JP2001274544A - Board cooling apparatus and soldering apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board cooling apparatus and a soldering apparatus which can reduce a printed board manufacturing cost. SOLUTION: Inactive gas G is collected from an inactive atmosphere chamber 2 of which inside is fulfilled with the inactive gas G for preventing soldering oxidation by an atmosphere circulating means 34. The collected inactive gas G is pressurized and transferred to a cooling means 25 by the atmosphere circulating means 34. After the supplied inactive gas G is cooled by the cooling means 25, the inactive gas G after cooling is pressurized and transferred to a printed board P which is transferred in the inactive atmosphere chamber 2. The printed board P can be cooled by spraying the inactive gas G after cooling. The inactive gas G can be economized and the total usage of the inactive gas G can be reduced. A printed board P manufacturing cost can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cooling apparatus and a brazing apparatus for cooling a substrate in an inert atmosphere for preventing oxidation during brazing.

[0002]

2. Description of the Related Art Conventionally, a brazing apparatus of this type has a substrate transferred into an inert atmosphere chamber filled with an inert atmosphere for preventing oxidation at the time of brazing. This substrate is cooled by supplying and blowing an inert gas at a substantially normal temperature different from the inert atmosphere.

[0003]

However, in the above-mentioned brazing apparatus, an inert gas supplied separately from the inert gas filled in the inert atmosphere chamber is blown and conveyed into the inert atmosphere chamber. Since the substrate is cooled, an inert gas newly taken into the inert atmosphere chamber is sequentially supplied from the outside.

[0004] As a result, the inert gas in the inert atmosphere chamber is sequentially exhausted to the outside.
In addition to the inert gas for forming the inert atmosphere, the amount of the inert gas required for cooling the substrate is added, which is enormous, and the manufacturing cost required for manufacturing the substrate is large. For this reason, in order to manufacture this substrate, a large amount of inert gas is required, so that there is a problem that it is not easy to reduce the manufacturing cost.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate cooling device and a brazing device that can reduce manufacturing costs.

[0006]

According to a first aspect of the present invention, there is provided a substrate cooling apparatus for recovering and circulating an inert atmosphere for preventing oxidation at the time of brazing, and transferring the inert atmosphere to a substrate which has reached a cooling step after soldering. Atmosphere circulating means for pumping an active atmosphere, and cooling means for cooling the inert atmosphere supplied and supplied by the atmosphere circulating means.

In this configuration, the inert atmosphere for preventing oxidation at the time of brazing collected by the atmosphere circulating means is cooled by the cooling means, and the cooled inert atmosphere is cooled by the atmosphere circulating means after the soldering. The substrate is pressure-fed to the substrate that has reached the process, and the substrate is forcibly cooled to ensure brazing strength. As a result, the inert atmosphere is circulated and cooled by the atmosphere circulating means and the cooling means, so that the inert atmosphere can be effectively used without waste. Thus, the amount of the inert atmosphere required for manufacturing the substrate is saved, and the manufacturing cost is reduced.

According to a second aspect of the present invention, there is provided a brazing apparatus comprising: an inert atmosphere chamber in which the inside is filled with an inert atmosphere for preventing oxidation at the time of brazing; An atmosphere circulating means for recovering and circulating the inert atmosphere, forcing the inert atmosphere to the substrate after soldering and reaching a cooling step, and the inert gas supplied and supplied by the atmosphere circulating means Cooling means for cooling the atmosphere.

In this configuration, the substrate disposed in the inert atmosphere chamber whose inside is filled with an inert atmosphere for preventing oxidation during brazing is used when the soldering is completed and the cooling process is reached. The gas is recovered from the inert atmosphere chamber by the atmosphere circulation means, cooled by the cooling means, and further cooled by the inert atmosphere circulated by the atmosphere circulation means and pumped. As a result, the inert atmosphere filled in the inert atmosphere chamber is circulated by the atmosphere circulating means and the cooling means, cooled and pressure-fed, and the substrate is forcibly cooled, thereby securing the brazing strength. Therefore, the substrate can be cooled while saving the inert atmosphere, so that the inert atmosphere can be effectively used without waste, and the manufacturing cost is reduced.

Further, the inert atmosphere used for preventing oxidation during brazing in the inert atmosphere chamber is circulated and reused for cooling the substrate, and unlike the conventional cooling fan, the inert atmosphere is inert. There is no risk of entraining external air into the inert atmosphere in the atmosphere chamber, and an increase in the oxygen concentration in the inert atmosphere chamber is prevented.

[0011] The brazing apparatus according to the third aspect is the second aspect.
In the brazing apparatus described above, the cooling means is provided with a heat exchange filter for cooling the inert atmosphere supplied by being supplied by the atmosphere circulating means and removing impurities in the inert atmosphere.

In this structure, the inert atmosphere recovered from the inert atmosphere chamber by the atmosphere circulating means and fed and supplied by pressure is cooled by a heat exchange filter as a cooling means and impurities are removed. The active atmosphere is pressure-fed to the substrate, and the substrate disposed in the inert atmosphere chamber is cooled by the inert atmosphere. As a result, the impurities contained in the inert atmosphere in the inert atmosphere chamber are removed at the same time as the cooling operation, so that the substrate can be cooled in the inert atmosphere regenerated by filtering. Therefore, the inert atmosphere in the inert atmosphere chamber is not contaminated by the cooling atmosphere.

[0013] The brazing apparatus according to the fourth aspect is the second aspect.
Or the substrate cooling apparatus according to 3, wherein the cooling means includes a jet nozzle which is disposed obliquely to a transport direction of the substrate transported into the inert atmosphere chamber, and adheres a brazing material to the substrate. One side is substantially parallel to the jet nozzle, and the other side is formed in a substantially flat fan shape substantially perpendicular to the direction of transport of the substrate, and along the transport surface of the substrate transported into the inert atmosphere chamber. A cooling jacket disposed at a base end of the cooling jacket and supplying a gas to the interior of the cooling jacket. And a plurality of gas blowing ports for blowing the cooled and cooled inert atmosphere to cool the substrate.

In this configuration, the substrate transported into the inert atmosphere chamber is disposed along the transport surface of the substrate after the brazing material is attached by the jet nozzle, and the plurality of gases in the cooling jacket are provided. Cooled in an inert atmosphere spouted from the spray outlet. At this time, since the cooling jacket was formed in a substantially flat fan shape with one side substantially parallel to the jet nozzle and the other side substantially perpendicular to the substrate transport direction, the jet nozzle was inclined with respect to the substrate transport direction. Even in such a case, the substrate in the inert atmosphere chamber can be cooled more uniformly, and the cooling jacket is provided by effectively using the limited triangular space. As a result, the jet nozzle is inclined with respect to the direction in which the substrate is conveyed. For example, the solder breakage when the brazing material is adhered to the substrate is good, and the effects such as difficulty in bridging the substrate with the brazing material are impaired. And rapid quenching can be performed uniformly.

According to a fifth aspect of the invention, there is provided a brazing apparatus.
In the brazing apparatus described above, the cooling jacket is provided in the cooling jacket, and a rectifying plate that supplies the inert atmosphere supplied from the base end side of the cooling jacket substantially uniformly toward the distal end side of the cooling jacket. It has.

In this configuration, a rectifying plate for supplying the inert atmosphere supplied from the base end side of the cooling jacket substantially uniformly toward the distal end side of the cooling jacket is provided in the cooling jacket. The inert atmosphere cooled by the cooling jacket can be more uniformly pumped to the substrate in the active atmosphere chamber by the atmosphere circulation means. As a result, the cooling of the substrate in the inert atmosphere chamber by the cooling jacket becomes more uniform. In particular, the flow rate of the inert atmosphere is uniformly distributed and supplied to the plurality of gas blowing ports opened at the tip of the cooling jacket formed in a substantially fan shape by the current plate.

The brazing device according to the sixth aspect is the fourth aspect.
6. The brazing apparatus according to claim 5, wherein the cooling jacket is a flat hollow, substantially fan-shaped jacket main body, a cooling plate partitioning a space in the jacket main body up and down, and one side in the jacket main body partitioned by the cooling plate. A refrigerant chamber formed in a space and allowing a refrigerant to pass therethrough; provided in the refrigerant chamber, after passing a refrigerant supplied from a base end of the refrigerant chamber toward a tip of the refrigerant chamber, the jacket body A partition plate that is passed along one side of the jacket, and that is passed toward the base end of the refrigerant chamber and discharged, and an inert atmosphere formed in the other space in the jacket body that is partitioned by the cooling plate. An inert atmosphere disposed along a transfer surface of the substrate transferred into the chamber, wherein an inert atmosphere passing through the inside by the refrigerant passing through the refrigerant chamber is cooled through the cooling plate; Those having a chamber.

In this configuration, the refrigerant supplied from the base end of the refrigerant chamber is provided by a partition plate provided in a refrigerant chamber formed in one side space in which a space in the jacket body is vertically divided by a cooling plate. After passing toward the distal end of the refrigerant chamber, it passes along one side of the jacket main body, and is further discharged after passing toward the base end of the refrigerant chamber.
For this reason, since the refrigerant circulates and passes through every corner in the refrigerant chamber, it is formed in the other side space in the jacket main body partitioned by the cooling plate, and along the transfer surface of the substrate transferred into the inert atmosphere chamber. The inert gas passing through the inert atmosphere chamber disposed in this way is more efficiently cooled by the refrigerant passing through the refrigerant chamber via the cooling plate. In particular, the inert atmosphere efficiently cooled by the cooling medium through the cooling plate can rapidly cool the lead-free brazing material heated to a high temperature, and a predetermined brazing strength is secured. Furthermore, since the refrigerant is supplied and discharged from the base end of the refrigerant chamber, the piping of the refrigerant to the jacket body becomes easy.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The construction of a first embodiment of the brazing apparatus according to the present invention will be described below with reference to FIG.

In FIG. 1, reference numeral 1a denotes a brazing apparatus. The brazing apparatus 1a has an inert atmosphere chamber 2, and a substrate as a transfer means disposed through the inert atmosphere chamber 2. After the printed circuit board P is conveyed by the conveyor 3 and the surface to be brazed of the printed circuit board P is heated, the brazing material jetted onto the electrodes of the electronic elements and the like mounted on the printed circuit board P Is a jet-flow type soldering device for bringing the solder S into contact with the printed circuit board P and further cooling the printed board P.

The inert atmosphere chamber 2 is arranged substantially horizontally, and is an inert gas such as nitrogen gas (N ₂ ) as an inert atmosphere for preventing oxidation during brazing, ie, soldering. G is filled, that is, filled. Further, in the inert atmosphere chamber 2, a substrate transport conveyor 3 for carrying the printed circuit board P into the inert atmosphere chamber 2 and unloading the printed board P from the inert atmosphere chamber 2 is provided. The substrate transport conveyor 3 has a transport direction in the left-right direction shown in FIG.

On the loading side of the inert atmosphere chamber 2, a substrate preheating space 11 for heating the back surface of the printed circuit board P after loading the printed circuit board P is formed. Below the heating space 11, a preheater 12 as a heating means for preheating the back surface of the printed circuit board P conveyed by the substrate conveying conveyor 3 is provided. The preheater 12 is a sheathed heater disposed below the substrate preheating space 11 in a meandering state.

Further, after the printed board P and the board mounted components and the solder S soldered thereto are cooled, the printed board P is placed in the inert atmosphere chamber 2 on the carry-out side of the inert atmosphere chamber 2. A substrate cooling space 13 is formed to be carried out from the outside to the outside.

Then, between the substrate preheating space 11 and the substrate cooling space 13 in the inert atmosphere chamber 2, a substrate soldering for soldering the printed circuit board P carried by the substrate carrying conveyor 3 is performed. A space 14 is formed. Below the board soldering space 14, a solder bath 15 as a bath body for storing the molten solder S therein is provided. In the solder bath 15, a primary jet nozzle as a jet nozzle is provided. 16 and a secondary jet nozzle 17 are provided.

Further, a nozzle insertion port 18 is opened in the lower part of the inert atmosphere chamber 2, and an opening edge 19 of the nozzle insertion port 18 is inserted into the molten solder S stored in the solder bath 15. ing. As a result, the lower part of the inert atmosphere chamber 2 is airtightly connected to the solder bath 15.

The primary jet nozzle 16 and the secondary jet nozzle 17 are connected to electromagnetic induction pumps 20a and 20b, respectively.
The molten solder S stored in the solder bath 15 is jetted from the tip of each of the nozzles 17, and the primary jet nozzle 16 and the secondary jet nozzle 17 are connected to the printed circuit board P conveyed by the board conveying conveyor 3. Molten solder S is adhered to the back surface of the substrate, that is, soldered.

Further, a projecting space 21 projecting upward is formed above the substrate soldering space 14 of the inert atmosphere chamber 2, and an inert atmosphere is formed above the projecting space 21. An inert gas supply pipe 21a for supplying an inert gas G such as a nitrogen gas into the chamber 2 is provided. An inert gas recovery port 22 for recovering the inert gas G in the inert atmosphere chamber 2 is provided on one side of the protruding space portion 21 located on the carry-out side.

The inert gas recovery port 22 collects and cools the inert gas G from the inert atmosphere chamber 2 and then cools the inert gas G into the substrate of the inert atmosphere chamber 2. A board cooling device 24 is connected to the printed board P after soldering, which is conveyed to the cooling space 13 and which is cooled rapidly to secure soldering strength by rapidly cooling the printed board P. This substrate cooling device 24
Is a cooling means for cooling the supplied inert gas G
The cooling means 25 is connected to the inert gas recovery port 22 of the inert atmosphere chamber 2.

The cooling means 25 cools the inert gas G supplied by pressure from the inert atmosphere chamber 2 and supplies impurities I such as flux fume floating in a mist form into the inert gas G. And a heat exchange filter 26 for removing the inert gas from the inert gas G.

This heat exchange filter 26 is of an air-cooled type,
A cooling chamber 27 having a substantially rectangular cross section is provided.
Above one side surface, a suction port 28 connected to the inert gas recovery port 22 of the inert atmosphere chamber 2 is formed.
Further, below one side surface of the cooling chamber 27, the cooling chamber
An outlet 29 for exhausting the inert gas G passing through the inside 27
Are drilled.

The other side surface of the cooling chamber 27 is formed as a cooling surface 27a made of a material having excellent heat conductivity, and the other side surface of the cooling chamber 27 via the cooling surface 27a is
A ventilation chamber 31 for cooling the inert gas G passing through the inside of the cooling chamber 27 by blowing air from the fan 30 is provided continuously. The ventilation chamber 31 is formed along the other side surface of the cooling chamber 27, and ventilation openings 31a and 31b are opened in the upper and lower portions of the ventilation chamber 31, respectively.

A fan 30 is disposed below the lower ventilation opening 31b so as to face upward, and air blows by the fan 30 to supply air A as a cooling medium into the ventilation chamber 31 sequentially. That is, it is ventilated. As a result, the cooling chamber
The inert gas G passing through the inside 27 is cooled by the air A blown into the ventilation chamber 31 via the cooling surface 27 a of the cooling chamber 27.

Further, an air filter 32 is disposed above the inside of the cooling chamber 27 so as to close the inside of the cooling chamber 27. The inert gas G collected from the suction port 28 passes through the air filter 32 so that the inert gas G
The impurities I floating therein are recovered and removed, that is, filtered.

The cooling chamber below the air filter 32
Inside the cooling chamber 27, a plurality of substantially flat plate-like baffles protruding inward alternately from one side and the other side of the cooling chamber 27 are provided.
33a, 33b, 33c, 33d are formed. These baffles 33
The projections a and 33c protrude from one side surface in the cooling chamber 27, project substantially perpendicularly to the one side surface, and then bend downward to project. In addition, the baffle plates 33b and 33d
It protrudes from the other side in 27, and after projecting almost perpendicularly to this other side, it bends upward and projects,
Furthermore, it is bent and projected substantially vertically toward the other side surface.

For this reason, the baffle plates 33a, 33b, 33c, 33d
When the inert gas G supplied by pressure from the suction port 28 of the cooling chamber 27 passes through the inside of the cooling chamber 27, the inert gas G collides with the inert gas G and floats in the inert gas G. In particular, the flux fume is liquefied and these baffles 33a, 3
The impurities I are collected and removed from the inert gas G by being attached to the surfaces 3b, 33c, and 33d, that is, the impurities I are filtered.

Then, the inert gas G discharged from the cooling chamber 27 is fed to the printed board P, which has completed the soldering and has reached the cooling step, through the outlet 29 of the cooling chamber 27 of the heat exchange filter 26. The suction port 35 of the blower 34a as a pressure feeding means constituting a part of the atmosphere circulation means 34 is connected. An exhaust port 36 is formed in the blower 34a.
A water cooling jacket 41 serving as a cooling jacket, which is the cooling means 25, is connected to the exhaust port 36. Further, the blower 34a is provided with a heat exchange filter 26 as a cooling means 25.
The inert gas G cooled by the water-cooling jacket 41 is sent under pressure to the printed board P in the inert atmosphere chamber 2 to cool the printed board P. That is, the blower 34a sends the recovered inert gas G under pressure to the printed circuit board P to be carried out of the inert atmosphere chamber 2 and circulates a part of the inert gas G.

Next, the water-cooling jacket 41 is of a water-cooling type, and is attached below the substrate cooling space 13 of the inert atmosphere chamber 2. Also, this water cooling jacket 41
After the inert gas G collected from the inert atmosphere chamber 2 and cooled by the heat exchange filter 26 and filtered is further cooled, the inert gas G is sent to the back surface of the printed circuit board P by the blower 34a. To forcibly cool the printed circuit board P.

Further, the water-cooled jacket 41 has a substantially flat hollow jacket body 41a, and a cooling plate 42 for vertically partitioning the space inside the jacket body 41a is mounted in the jacket body 41a. . This cooling plate
Reference numeral 42 is formed of a metal material having excellent thermal conductivity. Further, in a space located below, which is one side space in the jacket main body 41a partitioned by the cooling plate 42,
A refrigerant chamber through which water W, which is a liquid as a refrigerant, passes
44 are formed.

A gas chamber 43 as an inert atmosphere chamber through which an inert gas G passes is provided in an upper space which is another space in the jacket main body 41a partitioned by the cooling plate 42. Is formed. The gas chamber 43 is provided along the transfer surface of the printed circuit board P transferred into the inert atmosphere chamber 2. The inert gas G passing through the gas chamber 43 is cooled by the water W via the cooling plate 42 due to a temperature difference from the water W passing through the refrigerant chamber 44.

A gas supply port 45 for supplying the inert gas G after passing through the heat exchange filter 26 into the gas chamber 43 is formed in one side surface of the gas chamber 43. This gas supply port 45 is connected to the exhaust port 36 of the blower 34a, and the heat exchange filter 26
The inert gas G cooled by the pressure is fed and supplied.

The gas chamber 43 is provided on the upper surface of the gas chamber 43.
When passing through the inside, the cooled inert gas G is ejected, and the inert gas G is sprayed on the back surface of the printed circuit board P,
A plurality of small-diameter gas blowing ports 46 for cooling the printed circuit board P are provided.

Further, a water supply port 47 as a refrigerant supply port for supplying water W into the refrigerant chamber 44 is provided on one side of the refrigerant chamber 44 which is a side surface on which the gas supply port 45 of the gas chamber 43 is located. Are drilled. Further, a water discharge port 48 as a refrigerant discharge port for discharging the water W supplied into the refrigerant chamber 44 is formed on the lower surface of the refrigerant chamber 44 on the side opposite to the water supply port 47.
As a result, after the water W is supplied from the water supply port 47, the refrigerant chamber
By passing through 44 and being discharged from the water discharge port 48,
The inert gas G passing through the gas chamber 43 via the cooling plate 42 is cooled by the temperature difference from the water W.

Here, the cooling means 25 includes a heat exchange filter 26
And a water cooling jacket 41. The atmosphere circulating means 34 includes an inert atmosphere chamber 2, a cooling chamber 27 of a heat exchange filter 26, a blower 34a, and a water cooling jacket 41.
Gas chamber 43 is included. And the inert gas G
These inert atmosphere chamber 2, heat exchange filter 26
In the gas chamber 43 of the cooling chamber 27, the blower 34a, and the water cooling jacket 41.

Next, the operation of the first embodiment will be described.

When the printed circuit board P is placed on the transfer start end of the board transfer conveyor 3, the printed board P is transferred into the inert atmosphere chamber 2 by the board transfer conveyor 3.

Thereafter, when the substrate transport conveyor 3 transports the printed circuit board P into the substrate preheating space 11 of the inert atmosphere chamber 2, the preheater 12 disposed in the substrate preheating space 11 is activated. Then, the printed circuit board P is preheated.

Next, when the printed board P is transported to the upper part of the solder bath 15 of the board soldering space 14, the
Each molten solder S of turbulent wave (primary wave) and shaped wave (secondary wave) jetted from the secondary jet nozzle 16 and the secondary jet nozzle 17
Then, the printed circuit board P is soldered.

Further, when the printed circuit board P is conveyed onto the water-cooled jacket 41, the cooled inert gas G which is pressure-fed and blown out from the gas blowing port 46 of the water-cooled jacket 41 is discharged. The high temperature solder joint portion is cooled together with the printed circuit board P and the board mounted components by being sprayed on the back surface of P.

As a result, the inert gas G fed from the gas outlet 46 of the water cooling jacket 41 is
Is cooled and circulated through the substrate cooling space 13 of the inert atmosphere chamber 2 to fill the substrate cooling space 13 with the inert gas G. It is possible to prevent the outside air from entering the interior.

On the other hand, fresh inert gas G is always supplied from the inert gas supply pipe 21a to the substrate soldering space 14, but after being used as the soldering atmosphere, the inert gas G becomes inert. It is collected from the active gas collection port 22. Then, the inert gas G is supplied from the suction port 28 to the heat exchange filter.
After being fed into the cooling chamber 27 of 26 and passing through the air filter 32, it passes between the baffle plates 33a and 33b, and then passes between the baffle plates 33b and 33c. Further, the air passes between the baffle plates 33c and 33d, and is sent from the discharge port 29 to the suction port 35 of the blower 34a.

At this time, impurities I such as flux fume generated when the printed circuit board P is soldered float in the inert gas G, so that when the inert gas G passes through the air filter 32, The impurities I floating in the inert gas G are filtered, and the baffles 33a, 33b, 33
When passing between c and 33d, these baffles 33a, 33b, 33
Impurities I, especially mist-like flux fumes, floating in the inert gas G colliding with each of c and 33d are liquefied and adhered, and the impurities I are filtered. Further, when passing through the cooling chamber 27, the inert gas G is exchanged with the air A blown into the ventilation chamber 31 through the cooling surface 27a to be cooled.

Next, the inert gas G is supplied to the blower 34a
After being pressure-fed from the exhaust port 36, the gas is fed to the gas supply port 45 of the water-cooling jacket 41 and supplied into the gas chamber 43.

Then, when the inert gas G passes through the gas chamber 43, the heat is exchanged with the water W passing through the refrigerant chamber 44 via the cooling plate 42 to be cooled.

Thereafter, the inert gas G passes through the gas chamber 43, and is then sent under pressure from the gas blowing port 46 to the printed circuit board P to cool the printed circuit board P. It is sent to the cooling space 13.

As a result, the inert gas G is supplied to the blower 34
By the pumping by a, it circulates in the inert atmosphere chamber 2, the heat exchange filter 26 and the water cooling jacket 41.

As described above, according to the first embodiment, the inert gas G is recovered from the inert atmosphere chamber 2, and the recovered inert gas G is used as the heat exchange filter 26.
After cooling with the water cooling jacket 41, the inert gas G is pressure-fed to the printed circuit board P by the blower 34a to forcibly cool the printed circuit board P, so that the soldering strength can be secured.

As a result, by effectively utilizing the inert gas G in the inert atmosphere chamber 2 for cooling, the inert gas G can be efficiently used as compared with the case of cooling with unused fresh inert gas. Can be used effectively. Therefore, since the total amount of the inert gas G used can be saved, the printed circuit board P
Manufacturing cost can be reduced.

The inert gas G recovered from the inert atmosphere chamber 2 is cooled when passing through the cooling chamber 27 of the heat exchange filter 26, and the impurities I floating in the inert gas G are recovered and removed. Is done. For this reason, the impurities I generated when the solder S is jetted in the inert atmosphere chamber 2 can be collected and removed by the heat exchange filter 26, thereby preventing returning of the contaminated inert gas G into the inert atmosphere chamber 2. While cooling, the printed circuit board P can be cooled.

As a result, since the impurities I contained in the inert gas G in the inert atmosphere chamber 2 can be removed simultaneously with the cooling operation, the printed circuit board P can be cooled by the inert gas G regenerated by filtering. Therefore, the inert gas G in the inert atmosphere chamber 2 is not contaminated by the cooled inert gas G.

Accordingly, the inert gas G used for preventing oxidation during soldering in the inert atmosphere chamber 2 can be circulated and reused for cooling the printed circuit board P, so that the outside air can be cooled as in the conventional cooling fan. Can be prevented from being caught in the inert atmosphere chamber 2, the increase in the oxygen concentration in the inert atmosphere chamber 2 can be prevented, and the total amount of the inert gas G required for cooling the printed circuit board P can be further reduced. It is possible to further reduce the manufacturing cost when manufacturing the printed circuit board P.

Further, since the inert gas G recovered from the inert atmosphere chamber 2 is cooled by the heat exchange filter 26 and further cooled by the water cooling jacket 41, the inert gas G is cooled more efficiently. it can. Therefore, the printed circuit board P after soldering, which is conveyed into the board cooling space 13 of the inert atmosphere chamber 2, can be cooled more efficiently.

When the inert gas G collides with each of the baffles 33a, 33b, 33c and 33d of the heat exchange filter 26, the mist-like impurities I floating in the inert gas G are liquefied and collected and removed. When this is done, this impurity I, especially flux fume, etc., travels along the baffles 33a, 33b, 33c, 33d and the side walls in the cooling chamber 27 and is stored at the bottom of the cooling chamber 27. Therefore, impurities I, particularly flux fume, etc., can be easily recovered from the inert gas G in the inert atmosphere chamber 2.

In the first embodiment, the configuration has been described in which the inert gas G recovered from the inert atmosphere chamber 2 is cooled by the heat exchange filter 26 and then further cooled by the water cooling jacket 41. The configuration is not limited to such a configuration. After cooling the inert gas G recovered from the inert atmosphere chamber 2, the inert gas G is cooled.
Is circulated into the active atmosphere chamber 2 by pumping, and the inert gas G cools the printed circuit board P in the inert atmosphere chamber 2.

Next, the configuration of the second embodiment of the present invention will be described with reference to FIGS.

The brazing device 1b shown in FIGS. 2 and 3
Is basically the same as the brazing apparatus 1a shown in FIG. 1, but the primary jet nozzle 16 and the secondary jet nozzle 17 are inclined with respect to the transport direction of the printed circuit board P.

At the tip of each of the primary jet nozzle 16 and the secondary jet nozzle 17, fine jet ports 51 and 52 are formed, respectively. These jets 51 and 52 are shown in FIG.
As shown in FIG. 5, the longitudinal direction of each of the printed circuit boards P is inclined at an angle of about 45 degrees in the direction in which the printed circuit board P is conveyed by the substrate conveyer 3 penetrating into the inert atmosphere chamber 2. .

The water cooling jacket 41 has one side substantially parallel to the longitudinal direction of each of the primary jet nozzle 16 and the secondary jet nozzle 17, and has the other side in the direction in which the printed board P is transported by the substrate transport conveyor 3. A jacket body 41a having a substantially flat hollow fan shape at right angles to the jacket body 41a is provided.
1a is a substrate transport conveyor 3 in the inert atmosphere chamber 2.
Along the transfer surface of the printed circuit board P and below the board transfer conveyor 3.

Further, at the base end of the jacket body 41a,
A connection base 54 projecting substantially vertically from one side of the transfer surface of the substrate transfer conveyor 3 is formed.
A hose (not shown) connected to the exhaust port 36 of the blower 34a is connected to a supply pipe and a discharge pipe (not shown) for supplying and discharging the water W into and from the jacket body 41a.

In the jacket body 41a, FIG.
As shown in (a), (b) and (c), a gas chamber 43 through which an inert gas G passes and a refrigerant chamber 44 through which water W passes are formed. The refrigerant chamber 43 and the refrigerant chamber 44 are formed in a substantially flat fan shape having the same shape as the jacket main body 41a.

A water supply port 47 and a water discharge port 48 are juxtaposed at the base end of the lower surface of the refrigerant chamber 44, that is, on the lower surface side of the connection base 54 along the surface located at the base end of the refrigerant chamber 44. Have been. A supply pipe and a discharge pipe are connected to the water supply port 47 and the water discharge port 48. Further, in the refrigerant chamber 44, a substantially F-shaped partition plate 61 that linearly advances from the base end of the refrigerant chamber 44 to near the one end of the fan shape and then bends and advances to the vicinity of the other end is provided. Is provided.

The partition plates 61 are connected to the upper and lower surfaces of the refrigerant chamber 44, respectively.
After passing through toward one end of the refrigerant chamber 44,
The refrigerant passes through the side surface located at the distal end of the refrigerant chamber 44, that is, along one side of the water-cooling jacket 41, toward the other distal end of the refrigerant chamber 44, and further passes toward the base end of the refrigerant chamber 44.

At the base end of the upper surface of the gas chamber 43, that is, on the upper surface side of the connection base 54, the inert gas G
A gas supply port 45 for supplying air is provided, and a hose connected to the exhaust port 36 of the blower 34a is connected to the gas supply port 45. Further, a plurality of, for example, 16 gas blowing ports 46 are formed at the tip end of the upper surface of the gas chamber 43. These gas blowing ports 46 are connected to the primary jet nozzle 16.
A plurality of rows, for example, two rows, are arranged along the longitudinal direction of each of the jet ports 51 and the jet ports 52 of the secondary jet nozzle 17, that is, along one side located at the tip side of the gas chamber 43. .

Further, in the gas chamber 43, the jet port 51 of the primary jet nozzle 16
And a plurality of, for example, three rectifying plates 62a, 62b, 62c gradually expanding toward one side of the gas chamber 43 along the longitudinal direction of the jet port 52 of the secondary jet nozzle 17. Is provided. These rectifying plates 62a, 62b, 62c are provided in the gas chamber 4
After the inert gas G supplied to the third gas supply port 45 is substantially uniformly distributed and passed toward the front end side of the gas chamber 43, the inert gas G is substantially uniformly upward from each gas blowing port 46. Spout toward.

Next, the operation of the second embodiment will be described.

The brazing device 1b shown in FIGS. 2 and 3
Is basically the same as the operation of the brazing device 1a shown in FIG.

When the blower 34a is started, the inert gas G in the inert atmosphere chamber 2 supplied from the inert gas supply pipe 21a is recovered from the inert gas recovery port 22 and sent to the heat exchange filter 26 by pressure. You.

Then, the inert gas G is cooled by the heat exchange filter 26, and after the impurities I floating in the inert gas G are recovered, the air is sucked into the blower 34a, and thereafter, the water cooling jacket is formed. It is pumped to 41 gas supply ports 45.

Here, the inert gas G pressure-fed from the gas supply port 45 into the gas chamber 43 is supplied from the base end of the gas chamber 43 by the flow straightening plates 62a, 62b, 62c in the gas chamber 43. It is distributed and supplied almost evenly toward the tip.

At this time, the inert gas G is supplied to the refrigerant chamber 44
Is supplied from the water supply port 47, and the inside of the refrigerant chamber 44 is partitioned by the partition plate 61.
Is exchanged by the temperature difference with the water W passing along the
The cooling is performed via the cooling plate 42. After passing through the refrigerant chamber 44, the water W is discharged to the outside through the water discharge port 48.

Further, the inert gas G cooled in the gas chamber 43 is supplied from each gas blowing port 46 to the inert atmosphere chamber 2.
The printed circuit board P after soldering which is pressure-fed into the inside and is conveyed by the board conveyance conveyor 3 above the gas chamber 43.
To cool the printed circuit board P.

As a result, the inert gas G circulates in the inert atmosphere chamber 2, the heat exchange filter 26, the blower 34a and the water cooling jacket 41.

As described above, according to the second embodiment, after the inert gas G recovered from the inert atmosphere chamber 2 is cooled, the inert gas G is pumped to the printed circuit board P. Thus, since the printed circuit board P is cooled, the same effect as that of the brazing device 1a shown in FIG. 1 can be obtained.

Further, the longitudinal direction of each of the primary jet nozzle 16 and the secondary jet nozzle 17 arranged substantially in parallel with each other and inclined at about 45 degrees with respect to the transport direction of the substrate transport conveyor 3. Since the water cooling jacket 41 is provided in a substantially flat fan shape whose one side is substantially parallel and the other side is perpendicular to the conveyance direction of the printed circuit board P, the primary jet nozzle 16
Even if each of the secondary nozzles 17 and the secondary nozzles 17 are inclined with respect to the direction of transport of the printed circuit board P, the printed circuit board P after soldering transferred into the inert atmosphere chamber 2 can be cooled more uniformly. The water cooling jacket 41 can be installed by effectively using the limited triangular space.

Therefore, by using the cooling jacket 41, the primary jet nozzle 16 and the secondary jet nozzle 17 can be arranged at an angle to each other with respect to the transport direction of the printed circuit board P. And the secondary jet nozzles 17 are inclined with respect to the transport direction of the printed circuit board P.
It is possible to improve the solder breakage when the solder S is adhered by the next jet nozzle 16 and the secondary jet nozzle 17 and to prevent the formation of bridges by the solder S on the printed board P without impairing the effect. P can be quenched uniformly.

In the gas chamber 43 of the water cooling jacket 41,
By providing rectifying plates 62a, 62b, and 62c that gradually expand toward one side of the gas chamber 43, the inert gas G supplied from the gas supply port 45 is supplied to the gas chamber 43.
Can be passed substantially evenly from the base end to the front end. For this reason, the inert gas G can be more uniformly and efficiently cooled in the gas chamber 43, and the inert gas G can be more uniformly pumped to the printed board from the gas blowing port 46. P can be cooled more uniformly and efficiently. In particular, the flow rate of the inert gas G can be evenly distributed and supplied to the plurality of gas blowing ports 46 opened at the distal end of the water cooling jacket 41 formed in a substantially flat hollow fan shape by the flow straightening plates 62a, 62b, 62c.

Further, a plurality of gas blowing ports 46 are connected to the gas chamber 43.
Are arranged in two rows along one side located at the tip side of the nozzles, so that these gas blowing ports 46 are provided at the respective jet ports 51 of the primary jet nozzle 16 and the jet ports 52 of the secondary jet nozzle 17. They are juxtaposed along the longitudinal direction. As a result, the cooled inert gas G is sent from the gas blowing ports 46 to cool the printed circuit board P, thereby making the soldered printed circuit board P transported by the substrate transport conveyor 3 more uniform and efficient. Can cool well.

The water supply port 47 and the water discharge port 48 are provided side by side along the base end of the connection base 54 on the lower surface side of the connection base 54 of the refrigerant chamber 44 of the water cooling jacket 41. And the water outlet 48 are close to each other. As a result, the piping work of the supply pipe and the discharge pipe to the water supply port 47 and the water discharge port 48 can be facilitated, and the piping space can be reduced.

Further, by providing the partition plate 61 in the refrigerant chamber 44 of the water-cooled jacket 41, the water W supplied from the water supply port 47 into the refrigerant chamber 44 is supplied to one end of the refrigerant chamber 44. After passing toward the other end of the refrigerant chamber 44 along one side located at the end of the refrigerant chamber 44,
Further, the refrigerant passes toward the base end of the refrigerant chamber 44. As a result, the water W circulates through every corner in the refrigerant chamber 44, and the water W passes along one side of the refrigerant chamber 44 facing the gas blowing port 46 of the gas chamber 43. The inert gas G passing through the inside can be cooled more efficiently.

In particular, the inert gas G efficiently forcibly cooled with the water W via the cooling plate 42 can be rapidly cooled even with a lead-free solder heated to a high temperature, so that a predetermined soldering strength can be secured.

Further, the connection base 54 of the water cooling jacket 41 protrudes from one side surface of the transfer surface of the substrate transfer conveyor 3, and the connection base 54 is provided with the water supply port 47, the water discharge port 48, and the gas supply port 45. The connection work between the supply pipe and the discharge pipe for supplying and discharging the water W and the hose for pumping the inert gas G can be easily performed. As a result, the hoses can be bundled, etc.
Further, maintenance can be facilitated.

In each of the above-described embodiments, the molten solder S jetted from the primary jet nozzle 16 and the secondary jet nozzle 17 is attached to the printed board P conveyed by the board conveyor 3, and After the printed circuit board P is soldered, the jet type soldering apparatus for cooling the printed circuit board P after the soldering has been described. However, the present invention is not limited to such a configuration.
Any configuration may be used as long as it can cool the device.

For this purpose, for example, the substrate transport conveyor 3 is disposed in the inert atmosphere chamber 2 filled with the inert gas G, and the substrate transport conveyor 3 in the inert atmosphere chamber 2 is transported. A heating means for heating the printed circuit board P conveyed by the substrate transfer conveyor 3 is provided on the start end side, and an inert atmosphere chamber 2 is provided on the transfer end side of the substrate transfer conveyor 3 in the inert atmosphere chamber 2. An inert gas G is recovered and circulated from the substrate, and an atmosphere circulating means 34 is provided for pressure-feeding the heated gas to the printed circuit board P conveyed by the substrate conveying conveyor 3. A reflow device provided with a cooling means 25 for cooling the inert gas G to be used may be used.

[0093]

According to the substrate cooling apparatus of the first aspect,
An inert atmosphere for preventing oxidation at the time of brazing is recovered by an inert circulation means and a cooling means, cooled, and then forcedly cooled by forcibly cooling the substrate by sending it to a substrate which has completed soldering and has reached a cooling step. Since the mounting strength is secured, the inert atmosphere is circulated and cooled, so that the inert atmosphere can be effectively used without waste, and the total amount of the inert atmosphere required for manufacturing the substrate can be saved, and the manufacturing cost can be reduced. Can be reduced.

According to the brazing apparatus of the second aspect, the inert atmosphere for preventing oxidation at the time of brazing is recovered from the inert atmosphere chamber by the atmosphere circulating means and the cooling means, and then cooled to complete the soldering and the cooling step. By forcibly cooling the substrate by pumping it to the substrate that has arrived, the brazing strength is secured, and the substrate is cooled in this inert atmosphere while being cooled while circulating the inert atmosphere in the inert atmosphere chamber. Cooling allows the inert atmosphere to be saved without wasting, thereby reducing manufacturing costs.Furthermore, the inert atmosphere is circulated in the inert atmosphere chamber and can be reused for cooling the substrate. Unlike cooling, there is no danger of entraining external air into the inert atmosphere in the inert atmosphere chamber. The temperature can be prevented.

According to the brazing apparatus of the third aspect, in addition to the effect of the brazing apparatus of the second aspect, the substrate disposed in the inert atmosphere chamber is protected by the atmosphere circulating means and the heat exchange filter. Since it is cooled after being recovered from the active atmosphere chamber and is cooled by pumping the inert atmosphere from which impurities have been removed, impurities contained in the inert atmosphere in the inert atmosphere chamber can be removed simultaneously with the cooling action. Therefore, the substrate can be cooled in the inert atmosphere regenerated by filtering, and the inert atmosphere in the inert atmosphere chamber does not contaminate the cooling atmosphere.

According to the brazing apparatus according to the fourth aspect, in addition to the effect of the brazing apparatus according to the second or third aspect, the brazing material adheres to the substrate disposed in the inert atmosphere chamber by the jet nozzle. After being cooled, the cooling jacket is cooled in an inert atmosphere blown from a plurality of gas blowing ports of a substantially flat fan-shaped cooling jacket. Since the substrate in the active atmosphere chamber can be cooled more uniformly, and the cooling jacket can be installed by effectively using the limited triangular space, it is caused by tilting the jet nozzle with respect to the transport direction of the substrate, for example, The substrate can be rapidly quenched uniformly without impairing the effect that the solder is easily removed when the brazing material is adhered to the substrate and that the bridging material is not easily bridged on the substrate.

According to the brazing apparatus of the fifth aspect, in addition to the effect of the brazing apparatus of the fourth aspect, a rectifying plate for supplying an inert atmosphere substantially uniformly toward the tip end is provided in the cooling jacket. Therefore, the inert atmosphere cooled by the cooling jacket can be more uniformly pumped to the substrate in the inert atmosphere chamber by the atmosphere circulating means, so that the cooling of the substrate by the cooling jacket can be more uniform, and furthermore, this rectification can be achieved. The plate makes it possible to evenly distribute and supply the flow rate of the inert atmosphere to each gas blowing port of the substantially fan-shaped cooling jacket.

According to the brazing device of the sixth aspect, in addition to the effect of the brazing device of the fourth or fifth aspect, the refrigerant supplied into the refrigerant chamber of the cooling jacket is separated by the partition plate in the refrigerant chamber. After passing toward the tip of the refrigerant chamber, it passes along one side of the jacket main body, and further passes toward the base end of the refrigerant chamber, so that the refrigerant circulates and passes through every corner in the refrigerant chamber. The inert atmosphere that passes through the inert atmosphere chamber through the cooling plate can be more efficiently cooled, and the lead-free brazing material heated to a high temperature in the inert atmosphere efficiently forcibly cooled with the cooling medium through the cooling plate can be used. Can be quenched, ensuring the required brazing strength.
Since the refrigerant can be supplied and discharged from the base end of the refrigerant chamber, piping of the refrigerant to the cooling jacket can be easily performed.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a brazing device according to a first embodiment of the present invention.

FIG. 2 is a top view showing a second embodiment of the present invention.

FIG. 3 is an explanatory view showing a cooling jacket which is a cooling means of the brazing apparatus. (A) Top view of the cooling jacket (b) Side view of the cooling jacket (c) Bottom view of the cooling jacket

[Explanation of symbols]

 1a, 1b Brazing device 2 Inert atmosphere chamber 16 Primary jet nozzle as jet nozzle 17 Secondary jet nozzle as jet nozzle 24 Substrate cooling device 25 Cooling means 26 Heat exchange filter 34 Atmospheric circulation means 41 Water cooling as cooling jacket Jacket 41a Jacket body 42 Cooling plate 43 Gas chamber as inert atmosphere chamber 44 Refrigerant chamber 45 Gas supply port 46 Gas blowing port 61 Partition plate 62a, 62b, 62c Rectifying plate G Inert gas as inert atmosphere I Impurity P Printed circuit board as substrate S Solder as brazing material W Water as coolant

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // B23K 101: 42 B23K 101: 42 (72) Inventor Masamitsu Yachi 591, Kamihirose, Daiji, Sayama-shi, Saitama F-term in the Tamura FA System Co., Ltd. (reference) 4E080 AA01 AB06 DA04 EA02 5E319 AC01 CC24 CD60 GG05

Claims (6)

[Claims] 1. An atmosphere circulating means for collecting and circulating an inert atmosphere for preventing oxidation during brazing, and for pumping the inert atmosphere to a substrate which has reached a cooling step after soldering, and an atmosphere circulating means. And a cooling means for cooling the inert atmosphere supplied by pressure feeding. 2. An inert atmosphere chamber in which the inside is filled with an inert atmosphere for preventing oxidation at the time of brazing, and a substrate is disposed therein, and the inert atmosphere is recovered from the inert atmosphere chamber. Circulating, an atmosphere circulating means for pressure-feeding the inert atmosphere to the substrate which has reached the cooling step after soldering, and a cooling means for cooling the inert atmosphere fed and supplied by the atmosphere circulating means. Brazing apparatus characterized by having 3. The cooling means includes a heat exchange filter for cooling an inert atmosphere fed and supplied by the atmosphere circulating means and removing impurities in the inert atmosphere. Item 3. A brazing device according to Item 2. 4. A cooling device, comprising: a jet nozzle which is disposed obliquely to a transfer direction of a substrate transferred into an inert atmosphere chamber, and which has a jet nozzle for attaching a brazing material to the substrate. Substantially parallel to the jet nozzle, the other side is formed in a substantially flat fan shape substantially perpendicular to the transport direction of the substrate, and is disposed along a transport surface of the substrate transported into the inert atmosphere chamber. The cooling jacket has a gas supply port opened at the base end of the cooling jacket to supply an inert atmosphere to the inside, and a cooling jacket opened at the tip of the cooling jacket and cooled by being supplied to the cooling jacket. 4. A brazing apparatus according to claim 2, further comprising a plurality of gas blowing ports for blowing said inert atmosphere to cool said substrate. 5. A cooling jacket provided in the cooling jacket and having a rectifying plate for supplying an inert atmosphere supplied from a base end side of the cooling jacket substantially uniformly toward a tip end side of the cooling jacket. The brazing device according to claim 4, wherein the brazing is performed. 6. A cooling jacket is formed in a flat hollow, substantially fan-shaped jacket main body, a cooling plate partitioning a space in the jacket main body up and down, and a space in the jacket main body partitioned by the cooling plate. A refrigerant chamber through which the refrigerant passes, provided in the refrigerant chamber, and after allowing the refrigerant supplied from the base end of the refrigerant chamber to pass toward the tip of the refrigerant chamber,
A partition plate that passes along one side of the jacket main body, passes through and discharges toward the base end of the refrigerant chamber, and is formed in another space in the jacket main body partitioned by the cooling plate, An inert atmosphere chamber disposed along a transfer surface of the substrate transferred into the inert atmosphere chamber, wherein an inert atmosphere passing therethrough by the refrigerant passing through the refrigerant chamber is cooled through the cooling plate; The brazing device according to claim 4, further comprising: