- 150000003839 salts Chemical class 0.000 claims abstract description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 26
- 238000011282 treatment Methods 0.000 description 33
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 18
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 14
- 239000000243 solution Substances 0.000 description 13
- 239000002253 acid Substances 0.000 description 10
- 238000007788 roughening Methods 0.000 description 10
- 239000003513 alkali Substances 0.000 description 9
- 239000000084 colloidal system Substances 0.000 description 9
- 108010010803 Gelatin Proteins 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 229920000159 gelatin Polymers 0.000 description 8
- 235000019322 gelatine Nutrition 0.000 description 8
- 235000011852 gelatine desserts Nutrition 0.000 description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 7
- 238000005238 degreasing Methods 0.000 description 7
- 239000008273 gelatin Substances 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 238000007743 anodising Methods 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 241001061127 Thione Species 0.000 description 4
- 235000010489 acacia gum Nutrition 0.000 description 4
- 239000010407 anodic oxide Substances 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 description 4
- WXHLLJAMBQLULT-UHFFFAOYSA-N 2-[[6-[4-(2-hydroxyethyl)piperazin-1-yl]-2-methylpyrimidin-4-yl]amino]-n-(2-methyl-6-sulfanylphenyl)-1,3-thiazole-5-carboxamide;hydrate Chemical compound O.C=1C(N2CCN(CCO)CC2)=NC(C)=NC=1NC(S1)=NC=C1C(=O)NC1=C(C)C=CC=C1S WXHLLJAMBQLULT-UHFFFAOYSA-N 0.000 description 3
- 229920000084 Gum arabic Polymers 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 102000035195 Peptidases Human genes 0.000 description 3
- 108091005804 Peptidases Proteins 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 239000000205 acacia gum Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 3
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 3
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 3
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- GGZHVNZHFYCSEV-UHFFFAOYSA-N 1-Phenyl-5-mercaptotetrazole Chemical compound SC1=NN=NN1C1=CC=CC=C1 GGZHVNZHFYCSEV-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 229940126062 Compound A Drugs 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 2
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 241000978776 Senegalia senegal Species 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910021607 Silver chloride Inorganic materials 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 239000001768 carboxy methyl cellulose Substances 0.000 description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 235000019833 protease Nutrition 0.000 description 2
- NDGRWYRVNANFNB-UHFFFAOYSA-N pyrazolidin-3-one Chemical compound O=C1CCNN1 NDGRWYRVNANFNB-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- NRUVOKMCGYWODZ-UHFFFAOYSA-N sulfanylidenepalladium Chemical class [Pd]=S NRUVOKMCGYWODZ-UHFFFAOYSA-N 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 150000003536 tetrazoles Chemical class 0.000 description 2
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 2
- 229960001763 zinc sulfate Drugs 0.000 description 2
- 229910000368 zinc sulfate Inorganic materials 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- LORJYFSOIBSBAA-UHFFFAOYSA-N 1,3-dibenzylimidazolidine-2-thione Chemical compound C1CN(CC=2C=CC=CC=2)C(=S)N1CC1=CC=CC=C1 LORJYFSOIBSBAA-UHFFFAOYSA-N 0.000 description 1
- VGJWHKOKDHQDSO-UHFFFAOYSA-N 1,3-diethylbenzimidazole-2-thione Chemical compound C1=CC=C2N(CC)C(=S)N(CC)C2=C1 VGJWHKOKDHQDSO-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- PBRBGUUOYSTUHP-UHFFFAOYSA-N 1-methylquinoline-2-thione Chemical compound C1=CC=C2C=CC(=S)N(C)C2=C1 PBRBGUUOYSTUHP-UHFFFAOYSA-N 0.000 description 1
- MRORKWHSOOKUDV-UHFFFAOYSA-N 1h-benzo[e][1,3]benzothiazole-2-thione Chemical compound C1=CC=C2C(NC(S3)=S)=C3C=CC2=C1 MRORKWHSOOKUDV-UHFFFAOYSA-N 0.000 description 1
- JHHQNRXSSMYSHA-UHFFFAOYSA-N 2,6-diphenyl-1h-1,3,5-triazine-4-thione Chemical compound N=1C(=S)N=C(C=2C=CC=CC=2)NC=1C1=CC=CC=C1 JHHQNRXSSMYSHA-UHFFFAOYSA-N 0.000 description 1
- DIZBQMTZXOUFTD-UHFFFAOYSA-N 2-(furan-2-yl)-3h-benzimidazole-5-carboxylic acid Chemical compound N1C2=CC(C(=O)O)=CC=C2N=C1C1=CC=CO1 DIZBQMTZXOUFTD-UHFFFAOYSA-N 0.000 description 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 1
- HPDALKYKFZQBRG-UHFFFAOYSA-N 2-amino-6-benzyl-1h-1,3,5-triazine-4-thione Chemical compound N1C(N)=NC(=S)N=C1CC1=CC=CC=C1 HPDALKYKFZQBRG-UHFFFAOYSA-N 0.000 description 1
- JKFYKCYQEWQPTM-UHFFFAOYSA-N 2-azaniumyl-2-(4-fluorophenyl)acetate Chemical group OC(=O)C(N)C1=CC=C(F)C=C1 JKFYKCYQEWQPTM-UHFFFAOYSA-N 0.000 description 1
- RHLPAVIBWYPLRV-UHFFFAOYSA-N 2-hydroxy-4-sulfobenzoic acid Chemical compound OC(=O)C1=CC=C(S(O)(=O)=O)C=C1O RHLPAVIBWYPLRV-UHFFFAOYSA-N 0.000 description 1
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical compound C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 description 1
- 229940054266 2-mercaptobenzothiazole Drugs 0.000 description 1
- IQUPABOKLQSFBK-UHFFFAOYSA-N 2-nitrophenol Chemical compound OC1=CC=CC=C1[N+]([O-])=O IQUPABOKLQSFBK-UHFFFAOYSA-N 0.000 description 1
- AOCFYLGZVCPZML-UHFFFAOYSA-N 3-benzyl-1h-imidazole-2-thione Chemical compound S=C1NC=CN1CC1=CC=CC=C1 AOCFYLGZVCPZML-UHFFFAOYSA-N 0.000 description 1
- OVTQTPRJINYNIY-UHFFFAOYSA-N 3-butyl-1h-benzimidazole-2-thione Chemical compound C1=CC=C2NC(=S)N(CCCC)C2=C1 OVTQTPRJINYNIY-UHFFFAOYSA-N 0.000 description 1
- CIVAONBPTAWUTG-UHFFFAOYSA-N 3-dodecyl-1,3-benzothiazole-2-thione Chemical compound C1=CC=C2SC(=S)N(CCCCCCCCCCCC)C2=C1 CIVAONBPTAWUTG-UHFFFAOYSA-N 0.000 description 1
- HNQNFZRNOJJPFM-UHFFFAOYSA-N 3-ethyl-1,3-benzothiazole-2-thione Chemical compound C1=CC=C2SC(=S)N(CC)C2=C1 HNQNFZRNOJJPFM-UHFFFAOYSA-N 0.000 description 1
- QQPXCOHOBNFGLS-UHFFFAOYSA-N 3-pentyl-1,3-benzoxazole-2-thione Chemical compound C1=CC=C2OC(=S)N(CCCCC)C2=C1 QQPXCOHOBNFGLS-UHFFFAOYSA-N 0.000 description 1
- NYQSTRUSYDZNHC-UHFFFAOYSA-N 4,5-diphenyl-3h-1,3-oxazole-2-thione Chemical compound O1C(S)=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 NYQSTRUSYDZNHC-UHFFFAOYSA-N 0.000 description 1
- HLLSOEKIMZEGFV-UHFFFAOYSA-N 4-(dibutylsulfamoyl)benzoic acid Chemical compound CCCCN(CCCC)S(=O)(=O)C1=CC=C(C(O)=O)C=C1 HLLSOEKIMZEGFV-UHFFFAOYSA-N 0.000 description 1
- XBINDEBBUSHZTM-UHFFFAOYSA-N 4-amino-3-heptadecyl-1h-1,2,4-triazole-5-thione Chemical compound CCCCCCCCCCCCCCCCCC1=NN=C(S)N1N XBINDEBBUSHZTM-UHFFFAOYSA-N 0.000 description 1
- COHVGXVSGOHFDC-UHFFFAOYSA-N 4-ethyl-1,3-dihydrobenzimidazole-2-thione Chemical compound CCC1=CC=CC2=C1NC(=S)N2 COHVGXVSGOHFDC-UHFFFAOYSA-N 0.000 description 1
- CYCKHTAVNBPQDB-UHFFFAOYSA-N 4-phenyl-3H-thiazole-2-thione Chemical compound S1C(S)=NC(C=2C=CC=CC=2)=C1 CYCKHTAVNBPQDB-UHFFFAOYSA-N 0.000 description 1
- TUCXPBLFXXNRBH-UHFFFAOYSA-N 5,6-diphenyl-1h-pyrazine-2-thione Chemical compound C=1C=CC=CC=1C1=NC(S)=CN=C1C1=CC=CC=C1 TUCXPBLFXXNRBH-UHFFFAOYSA-N 0.000 description 1
- PZBQVZFITSVHAW-UHFFFAOYSA-N 5-chloro-2h-benzotriazole Chemical compound C1=C(Cl)C=CC2=NNN=C21 PZBQVZFITSVHAW-UHFFFAOYSA-N 0.000 description 1
- LRUDIIUSNGCQKF-UHFFFAOYSA-N 5-methyl-1H-benzotriazole Chemical compound C1=C(C)C=CC2=NNN=C21 LRUDIIUSNGCQKF-UHFFFAOYSA-N 0.000 description 1
- WNUOYRVNJDOWDH-UHFFFAOYSA-N 5-methyl-3-phenyl-1h-pyridazine-6-thione Chemical compound N1C(=S)C(C)=CC(C=2C=CC=CC=2)=N1 WNUOYRVNJDOWDH-UHFFFAOYSA-N 0.000 description 1
- BHQUBONFIYNJDA-UHFFFAOYSA-N 5-nitro-1h-pyridine-2-thione Chemical compound [O-][N+](=O)C1=CC=C(S)N=C1 BHQUBONFIYNJDA-UHFFFAOYSA-N 0.000 description 1
- QEBIATYMRXSORI-UHFFFAOYSA-N 5-nonyl-1,2-dihydro-1,2,4-triazole-3-thione Chemical compound CCCCCCCCCC1=NC(=S)NN1 QEBIATYMRXSORI-UHFFFAOYSA-N 0.000 description 1
- FOHWXVBZGSVUGO-UHFFFAOYSA-N 5-phenyl-3h-1,3,4-oxadiazole-2-thione Chemical compound O1C(S)=NN=C1C1=CC=CC=C1 FOHWXVBZGSVUGO-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
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- 102000009027 Albumins Human genes 0.000 description 1
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- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- HWLNXOZPRGEPNA-UHFFFAOYSA-N CCCCCCCC(O1)=CN[S+]1S Chemical compound CCCCCCCC(O1)=CN[S+]1S HWLNXOZPRGEPNA-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 1
- 102000004190 Enzymes Human genes 0.000 description 1
- 108090000790 Enzymes Proteins 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229920001612 Hydroxyethyl starch Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical compound C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 description 1
- ATTPTWQRJUUOCE-UHFFFAOYSA-N SC(CN1C(NCC1)=S)(CCCCCCCCN1C(NCC1)=S)S Chemical compound SC(CN1C(NCC1)=S)(CCCCCCCCN1C(NCC1)=S)S ATTPTWQRJUUOCE-UHFFFAOYSA-N 0.000 description 1
- MZAVWSCKASPTID-UHFFFAOYSA-N SC1SC(N=N1)(CCCCCCCCCCCCCCC)C1=CC=CC=C1 Chemical compound SC1SC(N=N1)(CCCCCCCCCCCCCCC)C1=CC=CC=C1 MZAVWSCKASPTID-UHFFFAOYSA-N 0.000 description 1
- 229910021612 Silver iodide Inorganic materials 0.000 description 1
- 239000004115 Sodium Silicate Chemical group 0.000 description 1
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- SJOOOZPMQAWAOP-UHFFFAOYSA-N [Ag].BrCl Chemical compound [Ag].BrCl SJOOOZPMQAWAOP-UHFFFAOYSA-N 0.000 description 1
- XCFIVNQHHFZRNR-UHFFFAOYSA-N [Ag].Cl[IH]Br Chemical compound [Ag].Cl[IH]Br XCFIVNQHHFZRNR-UHFFFAOYSA-N 0.000 description 1
- HOLVRJRSWZOAJU-UHFFFAOYSA-N [Ag].ICl Chemical compound [Ag].ICl HOLVRJRSWZOAJU-UHFFFAOYSA-N 0.000 description 1
- XEIPQVVAVOUIOP-UHFFFAOYSA-N [Au]=S Chemical compound [Au]=S XEIPQVVAVOUIOP-UHFFFAOYSA-N 0.000 description 1
- 239000001785 acacia senegal l. willd gum Substances 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- ANBBXQWFNXMHLD-UHFFFAOYSA-N aluminum;sodium;oxygen(2-) Chemical group [O-2].[O-2].[Na+].[Al+3] ANBBXQWFNXMHLD-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229940101006 anhydrous sodium sulfite Drugs 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000001580 bacterial effect Effects 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 229920001477 hydrophilic polymer Polymers 0.000 description 1
- 229940050526 hydroxyethylstarch Drugs 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052976 metal sulfide Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 1
- 235000019796 monopotassium phosphate Nutrition 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical compound C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- CMCWWLVWPDLCRM-UHFFFAOYSA-N phenidone Chemical compound N1C(=O)CCN1C1=CC=CC=C1 CMCWWLVWPDLCRM-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical compound C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000008237 rinsing water Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- ADZWSOLPGZMUMY-UHFFFAOYSA-M silver bromide Chemical compound [Ag]Br ADZWSOLPGZMUMY-UHFFFAOYSA-M 0.000 description 1
- ZUNKMNLKJXRCDM-UHFFFAOYSA-N silver bromoiodide Chemical compound [Ag].IBr ZUNKMNLKJXRCDM-UHFFFAOYSA-N 0.000 description 1
- 229940045105 silver iodide Drugs 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- 229910001388 sodium aluminate Inorganic materials 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical group [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 229940001482 sodium sulfite Drugs 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- VLLMWSRANPNYQX-UHFFFAOYSA-N thiadiazole Chemical compound C1=CSN=N1.C1=CSN=N1 VLLMWSRANPNYQX-UHFFFAOYSA-N 0.000 description 1
- CBDKQYKMCICBOF-UHFFFAOYSA-N thiazoline Chemical compound C1CN=CS1 CBDKQYKMCICBOF-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- DQJCHOQLCLEDLL-UHFFFAOYSA-N tricyclazole Chemical compound CC1=CC=CC2=C1N1C=NN=C1S2 DQJCHOQLCLEDLL-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
Abstract
(57)【要約】
【課題】十分な耐刷性と耐汚れ性を持った平版印刷版を
提供する。
【解決手段】粗面化され陽極酸化されたアルミニウム支
持体上に少なくとも1層のハロゲン化銀乳剤層を有し、
そのハロゲン化銀乳剤層とアルミニウム支持体との間に
pKaが10〜12.5の化合物、若くは両性金属の塩を含有す
ることを特徴とする平版印刷版を用いる。(57) [Summary] [Problem] To provide a lithographic printing plate having sufficient printing durability and stain resistance. The invention has at least one silver halide emulsion layer on a roughened and anodized aluminum support,
Between the silver halide emulsion layer and the aluminum support
A lithographic printing plate is used which contains a compound having a pKa of 10 to 12.5, or a salt of an amphoteric metal.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、アルミニウム板を
支持体とする平版印刷版、特に銀錯塩拡散転写法を用い
る平版印刷版に関すものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lithographic printing plate using an aluminum plate as a support, and more particularly to a lithographic printing plate using a silver complex salt diffusion transfer method.
【0002】[0002]
【従来の技術】銀錯塩拡散転写法(DTR法)を用いた平版
印刷版については、フォーカル・プレス、ロンドン ニ
ューヨーク(1972年)発行、アンドレ ロット及びエディ
ス ワイデ著、「フォトグラフィック・シルバー・ハライ
ド・ディフュージョン・プロセシズ」、第101頁〜第130頁
に幾つかの例が記載されている。2. Description of the Related Art A planographic printing plate using a silver complex salt diffusion transfer method (DTR method) is disclosed in "Focal Press, London New York (1972)," by Andrelot and Edith Weide, "Photographic Silver Halide. Some examples are described in "Diffusion Processes", pp. 101-130.
【0003】その中で述べられているように、DTR法を
用いた平版印刷版には、転写材料と受像材料を別々にし
たツーシートタイプ、あるいはそれらを一枚の支持体上
に設けたモノシートタイプの2方式が知られている。ツ
ーシートタイプの平版印刷版については、特開昭57-158
844号公報に詳しく記載されている。又、モノシートタ
イプについては、特公昭48-30562号、同51-15765号、特
開昭51-111103号、同52-150105号などの各公報に詳しく
記載されている。As described therein, a lithographic printing plate using the DTR method includes a two-sheet type in which a transfer material and an image receiving material are separated, or a monolithic type in which they are provided on a single support. Two types of sheet type are known. For a two-sheet type lithographic printing plate, see JP-A-57-158.
It is described in detail in Japanese Patent Publication No. 844. The mono-sheet type is described in detail in JP-B-48-30562, JP-B-51-15765, JP-A-51-111103, and JP-A-52-150105.
【0004】紙を支持体とした平版印刷版は、印刷中の
版伸びや水分のしみ込みなどのため耐刷性を含め高品質
の印刷は困難である。これらの問題点を改良し印刷性能
を向上する目的でフィルム支持体が用いられる。例え
ば、酢酸セルロースフィルム、ポリビニルアセタールフ
ィルム、ポリスチレンフィルム、ポリプロピレンフィル
ム、ポリエチレンテレフタレートフィルム、或はポリエ
ステル、ポリプロピレン、又はポリスチレンフィルムな
どをポリエチレンフィルムで被覆した複合フィルム等が
支持体として利用できる。[0004] A lithographic printing plate using paper as a support is difficult to print with high quality including printing durability due to plate elongation during printing and penetration of moisture. A film support is used for the purpose of improving these problems and improving printing performance. For example, a cellulose acetate film, a polyvinyl acetal film, a polystyrene film, a polypropylene film, a polyethylene terephthalate film, or a composite film obtained by coating a polyester, polypropylene, or polystyrene film with a polyethylene film can be used as the support.
【0005】しかしながら、フィルムを支持体とした平
版印刷版は紙ベースの印刷版と比べ、版伸び性や水分の
しみ込みなどの点で改良されたものの、耐刷性、保水
性、更には印刷機への版掛け性等の点で問題を残してい
る。[0005] However, lithographic printing plates using a film as a support are improved in terms of plate elongation and moisture penetration, as compared with paper-based printing plates, but they have improved printing durability, water retention and printing. The problem remains in terms of the ability to hang the plate on the machine.
【0006】そこで、上に述べた紙やフィルムを支持体
とした平版印刷版の種々の問題点を解決するために、金
属特にアルミニウム板を支持体とした銀塩方式の平版印
刷版が知られており、特開昭57-118244号、同57-158844
号、同63-260491号、特開平3-116151号、同4-282295号
などの各公報に詳しく記載されている。In order to solve the above-mentioned various problems of the lithographic printing plate using a paper or a film as a support, a lithographic printing plate of a silver salt type using a metal, particularly an aluminum plate as a support has been known. JP-A-57-118244, JP-A-57-158844
And JP-A-62-260491, JP-A-3-116151, and JP-A-4-82295.
【0007】これら各公報ではいずれも現像液として強
アルカリを用いると記載されているが、アルミニウムが
両性金属であり、アルカリに対して極めて容易に溶解す
るために現像時間が長かったり、高温で現像した場合DT
Rで析出した銀画像がベースごと溶解されてしまう、す
なわち、現像安定性に欠けるという問題を抱えていた。
また特開平7-199471においては、アルミの溶解性の低い
ケイ酸塩を使用するよう記載されているがこの場合、画
像銀とベースの接着性が極めて悪く、十分な耐刷性を得
ることができなかった。In each of these publications, it is described that a strong alkali is used as a developing solution. However, aluminum is an amphoteric metal and is very easily dissolved in alkali, so that the developing time is long or the developing temperature is high. DT if
There was a problem that the silver image precipitated by R was dissolved together with the base, that is, the development stability was lacking.
Also, Japanese Patent Application Laid-Open No. 7-199471 describes that a silicate having low aluminum solubility is used, but in this case, the adhesion between the image silver and the base is extremely poor, and sufficient printing durability can be obtained. could not.
【0008】[0008]
【発明が解決しようとする課題】本発明の目的は現像安
定性の良好な平版印刷版を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a lithographic printing plate having good development stability.
【0009】[0009]
【課題を解決するための手段】粗面化され陽極酸化され
たアルミニウム支持体上に少なくとも1層のハロゲン化
銀乳剤層を有し、そのハロゲン化銀乳剤層とアルミニウ
ム支持体との間にpKaが10〜12.5の化合物を含有させる
か、若くは両性金属の塩を含有することを特徴とする平
版印刷版を用いることによって達成された。SUMMARY OF THE INVENTION At least one silver halide emulsion layer is provided on a roughened and anodized aluminum support with a pKa between the silver halide emulsion layer and the aluminum support. Was achieved by using a lithographic printing plate characterized in that it contained a compound of from 10 to 12.5 or a salt of an amphoteric metal.
【0010】[0010]
【発明の実施の形態】本発明ではpKaが10〜12.5の化合
物、若くは両性金属の塩を含有させるにはハロゲン化銀
乳剤層とアルミニウム支持体の間にある層ならいずれの
層でも可能であるが、物理現像核層が最も好ましい。DETAILED DESCRIPTION OF THE INVENTION In the present invention, any compound having a pKa of 10 to 12.5 or a salt of an amphoteric metal can be contained in any layer between the silver halide emulsion layer and the aluminum support. However, a physical development nucleus layer is most preferred.
【0011】本発明においてpKaが10〜12.5の化合物は
有機化合物、無機化合物のどちらでも使用できるが、写
真性に影響のある化合物は好ましくない。無機化合物と
しては炭酸ナトリウム、リン酸などがある。また、有機
化合物としてはm-クレゾール、レゾルシノール、スルホ
サリチル酸などがある。これらは好ましくは0.1mmol/m2
以上、更に好ましくは0.5〜5mmol/m2塗布されることが
好ましい。また、これらを塗布する塗液のpHはアルミ支
持体に影響の少ない4.0〜8.0に調整することが好まし
い。In the present invention, a compound having a pKa of 10 to 12.5 can be used as an organic compound or an inorganic compound, but a compound having an adverse effect on photographic properties is not preferred. Inorganic compounds include sodium carbonate and phosphoric acid. Organic compounds include m-cresol, resorcinol, sulfosalicylic acid, and the like. These are preferably 0.1 mmol / m 2
As described above, it is more preferable to apply 0.5 to 5 mmol / m 2 . Further, the pH of the coating solution for applying these is preferably adjusted to 4.0 to 8.0 which has little influence on the aluminum support.
【0012】本発明において両性金属とはその酸化物が
酸に対しては塩基として作用し、塩基に対しては酸とし
て作用するものを言い、例えば亜鉛、カドミウム、ホウ
素、アルミニウム、ガリウム、インジウム、ケイ素、ゲ
ルマニウム、錫、鉛、ヒ素、アンチモン、ビスマスなど
がある。これら両性金属を塗布するには硫酸塩、硝酸
塩、リン酸塩、塩化物、臭化物などの形で、水溶性にし
て用いる。これらは0.1mmol/m2以上、好ましくは0.5〜
5mmol/m2、より好ましくは1〜5mmol/m2塗布されるこ
とである。また、これらを塗布する塗液のpHは沈殿を起
こさないように、弱酸性、4.0〜6.0に調整することが好
ましい。In the present invention, the amphoteric metal refers to an oxide whose oxide acts as a base for an acid and acts as an acid for a base. For example, zinc, cadmium, boron, aluminum, gallium, indium, There are silicon, germanium, tin, lead, arsenic, antimony, bismuth and the like. In order to apply these amphoteric metals, they are used in the form of sulfate, nitrate, phosphate, chloride, bromide, etc. after being made water-soluble. These are 0.1 mmol / m 2 or more, preferably 0.5 to
5 mmol / m 2, more preferably be applied 1~5mmol / m 2. Further, the pH of the coating liquid for applying these is preferably adjusted to a weak acidity and 4.0 to 6.0 so as not to cause precipitation.
【0013】本発明で用いられる物理現像核層の物理現
像核としては、公知の銀錯塩拡散転写法に用いられるも
のでよく、例えば金、銀等のコロイド、パラジウム、亜
鉛等の水溶性塩と硫化物を混合した金属硫化物などが使
用できる。保護コロイドとして各種親水性コロイドを用
いることもできる。これらの詳細及び製法については、
例えば、フォーカル・プレス、ロンドン ニューヨーク(1
972年)発行、アンドレロット及びエディス ワイデ著、
「フォトグラフィック・シルバー・ハライド・ディフュージ
ョン・プロセシズ」を参照し得る。The physical development nucleus of the physical development nucleus layer used in the present invention may be a physical development nucleus used in a known silver complex salt diffusion transfer method, for example, a colloid such as gold or silver, or a water-soluble salt such as palladium or zinc. Metal sulfide mixed with sulfide can be used. Various hydrophilic colloids can be used as the protective colloid. For details and manufacturing method,
For example, Focal Press, London New York (1
972) Published by Andre Lott and Edith Weide,
See "Photographic Silver Halide Diffusion Processes".
【0014】本発明で用いるアルミニウム支持体にはア
ルミニウム純度が93重量%以上、好ましくは99重量
%以上の純度のアルミニウム支持体を使用する。アルミ
ニウム不純物としては鉄、ケイ素、銅、マンガン、マグ
ネシウム、クロム、亜鉛、チタン、ビスマス、鉛、ジル
コニウム、ニッケルなど通常アルミニウム合金として用
いられている元素が使用できる。また、特に好ましいア
ルミ合金としては1050、1100、3003などが
挙げられる。The aluminum support used in the present invention has an aluminum purity of 93% by weight or more, preferably 99% by weight or more. As the aluminum impurities, elements commonly used as aluminum alloys such as iron, silicon, copper, manganese, magnesium, chromium, zinc, titanium, bismuth, lead, zirconium, and nickel can be used. Particularly preferred aluminum alloys include 1050, 1100, and 3003.
【0015】本発明で用いられるアルミニウム支持体は
公知の方法で圧延される。すなわち、アルミニウムのイ
ンゴットを溶解保持してスラブを鋳造し、スラブ表面の
不純物組織部分を面削機にかけて3〜10mmづつ切削
する面切削工程を経た後、均熱炉において480〜54
0℃、6〜12時間保持する均熱化処理工程を行い、し
かる後に熱間圧延で5〜40mmの厚みに圧延した後、
室温で所定の厚みに冷間圧延を行う。またその後組織の
均一化のために焼鈍を行い圧延組織等を均質化した後、
規定の厚みに冷間圧延を行い、平坦度の良い板にするた
め矯正する。支持体の厚さは通常約0.13〜0.50mmの範囲
である。The aluminum support used in the present invention is rolled by a known method. That is, a slab is cast by dissolving and holding an aluminum ingot, and a surface cutting step of cutting an impurity structure portion of the slab surface by a facer at a rate of 3 to 10 mm is performed.
0 ° C., performing a soaking process of holding for 6 to 12 hours, and then hot rolling to a thickness of 5 to 40 mm,
Cold rolling is performed at room temperature to a predetermined thickness. In addition, after annealing and homogenizing the rolled structure etc. afterwards for the uniformity of the structure,
Cold rolling is performed to a specified thickness, and straightening is performed to obtain a plate with good flatness. The thickness of the support usually ranges from about 0.13 to 0.50 mm.
【0016】本発明に用いられる支持体には、この技術
分野において通常使用されている脱脂処理、粗面化処理
及び陽極酸化処理等が施されるが、少なくとも粗面化処
理及び陽極酸化処理がこの順で行なわれた支持体を用い
る。The support used in the present invention is subjected to a degreasing treatment, a roughening treatment, an anodizing treatment, etc., which are generally used in this technical field. At least the roughening treatment and the anodizing treatment are performed. A support made in this order is used.
【0017】本発明で用いるアルミニウム板は表面から
脂肪性物質を除去するために脱脂処理を行う。脱脂処理
としてはトリクレン、シンナー等の溶剤脱脂、界面活性
剤、ケロシン、トリエタノールアミン、水酸化ナトリウ
ムを混ぜたエマルジョン脱脂、酸脱脂、アルカリ脱脂な
どがある。The aluminum plate used in the present invention is subjected to a degreasing treatment to remove fatty substances from the surface. Examples of the degreasing treatment include solvent degreasing such as trichlene and thinner, emulsion degreasing mixed with a surfactant, kerosene, triethanolamine, and sodium hydroxide, acid degreasing, and alkali degreasing.
【0018】本発明で用いるアルミニウム板は感光層と
の密着性を良好にし、かつ保水性を改善するために粗面
化処理をされる。粗面化処理の方法としては機械的処
理、化学的処理、電気化学的処理があり、これらを単独
もしくは組み合わせて処理を行うが、特にベースの色調
をコントロールするために化学的処理、電気化学的処理
は不可欠である。表面の形状は一般に粗さ計により表さ
れるが、その大きさは中心線平均粗さ;Raの値で0.3〜
1.0μmが適当である。The aluminum plate used in the present invention is subjected to a surface roughening treatment in order to improve the adhesion to the photosensitive layer and to improve the water retention. There are mechanical treatment, chemical treatment, and electrochemical treatment as a method of surface roughening treatment. These treatments are performed alone or in combination, but in particular, in order to control the color tone of the base, chemical treatment, electrochemical treatment, Processing is essential. The shape of the surface is generally represented by a roughness meter, and the size of the surface is center line average roughness;
1.0 μm is appropriate.
【0019】機械的粗面化処理としてボールグレイン
法、ナイロンブラシ法、バフ研磨法、ブラスト研磨法等
を用いることができる。また化学的粗面化には塩化物、
フッ化物等で化学的にアルミニウムを溶解する方法があ
る。As the mechanical surface roughening treatment, a ball grain method, a nylon brush method, a buff polishing method, a blast polishing method, or the like can be used. Chloride,
There is a method of chemically dissolving aluminum with fluoride or the like.
【0020】電気化学的粗面化処理方法は他の方法に比
較して電解液組成及び電解条件によって、砂目の形状及
び表面粗さを微妙にコントロールすることが可能なので
この方法を用いることが好ましい。電気化学的粗面化処
理は直流、交流または両者の組み合わせで行うことがで
きる。交流波としては単相又は3相の商業用交流あるい
はこれらを含めた10〜300Hzの範囲の正弦波、矩形波、
台波等がある。Since the electrochemical graining treatment method can finely control the grain shape and surface roughness depending on the composition of the electrolytic solution and the electrolytic conditions as compared with other methods, it is preferable to use this method. preferable. The electrochemical graining treatment can be performed by direct current, alternating current, or a combination of both. As the AC wave, a single-phase or three-phase commercial AC or a sine wave in the range of 10 to 300 Hz including these, a square wave,
There are typhoons and the like.
【0021】アルミニウム板に供給される電力は電解液
の組成、温度、電極間距離等により変わるが、印刷版と
して適切な砂目を得るためには、一般に電圧では1〜60
A/dm2、電気量では50〜4000Cの範囲で使われる。また
電極とアルミニウム板との距離は1〜10cmの範囲が好ま
しい。The electric power supplied to the aluminum plate varies depending on the composition of the electrolytic solution, the temperature, the distance between the electrodes, and the like.
It is used in the range of 50-4000C in A / dm 2 and electric quantity. The distance between the electrode and the aluminum plate is preferably in the range of 1 to 10 cm.
【0022】電解液としては硝酸あるいはその塩、塩酸
あるいはその塩、あるいはそれらの1種または2種以上の
混合物の水溶液が使用できる。更に必要に応じて硫酸、
リン酸、クロム酸、硼酸、有機酸、あるいはそれらの
塩、アンモニウム塩、アミン類、界面活性剤、その他の
腐食防止剤、腐食促進剤、安定化剤を加えて使用するこ
ともできる。As the electrolytic solution, an aqueous solution of nitric acid or a salt thereof, hydrochloric acid or a salt thereof, or one or a mixture of two or more thereof can be used. If necessary, sulfuric acid,
Phosphoric acid, chromic acid, boric acid, organic acids, or salts thereof, ammonium salts, amines, surfactants, other corrosion inhibitors, corrosion accelerators, and stabilizers can also be used.
【0023】電解液の濃度としては上記の酸類の濃度が
0.1〜10%であり、電解液中のアルミニウムイオンの濃
度を0〜10g/Lの範囲に維持したものが好ましい。電解液
の温度は0〜60℃が好ましい。As the concentration of the electrolyte, the concentration of the above-mentioned acids is as follows.
It is preferably 0.1 to 10%, and the concentration of aluminum ions in the electrolyte is maintained in the range of 0 to 10 g / L. The temperature of the electrolyte is preferably from 0 to 60 ° C.
【0024】本発明においてデスマットとは粗面化と陽
極酸化の間に行う化学エッチング工程のことを指す。デ
スマットには酸あるいはアルカリを用いて行うことがで
きるが酸処理が好ましい。酸には、硝酸、リン酸、クロ
ム酸、硫酸、塩酸、フッ酸などを単独、あるいは数種混
合して用いることができる。アルカリデスマットには水
酸化ナトリウム、炭酸ナトリウム、水酸化カリウム、炭
酸カリウム、第三リン酸カリウム、アルミン酸ナトリウ
ム、珪酸ナトリウムなどを単独、もしくは数種混合して
用いることができる。またそのデスマット液の濃度、処
理時間はスマットを完全に除去できるだけの濃度が必要
である。スマットの発生量はその前段階の粗面化の処理
方法に依存しているので、必要なデスマットの程度は粗
面化の方法に依存する。しかしスマットの除去の程度は
走査型顕微鏡で容易に観察できるので、これで処理した
アルミの表面を観測することでスマットが完全に除去さ
れるデスマットの程度を容易に決定することができる。
実際には廃液の処理の関係もあり、酸あるいはアルカリ
の合計で5〜40%程度で、その処理時間は30秒〜2分
が好ましい。処理温度は40〜60℃が好ましい。In the present invention, desmut refers to a chemical etching step performed between surface roughening and anodic oxidation. Desmutting can be performed using an acid or alkali, but acid treatment is preferred. As the acid, nitric acid, phosphoric acid, chromic acid, sulfuric acid, hydrochloric acid, hydrofluoric acid and the like can be used alone or as a mixture of several kinds. For the alkali desmut, sodium hydroxide, sodium carbonate, potassium hydroxide, potassium carbonate, potassium tertiary phosphate, sodium aluminate, sodium silicate, or the like can be used alone or in combination. Further, the concentration of the desmut solution and the processing time must be such that the smut can be completely removed. Since the amount of smut generation depends on the roughening treatment method at the preceding stage, the required degree of desmutting depends on the roughening method. However, since the degree of smut removal can be easily observed with a scanning microscope, the degree of desmut from which smut is completely removed can be easily determined by observing the surface of the aluminum treated with the scanning microscope.
Actually, there is also a relationship with the treatment of the waste liquid. The total amount of the acid or alkali is about 5 to 40%, and the treatment time is preferably 30 seconds to 2 minutes. The processing temperature is preferably from 40 to 60 ° C.
【0025】本発明においてデスマット工程は2回以上
に分けることも可能である。この場合酸デスマットとア
ルカリデスマットとを組み合わせることも可能である
が、アルカリデスマットを先にするほうが好ましい。In the present invention, the desmutting step can be divided into two or more times. In this case, it is possible to combine acid desmut and alkali desmut, but it is preferable to use alkali desmut first.
【0026】このような粗面化処理、デスマット処理を
行った後、陽極酸化処理が施される。陽極酸化の電解液
には硫酸、リン酸、シュウ酸、クロム酸または有機酸
(例えばスルファミン酸、ベンゼンスルホン酸など)ま
たはそれらの混合物が好ましく、また特に生成酸化膜の
溶解性の低い酸が好ましい。After performing such a roughening treatment and a desmutting treatment, an anodic oxidation treatment is performed. Sulfuric acid, phosphoric acid, oxalic acid, chromic acid or an organic acid (eg, sulfamic acid, benzenesulfonic acid, etc.) or a mixture thereof is preferable for the anodizing electrolyte, and an acid having low solubility of the formed oxide film is particularly preferable. .
【0027】陽極酸化膜は陽極にのみ生成するので電流
は通常直流電流が使用される。陽極酸化の条件としては
液濃度1〜40%、電流密度0.1〜10A/dm2、電圧10〜100
Vの範囲で使用される。陽極酸化膜の厚みは電流密度と
時間により変えられ、印刷版の耐刷グレードによって適
宜調整されるが、3g/m2以下、好ましくは2.8〜1g/
m2、更に好ましくは好ましくは2.3〜1g/m2必要とな
る。温度は陽極酸化膜の硬度に影響を与え、低温では硬
度は高くなるが、可撓性に劣るため通常は常温付近の温
度で処理される。これら作成した陽極酸化膜の量はJIS
H86807「皮膜質量法」に基づいて測定できる。Since the anodic oxide film is formed only on the anode, a direct current is usually used as the current. The conditions of anodic oxidation are as follows: liquid concentration 1 to 40%, current density 0.1 to 10 A / dm 2 , voltage 10 to 100
Used in the V range. The thickness of the anodic oxide film is changed depending on the current density and time, and is appropriately adjusted depending on the printing durability of the printing plate, but 3 g / m 2 or less, preferably 2.8 to 1 g /
m 2 , more preferably 2.3 to 1 g / m 2 . The temperature affects the hardness of the anodic oxide film, and the hardness increases at a low temperature, but the processing is usually performed at a temperature near normal temperature because of poor flexibility. The amount of anodic oxide film created is JIS
It can be measured based on H86807 “Coating Mass Method”.
【0028】また、陽極酸化処理を行なった後、必要に
応じて後処理を行うことも出来る。後処理としては当該
業者に知られた方法、例えば珪酸塩処理、弗化ジルコン
酸処理などの無機塩類での後処理、アラビアガム、ポリ
ビニルホスホン酸、ポリビニルスルホン酸等の有機高分
子処理、水和封孔処理などがある。After the anodic oxidation treatment, a post-treatment can be performed if necessary. As the post-treatment, methods known to those skilled in the art, for example, post-treatment with inorganic salts such as silicate treatment, fluorozirconic acid treatment, organic polymer treatment such as gum arabic, polyvinyl phosphonic acid, polyvinyl sulfonic acid, hydration There is a sealing treatment and the like.
【0029】本発明の印刷版の感光性ハロゲン化銀乳剤
層には保護コロイドとして各種親水性コロイドを用いる
ことができる。即ち、酸処理ゼラチン、アルカリ処理ゼ
ラチン、ゼラチン誘導体、グラフト化ゼラチン等各種ゼ
ラチンを用いることが出来る他、ポリビニルピロリド
ン、各種でんぷん、アルブミン、ポリビニルアルコー
ル、アラビアゴム、ヒドロキシエチルセルロース、等の
親水性高分子化合物を含有させることが出来る。用いら
れる親水性コロイドとしては、ゼラチン、ゼラチン誘導
体、ポリビニルアルコール、ポリビニルピロリドン等が
挙げられるが、好ましくは、物理現像後の親水性コロイ
ド層の剥離性を容易にするために実質的に硬膜剤を含ま
ない親水性コロイド層を用いることが望ましい。Various hydrophilic colloids can be used as protective colloids in the photosensitive silver halide emulsion layer of the printing plate of the present invention. That is, various gelatins such as acid-treated gelatin, alkali-treated gelatin, gelatin derivatives, and grafted gelatin can be used, and hydrophilic polymer compounds such as polyvinylpyrrolidone, various starches, albumin, polyvinyl alcohol, gum arabic, and hydroxyethyl cellulose. Can be contained. Examples of the hydrophilic colloid used include gelatin, a gelatin derivative, polyvinyl alcohol, and polyvinylpyrrolidone. Preferably, a substantially hardener is used to facilitate release of the hydrophilic colloid layer after physical development. It is desirable to use a hydrophilic colloid layer containing no.
【0030】本発明に用いられる感光性ハロゲン化銀乳
剤の種類としては、一般に用いられる塩化銀、臭化銀、
ヨウ化銀、塩臭化銀、塩ヨウ臭化銀、ヨウ臭化銀等から
選択される。また乳剤のタイプとしてはネガ型、ポジ型
のいずれでもよい。これらのハロゲン化銀乳剤は必要に
応じて化学増感あるいはスペクトル増感することが出来
る。The types of photosensitive silver halide emulsions used in the present invention include commonly used silver chloride, silver bromide, and silver halide.
It is selected from silver iodide, silver chlorobromide, silver chloroiodobromide, silver iodobromide and the like. The emulsion type may be either a negative type or a positive type. These silver halide emulsions can be chemically or spectrally sensitized as necessary.
【0031】本発明においてハロゲン化銀乳剤層にはベ
ンゾトリアゾールもしくはその誘導体、メルカプト基も
しくはチオン基を有する含窒素複素環化合物を含有させ
ることもできる。その量は1〜100mg/m2、好ましくは5
〜30mg/m2である。In the present invention, the silver halide emulsion layer may contain benzotriazole or a derivative thereof, or a nitrogen-containing heterocyclic compound having a mercapto group or a thione group. The amount is 1 to 100 mg / m 2 , preferably 5
3030 mg / m 2 .
【0032】ベンゾトリアゾール誘導体としては5−メ
チルベンゾトリアゾール、5ークロルベンゾトリアゾー
ル等が挙げられる。またメルカプト基もしくはチオン基
を有する含窒素複素環化合物の複素環としてはイミダゾ
ール、イミダゾリン、チアゾール、チアゾリン、オキサ
ゾール、オキサゾリン、ピラゾリドン、トリゾール、チ
アジアゾール、オキサジアゾール、テトラゾール、ピリ
ジン、ピリミジン、ピリダジン、ピラジン、トリアジン
等があり、中でもイミダゾール、トリアゾール、テトラ
ゾールが好ましい。Examples of the benzotriazole derivative include 5-methylbenzotriazole, 5-chlorobenzotriazole and the like. Examples of the heterocycle of the nitrogen-containing heterocyclic compound having a mercapto group or a thione group include imidazole, imidazoline, thiazole, thiazoline, oxazole, oxazoline, pyrazolidone, trizole, thiadiazole, oxadiazole, tetrazole, pyridine, pyrimidine, pyridazine, pyrazine, There are triazine and the like, and among them, imidazole, triazole and tetrazole are preferable.
【0033】メルカプト基もしくはチオン基を有する含
窒素複素環化合物の具体例を以下に挙げる。2−メルカ
プト−4−フェンルイミダゾール、2−メルカプト−1
−ベンジルイミダゾール、2メルカプト−1−ブチル−
ベンズイミダゾール、1エチル−2−メルカプト−ベン
ズイミダゾール、2メルカプト−ベンズイミダゾール、
1,3ジエチル−ベンズイミダゾリン−2−チオン、
1,3ジベンジル−イミダゾリジン−2−チオン、2,
2−ジメルカプト−1,1’−デカメチレン−ジイミダ
ゾリン−2−チオン、2メルカプト−4−フェニルチア
ゾール、2−メルカプト−ベンゾチアゾール、2−メル
カプトナフトチアゾール、3−エチル−ベンゾチアゾリ
ン−2−チオン、3−ドデシル−ベンゾチアゾリン−2
−チオン、2−メルカプト−4,5−ジフェニルオキサ
ゾール、2−メルカプトベンゾオキサゾール、3−ペン
チル−ベンゾオキサゾリン−2−チオン、1−フェニル
−3−メチルピラゾリドン−5−チオン、3−メルカプ
ト−4−アリル−5−ペンタデシル−1,2,4−トリ
アゾール、3−メルカプト−5−ノニル−1,2,4−
トリアゾール、3−メルカプト−5−ノニル−5−1,
2,4−トリアゾール、3−メルカプト−4−アリル−
5−ペンタデシル−1,2,4−トリアゾール、3−メ
ルカプト−4−アミノ−5−ヘプタデシル−1,2,4
−トリアゾール、2−メルカプト−5−フェニル−5−
ペンタデシル−1,3,4−チアジアゾール、2−メル
カプト−5−n−ヘプチル−オキサチアゾール、2−メ
ルカプト−5−フェニル1,3,4−オキサジアゾー
ル、5−メルカプト−1−フェニル−テトラゾール、2
−メルカプト−5−ニトロピリジン、1−メチル−キノ
リン−2(1H)−チオン、3−メルカプト−4−メチ
ル−6−フェニルピリダジン、2−メルカプト−5,6
−ジフェニル−ピラッジン、2−メルカプト−4,6−
ジフェニル1,3,5トリアジン、2−アミノ−4−メ
ルカプト−6−ベンジル−1,3,5−トリアジン、
1,5−ジメルカプト−3,7−ジフェニル−S−トリ
アゾリノ[1,2−a]−S−トリアゾリン等が挙げら
れる。Specific examples of the nitrogen-containing heterocyclic compound having a mercapto group or a thione group are shown below. 2-mercapto-4-fenlimidazole, 2-mercapto-1
-Benzylimidazole, 2 mercapto-1-butyl-
Benzimidazole, 1 ethyl-2-mercapto-benzimidazole, 2 mercapto-benzimidazole,
1,3 diethyl-benzimidazoline-2-thione,
1,3 dibenzyl-imidazolidin-2-thione, 2,
2-dimercapto-1,1′-decamethylene-diimidazoline-2-thione, 2-mercapto-4-phenylthiazole, 2-mercapto-benzothiazole, 2-mercaptonaphthothiazole, 3-ethyl-benzothiazoline-2-thione, 3-dodecyl-benzothiazoline-2
-Thione, 2-mercapto-4,5-diphenyloxazole, 2-mercaptobenzoxazole, 3-pentyl-benzoxazoline-2-thione, 1-phenyl-3-methylpyrazolidone-5-thione, 3-mercapto- 4-allyl-5-pentadecyl-1,2,4-triazole, 3-mercapto-5-nonyl-1,2,4-
Triazole, 3-mercapto-5-nonyl-5-1,
2,4-triazole, 3-mercapto-4-allyl-
5-pentadecyl-1,2,4-triazole, 3-mercapto-4-amino-5-heptadecyl-1,2,4
-Triazole, 2-mercapto-5-phenyl-5-
Pentadecyl-1,3,4-thiadiazole, 2-mercapto-5-n-heptyl-oxathiazole, 2-mercapto-5-phenyl-1,3,4-oxadiazole, 5-mercapto-1-phenyl-tetrazole, 2
-Mercapto-5-nitropyridine, 1-methyl-quinoline-2 (1H) -thione, 3-mercapto-4-methyl-6-phenylpyridazine, 2-mercapto-5,6
-Diphenyl-pyrazin, 2-mercapto-4,6-
Diphenyl 1,3,5 triazine, 2-amino-4-mercapto-6-benzyl-1,3,5-triazine,
1,5-dimercapto-3,7-diphenyl-S-triazolino [1,2-a] -S-triazoline and the like.
【0034】本発明では現像液に現像主薬、例えばポリ
ヒドロキシベンゼン類、3-ピラゾリジノン類、保恒剤、
例えば亜硫酸ナトリウム、粘稠剤、例えばカルボキシメ
チルセスロース、カブリ防止剤、例えば臭化カリウム、
1-フェニル-5-メルカプトテトラゾール、現像変成剤、
例えばポリオキシアルキレン化合物等の添加剤等を含ま
せることが出来る。またケイ酸塩以外にアルカリ性物
質、例えば水酸化カリウム、水酸化ナトリウム、水酸化
リチウム、第3燐酸ナトリウム、あるいはアミン化合物
を含ませることも可能である。In the present invention, a developing agent such as polyhydroxybenzenes, 3-pyrazolidinones, preservatives,
E.g. sodium sulfite, thickeners such as carboxymethylcellulose, antifoggants such as potassium bromide,
1-phenyl-5-mercaptotetrazole, development modifier,
For example, additives such as a polyoxyalkylene compound can be included. In addition to the silicate, an alkaline substance such as potassium hydroxide, sodium hydroxide, lithium hydroxide, sodium tertiary phosphate, or an amine compound can be contained.
【0035】本発明での現像液のpHとして通常約10〜1
4、好ましくは約12〜14であるが、使用する平版印刷版
のアルミニウム支持体の前処理(例えば陽極酸化)条件、
写真要素、所望の像、現像液中の各種化合物の種類及び
量、現像条件等によって異なる。The pH of the developer in the present invention is usually about 10 to 1
4, preferably about 12-14, but pretreatment (e.g. anodizing) conditions of the aluminum support of the lithographic printing plate to be used,
It depends on the photographic element, the desired image, the type and amount of various compounds in the developer, the development conditions, and the like.
【0036】本発明に於いて、現像後、直ちにゼラチン
層を除去するためのウォッシュオフ行程で行う。ウォッ
シュオフは温度20〜40℃程度で行なう。ウォッシュオフ
溶液には酵素や特開平10-133381にあるようなメルカプ
ト基またはチオン基を有する化合物を含ませることも可
能である。また、ウォッシュオフ行程を多段階に分ける
ことも可能である。In the present invention, a washing-off process for removing the gelatin layer immediately after the development is performed. Wash off is performed at a temperature of about 20 to 40 ° C. The wash-off solution may contain an enzyme or a compound having a mercapto group or a thione group as described in JP-A-10-133381. Further, the wash-off process can be divided into multiple stages.
【0037】銀塩印刷版においては通常版面保護の為に
ガム引きがなされる。ガム液はアラビヤガム、デキスト
リン、アルギン酸ナトリウム、ヒドロキシエチル澱粉、
カルボキシメチルセルロース、ヒドロキシエチルセルロ
ース、ポリビニルピロリドン、ポリスチレンスルホン
酸、ポリビニルアルコール等の保護コロイドを有するこ
とが好ましい。In silver salt printing plates, gumming is usually performed to protect the plate surface. The gum solution is arabic gum, dextrin, sodium alginate, hydroxyethyl starch,
It is preferable to have a protective colloid such as carboxymethylcellulose, hydroxyethylcellulose, polyvinylpyrrolidone, polystyrenesulfonic acid, and polyvinyl alcohol.
【0038】[0038]
【実施例】以下に本発明を実施例により説明するが、本
発明はこれらに何ら限定されるものではない。なお%は
断りのないかぎり重量%を示す。EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples. In addition,% shows weight% unless there is a notice.
【0039】実施例1 材質1050のアルミニウム板を4%水酸化ナトリウム
水溶液で50℃1分脱脂処理を行い、水洗した後、400メ
ッシュのパミストン懸濁液を用い、回転ナイロンブラシ
で研磨し、2.5%の塩酸水溶液中20℃で交流密度50A/dm
2で60秒電解粗面化処理を行い、20%リン酸で50℃1分間
デスマット処理した。その後25%硫酸溶液中で温度20℃
電気密度3A/dm2、処理時間45秒で陽極酸化処理した。Example 1 A 1050 aluminum plate was degreased with a 4% aqueous solution of sodium hydroxide at 50 ° C. for 1 minute, washed with water, polished with a 400 mesh pumicestone suspension with a rotating nylon brush, and polished to a thickness of 2.5%. AC density 50A / dm at 20 ℃ in 20% hydrochloric acid aqueous solution
2 was subjected to electrolytic surface roughening treatment for 60 seconds, followed by desmut treatment with 20% phosphoric acid at 50 ° C. for 1 minute. Then in a 25% sulfuric acid solution at a temperature of 20 ℃
Anodizing was performed at an electric density of 3 A / dm 2 and a processing time of 45 seconds.
【0040】物理現像核液として硫化パラジウム核を作
製し、これに表1にある塗布量(添加量)となるようpK
aが10〜12.5である化合物Aを含有させた。この核液のp
Hは4.5とした。この核液を作成したアルミ支持体上に塗
布量が硫化パラジウムとして3mg/m2となるよう塗布し
た。また、ヨウ素を0.5%含む塩化銀乳剤(平均粒径0.3
μm)を金硫黄増感し、更に赤色に色素増感し、塩ヨウ
化銀乳剤を作成した。つぎに作成したプレートにこの乳
剤を塗布量が硝酸銀で2.0g/m2となるよう塗布乾燥し感
光性平版印刷版を作成した。A palladium sulfide nucleus was prepared as a physical development nucleus solution, and pK was adjusted to the coating amount (addition amount) shown in Table 1.
Compound A in which a was 10-12.5 was included. P of this nuclear fluid
H was set to 4.5. This nucleus solution was applied on the prepared aluminum support so that the application amount was 3 mg / m 2 as palladium sulfide. In addition, a silver chloride emulsion containing 0.5% iodine (average particle size 0.3%)
μm) was sensitized with gold-sulfur and further dye-sensitized to red to form a silver chloroiodide emulsion. Next, this emulsion was coated with silver nitrate at 2.0 g / m 2 and dried on the prepared plate to prepare a photosensitive lithographic printing plate.
【0041】このようにして得られた平版印刷版に光源
が赤色半導体レーザーであるイメージセッターSDP-α24
00(三菱製紙社製)で2400dpi、175lpiで像露光及び全
面網露光を行った。次に製版用プロセッサー(三菱製紙
社製P-α880)を用いて、現像製版処理を行った。製版
用プロセッサーは、現像処理工程(22℃)、水洗処理工
程(35℃の水洗水をシャワー噴射しながらスクラブロー
ラーで乳剤層をウォッシュオフする)、仕上げ処理工程
(21℃、シャワー)及び乾燥工程から構成されてい
る。水洗処理工程は貯蔵タンクに貯留された20Lの水洗
水をポンプで循環させて、平版印刷版にシャワー噴射し
た後、濾過フィルターで濾過して貯留タンクに回収し再
使用するクローズドタイプとなっている。処理速度は版
が現像液に浸漬する時間で表わし、この処理速度を変え
て製版した。The lithographic printing plate obtained in this manner has an image setter SDP-α24 whose light source is a red semiconductor laser.
Image exposure and full screen exposure were performed at 2400 dpi and 175 lpi with 00 (manufactured by Mitsubishi Paper Mills). Next, development plate-making processing was performed using a plate-making processor (P-α880 manufactured by Mitsubishi Paper Mills). The plate making processor includes a developing process (22 ° C.), a rinsing process (washing off the emulsion layer with a scrub roller while spraying rinsing water at 35 ° C.), a finishing process (21 ° C., shower), and a drying process. It is composed of The washing process is a closed type that circulates 20L of washing water stored in the storage tank with a pump, sprays it onto a lithographic printing plate, then filters it with a filter, collects it in the storage tank, and reuses it. . The processing speed was represented by the time during which the plate was immersed in the developer, and the plate was made at different processing speeds.
【0042】用いた現像液、水洗液、仕上げ液の構成は
次の通りである。 <現像液> 水酸化ナトリウム 20g ハイドロキノン 20g 1−フェニル−3ピラゾリジノン 2g 無水亜硫酸ナトリウム 80g N−メチルエタノールアミン 6g エチレンジアミン4酢酸ナトリウム塩 5g 脱イオン水で1000mLとする。 pH(25℃)=13.4The structures of the developing solution, washing solution and finishing solution used are as follows. <Developer> 20 g of sodium hydroxide 20 g of hydroquinone 1 g of 1-phenyl-3-pyrazolidinone 2 g of anhydrous sodium sulfite 80 g 6 g of N-methylethanolamine 5 g of sodium sodium ethylenediaminetetraacetate 5 g of deionized water. pH (25 ° C) = 13.4
【0043】<水洗液> 2−メルカフ゜ト−5−nヘフ゜チル−オキサンシ゛オール 0.5g トリエタノールアミン 13g 重亜硫酸ナトリウム 10g リン酸2水素カリウム 40g タンパク質分解酵素 1g 水を加えて全量を1000ccに調整する。pHは6.0
に調整した。タンパク質分解酵素として、ビオプラーゼ
AL-15(細菌プロティナーゼ、長瀬産業(株)製)を用
いた。<Washing solution> 2-mercapto-5-n-heptyl-oxanediol 0.5 g triethanolamine 13 g sodium bisulfite 10 g potassium dihydrogen phosphate 40 g proteinase 1 g Water is added to adjust the total amount to 1000 cc. . pH 6.0
Was adjusted. Bioprolase as a proteolytic enzyme
AL-15 (bacterial proteinase, manufactured by Nagase & Co., Ltd.) was used.
【0044】<仕上げ液> アラビアゴム 10g リン酸 0.5g 硝酸ナトリウム 20g ポリエチレングリコール#400 100g 2-メルカフ゜ト-5-nヘフ゜チルオキサンシ゛オール 0.5g 脱イオン水にて1000mLとする。水酸化ナトリウム
にてpHは6.5に調整した。<Finishing solution> Gum arabic 10 g Phosphoric acid 0.5 g Sodium nitrate 20 g Polyethylene glycol # 400 100 g 2-Mercapto-5-n-heptyloxane diol 0.5 g Make up to 1000 mL with deionized water. The pH was adjusted to 6.5 with sodium hydroxide.
【0045】この様にして作成した平版印刷板を、印刷
機スプリント226(コモリコーポレーション)で印刷
した。The lithographic printing plate thus prepared was printed by a printing machine Sprint 226 (Komori Corporation).
【0046】表1に印刷結果を示す。現像ラチチュード
は現像時間を変えて製版した版で1万枚印刷した結果、
網点や細線にかけができなかった現像時間(秒数)を示
し、このラチチュードが広ければ広いほど製版安定性の
良好な印刷版であると言える。Table 1 shows the printing results. The development latitude was changed to a plate made by changing the development time, and as a result of printing 10,000 sheets,
This indicates the development time (seconds) in which halftone dots and fine lines could not be applied. The wider the latitude, the better the printing plate stability.
【0047】[0047]
【表1】 ─────────────────────────────────── No. 化合物A pKa 解離段 添加量 現像ラチチュート゛ 備考 (mmol/m2) ─────────────────────────────────── 1 なし 9〜10秒 比較 2 スルホサリチル酸 12.0 2 0.1 9〜12秒 本発明 3 スルホサリチル酸 12.0 2 0.5 9〜13秒 本発明 4 スルホサリチル酸 12.0 2 2.0 9〜13秒 本発明 5 レソ゛ルシノール 11.3 2 2.0 9〜13秒 本発明 6 マロン酸 5.3 2 2.0 9〜10秒 比較 7 o-ニトロフェノール 7.2 2.0 9〜10秒 比較 8 p-フェノールスルホン酸 9.1 2 2.0 9〜10秒 比較 9 リン酸 12.4 2 2.0 9〜12秒 本発明 10 炭酸ナトリウム 10.3 2 2.0 9〜12秒 本発明 ───────────────────────────────────[Table 1] ─────────────────────────────────── No. Compound A pKa Dissociation stage Addition amount Development latitude ゛Remarks (mmol / m 2 ) ─────────────────────────────────── 1 None 9-10 seconds Comparison 2 Sulfosalicylic acid 12.0 2 0.1 9 to 12 seconds The present invention 3 Sulfosalicylic acid 12.0 2 0.5 9 to 13 seconds The present invention 4 Sulfosalicylic acid 12.0 22.0 9 to 13 seconds The present invention 5 Resorucinol 11.3 22.0 9 to 13 seconds The present invention 6 Malonic acid 5.3 2 2.0 9-10 seconds comparison 7 o-nitrophenol 7.2 2.0 9-10 seconds comparison 8 p-phenolsulfonic acid 9.1 2 2.0 9-10 seconds comparison 9 phosphoric acid 12.4 22.0 9-12 seconds invention 10 sodium carbonate 10.3 2 2.0 9 to 12 seconds The present invention ───────────────────────────────────
【0048】表1よりpKaが10〜12.5の化合物を物理現
像核層に含有させることによって、現像ラチチュードが
広がることが判る。From Table 1, it can be seen that the development latitude is expanded by including a compound having a pKa of 10 to 12.5 in the physical development nucleus layer.
【0049】実施例2 実施例1の物理現像核層にpKaが10〜12.5の化合物に代
えて表2のように両性金属の塩を入れる以外は実施例1
と同様試験したところ、表2のような結果を得た。Example 2 Example 1 was repeated except that a salt of an amphoteric metal was added to the physical development nucleus layer of Example 1 in place of the compound having a pKa of 10 to 12.5 as shown in Table 2.
As a result, the results shown in Table 2 were obtained.
【0050】[0050]
【表2】 ────────────────────────────────── No. 化合物 添加量 現像ラチチュート゛ 備考 (mmol/m2) ────────────────────────────────── 1 なし 9〜10秒 比較 11 硫酸アルミニウム 0.1 9〜12秒 本発明 12 同上 0.5 9〜12秒 本発明 13 同上 2.0 9〜13秒 本発明 14 硫酸亜鉛 0.5 9〜12秒 本発明 15 硫酸亜鉛 2.0 9〜13秒 本発明 16 塩化錫(II) 0.5 9〜12秒 本発明 17 塩化錫(IV) 0.5 9〜12秒 本発明 ──────────────────────────────────[Table 2] ────────────────────────────────── Addition amount of No. compound Developing latitude ゛ Remarks (mmol / m 2 ) 1 1 None 9-10 seconds Comparison 11 Aluminum sulfate 0.1 9-12 Second invention 12 Same as above 0.5 9 to 12 seconds Invention 13 Same as above 2.0 9 to 13 seconds Invention 14 Zinc sulfate 0.59 to 12 seconds Invention 15 Zinc sulfate 2.0 9 to 13 seconds Invention 16 Tin (II) chloride 0.59 to 12 seconds invention 17 tin (IV) chloride 0.5 9-12 seconds invention ───────────────────────────────── ─
【0051】表2より、両性金属の塩を物理現像核層に
含有することによって現像ラチチュードの広がることが
判る。From Table 2, it can be seen that the development latitude is widened by containing a salt of an amphoteric metal in the physical development nucleus layer.
【0052】[0052]
【発明の効果】粗面化され陽極酸化されたアルミニウム
支持体上に少なくとも1層のハロゲン化銀乳剤層を有
し、そのハロゲン化銀乳剤層とアルミニウム支持体との
間にpKaが10〜12.5の化合物、若くは両性金属の塩を含
有させることによって広い現像ラチチュードを持った平
版印刷版を得ることができる。The invention has at least one silver halide emulsion layer on a roughened and anodized aluminum support, and has a pKa between 10 and 12.5 between the silver halide emulsion layer and the aluminum support. Or a salt of an amphoteric metal, a lithographic printing plate having a wide development latitude can be obtained.
Claims (3)
支持体上に少なくとも1層のハロゲン化銀乳剤層を有
し、そのハロゲン化銀乳剤層とアルミニウム支持体との
間にpKaが10〜12.5の化合物を含有することを特徴とす
る平版印刷版。1. A method according to claim 1, wherein the silver halide emulsion layer has at least one silver halide emulsion layer on a roughened and anodized aluminum support, and has a pKa of 10 to 12.5 between the silver halide emulsion layer and the aluminum support. A lithographic printing plate comprising the compound of formula (I).
支持体上に少なくとも1層のハロゲン化銀乳剤層を有
し、そのハロゲン化銀乳剤層とアルミニウム支持体との
間に両性金属の塩を含有することを特徴とする平版印刷
版。2. The method according to claim 1, further comprising at least one silver halide emulsion layer on the roughened and anodized aluminum support, wherein an amphoteric metal salt is interposed between the silver halide emulsion layer and the aluminum support. A lithographic printing plate characterized by containing.
ウム支持体の間に物理現像核層を有し、該物理現像核層
がpKa10〜12.5の化合物または両性金属の塩を含有する
請求項1または2に記載の平版印刷版。3. A physical development nucleus layer between the silver halide emulsion layer and the aluminum support, wherein the physical development nucleus layer contains a compound having a pKa of 10 to 12.5 or a salt of an amphoteric metal. 2. The lithographic printing plate according to 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000095597A JP2001281870A (en) | 2000-03-30 | 2000-03-30 | Lithographic printing plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000095597A JP2001281870A (en) | 2000-03-30 | 2000-03-30 | Lithographic printing plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001281870A true JP2001281870A (en) | 2001-10-10 |
JP2001281870A5 JP2001281870A5 (en) | 2004-09-02 |
Family
ID=18610486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000095597A Pending JP2001281870A (en) | 2000-03-30 | 2000-03-30 | Lithographic printing plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001281870A (en) |
-
2000
- 2000-03-30 JP JP2000095597A patent/JP2001281870A/en active Pending
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